KR20200062145A - Chip electronic component and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a chip electronic component and a manufacturing method thereof, and more specifically, to a chip electronic component which can increase force for supporting an inner coil portion to prevent deformation of the inner coil portion in the process of laminating and compressing the magnetic layer, and improve defective exposure due to the deformation of the inner coil portion, and a manufacturing method thereof.

Description

Chip electronic component and manufacturing method thereof

The present invention relates to a chip electronic component and its manufacturing method.

An inductor, one of the chip electronic components, is a typical passive element that removes noise by forming an electronic circuit together with a resistor and a capacitor. It uses electromagnetic characteristics to combine with the capacitor to amplify a signal in a specific frequency band. It is used in the construction of resonant circuits, filter circuits, and the like.

2. Description of the Related Art Recently, miniaturization and thinning of IT devices such as various communication devices or display devices are accelerating, and various elements such as inductors, capacitors, and transistors employed in the IT devices are also being continuously researched for miniaturization and thinning.

In addition, as miniaturization and high performance of electronic devices are required, power consumption is increasing. According to the increase in power consumption, a switching frequency is high-frequency, an output current increases, and a power management integrated circuit (PMIC) or a DC-DC converter used in a power circuit of an electronic device increases. Accordingly, the use of power inductors used for stabilizing the output current of PMIC or DC-DC converters is increasing.

The development direction of the power inductor is focused on miniaturization, high currentization, and low DC resistance. However, there is a limit in realizing this with conventional stacked power inductors, and magnetic powder is formed on the coil pattern formed by plating on the upper and lower surfaces of the insulating substrate of the thin film. The development of a thin-film inductor formed by mixing with a resin continues.

The thin-film inductor forms a coil pattern by plating and then removes an insulating substrate in an area except for the portion where the coil pattern is formed in order to secure the maximum inductance. However, in the process of laminating and compressing the magnetic material layer due to a lack of a force in which the insulating substrate from which all regions except the coil pattern is formed is insufficient to support the coil, deformation of the coil occurs, and defective exposure due to deformation of the coil occurs. There was a problem.

Japanese Patent Publication No. 2006-278479

One embodiment of the present invention can increase the force supporting the inner coil portion to prevent deformation of the inner coil portion in the process of laminating and compressing the magnetic material layer, and to improve defective exposure due to deformation of the inner coil portion. It relates to a chip electronic component and its manufacturing method.

One embodiment of the present invention includes a magnetic body including an insulating substrate; An inner coil portion formed on at least one surface of the insulating substrate; And an external electrode formed on a cross section of the body of the magnetic body and connected to the inner coil part. The insulating substrate provides a chip electronic component including a bridge pattern part in which the inner coil part is not formed.

The bridge pattern portion may be exposed on both sides opposite to each other of the magnetic body.

The bridge pattern portion may be exposed on both sides opposite to each other so as to be orthogonal to both end faces of the magnetic body where the lead portion of the inner coil portion is exposed.

 The bridge pattern portion may prevent deformation of the inner coil portion formed on the insulating substrate.

 When the thickness of the insulating substrate is t, and the length of one side surface of the magnetic body to which the bridge pattern portion is exposed is l, the ratio of the cross-sectional area of the bridge pattern portion to t×l may be 0.02 to 0.88.

The central portion of the insulating substrate may form a through hole, and the through hole may be filled with a magnetic material to form a core portion.

 The insulating substrate may be any one or more selected from the group consisting of polypropylene glycol (PPG) substrate, ferrite substrate and metal-based soft magnetic substrate.

Another embodiment of the present invention is a magnetic body including an insulating substrate having a through hole formed in the central portion; An inner coil part formed on both surfaces of the insulating substrate and exposed to the first lead part and the second lead part in both cross sections opposite to each other of the magnetic body; A first external electrode and a second external electrode formed on both ends of the magnetic body and connected to the first and second lead portions of the inner coil portion, respectively. The insulating substrate includes the inner coil portion. Provided is a chip electronic component including a bridge pattern portion exposed to both sides opposite to each other so as to be orthogonal to both end surfaces of the magnetic body where the first lead portion and the second lead portion of the body are exposed.

