KR20210033911A - Pressure-sensitive adhesive tape - Google Patents

Abstract

The present invention relates to an adhesive tape having excellent heat resistance and excellent expandability even when subjected to a heating process. The adhesive tape of the present invention comprises: a base material; and an adhesive layer positioned on one side of the base material. In addition, the adhesive tape has tensile shear adhesive strength of 0.05 N per 20 mm or less after stage heating and affixation at 150°C for 30 minutes, and stress of 15 N or less at 10% elongation.

Description

Adhesive tape {PRESSURE-SENSITIVE ADHESIVE TAPE}

The present invention relates to an adhesive tape. More specifically, it relates to an adhesive tape suitable for processing a semiconductor wafer.

A work (e.g., a semiconductor wafer), which is an assembly of electronic components, is manufactured with a large diameter, and after forming a pattern on the surface, the back surface is usually ground so that the thickness of the wafer is about 100 μm to 600 μm, and then It is cut and separated (diced) into small pieces of the element, and further transferred to the mounting process. In this dicing process, the work is cut and small pieces. In the process of manufacturing a semiconductor, a pressure-sensitive adhesive sheet is used to fix a semiconductor wafer or a dicing frame (eg, SUS ring) used in a dicing process (eg, Patent Document 1).

The adhesive tape used in the processing process of a semiconductor wafer is required to have properties according to the process. For example, the adhesive tape used in the dicing process is required to have a property that no chips are released during the dicing process, a chip pick-up property after dicing, and an expandability in an expand process. In addition, in the processing process of a semiconductor wafer, a heating process may be included before and after a dicing process. In this heating process, the adhesive tape is applied to the semiconductor wafer in a heating process. The adhesive tape suitably used in the above dicing process has room for improvement in heat resistance. Therefore, in the case of including a heating step, a step of replacing the pressure-sensitive adhesive sheet to be adhered to the semiconductor wafer is required.

Japanese Patent Laid-Open No. 2003-007646 Japanese Patent Publication No. 2014-37458

The present invention has been made in order to solve the above conventional problems, and is to provide an adhesive tape having excellent heat resistance and excellent expandability even when subjected to a heating step.

The adhesive tape of the present invention includes a substrate and an adhesive layer disposed on one side of the substrate. This pressure-sensitive adhesive tape has a tensile shear adhesive strength of 0.05 N/20 mm or less after stage-heating bonding at 150° C. for 30 minutes, and a stress at 10% elongation of 15 N or less.

In one embodiment, the elongation at break of the adhesive tape is 300% or more.

In one embodiment, the shrinkage ratio of the adhesive tape after heating at 150° C. for 30 minutes is 1.0% or less.

In one embodiment, the initial elastic modulus of the adhesive tape is 500 MPa or less.

In one embodiment, the base material contains an aliphatic polyester resin.

In one embodiment, the coefficient of linear expansion at 100°C to 150°C of the adhesive tape is 1000 ppm/°C or less.

In one embodiment, the melting start point of the substrate exceeds 150°C.

In one embodiment, the adhesive tape is used in a semiconductor wafer processing step.

In one embodiment, the processing step of the semiconductor wafer includes a heating step and an expanding step.

In one embodiment, the adhesive tape is used as a dicing tape.

The adhesive tape of the present invention includes a substrate and an adhesive layer disposed on one side of the substrate. This pressure-sensitive adhesive tape has a tensile shear adhesive strength of 0.05 N/20 mm or less after stage-heating bonding at 150° C. for 30 minutes, and a stress at 10% elongation of 15 N or less. The adhesive tape of the present invention is excellent in heat resistance. Therefore, even when used in a manufacturing process including a heating process, the process of replacing the adhesive tape becomes unnecessary. In addition, the adhesive tape of the present invention can be suitably used for a semiconductor wafer processing step, similar to the conventional adhesive tape for semiconductor wafer processing. Specifically, the adhesive tape of the present invention has excellent expandability. Moreover, excellent expandability (elongation in the surface direction) can be maintained even when a heating process is passed. Therefore, even when applied to the expansion process of expanding the adhesive tape in the plane direction, the adhesive tape is not broken, and small pieces (e.g., semiconductor chips) after dicing can be satisfactorily picked up. . As a result, the productivity of the semiconductor wafer can be improved.

1 is a schematic cross-sectional view of an adhesive tape according to an embodiment of the present invention.

A. Outline of adhesive tape

1 is a schematic cross-sectional view of an adhesive tape according to an embodiment of the present invention. The adhesive tape 100 of the illustrated example includes a substrate 10 and an adhesive layer 20 disposed on one side of the substrate 10. The pressure-sensitive adhesive layer is typically formed of an active energy ray-curable pressure-sensitive adhesive composition. Practically, in order to properly protect the pressure-sensitive adhesive layer 20 during use, a separator is attached to the pressure-sensitive adhesive layer 20 so as to be peelable. In addition, the adhesive tape 100 may further contain any suitable other layer. Preferably, the pressure-sensitive adhesive layer is disposed directly on the substrate.

In another embodiment of the present invention, the pressure-sensitive adhesive layer has a two-layer structure, and the pressure-sensitive adhesive tape includes a base material, a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer in this order (not shown).

The adhesive tape has a tensile shear adhesive strength of 0.05N/20mm or less, preferably 0.02N/20mm or less, and more preferably after stage-heating bonding at 150°C for 30 minutes (hereinafter, also referred to as stage-heating bonding). Is below the measurement limit. When the tensile shear adhesive strength after stage warming is not more than 0.05N/20mm, even after passing through the heating process, it is possible to prevent contamination of the stage by the adhesive tape melted in the heating process, and more specifically, the molten substrate. In addition, the weaker the adhesive force of the adhesive tape after the stage warming is applied, the more preferable it is, and it may be equal to or less than the measurement limit (in a state where there is no tensile shear adhesive strength substantially). Therefore, depending on the embodiment, it may not be possible to measure the tensile shear adhesive strength itself after stage-heating affixing of the adhesive tape. As the adhesive tape of the present invention, those in which the adhesive force after stage heating cannot be measured can be suitably used. In the present specification, the tensile shear adhesive strength after stage-heating bonding at 150°C for 30 minutes refers to the tensile shear adhesive strength measured by the method described in Examples to be described later.

