KR890004818B1 - Ic용 전자동 납땜장치 - Google Patents
Ic용 전자동 납땜장치 Download PDFInfo
- Publication number
- KR890004818B1 KR890004818B1 KR1019840007108A KR840007108A KR890004818B1 KR 890004818 B1 KR890004818 B1 KR 890004818B1 KR 1019840007108 A KR1019840007108 A KR 1019840007108A KR 840007108 A KR840007108 A KR 840007108A KR 890004818 B1 KR890004818 B1 KR 890004818B1
- Authority
- KR
- South Korea
- Prior art keywords
- rail
- conveying
- container
- cleaning
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- H10W99/00—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0676—Conveyors therefor
-
- H10P72/3412—
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (1)
- 납땜되는 IC를 반송시키는 반송레일과, 상기 IC를 간헐적으로 반송하는 반송체인과, 상기IC에 납땜을 행하기 전에 세정을 시행하는 산세정조 및 물세정조와, 세정된 상기 IC를 용제처리하는 용제부와, 납땜처리를 시행하는 땜납조와, 납땜을 행한 후의 상기 IC를 세정하는 물세정조를 순차 배열한 전자동 납땜장치에 있어서, 납땜되는 상기IC를 복수개 놓아서 상기 반송레일로 간헐적으로 송출하는 송출장치와, 상기 반송레일상의 상기 IC를 눌러서 반송시키기 위하여 상기 반송체인에 설치한 걸림부재와, 납땜된 상기 IC를 가동레일로 반송한 후, 이 가동레일을 경사시켜 구동장치에 의하여 상기 IC를 수납부에 수납장치를 설치하고, 상기 IC를 세정액으로 세정하기 위하여 상기 각 세정조 및 용제부를 외용기와 내용기로 나누어 구성하여 상기 반송레일의 하방에 설치함과 동시에, 상기 내용기의 상부를 상기 반송레일로 밀폐하고, 또한 상기 내용기 부분과 대응하는 상기 반송레일의 하부에 상기 내용기의 세정액 또는 용제가 상방으로 분출하는 분출구를 설치하고, 또한 상기 분출구로 부터 분출한 상기 세정액 또는 용제를 상기 외용기에 환류시키는 환류구를 상기 반송레일에 설치하며, 상기 땜납조와 대응하는 부분의 상기 반송 레일을 절결하여 절결부분을 설치하고, 이 절결부분에 IC를 주행시키기 위한 와이어를 걸어 놓는 것으로서, 와이어 레일을 형성한 것을 특징으로 하는 IC용 전자동 납땜장치.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21235983A JPS60106664A (ja) | 1983-11-14 | 1983-11-14 | Ic用全自動はんだ付け装置 |
| JP58-212359 | 1983-11-14 | ||
| JP21235883A JPS60106663A (ja) | 1983-11-14 | 1983-11-14 | Ic用全自動はんだ付け装置 |
| JP58-212358 | 1983-11-14 | ||
| JP58-212360 | 1983-11-14 | ||
| JP21236083A JPS60105292A (ja) | 1983-11-14 | 1983-11-14 | Ic用全自動はんだ付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR850003832A KR850003832A (ko) | 1985-06-26 |
| KR890004818B1 true KR890004818B1 (ko) | 1989-11-27 |
Family
ID=27329354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019840007108A Expired KR890004818B1 (ko) | 1983-11-14 | 1984-11-13 | Ic용 전자동 납땜장치 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4570569A (ko) |
| KR (1) | KR890004818B1 (ko) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8419420D0 (en) * | 1984-07-30 | 1984-09-05 | Sun Ind Coatings | Holding electronic components during application of solder |
| US4695481A (en) * | 1985-03-28 | 1987-09-22 | Senju Metal Industry Co., Ltd. | Method of performing plating of an item having fine parts and a support device therefor |
| DE3529313A1 (de) * | 1985-08-14 | 1987-02-26 | Schering Ag | Automatische transport- und behandlungseinrichtung fuer waren, insbesondere leiterplatten |
| US4720396A (en) * | 1986-06-25 | 1988-01-19 | Fairchild Semiconductor Corporation | Solder finishing integrated circuit package leads |
| US4887762A (en) * | 1987-03-12 | 1989-12-19 | British Aerospace Public Limted Company | Solder coating processes |
| US4799450A (en) * | 1987-03-27 | 1989-01-24 | Corfin Technologies Inc. | Tinning system for surface mount components |
| CA2216774A1 (en) * | 1997-10-17 | 1999-04-17 | Sylvain Rodier | Continuous carrier device for electronic components |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3004505A (en) * | 1957-09-30 | 1961-10-17 | Western Electric Co | Soldering device |
| JPS5332854A (en) * | 1976-09-08 | 1978-03-28 | Hitachi Ltd | Soldering device |
| US4401253A (en) * | 1978-04-18 | 1983-08-30 | Cooper Industries, Inc. | Mass soldering system |
| DE3111809C2 (de) * | 1981-03-25 | 1985-05-15 | Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen | Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken |
-
1984
- 1984-11-13 KR KR1019840007108A patent/KR890004818B1/ko not_active Expired
- 1984-11-13 US US06/670,941 patent/US4570569A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4570569A (en) | 1986-02-18 |
| KR850003832A (ko) | 1985-06-26 |
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