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KR900005230A - 텐트성 땜납 마스크 피막 제조용 자외선 경화성 조성물 - Google Patents

텐트성 땜납 마스크 피막 제조용 자외선 경화성 조성물 Download PDF

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Publication number
KR900005230A
KR900005230A KR1019890013516A KR890013516A KR900005230A KR 900005230 A KR900005230 A KR 900005230A KR 1019890013516 A KR1019890013516 A KR 1019890013516A KR 890013516 A KR890013516 A KR 890013516A KR 900005230 A KR900005230 A KR 900005230A
Authority
KR
South Korea
Prior art keywords
composition
weight
compound
solder mask
alkylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019890013516A
Other languages
English (en)
Korean (ko)
Inventor
링 공 흉 폴
큐-슈 쳉 케네드
Original Assignee
고든시. 앤드류스
엠 앤드 티 케미칼스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고든시. 앤드류스, 엠 앤드 티 케미칼스 인코포레이티드 filed Critical 고든시. 앤드류스
Publication of KR900005230A publication Critical patent/KR900005230A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/117—Free radical

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
KR1019890013516A 1988-09-20 1989-09-20 텐트성 땜납 마스크 피막 제조용 자외선 경화성 조성물 Withdrawn KR900005230A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US247,052 1988-09-20
US07/247,052 US5006436A (en) 1988-09-20 1988-09-20 UV curable compositions for making tentable solder mask coating

Publications (1)

Publication Number Publication Date
KR900005230A true KR900005230A (ko) 1990-04-13

Family

ID=22933355

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890013516A Withdrawn KR900005230A (ko) 1988-09-20 1989-09-20 텐트성 땜납 마스크 피막 제조용 자외선 경화성 조성물

Country Status (13)

Country Link
US (1) US5006436A (xx)
EP (1) EP0360579A1 (xx)
JP (1) JPH02210443A (xx)
KR (1) KR900005230A (xx)
CN (1) CN1043397A (xx)
AU (1) AU4145989A (xx)
BR (1) BR8904708A (xx)
DK (1) DK461589A (xx)
FI (1) FI894430L (xx)
IL (1) IL91686A0 (xx)
NO (1) NO893734L (xx)
PT (1) PT91735A (xx)
ZA (1) ZA897138B (xx)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5420171A (en) * 1991-12-31 1995-05-30 Tech Spray, Inc. UV curable temporary solder mask
JPH06295060A (ja) * 1992-10-29 1994-10-21 Ajinomoto Co Inc 感光性樹脂組成物又は感光性熱硬化性樹脂組成物及びそれらを使用したフォトソルダ−レジスト組成物
EP0680626B1 (en) * 1993-01-20 1999-06-16 Agfa-Gevaert N.V. Photopolymerizable composition of high sensitivity and method for obtaining images therewith
US5843622A (en) * 1994-03-04 1998-12-01 Ashai Kasei Kogyo Kabushiki Kaisha Liquid photosensitive resin composition for use in forming a relief structure
WO1997022910A1 (en) 1995-12-21 1997-06-26 The Dow Chemical Company Solder mask compositions
US5707782A (en) * 1996-03-01 1998-01-13 The Board Of Trustees Of The University Of Illinois Photoimageable, dielectric, crosslinkable copolyesters
EP0860742B1 (en) * 1997-02-25 2001-04-04 E.I. Du Pont De Nemours And Company Flexible, flame-retardant, photoimageable composition for coating printing circuits
US5874197A (en) * 1997-09-18 1999-02-23 E. I. Du Pont De Nemours And Company Thermal assisted photosensitive composition and method thereof
US6037014A (en) * 1997-11-06 2000-03-14 The Edgington Co. Coating composition
EP0921152B1 (en) 1997-12-02 2006-04-05 Ciba SC Holding AG Polyolefin materials having enhanced surface durability and methods of making the same by exposure to radiation
US6331317B1 (en) * 1999-11-12 2001-12-18 Alkermes Controlled Therapeutics Ii Inc. Apparatus and method for preparing microparticles
US6818382B2 (en) 2000-09-11 2004-11-16 Showa Denko K.K. Photosensitive composition, cured article thereof, and printed circuit board using the same
US6667357B2 (en) 2000-12-15 2003-12-23 The College Of William And Mary Organic thiol metal-free stabilizers and plasticizers for halogen-containing polymers
US6927247B2 (en) * 2000-12-15 2005-08-09 The College Of William And Mary Organic thiol metal-free stabilizers and plasticizers for halogen-containing polymers
US7312266B2 (en) * 2000-12-15 2007-12-25 The College Of William And Mary Organic thiol metal-free stabilizers and plasticizers for halogen-containing polymers
US6762231B2 (en) 2000-12-15 2004-07-13 The College Of William And Mary Organic thiol metal-free stabilizers and plasticizers for halogen-containing polymers
RU2192661C1 (ru) * 2001-03-01 2002-11-10 Открытое акционерное общество "Компания Славич" Универсальная фотополимеризующаяся композиция паяльной маски для печатных плат с повышенными эксплуатационными характеристиками
JP4581706B2 (ja) * 2004-01-29 2010-11-17 住友ベークライト株式会社 ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法
JP4587865B2 (ja) * 2004-04-22 2010-11-24 昭和電工株式会社 感光性樹脂組成物及びその硬化物並びにそれらを使用するプリント配線基板の製造方法
JP2007010785A (ja) * 2005-06-28 2007-01-18 Fujifilm Holdings Corp 永久パターン形成方法
TWI426351B (zh) * 2006-11-15 2014-02-11 Taiyo Holdings Co Ltd Photolithography (Phototool) and the formation of resistance to resistance pattern
JP6361944B1 (ja) * 2017-01-24 2018-07-25 東洋インキＳｃホールディングス株式会社 カラーフィルタ用感光性組成物及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3048502A1 (de) * 1980-12-22 1982-07-22 Hoechst Ag, 6000 Frankfurt Durch strahlung polymerisierbares gemisch und daraus hergestelltes strahlungsempfindliches aufzeichnungsmaterial
US4422914A (en) * 1981-01-16 1983-12-27 W. R. Grace & Co. Polymer composition having terminal alkene and terminal carboxyl groups
JPS5986045A (ja) * 1982-11-05 1984-05-18 Nippon Soda Co Ltd 永久レジスト用光硬化性樹脂組成物
US4572890A (en) * 1983-05-11 1986-02-25 Ciba-Geigy Corporation Process for the production of images
DE3412992A1 (de) * 1984-04-06 1985-10-24 Hoechst Ag, 6230 Frankfurt Durch strahlung polymerisierbares gemisch und verfahren zum aufbringen von markierungen auf eine loetstopresistschicht
US4849320A (en) * 1986-05-10 1989-07-18 Ciba-Geigy Corporation Method of forming images

Also Published As

Publication number Publication date
BR8904708A (pt) 1990-05-01
JPH02210443A (ja) 1990-08-21
NO893734L (no) 1990-03-21
DK461589A (da) 1990-03-21
ZA897138B (en) 1990-06-27
EP0360579A1 (en) 1990-03-28
CN1043397A (zh) 1990-06-27
US5006436A (en) 1991-04-09
FI894430A7 (fi) 1990-03-21
IL91686A0 (en) 1990-04-29
FI894430A0 (fi) 1989-09-19
DK461589D0 (da) 1989-09-19
PT91735A (pt) 1990-03-30
FI894430L (fi) 1990-03-21
AU4145989A (en) 1990-03-29
NO893734D0 (no) 1989-09-19

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19890920

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid