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KR850000812A - 전기적 열적전도성 접착 전이테이프 - Google Patents

전기적 열적전도성 접착 전이테이프 Download PDF

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Publication number
KR850000812A
KR850000812A KR1019840003306A KR840003306A KR850000812A KR 850000812 A KR850000812 A KR 850000812A KR 1019840003306 A KR1019840003306 A KR 1019840003306A KR 840003306 A KR840003306 A KR 840003306A KR 850000812 A KR850000812 A KR 850000812A
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KR
South Korea
Prior art keywords
adhesive
adhesive tape
layer
particles
tape
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KR1019840003306A
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English (en)
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KR930001907B1 (ko
Inventor
스티븐 레이레크(외 1) 로버트
Original Assignee
도날드 밀러 셀
미네소타 마이닝 앤드 매뉴팩츄어링 컴패니
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Publication of KR850000812A publication Critical patent/KR850000812A/ko
Application granted granted Critical
Publication of KR930001907B1 publication Critical patent/KR930001907B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10P50/00—
    • H10W20/40—
    • H10W40/251—
    • H10W72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0435—Metal coated solder, e.g. for passivation of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H10W72/01304—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—
    • H10W90/736—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)

Abstract

내용 없음.

Description

전기적 열적전도성 접착 전이테이프
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 다이(die) 부착용 접착테이프의 횡단면도이다.
제2도는 제1도의 테이프가 부착되고 다이싱(dicing)용 웨이퍼 서잉 필름(wafer sawing film)상에 표장되는 반도체 웨이퍼의 횡단면도이다.
제3도는 반도체다이를 전도체물질에 부착시키기 위해 사용되는 제1도와 제2도의 것과 유사한 접착테이프의 이용을 나타내는 도면이다.

Claims (24)