The stress at 10% elongation of the adhesive tape is 15 N or less, preferably 10 N or less, more preferably 8 N or less, and still more preferably 5 N or less. When the stress at 10% elongation is within the above range, an adhesive tape having good expandability can be obtained. Therefore, for example, even when used in a method of manufacturing a semiconductor wafer including an expanding step of stretching in the plane direction, it can be well expanded in the plane direction (MD direction and TD direction), so that the subsequent pick-up step can be performed. Therefore, the diced semiconductor wafer can be picked up efficiently. The stress at 10% elongation is preferably 4N or more. In the present specification, the stress at 10% elongation refers to the stress measured by the method described in Examples to be described later.

The elongation at break of the adhesive tape is preferably 300% or more, more preferably 400% or more, and still more preferably 450% or more. Further, the elongation at break of the adhesive tape is preferably 1000% or less. When the elongation at break is within the above range, the adhesive tape can be suitably used in the manufacturing process of a semiconductor wafer including an expanding process. The elongation at break of the adhesive tape can be measured by any suitable method. In one embodiment, the adhesive tape has the said breaking elongation in the TD direction and the MD direction. By having the above breaking elongation in the TD direction and the MD direction, it can be suitably used for a method of manufacturing a semiconductor wafer including an expand process.

The shrinkage of the adhesive tape after heating at 150° C. for 30 minutes is preferably 1.5% or less, more preferably 1.0% or less, more preferably -0.5% to 1.0%, and particularly preferably -0.2% to 0.7%, most preferably 0% to 0.5%. Since the shrinkage ratio after heating at 150° C. for 30 minutes is within the above range, it can be suitably used also for a method of manufacturing a semiconductor wafer including a heating step. In the present specification, the shrinkage rate after heating at 150° C. for 30 minutes can be measured by the method described in Examples to be described later. In the present specification, when the shrinkage rate is-(minus), it means that it is larger than the initial value (elongated) after heating, and when the shrinkage rate is + (plus), it means that it becomes smaller (shrink) than the initial value after heating.

The initial elastic modulus of the adhesive tape is preferably 500 MPa or less, more preferably 300 MPa or less, and still more preferably 200 MPa or less. When the initial elastic modulus is in the above range, it can be suitably used as an adhesive tape used in a semiconductor wafer processing step. The initial elastic modulus of the adhesive tape is preferably 50 MPa or more. The initial modulus of elasticity of the adhesive tape can be measured by any suitable method.

The coefficient of linear expansion of the adhesive tape at 100°C to 150°C is preferably 1000 ppm/°C or less, more preferably 950 ppm/°C or less, and still more preferably 600 ppm/°C or less. When the coefficient of linear expansion at 100°C to 150°C is within the above range, it is possible to prevent occurrence of wrinkles in the substrate provided in the heating step and deformation of the adhesive tape provided in the heating step. The coefficient of linear expansion in 100°C to 150°C of the adhesive tape is, for example, 300 ppm/°C or more. The coefficient of linear expansion of the adhesive tape can be analyzed by thermomechanical analysis (TMA). Specifically, it can be analyzed by the following method. The obtained sample was set to a thermomechanical analyzer (manufactured by TA Instruments, product name: TMAQ-400) with a width of 3 mm and a chuck distance of 16.05 mm. In a nitrogen atmosphere, under the condition of a load of 1.96 mN, the temperature is increased from 25°C to 160°C at 10°C/min. In this specification, the amount of displacement accompanying the linear expansion of the thickness of the sample is measured, and a value obtained from the amount of sample displacement between 100°C and 150°C is taken as the linear expansion coefficient of the substrate.

The thickness of the adhesive tape can be set in any suitable range. It is preferably 50 µm to 300 µm, more preferably 55 µm to 250 µm.

B. Description

The substrate 10 may be made of any suitable resin. As the resin, it is possible to use a resin in which the tensile shear adhesive strength of the obtained adhesive tape after stage warming bonding is 0.05 N/20 mm or less, and the stress at 10% elongation is 15 N or less. Specifically, an aliphatic polyester resin or the like can be used. Preferably, a polyester resin obtained by dehydrating condensation of an aliphatic polyhydric carboxylic acid and an aliphatic polyhydric alcohol, more preferably a polyester resin obtained by dehydrating condensation of an alicyclic polyhydric carboxylic acid and an alicyclic polyhydric alcohol is mentioned.

As the aliphatic polyester resin, for example, an esterified product of an alicyclic dicarboxylic acid and an alicyclic diol can be suitably used. As the alicyclic dicarboxylic acid, a derivative such as an alkyl ester may be used. Specifically, the esterified product of 1,4-cyclohexanedicarboxylic acid dimethyl and 1,4-cyclohexanedimethanol, etc. are mentioned.

In one embodiment, the aliphatic polyester resin is a polyester resin obtained by polymerization reaction using alicyclic dicarboxylic acid and dimer acid as the dicarboxylic acid component and alicyclic diol as the diol component, respectively. By further including dimer acid, heat resistance can be further improved. In this embodiment, the content ratio of the alicyclic dicarboxylic acid in the dicarboxylic acid component is preferably 75 mol% to 98 mol%, more preferably 80 mol% to 90 mol% in the total dicarboxylic acid component. . In addition, the content ratio of the dimer acid in the dicarboxylic acid component is preferably 2 mol% to 25 mol%, more preferably 10 mol% to 20 mol%.

Alicyclic dicarboxylic acids include alicyclic structures such as monocyclic cycloalkanes such as cyclopentane, cyclohexane, cycloheptane, and cyclooctane, and bicyclic alkanes such as decahydronaphthalene (decalin), and two carboxyl groups. It is a compound having. As the alicyclic dicarboxylic acid, for example, 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,4-decahydronaphthalenedicarboxylic acid, And 1,5-decahydronaphthalenedicarboxylic acid, 2,6-decahydronaphthalenedicarboxylic acid, and 2,7-decahydronaphthalenedicarboxylic acid. Preferably, 1,4-cyclohexanedicarboxylic acid is used.

