KR20230107548A - Solvent-free reactive adhesives, cured products and laminates thereof - Google Patents
Solvent-free reactive adhesives, cured products and laminates thereof Download PDFInfo
- Publication number
- KR20230107548A KR20230107548A KR1020237013855A KR20237013855A KR20230107548A KR 20230107548 A KR20230107548 A KR 20230107548A KR 1020237013855 A KR1020237013855 A KR 1020237013855A KR 20237013855 A KR20237013855 A KR 20237013855A KR 20230107548 A KR20230107548 A KR 20230107548A
- Authority
- KR
- South Korea
- Prior art keywords
- polyol
- polyisocyanate
- solvent
- mass
- diisocyanate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000004823 Reactive adhesive Substances 0.000 title claims abstract description 43
- 229920005862 polyol Polymers 0.000 claims abstract description 129
- 150000003077 polyols Chemical class 0.000 claims abstract description 126
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 87
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 87
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims abstract description 35
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims abstract description 35
- 125000003118 aryl group Chemical group 0.000 claims abstract description 23
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims abstract description 20
- -1 polymethylene Polymers 0.000 claims description 46
- 239000002904 solvent Substances 0.000 claims description 23
- 239000004417 polycarbonate Substances 0.000 claims description 15
- 229920000515 polycarbonate Polymers 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000012948 isocyanate Substances 0.000 claims description 7
- 150000002513 isocyanates Chemical class 0.000 claims description 6
- 229920006389 polyphenyl polymer Polymers 0.000 claims description 6
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 19
- 238000002156 mixing Methods 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 30
- 230000001070 adhesive effect Effects 0.000 description 30
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 27
- 239000010408 film Substances 0.000 description 20
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 16
- 238000011156 evaluation Methods 0.000 description 15
- 239000000047 product Substances 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 14
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 12
- 239000003921 oil Substances 0.000 description 11
- 235000019198 oils Nutrition 0.000 description 11
- 239000002253 acid Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000004721 Polyphenylene oxide Substances 0.000 description 8
- 230000001588 bifunctional effect Effects 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 229910001873 dinitrogen Inorganic materials 0.000 description 8
- 235000011007 phosphoric acid Nutrition 0.000 description 8
- 229920000570 polyether Polymers 0.000 description 8
- 238000010992 reflux Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 239000005058 Isophorone diisocyanate Substances 0.000 description 7
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 7
- 239000012299 nitrogen atmosphere Substances 0.000 description 7
- 229920005906 polyester polyol Polymers 0.000 description 7
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 6
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000013329 compounding Methods 0.000 description 6
- 239000012975 dibutyltin dilaurate Substances 0.000 description 6
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 5
- 125000005442 diisocyanate group Chemical group 0.000 description 5
- 239000000539 dimer Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 239000004566 building material Substances 0.000 description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical class OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 3
- 150000002596 lactones Chemical class 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 238000009864 tensile test Methods 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 235000015112 vegetable and seed oil Nutrition 0.000 description 3
- 239000008158 vegetable oil Substances 0.000 description 3
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- AFINAILKDBCXMX-PBHICJAKSA-N (2s,3r)-2-amino-3-hydroxy-n-(4-octylphenyl)butanamide Chemical compound CCCCCCCCC1=CC=C(NC(=O)[C@@H](N)[C@@H](C)O)C=C1 AFINAILKDBCXMX-PBHICJAKSA-N 0.000 description 2
- ARXKVVRQIIOZGF-UHFFFAOYSA-N 1,2,4-butanetriol Chemical compound OCCC(O)CO ARXKVVRQIIOZGF-UHFFFAOYSA-N 0.000 description 2
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- DQVQOGVATWWHNG-UHFFFAOYSA-N 2-(2-ethylpentyl)-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCCC(CC)CC(CO)(CO)CO DQVQOGVATWWHNG-UHFFFAOYSA-N 0.000 description 2
- QKUSTVKSBZYKTG-UHFFFAOYSA-N 2-(hydroxymethyl)-2-(14-methylpentadecyl)propane-1,3-diol Chemical compound CC(C)CCCCCCCCCCCCCC(CO)(CO)CO QKUSTVKSBZYKTG-UHFFFAOYSA-N 0.000 description 2
- HAGYSCKKHMILCH-UHFFFAOYSA-N 2-(hydroxymethyl)-2-(2-methylpentyl)propane-1,3-diol Chemical compound CCCC(C)CC(CO)(CO)CO HAGYSCKKHMILCH-UHFFFAOYSA-N 0.000 description 2
- UPBIGIAAYUUXSD-UHFFFAOYSA-N 2-(hydroxymethyl)-2-pent-4-enylpropane-1,3-diol Chemical compound C(O)C(CCCC=C)(CO)CO UPBIGIAAYUUXSD-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- OFPIKLJDDFUHBE-UHFFFAOYSA-N 2-heptan-3-yl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCCCC(CC)C(CO)(CO)CO OFPIKLJDDFUHBE-UHFFFAOYSA-N 0.000 description 2
- KPVRHYYPNHZEAX-UHFFFAOYSA-N 2-hexan-2-yl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCCCC(C)C(CO)(CO)CO KPVRHYYPNHZEAX-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 2
- 229930006000 Sucrose Natural products 0.000 description 2
- 235000019486 Sunflower oil Nutrition 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 239000011151 fibre-reinforced plastic Substances 0.000 description 2
- 235000019256 formaldehyde Nutrition 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- YPQKTLPPOXNDMC-UHFFFAOYSA-N isocyanic acid;methylcyclohexane Chemical compound N=C=O.CC1CCCCC1 YPQKTLPPOXNDMC-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- NUKZAGXMHTUAFE-UHFFFAOYSA-N methyl hexanoate Chemical compound CCCCCC(=O)OC NUKZAGXMHTUAFE-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 2
- 150000003016 phosphoric acids Chemical class 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920001195 polyisoprene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- AQHHHDLHHXJYJD-UHFFFAOYSA-N propranolol Chemical compound C1=CC=C2C(OCC(O)CNC(C)C)=CC=CC2=C1 AQHHHDLHHXJYJD-UHFFFAOYSA-N 0.000 description 2
- 235000013772 propylene glycol Nutrition 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229960004793 sucrose Drugs 0.000 description 2
- 239000002600 sunflower oil Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 2
- 125000005591 trimellitate group Chemical group 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- OWEYKIWAZBBXJK-UHFFFAOYSA-N 1,1-Dichloro-2,2-bis(4-hydroxyphenyl)ethylene Chemical compound C1=CC(O)=CC=C1C(=C(Cl)Cl)C1=CC=C(O)C=C1 OWEYKIWAZBBXJK-UHFFFAOYSA-N 0.000 description 1
- YAXKTBLXMTYWDQ-UHFFFAOYSA-N 1,2,3-butanetriol Chemical compound CC(O)C(O)CO YAXKTBLXMTYWDQ-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- WVWYODXLKONLEM-UHFFFAOYSA-N 1,2-diisocyanatobutane Chemical compound O=C=NC(CC)CN=C=O WVWYODXLKONLEM-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- ZGDSDWSIFQBAJS-UHFFFAOYSA-N 1,2-diisocyanatopropane Chemical compound O=C=NC(C)CN=C=O ZGDSDWSIFQBAJS-UHFFFAOYSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- NGACGNKKNNNNHK-UHFFFAOYSA-N 1,3,7-Octanetriol Chemical compound CC(O)CCCC(O)CCO NGACGNKKNNNNHK-UHFFFAOYSA-N 0.000 description 1
- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
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- LUKBXSAWLPMMSZ-UHFFFAOYSA-N resveratrol Chemical compound C1=CC(O)=CC=C1C=CC1=CC(O)=CC(O)=C1 LUKBXSAWLPMMSZ-UHFFFAOYSA-N 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- CDAISMWEOUEBRE-UHFFFAOYSA-N scyllo-inosotol Natural products OC1C(O)C(O)C(O)C(O)C1O CDAISMWEOUEBRE-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229940100515 sorbitan Drugs 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
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- 235000010356 sorbitol Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 241000894007 species Species 0.000 description 1
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- 239000007858 starting material Substances 0.000 description 1
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- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical group CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical group CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 description 1
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- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/44—Polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Polyurethanes Or Polyureas (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
내열 시험 및 내유 시험 후에도 우수한 도막 강도 및 유연성을 유지할 수 있고, 또한, 주제와 경화제의 혼합비가 변동한 경우라도 파단 신장도로의 영향이 적은, 무용제형 반응성 접착제를 제공한다. 상기 과제는, 톨릴렌 디이소시아네이트 및 디페닐메탄 디이소시아네이트 중 적어도 한쪽의 트리메틸올프로판 어덕트체와, 상기 트리메틸올프로판 어덕트체를 제외한 방향족 폴리이소시아네이트를 포함하는 폴리이소시아네이트, 및 폴리올을 포함하고, 상기 폴리이소시아네이트의 합계 질량을 기준으로 하여, 상기 톨릴렌 디이소시아네이트의 트리메틸올프로판 어덕트체 및 상기 디페닐메탄 디이소시아네이트의 트리메틸올프로판 어덕트체를, 합계로 40∼80질량%의 범위로 포함하는 무용제형 반응성 접착제에 의해 해결된다.To provide a solvent-free reactive adhesive that can maintain excellent film strength and flexibility even after a heat resistance test and an oil resistance test, and has little effect on the elongation at break even when the mixing ratio of the main agent and the curing agent is changed. The above object includes a polyisocyanate containing a trimethylolpropane adduct of at least one of tolylene diisocyanate and diphenylmethane diisocyanate, and an aromatic polyisocyanate excluding the trimethylolpropane adduct, and a polyol, Based on the total mass of the polyisocyanate, the trimethylolpropane adduct of the tolylene diisocyanate and the trimethylolpropane adduct of the diphenylmethane diisocyanate are included in the range of 40 to 80% by mass in total It is solved by a solvent-free reactive adhesive.
Description
본 발명은, 높은 도막 강도와 유연성을 가지며, 내열성, 내유성(耐油性), 접착력, 및 작업성이 우수한 무용제형 반응성 접착제, 그 경화물 및 적층체에 관한 것이다.The present invention relates to a solvent-free reactive adhesive having high film strength and flexibility and excellent in heat resistance, oil resistance, adhesion, and workability, and a cured product and laminate thereof.
자동차, 건축 자재, 선박, 항공기 등의 분야에 있어서, 철, 알루미늄, 스테인리스 등의 금속, 수지, 유리, 세라믹 등을 접착 고정하기 위해서 다양한 구조용 접착제가 사용되고 있다. 최근, 자동차나 항공기의 분야에서는 연비 향상을 위해 경량화가 진행되고 있고, 플라스틱이나 섬유 강화 플라스틱으로 이루어지는 재료(이하, FRP라고 약칭한다)의 사용 비율을 높이는 것이나, 철로부터 보다 경량의 알루미늄으로 대체하려는 움직임이 활발해지고 있어, 이들을 강고하게 접합할 수 있는 접착제가 요구되고 있다. 그리고 또한, 작업성이나 환경 부하 저감의 관점에서, 휘발성 유기 화합물을 포함하지 않는 접착제가 요구되고 있다.In the fields of automobiles, building materials, ships, and aircraft, various structural adhesives are used to adhere and fix metals such as iron, aluminum, and stainless steel, resins, glass, and ceramics. In recent years, in the field of automobiles and aircraft, weight reduction has been progressing to improve fuel efficiency, increasing the use rate of materials made of plastic or fiber-reinforced plastic (hereinafter abbreviated as FRP), or replacing steel with lighter aluminum. Movement is becoming active, and adhesives capable of bonding them firmly are required. Further, from the viewpoints of workability and environmental impact reduction, adhesives containing no volatile organic compounds are required.
그러나, 예를 들면, 알루미늄 등의 금속과 FRP와 같은 선팽창 계수가 다른 재료를 접착하는 경우, 제조 과정 또는 사용 온도 환경에 있어서의 온도 변화에 따라 생기는 재료간의 팽창률 차이에 의해 접착층에 높은 응력이 걸려, 접착층의 파괴 또는 열화가 촉진된다고 하는 과제가 있다.However, when bonding materials having different coefficients of linear expansion, such as aluminum and other materials, such as FRP, high stress is applied to the adhesive layer due to differences in expansion coefficients between materials caused by temperature changes in the manufacturing process or operating temperature environment. , there is a problem that destruction or deterioration of the adhesive layer is accelerated.
이때, 특허문헌1∼3에서는, 금속이나 FRP로의 높은 접착력을 갖는 에폭시 화합물에, 응력 완화를 목적으로서 장쇄 폴리아민이나 나노 분산시킨 고무상 입자를 첨가하는 방법을 개시하고 있다. 그러나, 이들 방법에서는, 일정한 유연성을 부여할 수 있지만, 얻어지는 접착층은 여전히 단단하고 부서지는 경향이 있어서, 효과가 충분하지 않을 수 있다.At this time, Patent Documents 1 to 3 disclose a method of adding long-chain polyamine or nano-dispersed rubber-like particles to an epoxy compound having high adhesion to metal or FRP for the purpose of stress relaxation. However, in these methods, although a certain flexibility can be imparted, the resulting adhesive layer is still hard and tends to break, so the effect may not be sufficient.
또한, 특허문헌 4에서는, 우레탄 프리폴리머를 포함하는 주제와, 활성 수소기를 갖는 화합물을 포함한 경화제 경화물로 이루어지는, 파단 신장도(伸度)가 우수한 무용제형의 우레탄계 접착제 조성물을 개시하고 있다. 그러나, 특허문헌 4에 기재된 접착제는, 2액 혼합 토출 장치로 도포하는 경우에, 혼합비의 흔들림이나, 믹싱 노즐 내에서의 혼합 불균일에 의해, 파단 신장도가 대폭 저하할 수 있다고 하는 과제가 있다.Further, Patent Literature 4 discloses a non-solvent type urethane-based adhesive composition having excellent elongation at break, comprising a main agent containing a urethane prepolymer and a cured product containing a curing agent containing a compound having an active hydrogen group. However, when the adhesive described in Patent Literature 4 is applied with a two-component mixing and dispensing device, there is a problem that the elongation at break can be significantly reduced due to fluctuations in the mixing ratio or uneven mixing in the mixing nozzle.
이와 같은 과제에 대하여, 특허문헌 5에서는, 우레탄 폴리머를 포함하는 주제, 및 비결정성 폴리올 화합물과 폴리아민 화합물을 포함하는 경화제를 사용함으로써, 주제와 경화제의 혼합비가 변동해도, 파단 신장도의 저하가 억제된 우레탄계 접착제 조성물이 개시되어 있다. 그러나, 특허문헌 5에 기재된 접착제는 아민 화합물을 대량으로 사용하기 때문에, 경화 속도의 조정이 어려운 경우가 있고, 도포시의 노즐 막힘이나, 대면적 혹은 수작업에 있어서의 접착에서 접합 불균일이 발생할 수 있는 과제가 있다. 또한, 아민 화합물의 사용량을 줄임으로써 경화 속도를 늦출 수 있지만, 유연성이나 도막 강도가 저하되는 경향이 있다. 그리고 또한, 이들 방법에서는 경화막 중에 아미노기가 미량으로 잔존하기 때문에, 내열성이나, 내유성 등의 내약품성이 저하될 수 있다는 과제가 있다.Regarding such a problem, in Patent Document 5, by using a base material containing a urethane polymer and a curing agent containing an amorphous polyol compound and a polyamine compound, even if the mixing ratio of the base material and the curing agent fluctuates, the decrease in elongation at break is suppressed A urethane-based adhesive composition is disclosed. However, since the adhesive described in Patent Document 5 uses a large amount of an amine compound, it is sometimes difficult to adjust the curing speed, and nozzle clogging at the time of application or bonding unevenness may occur in large area or manual adhesion. There is a task. In addition, although the curing rate can be slowed down by reducing the amount of the amine compound used, flexibility and strength of the coating film tend to decrease. Further, in these methods, since a trace amount of amino groups remain in the cured film, there is a problem that chemical resistance such as heat resistance and oil resistance may decrease.
본 발명의 목적은, 내열 시험 및 내유 시험 후에도 우수한 도막 강도 및 유연성을 유지할 수 있고, 또한, 주제(폴리올에 상당)와 경화제(폴리이소시아네이트에 상당)의 혼합비가 변동한 경우라도 파단 신장도로의 영향이 적은, 무용제형 반응성 접착제를 제공하는 것에 있다.An object of the present invention is to be able to maintain excellent coating film strength and flexibility even after a heat resistance test and an oil resistance test, and also affect the elongation at break even when the mixing ratio of the main agent (corresponding to polyol) and the curing agent (corresponding to polyisocyanate) fluctuates. This enemy lies in providing a non-solvent type reactive adhesive.
본 발명자들은, 예의 검토를 행한 결과, 폴리올과 함께, 방향족 폴리이소시아네이트와, 특정량의 톨릴렌 디이소시아네이트 및 디페닐메탄 디이소시아네이트 중 적어도 한쪽의 트리메틸올프로판 어덕트체를 포함하는 폴리이소시아네이트를 사용한 접착제가, 상기의 과제를 해결할 수 있다는 것을 알아냈다.As a result of intensive studies, the inventors of the present invention have found that an adhesive using a polyisocyanate containing an aromatic polyisocyanate and a specific amount of a trimethylolpropane adduct of at least one of tolylene diisocyanate and diphenylmethane diisocyanate, together with a polyol. It was found that the above problems could be solved.
즉, 본 발명은, 톨릴렌 디이소시아네이트 및 디페닐메탄 디이소시아네이트 중 적어도 한쪽의 이소시아네이트의 트리메틸올프로판 어덕트체와, 상기 트리메틸올프로판 어덕트체를 제외한 방향족 폴리이소시아네이트를 포함하는 폴리이소시아네이트, 및 폴리올을 포함하는 무용제형 반응성 접착제이며, 상기 폴리이소시아네이트의 합계 질량을 기준으로 해서, 상기 톨릴렌 디이소시아네이트의 트리메틸올프로판 어덕트체 및 상기 디페닐메탄 디이소시아네이트의 트리메틸올프로판 어덕트체를, 합계로 40~80질량%의 범위로 포함하는, 무용제형 반응성 접착제에 관한 것이다.That is, the present invention relates to a polyisocyanate comprising a trimethylolpropane adduct of at least one isocyanate of tolylene diisocyanate and diphenylmethane diisocyanate, and an aromatic polyisocyanate excluding the trimethylolpropane adduct, and a polyol A non-solvent type reactive adhesive comprising a, based on the total mass of the polyisocyanate, the trimethylolpropane adduct of the tolylene diisocyanate and the trimethylolpropane adduct of the diphenylmethane diisocyanate, in total It relates to a non-solvent type reactive adhesive containing in the range of 40 to 80% by mass.
또한 본 발명은, 상기 방향족 폴리이소시아네이트가, 디페닐메탄 디이소시아네이트, 폴리메틸렌 폴리페닐 폴리이소시아네이트, 및 카르보디이미드 변성 디페닐메탄 디이소시아네이트로 이루어지는 군에서 선택되는 적어도 1종을 포함하는, 상기 무용제형 반응성 접착제에 관한 것이다.Furthermore, in the present invention, the solvent-free type wherein the aromatic polyisocyanate contains at least one selected from the group consisting of diphenylmethane diisocyanate, polymethylene polyphenyl polyisocyanate, and carbodiimide-modified diphenylmethane diisocyanate. It is about reactive adhesives.
또한, 본 발명은, 상기 폴리이소시아네이트의 합계 질량을 기준으로 하여, 상기 방향족 폴리이소시아네이트를, 합계로 20∼60질량%의 범위로 포함하는, 상기 무용제형 반응성 접착제에 관한 것이다.Further, the present invention relates to the non-solvent type reactive adhesive containing the aromatic polyisocyanate in a range of 20 to 60% by mass in total based on the total mass of the polyisocyanate.
또한 본 발명은, 상기 폴리이소시아네이트의 합계 질량을 기준으로 하여, 상기 톨릴렌 디이소시아네이트의 트리메틸올프로판 어덕트체 및 상기 디페닐메탄 디이소시아네이트의 트리메틸올프로판 어덕트체를, 합계로 45∼75질량%의 범위로 포함하는, 상기 무용제형 반응성 접착제에 관한 것이다.In addition, the present invention, based on the total mass of the polyisocyanate, the trimethylolpropane adduct of the tolylene diisocyanate and the trimethylolpropane adduct of the diphenylmethane diisocyanate are 45 to 75 mass in total It relates to the solvent-free reactive adhesive, including in the range of %.
또한, 본 발명은, 상기 폴리올이, 우레탄 결합을 갖지 않는 폴리카보네이트 폴리올을 포함하는, 상기 무용제형 반응성 접착제에 관한 것이다.Further, the present invention relates to the solvent-free reactive adhesive, wherein the polyol includes a polycarbonate polyol having no urethane bond.
또한, 본 발명은, 상기 폴리올이, 우레탄 결합을 갖는 폴리올을 포함하는, 상기 무용제형 반응성 접착제에 관한 것이다.Further, the present invention relates to the solvent-free reactive adhesive, wherein the polyol includes a polyol having a urethane bond.
또한, 본 발명은, 상기 폴리올의 합계 질량을 기준으로 하여, 상기 우레탄 결합을 갖는 폴리올을, 합계로 30~70질량%의 범위로 포함하는, 상기 무용제형 반응성 접착제에 관한 것이다.Further, the present invention relates to the non-solvent type reactive adhesive containing the polyol having a urethane bond in a range of 30 to 70% by mass in total based on the total mass of the polyol.
또한, 본 발명은, 상기 무용제형 반응성 접착제의 경화물에 관한 것이다.Further, the present invention relates to a cured product of the non-solvent type reactive adhesive.
또한, 본 발명은, 기재 상에, 상기 경화물로 이루어지는 접착층을 갖는 적층체에 관한 것이다.Further, the present invention relates to a laminate having an adhesive layer made of the above cured material on a substrate.
본 발명에 의해, 내열 시험 및 내유 시험 후에도 우수한 도막 강도 및 유연성을 유지할 수 있고, 그리고 또한, 주제와 경화제의 혼합비가 변동한 경우라도 파단 신장도로의 영향이 적은, 무용제형 반응성 접착제를 제공할 수 있다.According to the present invention, it is possible to provide a solvent-free reactive adhesive that can maintain excellent film strength and flexibility even after a heat resistance test and an oil resistance test, and has little effect on the elongation at break even when the mixing ratio of the main agent and the curing agent is changed. there is.
<무용제형 반응성 접착제><Solvent-free reactive adhesive>
본 발명의 무용제형 반응성 접착제는, 특정의 폴리이소시아네이트와, 폴리올을 포함하는 것을 특징으로 한다. 상기 폴리이소시아네이트는, 적어도, (i)톨릴렌 디이소시아네이트 및 디페닐메탄 디이소시아네이트 중 적어도 한쪽의 이소시아네이트의 트리메틸올프로판 어덕트체(이후, 어덕트체(i)라고 칭할 수 있다); 및 (ii) 방향족 폴리이소시아네이트(단, 상기 어덕트체(i)를 제외한다)를 포함한다.The non-solvent type reactive adhesive of the present invention is characterized by containing a specific polyisocyanate and a polyol. The said polyisocyanate is at least (i) the trimethylolpropane adduct of at least one isocyanate of tolylene diisocyanate and diphenylmethane diisocyanate (it can henceforth be called adduct body (i)); and (ii) aromatic polyisocyanates (except for the adduct (i)).
또한, 어덕트체(i)는, 톨릴렌 디이소시아네이트의 트리메틸올프로판 어덕트체만이어도 되고, 디페닐메탄 디이소시아네이트의 트리메틸올프로판 어덕트체만이어도 된다. 즉, 어덕트체(i)는, 톨릴렌 디이소시아네이트 또는 디페닐메탄 디이소시아네이트의 트리메틸올프로판 어덕트체일 수 있다. 또한, 어덕트체(i)는, 톨릴렌 디이소시아네이트의 트리메틸올프로판 어덕트체 및 디페닐메탄 디이소시아네이트의 트리메틸올프로판 어덕트체 양쪽이어도 된다. 이와 같이, 어덕트체(i)는, 1종을 단독으로 사용해도 되고, 여러 종을 병용해도 된다.Further, the adduct (i) may be only the trimethylolpropane adduct of tolylene diisocyanate or only the trimethylolpropane adduct of diphenylmethane diisocyanate. That is, the adduct (i) may be a trimethylolpropane adduct of tolylene diisocyanate or diphenylmethane diisocyanate. Further, the adduct (i) may be both a trimethylolpropane adduct of tolylene diisocyanate and a trimethylolpropane adduct of diphenylmethane diisocyanate. In this way, the adduct body (i) may be used singly or in combination of several types.
또한, 상기 폴리이소시아네이트의 합계 질량을 기준으로 하여, 상기 어덕트체(i)(톨릴렌 디이소시아네이트의 트리메틸올프로판 어덕트체 및 디페닐메탄 디이소시아네이트의 트리메틸올프로판 어덕트체)를, 합계로 40∼80질량%의 범위에서 포함한다. In addition, based on the total mass of the polyisocyanate, the adduct (i) (trimethylolpropane adduct of tolylene diisocyanate and trimethylolpropane adduct of diphenylmethane diisocyanate), in total It contains in the range of 40-80 mass %.
이와 같이, 폴리올과 함께, 방향족 폴리이소시아네이트 및 소정 범위량의 어덕트체(i)를 포함하는 특정의 폴리이소시아네이트를 사용함으로써, 주제(폴리올)와 경화제(폴리이소시아네이트)의 혼합비가 변동한 경우에도, 탄성률 변화가 적은 경화막을 얻을 수 있고, 우수한 유연성을 안정적으로 발휘할 수 있다. 또한, 본 발명의 무용제형 반응성 접착제는, 높은 도막 강도와 유연성, 및 우수한 내열성, 내유성, 접착력, 적당한 택트 타임(Tact time)을 발휘할 수 있다.In this way, by using a specific polyisocyanate containing an aromatic polyisocyanate and an adduct (i) in a predetermined range together with a polyol, even when the mixing ratio of the main agent (polyol) and the curing agent (polyisocyanate) fluctuates, A cured film with little change in elastic modulus can be obtained, and excellent flexibility can be stably exhibited. In addition, the solvent-free reactive adhesive of the present invention can exhibit high film strength and flexibility, excellent heat resistance, oil resistance, adhesive strength, and appropriate tact time.
따라서, 본 발명의 무용제형 반응성 접착제는, 자동차, 건축 자재, 선박, 항공기 등의 분야에 적합하게 사용된다.Therefore, the solvent-free reactive adhesive of the present invention is suitably used in fields such as automobiles, building materials, ships, and aircraft.
<폴리이소시아네이트><Polyisocyanate>
본 발명에 있어서의 폴리이소시아네이트는, 상기 어덕트체(i)를 제외한 방향족 폴리이소시아네이트와 함께, 폴리이소시아네이트의 전체 질량을 기준으로 하여, 상기 어덕트체(i)를 합계로 40∼80질량%의 범위로 포함하는 것이다. 상기 어덕트체(i)는, 통상, 상온(예를 들면, 25℃)에서 점성 고체이기 때문에, 취급이 어렵고, 지금까지 무용제형 접착제로는 사용되어 오지 않았다. 그러나, 어덕트체(i)를, 전체 폴리이소시아네이트 중, 합계로 40∼80질량%라고 하는 높은 배합비로 함유함으로써, 특이적인 가교 형태를 형성할 수 있다. 이에 따라, 주제와 경화제의 혼합비가 변동한 경우에도, 경화막의 탄성률 변화가 억제되고, 얻어지는 경화막은, 높은 유연성과, 우수한 도막 강도, 내열성, 내유성을 나타낸다.The polyisocyanate in the present invention is 40 to 80% by mass of the adduct body (i) in total based on the total mass of the polyisocyanate together with the aromatic polyisocyanate excluding the adduct body (i). to be included in the scope. Since the adduct body (i) is usually a viscous solid at room temperature (eg, 25° C.), it is difficult to handle and has not been used as a solvent-free adhesive until now. However, a specific crosslinked form can be formed by containing the adduct body (i) at a high compounding ratio of 40 to 80% by mass in total in all polyisocyanates. As a result, even when the mixing ratio of the main agent and the curing agent fluctuates, the change in elastic modulus of the cured film is suppressed, and the resulting cured film exhibits high flexibility, excellent coating strength, heat resistance, and oil resistance.
상기 어덕트체(i)의 합계 함유율은, 폴리이소시아네이트의 합계 질량을 기준으로 하여, 바람직하게는 45∼75질량%의 범위이고, 보다 바람직하게는 50∼75질량%의 범위이다. 어덕트체(i)의 함유율이 45질량% 이상이면, 파단 응력 및 파단 신장도가 보다 우수하기 때문에 바람직하다. 또한, 어덕트체(i)의 함유율이 75질량% 이하이면, 전단 응력 및 파단 신장도가 보다 우수하기 때문에 바람직하다.The total content of the adduct (i) is preferably in the range of 45 to 75% by mass, more preferably in the range of 50 to 75% by mass, based on the total mass of the polyisocyanate. When the content of the adduct body (i) is 45% by mass or more, it is preferable because the breaking stress and breaking elongation are more excellent. In addition, when the content of the adduct body (i) is 75% by mass or less, the shear stress and elongation at break are more excellent, so it is preferable.
톨릴렌 디이소시아네이트의 트리메틸올프로판 어덕트체는, 2,4-톨릴렌디이소시아네이트 및/또는 2,6-톨릴렌디이소시아네이트와, 트리메틸올프로판의 반응체이면 특별히 제한되지 않고 사용할 수 있다. 톨릴렌 디이소시아네이트의 트리메틸올프로판 어덕트체로서는, 예를 들면, 미츠이카가쿠사 제조의 상품명:「타케네이트 D103H」, 스미카바이엘 우레탄사 제조의 상품명:「데스모듈 L」을 들 수 있다.The trimethylolpropane adduct of tolylene diisocyanate can be used without particular limitation as long as it is a reaction product between 2,4-tolylene diisocyanate and/or 2,6-tolylene diisocyanate and trimethylolpropane. Examples of the trimethylolpropane adduct of tolylene diisocyanate include "Takenate D103H", a trade name manufactured by Mitsui Chemicals, and "Desmodule L", a trade name manufactured by Sumika Bayer Urethane Co., Ltd.
디페닐메탄 디이소시아네이트의 트리메틸올프로판 어덕트체는, 4,4'-디페닐메탄 디이소시아네이트 및/또는 2,4'-디페닐메탄 디이소시아네이트와, 트리메틸올프로판의 반응체이면 특별히 제한되지 않고 사용할 수 있다.The trimethylolpropane adduct of diphenylmethane diisocyanate is not particularly limited as long as it is a reaction product of 4,4'-diphenylmethane diisocyanate and/or 2,4'-diphenylmethane diisocyanate and trimethylolpropane. can be used
폴리이소시아네이트는, 상기 어덕트체(i) 이외의 폴리이소시아네이트(이하, 기타 폴리이소시아네이트라고 칭하는 경우가 있다)를 20∼60질량%의 범위로 포함하는 것이다. 다른 폴리이소시아네이트는, 적어도 방향족 폴리이소시아네이트(단, 방향족 폴리이소시아네이트의 변성체도 포함)를 포함한다. 그 밖의 폴리이소시아네이트로서는, 방향족 폴리이소시아네이트 이외는 특별히 제한되지 않지만, 예를 들면, 방향지방족 폴리이소시아네이트, 지방족 폴리이소시아네이트 및 지환식 폴리이소시아네이트, 및 이들의 변성체를 사용할 수 있다.The polyisocyanate contains polyisocyanates other than the adduct body (i) (hereinafter sometimes referred to as other polyisocyanates) in the range of 20 to 60% by mass. Other polyisocyanates include at least aromatic polyisocyanates (however, modified products of aromatic polyisocyanates are also included). The other polyisocyanates are not particularly limited to those other than aromatic polyisocyanates, and examples thereof include aromatic aliphatic polyisocyanates, aliphatic polyisocyanates and alicyclic polyisocyanates, and modified products thereof.
상기 방향족 폴리이소시아네이트로서는, 예를 들면, 디페닐메탄 디이소시아네이트, 카르보디이미드 변성 디페닐메탄 디이소시아네이트, 페닐렌 디이소시아네이트, 톨릴렌 디이소시아네이트, 나프탈렌 디이소시아네이트 등의 방향족 디이소시아네이트; 폴리메틸렌 폴리페닐 폴리이소시아네이트 등의 방향족 폴리이소시아네이트를 들 수 있다.Examples of the aromatic polyisocyanates include aromatic diisocyanates such as diphenylmethane diisocyanate, carbodiimide-modified diphenylmethane diisocyanate, phenylene diisocyanate, tolylene diisocyanate, and naphthalene diisocyanate; and aromatic polyisocyanates such as polymethylene polyphenyl polyisocyanate.
상술한 바와 같이, 본 발명의 무용제형 반응성 접착제가 포함하는 방향족 폴리이소시아네이트는, 디페닐메탄 디이소시아네이트 등의 단량체 이소시아네이트, 및 폴리메틸렌 폴리페닐 폴리이소시아네이트 등의 중합체 이소시아네이트를 포함하는 것이다. 이와 같이, 본 명세서에 있어서의 「폴리이소시아네이트」란, 분자 내에 이소시아네이트기를 2개 이상 갖는 화합물이면 좋고, 이소시아네이트기의 배치는 특별히 한정되지 않는다.As described above, the aromatic polyisocyanate contained in the non-solvent type reactive adhesive of the present invention includes monomer isocyanates such as diphenylmethane diisocyanate and polymer isocyanates such as polymethylene polyphenyl polyisocyanate. Thus, the "polyisocyanate" in this specification may be a compound having two or more isocyanate groups in the molecule, and the arrangement of the isocyanate groups is not particularly limited.
상기 방향지방족 폴리이소시아네이트로서는, 예를 들면, 1,3- 또는 1,4-자일릴렌디이소시아네이트 혹은 그 혼합물, ω,ω'-디이소시아네이트-1,4-디에틸벤젠, 1,3- 또는 1,4-비스(1-이소시아네이트-1-메틸에틸)벤젠 혹은 그 혼합물 등의 방향지방족 디이소시아네이트를 들 수 있다.Examples of the aromatic aliphatic polyisocyanate include 1,3- or 1,4-xylylene diisocyanate or a mixture thereof, ω,ω'-diisocyanate-1,4-diethylbenzene, and 1,3- or 1 and aromatic aliphatic diisocyanates such as ,4-bis(1-isocyanate-1-methylethyl)benzene or mixtures thereof.
상기 지방족 폴리이소시아네이트로서는, 예를 들면 트리메틸렌디이소시아네이트, 테트라메틸렌디이소시아네이트, 헥사메틸렌디이소시아네이트, 1,2-프로필렌디이소시아네이트, 1,2-부틸렌디이소시아네이트, 2,3-부틸렌디이소시아네이트, 1,3-부틸렌디이소시아네이트, 2,4,4- 또는 2,2,4-트리메틸헥사메틸렌디이소시아네이트, 2,6-디이소시아네이트메틸카프로에이트, 라이신디이소시아네이트, 다이머산디이소시아네이트 등의 지방족 디이소시아네이트를 들 수 있다.As said aliphatic polyisocyanate, for example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, 1,2-propylene diisocyanate, 1,2-butylene diisocyanate, 2,3-butylene diisocyanate, 1, aliphatic diisocyanates such as 3-butylene diisocyanate, 2,4,4- or 2,2,4-trimethylhexamethylene diisocyanate, 2,6-diisocyanate methyl caproate, lysine diisocyanate, and dimer acid diisocyanate; there is.
상기 지환식 폴리이소시아네이트로서는, 예를 들면 1,4-시클로헥산디이소시아네이트, 1,3-시클로헥산디이소시아네이트, 이소포론디이소시아네이트, 4,4'-메틸렌비스(시클로헥실이소시아네이트), 메틸2,4-시클로헥산디이소시아네이트, 메틸2, 6-시클로헥산디이소시아네이트, 1,4-비스(이소시아네이트메틸)시클로헥산, 1,3-비스(이소시아네이트메틸)시클로헥산, 노르보르넨디이소시아네이트 등의 지환식 디이소시아네이트를 들 수 있다.Examples of the alicyclic polyisocyanates include 1,4-cyclohexane diisocyanate, 1,3-cyclohexane diisocyanate, isophorone diisocyanate, 4,4'-methylenebis(cyclohexyl isocyanate), and methyl 2,4. -Cyclohexane diisocyanate, methyl 2,6-cyclohexane diisocyanate, 1,4-bis (isocyanate methyl) cyclohexane, 1,3-bis (isocyanate methyl) cyclohexane, norbornene diisocyanate and other alicyclic diisocyanates can be heard
폴리이소시아네이트의 변성체로서는, 예를 들면, 알로파네이트형 변성체, 이소시아누레이트형 변성체, 뷰렛형 변성체, 어덕트형 변성체 외에, 상기 폴리이소시아네이트 성분과 폴리올을 이소시아네이트기 과잉의 조건하에 반응시킨 이소시아네이트기와 우레탄 결합을 갖는 반응 생성물을 들 수 있다. 상기 폴리이소시아네이트의 변성체를 형성하는 폴리올로서는, 특별히 제한되지 않고, 공지의 폴리올에서 선택할 수 있으며, 예를 들면, 폴리에스테르 폴리올, 폴리에스테르우레탄 폴리올, 폴리카보네이트 폴리올, 폴리카프로락톤 폴리올, 폴리에테르 폴리올, 폴리에테르우레탄 폴리올, 폴리올레핀 폴리올, 아크릴 폴리올, 실리콘 폴리올, 피마자유계 폴리올, 불소계 폴리올을 들 수 있다.Examples of modified polyisocyanates include allophanate-type modified products, isocyanurate-type modified products, biuret-type modified products, and adduct-type modified products, as well as conditions where the polyisocyanate component and the polyol have excess isocyanate groups. and a reaction product having an isocyanate group and a urethane bond reacted under. The polyol forming the modified polyisocyanate is not particularly limited and can be selected from known polyols, such as polyester polyol, polyesterurethane polyol, polycarbonate polyol, polycaprolactone polyol, and polyether polyol. , polyetherurethane polyols, polyolefin polyols, acrylic polyols, silicone polyols, castor oil-based polyols, and fluorine-based polyols.
이들의 다른 폴리이소시아네이트는, 1종을 단독으로 사용해도 되고, 2종 이상을 조합하여 사용해도 된다.These other polyisocyanates may be used individually by 1 type, and may be used in combination of 2 or more type.
본 발명의 무용제형 반응성 접착제는, 다른 폴리이소시아네이트로서 방향족 폴리이소시아네이트를 포함하지만, 상기 방향족 폴리이소시아네이트로서는, 디페닐메탄 디이소시아네이트, 폴리메틸렌폴리페닐폴리이소시아네이트, 및 카르보디이미드 변성 디페닐메탄 디이소시아네이트로 이루어지는 군에서 선택되는 적어도 1종을 포함하는 것이 바람직하다.The non-solvent type reactive adhesive of the present invention includes aromatic polyisocyanates as other polyisocyanates, but diphenylmethane diisocyanates, polymethylene polyphenyl polyisocyanates, and carbodiimide-modified diphenylmethane diisocyanates are used as the aromatic polyisocyanates. It is preferable to include at least 1 sort(s) selected from the group which consists of.
폴리이소시아네이트가 방향족 폴리이소시아네이트를 포함하는 경우, 방향족 폴리이소시아네이트의 함유율은, 폴리이소시아네이트의 합계 질량을 기준으로 하여, 합계로, 바람직하게는 20~60질량%이며, 보다 바람직하게는 20~50질량%이며, 더욱 바람직하게는 25~45질량%이다. 상기 범위 내이면, 얻어지는 경화막의 유연성, 도막 강도, 내열성이 보다 우수하기 때문에 바람직하다.When the polyisocyanate contains an aromatic polyisocyanate, the content of the aromatic polyisocyanate is preferably 20 to 60% by mass, more preferably 20 to 50% by mass, in total based on the total mass of the polyisocyanate. and more preferably 25 to 45% by mass. If it is within the above range, it is preferable because the flexibility, coating strength, and heat resistance of the obtained cured film are more excellent.
<폴리올><Polyol>
본 발명에 있어서의 폴리올은, 폴리이소시아네이트와의 반응에서 강인한 가교 구조를 형성하고, 얻어지는 경화막에 적당한 유연성과 응집력을 주어, 우수한 도막 강도, 유연성, 내열성을 부여하는 역할을 담당한다. 상기 폴리올은, 분자 내에 수산기를 2개 이상 갖는 화합물이면 되고, 화합물이 수지인 경우, 당해 수산기는, 수지의 말단, 측쇄, 또는 측기 중 어느 것에 있어도 된다.The polyol in the present invention plays a role of forming a strong cross-linked structure through reaction with polyisocyanate, imparting appropriate flexibility and cohesion to the obtained cured film, and imparting excellent coating film strength, flexibility and heat resistance. The polyol may be a compound having two or more hydroxyl groups in the molecule, and when the compound is a resin, the hydroxyl group may be present at the terminal, side chain, or side group of the resin.
이러한 폴리올로서는, 예를 들면, 폴리에테르 폴리올, 폴리에스테르 폴리올, 폴리카보네이트 폴리올, 폴리올레핀 폴리올, 식물유계 폴리올, 아크릴 폴리올이나 기타 폴리올, 이들의 복합체를 들 수 있다. 또한, 경화막 중의 우레탄 결합 농도의 조절이나 각종 관능기 도입을 목적으로 하여, 후술하는 저분자 폴리올을 사용해도 된다.Examples of such polyols include polyether polyols, polyester polyols, polycarbonate polyols, polyolefin polyols, vegetable oil polyols, acrylic polyols, other polyols, and complexes thereof. In addition, for the purpose of adjusting the concentration of urethane bonds in the cured film or introducing various functional groups, a low molecular weight polyol described later may be used.
본 발명의 무용제형 반응성 접착제가 함유하는 폴리올은, 폴리올 중의 수산기의 일부가 산 변성된 산 변성물이어도 되고, 산 무수물을 반응시켜서 카르복실기를 도입한 것이나 디이소시아네이트를 반응시켜서 우레탄 결합을 도입한 것이어도 된다.The polyol contained in the non-solvent type reactive adhesive of the present invention may be an acid-modified product in which a part of the hydroxyl groups in the polyol is acid-modified, or a product in which a carboxyl group is introduced by reacting an acid anhydride or a urethane bond is introduced by reacting a diisocyanate. do.
이들 폴리올은 1종을 단독으로 사용해도 되고, 2종 이상을 조합하여 사용해도 된다.These polyols may be used individually by 1 type, and may be used in combination of 2 or more type.
(폴리에테르 폴리올)(polyether polyol)
폴리에테르 폴리올은, 수산기와 에테르 결합을 분자 내에 각각 2개 이상 갖는 화합물이면 된다. 폴리에테르 폴리올로서는, 예를 들면 폴리에틸렌글리콜, 폴리프로필렌글리콜, 폴리(에틸렌/프로필렌)글리콜, 또는 폴리테트라메틸렌글리콜 등의, 산화메틸렌, 산화에틸렌, 산화프로필렌, 테트라히드로푸란 등의 중합체 또는 공중합체; 헥산디올, 메틸헥산디올, 헵탄디올, 옥탄디올 또는 이들의 혼합물의 축합에 의한 폴리에테르폴리올류; 저분자 폴리올, 지방족 아민 화합물류, 방향족 아민 화합물류, 알칸올아민류, 또는 비스페놀류 등의 적어도 2개 이상의 활성 수소기를 갖는 화합물을 출발 원료로서, 이것에 산화메틸렌, 산화에틸렌, 산화프로필렌, 산화부틸렌, 테트라히드로푸란, 혹은 폴리옥시테트라메틸렌옥사이드 등의 알킬렌옥사이드를 부가시켜서 얻어지는 폴리올을 들 수 있다.The polyether polyol may be a compound each having two or more hydroxyl groups and ether bonds in a molecule. Examples of the polyether polyol include polymers or copolymers such as polyethylene glycol, polypropylene glycol, poly(ethylene/propylene) glycol, and polytetramethylene glycol, such as methylene oxide, ethylene oxide, propylene oxide, and tetrahydrofuran; polyether polyols by condensation of hexanediol, methylhexanediol, heptanediol, octanediol or mixtures thereof; A compound having at least two or more active hydrogen groups such as low molecular weight polyols, aliphatic amine compounds, aromatic amine compounds, alkanolamines, or bisphenols is used as a starting material, and methylene oxide, ethylene oxide, propylene oxide, and butylene oxide are added thereto , tetrahydrofuran, or a polyol obtained by adding an alkylene oxide such as polyoxytetramethylene oxide.
상기 저분자 폴리올로서는, 예를 들면, 에틸렌글리콜, 1,2-프로판디올, 1,3-프로판디올, 1,2-부탄디올, 1,3-부탄디올, 1,4-부탄디올, 네오펜틸글리콜, 펜탄디올, 헥산디올, 옥탄디올, 노난디올, 디프로필렌글리콜, 디에틸렌글리콜, 트리에틸렌글리콜, 3-메틸-1,5-펜탄디올, 2-부틸-2-에틸-1,3-프로판디올, 2-에틸-1,3-헥산디올, 2-메틸-1,8-옥탄디올, 폴리옥시에틸렌글리콜(부가몰수10이하), 폴리옥시프로필렌글리콜(부가몰수10이하), 시클로헥산디올, 시클로헥산디메탄올, 트리시클로데칸디메탄올, 시클로펜타디엔디메탄올, 다이머디올, 비스페놀B,N,N-비스(2-히드록시프로필)아닐린, 디메틸올초산, 디메틸올프로피온산, 디메틸올부탄산, 2,2-디메틸올락산, 2,2-디메틸올펜탄산, 디하이드록시숙신산, 디하이드록시프로피온산, 디하이드록시 안식향산 등의 2관능의 저분자 폴리올;Examples of the low molecular weight polyol include ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, neopentylglycol, and pentanediol. , hexanediol, octanediol, nonanediol, dipropylene glycol, diethylene glycol, triethylene glycol, 3-methyl-1,5-pentanediol, 2-butyl-2-ethyl-1,3-propanediol, 2- Ethyl-1,3-hexanediol, 2-methyl-1,8-octanediol, polyoxyethylene glycol (additional mole number 10 or less), polyoxypropylene glycol (additional mole number 10 or less), cyclohexanediol, cyclohexanedimethanol , tricyclodecane dimethanol, cyclopentadiene dimethanol, dimer diol, bisphenol B,N,N-bis(2-hydroxypropyl)aniline, dimethylolacetic acid, dimethylolpropionic acid, dimethylolbutanoic acid, 2,2-dimethylol bifunctional low-molecular-weight polyols such as lactic acid, 2,2-dimethylolpentanoic acid, dihydroxysuccinic acid, dihydroxypropionic acid, and dihydroxybenzoic acid;
트리메틸올에탄, 트리메틸올프로판, 1,1,1-트리메틸올부탄, 1,2,3-부탄트리올, 1,2,4-부탄트리올, 1,2,6-부탄트리올, 트리메틸올부텐, 트리메틸올펜텐, 트리메틸올헥센, 트리메틸올헵텐, 트리메틸올옥텐, 트리메틸올노넨, 트리메틸올데센, 트리메틸올운데센, 트리메틸올도데센, 트리메틸올트리데센, 트리메틸올펜타데센, 트리메틸올헥사데센, 트리메틸올헵타데센, 트리메틸올옥타데센, 1,1,1-트리메틸올-2-메틸-헥산, 1,1,1-트리메틸올-3-메틸-헥산, 1,1,1-트리메틸올-2-에틸-헥산, 1,1,1-트리메틸올-3-에틸-헥산, 트리메틸올헥센, 1,2,3-옥탄트리올, 1,3,7-옥탄트리올, 3,7-디메틸-1,2,3-옥탄트리올, 1,1,1-트리메틸올데칸, 1,2,10-데칸트리올, 1,1,1-트리메틸올이소헵타데칸, 1,1,1-트리메틸올-seA-부탄, 1,1,1-트리메틸올-tert-펜탄, 1,1,1-트리메틸올-tert-노난, 1,1,1-트리메틸올-tert-트리데칸, 1,1,1-트리메틸올-tert-헵타데칸, 1,1,1-트리메틸올-2-메틸-헥산, 1,1,1-트리메틸올-3-메틸-헥산, 1,1,1-트리메틸올-2-에틸-헥산, 1,1,1-트리메틸올-3-에틸-헥산, 1,1,1-트리메틸올이소헵타데칸, 1,2,3,4-부탄테트라올, 펜타에리스리톨, 디펜타에리스리톨, 트리펜타에리스리톨, 글리세린, 디글리세린, 트리글리세린, 폴리글리세린, 디트리메틸올에탄, 디트리메틸올프로판, 트리스(2-히드록시에틸)이소시아누레이트, 벤젠-1,3,5-트리올, 벤젠-1,2,3-트리올, 스틸벤-3,4',5-트리올, 슈크로스, 이노시톨, 소르비탄, 소르비톨, 만니톨, 사카로스, 셀룰로오스, 자일리톨 등의 3관능 이상의 저분자 폴리올을 들 수 있다.Trimethylolethane, trimethylolpropane, 1,1,1-trimethylolbutane, 1,2,3-butanetriol, 1,2,4-butanetriol, 1,2,6-butanetriol, trimethylol Butene, trimethylolpentene, trimethylolhexene, trimethylolheptene, trimethyloloctene, trimethylolnonene, trimethyloldecene, trimethylolundecene, trimethyloldodecene, trimethyloltridecene, trimethylolpentadecene, trimethylolhexadecene , trimethylolheptadecene, trimethyloloctadecene, 1,1,1-trimethylol-2-methyl-hexane, 1,1,1-trimethylol-3-methyl-hexane, 1,1,1-trimethylol- 2-ethyl-hexane, 1,1,1-trimethylol-3-ethyl-hexane, trimethylolhexene, 1,2,3-octanetriol, 1,3,7-octanetriol, 3,7-dimethyl -1,2,3-octanetriol, 1,1,1-trimethyloldecane, 1,2,10-decanetriol, 1,1,1-trimethylolisoheptadecane, 1,1,1-trimethyl ol-seA-butane, 1,1,1-trimethylol-tert-pentane, 1,1,1-trimethylol-tert-nonane, 1,1,1-trimethylol-tert-tridecane, 1,1, 1-trimethylol-tert-heptadecane, 1,1,1-trimethylol-2-methyl-hexane, 1,1,1-trimethylol-3-methyl-hexane, 1,1,1-trimethylol-2 -Ethyl-hexane, 1,1,1-trimethylol-3-ethyl-hexane, 1,1,1-trimethylolisoheptadecane, 1,2,3,4-butanetetraol, pentaerythritol, dipentaerythritol , tripentaerythritol, glycerin, diglycerin, triglycerin, polyglycerin, ditrimethylolethane, ditrimethylolpropane, tris(2-hydroxyethyl)isocyanurate, benzene-1,3,5-triol, trifunctional or higher molecular weight polyols such as benzene-1,2,3-triol, stilbene-3,4',5-triol, sucrose, inositol, sorbitan, sorbitol, mannitol, saccharose, cellulose, and xylitol can be heard
상기 지방족 아민 화합물류로서는, 예를 들면, 에틸렌디아민, 트리에틸렌테트라민, 디에틸렌트리아민, 트리아미노프로판을 들 수 있다. 상기 방향족 아민 화합물류로서는, 예를 들면 톨루엔디아민, 디페닐메탄-4,4-디아민을 들 수 있다. 상기 알칸올아민류로서는, 예를 들면, 에탄올아민 및 디에탄올아민을 들 수 있다. 상기 비스페놀류로서는, 예를 들면, 비스페놀 B, 비스페놀 BP, 비스페놀 C, 비스페놀 A, 비스페놀 E, 비스페놀 F를 들 수 있다.Examples of the aliphatic amine compounds include ethylenediamine, triethylenetetramine, diethylenetriamine, and triaminopropane. Examples of the aromatic amine compounds include toluene diamine and diphenylmethane-4,4-diamine. Examples of the alkanolamines include ethanolamine and diethanolamine. Examples of the bisphenols include bisphenol B, bisphenol BP, bisphenol C, bisphenol A, bisphenol E, and bisphenol F.
(폴리에스테르 폴리올)(polyester polyol)
폴리에스테르 폴리올로서는, 예를 들면, 상술한 저분자 폴리올과 이염기산 성분이 축합 반응한 폴리에스테르 폴리올이나, 락톤류 등의 환상 에스테르 화합물의 개환 중합에 의해 얻어지는 락톤계 폴리에스테르 폴리올을 들 수 있다.As a polyester polyol, the polyester polyol which the above-mentioned low molecular weight polyol and dibasic acid component were condensation-reacted, and the lactone system polyester polyol obtained by ring-opening polymerization of cyclic ester compounds, such as lactones, are mentioned, for example.
상기 이염기산 성분으로서는, 예를 들면, 테레프탈산, 아디프산, 아젤라산, 세바신산, 다이머산, 수첨 다이머산, 무수 프탈산, 이소프탈산, 트리멜리트산, 글루타르산, 피멜린산, 수베르산 등의 지방족 혹은 방향족 이염기산, 및 이들의 무수물을 들 수 있다.Examples of the dibasic acid component include terephthalic acid, adipic acid, azelaic acid, sebacic acid, dimer acid, hydrogenated dimer acid, phthalic anhydride, isophthalic acid, trimellitic acid, glutaric acid, pimelic acid, and suberic acid. aliphatic or aromatic dibasic acids such as the like, and anhydrides thereof.
상기 락톤류로서는, 예를 들면, ε-카프로락톤, 폴리(β-메틸-γ-발레로락톤), 폴리발레로락톤을 들 수 있다.Examples of the lactones include ε-caprolactone, poly(β-methyl-γ-valerolactone), and polyvalerolactone.
(폴리카보네이트 폴리올)(Polycarbonate Polyol)
폴리카보네이트 폴리올로서는, 예를 들면, 상술한 저분자 폴리올과, 디알킬카보네이트, 알킬렌카보네이트, 디아릴카보네이트 등의 카보네이트 화합물과의, 반응 생성물을 들 수 있다.As a polycarbonate polyol, the reaction product of the above-mentioned low molecular weight polyol and carbonate compounds, such as a dialkyl carbonate, an alkylene carbonate, and a diaryl carbonate, is mentioned, for example.
상기 디알킬카보네이트로서는, 디메틸카보네이트, 디에틸카보네이트 등을 들 수 있다. 상기 알킬렌 카보네이트로서는, 에틸렌 카보네이트 등을 들 수 있다. 상기 디아릴카보네이트로서는, 디페닐카보네이트 등을 들 수 있다.As said dialkyl carbonate, dimethyl carbonate, diethyl carbonate, etc. are mentioned. Ethylene carbonate etc. are mentioned as said alkylene carbonate. As said diaryl carbonate, diphenyl carbonate etc. are mentioned.
(폴리올레핀 폴리올)(Polyolefin Polyol)
폴리올레핀 폴리올로서는, 예를 들면, 수산기 함유 폴리부타디엔, 수첨(水添)한 수산기 함유 폴리부타디엔, 수산기 함유 폴리이소프렌, 수첨한 수산기 함유 폴리이소프렌, 수산기 함유 염소화 폴리프로필렌, 수산기 함유 염소화 폴리에틸렌을 들 수 있다.Examples of the polyolefin polyol include hydroxyl group-containing polybutadiene, hydrogenated hydroxyl group-containing polybutadiene, hydroxyl group-containing polyisoprene, hydrogenated hydroxyl group-containing polyisoprene, hydroxyl group-containing chlorinated polypropylene, and hydroxyl group-containing chlorinated polyethylene. .
(식물유계 폴리올)(vegetable oil polyol)
식물유계 폴리올로서는, 예를 들면, 식물 유래의 해바라기유, 다이머산, 또는 대두유를 원료로 한 폴리올을 들 수 있다.Examples of vegetable oil-based polyols include plant-derived sunflower oil, dimer acid, and polyols made from soybean oil as a raw material.
이들 폴리올은, 전술한 바와 같이, 폴리올 중의 수산기의 일부가 산 변성된 산 변성물이어도 되고, 산 무수물을 반응시켜서 카르복실기를 도입한 것이나, 디이소시아네이트를 반응시켜서 우레탄 결합을 도입한 것이어도 좋다.As described above, these polyols may be acid-modified products in which some of the hydroxyl groups in the polyol are acid-modified, or may be products in which carboxyl groups are introduced by reacting acid anhydrides or urethane bonds are introduced by reacting diisocyanate.
상기 산 무수물로서는, 예를 들면, 무수 피로멜리트산, 무수 메리트산, 무수 트리멜리트산, 트리멜리트산 에스테르 무수물을 들 수 있다. 트리멜리트산 에스테르 무수물로서는, 예를 들면, 탄소수 2∼30의 알킬렌글리콜 또는 알칸트리올을 무수 트리멜리트산으로 에스테르화 반응시켜서 이루어지는 에스테르 화합물을 들 수 있다. 트리멜리트산에스테르 무수물로서는, 보다 구체적으로는, 에틸렌글리콜비스안히드로트리멜리테이트, 프로필렌글리콜비스안히드로트리멜리테이트 등을 들 수 있다.Examples of the acid anhydride include pyromellitic anhydride, meritic acid anhydride, trimellitic anhydride, and trimellitic acid ester anhydride. As a trimellitic acid ester anhydride, the ester compound formed by carrying out the esterification reaction of C2-C30 alkylene glycol or alkanetriol with trimellitic anhydride is mentioned, for example. As a trimellitic acid ester anhydride, ethylene glycol bisanhydro trimellitate, a propylene glycol bisanhydro trimellitate, etc. are mentioned more specifically.
상기 디이소시아네이트로서는, 예를 들면, 2,4-톨릴렌 디이소시아네이트, 2,6-톨릴렌 디이소시아네이트, 자일릴렌 디이소시아네이트, 디페닐메탄 디이소시아네이트, 이소포론 디이소시아네이트, 1,5-나프탈렌 디이소시아네이트, 헥사메틸렌 디이소시아네이트, 수첨화 디페닐메탄 디이소시아네이트를 들 수 있다.Examples of the diisocyanate include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate, isophorone diisocyanate, and 1,5-naphthalene diisocyanate. , hexamethylene diisocyanate, and hydrogenated diphenylmethane diisocyanate.
그리고 또한, 본 발명의 무용제형 반응성 접착제는, 우레탄 결합을 갖는 폴리올을 포함하는 것이 바람직하다. 이러한 우레탄 결합을 갖는 폴리올로서는, 상술한, 디이소시아네이트를 반응시켜서 우레탄 결합을 도입한 폴리올을 들 수 있고, 상이한 폴리머종끼리를 연결한 블록 폴리머여도 좋다.Further, it is preferable that the non-solvent type reactive adhesive of the present invention contains a polyol having a urethane bond. Examples of the polyol having such a urethane bond include a polyol in which a urethane bond is introduced by reacting the diisocyanate described above, and a block polymer in which different polymer species are linked may be used.
상기 우레탄 결합을 갖는 폴리올은, 수지의 말단 영역에 수산기가 국재화(局在化)되어 있는 것이 바람직하다. 수지의 말단 영역에 수산기가 국재화되어 있으면, 경화막의 유연성이 우수하기 때문에 바람직하다.It is preferable that the hydroxyl group is localized in the terminal region of resin in the polyol which has the said urethane bond. When the hydroxyl group is localized in the terminal region of the resin, the cured film is excellent in flexibility, so it is preferable.
이러한 수지의 말단에 수산기를 갖는, 우레탄 결합을 갖는 폴리올로서는, 예를 들면, 상술한 폴리이소시아네이트와 폴리올을, 이소시아네이트기와 수산기의 몰 당량비(NCO몰수/OH몰수)가 1미만이 되도록 반응시킴으로써 얻을 수 있다.The polyol having a urethane bond having a hydroxyl group at the terminal of such a resin can be obtained, for example, by reacting the above-mentioned polyisocyanate and polyol so that the molar equivalent ratio of the isocyanate group and the hydroxyl group (NCO moles/OH moles) is less than 1. there is.
이들 중에서도, 폴리올로서 바람직하게는, 폴리에테르 폴리올, 및 폴리카보네이트 폴리올로 이루어지는 군에서 선택되는 적어도 1종을 포함하는 것이며, 보다 바람직하게는 폴리카보네이트 폴리올을 포함하는 것이며, 더욱 바람직하게는, 폴리카보네이트 폴리올(단, 우레탄 결합을 갖지 않음)과, 우레탄 결합을 갖는 폴리올을 포함하는 것이다.Among these, the polyol preferably contains at least one selected from the group consisting of polyether polyols and polycarbonate polyols, more preferably contains polycarbonate polyols, and still more preferably polycarbonates. It includes a polyol (but not having a urethane bond) and a polyol having a urethane bond.
폴리올이 폴리카보네이트 폴리올을 포함하는 경우, 폴리카보네이트 폴리올의 함유율은, 폴리올의 합계 질량을 기준으로서, 바람직하게는 30질량% 이상, 보다 바람직하게는 50질량% 이상이며, 또한, 바람직하게는 100질량% 이하, 보다 바람직하게는 90질량% 이하, 더욱 바람직하게는 70질량% 이하이다.When the polyol contains a polycarbonate polyol, the content of the polycarbonate polyol is preferably 30% by mass or more, more preferably 50% by mass or more, and preferably 100% by mass, based on the total mass of the polyol. % or less, more preferably 90% by mass or less, still more preferably 70% by mass or less.
폴리올이 우레탄 결합을 갖는 폴리올을 포함하는 경우, 우레탄 결합을 갖는 폴리올의 함유율은, 폴리올의 합계 질량을 기준으로 하여, 합계로, 바람직하게는 30~70질량%이다. 우레탄 결합을 갖는 폴리올의 함유율이 30질량% 이상이면, 얻어지는 경화막의 발포성이 보다 우수하다. 우레탄 결합을 갖는 폴리올의 함유율이 70질량% 이하이면, 후술하는 가사(可使) 시간이 보다 우수하다.When the polyol contains a polyol having a urethane bond, the total content of the polyol having a urethane bond is preferably 30 to 70% by mass based on the total mass of the polyol. When the content rate of the polyol having a urethane bond is 30% by mass or more, the resulting cured film has better foamability. When the content of the polyol having a urethane bond is 70% by mass or less, the pot life described later is more excellent.
상기 우레탄 결합을 갖지 않는 폴리카보네이트 폴리올의 수평균 분자량은, 바람직하게는 500이상, 5,000미만이며, 보다 바람직하게는 700이상, 3,500미만이다.The number average molecular weight of the polycarbonate polyol having no urethane bond is preferably 500 or more and less than 5,000, more preferably 700 or more and less than 3,500.
상기 우레탄 결합을 갖는 폴리올의 중량 평균 분자량은, 바람직하게는 3,000~200,000이다. 중량 평균 분자량이 3,000이상이면 얻어지는 경화막의 유연성이 보다 우수하고, 200,000이하이면 점도의 조정이 보다 용이하다.The weight average molecular weight of the polyol having the urethane bond is preferably 3,000 to 200,000. When the weight average molecular weight is 3,000 or more, the flexibility of the obtained cured film is more excellent, and when it is 200,000 or less, adjustment of the viscosity is easier.
상기 우레탄 결합을 갖는 폴리올의 수산기가는, 바람직하게는 50~500mgKOH/g이고, 보다 바람직하게는 100~300mgKOH/g이다. 50~500mgKOH/g이면, 얻어지는 경화막의 접착력, 유연성, 내열성이 보다 우수하기 때문에 바람직하다.The hydroxyl value of the polyol having a urethane bond is preferably 50 to 500 mgKOH/g, and more preferably 100 to 300 mgKOH/g. If it is 50-500 mgKOH/g, since the adhesive force of the cured film obtained, flexibility, and heat resistance are more excellent, it is preferable.
<무용제형 반응성 접착제의 조정><Adjustment of solvent-free reactive adhesive>
본 발명의 무용제형 반응성 접착제는, 전술한 폴리이소시아네이트 및 폴리올을 배합하여 얻어지는, 2액 경화형의 우레탄계 무용제 접착제이며, 폴리올과 폴리이소시아네이트의 배합 비율은, 이소시아네이트가 함유하는 전체 이소시아네이트기와, 폴리올이 함유하는 전체 수산기의 몰 당량비[NCO/OH]가 0.8∼2.5의 범위인 것이 바람직하고, 보다 바람직하게는 1.0∼2.0의 범위이다.The solvent-free reactive adhesive of the present invention is a two-component curing type urethane-based solventless adhesive obtained by blending the above-mentioned polyisocyanate and polyol, and the blending ratio of the polyol and polyisocyanate is the total isocyanate group contained in the isocyanate and the polyol. The molar equivalent ratio of all hydroxyl groups [NCO/OH] is preferably in the range of 0.8 to 2.5, more preferably in the range of 1.0 to 2.0.
또한, 질량 비율의 경우는, 폴리올의 전체 질량에 대한 폴리이소시아네이트의 비율은, 바람직하게는 20~100질량%이다.In the case of mass ratio, the ratio of polyisocyanate to the total mass of polyol is preferably 20 to 100% by mass.
본 발명의 무용제형 반응성 접착제에 있어서의 폴리이소시아네이트의 함유율은, 폴리올의 합계 질량을 기준으로 해서, 합계로, 바람직하게는 20∼100질량%의 범위이다. 상기 범위 내이면, 얻어지는 경화막의 도막 강도, 유연성, 내열성이 보다 우수하기 때문에 바람직하다.The content of the polyisocyanate in the non-solvent type reactive adhesive of the present invention is preferably in the range of 20 to 100% by mass in total based on the total mass of the polyol. If it is within the above range, it is preferable because the coating film strength, flexibility, and heat resistance of the cured film obtained are more excellent.
본 발명의 무용제형 반응성 접착제의 점도는, 상온 25℃에 있어서, 바람직하게는 10~1,000Pa·s이고, 보다 바람직하게는 50~750Pa·s이다.The viscosity of the non-solvent type reactive adhesive of the present invention is preferably 10 to 1,000 Pa·s, more preferably 50 to 750 Pa·s at room temperature of 25°C.
점도가 10Pa·s 이상이면 접착제의 초기 응집력이 우수하기 때문에 바람직하다. 점도가 1,000Pa·s 이하이면 도공성이 우수하기 때문에 바람직하다.If the viscosity is 10 Pa·s or more, the initial cohesive force of the adhesive is excellent, so it is preferable. A viscosity of 1,000 Pa·s or less is preferable because coatability is excellent.
[그 외 성분][Other Ingredients]
본 발명의 무용제형 반응성 접착제는, 또한, 반응 촉진제, 실란 커플링제, 인산 또는 인산 유도체, 레벨링제 또는 소포제, 충전제, 분사제, 가소제, 초가소제, 습윤제, 난연제, 점도 조정제, 보존제, 안정제 및 착색제 등의 공지된 첨가제를 포함할 수 있다. 이러한 첨가제는, 1종을 단독으로 사용해도 되고, 2종 이상을 조합하여 사용해도 된다.The solvent-free reactive adhesive of the present invention also contains a reaction accelerator, a silane coupling agent, phosphoric acid or a phosphoric acid derivative, a leveling agent or antifoaming agent, a filler, a propellant, a plasticizer, a superplasticizer, a wetting agent, a flame retardant, a viscosity modifier, a preservative, a stabilizer and a colorant Such known additives may be included. These additives may be used individually by 1 type, and may be used in combination of 2 or more type.
반응 촉진제로서는, 예를 들면, 디부틸틴 디아세테이트, 디부틸틴 디라우레이트, 디옥틸틴 디라우레이트, 디부틸틴 디말레이트 등의 금속계 촉매; 1,8-디아자-비시클로(5,4,0)운데센-7,1,5-디아자비시클로(4,3,0)노넨-5,6-디부틸아미노-1,8-디아자비시클로(5,4,0)운데센-7 등의 3급 아민; 트리에탄올아민 등의 반응성 3급 아민을 들 수 있다.Examples of the reaction promoter include metal catalysts such as dibutyltin diacetate, dibutyltin dilaurate, dioctyltin dilaurate, and dibutyltin dimaleate; 1,8-diaza-bicyclo(5,4,0)undecene-7,1,5-diazabicyclo(4,3,0)nonene-5,6-dibutylamino-1,8-dia tertiary amines such as zabicyclo (5,4,0) undecene-7; and reactive tertiary amines such as triethanolamine.
반응 촉진제의 배합량은, 폴리이소시아네이트의 합계 질량을 기준으로 하여, 바람직하게는 0.005∼5질량%이다.The compounding amount of the reaction accelerator is preferably 0.005 to 5% by mass based on the total mass of the polyisocyanate.
실란 커플링제로서는, 예를 들면, 비닐트리메톡시실란, 비닐트리에톡시실란 등의 비닐기를 갖는 트리알콕시실란, 3-아미노프로필트리에톡시실란, N-(2-아미노에틸)3-아미노프로필트리메톡시실란 등의 아미노기를 갖는 트리알콕시실란; 3-글리시독시프로필트리메톡시실란, 2-(3,4-에폭시시클로헥실)에틸트리메톡시실란, 3-글리시독시프로필트리에톡시실란 등의 글리시딜기를 갖는 트리알콕시실란; 3-이소시아네이트프로필트리에톡시실란 등의 이소시아나토기를 갖는 트리알콕시실란; 3-메르캅토프로필메틸디메톡시실란, 3-메르캅토프로필트리메톡시실란 등의 메르캅토기를 갖는 트리알콕시실란을 들 수 있다.Examples of the silane coupling agent include trialkoxysilane having a vinyl group such as vinyltrimethoxysilane and vinyltriethoxysilane, 3-aminopropyltriethoxysilane, and N-(2-aminoethyl)3-aminopropyl. trialkoxysilanes having amino groups such as trimethoxysilane; trialkoxysilanes having glycidyl groups such as 3-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and 3-glycidoxypropyltriethoxysilane; trialkoxysilanes having an isocyanato group such as 3-isocyanate propyltriethoxysilane; Trialkoxysilane which has a mercapto group, such as 3-mercaptopropyl methyl dimethoxysilane and 3-mercapto propyl trimethoxysilane, is mentioned.
실란 커플링제의 배합량은, 폴리이소시아네이트의 합계 질량을 기준으로서 바람직하게는 0.05~10질량%이다.The compounding amount of the silane coupling agent is preferably 0.05 to 10% by mass based on the total mass of polyisocyanates.