 When the thickness of the insulating substrate is t, and the length of one side surface of the magnetic body to which the bridge pattern portion is exposed is l, the ratio of the cross-sectional area of the bridge pattern portion to t×l may be 0.02 to 0.88.

The through hole may be filled with a magnetic material to form a core portion.

 The insulating substrate may be any one or more selected from the group consisting of polypropylene glycol (PPG) substrate, ferrite substrate and metal-based soft magnetic substrate.

Another embodiment of the present invention includes forming an inner coil part on at least one surface of the insulating substrate; Removing the portion where the inner coil portion is not formed from the insulating substrate; Forming a magnetic body by stacking magnetic layers on top and bottom of the insulating substrate on which the inner coil part is formed; And forming an external electrode on the end face of the magnetic body so as to be connected to the inner coil part, wherein the inner coil part is not formed in the step of removing the insulating substrate of the part where the inner coil part is not formed. Provided is a method of manufacturing a chip electronic component that forms a bridge pattern by removing an insulating substrate except for a part.

 The bridge pattern portion may be formed to be exposed on both sides opposite to each other of the magnetic body.

The bridge pattern portion may be exposed on both sides opposite to each other so as to be orthogonal to both end faces of the magnetic body where the lead portion of the inner coil portion is exposed.

The bridge pattern portion may prevent deformation of the inner coil portion formed on the insulating substrate when the magnetic body layer is stacked to form the magnetic body.

When the thickness of the insulating substrate is t and the length of one side of the body of the magnetic body to which the bridge pattern portion is exposed is l, the ratio of the cross-sectional area of the bridge pattern portion to t×l may be 0.02 to 0.88.

The central portion of the insulating substrate may form a through hole, and a magnetic body may be filled in the through hole in the step of stacking the magnetic layer to form a core portion.

One embodiment of the present invention can increase the force supporting the inner coil portion to prevent deformation of the inner coil portion in the process of laminating and compressing the magnetic material layer, and improve exposure failure due to deformation of the inner coil portion. .

In addition, by blocking the magnetic flux flowing around the coil to prevent magnetization around the coil to improve the characteristics of the change in the inductance (L) value according to the application of current, it is possible to realize a high maximum inductance value by sufficiently securing the filled magnetic material volume.

1 is a schematic perspective view showing an internal coil portion of a chip electronic component according to an embodiment of the present invention.
2 is a schematic plan view of a chip electronic component according to an embodiment of the present invention.
3 is a schematic plan view of a chip electronic component according to an embodiment of the present invention.
4 is a schematic perspective view for showing a cross-sectional area of a bridge pattern portion of a chip electronic component according to an embodiment of the present invention.
5 is a process diagram showing a method of manufacturing a chip electronic component according to an embodiment of the present invention.
6 to 8 are views sequentially showing a method of manufacturing a chip electronic component according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for a clearer description, and elements indicated by the same reference numerals in the drawings are the same elements.

In addition, in order to clearly describe the present invention in the drawings, parts irrelevant to the description are omitted, and thicknesses are enlarged to clearly express various layers and regions, and components having the same function within the scope of the same idea have the same reference. It will be explained using a sign.

Throughout the specification, when a part “includes” a certain component, this means that other components may be further included rather than excluding other components unless specifically stated to the contrary.

Chip electronic components

Hereinafter, a chip electronic component according to an exemplary embodiment of the present invention will be described, but is not limited to, particularly as a thin film inductor.

1 is a schematic perspective view showing an inner coil portion of a chip electronic component according to an embodiment of the present invention.

Referring to FIG. 1, as an example of a chip electronic component, a thin film chip inductor 100 used in a power line of a power supply circuit is disclosed. The chip electronic component can be suitably applied as a chip bead, a chip filter, etc., in addition to a chip inductor.