  1. 실온에서의 대체로 순수한 은구 입자와 같이 접착제의 결합 온도에서 변형될 수 있는 전기적 열적 전도성 입자를 포함하는 접착제층이 용이하게 접착되는 가요성의 저-접착성 케리어 웨브(carrier web)를 특징으로 하고 상기의 전도체 입자는 입자간의 접착제층 보다 균일한 두께로 더욱 크며 그층 또는 그층의 예선택 세그먼트 전체를 통해 균일하게 분포되며 상기 입자-함유층이 케리어 웨브로부터 벗겨지고 두개의 편평하고 견고한 플래이프 사이에서 압착될때 그 입자가 입자간의 접착제의 두께에 대하여 평면화되어서 접착제층의 작표면에서 작고, 편평한 전도체부위가 제공되는 것을 특징으로 하는 접착전이 테이프.
  2. 제1항에 있어서, 인접한 입자간의 평균 공간이 약 0.5mm이상 크지 않는 접착테이프.
  3. 제1항에 있어서, 그 입자가 대체로 구형이 접착테이프.
  4. 제3항에 있어서, 그 입자가 은인 접착테이프.
  5. 제1항에 있어서, 접착제가 열-활성 접착제이고 각 입자가 접착제의 활성온도에서 용융되는 표층과 용융되지 않는 코어를 갖는 적층 입라인 접착테이프.
  6. 제5항에 있어서, 각 입자의 표층이 납인 접착테이프.
  7. 제5항에 있어서, 코어가 금속인 접착테이프.
  8. 제5항에 있어서, 코어가 비금속인 접착테이프.
  9. 제1항에 있어서, 접착제가 열-활성 접착제이고 각 입자가 접착제의 활성온도에서 용융되지 않는 표층과 용융되는 코어를 가지는 접착테이프.
  10. 제9항에 있어서, 코어가 납인 접착테이프.
  11. 제10항에 있어서, 각 입자의 표층이 은인 접착테이프.
  12. 제1항에 있어서, 케리어 웨브가 200℃에 짧게 노출될때 주름지지 않는 접착 테이프.
  13. 제1항에 있어서, 각 입자가 작은 합금 과립의 집괴인 접착테이프.
  14. 층의 각 표면에서 그층의 전체에 그 융기는 접착제의 결합 온도에서 실온에서의 대체로 순수한 은구 입자와 같이 변형될 수 있으며 전기적 열적 전도성 원소를 포함하는 접착제층에 용이하게 접착되는 가요성의 저-점착성 케리어 웨브를 포함하는 다이 접착용 접착 테이프로서 유용한 접착 테이프.
  15. 제14항에서 원소가 직조된 와이어 스크린을 형성하는 접착 테이프.
  16. 제1항에 있어서, 그 원소가 금속 호일을 형성하고 그 호일의 두께가 융기 사이의 접착제 두께의 반이하인 접착테이프.
  17. 제16항에 있어서, 금속호일이 각 표면으로 부터 혹 같은 융기를 가지는 접착테이프.
  18. 제17항에 있어서, 한 표면으로부터의 융기가 다른 표면으로부터의 융기와 함께 정렬되고 각 융기는 접착 테이프가 압착될때 평면화되도록 유연한 접착테이프.
  19. 제17항에 있어서, 융기가 금속호일에 융합된 납의 점적에 의해 제공되는 접착테이프.
  20. 제14항에 있어서, 그 융기가 금속호일의 부풀림에 의해 제공되는 접착테이프.
  21. 제1항에 있어서, 접착제층이 -10° 내지 80°의 중량-평균 Tg값을 가지는 알킬 아크릴레이트와 알킬메타크릴레이트중 최소한 하나의 중합체를 포함하는 접착제 테이프.
  22. 제21항에 있어서, 그 중합체가 단량체의 공중합체이며, 이것의 50몰%까지가 아크릴산, 메타크릴산, 이타콘산, 말레산, 말레무수물, 상기산의 아미드와 N-비닐-2-피롤리돈으로부터 선택된 최소한 하나의 공중합성 단량체인 접착테이프.
  23. 반도체 웨이퍼를 제1항에서의 접착제층과 결합시키고 웨이퍼와 접착층을 각각의 접차제-포함 다이스로 썰고 입자간의 접착제층의 두께에 대하여 테이프의 전도성 입자를 평면화시키기 위한 충분한 입력하에 접착제의 결합 온도에서 다이의 접착제층을 상기 기판에 대하여 압착시키는 단계를 포함하는 전기적, 열적 전도성 기판에 다이를 접착시키는 방법.
  24. 제23항에 있어서, 그 접착제가 열-활성이고 압착중에 이것의 활성온도까지 가열되는 다이의 접착방법.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019840003306A 1983-06-13 1984-06-13 전기 및 열전도성 접착 전이테이프 Expired - Fee Related KR930001907B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US50357883A 1983-06-13 1983-06-13
US503578 1983-06-13
US503,578 1983-06-13

Publications (2)

Publication Number Publication Date
KR850000812A true KR850000812A (ko) 1985-03-09
KR930001907B1 KR930001907B1 (ko) 1993-03-19

Family

ID=24002656

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840003306A Expired - Fee Related KR930001907B1 (ko) 1983-06-13 1984-06-13 전기 및 열전도성 접착 전이테이프

Country Status (11)

Country Link
EP (1) EP0134623B1 (ko)
JP (1) JPS6011574A (ko)
KR (1) KR930001907B1 (ko)
AT (1) ATE36429T1 (ko)
AU (1) AU565919B2 (ko)
CA (1) CA1247943A (ko)
DE (1) DE3473382D1 (ko)
HK (1) HK24989A (ko)
IE (1) IE55524B1 (ko)
MX (1) MX158056A (ko)
SG (1) SG90788G (ko)

Cited By (1)

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KR100218335B1 (ko) * 1996-11-20 1999-09-01 구본준 칩 사이즈 패키지

