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KR830005812A - 인쇄회로용 구리박판 및 그의 제조방법 - Google Patents

인쇄회로용 구리박판 및 그의 제조방법 Download PDF

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Publication number
KR830005812A
KR830005812A KR1019810001121A KR810001121A KR830005812A KR 830005812 A KR830005812 A KR 830005812A KR 1019810001121 A KR1019810001121 A KR 1019810001121A KR 810001121 A KR810001121 A KR 810001121A KR 830005812 A KR830005812 A KR 830005812A
Authority
KR
South Korea
Prior art keywords
printed circuit
manufacturing
copper foil
copper
nickel layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019810001121A
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English (en)
Other versions
KR840002495B1 (ko
Inventor
히로시 나까쯔가와
Original Assignee
마쯔오까 아다라시
후루가와 서킷트 호일 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마쯔오까 아다라시, 후루가와 서킷트 호일 가부시끼가이샤 filed Critical 마쯔오까 아다라시
Priority to KR1019810001121A priority Critical patent/KR840002495B1/ko
Publication of KR830005812A publication Critical patent/KR830005812A/ko
Application granted granted Critical
Publication of KR840002495B1 publication Critical patent/KR840002495B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

내용 없음

Description

인쇄회로용 구리박판 및 그의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. 인쇄회로용 구리박판에 있어서, 구리층과 상기 구리츠의 한측부 또는 양측부에 형성된 니켈층을 포함하며, 상기 니켈층의 표면이 음극적인 크롬산 처리를 받는 것을 특징으로 하는 인쇄회로용 구리박판.
  2. 인쇄회로용 구리박판의 제조방법에 있어서, 전기도금에 의해 구리층의 한측부 또는 양측부에 니켈층을 형성시키고, 전해물로서 크롬산 처리 용액을 사용하여 음극으로 되는 상기 니켈층의 표면을 전해해적으로 처리시키는 공정들을 포함하는 것을 특징으로 하는 인쇄회로용 구리박판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019810001121A 1981-04-03 1981-04-03 인쇄회로용 동박(銅箔) Expired KR840002495B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019810001121A KR840002495B1 (ko) 1981-04-03 1981-04-03 인쇄회로용 동박(銅箔)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019810001121A KR840002495B1 (ko) 1981-04-03 1981-04-03 인쇄회로용 동박(銅箔)

Publications (2)

Publication Number Publication Date
KR830005812A true KR830005812A (ko) 1983-09-09
KR840002495B1 KR840002495B1 (ko) 1984-12-31

Family

ID=19220611

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019810001121A Expired KR840002495B1 (ko) 1981-04-03 1981-04-03 인쇄회로용 동박(銅箔)

Country Status (1)

Country Link
KR (1) KR840002495B1 (ko)

Also Published As

Publication number Publication date
KR840002495B1 (ko) 1984-12-31

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