KR20190048811A - Method for manufacturing silicon carbide dense bodies having excellent thermal conductivity and thermal durability - Google Patents
Method for manufacturing silicon carbide dense bodies having excellent thermal conductivity and thermal durability Download PDFInfo
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims description 18
- 238000005245 sintering Methods 0.000 claims abstract description 38
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 29
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 239000000654 additive Substances 0.000 claims abstract description 9
- 230000000996 additive effect Effects 0.000 claims abstract description 8
- 229910052580 B4C Inorganic materials 0.000 claims abstract description 7
- 239000011812 mixed powder Substances 0.000 claims abstract description 7
- 239000000843 powder Substances 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 239000002952 polymeric resin Substances 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 239000006229 carbon black Substances 0.000 claims description 3
- 238000005238 degreasing Methods 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 238000010298 pulverizing process Methods 0.000 claims 1
- 238000005303 weighing Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 abstract description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 5
- 239000010703 silicon Substances 0.000 abstract description 5
- 238000001272 pressureless sintering Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 15
- 239000000203 mixture Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 238000000280 densification Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 3
- 238000003826 uniaxial pressing Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 238000002490 spark plasma sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
본 발명은 (a) 탄화규소(SiC) 분말, 탄화붕소(B4C) 및 탄소계 첨가제를 칭량한 후 혼합 및 분쇄하여 탄화규소 90 내지 96 중량%; 탄화붕소 1 내지 5 중량%; 및 탄소(C) 3 내지 5 중량%를 포함하는 혼합 분말을 제조하는 단계; (b) 상기 세라믹 혼합 분말로 성형체를 제조하는 단계; 및 (c) 상기 성형체를 2000 내지 2400 ℃의 온도에서 상압소결하는 단계를 포함하는 탄화규소 소결체의 제조방법에 대한 것으로서,
본 발명에 의하면, 상압소결을 통한 탄화규소 소결체를 제조함에 있어서 소결조제인 탄화붕소(B4C)와 탄소의 첨가량을 최적화하여 최소 97.3% 이상의 높은 열전도도를 가지는 치밀화된 탄화규소 소결체를 제조할 수 있다.(A) a silicon carbide (SiC) powder, boron carbide (B 4 C), and a carbon-based additive are weighed, mixed and crushed to obtain 90 to 96% by weight of silicon carbide; 1 to 5% by weight of boron carbide; And carbon (C) in an amount of 3 to 5% by weight; (b) preparing a shaped body from the ceramic mixed powder; And (c) sintering the shaped body at a temperature of 2000 to 2400 캜 under normal pressure. The present invention relates to a method for producing a silicon carbide-
According to the present invention, in producing a silicon carbide sintered body by pressureless sintering, the densified silicon carbide sintered body having a high thermal conductivity of at least 97.3% is manufactured by optimizing the amount of boron carbide (B 4 C) and carbon added .
Description
본 발명은 열전달용 고온 부품 등에 사용되는 탄화규소 세라믹 소결체의 제조방법에 대한 것이다.The present invention relates to a method for producing a silicon carbide ceramic sintered body used for high-temperature parts for heat transfer and the like.
탄화규소는 비산화물 고온구조용 세라믹스의 대표적인 소재로 실리콘-탄소 원소간의 공유결합으로 나타나는 내산화성, 고온강도, 고경도 및 내마모성 등의 우수한 물리적 특성을 지니므로 다양한 분야에 응용되는 세라믹 소재이다. Silicon carbide is a typical ceramic material for non-arsenic high-temperature structural ceramics. It is a ceramic material that is applied to various fields because it has excellent physical properties such as oxidation resistance, high temperature strength, hardness and abrasion resistance, which are represented by covalent bonding between silicon and carbon elements.
현재 탄화규소의 전형적인 응용처로는 고온로 내장재 및 특수내화물, 베어링 소재, 블라스트 노즐(blast nozzle), 미케니컬실(mechanical seal), 세라믹 방탄소재, 연삭/연마재 및 절삭공구 등이 있으며 다이아몬드, 붕화물 등과 함께 제조한 복합세라믹스 소재로도 사용되고 있다. Currently, typical applications of silicon carbide include high-temperature interior and special refractories, bearing materials, blast nozzles, mechanical seals, ceramic ballistic materials, grinding / abrasives and cutting tools, And the like are also used as composite ceramics materials.
또한, 우수한 열물리적 특성으로 인해 래디언트 튜브(radiant tube), 열교환기, 발열체 등의 에너지분야에도 널리 응용되고 있다.Also, due to its excellent thermal and physical properties, it is widely applied to energy fields such as radiant tubes, heat exchangers and heating elements.