The alicyclic dicarboxylic acid may be an unsubstituted compound or a derivative such as an alkyl ester of an alicyclic dicarboxylic acid. Examples of the alkyl ester derivatives include alkyl esters having 1 to 10 carbon atoms such as dimethyl ester and diethyl ester. Preferably, it is a dimethyl ester.

The dimer acid is a dicarboxylic acid compound obtained by dimerizing an unsaturated fatty acid having 10 to 30 carbon atoms, for example, an unsaturated fatty acid having 18 carbon atoms such as oleic acid and linoleic acid, and an unsaturated fatty acid having 22 carbon atoms such as erucic acid. It is a C36 or 44 dimer dicarboxylic acid obtained by this, or its ester-forming derivative. Further, a hydrogenated dimer acid obtained by saturating the unsaturated double bond remaining after dimerization by hydrogenation may be used. By using a hydrogenated dimer acid, reaction stability, flexibility, impact resistance, and the like can be improved. On the other hand, dimer acids are usually obtained as a mixture of compounds having a straight-chain branched structure compound, an alicyclic structure, and the like, and their content rates vary depending on the manufacturing process, but their content rates are not particularly limited.

Moreover, dicarboxylic acid components other than alicyclic dicarboxylic acid and dimer acid may be further contained. For example, aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 4,4'-diphenyldicarboxylic acid, and succinic acid, glutaric acid, adiph Aliphatic dicarboxylic acids, such as acid, pimelic acid, suberic acid, azelaic acid, and sebacic acid, etc. are mentioned. These dicarboxylic acid components may be used alone or in combination of two or more. Dicarboxylic acids other than alicyclic dicarboxylic acid and dimer acid are used in any suitable amount.

The alicyclic diol is a compound having an alicyclic structure such as a monocyclic cycloalkane and a bicyclic alkane and two hydroxyl groups. For example, 1,2-cyclopentanediol, 1,3-cyclopentanediol, 1,2-cyclopentanedimethanol, 1,3-cyclopentanedimethanol, bis(hydroxymethyl) 5-membered ring diols such as tricyclo[5.2.1.0]decane, 1,2-cyclocyclohexanediol, 1,3-cyclocyclohexanediol, 1,4-cyclocyclohexanediol, 1 ,2-cyclocyclohexanedimethanol, 1,3-cyclocyclohexanedimethanol, 1,4-cyclocyclohexanedimethanol, 2,2-bis-(4-hydroxycyclohexyl)-propane, etc. 6-membered ring diol, etc. are mentioned. Preferably 1,2-cyclocyclohexanedimethanol, 1,3-cyclocyclohexanedimethanol, and 1,4-cyclocyclohexanedimethanol, more preferably 1,4-cyclohexanedimethanol to be. 1,4-cyclohexanedimethanol can be suitably used because the methylol group is in the para position, the reactivity is high, and the polyester having a high polymerization degree is easily obtained.

Moreover, you may further use diol components other than alicyclic diol. As a diol component other than alicyclic diol, for example, ethylene glycol, propylene glycol, butanediol, hexanediol, octediol, decanediol, or bisphenol A, bisphenol Ethylene oxide adducts, such as S, and trimethylolpropane, etc. are mentioned. These may be used alone or in combination of two or more. It is preferable to use a diol component other than an alicyclic diol so that it may become less than 25 mol% with respect to the total amount of the diol component.

The polyester resin can be produced by any suitable method. For example, it can manufacture by polymerizing a dicarboxylic acid component and a diol component using arbitrary suitable catalyst. Specifically, a method of directly esterifying an unsubstituted dicarboxylic acid as a starting material, and a method of performing an transesterification reaction using an esterified product such as dimethyl ester as a starting material may be mentioned. More specifically, the transesterification reaction or esterification reaction is performed under normal pressure using any suitable catalyst, and then further polymerization reaction is performed under reduced pressure using any suitable catalyst.

As the catalyst for the transesterification reaction, any suitable catalyst can be used. Preferably, one or more types of metal compounds are used. The metal element contained in the metal compound is preferably sodium, potassium, calcium, titanium, lithium, magnesium, manganese, zinc, tin, cobalt, and the like. Among them, a titanium compound and a manganese compound are preferable because the reactivity is high and the color tone of the obtained resin is good. The amount of the transesterification catalyst used is usually 5 ppm to 1000 ppm, preferably 10 ppm to 100 ppm based on the polyester resin to be produced.

In the transesterification reaction, for example, each component used as a polymerization raw material and any appropriate other copolymerization component are introduced into a reaction tank equipped with a heating device, a stirrer and an outlet pipe, and a reaction catalyst is added. It is carried out by raising the temperature while stirring in an atmospheric pressure inert gas atmosphere, and advancing the reaction while distilling off by-products such as methanol produced by the reaction. The reaction temperature is, for example, 150°C to 270°C, preferably 160°C to 260°C. The reaction time is usually about 3 to 7 hours.

Further, after the transesterification reaction is completed, it is preferable to further add an ester exchange catalyst and an equimolar or more phosphorus compound to further advance the esterification reaction. As a phosphorus compound, phosphoric acid, phosphorous acid, trimethyl phosphate, triethyl phosphate, tributyl phosphate, trimethyl phosphite, triethyl phosphite, tributyl phosphite, etc. are mentioned, for example. Preferably, trimethylphosphate is used. The amount of the phosphorus compound used is usually 5 ppm to 1000 ppm, preferably 20 ppm to 100 ppm with respect to the polyester resin to be produced.

Following the transesterification reaction and the esterification reaction, a polycondensation reaction is further performed until the desired molecular weight is reached. As the catalyst for the polycondensation reaction, preferably, one or more types of metal compounds are used. As a metal element contained in a metal compound, titanium, germanium, antimony, aluminum, etc. are mentioned, for example. Since the reactivity is high and the transparency of the obtained resin is also excellent, a titanium compound and a germanium compound are preferably used. The amount of the polymerization catalyst used is usually 30 ppm to 1000 ppm, preferably 50 ppm to 500 ppm, based on the polyester resin to be produced.

