KR20230019757A - Test Handler for Electronic Component - Google Patents

Abstract

The present invention includes a loading unit performing a loading process of loading an electronic component to be tested into a test tray; an unloading unit performing an unloading process of unloading the tested electronic component from the tray; At the upper test site, a test process of connecting the electronic components stored in the test tray to the test equipment is performed, and at the lower test site disposed below the upper test site, the electronic components stored in the test tray are connected to the test equipment. a test unit that performs a test process; a first chamber unit transferring the test tray on which the loading process has been performed to the test unit; a second chamber unit transferring the test tray on which the test process is performed to the unloading unit; a rotating unit that rotates the test tray so that the test tray is switched between a horizontal state and a vertical state; and a change unit for changing the order between a first test tray accommodating a first electronic component belonging to a first lot and a second test tray accommodating a second electronic component belonging to a second lot. will be.

Description

Electronic component test handler {Test Handler for Electronic Component}

The present invention relates to an electronic component test handler for testing and classifying electronic components.

Memory semiconductor devices, non-memory semiconductor devices, central processing units (CPUs), and the like (hereinafter referred to as 'electronic components') are manufactured through various processes. For example, electronic components go through various processes, such as classification by grade through a test process through handler equipment such as a test handler.

The test handler performs a loading process, a test process, and an unloading process for electronic components. The loading process is a process in which a test handler loads an electronic component from a user tray to a test tray. The test process is a process in which the test handler connects the electronic component accommodated in the test tray to the test equipment. The test equipment performs a predetermined test on an electronic component. The unloading process is a process in which the test handler unloads the electronic component from the test tray to the customer tray. In this case, the test handler classifies electronic components into grades according to test results.

The electronic component test handler according to the prior art performed the loading process, the test process, and the unloading process by classifying each lot (Lot) of the electronic component. For example, the electronic component test handler according to the prior art completes the loading process, the testing process, and the unloading process for the electronic components belonging to the first lot, and then to the electronic components belonging to the second lot. The loading process, the testing process, and the unloading process were started.

Accordingly, the electronic component test handler according to the prior art did not perform the loading process when performing the test process on the last electronic components among the electronic components belonging to the first lot, and the electronic component belonging to the first lot When the unloading process is performed on the last electronic parts among the components, the loading process and the test process are not performed. In addition, the electronic component test handler according to the prior art completes the loading process, the testing process, and the unloading process for the electronic components belonging to the first lot, and then the electronic component belonging to the second lot. When the loading process was performed for the first time, the test process and the unloading process were not performed.

As such, conventionally, since the loading process, the test process, and the unloading process are divided by lot (LOT), idle processes occur in the process of changing lots, there is a problem in that the overall efficiency is lowered.

The present invention has been made to solve the above problems, and is to provide an electronic component test handler capable of reducing an idle process occurring in a process of changing a lot.

In order to solve the problems as described above, the present invention may include the following configuration.

An electronic component test handler according to the present invention includes a loading unit performing a loading process of loading an electronic component to be tested into a test tray; an unloading unit performing an unloading process of unloading the tested electronic component from the tray; At the upper test site, a test process of connecting the electronic components stored in the test tray to the test equipment is performed, and at the lower test site disposed below the upper test site, the electronic components stored in the test tray are connected to the test equipment. a test unit that performs a test process; a first chamber unit transferring the test tray on which the loading process has been performed to the test unit; a second chamber unit transferring the test tray on which the test process is performed to the unloading unit; a rotating unit that rotates the test tray so that the test tray is switched between a horizontal state and a vertical state; and a change unit configured to change an order between a first test tray accommodating first electronic components belonging to the first lot and a second test tray accommodating second electronic components belonging to the second lot.

In the electronic component test handler according to the present invention, the changing unit may change the order in which the unloading process is performed on the first test tray and the second test tray in the unloading unit.

In the electronic component test handler according to the present invention, the loading unit performs a loading process of loading the first electronic component on the first test tray and then a loading process of loading the second electronic component on the second test tray. can be performed. The first chamber unit may transfer the first test tray to the upper test site and transfer the second test tray to the lower test site. The second chamber unit may first transport the second test tray to the rotate unit and then transport the first test tray to the rotate unit. The rotate unit may first transfer the second test tray to the unloading position of the unloading unit, and then transfer the first test tray to the unloading position. The change unit may transfer the second test tray so that the order in which the unloading process is performed is changed between the second test tray first transferred to the unloading position and the first test tray transferred later to the unloading position. The unloading unit may perform an unloading process of unloading the first electronic component from the first test tray and then an unloading process of unloading the second electronic component from the second test tray. .

The electronic component test handler according to the present invention may include a transfer unit for transferring the test tray on which the unloading process has been performed from an unloading position of the unloading unit to a loading position of the loading unit. The loading unit may perform a loading process of loading the first electronic component on the first test tray and then a loading process of loading the second electronic component on the second test tray. The changing unit and the transfer unit transfer the second test tray transferred to the unloading position to the avoiding position, and the loading position after the first test tray is transferred to the unloading position and the unloading process is performed. When transferred to , the second test tray can be transferred from the avoidance position to the unloading position.

In the electronic component test handler according to the present invention, the unloading unit may include an unloading buffer that moves between the loading position and the unloading position. The avoiding position may be disposed above the return path for transferring the test tray where the unloading process is performed to the loading position, and may be disposed below the unloading buffer.

In the electronic component test handler according to the present invention, an avoidance groove may be formed on at least one lower surface of the unloading buffer and the buffer frame in which the unloading buffer is installed.

In the electronic component test handler according to the present invention, the transfer unit includes an unloading lifting unit that lifts and lowers the test tray between an unloading standby position disposed below the unloading position and the unloading position; a transfer unit that transfers the test tray between the unloading standby position and the loading standby position disposed below the loading position; and a loading lifting unit that lifts and lowers the test tray between the loading standby position and the loading position.

In the electronic component test handler according to the present invention, the transfer unit may transfer the second test tray between the unloading standby position and the avoidance standby position disposed below the avoidance position. The change unit may include an avoidance lift unit that lifts and lowers the second test tray between the avoidance stand-by position and the avoidance position.

In the electronic component test handler according to the present invention, the change unit stops the second test tray, which is transported from the unloading standby position toward the loading standby position by the transfer unit, at the avoidance standby position disposed below the avoidance position. Avoidance stopper to do; and an avoidance lift unit that lifts and lowers the second test tray between the avoidance stand-by position and the avoidance position.

In the electronic component test handler according to the present invention, the change unit may include an avoidance detection sensor for detecting the test tray located at the avoidance position. The transfer unit may transfer the first test tray from the unloading standby position to the loading standby position after the avoidance detection sensor detects the test tray.

In the electronic component test handler according to the present invention, the change unit may include a standby detection sensor for detecting a test tray located at the avoidance standby position. The avoidance lifting unit may move the second test tray up and down between the avoidance standby position and the avoidance position by using the avoidance detection information acquired by the avoidance detection sensor and the standby detection information obtained by the standby detection sensor. The transfer unit may transfer the second test tray between the avoidance standby position and the unloading standby position by using the avoidance detection information and the standby detection information.