반면에, 탄화규소는 강한 공유결합 특성으로 인해 높은 녹는점을 지니며 격자내부의 자기확산계수(self-diffusion coefficient)가 낮아서 일반적인 상압소결로 치밀화하기 위해서는 2000℃ 이상의 고온이 필요하므로 일반적으로 산화물 소결조재를 이용한 액상소결, 실리콘 함침을 통한 반응소결, 외부에서 압력을 추가로 가하는 가압소결 등의 치밀화 공정이 널리 쓰인다. On the other hand, silicon carbide has a high melting point due to its strong covalent bonding property and has a low self-diffusion coefficient inside the lattice. Therefore, in order to densify the sintering furnace by normal pressure sintering, Densification processes such as liquid sintering using crude, reaction sintering through silicon impregnation, and pressure sintering to apply additional pressure from outside are widely used.
이 중 가압소결은 통상 핫프레스를 사용하여 치밀화 구동력으로 온도 외에 외부압력을 사용하는데 고온에서의 입성장을 억제하여 미립의 기계적 특성을 이용하기 위해 방전플라즈마소결(spark plasma sintering)과 같은 급속소결법도 널리 사용되며 가압을 위한 몰드를 사용하므로 소결체의 형상에 제약을 받는다.Among them, pressure sintering is usually performed by using a hot press, and external pressure is used in addition to temperature by densifying driving force. In order to suppress grain growth at high temperature and to utilize the fine mechanical characteristics, a rapid sintering method such as spark plasma sintering It is widely used and the shape of the sintered body is restricted because it uses a mold for pressurization.
RBSC (reaction-bonded silicon carbide)는 SiC 분말을 2000℃ 이상에서 열처리하여 부분적으로 결합(necking)시킨 재결정 SiC (recrystallized silicon carbide) 골격에 액상의 실리콘을 함침하는 실리콘화 SiC (siliconized silicon carbide) 제조법에서 응용된 공정으로 치밀화된 SiC 소재이다. 기존 실리콘화 SiC와의 차이는 SiC와 C의 성형체에 액상 Si를 함침하는 것으로 C와 Si가 반응하여 2차 SiC가 합성되면서 완전치밀화에 필요한 공정온도를 낮출 수 있으며 정밀정형(near-net shape)의 부품제조가 가능하여 산업적으로 널리 사용되고 있으나 잔류실리콘의 함량에 따라 고온사용온도의 제한이 있다.Reaction-bonded silicon carbide (RBSC) is a siliconized silicon carbide (SiC) process in which liquid silicon is impregnated into a recrystallized silicon carbide (SiC) skeleton partially annealed by heat treating SiC powder at a temperature of 2000 ° C. or higher It is SiC material densified by applied process. The difference between SiC and SiC is that the liquid Si is impregnated into the SiC and the C-shaped body, so that C and Si react to synthesize the second SiC to lower the process temperature required for complete densification. It is widely used industrially because it is possible to manufacture parts, but there is a limitation on high temperature use temperature depending on the content of residual silicon.
따라서, 종래 상압소결에 사용되는 소결조제 중 대표적인 탄화붕소와 탄소의 첨가량을 최적화하여 치밀화를 극대화하는 기술에 대한 필요성이 증대되고 있다.Therefore, there is a growing need for a technique for maximizing densification by optimizing the addition amounts of representative boron carbide and carbon among sintering aids used in the conventional pressure sintering.
본 발명이 해결하고자 하는 기술적 과제는, 상압소결에 사용되는 소결조제의 조성 및 함량을 조절하여 치밀화가 극대화된 탄화규소 소결체를 제조하는 방법 및 이에 의해 제조된 탄화규소 소결체를 제공하는 것이다.SUMMARY OF THE INVENTION The present invention provides a method of manufacturing a silicon carbide sintered body having maximum densification by controlling a composition and a content of a sintering auxiliary used in atmospheric pressure sintering, and a silicon carbide sintered body produced by the method.