The polycondensation reaction is carried out, for example, after adding the polycondensation catalyst to the reaction tank in which the above-described transesterification reaction and the product after the esterification reaction were placed, while gradually raising the temperature and reducing the pressure in the reaction tank. The pressure in the tank is finally reduced to, for example, 0.4 kPa or less, preferably 0.2 kPa or less, from the normal pressure atmosphere. The temperature in the bath is increased from, for example, 220°C to 230°C, and finally, for example, 250°C to 290°C, preferably 260°C to 270°C, and after reaching a predetermined torque, the bath The reaction product is extruded from the bottom and recovered. Usually, the reaction product is extruded in water into strands, cooled, and then cut to obtain a pellet-shaped polyester resin.

Such a polyester resin is described in, for example, Japanese Unexamined Patent Application Publication No. 2016-69600. In this publication, description of the whole is incorporated in this specification as a reference.

The melting point of the resin constituting the substrate is preferably 150°C to 250°C, more preferably 170°C to 220°C, and still more preferably 180°C to 210°C. When the melting point is in the above range, the heat resistance of the substrate itself is also improved, and an adhesive tape having more excellent heat resistance can be obtained. The melting point of the resin can be measured by any suitable method. In this specification, the melting point of a resin refers to the peak temperature of the endothermic peak measured using a differential scanning calorimeter (for example, manufactured by TA Instruments, product name: Q-2000).

The elastic modulus of the substrate after heating at 100°C is preferably 50 MPa to 200 MPa, more preferably 60 MPa to 100 MPa. Further, the elastic modulus of the substrate after heating at 130°C is preferably 50 MPa to 200 MPa, more preferably 60 MPa to 100 MPa. Furthermore, the elastic modulus of the substrate after heating at 150°C is preferably 60 MPa to 150 MPa, and more preferably 70 MPa to 120 MPa. Since the elastic modulus of the substrate after heating at 100° C., 130° C., and 150° C. is within the above range, the adhesive tape can be suitably used for a method of manufacturing a semiconductor wafer including a heating step and an expand step.

The coefficient of linear expansion of the substrate at 100°C to 150°C is preferably 1000 ppm/°C or less, more preferably 950 ppm/°C or less, and still more preferably 600 ppm/°C or less. When the coefficient of linear expansion at 100°C to 150°C is within the above range, it is possible to prevent occurrence of wrinkles in the substrate provided in the heating step and deformation of the adhesive tape provided in the heating step. The coefficient of linear expansion at 100°C to 150°C of the substrate is, for example, 300 ppm/°C or more. The coefficient of linear expansion of the substrate can be analyzed by thermomechanical analysis (TMA). Specifically, it can be analyzed by the following method. The obtained sample was set in a thermomechanical analysis device (manufactured by TA Instruments, product name: Q-400) with a width of 3 mm and a chuck distance of 16.05 mm. In a nitrogen atmosphere, under the condition of a load of 1.96 mN, the temperature is increased from 25°C to 160°C at 10°C/min. In this specification, the amount of displacement accompanying the linear expansion of the thickness of the sample is measured, and a value obtained from the amount of sample displacement between 100°C and 150°C is taken as the linear expansion coefficient of the substrate.

The melting start point of the substrate is preferably more than 150°C, more preferably 155°C or more, and still more preferably 160°C or more. When the melting initiation point is within the above range, it is possible to prevent occurrence of wrinkles in the substrate provided in the heating step, and occurrence of deformation of the adhesive tape provided in the heating step. The starting point of melting of the substrate is, for example, 200°C or less. In this specification, the melting start point of the substrate can be determined by the following method. In accordance with JIS K7121-1987, the extrapolated melting start temperature (Tim) is measured. The melting start point is the intersection of a straight line extending from the low-temperature side of the differential scanning calorimeter to the high-temperature side and a point at which the gradient is maximum with respect to the low-temperature side curve of the melting peak.

The thickness of the substrate is preferably 30 µm to 250 µm, more preferably 40 µm to 200 µm, and still more preferably 50 µm to 150 µm.

In one embodiment, it is preferable that the base material has been subjected to an annealing treatment. By performing the annealing treatment, it is possible to prevent the occurrence of deformation of the adhesive tape provided in the heating step. Therefore, it is possible to prevent the occurrence of a problem in a manufacturing process performed after the heating process, for example, an expand process.

The annealing treatment can be performed by any suitable method. For example, it can perform by heating a base material using a heating device, such as an oven. The heating time and the heating temperature can be set to any suitable value depending on the resin used for the substrate, the thickness of the substrate, and the like. For example, when using the substrate containing the aliphatic polyester resin, the heating temperature is preferably 155°C or higher, more preferably 160°C or higher, and still more preferably 170°C or higher. In addition, heating temperature is 180 degreeC or less, for example. The heating time is, for example, 1 minute to 30 minutes.

In one embodiment, the heating temperature in the annealing treatment can be set according to the temperature of the heating step in which the adhesive tape is provided. The heating temperature in the annealing treatment is, for example, a temperature of +10°C or higher in a heating step in which the adhesive tape is provided, and preferably +20°C or higher in a heating step in which the adhesive tape is provided. By performing the annealing treatment at such a temperature, it is possible to prevent the occurrence of deformation of the adhesive tape provided in the heating step. The heating temperature in the annealing treatment is, for example, less than the melting point of the resin used for the substrate.

C. Adhesive layer

The pressure-sensitive adhesive layer 20 is formed using a composition (adhesive composition) for forming the pressure-sensitive adhesive layer.

C-1. Adhesive composition

As the pressure-sensitive adhesive layer composition (adhesive), any suitable pressure-sensitive adhesive is used. For example, an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, and a polyvinyl ether-based pressure-sensitive adhesive may be mentioned.