According to the present invention, the following effects can be achieved.

The present invention can reduce the idle process that occurs in the process of changing a lot (LOT), and after the unloading process in which all the first electronic parts belonging to the first lot are unloaded to the customer tray is completed, belonging to the second lot An unloading process in which the second electronic component is unloaded to the customer tray may be implemented to start. Accordingly, the present invention can increase the throughput of the process of classifying the electronic parts for which the test process has been completed by grade, and improve the accuracy of classifying the tested electronic parts by lot and storing them in customer trays.

1 is a schematic block diagram of an electronic component test handler according to the present invention;
2 is a schematic plan view of an electronic component test handler according to the present invention;
3 is a schematic perspective view showing a circulation path of a test tray in an electronic component test handler according to the present invention;
4 is a conceptual plan view showing the order in which a first test tray and a second test tray are unloaded from a loading unit in an electronic component test handler according to the present invention;
5A to 5E are conceptual front views showing a state in which a first test tray and a second test tray are transferred between a first chamber unit, a test unit, and a second chamber unit in the electronic component test handler according to the present invention;
6 is a conceptual plan view showing the order in which a first test tray and a second test tray are loaded into an unloading unit in an electronic component test handler according to the present invention;
7A to 7C are conceptual front views illustrating a process of changing the order between a first test tray and a second test tray in the electronic component test handler according to the present invention;
9 is a schematic block diagram of a change unit and a transfer unit in an electronic component test handler according to the present invention.
9 is a schematic plan view of a loading unit, an unloading unit, and a changing unit in the electronic component test handler according to the present invention.
10 is a schematic side cross-sectional view taken along line II of FIG. 8 in the electronic component test handler according to the present invention.

Hereinafter, an embodiment of an electronic component test handler according to the present invention will be described in detail with reference to the accompanying drawings. 3, reference numerals corresponding to locations or devices according to processes performed on the test tray are marked on the test tray.

1 to 3, the electronic component test handler 1 according to the present invention tests electronic components such as a memory semiconductor device, a non-memory semiconductor device, and a CPU (Central Processing Unit), and classifies them according to test results. for classification. The electronic component test handler 1 according to the present invention performs a loading process, a test process, and an unloading process for electronic components. The loading process is to load electronic components from a user tray to a test tray (100). The test process is to connect the electronic components accommodated in the test tray 100 to the test equipment 200. The unloading process is to unload electronic components from the test tray 100 to the customer tray. The unloading process may be performed by classifying electronic components according to grades according to test results in the test process and unloading them to customer trays.

The electronic component test handler 1 according to the present invention includes a loading unit 2, an unloading unit 3, a test unit 4, a first chamber unit 5, a second chamber unit 6, and a rotate unit. (7) may be included.

<loading part>

1 to 3, the loading unit 2 performs the loading process. The loading unit 2 may perform the loading process by loading the electronic component to be tested onto the test tray 100 . The loading unit 2 may load an electronic component to be tested on the test tray 100 located at the loading position 20 . The loading unit 2 may perform the loading process on the test tray 100 arranged in a horizontal state.

The loading unit 2 may include a loading stacker 21 , a loading picker 22 , and a loading buffer 23 .

The loading stacker 21 stores a customer tray containing electronic components to be tested. A plurality of electronic components may be contained in the customer tray. A plurality of customer trays may be stored in the loading stacker 21 .

The loading picker 22 picks up electronic components to be tested from the customer tray located on the loading stacker 21 and puts them in the test tray 100 located at the loading position 20 . The loading picker 22 can pick up a plurality of electronic components at once. The loading picker 22 may be moved along the first axial direction (X-axis direction) and the second axial direction (Y-axis direction). The first axial direction (X-axis direction) and the second axial direction (Y-axis direction) are axial directions orthogonal to each other. The loading picker 22 may be moved up and down in a vertical direction (Z-axis direction). The vertical direction (Z-axis direction) is an axis direction perpendicular to each of the first axial direction (X-axis direction) and the second axial direction (Y-axis direction). A plurality of electronic components may be accommodated in the test tray 100 .

The loading buffer 23 temporarily stores electronic components to be tested. The loading picker 22 includes a first loading picker (not shown) that transfers an electronic component to be tested from a customer tray located in the loading stacker 21 to the loading buffer 23, and an electronic component to be tested. A second loading picker (not shown) may be included to transfer from the loading buffer 23 to the test tray 100 . The loading buffer 23 may be moved along the second axis direction (Y axis direction).

<Unloading part>

1 to 3, the unloading unit 3 performs the unloading process. The unloading unit 3 may perform the unloading process by unloading the tested electronic component from the test tray 100 . The unloading unit 3 may unload the tested electronic component from the test tray 100 located at the unloading position 30 . The unloading unit 3 may perform the unloading process on the test tray 100 arranged in a horizontal state. The unloading unit 3 and the loading unit 2 may be spaced apart from each other along the first axial direction (X-axis direction).

The unloading unit 3 may include an unloading stacker 31, an unloading picker 32, and an unloading buffer 33.

The unloading stacker 31 stores customer trays containing tested electronic components. A plurality of customer trays may be stored in the unloading stacker 31 . The tested electronic components may be placed in customer trays located in different positions according to grades in the unloading stacker 31 according to the test results.

The unloading picker 32 picks up the tested electronic components from the test tray 100 located at the unloading position 30 and puts them in the customer tray located at the unloading stacker 31. The unloading picker 32 can pick up a plurality of electronic components at once. The unloading picker 32 may be moved along the first axial direction (X-axis direction) and the second axial direction (Y-axis direction). The unloading picker 32 may move up and down along the vertical direction (Z-axis direction).

The unloading buffer 33 temporarily accommodates the tested electronic component. The unloading picker 32 includes a first unloading picker (not shown) that transfers the tested electronic component from the test tray 100 to the unloading buffer 33, and the tested electronic component to the unloading buffer ( 33) may include a second unloading picker (not shown) that transfers to the customer tray located in the unloading stacker 31. The unloading buffer 33 may be moved along the second axis direction (Y axis direction).

<Test part>

Referring to FIGS. 1 to 3 , the test unit 4 performs the test process. The test unit 4 may perform the test process by connecting the electronic components accommodated in the test tray 100 to the test equipment 200 . A Hi-fix board of the test equipment 200 may be coupled to the test unit 4 . The test unit 4 may include a contact unit (not shown) that connects electronic components stored in the test tray 100 to the high-fix board. The contact unit may connect a plurality of electronic components to the high-fix board at once. The test unit 4 may perform the test process on the test tray 100 arranged in a vertical state. The test unit 4 may be implemented as a chamber.

The test unit 4 may include an upper test site 41 and a lower test site 42 .

At the upper test site 41, a test process of connecting electronic components stored in the test tray 100 to the test equipment 200 may be performed. Based on the vertical direction (Z-axis direction), the upper test site 41 may be disposed above the lower test site 42 .