상기 기술적 과제를 달성하기 위해, 본 발명은 (a) 탄화규소(SiC) 분말, 탄화붕소(B4C) 및 탄소계 첨가제를 칭량한 후 혼합 및 분쇄하여 탄화규소 90 내지 96 중량%; 탄화붕소 1 내지 5 중량%; 및 탄소(C) 3 내지 5 중량%를 포함하는 세라믹 혼합 분말을 제조하는 단계; (b) 상기 세라믹 혼합 분말로 성형체를 제조하는 단계; 및 (c) 상기 성형체를 2000 내지 2400 ℃의 온도에서 상압소결하는 단계를 포함하는 탄화규소 소결체의 제조방법을 제안한다.(A) a silicon carbide (SiC) powder, boron carbide (B 4 C), and a carbon-based additive are weighed and mixed and pulverized to obtain 90 to 96 wt% of silicon carbide; 1 to 5% by weight of boron carbide; And 3 to 5% by weight of carbon (C); (b) preparing a shaped body from the ceramic mixed powder; And (c) sintering the molded body at a temperature of 2000 to 2400 캜 under normal pressure, thereby producing a silicon carbide sintered body.
또한, 상기 탄소계 첨가제는 고분자 수지, 그라파이트, 카본블랙 또는 활성탄소로 이루어진 군으로부터 선택된 1종 이상인 것을 특징으로 하는 탄화규소 소결체의 제조방법을 제안한다.Further, the carbon-based additive is one or more selected from the group consisting of a polymer resin, graphite, carbon black, and activated carbon, and proposes a method of producing the silicon carbide sintered body.
또한, 상기 고분자 수지는 페놀계 수지인 것을 특징으로 하는 탄화규소 소결체의 제조방법을 제안한다.The present invention also provides a method for producing a silicon carbide sintered body, wherein the polymer resin is a phenolic resin.
또한, 상기 (c) 단계에서 상기 성형체를 2000 내지 2200 ℃의 온도에서 상압소결하는 것을 특징으로 하는 탄화규소 소결체의 제조방법을 제안한다.In the step (c), the green body is sintered at atmospheric pressure at a temperature of 2000 to 2200 캜, thereby producing a silicon carbide sintered body.
또한, 상기 (c) 단계를 실시하기에 앞서, 상기 성형체를 600 내지 1000 ℃의 온도로 가열해 탈지처리하는 단계를 더 포함하는 것을 특징으로 하는 탄화규소 소결체의 제조방법을 제안한다.Further, prior to the step (c), the method further comprises degreasing the shaped body by heating the shaped body to a temperature of 600 to 1000 ° C. The present invention further provides a method for producing a silicon carbide sintered body.
그리고, 본 발명은 발명의 다른 측면에서 상기 제조방법에 의해 제조된 탄화규소 소결체를 제안한다.In addition, the present invention proposes a silicon carbide sintered body produced by the above manufacturing method in another aspect of the invention.
또한, 97.3% 이상의 상대밀도를 가지는 것을 특징으로 하는 탄화규소 소결체를 제안한다.Further, the present invention proposes a silicon carbide sintered body having a relative density of 97.3% or more.
본 발명에 의하면, 상압소결을 통한 탄화규소 소결체를 제조함에 있어서 소결조제인 탄화붕소(B4C)와 탄소의 첨가량을 최적화하여 최소 97.3%의 높은 상대밀도를 가지는 치밀화된 탄화규소 소결체를 제조할 수 있다.According to the present invention, in producing a silicon carbide sintered body by pressureless sintering, the densified silicon carbide sintered body having a high relative density of at least 97.3% is manufactured by optimizing the amount of boron carbide (B 4 C) and carbon added .
도 1은 본 발명에 따른 완전 치밀화된 탄화규소 소결체 제조방법의 흐름도이다.
도 2는 본원 실시예 1 및 2와 비교예 1 내지 4에 있어서, 일축가압성형 후 성형밀도의 이론밀도 대비 상대밀도로 표시된 결과이다.
도 3은 본원 실시예 1 및 2와 비교예 1 내지 4에 있어서, 2070℃에서 2시간동안 진공소결한 후 소결밀도의 이론밀도 대비 상대밀도로 표시된 결과이다.
도 4는 본원 실시예 1 및 2와 비교예 1 내지 4에 있어서, 2160℃에서 2시간동안 진공소결한 후 소결밀도의 이론밀도 대비 상대밀도로 표시된 결과이다.
도 5는 본원 실시예 1 및 2와 비교예 4에 있어서, 2160℃에서 2시간동안 진공소결한 후 소결체의 단면미세구조를 보여주는 주사전자현미경(SEM) 결과이다.
도 6은 본원 실시예 2와 비교예 2 및 3에 있어서, 2160℃에서 2시간동안 진공소결한 소결체 시편에 대해 온도에 따른 열전도도(thermal conductivity)를 측정한 결과를 나타내는 그래프이다.1 is a flow chart of a method of manufacturing a fully densified silicon carbide sintered body according to the present invention.
Fig. 2 is a graph showing relative density versus the theoretical density of molding density after uniaxial pressing in Examples 1 and 2 and Comparative Examples 1 to 4 of the present invention.