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IE55238B1 (en) * 1983-08-03 1990-07-04 Nat Starch Chem Corp Carrier film with conductive adhesive for dicing of semiconductor wafers
US4687693A (en) * 1985-06-13 1987-08-18 Stauffer Chemical Company Adhesively mountable die attach film
AU588925B2 (en) * 1985-11-06 1989-09-28 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
AU608745B2 (en) * 1986-02-07 1991-04-18 Minnesota Mining And Manufacturing Company Connector with fine-pitched conductive passages
DE3777995D1 (de) * 1986-12-22 1992-05-07 Siemens Ag Verfahren zur befestigung von elektronischen bauelementen auf einem substrat, folie zur durchfuehrung des verfahrens und verfahren zur herstellung der folie.
US4839227A (en) * 1987-03-12 1989-06-13 Minnesota Mining And Manufacturing Company Resilient electrically and thermally conductive flexible composite
DE3908097A1 (de) * 1989-03-13 1990-09-20 Irion & Vosseler Praegefolie zum aufbringen von leiterbahnen auf feste oder plastische unterlagen
DE69017553T2 (de) * 1989-08-15 1995-12-14 Casio Computer Co Ltd Leitfähige Verbindungsstruktur.
WO1993012190A1 (en) * 1991-12-19 1993-06-24 Cookson Group Plc Conductive adhesive compositions based on thermally depolymerisable polymers
JPH08236554A (ja) * 1995-02-28 1996-09-13 Mitsubishi Electric Corp 半導体装置，及び半導体装置の製造方法，並びに半導体装置のダイボンディング方法
JP2793559B2 (ja) * 1996-05-30 1998-09-03 日東電工株式会社 耐熱性および熱伝導性にすぐれた感圧性接着剤とその接着シ―ト類およびこれらを用いた電子部品と放熱部材との固定方法
ES2246579T3 (es) 1998-07-04 2006-02-16 Tesa Ag Film adhesivo electroconductor, termoplastico y termoactivable.
DE19853805B4 (de) * 1998-11-21 2005-05-12 Tesa Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie und deren Verwendung
US9061478B2 (en) 2011-05-18 2015-06-23 3M Innovative Properties Company Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom
CN104085215B (zh) * 2014-06-27 2016-08-17 苏州达方电子有限公司 热转印膜及其制造方法与硬质表面结构及其形成方法
JP6718761B2 (ja) * 2015-07-21 2020-07-08 積水化学工業株式会社 接着シート

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US3896544A (en) * 1973-01-15 1975-07-29 Essex International Inc Method of making resilient electrical contact assembly for semiconductor devices
JPS51101040A (ko) * 1975-03-04 1976-09-07 Suwa Seikosha Kk
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JPS58160383A (ja) * 1982-03-18 1983-09-22 Nitto Electric Ind Co Ltd 導電性接着テ−プの貼り付け方法
ES276990Y (es) * 1983-01-24 1985-01-16 Minnesota Mining And Manufacturing Company Articulo laminar para efectuar conexiones electricas de union a un sustrato
JPS59153339A (ja) * 1983-02-21 1984-09-01 Nippon Telegr & Teleph Corp <Ntt> 誘導雑音区間識別方式
JPS59195837A (ja) * 1983-04-21 1984-11-07 Sharp Corp Ｌｓｉチツプボンデイング方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100218335B1 (ko) * 1996-11-20 1999-09-01 구본준 칩 사이즈 패키지

Also Published As

Publication number Publication date
MX158056A (es) 1988-12-29
HK24989A (en) 1989-03-31
AU565919B2 (en) 1987-10-01
DE3473382D1 (en) 1988-09-15
JPH0352510B2 (ko) 1991-08-12
ATE36429T1 (de) 1988-08-15
IE841147L (en) 1984-12-13
CA1247943A (en) 1989-01-03
KR930001907B1 (ko) 1993-03-19
SG90788G (en) 1991-04-05
EP0134623B1 (en) 1988-08-10
EP0134623A3 (en) 1985-10-30
JPS6011574A (ja) 1985-01-21
AU2783184A (en) 1984-12-20
IE55524B1 (en) 1990-10-10
EP0134623A2 (en) 1985-03-20

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