At the lower test site 42 , a test process of connecting electronic components accommodated in the test tray 100 to the test equipment 200 may be performed. In this case, at the upper test site 41 and the lower test site 42 , a test process for the electronic components housed in the separate test trays 100 may be performed. The high fix board and the contact unit may be installed on each of the upper test site 41 and the lower test site 42 . The contact units installed on each of the upper test site 41 and the lower test site 42 may operate integrally. In this case, the test process at the lower test site 42 and the test process at the upper test site 41 may be performed in parallel.

<First chamber unit>

Referring to FIGS. 1 to 3 , the first chamber unit 5 transfers the test tray 100 on which the loading process has been performed to the test unit 4 . Based on the second axial direction (Y-axis direction), the first chamber part 5 may be disposed on the rear side (direction of arrow BD) with respect to the loading part 2 . The first chamber unit 5 can adjust the temperature of the electronic components stored in the test tray 100 to the test temperature while transporting the test tray 100 backward (in the direction of the BD arrow). The test temperature may be preset by an operator. When the test temperature is higher than the room temperature, the first chamber unit 5 may adjust the temperature of the electronic components accommodated in the test tray 100 to the test temperature through heating. When the test temperature is lower than the room temperature, the first chamber unit 5 may adjust the temperature of the electronic component accommodated in the test tray 100 to the test temperature through cooling. The first chamber unit 5 includes a first transport unit (not shown) for transporting the test tray 100 and a first temperature control unit (not shown) for controlling the temperature of electronic components stored in the test tray 100. not shown) may be included.

The first chamber part 5 and the test part 4 may be arranged side by side along the first axial direction (X-axis direction). In this case, the test unit 4 may be disposed between the first chamber unit 5 and the second chamber unit 6 based on the first axial direction (X-axis direction). The first chamber unit 5 can adjust the temperature of the electronic components accommodated in the test tray 100 while transferring the test tray 100 arranged in a vertical state. The first chamber unit 5 may be implemented as a chamber.

The first chamber unit 5 may supply the test tray 100 to each of the upper test site 41 and the lower test site 42 . To this end, the first chamber unit 5 may include a first lifting unit (not shown) for raising the test tray 100 to a height corresponding to the upper test site 41 . The first chamber unit 5 may include a first supply unit (not shown) for pushing the test tray 100 and supplying the test tray 100 to the test unit 4 .

The first chamber unit 5 may include a first carry-in position 51 and a first take-out position 52 .

The first loading position 51 is a position where the test tray 100 is loaded from the outside of the first chamber part 5 to the inside of the first chamber part 5 . In this case, the test tray 100 may be carried into the first chamber part 5 by being transferred from the rotate part 7 to the first loading position 51 .

The first delivery position 52 is a position at which the test tray 100 is delivered from the inside of the first chamber unit 5 to the outside of the first chamber unit 5 . In this case, the test tray 100 may be transported from the first delivery position 52 to the test unit 4 and transported from the inside of the first chamber unit 5 . When the test part 4 includes the upper test site 41 and the lower test site 42, the first carry-out position 52 includes the first lower carry-out position 521 and the first upper carry-out position 521. location 522 . The first lower carrying position 521 may be disposed below the first upper carrying position 522 . The first chamber unit 5 can sequentially transport the test tray 100 located at the first carrying-in position 51 backward (in the direction of the BD arrow) and position it at the first lower carrying-out position 521. there is. The test tray 100 may be transported from the first lower delivery position 521 to the first upper delivery position 522 and then transported from the first upper delivery position 522 to the upper test site 41. there is. After the test tray 100 is raised from the first lower carrying position 521 to the first upper carrying position 522, the test tray 100 transferred to the first lower carrying position 521 is 1 It can be carried out to the lower test site 42 from the lower delivery position 521. The first lower carrying position 521 may be spaced apart from the first carrying position 51 towards the rear (direction of arrow BD).

<Second chamber part>

Referring to FIGS. 1 to 3 , the second chamber unit 6 transfers the test tray 100 on which the test process has been performed to the unloading unit 3 . Based on the second axial direction (Y-axis direction), the second chamber unit 6 may be disposed on the rear side (direction of arrow BD) with respect to the unloading unit 3 . The second chamber unit 6 can adjust the temperature of electronic components stored in the test tray 100 to room temperature while transferring the test tray 100 forward (in the direction of the FD arrow). When the test temperature is higher than the room temperature, the second chamber unit 6 may adjust the temperature of the electronic component accommodated in the test tray 100 to room temperature through cooling. When the test temperature is lower than the room temperature, the second chamber unit 6 can adjust the temperature of the electronic components accommodated in the test tray 100 to room temperature through heating. The second chamber unit 6 includes a second transport unit (not shown) for transporting the test tray 100, and a second temperature control unit (not shown) for controlling the temperature of electronic components stored in the test tray 100. not shown) may be included. The second chamber unit 6 can adjust the temperature of the electronic components accommodated in the test tray 100 while transferring the test tray 100 arranged in a vertical state. The second chamber unit 6 may be implemented as a chamber.

The second chamber unit 6 may receive the test tray 100 from each of the upper test site 41 and the lower test site 42 . To this end, the second chamber unit 6 may include a first lowering unit (not shown) for lowering the test tray 100 supplied from the upper test site 41 . The second chamber unit 6 may include a second supply unit (not shown) for pulling and bringing the test tray 100 from the test unit 4 .

The second chamber unit 6 may include a second carrying position 61 and a second carrying position 61 .

The second loading position 61 is a position where the test tray 100 is loaded from the outside of the second chamber part 6 to the inside of the second chamber part 6 . In this case, the test tray 100 can be carried into the second chamber unit 6 by being transported from the test unit 4 to the second loading position 61 . When the test unit 4 includes the upper test site 41 and the lower test site 42, the second carrying position 61 includes a second lower carrying position 611 and a second upper carrying position 611. location 612 . The second lower carrying position 611 may be disposed below the second upper carrying position 612 . The second chamber unit 6 can sequentially transport the test tray 100 located at the second lower carrying position 611 forward (in the direction of the FD arrow) and place it at the second carrying position 62. there is. In this case, as the test tray 100 transferred from the lower test site 42 to the second lower loading position 611 is transported forward (in the direction of the FD arrow), the second lower loading position 611 becomes empty. In this case, the test tray 100 transferred from the upper test site 41 to the second upper loading position 612 is lowered to the second lower loading position 611 and then transported forward (in the direction of the FD arrow). can

The second delivery position 62 is a position at which the test tray 100 is delivered from the inside of the second chamber unit 6 to the outside of the second chamber unit 6 . In this case, the test tray 100 may be transported from the second delivery position 62 to the rotate unit 7 and transported from the inside of the second chamber unit 6 . The second carry-in position 62 may be disposed forward (in the direction of the FD arrow) from the second lower carry-in position 611 .