인산 또는 인산 유도체 중, 인산으로서는, 유리(遊離)의 산소산을 적어도 1개 가지고 있는 것이면 되고, 예를 들면, 차아인산, 아인산, 오르토인산, 차인산 등의 인산류; 메타인산, 피로인산, 트리폴리인산, 폴리인산, 울트라인산 등의 축합 인산류를 들 수 있다. 또한, 인산 유도체로서는, 상술한 인산을 유리의 산소산을 적어도 1개 남긴 상태에서 알코올류와 부분적으로 에스테르화된 것 등을 들 수 있다. 이들 알코올로서는, 메탄올, 에탄올, 에틸렌글리콜, 글리세린 등의 지방족 알코올; 페놀, 자일레놀, 하이드로퀴논, 카테콜, 플로로글리시놀 등의 방향족 알코올을 들 수 있다.Among phosphoric acid or phosphoric acid derivatives, the phosphoric acid may be one having at least one free oxygen acid, and examples thereof include phosphoric acids such as hypophosphorous acid, phosphorous acid, orthophosphoric acid, and hypophosphorous acid; and condensed phosphoric acids such as metaphosphoric acid, pyrophosphoric acid, tripolyphosphoric acid, polyphosphoric acid, and ultraphosphoric acid. Moreover, as a phosphoric acid derivative, what the above-mentioned phosphoric acid was partially esterified with alcohol in the state which left at least one free oxygen acid, etc. are mentioned. Examples of these alcohols include aliphatic alcohols such as methanol, ethanol, ethylene glycol, and glycerin; and aromatic alcohols such as phenol, xylenol, hydroquinone, catechol, and phloroglycinol.
인산 및 그 유도체의 배합량은, 폴리이소시아네이트의 합계 질량을 기준으로 하여, 합계로, 바람직하게는 0.005∼5질량%이다.The compounding amount of phosphoric acid and its derivatives is preferably 0.005 to 5% by mass in total based on the total mass of polyisocyanates.
레벨링제로서는, 예를 들면, 폴리에테르 변성 폴리디메틸실록산, 폴리에스테르 변성 폴리디메틸실록산, 아랄킬 변성 폴리메틸알킬실록산, 폴리에스테르 변성 수산기 함유 폴리디메틸실록산, 폴리에테르에스테르 변성 수산기 함유 폴리디메틸실록산, 아크릴계 공중합물, 메타크릴계 공중합물, 폴리에테르 변성 폴리메틸알킬실록산, 아크릴산알킬에스테르 공중합물, 메타크릴산알킬에스테르 공중합물, 레시틴을 들 수 있다.Examples of the leveling agent include polyether-modified polydimethylsiloxane, polyester-modified polydimethylsiloxane, aralkyl-modified polymethylalkylsiloxane, polyester-modified hydroxyl group-containing polydimethylsiloxane, polyether ester-modified hydroxyl group-containing polydimethylsiloxane, and acrylic type. copolymers, methacrylic copolymers, polyether-modified polymethylalkylsiloxanes, acrylic acid alkyl ester copolymers, methacrylic acid alkyl ester copolymers, and lecithin.
소포제로서는, 실리콘 수지, 실리콘 용액, 알킬비닐에테르와 아크릴산 알킬 에스테르와 메타크릴산 알킬 에스테르와의 공중합물 등, 공지의 것을 들 수 있다.Examples of the antifoaming agent include known ones such as silicone resins, silicone solutions, and copolymers of alkyl vinyl ethers, alkyl acrylate esters, and alkyl methacrylates.
<적층체, 경화물><Laminate, cured product>
본 발명의 경화물은, 본 발명의 무용제형 반응성 접착제를 경화시킨 것이며, 상기 폴리이소시아네이트, 폴리올 및 필요에 따라서 그 밖의 성분을 공지의 방법으로 혼합하여 우레탄 가교 반응을 진행함으로써 얻을 수 있다.The cured product of the present invention is obtained by curing the non-solvent type reactive adhesive of the present invention, and can be obtained by mixing the polyisocyanate, polyol, and other components as necessary by a known method and conducting a urethane crosslinking reaction.
또한, 본 발명의 적층체는, 기재 상에 상기 경화물로 이루어지는 접착층을 갖는 것이다. 적층체의 제조 방법은 특별히 제한되지 않고, 예를 들면, 무용제형 반응성 접착제를 기재의 한쪽 면에 도포하고, 이어서, 미경화의 접착제면에 다른 기재를 겹쳐서, 20∼150℃ 정도로 가열 처리를 행하고, 무용제형 반응성 접착제를 경화시킴으로써, 적층체를 얻을 수 있다. 경화 후의 접착층의 두께는, 바람직하게는 0.1㎛~300mm이다.Further, the laminate of the present invention has an adhesive layer made of the above cured material on a substrate. The method for producing the laminate is not particularly limited. For example, a non-solvent type reactive adhesive is applied to one side of a substrate, then another substrate is overlaid on the uncured adhesive side, and heat treatment is performed at about 20 to 150° C. , A laminate can be obtained by curing the non-solvent type reactive adhesive. The thickness of the adhesive layer after curing is preferably 0.1 μm to 300 mm.
본 발명의 무용제형 반응성 접착제는, 다종의 기재간의 접착에 사용할 수 있다. 적합한 기재로서는, 예를 들면 알루미늄 등의 금속, 폴리에틸렌, 폴리프로필렌, 폴리우레탄, 폴리아크릴레이트 및 폴리카보네이트 및 이들의 코폴리머 등의 열가소성 폴리머, 가황 고무 등의 열경화성 폴리머, 요소-포름알데히드폼, 멜라민 수지, 목재, 탄소 섬유 강화 플라스틱, 유리 섬유 강화 플라스틱 및 기타 섬유 강화 플라스틱을 들 수 있고, 접착층을 통해서 접착되는 기재는 동일해도 되고 상이해도 된다.The solvent-free reactive adhesive of the present invention can be used for bonding between multiple substrates. Suitable substrates include, for example, metals such as aluminum, thermoplastic polymers such as polyethylene, polypropylene, polyurethane, polyacrylates and polycarbonates and copolymers thereof, thermosetting polymers such as vulcanized rubber, urea-formaldehyde foam, and melamine. resin, wood, carbon fiber reinforced plastics, glass fiber reinforced plastics and other fiber reinforced plastics, and the substrates to be bonded through the adhesive layer may be the same or different.
본 발명의 무용제형 반응성 접착제는, 우수한 도막 강도, 유연성, 내열성, 내유성, 접착력, 및 적당한 택트 타임을 갖고 있고, 당해 접착제를 사용한 적층체는, 자동차, 건축 자재, 선박, 항공기 등의 수송 기기의 구조 부재(패널부품, 골격부품, 서스팬션 부품 등)로서 유용하다.The non-solvent type reactive adhesive of the present invention has excellent coating film strength, flexibility, heat resistance, oil resistance, adhesive strength and appropriate tact time, and a laminate using the adhesive can be used for transportation equipment such as automobiles, building materials, ships, and aircraft. It is useful as a structural member (panel parts, skeleton parts, suspension parts, etc.).
실시 예embodiment
이하, 실시 예에 의해 본 발명을 더욱 구체적으로 설명하는데, 이하의 실시예는 본 발명의 권리 범위를 전혀 제한하는 것은 아니다. 또한, 특별히 언급하지 않는 한, 실시 예에 있어서의 「부」는 「질량부」를 나타낸다.Hereinafter, the present invention will be described in more detail by examples, but the following examples do not limit the scope of the present invention at all. In addition, unless otherwise indicated, "parts" in Examples represent "parts by mass".
[중량 평균 분자량(Mw)][Weight Average Molecular Weight (Mw)]
수지의 중량 평균 분자량(Mw)은, GPC(겔 투과 크로마토그래피)에 의해, 표준 폴리스티렌에 의한 환산값으로서 구하였다. 측정은, GPC 장치로서 GPC-8020(제품명, 도소사 제조), 용리액으로서 테트라히드로푸란, 컬럼으로서 TSKgelSuperHM-M(상품명, 도소사 제조)를 3개 직렬로 연결하여, 유속 0.6ml/분, 주입량 10㎕, 컬럼 온도 40℃의 조건에서 행하였다.The weight average molecular weight (Mw) of the resin was determined as a value converted to standard polystyrene by gel permeation chromatography (GPC). The measurement was performed by connecting three GPC-8020 (trade name, manufactured by Tosoh Corporation) as a GPC device, tetrahydrofuran as an eluent, and TSKgelSuperHM-M (trade name, manufactured by Tosoh Corporation) as a column in series, and a flow rate of 0.6 ml/min and an injection amount. It was carried out under conditions of 10 μl and a column temperature of 40°C.
본 명세서에서의 화합물의 약칭을 이하에 나타낸다.The abbreviated name of the compound in this specification is shown below.
<폴리이소시아네이트><Polyisocyanate>
·TDI-TMP 어덕트:톨릴렌 디이소시아네이트의 트리메틸올프로판 어덕트체, 상품명「타케네이트 D103H」, 초산에틸 용액(고형분 농도 75질량%), 미츠이카가쿠사 제조를, 감압 하에서 초산에틸을 제거한 것TDI-TMP adduct: trimethylolpropane adduct of tolylene diisocyanate, trade name "Takenate D103H", ethyl acetate solution (solid content concentration: 75% by mass), manufactured by Mitsui Chemicals Co., Ltd., obtained by removing ethyl acetate under reduced pressure
·HDI:헥사메틸렌디이소시아네이트HDI: hexamethylene diisocyanate
·MDI:2,4'- 및 4,4'-디페닐메탄 디이소시아네이트의 혼합물, 상품명「루프라네이트 MI」, BASF INOAC 폴리우레탄사 제조MDI: mixture of 2,4'- and 4,4'-diphenylmethane diisocyanate, trade name "Lupranate MI", manufactured by BASF INOAC Polyurethanes
·카르보디이미드 변성 MDI:상품명「루프라네이트 MM103」, BASF INOAC 폴리우레탄사 제조・Carbodiimide-modified MDI: Trade name “Lupranate MM103”, manufactured by BASF INOAC Polyurethane Co., Ltd.
·폴리메릭 MDI:폴리메틸렌폴리페닐폴리이소시아네이트, 상품명「루프라네이트 M5S」, BASF INOAC 폴리우레탄사 제조・Polymeric MDI: Polymethylene polyphenyl polyisocyanate, trade name “Lupranate M5S”, manufactured by BASF INOAC Polyurethane Co., Ltd.
<폴리올><Polyol>
·T5651: 2관능 폴리카보네이트 폴리올, 수평균 분자량 1,000, 수산기가 110mgKOH/g, 상품명「듀라놀 T5651」, 아사히카세이사 제조T5651: bifunctional polycarbonate polyol, number average molecular weight 1,000, hydroxyl value 110 mgKOH/g, trade name "Duranol T5651", manufactured by Asahi Kasei Co., Ltd.
·T5650E: 2관능 폴리카보네이트 폴리올, 수평균 분자량 500, 수산기가 220mgKOH/g, 상품명「듀라놀 T5650E」, 아사히카세이사 제조T5650E: bifunctional polycarbonate polyol, number average molecular weight 500, hydroxyl value 220 mgKOH/g, trade name "Duranol T5650E", manufactured by Asahi Kasei Co., Ltd.
·P-1000: 2관능 폴리프로필렌글리콜, 수평균 분자량 1,000, 수산기가 56.1mgKOH/g, 아데카사 제조P-1000: bifunctional polypropylene glycol, number average molecular weight 1,000, hydroxyl value 56.1 mgKOH/g, manufactured by Adeka
·P-400: 2관능 폴리프로필렌글리콜, 수평균 분자량 400, 수산기가 280mgKOH/g, 아데카사 제조P-400: bifunctional polypropylene glycol, number average molecular weight 400, hydroxyl value 280 mgKOH/g, manufactured by Adeka
·PTMG-1000SN: 2관능 폴리테트라메틸렌에테르글리콜, 수평균 분자량 1,000, 수산기가 112mgKOH/g, 호도가야카가쿠코교사 제조PTMG-1000SN: bifunctional polytetramethylene ether glycol, number average molecular weight 1,000, hydroxyl value 112mgKOH/g, manufactured by Hodogaya Chemical Co., Ltd.
·GI-1000: 수소 첨가 폴리부타디엔디올, 수평균 분자량 1,400, 수산기가 75mgKOH/g, 니혼소다사 제조GI-1000: hydrogenated polybutadiene diol, number average molecular weight 1,400, hydroxyl value 75 mgKOH/g, manufactured by Nippon Soda Co., Ltd.
·URIC HF2009: 2관능 해바라기유 폴리올, 수평균 분자량 2,640, 수산기가 41.5mgKOH/g, 이토세이유사 제조・URIC HF2009: bifunctional sunflower oil polyol, number average molecular weight 2,640, hydroxyl value 41.5 mgKOH/g, manufactured by Itoseiyu Co., Ltd.
·NS-2400: 2관능 폴리에스테르 폴리올, 수평균 분자량 2000, 수산기가 56mgKOH/g, 상품명「아데카뉴에이스 NS-2400」, 아데카사 제조NS-2400: bifunctional polyester polyol, number average molecular weight 2000, hydroxyl value 56 mgKOH/g, trade name "Adeca New Ace NS-2400", manufactured by Adeka
<저분자 폴리올><Low Molecular Polyol>
·1,3-프로판디올(분자량: 76.1)1,3-propanediol (molecular weight: 76.1)
<폴리이소시아네이트의 제조 예><Production example of polyisocyanate>
[디페닐메탄 디이소시아네이트의 트리메틸올프로판 어덕트체(MDI-TMP 어덕트)의 제조][Preparation of trimethylolpropane adduct of diphenylmethane diisocyanate (MDI-TMP adduct)]
질소 가스 도입관, 교반 장치, 온도계, 환류기를 구비한 반응 용기에, MDI를 100.0부, 트리메틸올프로판을 10.0부, 초산에틸을 30.0부 투입, 균일하게 교반한 후, 질소 분위기하 90℃에서 3시간 반응시키고, 계속해서 감압하에서 초산에틸을 모두 제거하고, 공지의 박막 증류법을 이용하여 미반응의 MDI를 제거함으로써, 디페닐메탄 디이소시아네이트의 트리메틸올프로판 어덕트체(MDI-TMP 어덕트)를 얻었다. 얻어진 MDI-TMP 어덕트의 중량 평균 분자량은 900이었다.100.0 parts of MDI, 10.0 parts of trimethylolpropane, and 30.0 parts of ethyl acetate were added to a reaction vessel equipped with a nitrogen gas inlet pipe, a stirrer, a thermometer, and a reflux device, and after uniform stirring, the mixture was stirred at 3°C under a nitrogen atmosphere. The trimethylolpropane adduct (MDI-TMP adduct) of diphenylmethane diisocyanate was obtained by reacting for a period of time, then removing all ethyl acetate under reduced pressure, and removing unreacted MDI using a known thin film distillation method. Got it. The weight average molecular weight of the obtained MDI-TMP adduct was 900.