The thin film inductor 100 includes a magnetic body 50, an insulating substrate 20, an inner coil part 40, and external electrodes 81 and 82.

The magnetic body 50 forms an external appearance of the thin film inductor 100, and is not limited as long as it is a material exhibiting magnetic properties, and may be formed by filling, for example, a ferrite or metal-based soft magnetic material.

The ferrite may include known ferrites such as Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite, or Li ferrite.

The metal-based soft magnetic material may be an alloy including any one or more selected from the group consisting of Fe, Si, Cr, Al, and Ni, and may include, for example, Fe-Si-B-Cr-based amorphous metal particles. And is not limited thereto.

The particle diameter of the metal-based soft magnetic material may be 0.1 μm to 30 μm, and may be included in a form dispersed on a polymer such as an epoxy resin or polyimide.

The magnetic body 50 may have a hexahedral shape, and when the direction of the hexahedron is defined to clearly describe an embodiment of the present invention, L, W, and T shown in FIG. 1 respectively indicate a length direction, a width direction, and a thickness direction. Shows. The magnetic body 50 may have a rectangular parallelepiped whose length in the longitudinal direction is greater than that in the width direction. In this embodiment, the magnetic body 50, one side and the other end facing each other in the longitudinal direction (L), one end and the other end, and one side and the other side facing each other in the width direction (W), And connecting one side and the other side and having one surface and the other surface facing each other in the thickness direction (T).

The insulating substrate 20 formed inside the magnetic body 50 may be formed of, for example, a polypropylene glycol (PPG) substrate, a ferrite substrate, or a metal-based soft magnetic substrate.

An inner coil portion 40 having a coil-shaped pattern may be formed on one surface of the insulating substrate 20, and an inner coil portion 40 of a coil-shaped pattern may be formed on the opposite side of the insulating substrate 20. Can be.

The inner coil portion 40 may be formed in a coil pattern in a spiral shape, and the inner coil portion 40 formed on one surface and the opposite side of the insulating substrate 20 may be formed on the insulating substrate 20. It can be electrically connected through the via electrode 45 to be formed.

The inner coil part 40 may include a first lead part 41 and a second lead part 42 exposed to both cross sections opposite to each other of the magnetic body 50.

The inner coil portion 40 formed on one surface of the insulating substrate 20 includes a first lead portion 41 exposed to one cross section of the magnetic body 50, and is formed on the opposite side of the insulating substrate 20 The inner coil part 40 may include a second lead part 42 exposed to the other end face opposite to one end face of the magnetic body 50 to which the first lead part 41 is exposed.

The inner coil part 40 and the via electrode 45 may be formed of a metal having excellent electrical conductivity, for example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), It may be formed of titanium (Ti), gold (Au), copper (Cu), platinum (Pt), or alloys thereof.

A through hole is formed in a central portion of the insulating substrate 20 where the inner coil portion 40 is not formed, and the through hole is filled with a magnetic material such as ferrite or a metal soft magnetic material to form the core portion 55. have. As the core portion 55 filled with the magnetic material is formed, the inductance L can be improved.

The insulating substrate 20 may include a bridge pattern portion 25 in an area where the inner coil portion 40 is not formed.

Conventionally, the insulating substrate 20 in all regions except for the portion where the inner coil portion 40 is formed is removed. However, in one embodiment of the present invention, the insulating substrate 20 in some regions where the inner coil portion 40 is not formed Without removing the, it is possible to prevent deformation of the inner coil portion 40 when the magnetic layer is laminated or compressed by increasing the force supporting the inner coil portion 40 as the bridge pattern portion 25 is formed. For example, by forming the bridge pattern portion 25, the deformation of the inner coil portion 40 is prevented, and the defective exposure rate due to the deformation of the coil is significantly reduced from 9.2% to 0.34%.