<rotate section>

Referring to FIGS. 1 to 3 , the rotate unit 7 rotates the test tray 100 . The rotate unit 7 can rotate the test tray 100 to switch the test tray 100 between a horizontal state and a vertical state. By the rotate unit 7, the loading process and the unloading process can be performed in a state where the test tray 100 is arranged in a horizontal state. By means of the rotate unit 7, the test process can be performed in a state where the test tray 100 is vertically arranged. A process of adjusting the temperature of electronic components while transferring the test tray 100 in a vertical state is performed in each of the first chamber unit 5 and the second chamber unit 6 by the rotate unit 7. can

The rotating unit 7 may include a loading rotator 71 and an unloading rotator 72 .

The loading rotator 71 rotates the test tray 100 in a horizontal state and converts it to a vertical state. After receiving the test tray 100 in a horizontal state from the loading unit 2, the loading rotator 71 rotates the test tray 100 to convert it into a vertical state. After that, the loading rotator 71 may supply the test tray 100 in a vertical state to the first chamber unit 5 . In this case, the test tray 100 in a vertical state may be transported from the loading rotator 71 to the first loading position 51. The loading rotator 71 may be disposed between the loading part 2 and the first chamber part 5. The loading rotator 71 may be disposed on the rear side (in the direction of the BD arrow) with respect to the loading unit 2 and disposed above the first chamber unit 5 .

The unloading rotator 72 rotates the vertical test tray 100 to convert it to a horizontal state. After receiving the test tray 100 in a vertical state from the second chamber unit 6, the unloading rotator 72 rotates the test tray 100 to convert it to a horizontal state. In this case, the test tray 100 in a vertical state is transferred from the second delivery position 62 to the unloading rotator 72, and then rotated by the unloading rotator 72 to be converted to a horizontal state. there is. After that, the unloading rotator 72 may supply the test tray 100 in a horizontal state to the unloading unit 3 . The unloading rotator 72 may be disposed between the unloading part 3 and the second chamber part 6. The unloading rotator 72 may be disposed at the rear (direction of arrow BD) with respect to the unloading unit 3 and at the upper side of the second chamber unit 6 . Based on the first axial direction (X-axis direction), the unloading rotator 72 and the loading rotator 71 may be spaced apart from each other.

Although not shown, the rotating unit 7 may rotate the test tray 100 using a single rotator to switch between a vertical state and a horizontal state. In this case, the rotator may rotate the test tray 100 transported from the loading unit 2 to convert it from a horizontal state to a vertical state, and then supply the test tray 100 to the first chamber unit 5 . The rotator may rotate the test tray 100 transported from the second chamber unit 6 to convert it from a vertical state to a horizontal state, and then supply the test tray 100 to the unloading unit 3.

Here, as shown in FIGS. 4 to 7C, the electronic component test handler 1 according to the present invention includes a first test tray 101 containing a first electronic component belonging to a first lot and a second electronic component belonging to a second lot. It may be implemented to perform the loading process, the test process, and the unloading process with respect to the second test tray 102 in which 2 electronic components are accommodated. For example, while the loading process, the testing process, and the unloading process are performed by storing the last electronic parts among the electronic parts belonging to the first lot in the first test tray 101, the second lot The belonging electronic components may be accommodated in the second test tray 102 to perform the loading process, the testing process, and the unloading process.

Accordingly, the electronic component test handler 1 according to the present invention can reduce idle processes occurring in the process of changing a lot (LOT). Therefore, the electronic component test handler 1 according to the present invention can increase the throughput of the process of classifying the electronic component for which the test process has been completed by grade, and improve the overall efficiency.

On the other hand, in the first test tray 101, the second test tray 102, the first electronic component, and the second electronic component, "first" and "second" are used to distinguish a lot It became. In addition, in FIGS. 4 to 7C , hatching of different shapes is displayed on the first test tray 101 and the second test tray 102, which is to classify the lot. The first test tray 101 and the second test tray 102 may be implemented as the same test tray, and the first electronic component and the second electronic component may be implemented as the same electronic component.

In this way, when the loading process, the test process, and the unloading process are performed in parallel for the first test tray 101 and the second test tray 102, the electronic component test handler according to the present invention ( 1) can operate as follows.

First, as shown in FIG. 4, the loading unit 2 performs a loading process of loading the first electronic component on the first test tray 101, and then the second test tray 102. A loading process of loading the second electronic component may be performed. Accordingly, after the first test tray 101 is first taken out of the loading unit 2 and supplied to the first chamber unit 5 via the loading rotator 71, the second test tray 102 ) may be carried out from the loading unit 2 and supplied to the first chamber unit 5 via the loading rotator 71 . In this case, the first test tray 101 and the second test tray 102 may be sequentially supplied to the first loading position 51 of the first chamber unit 5 .

Next, since the first test tray 101 is first brought into the first chamber unit 5 and then the second test tray 102 is brought in, the first chamber unit 5 is The first test tray 101 and the second test tray 102 are rearward (direction of arrow BD) with the tray 101 disposed further rearward (direction of arrow BD) than the second test tray 102 can be transferred to Accordingly, as shown in FIG. 5A , the first test tray 101 may first reach the first lower delivery position 521 and then be elevated to the first upper delivery position 522 . After that, as shown in FIG. 5B , the second test tray 102 may reach the first lower carrying position 521 .

Next, as shown in FIGS. 5B and 5C, the first test tray 101 is transported from the first upper delivery position 522 of the first chamber unit 5 to the upper test site 41, , the second test tray 102 can be transported from the first lower delivery position 521 of the first chamber unit 5 to the lower test site 42 . Thereafter, a test process may be performed on the first electronic component stored in the first test tray 101 and the second electronic component stored in the second test tray 102 .

Next, as shown in FIGS. 5C and 5D, the first test tray 101 is transferred from the upper test site 41 to the second upper loading position 612 of the second chamber unit 6, , The second test tray 102 can be transferred from the lower test site 42 to the second lower loading position 611 of the second chamber unit 6 .

Next, the second chamber unit 6 first transfers the second test tray 102 located at the second lower loading position 611 forward (in the direction of the FD arrow), as shown in FIG. 5E. Likewise, the first test tray 101 located at the second upper loading position 612 may be lowered to the second lower loading position 611 . After that, the second chamber part 6 is placed on the second test tray 102 in a state where the second test tray 102 is disposed more forward (in the direction of the FD arrow) than the first test tray 101. and the first test tray 101 can be transferred forward (in the direction of the FD arrow). Accordingly, since the second test tray 102 reaches the second delivery position 62 of the second chamber unit 6 before the first test tray 101, the second chamber unit 6 ), the second test tray 102 is first unloaded, and then the first test tray 101 is unloaded.

Next, after the second test tray 102 is first positioned at the unloading position 30 via the unloading rotator 72, the first test tray 101 passes through the unloading rotator 72 Since it is located at the unloading position 30, as shown in FIG. 6, the unloading unit 3 performs an unloading process of unloading the second electronic component from the second test tray 102. Afterwards, an unloading process of unloading the first electronic component from the first test tray 101 is performed.