[폴리이소시아네이트 A의 제조][Preparation of Polyisocyanate A]
질소 가스 도입관, 교반 장치, 온도계, 환류기를 구비한 반응 용기에, PTMG-1000SN을 100부, MDI를 150부 투입, 질소 분위기하 80℃에서 4시간 반응시켜서, 방향족 폴리이소시아네이트 A를 얻었다.100 parts of PTMG-1000SN and 150 parts of MDI were added to a reaction vessel equipped with a nitrogen gas inlet pipe, a stirrer, a thermometer, and a reflux machine, and the mixture was reacted under a nitrogen atmosphere at 80° C. for 4 hours to obtain aromatic polyisocyanate A.
<우레탄 결합을 갖는 폴리올 B의 제조 예><Production example of polyol B having a urethane bond>
[폴리올 B1의 제조][Preparation of Polyol B1]
질소 가스 도입관, 교반 장치, 온도계, 환류기를 구비한 반응 용기에, T5651을 100.0부, 이소포론디이소시아네이트를 19.9부, 촉매로서 디부틸주석 디라우레이트 0.02부를 투입하여 균일하게 교반한 후, 질소 분위기하 100℃에서 5시간 반응시켜서, 우레탄 결합을 갖는 폴리올 B1을 얻었다. 얻어진 폴리올 B1의 중량 평균 분자량은 15,000이었다.100.0 parts of T5651, 19.9 parts of isophorone diisocyanate, and 0.02 part of dibutyltin dilaurate as a catalyst were added to a reaction vessel equipped with a nitrogen gas inlet pipe, a stirrer, a thermometer, and a reflux device, and uniform stirring was performed. It was made to react at 100 degreeC for 5 hours in an atmosphere, and the polyol B1 which has a urethane bond was obtained. The weight average molecular weight of the obtained polyol B1 was 15,000.
[폴리올 B2의 제조][Preparation of polyol B2]
질소 가스 도입관, 교반 장치, 온도계, 환류기를 구비한 반응 용기에, T5651을 100.0부, MDI 21.3부를 넣고, 균일하게 교반한 후, 질소 분위기하 100℃에서 5시간 반응시켜서, 우레탄 결합을 갖는 폴리올 B2를 얻었다. 얻어진 폴리올 B2의 중량 평균 분자량은 11,000이었다.100.0 parts of T5651 and 21.3 parts of MDI were placed in a reaction vessel equipped with a nitrogen gas inlet pipe, a stirrer, a thermometer, and a reflux device, and after stirring uniformly, the reaction was performed at 100° C. for 5 hours under a nitrogen atmosphere to obtain a polyol having a urethane bond. Got B2. The weight average molecular weight of the obtained polyol B2 was 11,000.
[폴리올 B3의 제조][Preparation of Polyol B3]
질소 가스 도입관, 교반 장치, 온도계, 환류기를 구비한 반응 용기에, P-1000을 50.0부, PTMG-1000SN을 50.0부, 이소포론디이소시아네이트를 19.9부, 촉매로서 디부틸주석 디라우레이트 0.02부를 투입하고, 균일하게 교반한 후, 질소 분위기하 100℃에서 5시간 반응시켜서, 우레탄 결합을 갖는 폴리올 B3을 얻었다. 얻어진 폴리올 B3의 중량 평균 분자량은 15,000이었다.To a reaction vessel equipped with a nitrogen gas inlet pipe, a stirrer, a thermometer, and a reflux machine, 50.0 parts of P-1000, 50.0 parts of PTMG-1000SN, 19.9 parts of isophorone diisocyanate, and 0.02 part of dibutyltin dilaurate as a catalyst. After throwing in and stirring uniformly, it was made to react at 100 degreeC for 5 hours in nitrogen atmosphere, and polyol B3 which has a urethane bond was obtained. The weight average molecular weight of the obtained polyol B3 was 15,000.
[폴리올 B4의 제조][Preparation of polyol B4]
질소 가스 도입관, 교반 장치, 온도계, 환류기를 구비한 반응 용기에, GI-1000을 50.0부, PTMG-1000SN을 50.0부, 이소포론디이소시아네이트를 16.2부, 촉매로서 디부틸주석 디라우레이트 0.02부를 투입하고, 균일하게 교반한 후, 질소 분위기하 100℃에서 5시간 반응시켜서, 우레탄 결합을 갖는 폴리올 B4를 얻었다. 얻어진 폴리올 B4의 중량 평균 분자량은 15,000이었다.Into a reaction vessel equipped with a nitrogen gas inlet tube, a stirrer, a thermometer and a reflux machine, 50.0 parts of GI-1000, 50.0 parts of PTMG-1000SN, 16.2 parts of isophorone diisocyanate, and 0.02 part of dibutyltin dilaurate as a catalyst were added. After throwing in and stirring uniformly, it was made to react at 100 degreeC for 5 hours in nitrogen atmosphere, and polyol B4 which has a urethane bond was obtained. The weight average molecular weight of the obtained polyol B4 was 15,000.
[폴리올 B5의 제조][Preparation of polyol B5]
질소 가스 도입관, 교반 장치, 온도계, 환류기를 구비한 반응 용기에, URIC HF2009를 50.0부, PTMG-1000SN을 50.0부, 이소포론디이소시아네이트를 12.5부, 촉매로서 디부틸주석 디라우레이트 0.02부를 투입하고, 균일하게 교반한 후, 질소 분위기하 100℃에서 5시간 반응시켜서, 우레탄 결합을 갖는 폴리올 B5를 얻었다. 얻어진 폴리올 B5의 중량 평균 분자량은 15,000이었다.50.0 parts of URIC HF2009, 50.0 parts of PTMG-1000SN, 12.5 parts of isophorone diisocyanate, and 0.02 part of dibutyltin dilaurate as a catalyst were added to a reaction vessel equipped with a nitrogen gas inlet pipe, a stirrer, a thermometer, and a reflux machine. After uniform stirring, the mixture was reacted at 100°C for 5 hours under a nitrogen atmosphere to obtain polyol B5 having a urethane bond. The weight average molecular weight of obtained polyol B5 was 15,000.
[폴리올 B6의 제조][Preparation of polyol B6]
질소 가스 도입관, 교반 장치, 온도계, 환류기를 구비한 반응 용기에, P-1000을 50.0부, NS-2400을 50.0부, 이소포론디이소시아네이트를 14.2부, 촉매로서 디부틸주석 디라우레이트 0.02부를 투입하고, 균일하게 교반한 후, 질소 분위기하 100℃에서 5시간 반응시켜서, 우레탄 결합을 갖는 폴리올 B6을 얻었다. 얻어진 폴리올 B6의 중량 평균 분자량은 15,000이었다.To a reaction vessel equipped with a nitrogen gas inlet pipe, a stirrer, a thermometer, and a reflux machine, 50.0 parts of P-1000, 50.0 parts of NS-2400, 14.2 parts of isophorone diisocyanate, and 0.02 part of dibutyltin dilaurate as a catalyst. After throwing in and stirring uniformly, it was made to react at 100 degreeC for 5 hours in nitrogen atmosphere, and polyol B6 which has a urethane bond was obtained. The weight average molecular weight of the obtained polyol B6 was 15,000.
<접착제의 조제><Preparation of adhesive>
[실시 예 1][Example 1]
TDI-TMP 어덕트 40.0부와, MDI 60.0부를 100℃에서 교반 탈포(脫泡) 혼합하여 폴리이소시아네이트를 얻었다. 별도로, 우레탄 결합을 갖는 폴리올 B1 83.3부에, T5651을 194.4부 첨가하고, 100℃에서 교반 탈포 혼합하여 폴리올을 얻었다. 이어서, 얻어진 폴리이소시아네이트 및 폴리올을 실온(25℃)에서 혼합하여 무용제형의 접착제를 조제하였다.40.0 parts of TDI-TMP adduct and 60.0 parts of MDI were stirred and degassed and mixed at 100°C to obtain polyisocyanate. Separately, 194.4 parts of T5651 was added to 83.3 parts of polyol B1 having a urethane bond, and stirring and defoaming mixing were carried out at 100°C to obtain a polyol. Subsequently, the obtained polyisocyanate and polyol were mixed at room temperature (25°C) to prepare a solvent-free adhesive.
[실시 예 2~48, 참고 예 1~2, 및 비교 예 1~12][Examples 2 to 48, Reference Examples 1 to 2, and Comparative Examples 1 to 12]
표 1~4에 나타내는 배합 조성으로 변경한 것 이외에는, 실시 예 1과 같은 조작을 행하여, 실시 예 2~48, 참고 예 1~2, 및 비교예 1~12의 접착제를 조제했다.Except having changed to the compounding composition shown in Tables 1-4, the same operation as Example 1 was performed, and the adhesives of Examples 2-48, Reference Examples 1-2, and Comparative Examples 1-12 were prepared.
<접착제의 평가><Evaluation of adhesive>
실시 예 및 비교 예에서 조제한 접착제에 대해서, 이하의 평가를 행하였다. 판정 결과는 표1~4에 기재하였다. 또한, 비교 예 3, 4, 11 및 12는, 폴리이소시아네이트의 점도가 높고, 폴리올과의 혼합이 곤란하며, 무용제형의 접착제로서 사용할 수 없었기 때문에, 이후의 평가를 실시하지 않았다 .The adhesives prepared in Examples and Comparative Examples were evaluated as follows. The judgment result was described in Tables 1-4. In Comparative Examples 3, 4, 11, and 12, polyisocyanate has a high viscosity, and mixing with polyol is difficult, and since it cannot be used as a solvent-free adhesive, subsequent evaluation was not performed.
[전단 접착력][Shear adhesion]
각 접착제를, 스테인리스 기재(길이 100mm, 폭 25mm, 두께 2mm) 상에, 폭 25mm, 길이 10mm, 두께 0.1mm가 되도록 도포하고, 탄소 섬유 강화 플라스틱 기판(길이 100mm, 폭 25mm, 두께 2mm)과 붙여 맞춰서, 두께 0.1mm를 유지하도록 압착한 상태에서 80℃ 1일간 양생시켜서, 시험편을 얻었다. 얻어진 시험편을 온도 25℃, 상대 습도 50%의 조건 하, 인장 속도 1mm/분으로 인장 시험기를 사용하여 전단 접착 강도를 측정하고, 이하의 평가 기준으로 판정하였다.Each adhesive is applied on a stainless substrate (length 100 mm, width 25 mm, thickness 2 mm) to a width of 25 mm, length 10 mm, and thickness 0.1 mm, and it is attached to a carbon fiber reinforced plastic substrate (length 100 mm, width 25 mm, thickness 2 mm). Together, it was cured at 80°C for 1 day in a state where it was crimped so as to maintain a thickness of 0.1 mm, and a test piece was obtained. The shear adhesive strength of the obtained test piece was measured using a tensile tester at a tensile speed of 1 mm/min under conditions of a temperature of 25°C and a relative humidity of 50%, and the following evaluation criteria were used.
(평가 기준)(Evaluation standard)
A: 전단 접착력이, 7MPa 이상(양호)A: Shear adhesion, 7 MPa or more (good)
B: 전단 접착력이, 5MPa 이상, 7MPa 미만(사용 가능)B: Shear adhesion, 5 MPa or more, less than 7 MPa (available)
C: 전단 접착력이, 5MPa 미만(사용 불가)C: shear adhesion, less than 5 MPa (cannot be used)
[파단 응력·파단 신장도][Breaking stress/breaking elongation]
두께 2mm의 시트형상 형틀에 각 접착제를 충전하고, 표면을 정돈해서, 80℃ 1일간 양생한 후, 3호 덤벨형으로 타발하여, 평가용의 덤벨형 시험편을 제작했다. 이 덤벨편(片)을 이용하여, 인장 속도 50mm/분으로 인장 시험을 행하고, 파단 응력(MPa)과 파단 신장도(%)를 측정하여, 이하의 기준으로 판정하였다.Each adhesive was filled in a sheet-shaped mold with a thickness of 2 mm, the surface was prepared, and after curing at 80 ° C. for 1 day, it was punched out in a No. 3 dumbbell shape to produce a dumbbell-shaped test piece for evaluation. Using this dumbbell piece, a tensile test was performed at a tensile speed of 50 mm/min, the breaking stress (MPa) and the breaking elongation (%) were measured, and determined according to the following criteria.
(파단 응력의 평가 기준)(Evaluation criteria for breaking stress)
A: 파단 응력이, 25MPa 이상(양호)A: Breaking stress is 25 MPa or more (good)
B: 파단 응력이, 20MPa 이상, 25MPa 미만(사용 가능)B: Breaking stress of 20 MPa or more and less than 25 MPa (can be used)
C: 파단 응력이, 20MPa 미만(사용 불가)C: Breaking stress is less than 20 MPa (cannot be used)
(파단 신장도의 평가 기준)(Evaluation criteria for elongation at break)
A: 파단 신장도가, 250% 이상(양호)A: Elongation at break is 250% or more (good)
B: 파단 신장도가, 200% 이상, 250% 미만(사용 가능)B: Elongation at break, 200% or more, less than 250% (available)
C: 파단 신장도가, 200% 미만(사용 불가)C: elongation at break, less than 200% (cannot be used)
[100℃ 내열성][100℃ heat resistance]
상기 [파단 응력·파단 신장도]와 동일하게 해서, 덤벨형 시험편을 제작하였다. 이 덤벨편을 100℃의 환경하에서 500시간 가열 처리한 후, 상기 [파단 응력·파단 신장도]와 마찬가지로 인장 시험을 행하여, 파단 응력(MPa)과 파단 신장도(%)를 측정했다. 시험 전후의 시험편에 대해서 변화율을 산출하고, 이하의 기준으로 판정하였다.Dumbbell-shaped test pieces were produced in the same manner as the above [breaking stress/breaking elongation]. After heat treatment of this dumbbell piece in an environment of 100 ° C. for 500 hours, a tensile test was performed in the same manner as in the above [breaking stress and elongation at break], and the breaking stress (MPa) and breaking elongation (%) were measured. The rate of change was calculated for the test piece before and after the test, and determined according to the following criteria.