2 and 3 are schematic plan views of a chip electronic component according to an embodiment of the present invention.

2 and 3, the bridge pattern portion 25 may be exposed on both sides facing each other of the magnetic body 50.

For example, the bridge pattern portion 25 is a direction orthogonal to both end surfaces of the magnetic body 50 to which the first lead portion 41 and the second lead portion 42 of the inner coil portion 40 are exposed. Can be exposed on both sides facing each other.

On the other hand, the bridge pattern portion 25 may be differently adjusted in volume, as in the other embodiments illustrated in FIGS. 2 and 3.

However, the position and shape of the bridge pattern portion 25 is not limited to FIGS. 2 and 3, and is a partial region of the insulating substrate 20 on which the inner coil portion 40 is not formed. There is no particular limitation as long as it can prevent deformation.

4 is a schematic perspective view for showing a cross-sectional area of a bridge pattern portion of a chip electronic component according to an embodiment of the present invention.

Referring to FIG. 4, when the thickness of the insulating substrate 20 is t and the length of one side of the magnetic body 50 to which the bridge pattern portion 25 is exposed is l, the bridge to the cross-sectional area of t×l The ratio of the cross-sectional area of the pattern portion 25 may be 0.02 to 0.88.

When the cross-sectional area ratio of the bridge pattern portion 25 satisfies the above range, the deformation of the inner coil portion 40 can be effectively prevented, and further, the non-magnetic insulating substrate 20 blocks the flow of magnetic flux to apply current. While the effect of reducing the inductance change is improved, at the same time, a sufficient volume of the magnetic body filled in the magnetic body 50 can be sufficiently secured to realize a high inductance value.

When the cross-sectional area ratio of the bridge pattern portion 25 is less than 0.02, the force supporting the inner coil portion 40 is insufficient, and thus, poor exposure due to deformation of the inner coil portion 40 may occur during the lamination and compression process of the magnetic layer. If it exceeds 0.88, the inductance value may be significantly reduced due to the reduction in the volume of the magnetic material.

Meanwhile, the inner coil portion 40 may be covered with an insulating layer 30.

The insulating layer 30 may be formed by a known method such as a screen printing method, exposure of photoresist (PR), process through development, spray coating process, vacuum dipping process, CVD (Weather deposition method). The inner coil part 40 may not be in direct contact with the magnetic material forming the magnetic body 50 by being covered with the insulating layer 30.

The first end portions of the magnetic body body 50 are respectively connected to the first lead portion 41 and the second lead portion 42 of the inner coil portion 40 exposed to both end faces of the magnetic body body 50. External electrodes and second external electrodes 81 and 82 may be formed.

The first external electrodes and the second external electrodes 81 and 82 are formed on both end surfaces of the magnetic body 50 in the longitudinal direction, and the amount of the one surface and the other surface and/or the width direction of the magnetic body 50 is in the thickness direction. It can be formed to extend laterally.

The first and second external electrodes 81 and 82 may be formed of a metal having excellent electrical conductivity, for example, nickel (Ni), copper (Cu), tin (Sn), or silver (Ag). It may be formed of a single or an alloy of these.

Manufacturing method of chip electronic parts

5 is a process diagram showing a method of manufacturing a chip electronic component according to an embodiment of the present invention, FIGS. 6 to 8 are views sequentially showing a method of manufacturing a chip electronic component according to an embodiment of the present invention.

Referring to FIG. 6, first, an inner coil part 40 may be formed on at least one surface of the insulating substrate 20.

The insulating substrate 20 is not particularly limited and may be, for example, a polypropylene glycol (PPG) substrate, a ferrite substrate, or a metal-based soft magnetic substrate, and may have a thickness of 40 to 100 μm.

The method of forming the inner coil part 40 may include, for example, an electroplating method, but is not limited thereto, and the inner coil part 40 may be formed of a metal having excellent electrical conductivity, for example. , Silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt) or alloys thereof.