In one embodiment, it is preferable that the pressure-sensitive adhesive composition is an active energy ray-curable pressure-sensitive adhesive composition. By using an active energy ray-curable pressure-sensitive adhesive, the adhesive strength decreases by irradiation with an active energy ray (typically, ultraviolet rays) after dicing, making it possible to easily pick up small pieces of work (e.g., semiconductor chips). A good adhesive tape can be obtained.

C-1-1. Base polymer

The pressure-sensitive adhesive composition may contain a base polymer exhibiting adhesiveness. Examples of the monomer constituting the base polymer include a hydrophilic monomer. As the hydrophilic monomer, any suitable monomer having a polar group can be used. Specifically, carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; Acid anhydride monomers such as maleic anhydride and itaconic anhydride; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, Hydroxyl group-containing monomers such as 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl methacrylate; Styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidepropanesulfonic acid, sulfopropyl (meth)acrylate, (meth)acryloyloxynaphthalene Sulfonic acid group-containing monomers such as sulfonic acid; Phosphoric acid group-containing monomers such as 2-hydroxyethylacryloyl phosphate; (Meth)acrylamide, N,N-dimethyl (meth)acrylamide, N-butyl (meth)acrylamide, N-methylol (meth)acrylamide, N-methylolpropane (meth)acrylamide, acrylic (N-substituted) amide-based monomers such as loylmorpholine; Aminoalkyl (meth)acrylate monomers such as aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate; Alkoxyalkyl (meth)acrylate monomers such as methoxyethyl (meth)acrylate and ethoxyethyl (meth)acrylate; Maleimide-based monomers such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, and N-phenylmaleimide; N-methyl itaconimide, N-ethyl itaconimide, N-butyl itaconimide, N-octyl itaconimide, N-2-ethylhexyl itaconimide, N-cyclohexyl itacone Itaconimide-based monomers such as mid and N-lauryl itaconimide; N-(meth)acryloyloxymethylenesuccinimide, N-(meth)acryloyl-6-oxyhexamethylenesuccinimide, N-(meth)acryloyl-8-oxyoctamethylenesuccinimide, etc. Succinimide-based monomer of; Vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperazine, vinylpyrazine, vinylpyrrole, vinylimidazole, vinyloxazole, vinyl Vinyl monomers such as morpholine, N-vinylcarboxylic acid amides, styrene, α-methylstyrene, and N-vinylcaprolactam; Cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; Epoxy group-containing acrylic monomers such as glycidyl (meth)acrylate; Glycol-based acrylic ester monomers such as polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, methoxyethylene glycol (meth)acrylate, and methoxypolypropylene glycol (meth)acrylate; Acrylic acid ester-based monomers having heterocycles such as tetrahydrofurfuryl (meth)acrylate, fluorine (meth)acrylate, and silicone (meth)acrylate, halogen atoms, silicon atoms, and the like; Hexediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate , Pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy acrylate, polyester And polyfunctional monomers such as acrylate and urethane acrylate. As the hydrophilic monomer, a hydroxyl group-containing monomer and/or a (N-substituted) amide-based monomer can be suitably used. Hydrophilic monomers may be used alone or in combination of two or more.

Further, the hydrophilic monomer and the hydrophobic monomer may be used in combination. As the hydrophobic monomer, any suitable monomer may be used as long as it has a hydrophobic monomer. Specifically, vinyl alkyl or aryl ethers having an alkyl group having 9 to 30 carbon atoms such as vinyl 2-ethylhexanoate, vinyl laurate, vinyl stearate, and stearyl vinyl ether; Hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, isooctyl acrylate, isononyl acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, dodecyl (meth)acrylate, (meth)acrylate ) 2-ethylhexyl acrylate, benzyl (meth) acrylate, lauryl (meth) acrylate, oleyl (meth) acrylate, palmityl (meth) acrylate, and 6 to 30 carbon atoms of stearyl (meth) acrylate (meth) acrylic acid Alkyl esters of; Unsaturated vinyl esters of (meth)acrylic acid derived from fatty acids and fatty alcohols; Monomers derived from cholesterol; Olefin monomers, such as 1-butene, 2-butene, 1-pentene, 1-hexene, 1-octene, isobutylene, and isoprene, are mentioned. Hydrophobic monomers may be used alone or in combination of two or more. Meanwhile, in the present specification, the hydrophobic monomer refers to a monomer having a solubility of 0.02 g or less in 100 g of water.

The base polymer may further contain monomer components other than the hydrophilic monomer and the hydrophobic monomer. As another monomer component, alkyl acrylates, such as butyl acrylate and ethyl acrylate, etc. are mentioned. Other monomer components may be used alone or in combination of two or more.

The base polymer may further contain a structural unit derived from an isocyanate compound having a curable functional group in the molecule. The base polymer containing a constituent unit derived from an isocyanate compound reacts, for example, with a substituent (e.g., an OH group) of the constituent unit derived from the hydrophilic monomer and the NCO group of the isocyanate compound You can get it. As the isocyanate-based compound, for example, methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-iso And propenyl-α,α-dimethylbenzyl isocyanate.

The weight average molecular weight of the base polymer constituting the pressure-sensitive adhesive is preferably 300,000 to 2 million, more preferably 500,000 to 1.5 million. The weight average molecular weight can be measured by GPC (solvent: THF).