Accordingly, in a state in which the unloading process for the first electronic component stored in the first test tray 101 is not completed, the unloading process for the second electronic component stored in the second test tray 102 is performed. Therefore, there is a concern that the first electronic component belonging to the first lot and the second electronic component belonging to the second lot are mixed in the customer tray located in the unloading stacker 31.

To prevent this, the electronic component test handler 1 according to the present invention may include a change unit 8. The electronic component test handler 1 according to the present invention performs a loading process in which the loading unit 2 loads the first electronic component to the first test tray 101 using the change unit 8 Even if the loading process of loading the second electronic component to the second test tray 102 is performed continuously after After performing an unloading process of unloading the second electronic component from the second test tray 102 , an unloading process of unloading the second electronic component may be performed.

Therefore, the electronic component test handler 1 according to the present invention can reduce the idle process occurring in the process of changing a lot (LOT), while all the first electronic components belonging to the first lot are unloading stacker ( 31), after the process of storing the second electronic component in the customer tray located in the unloading stacker 31 is completed, the process of storing the second electronic component belonging to the second lot in the customer tray located in the unloading stacker 31 may start. . Accordingly, the electronic component test handler 1 according to the present invention can increase the throughput of the process of classifying the electronic components for which the test process has been completed by grade, while classifying the tested electronic components by lot and storing them in the customer tray accuracy can be improved.

1 to 7C, the change unit 8 accommodates the first test tray 101 containing the first electronic component belonging to the first lot and the second electronic component belonging to the second lot. This is to change the order between the second test trays 102. Accordingly, the change unit 8 performs an unloading process in which the unloading unit 3 unloads the first electronic component from the first test tray 101, and then the second test tray 102 ) to perform an unloading process of unloading the second electronic component.

The changing unit 8 may be implemented to change the order in which the unloading process is performed for the first test tray 101 and the second test tray 102 in the unloading unit 3 . The change unit 8 operates in conjunction with the transfer unit 9 to change the order in which the unloading process is performed for the first test tray 101 and the second test tray 102 . The transfer unit 9 transfers the test tray 100 where the unloading process has been performed from the unloading position 30 of the unloading unit 3 to the loading position 20 of the loading unit 2 . The transfer unit 9 can transfer the test tray 100 by pushing or pulling it. The transfer unit 9 may push and transfer the test tray 100 or pull and transfer the test tray 100 according to the transfer direction of the test tray 100 . The changing unit 8 and the transfer unit 9 may change the order in which the unloading process is performed for the first test tray 101 and the second test tray 102 by operating as follows.

First, as shown in FIG. 7A, when the second test tray 102 is located at the unloading position 30, the change unit 8 and the transfer unit 9 move the second test tray 102 It can be transferred from the unloading position 30 to the avoiding position 80. In this case, in the process of transferring the second test tray 102 along the return path 91 after the transfer unit 9 lowers the second test tray 102 from the unloading position 30 to the unloading standby position 30a, the The change unit 8 may transfer the second test tray 102 to the avoidance position 80 by raising the second test tray 102 from the return path 91 . The return path 91 may be disposed below the unloading buffer 33 . The avoidance position 80 may be disposed above the return path 91 and below the unloading buffer 33 . That is, based on the vertical direction (Z-axis direction), the avoidance position 80 may be disposed between the return path 91 and the unloading buffer 33 . The unloading waiting position 30a may be disposed below the unloading position 30, and the loading waiting position 20a may be disposed below the loading position 20. An avoidance standby position 80a may be disposed below the avoidance position 80 . Based on the first axial direction (X-axis direction), the avoidance waiting position 80a may be disposed between the unloading waiting position 30a and the loading waiting position 20a. In this case, after the transfer unit 9 lowers the second test tray 102 from the unloading position 30 to the unloading waiting position 30a, the avoidance waiting position ( When transferred to 80a), the change unit 8 can raise the second test tray 102 from the avoidance standby position 80a to the avoidance position 80.

Next, as shown in FIG. 7B, in a state where the second test tray 102 is located at the avoidance position 80, the unloading unit 3 is located at the unloading position 30. An unloading process of unloading the first electronic component from one test tray 101 may be performed. Through this, an unloading process for the first electronic component may be completed.

Next, after the unloading process for the first test tray 101 is completed, the transfer unit 9 transfers the first test tray 101 from the unloading position 30 to the loading position 20 can do. In this case, the first test tray 101 moves from the unloading position 30 to the unloading standby position 30a, the return path 91, and the loading standby position 20a by the transfer unit 9. ) and can be transferred to the loading position 20. When the avoidance waiting position 80a is provided, the first test tray 101 passes through the unloading waiting position 90a in the process of being transported along the return path 91 and moves to the loading waiting position 20a. ) can be located. A loading process of loading a second electronic component may be performed on the first test tray 101 located at the loading position 20 .

Next, when the first test tray 101 is transferred to the loading position 20, the change unit 8 and the transfer unit 9 transfer the second test tray 102 as shown in FIG. 7C. It can be transferred from the avoidance position 80 to the unloading position 30. In this case, when the change unit 8 lowers the second test tray 102 from the avoidance position 80 to the return path 91, the second test tray 102 moves along the transfer unit 9 After being transported to the unloading waiting position 30a along the return path 91, it can be transported to the unloading position 30. When the unloading standby position 90a is provided, when the change unit 8 lowers the second test tray 102 from the avoidance position 80 to the avoidance standby position 80a, the transfer unit ( 9) moves the second test tray 102 from the avoidance standby position 80a to the unloading standby position 30a, and then rises from the unloading standby position 30a to the unloading position 30 can make it When the second test tray 102 is located at the unloading position 30, an unloading process of unloading the second electronic component from the second test tray 102 may be performed. Through this, an unloading process for the second electronic component may be started.

In this way, the change unit 8 changes the order in which the unloading process is performed for the first test tray 101 and the second test tray 102 in the unloading unit 3, so that the unloading unit 3 The loading unit 3 performs an unloading process of unloading the first electronic component from the first test tray 101 and then unloads the second electronic component from the second test tray 102. A loading process can be performed.

Therefore, the electronic component test handler 1 according to the present invention can reduce the idle process occurring in the process of changing a lot using the change unit 8, while all the first batches belonging to the first lot After the process of storing the electronic parts in the customer tray located in the unloading stacker 31 is completed, the second electronic part belonging to the second lot is stored in the customer tray located in the unloading stacker 31 It can be implemented so that the process to be started. The change unit 8 is implemented to raise and lower the test tray 100 along the vertical direction (Z-axis direction) and to support the test tray 100 at the avoidance position 80 .

Referring to FIGS. 1 to 10 , the change unit 8 may include an avoidance lifting unit 81 .

The avoidance lifting unit 81 raises and lowers the second test tray 102 between the avoidance standby position 80a and the avoidance position 80 . When the unloading process is not performed on the first test tray 101, the avoidance lifting unit 81 is the second test tray transferred to the avoidance standby position 80a by the transfer unit 9 (102) can be raised to the avoidance position (80). When the first test tray 101 is transferred to the loading position 20 after the unloading process is performed on the first test tray 101, the avoidance lifting unit 81 moves the second The test tray 102 may be lowered from the avoidance position 80 to the avoidance standby position 80a. After that, the second test tray 102 can be transferred to the unloading position 30 via the unloading standby position 30a by the transfer unit 9 .