A via electrode 45 may be formed by forming a hole in a portion of the insulating substrate 20 and filling a conductive material. The via electrode 45 may be formed on a surface opposite to one surface of the insulating substrate 20. The inner coil part 40 can be electrically connected.

The inner coil part 40 may include a first lead part 41 and a second lead part 42 exposed in both cross sections, respectively.

The inner coil portion 40 formed on one surface of the insulating substrate 20 includes a first lead portion 41 exposed in one cross-section, and an inner coil portion 40 formed on the opposite side of the insulating substrate 20 The first withdrawal portion 41 may include a second withdrawal portion 42 exposed to the other end face that is opposite to one exposed section.

Referring to FIG. 7, a portion in which the inner coil part 40 is not formed may be removed from the insulating substrate 20.

Removal of the insulating substrate 20 may be performed by applying a drill, laser, sand blasting, punching, or the like, and for example, CO ₂ laser may be performed to remove the substrate.

The central portion of the insulating substrate 20 on which the inner coil portion 40 is not formed may be removed to form a through hole penetrating the insulating substrate 20.

At this time, the bridge pattern portion 25 may be formed by removing some of the portions of the insulating substrate 20 on which the inner coil portion 40 is not formed.

Conventionally, the insulating substrate 20 in all regions except for the portion where the inner coil portion 40 is formed is removed. However, in one embodiment of the present invention, the insulating substrate 20 in some regions where the inner coil portion 40 is not formed Without removing the, it is possible to prevent deformation of the inner coil portion 40 when the magnetic layer is laminated or compressed by increasing the force supporting the inner coil portion 40 as the bridge pattern portion 25 is formed.

The bridge pattern portion 25 may be exposed on both sides facing each other in a direction orthogonal to both cross-sections where the first lead portion 41 and the second lead portion 42 of the inner coil portion 40 are exposed. have.

When the thickness of the insulating substrate 20 is t and the length of one side of the magnetic body 50 to which the bridge pattern portion 25 is exposed is l, the bridge pattern portion 25 for a cross-sectional area of t×l The ratio of the cross-sectional area of may be 0.02 to 0.88.

When the cross-sectional area ratio of the bridge pattern portion 25 satisfies the above range, the deformation of the inner coil portion 40 can be effectively prevented, and further, the non-magnetic insulating substrate 20 blocks the flow of magnetic flux to apply current. While the effect of reducing the inductance change is improved, it is possible to realize a high inductance value by sufficiently securing the volume of the magnetic body filled in the magnetic body 50 at the same time.

When the cross-sectional area ratio of the bridge pattern portion 25 is less than 0.02, the force supporting the inner coil portion 40 is insufficient, and thus, poor exposure due to deformation of the inner coil portion 40 may occur during the lamination and compression process of the magnetic layer. If it exceeds 0.88, the inductance value may be significantly reduced due to the reduction in the volume of the magnetic material.

An insulating layer 30 covering the inner coil portion 40 may be formed on the surface of the inner coil portion 40. The insulating layer 30 is formed by a method such as a screen printing method, exposure of photoresist (PR), a process through development, a spray coating process, a vacuum dipping process, and a CVD (vapor deposition method). It can, but is not limited to.

Referring to FIG. 8, the magnetic body 50 may be formed by stacking magnetic layers 51 on the upper and lower portions of the insulating substrate 20 on which the inner coil portion 40 is formed.

The magnetic body layer 51 may be stacked on both sides of the insulating substrate 20 and compressed by a lamination method or a hydrostatic pressing method to form the magnetic body 50.

At this time, the through hole formed in the central portion of the insulating substrate 20 may be filled with a magnetic material to form the core portion 55.

Next, both cross-sections of the magnetic body 50 are respectively connected to the first lead-out portion 41 and the second lead-out portion 42 of the inner coil portion 40 exposed to both cross-sections of the magnetic body 50. The first external electrode and the second external electrode 81 and 82 may be formed on it.