(파단 응력의 변화율의 평가 기준)(Evaluation Criteria for Change Rate of Breaking Stress)
A: 변화율이, 30% 미만(양호)A: Change rate is less than 30% (good)
B: 변화율이, 30% 이상, 50% 미만(사용 가능)B: The change rate is greater than or equal to 30% and less than 50% (available)
C: 변화율이, 50% 이상(사용 불가)C: Change rate is 50% or more (unusable)
(파단 신장도의 변화율의 평가 기준)(Evaluation criteria for rate of change in elongation at break)
A: 변화율이, 30% 미만(양호)A: Change rate is less than 30% (good)
B: 변화율이, 30% 이상, 50% 미만(사용 가능)B: The change rate is greater than or equal to 30% and less than 50% (available)
C: 변화율이, 50% 이상(사용 불가)C: Change rate is 50% or more (unusable)
[100℃ 내유성][100℃ oil resistance]
상기 [파단 응력·파단 신장도]와 동일하게 해서, 덤벨형 시험편을 제작하였다. 이 덤벨편을 100℃의 오토마 오일에 100시간 침지한 후, 상기 [파단 응력·파단 신장도]와 마찬가지로 인장 시험을 행하여, 파단 응력(MPa)과 파단 신장도(%)를 측정했다. 시험 전후의 시험편에 대하여 변화율을 산출하고, 이하의 기준으로 판정하였다.Dumbbell-shaped test pieces were produced in the same manner as the above [breaking stress/breaking elongation]. After immersing this dumbbell piece in Automa oil at 100 ° C. for 100 hours, a tensile test was performed in the same manner as in the above [breaking stress and elongation at break], and the breaking stress (MPa) and breaking elongation (%) were measured. The rate of change was calculated for the test piece before and after the test, and judged according to the following criteria.
(파단 응력의 변화율의 평가 기준)(Evaluation Criteria for Change Rate of Breaking Stress)
A: 변화율이, 30% 미만(양호)A: Change rate is less than 30% (good)
B: 변화율이, 30% 이상, 50% 미만(사용 가능)B: The change rate is greater than or equal to 30% and less than 50% (available)
C: 변화율이, 50% 이상(사용 불가)C: Change rate is 50% or more (unusable)
(파단 신장도의 변화율의 평가 기준)(Evaluation criteria for rate of change in elongation at break)
A: 변화율이, 30% 미만(양호)A: Change rate is less than 30% (good)
B: 변화율이, 30% 이상, 50% 미만(사용 가능)B: The change rate is greater than or equal to 30% and less than 50% (available)
C: 변화율이, 50% 이상(사용 불가)C: Change rate is 50% or more (unusable)
[발포성][Effervescence]
상기 [파단 응력·파단 신장도]와 동일하게 해서, 덤벨형 시험편을 제작하고, 시험편의 표면 및 내부에서의 발포의 유무를 육안으로 관찰하고, 이하의 기준으로 판정하였다.Dumbbell-shaped test pieces were prepared in the same manner as the above [breaking stress/breaking elongation], and the presence or absence of foaming on the surface and inside of the test piece was visually observed, and judged according to the following criteria.
A: 발포가 관측되지 않는다(양호)A: Foaming is not observed (good)
B: 발포가 1~2개 관측된다(사용 가능)B: 1 or 2 bubbles are observed (usable)
C: 발포가 3개 이상 관측된다(사용 불가)C: 3 or more bubbles are observed (unusable)
[가사 시간][household time]
폴리이소시아네이트와 폴리올을 혼합한 후, 유동성이 현저하게 손실될 때까지의 시간을 관측하고, 이하의 기준으로 판정하였다.After mixing the polyisocyanate and the polyol, the time until the fluidity was remarkably lost was observed and judged according to the following criteria.
A: 가사 시간이, 15분 이상(양호)A: Pot life is 15 minutes or more (good)
B: 가사 시간이, 10분 이상, 15분 미만(사용 가능)B: Pot life is more than 10 minutes and less than 15 minutes (can be used)
C: 가사 시간이, 10분 미만(사용 불가)C: pot life, less than 10 minutes (unusable)
[파단 신장도 저하의 평가 기준][Evaluation Criteria for Decreasing Elongation at Break]
폴리이소시아네이트와 폴리올의 배합비만 다른 실시 예들(예를 들면 실시 예 1과 실시 예 2)에 대해서, 파단 신장도의 평가 결과를 비교하고, 이하의 기준으로 판정하였다.For Examples (for example, Example 1 and Example 2) differing only in the compounding ratio of polyisocyanate and polyol, the evaluation results of elongation at break were compared and determined according to the following criteria.
A: 파단 신장도의 평가 결과가 동일하다(양호)A: The evaluation results of the elongation at break are the same (good)
C: 파단 신장도의 평가 결과가 다르다(사용 불가)C: The evaluation results of the elongation at break are different (cannot be used)
[표 1][Table 1]
[표 2][Table 2]
[표 3][Table 3]
[표 4][Table 4]
본 발명의 무용제형 반응성 접착제는, 접착 강도가 양호하고, 우수한 도막 강도(파단 응력)와 유연성(파단 신장도)를 나타내고, 내열 시험 및 내유 시험 후에도, 우수한 파단 응력과 파단 신장도를 유지하였다. 그리고 또한, 본 발명의 접착제는, 주제와 경화제의 혼합 비율이 변동한 경우에 있어서도, 파단 신장도가 변화하지 않고 안정적이었다. 또한, 본 발명의 접착제는, 발포가 억제되고, 적당한 택트 타임을 발휘하여 가사 시간도 양호했다.The solvent-free reactive adhesive of the present invention has good adhesive strength, exhibits excellent coating strength (breaking stress) and flexibility (breaking elongation), and maintains excellent breaking stress and breaking elongation even after a heat resistance test and an oil resistance test. Further, the adhesive of the present invention was stable with no change in elongation at break even when the mixing ratio of the main agent and the curing agent was varied. Further, the adhesive of the present invention suppressed foaming, exhibited an appropriate tact time, and exhibited good pot life.
한편, 비교 예의 접착제는, 주제와 경화제의 혼합 비율이 변동한 경우에, 파단 신장도가 변화하여, 불안정했다. 또한, 비교예의 접착제는, 파단 응력과 유연성을 양립할 수 없어, 내열성 및 내유성이 불량하였다.On the other hand, in the case of the adhesive of Comparative Example, when the mixing ratio of the base material and the curing agent fluctuated, the elongation at break changed and was unstable. In addition, the adhesives of the comparative examples were unable to achieve both breaking stress and flexibility, and were poor in heat resistance and oil resistance.
이 출원은, 2020년 11월 20일에 출원된 일본 특허출원 제2020-193766호, 2021년 6월 25일에 출원된 일본 특허출원 제2021-105556호 및 2021년 11월 9일에 출원된 일본 특허출원 제2021-182699호를 기초로 하는 우선권을 주장하고, 이들 개시의 전부를 여기에 포함한다.This application relates to Japanese Patent Application No. 2020-193766 filed on November 20, 2020, Japanese Patent Application No. 2021-105556 filed on June 25, 2021, and Japanese Patent Application No. 2021-105556 filed on November 9, 2021. Priority is claimed on the basis of Patent Application No. 2021-182699, the entire disclosure of which is incorporated herein.
Claims (9)
상기 폴리이소시아네이트의 합계 질량을 기준으로 하여, 상기 톨릴렌 디이소시아네이트의 트리메틸올프로판 어덕트체 및 상기 디페닐메탄 디이소시아네이트의 트리메틸올프로판 어덕트체를, 합계로 40∼80질량%의 범위로 포함하는, 무용제형 반응성 접착제.
A polyisocyanate containing a trimethylolpropane adduct of at least one isocyanate of tolylene diisocyanate and diphenylmethane diisocyanate, an aromatic polyisocyanate excluding the trimethylolpropane adduct, and a solvent-free type containing a polyol It is a reactive adhesive,
Based on the total mass of the polyisocyanate, the trimethylolpropane adduct of the tolylene diisocyanate and the trimethylolpropane adduct of the diphenylmethane diisocyanate are included in the range of 40 to 80% by mass in total , solvent-free reactive adhesive.
상기 방향족 폴리이소시아네이트가, 디페닐메탄 디이소시아네이트, 폴리메틸렌 폴리페닐 폴리이소시아네이트, 및 카르보디이미드 변성 디페닐메탄 디이소시아네이트로 이루어진 군에서 선택되는 적어도 1종을 포함하는, 무용제형 반응성 접착제.
According to claim 1,
The solvent-free reactive adhesive, wherein the aromatic polyisocyanate contains at least one selected from the group consisting of diphenylmethane diisocyanate, polymethylene polyphenyl polyisocyanate, and carbodiimide-modified diphenylmethane diisocyanate.
상기 폴리이소시아네이트의 합계 질량을 기준으로 하여, 상기 방향족 폴리이소시아네이트를, 합계로 20~60질량%의 범위로 포함하는, 무용제형 반응성 접착제.
According to claim 1 or 2,
A non-solvent type reactive adhesive comprising the aromatic polyisocyanate in a range of 20 to 60% by mass in total based on the total mass of the polyisocyanate.
상기 폴리이소시아네이트의 합계 질량을 기준으로 하여, 상기 톨릴렌 디이소시아네이트의 트리메틸올프로판 어덕트체 및 상기 디페닐메탄 디이소시아네이트의 트리메틸올프로판 어덕트체를, 합계로 45∼75질량%의 범위로 포함하는, 무용제형 반응성 접착제.
According to any one of claims 1 to 3,
Based on the total mass of the polyisocyanate, the trimethylolpropane adduct of the tolylene diisocyanate and the trimethylolpropane adduct of the diphenylmethane diisocyanate are included in the range of 45 to 75% by mass in total , solvent-free reactive adhesive.
상기 폴리올이, 우레탄 결합을 갖지 않는 폴리카보네이트 폴리올을 포함하는, 무용제형 반응성 접착제.
According to any one of claims 1 to 4,
A non-solvent type reactive adhesive in which the polyol comprises a polycarbonate polyol having no urethane bond.
상기 폴리올이, 우레탄 결합을 갖는 폴리올을 포함하는, 무용제형 반응성 접착제.
According to any one of claims 1 to 5,
A non-solvent type reactive adhesive wherein the polyol contains a polyol having a urethane bond.
상기 폴리올의 합계 질량을 기준으로 하여, 상기 우레탄 결합을 갖는 폴리올을, 합계로 30∼70질량%의 범위로 포함하는, 무용제형 반응성 접착제.
According to claim 6,
A non-solvent type reactive adhesive containing the polyol having the urethane bond in a range of 30 to 70% by mass in total based on the total mass of the polyol.
A cured product of the non-solvent type reactive adhesive according to any one of claims 1 to 7.
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JPJP-P-2021-105556 | 2021-06-25 | ||
JP2021105556 | 2021-06-25 | ||
JPJP-P-2021-182699 | 2021-11-09 | ||
JP2021182699A JP2022082441A (en) | 2020-11-20 | 2021-11-09 | Solvent-free reactive adhesives, cured products thereof, and laminates |
PCT/JP2021/042602 WO2022107881A1 (en) | 2020-11-20 | 2021-11-19 | Solvent-free reactive adhesive agent, cured product thereof, and laminate |
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WO2007025007A1 (en) | 2005-08-24 | 2007-03-01 | Henkel Kommanditgesellschaft Auf Aktien | Epoxy compositions having improved impact resistance |
JP2015182248A (en) | 2014-03-20 | 2015-10-22 | 株式会社カネカ | Laminate in which different kinds of members are bonded with curable resin composition |
JP2017218539A (en) | 2016-06-09 | 2017-12-14 | 横浜ゴム株式会社 | Two-pack curable urethane adhesive composition |
JP2018506635A (en) | 2014-12-22 | 2018-03-08 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA | Epoxy resin composition |
JP2020055923A (en) | 2018-09-28 | 2020-04-09 | 横浜ゴム株式会社 | Two-part curable adhesive composition |
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JP4385553B2 (en) * | 2000-09-11 | 2009-12-16 | 凸版印刷株式会社 | Adhesive for dry or non-solvent lamination and laminated packaging material and packaging bag using the same |
JP5075327B2 (en) * | 2004-07-23 | 2012-11-21 | 東洋モートン株式会社 | Solventless adhesive composition and laminate using the same |
JP5561657B2 (en) * | 2011-01-13 | 2014-07-30 | 日本ポリウレタン工業株式会社 | Solvent-free polyurethane resin-forming adhesive composition for fibrous base material, laminate using the adhesive composition, and method for producing laminate |
JP2016098323A (en) * | 2014-11-21 | 2016-05-30 | Dic株式会社 | Adhesive and multilayer film having the adhesive |
JP6090522B1 (en) * | 2016-03-29 | 2017-03-08 | 東洋インキScホールディングス株式会社 | Laminated body and manufacturing method thereof |
KR102400693B1 (en) * | 2017-12-22 | 2022-05-20 | 미쓰이 가가쿠 가부시키가이샤 | block isocyanate |
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2021
- 2021-11-19 WO PCT/JP2021/042602 patent/WO2022107881A1/en active Application Filing
- 2021-11-19 KR KR1020237013855A patent/KR20230107548A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2007025007A1 (en) | 2005-08-24 | 2007-03-01 | Henkel Kommanditgesellschaft Auf Aktien | Epoxy compositions having improved impact resistance |
JP2015182248A (en) | 2014-03-20 | 2015-10-22 | 株式会社カネカ | Laminate in which different kinds of members are bonded with curable resin composition |
JP2018506635A (en) | 2014-12-22 | 2018-03-08 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA | Epoxy resin composition |
JP2017218539A (en) | 2016-06-09 | 2017-12-14 | 横浜ゴム株式会社 | Two-pack curable urethane adhesive composition |
JP2020055923A (en) | 2018-09-28 | 2020-04-09 | 横浜ゴム株式会社 | Two-part curable adhesive composition |
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