The avoidance lifting unit 81 may include an avoidance support member 811 (shown in FIG. 9) and an avoidance lift mechanism 812 (shown in FIG. 9).

The avoidance support member 811 is coupled to the main body 10 to be able to go up and down. The main body 10 is to which the loading part 2, the unloading part 3, and the conveying part 9 are installed. The main body 10 may be disposed on a front side (direction of arrow FD) with respect to the test unit 4 , the first chamber unit 5 , and the second chamber unit 6 . The main body 10 may be installed on the floor of the workplace. The rotating part 7 may be installed in the main body 10 .

The avoidance support member 811 may support the second test tray 102 . A part of the avoidance support member 811 may be disposed inside the main body 10 and a remaining part may be disposed outside the main body 10 . A portion of the avoidance support member 811 disposed inside the main body 10 may support the second test tray 102 . A portion of the avoidance support member 811 disposed outside the main body 10 may be coupled to the avoidance lifting mechanism 812 .

The avoidance lifting mechanism 812 raises and lowers the avoidance support member 811 . The avoidance lifting mechanism 812 raises and lowers the avoidance support member 811 between the avoidance standby position 80a and the avoidance position 80, so that the second test tray supported by the avoidance support member 811 ( 102) can be raised and lowered between the avoidance standby position 80a and the avoidance position 80. The avoidance lifting mechanism 812 may be installed on the main body 10 . The avoidance support member 811 may be coupled to the avoidance lifting mechanism 812 . The avoidance lifting mechanism 812 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a belt method using a motor and a pulley, a rack and pinion method using a rack gear and a pinion gear, a linear motor method using a permanent magnet and a coil, and the like. The avoidance support member 811 can be raised and lowered.

The change unit 8 may include a plurality of avoidance support members 811 . The avoidance support members 811 may be spaced apart from each other along the second axis direction (Y axis direction). Accordingly, since the avoidance support members 811 can support both sides of the second test tray 102 based on the second axis direction (Y axis direction), the second test tray 102 It can be raised and lowered more stably. The change unit 8 may include a plurality of the avoiding lifting mechanism 812 . In this case, the avoidance lifting mechanisms 812 may individually move the avoidance support members 811 up and down. The change unit 8 may include an interlocking mechanism (not shown) connecting the avoidance support members 811 . In this case, when the avoidance lifting mechanism 812 moves any one of the avoidance support members 811 up and down, the avoidance support members 811 may be moved up and down together by the linkage mechanism.

Referring to FIGS. 1 to 10 , the change unit 8 may include an avoidance groove 82 (shown in FIG. 10).

The avoidance groove 82 is formed on at least one lower surface of the unloading buffer 33 and the buffer frame 110 . The buffer frame 110 is a part of the main body 10 and may correspond to a part supporting the unloading buffer 33 . At least one lower surface of the unloading buffer 33 and the buffer frame 110 is a surface disposed toward the avoidance position 80 . Accordingly, when the second test tray 102 is positioned at the avoidance position 80, part or all of the second test tray 102 may be inserted into the avoidance groove 82. Therefore, the electronic component test handler 1 according to the present invention can reduce interference caused by the presence of the avoidance position 80, and the avoidance position 80 prevents the height of the main body 10 from increasing. It can be implemented to be prepared. On the other hand, even if the height of the main body 10 increases as the avoidance position 80 is provided, the height increase rate of the main body 10 can be reduced due to the avoidance groove 82 .

Referring to FIGS. 1 to 10 , the change unit 8 may include an avoidance stopper 83 .

The avoidance stopper 83 is for stopping the second test tray 102 transferred from the unloading waiting position 30a to the loading waiting position 20a at the avoiding waiting position 80a. Since the test handler 1 according to the present invention can increase the accuracy of the work of stopping the second test tray 102 at the avoidance standby position 80a using the avoidance stopper 83, the avoidance lifting unit Using (81), the accuracy and stability of the operation of raising the second test tray 102 from the avoidance standby position 80a to the avoidance position 80 can be improved.

The avoidance stopper 83 may be coupled to the main body 10 . The avoidance stopper 83 may be disposed between both sides of the main body 10 based on the second axis direction (Y axis direction). Accordingly, the avoidance stopper 83 and the avoidance elevation unit 81 may be disposed so as not to interfere with each other. The avoidance stopper 83 may be disposed between the loading waiting position 20a and the avoiding waiting position 80a based on the first axial direction (X-axis direction).

The avoidance stopper 83 may be coupled to the main body 10 to be able to go up and down. The avoidance stopper 83 may be moved up and down by a stopper lifting mechanism 831 .

The stopper lifting mechanism 831 can raise the avoidance stopper 83 to the same height as the avoidance waiting position 80a. Accordingly, the avoidance stopper 83 can stop the second test tray 102 transferred from the unloading waiting position 30a toward the loading waiting position 20a at the avoiding waiting position 80a. Therefore, the electronic component test handler 1 according to the present invention can move the test tray 100 without having a separate transfer mechanism for transferring the second test tray 102 to the avoidance standby position 80a. It is implemented so that the second test tray 102 can be positioned at the avoidance standby position 80a only by the transfer unit 9 that transfers from the unloading position 30 to the loading position 20 . Accordingly, the electronic component test handler 1 according to the present invention can reduce the cost of providing a separate transfer mechanism in addition to the transfer unit 9 .

The stopper lifting mechanism 831 may lower the avoidance stopper 83 to a height lower than the avoidance standby position 80a. Accordingly, the avoidance stopper 83 may be disposed at a position where it does not interfere with the first test tray 101 transferred from the unloading standby position 30a to the loading standby position 20a. Accordingly, the first test tray 101 can be transferred from the unloading waiting position 30a to the loading waiting position 20a without being obstructed by the avoidance stopper 83 .

The stopper lifting mechanism 831 may be installed on the main body 10 . The avoidance stopper 83 may be coupled to the stopper lifting mechanism 831 . The stopper lifting mechanism 831 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a belt method using a motor and a pulley, a rack and pinion method using a rack gear and a pinion gear, a linear motor method using a permanent magnet and a coil, and the like. The avoidance stopper 83 can be raised and lowered.

Referring to FIGS. 1 to 10 , the change unit 8 may include an avoidance detection sensor 84 .

The avoidance detection sensor 84 is for detecting the test tray 100 located at the avoidance position 80 . The avoidance detection sensor 84 may obtain avoidance detection information by detecting the test tray 100 located at the avoidance position 80 . The avoidance detection sensor 84 may provide the avoidance detection information to at least one of the avoidance lifting unit 81 and the transfer unit 9 through wired communication or wireless communication. The avoidance detection sensor 84 may be coupled to the main body 10 . The avoidance detection sensor 84 may be implemented as an optical sensor, a laser sensor, or a proximity sensor.