C-1-2. Polymerization initiator

The active energy ray-curable pressure-sensitive adhesive composition typically contains a polymerization initiator. As the polymerization initiator, any suitable initiator can be used, and a photopolymerization initiator is preferably used. As the photoinitiator, any suitable initiator can be used. As a photoinitiator, for example, 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxy-α,α'-dimethylacetophenone, 2-methyl- Α-ketol compounds such as 2-hydroxypropiophenone and 1-hydroxycyclohexylphenyl ketone; Methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1-[4-(methylthio)-phenyl]-2-mo Acetophenone compounds such as polynopropane-1; Benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether; Ketal compounds such as benzyl dimethyl ketal; Aromatic sulfonyl chloride compounds such as 2-naphthalenesulfonyl chloride; Photoactive oxime compounds such as 1-phenone-1,1-proteinion-2-(o-ethoxycarbonyl)oxime; Benzophenone compounds such as benzophenone, benzoylbenzoic acid, and 3,3'-dimethyl-4-methoxybenzophenone; Thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethyl thioxanthone, isopropyl thioxanthone, 2,4-dichlorothioxanthone, 2,4-diethyl Thioxanthone compounds such as thioxanthone and 2,4-diisopropyl thioxanthone; Campaquinone; Halogenated ketones; Acyl phosphine oxide; And acyl phosphonate. Only one type of photoinitiator may be used, or two or more types may be used in combination. The amount of the photopolymerization initiator used may be set to any suitable amount. The amount of the photopolymerization initiator used is preferably 1 to 10 parts by weight, more preferably 3 to 7 parts by weight, based on 100 parts by weight of the base polymer.

As the photoinitiator, a commercial item may be used. For example, BASF's brand names "Irgacure 651", "Irgacure 184", "Irgacure 369", "Irgacure 819", "Irgacure 2959" and the like can be mentioned.

C-1-3. Crosslinking agent

The active energy ray-curable pressure-sensitive adhesive composition preferably further contains a crosslinking agent. Examples of crosslinking agents include isocyanate crosslinking agents, epoxy crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, melamine crosslinking agents, peroxide crosslinking agents, urea crosslinking agents, metal alkoxide crosslinking agents, metal chelate crosslinking agents, and metal salts. And a carbodiimide crosslinking agent, an amine crosslinking agent, and the like.

In one embodiment, an isocyanate-based crosslinking agent is preferably used. The isocyanate-based crosslinking agent is preferable in that it can react with various types of functional groups. Specific examples of the isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; Alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, and isophorone diisocyanate; Aromatic isocyanates such as 2,4-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate; Trimethylolpropane/tolylene diisocyanate trimer adduct (manufactured by Tosoh Corporation, brand name ``Colonate L''), trimethylolpropane/hexamethylene diisocyanate trimer adduct (Nippon Polyurethane Isocyanate adducts, such as an industrial company make, a brand name "Colonate HL"), and an isocyanurate body of hexamethylene diisocyanate (the product made by Nippon Polyurethane Industries, a brand name "Colonate HX"); And the like. Preferably, a crosslinking agent having 3 or more isocyanate groups is used.

The active energy ray-curable pressure-sensitive adhesive composition may further contain any suitable additive. As an additive, for example, an active energy ray polymerization accelerator, a radical scavenger, a tackifier, a plasticizer (for example, a trimellitic ester plasticizer, a pyromellitic ester plasticizer), a pigment, a dye, a filler, an anti-aging agent , A conductive material, an antistatic agent, an ultraviolet absorber, a light stabilizer, a peeling regulator, a softener, a surfactant, a flame retardant, an antioxidant, and the like.

The content of the crosslinking agent can be adjusted to any appropriate amount. For example, it is preferably 0.005 parts by weight to 20 parts by weight, more preferably 0.02 parts by weight to 10 parts by weight, based on 100 parts by weight of the base polymer. In addition, when the pressure-sensitive adhesive layer has a single-layer configuration, the content ratio of the crosslinking agent is preferably 0.1 parts by weight to 10 parts by weight, more preferably 0.5 parts by weight to 8 parts by weight, based on 100 parts by weight of the base polymer of the pressure-sensitive adhesive. to be. If it is such a range, it is possible to form the pressure-sensitive adhesive layer in which the elastic modulus is appropriately adjusted.

The pressure-sensitive adhesive layer may be a single layer or may be composed of two or more layers. In one embodiment, the pressure-sensitive adhesive layer is constituted by a single layer. When the pressure-sensitive adhesive layer has a single-layer configuration, the tensile modulus of the pressure-sensitive adhesive layer at 22° C. is preferably 0.05 MPa to 1 MPa, more preferably 0.1 MPa to 0.8 MPa, and still more preferably 0.15 MPa to 0.6 MPa. to be. In such a range, a pressure-sensitive adhesive layer having sufficient strength can be formed, and the pressure-sensitive adhesive layer and the substrate are in good contact with each other, and generation of voids in the vicinity of the interface between the substrate and the pressure-sensitive adhesive layer can be suppressed. In addition, when the tensile modulus is less than 0.05 MPa, there is a fear that the pressure-sensitive adhesive layer does not maintain a fixed shape and does not have sufficient properties. On the other hand, as described above, when the pressure-sensitive adhesive layer is made of an active energy ray-curable pressure-sensitive adhesive, it is preferable that the tensile modulus at 22° C. before irradiation with the active energy ray is within the range. A method of measuring the tensile modulus of the pressure-sensitive adhesive layer will be described later.

When the pressure-sensitive adhesive layer has a single-layer configuration, ^{the tensile modulus at 22° C. after irradiation with ultraviolet rays (460 mJ/cm 2} ) of the pressure-sensitive adhesive layer is preferably 50 MPa to 3000 MPa, more preferably 100 MPa to 1500 MPa, and more preferably It is 200 MPa to 1000 MPa. If it is such a range, an adhesive tape excellent in pick-up property can be obtained.

When the pressure-sensitive adhesive layer has a single-layer configuration, the thickness of the pressure-sensitive adhesive layer is preferably 5 μm to 200 μm, more preferably 5 μm to 150 μm, and still more preferably 5 μm to 100 μm.

D. Manufacturing method of adhesive tape

The adhesive tape can be manufactured by any suitable method. The adhesive tape can be obtained, for example, by coating the adhesive on a substrate. As a coating method, various methods such as bar coater coating, air knife coating, gravure coating, gravure reverse coating, reverse roll coating, lip coating, die coating, dip coating, offset printing, flexo printing, screen printing, etc. can be adopted. . In addition, after forming the pressure-sensitive adhesive layer on the separator separately, a method of bonding it to the substrate may be employed.