The first and second external electrodes 81 and 82 may be formed using a paste containing a metal having excellent electrical conductivity, for example, nickel (Ni), copper (Cu), tin (Sn), or silver. It may be a conductive paste containing only (Ag) or an alloy thereof.

The method of forming the first and second external electrodes 81 and 82 may be formed by performing a dipping method or the like as well as printing according to the shape of the external electrodes 81 and 82.

Other parts identical to those of the chip electronic component according to the above-described embodiment of the present invention will be omitted here.

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited by the appended claims.

Accordingly, various forms of substitution, modification, and modification will be possible by those skilled in the art without departing from the technical spirit of the present invention as set forth in the claims, and this also belongs to the scope of the present invention. something to do.

100: thin film inductor 45: via electrode
20: insulating substrate 50: magnetic body
25: bridge pattern portion 51: magnetic material layer
30: insulating layer 55: core portion
40: inner coil 81, 82: first and second external electrodes
41: first withdrawal unit
42: second withdrawal unit

Claims (11)

Insulating substrates;
A main body including the insulating substrate, having both end faces facing each other, and both side surfaces connecting the both end faces and facing each other;
A coil portion formed on at least one surface of the insulating substrate and including first and second lead portions exposed on both ends of the magnetic body; And
External electrodes formed on both ends of the main body and connected to the coil part; Including,
The insulating substrate includes a bridge pattern portion in which the coil portion is not formed,
At least a portion of the outer peripheral surface of the insulating substrate and at least a portion of the outer peripheral surface of the coil portion, the chip electronic component.
According to claim 1,
The bridge pattern portion is a chip electronic component exposed to one side of the body.
According to claim 1,
The bridge pattern part is a chip electronic component that is exposed on both sides opposite to each other in a direction orthogonal to both cross sections of the main body where the first and second lead portions of the coil part are exposed.
According to claim 1,
The bridge pattern portion is a chip electronic component that prevents deformation of the coil portion formed on the insulating substrate.
According to claim 1,
When the thickness of the insulating substrate is t, and the length of one side of the body where the bridge pattern portion is exposed is l, the ratio of the cross-sectional area of the bridge pattern portion to the cross-sectional area of t×l is 0.02 to 0.88.
According to claim 1,
A central electronic part of the insulating substrate forms a through hole, and the through hole is filled with a magnetic material to form a core portion.
According to claim 1,
The insulating substrate is at least one chip electronic component selected from the group consisting of a polypropylene glycol (PPG) substrate, a ferrite substrate and a metal-based soft magnetic substrate.
An insulating substrate having a through hole formed in a central portion;
A main body including the insulating substrate, having both end faces facing each other, and both side surfaces connecting the both end faces and facing each other;
A coil portion formed on both sides of the insulating substrate, wherein the first lead portion and the second lead portion are exposed to both end faces of the main body; And
First external electrodes and second external electrodes formed on both end surfaces of the main body and respectively connected to the first and second lead portions of the coil portion; Including,
The insulating substrate includes a bridge pattern portion exposed to both side surfaces opposite to each other in a direction orthogonal to both end surfaces of the main body where the first lead portion and the second lead portion of the coil portion are exposed, to prevent deformation of the coil portion,
At least a portion of the outer peripheral surface of the insulating substrate and at least a portion of the outer peripheral surface of the coil portion, the chip electronic component.
The method of claim 8,
When the thickness of the insulating substrate is t, and the length of one side of the body where the bridge pattern portion is exposed is l, the ratio of the cross-sectional area of the bridge pattern portion to the cross-sectional area of t×l is 0.02 to 0.88.
The method of claim 8,
The through hole is filled with a magnetic material to form a core electronic component.
The method of claim 8,
The insulating substrate is at least one chip electronic component selected from the group consisting of a polypropylene glycol (PPG) substrate, a ferrite substrate and a metal-based soft magnetic substrate.

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