When the avoidance detection sensor 84 detects that the test tray 100 is located at the avoidance position 80, the avoidance detection sensor 84 may obtain first avoidance detection information. In this case, the test tray 100 located in the avoidance position 80 may be the second test tray 102 . When the first avoidance detection information is received, the transfer unit 9 may transfer the first test tray 101 from the unloading position 30 to the loading position 20 . Therefore, after the electronic component test handler 1 according to the present invention positions the second test tray 102 at the avoidance position 80 using the avoidance detection sensor 84, the first test tray ( 101) from the unloading position 30 to the loading position 20. Accordingly, since the electronic component test handler 1 according to the present invention can prevent collisions and interference between the first test tray 101 and the second test tray 102 from occurring, the first test The stability of the operation of changing the order between the tray 101 and the second test tray 102 can be improved. Meanwhile, when the avoidance detection sensor 84 detects that the test tray 100 is not present in the avoidance position 80, the avoidance detection sensor 84 may obtain second avoidance detection information. The avoidance lifting unit 81 may lift the second test tray 102 from the avoidance standby position 80a to the avoidance position 80 after the second avoidance detection information is received.

Referring to FIGS. 1 to 10 , the change unit 8 may include an air detection sensor 85 .

The standby detection sensor 85 is for detecting the test tray 100 located at the avoidance standby position 80a. The standby detection sensor 85 may obtain standby detection information by detecting the test tray 100 located at the avoidance standby position 80a. The standby detection sensor 85 may provide the standby detection information to at least one of the avoidance lifting unit 81 and the transfer unit 9 through wired communication or wireless communication. The atmospheric sensor 85 may be coupled to the main body 10 . The atmospheric sensor 85 may be implemented as an optical sensor, a laser sensor, or a proximity sensor.

When the standby sensor 85 detects that the test tray 100 is located at the avoiding standby position 80a, the standby sensor 85 may obtain first standby detection information. When the standby detection sensor 85 detects that the test tray 100 is not present at the avoidance standby position 80a, the standby detection sensor 85 may obtain second standby detection information.

When both the air detection sensor 85 and the avoidance detection sensor 84 are provided, the air detection sensor 85 may be disposed below the avoidance detection sensor 84 . The avoidance lifting unit 81 can move the second test tray 102 up and down between the avoidance standby position 80a and the avoidance position 80 using the avoidance detection information and the standby detection information. The transfer unit 9 may transfer the second test tray 102 between the avoidance standby position 80a and the unloading standby position 30a using the avoidance detection information and the standby detection information. Looking at this in detail, it is as follows.

First, after confirming that the second avoidance detection information and the second standby detection information are received, the transfer unit 9 moves the second test tray 102 from the unloading position 30 to the unloading standby position. It can be transferred to the avoidance standby position (80a) via (30a).

Next, after confirming that the second avoidance detection information and the first standby detection information are received, the avoidance lifting unit 81 moves the second test tray 102 from the avoidance standby position 80a to the avoidance position. It can be raised to (80).

Next, after confirming that the first avoidance detection information and the second standby detection information have been received, the transfer unit 9 moves the first test tray 101 from the unloading position 30 to the unloading standby position. It can be transferred to the loading position 20 via (30a) and the loading waiting position 20a.

Next, after confirming that the first avoidance detection information and the second standby detection information are received, the avoidance lifting unit 81 moves the second test tray 102 from the avoidance position 80 to the avoidance standby position. (80a) can be lowered. In this case, the avoidance lifting unit 81 receives the first avoidance detection information and the second standby detection information, and the first test tray 101 moves from the unloading standby position 30a to the avoidance standby position. In the process of being transported to the loading standby position 20a via step 80a, after confirming that the first standby detection information was received and then the second standby detection information was received, the second test tray 102 can be lowered

Next, after confirming that the second avoidance detection information and the first standby detection information have been received, the transfer unit 9 moves the second test tray 102 from the avoidance standby position 80a to the unloading standby position. It can be transferred to the unloading position 30 via (30a).

By operating in this way, the change unit 8 and the transfer unit 9 use the avoidance detection information and the standby detection information to change the order of the first test tray 101 and the second test tray 102. can be changed

1 to 10, the transfer unit 9 may include a loading lift unit 92, an unload lift unit 93, and a transfer unit 94 (shown in FIG. 8).

The loading lift unit 92 lifts the test tray 100 between the loading position 20a and the loading position 20 . When the empty test tray 100 is transferred to the loading waiting position 20a, the loading lift unit 92 can lift the empty test tray 100 to the loading position 20.

The loading lift unit 92 may include a loading support member 921 (shown in FIG. 9) and a loading lift mechanism 922 (shown in FIG. 9).

The loading support member 921 is for supporting the test tray 100 . The loading support member 921 may be coupled to the main body 10 to be able to move up and down.

The loading lifting mechanism 922 lifts and lowers the loading support member 921 . The loading/elevating mechanism 922 raises and lowers the loading support member 921 between the loading standby position 20a and the loading position 20, thereby lifting the test tray 100 supported by the loading support member 921. can be moved up and down between the loading standby position 20a and the loading position 20. The loading lifting mechanism 922 may be installed on the main body 10 . The loading support member 921 may be coupled to the loading/elevating mechanism 922 . The loading and lifting mechanism 922 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a belt method using a motor and a pulley, a rack and pinion method using a rack gear and a pinion gear, a linear motor method using a permanent magnet and a coil, and the like. The loading support member 921 can be moved up and down.

The unloading lifting unit 93 lifts the test tray 100 between the unloading standby position 30a and the unloading position 30. When the unloading process is completed for the test tray 100 located at the unloading position 30, the unloading lift unit 93 moves the test tray 100 where the unloading process is completed to the unloading standby position. (30a) can be lowered. When trying to change the order between the first test tray 101 and the second test tray 102, the unloading lifting unit 93 is used before the unloading process is performed on the second test tray 102 Then, the second test tray 102 can be lowered from the unloading position 30 to the unloading standby position 30a. When the first test tray 101 is transferred to the loading position 20 after the unloading process is completed and the second test tray 102 is transferred to the unloading standby position 30a, the unloading process The loading lift unit 93 can lift the second test tray 102 from the unloading standby position 30a to the unloading position 30 .

The unloading lift unit 93 may include an unloading support member 931 (shown in FIG. 9) and an unloading lift mechanism 932 (shown in FIG. 9).

The unloading support member 931 is for supporting the test tray 100 . The unloading support member 931 may be coupled to the main body 10 to be able to move up and down.

The unloading lifting mechanism 932 moves the unloading support member 931 up and down. The unloading lifting mechanism 932 raises and lowers the unloading support member 931 between the unloading standby position 30a and the unloading position 30, so that the unloading support member 931 is supported by the unloading support member 931. The test tray 100 can be moved up and down between the unloading standby position 30a and the unloading position 30 . The unloading lifting mechanism 932 may be installed on the main body 10 . The unloading support member 931 may be coupled to the unloading elevation mechanism 932 . The unloading lifting mechanism 932 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a belt method using a motor and a pulley, a rack and pinion method using a rack gear and a pinion gear, a linear motor method using a permanent magnet and a coil, and the like. The unloading support member 931 may be moved up and down.