E. Use of adhesive tape

The adhesive tape of the present invention has excellent heat resistance and expandability, and has excellent expandability even when subjected to a heating process. Therefore, it can be suitably used for applications requiring these characteristics. In one embodiment, the adhesive tape of the present invention can be suitably used for a processing step of a semiconductor wafer, and can be preferably used as a dicing tape. In addition, the adhesive tape can be suitably used for a method of manufacturing a semiconductor wafer including an expanding process. In the expand process, the adhesive tape is stretched in the plane direction (MD direction and TD direction) while being attached to the semiconductor wafer. The adhesive tape has excellent elongation not only in one direction, but also in the surface direction. Therefore, it can be suitably used for a method of manufacturing a semiconductor wafer including an expanding process. Moreover, the adhesive tape has excellent heat resistance and can maintain excellent expandability even after passing through a heating process. Therefore, it can be suitably used for a method of manufacturing a semiconductor wafer including a heating step. Moreover, since the step of replacing the adhesive tape can be omitted, the productivity of the semiconductor wafer can also be improved.

Example

Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited by these examples. Tests and evaluation methods in Examples are as follows. In addition, unless otherwise specified, "parts" and "%" are based on weight.

<Production Example 1> Preparation of polymer solution

100 parts by weight of 2-methoxyethyl acrylate, 27 parts by weight of acryloylmorpholine, and 22 parts by weight of 2-hydroxyethyl acrylate were mixed to prepare a monomer solution 1. Then, nitrogen was introduced into a reaction vessel equipped with a nitrogen introduction tube, a thermometer, and a stirrer, and under a nitrogen atmosphere, 500 parts by weight of ethyl acetate, 1 part of the monomer solution, and 0.2 parts by weight of azoisobutyl nitrile (AIBN) were added. , It stirred at 60 degreeC for 24 hours. Then, it cooled to room temperature, and obtained the acrylic copolymer solution containing the acrylic copolymer (weight average molecular weight: 600,000). To the obtained acrylic copolymer solution, 24 parts by weight of 2-methacryloyloxyethyl isocyanate was added and reacted, an NCO group was added to the side chain terminal OH group of 2-hydroxyethyl acrylate in the copolymer, and carbon- A weight average molecular weight of 800,000 acrylic copolymer solution 1 (polymer) having a carbon double bond was obtained.

[Example 1]

(Preparation of an adhesive layer-forming composition)

100 parts by weight of the acrylic polymer solution obtained in Preparation Example 1, 3 parts by weight of a crosslinking agent (manufactured by Tosoh Corporation, brand name: Colonate L), 7 parts by weight of a photopolymerization initiator (manufactured by BASF, brand name: Irgacure 184), and a diluting solvent (ethyl acetate ) Was blended and stirred to obtain a pressure-sensitive adhesive composition.

(Production of equipment)

A base material (thickness: 80 μm) was produced using an aliphatic polyester resin (manufactured by Sidam, product name: aliphatic polyester resin containing BPP-TPEE1) manufactured by Bell Polyester Products.

(Production of adhesive tape)

The pressure-sensitive adhesive layer-forming composition was applied to a polyethylene terephthalate (PET) separator (manufactured by Mitsubishi Chemical, product name: Diafoil MRF38, silicone coated polyester film), and then heated at 120° C. for 2 minutes. Then, the pressure-sensitive adhesive layer was transferred to the substrate to obtain a pressure-sensitive adhesive tape (thickness: 100 μm) having a pressure-sensitive adhesive layer having a thickness of 10 μm.

[Example 2]

The substrate used in Example 1 was put into an oven heated at 150° C. for 5 minutes to perform annealing treatment. Then, it carried out similarly to Example 1, and produced the adhesive tape.

[Example 3]

The substrate used in Example 1 was put into an oven heated to 160° C. for 5 minutes to perform annealing treatment. Then, it carried out similarly to Example 1, and produced the adhesive tape.

[Example 4]

The substrate used in Example 1 was put into an oven heated to 170° C. for 5 minutes to perform annealing treatment. Then, it carried out similarly to Example 1, and produced the adhesive tape.

(Comparative Example 1)

As the substrate, an adhesive tape C1 was produced in the same manner as in Example 1, except that a polyolefin resin film (manufactured by Okura Industrial Co., Ltd., product name: ODZ2, thickness: 80 μm) was used.

(Comparative Example 2)

As the substrate, an adhesive tape C2 was produced in the same manner as in Example 1, except that a polyolefin resin film (manufactured by Okura Industrial Co., Ltd., product name: ODZ5, thickness: 80 μm) was used.

(Comparative Example 3)

As a substrate, an adhesive tape C3 was produced in the same manner as in Example 1, except that a polyethylene terephthalate film (manufactured by Toray, product name: Lumirror S10#100, thickness: 100 μm) was used.

(Comparative Example 4)

As the substrate, an adhesive tape C4 was produced in the same manner as in Example 1, except that a polyethylene naphthalate film (manufactured by Teijin Film Solutions, product name: Theonex Q51C, thickness: 50 μm) was used.

(Comparative Example 5)

As the substrate, an adhesive tape C5 was produced in the same manner as in Example 1 except that a polyimide film (manufactured by Toray DuPont, product name: Kafton 100H, thickness: 25 μm) was used.

The following evaluation was performed using the adhesive tape obtained in Examples and Comparative Examples. The results are shown in Tables 1 and 2.

(1) Tensile shear adhesion strength after stage warming bonding

The substrate surface of a 10-mm-square adhesive tape was superimposed on the SUS plate (BA304), and on a stage heated at 100°C to 150°C, the adhesive tape side (adhesive layer) was placed in contact and left for 30 minutes. After that, it was lowered from the stage, the SUS plate was placed on the lower side, and left to stand until it reached room temperature. Then, using a tensile tester (manufactured by Orientec, product name: RTM-100), it was stretched at 22° C., a chuck distance of 50 mm, a speed of 300 mm/min, and a tensile angle of 180 degrees, and the tensile shear adhesive strength (N/10 mm) was obtained. Measured.

(2) Stress at 10% elongation, modulus of elasticity, elongation at break

The obtained adhesive tape was cut out into strips having a width of 10 mm and a length of 100 mm to obtain a test piece. Using the above tensile tester, the stress at 10% elongation, elastic modulus, and elongation at break were measured under conditions of 23°C, 50 mm interchuck distance, and 300 mm/min of speed. On the other hand, the modulus of elasticity is an initial modulus of elasticity (Young's modulus) obtained from deformation within a range that can be regarded as a straight line immediately after stretching. The breaking elongation was taken as the deformation (%) when the tape was broken.

(3) Heat shrinkage rate (dimension change rate)

The obtained adhesive tape was cut out to a size of 100 mm x 100 mm to obtain a test piece. The lengths in the TD direction and the MD direction of the test piece were measured with a projector (manufactured by Mitutoyo Co., Ltd., product name: PJ-H3000F), and were set as initial values. The test pieces were put in an oven heated at 100°C, 130°C, 150°C, and 180°C, with the pressure-sensitive adhesive layer of the adhesive tape as the upper side. After 30 minutes, the test piece was taken out of the oven and cooled at room temperature of 22° C. for 30 minutes or more. Then, the length of the test piece after heating in the TD direction and the MD direction was measured with a projector. The ratio of the length after heating to the initial value ((initial value-length after heating)/initial value) x 100 was calculated, and it was set as the thermal contraction rate (dimension change rate).

As is clear from Table 1, the adhesive tape of Example 1 had a small shrinkage even after heating at 100°C to 180°C and was excellent in heat resistance. Moreover, even after heating, it has the same degree of elasticity modulus and breaking strength as before heating, and can be suitably used in the manufacturing process of a semiconductor wafer.

The following evaluation was performed about the adhesive tape obtained in Examples 1-4 and the base material used in each Example. Table 3 shows the results.

(4) Coefficient of linear expansion at 100°C to 150°C

The substrates used in Examples 1 to 4 were set to a thermomechanical analysis device (manufactured by TA Instruments, product name: Q-400) with a width of 3 mm and a chuck interval of 16.05 mm. Then, the temperature was raised from 25°C to 160°C under conditions of 10°C/min under a nitrogen atmosphere and a load of 1.96 mN. The amount of displacement accompanying the linear expansion of the thickness of the substrate was measured, and the amount of sample displacement from 100°C to 150°C was determined.

In addition, the coefficient of linear expansion was similarly measured for the adhesive tapes obtained in Examples 1 to 4.

(5) Melting start point and melting point

The substrates used in Examples 1 to 4 were punched into a circle having a diameter of 4 mm and used as a sample. With respect to this sample, using a differential scanning calorimeter (manufactured by TA Instruments, product name: Q-2000), the temperature was raised under the condition of 10°C/min in the measurement range of -30°C to 300°C, and the melting initiation point and melting point were determined. Measured. The melting start point was determined by the following method.

The extrapolation melting start temperature (Tim) was measured according to JIS K7121-1987. The melting initiation point was taken as the intersection of the straight line extending from the low temperature side of the differential scanning calorimeter to the high temperature side and the point at which the gradient became the maximum with respect to the curve on the low temperature side of the melting peak.

(6) Modulus of elasticity, stress at break, and elongation at break

The substrate used in each example was cut out into strips having a width of 10 mm and a length of 100 mm to obtain a test piece. Using the above tensile tester, the elastic modulus, the breaking point stress, and the breaking elongation were measured under conditions of 23°C, a chuck distance of 50 mm, and a speed of 300 mm/min. On the other hand, the modulus of elasticity is an initial modulus of elasticity (Young's modulus) obtained from deformation within a range that can be regarded as a straight line immediately after stretching. The breaking elongation was taken as the deformation (%) when the tape was broken.

(7) Chip contact in the dicing process

An 8-inch Si wafer back-ground to a thickness of 150 μm was mounted on the adhesive tapes obtained in Examples 1 to 4. Then, it adhered to the dicing ring. Dicing was performed using a dicing device (manufactured by Disco, product name DFD6450, chip size 10 mm square, blade ZH05-SD3000-N1-70 HI). Thereafter, the wafer was used as the upper surface and the tape was used as the lower surface, and posts were attached to the four corners of the dicing ring, placed in an oven at 150°C, and taken out from the oven after 2 minutes. Then, the wafer was divided into four areas according to the MD direction and the TD direction of the tape. Thereafter, light was irradiated from the tape side, and the light leaking to the wafer side was visually checked, and the presence or absence of contact with the chip was judged based on the following criteria.

Yes: There are places where light leaking cannot be confirmed in all areas.

Some contacts: There are spots where light leaking from one to three areas cannot be observed.

None: There are no spots where the leaking light cannot be confirmed in all areas.

The adhesive tape of the present invention can be suitably used for semiconductor processing applications.

10 description
20 adhesive layer
100 adhesive tape

Claims (11)

It has a substrate and an adhesive layer disposed on one side of the substrate,
An adhesive tape having a tensile shear adhesive strength of 0.05 N/20 mm or less after performing stage heating at 150° C. for 30 minutes and a stress at 10% elongation of 15 N or less. The method of claim 1,
Adhesive tape with an elongation at break of 300% or more. The method of claim 1,
An adhesive tape having a shrinkage of 1.0% or less after heating at 150°C for 30 minutes. The method of claim 1,
An adhesive tape having an initial elastic modulus of 500 MPa or less. The method of claim 1,
The adhesive tape, wherein the base material contains an aliphatic polyester resin. The method of claim 1,
The adhesive tape, wherein the adhesive tape has a coefficient of linear expansion of 1000 ppm/°C or less in 100°C to 150°C. The method of claim 1,
The adhesive tape, wherein the melting start point of the substrate exceeds 150°C. The method of claim 1,
Adhesive tape used in a semiconductor wafer processing process. The method of claim 8,
The adhesive tape, wherein the semiconductor wafer processing process includes a heating process and an expanding process. The method of claim 8,
Adhesive tape used as a dicing tape. The method of claim 9,
Adhesive tape used as a dicing tape.

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