The transfer unit 94 is for transferring the test tray 100. The transfer unit 94 transfers the test tray 100 between the unloading standby position 30a and the loading standby position 20a. can be transported

When the test tray 100 on which the unloading process is completed is lowered from the unloading position 30 to the unloading standby position 30a by the unloading elevation unit 93, the transfer unit 94 The test tray 100 may be transferred from the unloading standby position 30a to the loading standby position 20a. After that, the test tray 100 after completion of the unloading process may be elevated from the loading standby position 20a to the loading position 20 by the loading elevation unit 92 .

When changing the order between the first test tray 101 and the second test tray 102, the second test tray 102 is moved to the unloading position 30 by the unloading lifting unit 93. When lowered to the unloading standby position 30a, the transfer unit 94 may transfer the second test tray 102 from the unloading standby position 30a to the avoidance standby position 80a. . In this case, when the transfer unit 94 operates to transfer the second test tray 102 from the unloading standby position 30a to the loading standby position 20a, the avoidance stopper 83 The second test tray 102 can be stopped at the standby position 80a. Then, the second test tray 102 may be raised from the avoidance standby position 80a to the avoidance position 80 by the avoidance lifting unit 81 .

When the first test tray 101 is transferred to the loading position 20 after the unloading process is completed while the second test tray 102 is located at the avoiding position 80, the second The test tray 102 may be lowered from the avoidance position 80 to the avoidance standby position 80a by the avoidance lifting unit 81 . After that, the transfer unit 94 may transfer the second test tray 102 from the avoidance standby position 80a to the unloading standby position 30a. The second test tray 102 transported to the unloading standby position 30a can be elevated from the unloading standby position 30a to the unloading position 30 by the unloading elevation unit 93. . Then, the second test tray 102 may be transferred to the loading position 20 after the unloading process is completed. In this case, the transfer unit 94 may transfer the second test tray 102 after completion of the unloading process from the unloading waiting position 30a to the loading waiting position 20a.

The present invention described above is not limited to the above-described embodiments and accompanying drawings, and various substitutions, modifications, and changes are possible within the scope of the technical spirit of the present invention. It is common in the art to which the present invention belongs. It will be clear to those who have knowledge.

1: Electronic component test handler 2: Loading unit
3: unloading unit 4: testing unit
5: first chamber part 6: second chamber part
7: rotation part 8: change part
9: transfer unit 100: test tray
101: first test tray 102: second test tray
200: test equipment

Claims (11)

a loading unit performing a loading process of loading an electronic component to be tested into a test tray;
an unloading unit performing an unloading process of unloading the tested electronic component from the tray;
At the upper test site, a test process of connecting the electronic components stored in the test tray to the test equipment is performed, and at the lower test site disposed below the upper test site, the electronic components stored in the test tray are connected to the test equipment. a test unit that performs a test process;
a first chamber unit transferring the test tray on which the loading process has been performed to the test unit;
a second chamber unit transferring the test tray on which the test process is performed to the unloading unit;
a rotating unit that rotates the test tray so that the test tray is switched between a horizontal state and a vertical state; and
An electronic component test handler comprising a change unit for changing an order between a first test tray accommodating a first electronic component belonging to a first lot and a second test tray accommodating a second electronic component belonging to a second lot. According to claim 1,
The electronic component test handler, characterized in that the change unit changes the order in which the unloading process is performed for the first test tray and the second test tray in the unloading unit. According to claim 1,
The loading unit performs a loading process of loading the first electronic component on the first test tray and then loading the second electronic component on the second test tray;
The first chamber unit transfers the first test tray to the upper test site and transfers the second test tray to the lower test site;
The second chamber unit first transports the second test tray to the rotate unit and then transports the first test tray to the rotate unit;
The rotate unit first transfers the second test tray to the unloading position of the unloading unit and then transfers the first test tray to the unloading position;
The change unit transfers the second test tray so that the order in which the unloading process is performed is changed between the second test tray first transferred to the unloading position and the first test tray transferred later to the unloading position;
The unloading unit performs an unloading process of unloading the first electronic component from the first test tray and then an unloading process of unloading the second electronic component from the second test tray. electronic component test handler. According to claim 1,
A transfer unit for transferring the test tray on which the unloading process has been performed from an unloading position of the unloading unit to a loading position of the loading unit,
The loading unit performs a loading process of loading the first electronic component on the first test tray and then a loading process of loading the second electronic component on the second test tray;
The changing unit and the transfer unit transfer the second test tray transferred to the unloading position to the avoiding position, and the loading position after the first test tray is transferred to the unloading position and the unloading process is performed. When transferred to, the electronic component test handler, characterized in that for transferring the second test tray from the avoidance position to the unloading position. According to claim 4,
The unloading unit includes an unloading buffer that moves between the loading position and the unloading position,
The avoidance position is an electronic component test handler, characterized in that disposed above the return path for the test tray on which the unloading process is performed to be transferred to the loading position and disposed below the unloading buffer. According to claim 5,
An electronic component test handler, characterized in that an avoidance groove is formed on the lower surface of at least one of the unloading buffer and the buffer frame in which the unloading buffer is installed. The method of claim 4, wherein the transfer unit
an unloading lift unit that lifts and lowers the test tray between an unloading standby position disposed below the unloading position and the unloading position;
a transfer unit that transfers the test tray between the unloading standby position and the loading standby position disposed below the loading position; and
and a loading lifting unit for lifting and lowering the test tray between the loading standby position and the loading position. According to claim 7,
The transfer unit transfers the second test tray between the unloading standby position and the avoidance standby position disposed below the avoidance position;
The electronic component test handler according to claim 1 , wherein the change unit includes an avoidance lifting unit that lifts and lowers the second test tray between the avoidance stand-by position and the avoidance position. The method of claim 7, wherein the change unit
an avoidance stopper for stopping the second test tray transported from the unloading standby position toward the loading standby position by the transfer unit at the avoidance standby position disposed below the avoidance position; and
and an avoidance lifting unit for lifting and lowering the second test tray between the avoidance standby position and the avoidance position. The method of claim 8 or 9,
The change unit includes an avoidance detection sensor for detecting a test tray located in the avoidance position,
The transfer unit transfers the first test tray from the unloading standby position to the loading standby position after the avoidance detection sensor detects the test tray. According to claim 10,
The change unit includes an air detection sensor for detecting a test tray located in the avoidance standby position,
The avoidance lifting unit moves the second test tray up and down between the avoidance standby position and the avoidance position using the avoidance detection information obtained by the avoidance detection sensor and the standby detection information obtained by the standby detection sensor;
The electronic component test handler, characterized in that the transfer unit transfers the second test tray between the avoidance standby position and the unloading standby position using the avoidance detection information and the standby detection information.

Images