FIG. 3 is a graph showing relative density versus the theoretical density of sintered compacts after vacuum sintering at 2070 ° C. for 2 hours in Examples 1 and 2 and Comparative Examples 1 to 4.
4 is a graph showing relative density versus the theoretical density of sintered compacts after vacuum sintering at 2160 ° C for 2 hours in Examples 1 and 2 and Comparative Examples 1 to 4.
5 is a scanning electron microscope (SEM) image showing the cross-sectional microstructure of the sintered body after vacuum sintering at 2160 ° C for 2 hours in Examples 1 and 2 and Comparative Example 4 of the present application.
6 is a graph showing the results of measurement of thermal conductivity of a sintered body specimen vacuum-sintered at 2160 ° C for 2 hours in Example 2 and Comparative Examples 2 and 3 according to temperature.
본 발명을 설명함에 있어서 관련된 공지 기능 또는 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명을 생략할 것이다.In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.
본 발명의 개념에 따른 실시예는 다양한 변경을 가할 수 있고 여러 가지 형태를 가질 수 있으므로 특정 실시예들을 도면에 예시하고 본 명세서 또는 출원에 상세하게 설명하고자 한다. 그러나 이는 본 발명의 개념에 따른 실시 예를 특정한 개시 형태에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변경, 균등물 내지 대체물을 포함하는 것으로 이해되어야 한다.Embodiments in accordance with the concepts of the present invention can make various changes and have various forms, so that specific embodiments are illustrated in the drawings and described in detail in this specification or application. It should be understood, however, that the embodiments according to the concepts of the present invention are not intended to be limited to any particular mode of disclosure, but rather all variations, equivalents, and alternatives falling within the spirit and scope of the present invention.
본 명세서에서 사용한 용어는 단지 특정한 실시예를 설명하기 위해 사용된 것으로, 본 발명을 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 명세서에서, "포함하다" 또는 "가지다" 등의 용어는 설시된 특징, 숫자, 단계, 동작, 구성요소, 부분품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부분품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms " comprises ", or " having ", or the like, specify that there is a stated feature, number, step, operation, , Steps, operations, components, parts, or combinations thereof, as a matter of principle.
이하, 본 발명을 상세하게 설명한다.Hereinafter, the present invention will be described in detail.
본 발명은 종래 상압소결에 사용되는 소결조제 중 대표적인 탄화붕소와 탄소의 첨가량을 최적화하여 소결체의 치밀화를 극대화함으로써, 상압소결을 통해 열전도도 및 열내구성 등 열물성이 우수한 탄화규소 소결체를 제조할 수 있는 방법을 제안하고자 한다.The present invention maximizes the densification of the sintered body by optimizing the addition amounts of typical boron carbide and carbon among the sintering aids used in the conventional pressure sintering so as to produce sintered silicon carbide excellent in thermal properties such as thermal conductivity and thermal durability through pressure sintering I would like to propose a method.
이를 위해, 본 발명은 (a) 탄화규소(SiC) 분말, 탄화붕소(B4C) 및 탄소계 첨가제를 칭량한 후 혼합 및 분쇄하여 탄화규소 90 내지 96 중량%; 탄화붕소 1 내지 5 중량%; 및 탄소(C) 3 내지 5 중량%를 포함하는 세라믹 혼합 분말을 제조하는 단계; (b) 상기 세라믹 혼합 분말로 성형체를 제조하는 단계; 및 (c) 상기 성형체를 2000 내지 2400 ℃의 온도에서 상압소결하는 단계를 포함하는 것을 특징으로 한다.(A) a silicon carbide (SiC) powder, boron carbide (B 4 C) and a carbonaceous additive are weighed, mixed and crushed to obtain 90 to 96% by weight of silicon carbide; 1 to 5% by weight of boron carbide; And 3 to 5% by weight of carbon (C); (b) preparing a shaped body from the ceramic mixed powder; And (c) sintering the formed body at a temperature of 2000 to 2400 캜.
상기 단계 (a)에서는 소결체 제조를 위한 세라믹 원료 분말을 준비하는 단계로서, 탄화규소 90 내지 96 중량%; 탄화붕소 1 내지 5 중량%; 및 탄소(C) 3 내지 5 중량%를 포함하는 혼합 분말을 얻기 위해, 탄화규소(SiC) 분말, 탄화붕소(B4C) 및 탄소계 첨가제를 칭량, 혼합 및 분쇄한다.In the step (a), a step of preparing a ceramic raw material powder for producing a sintered body includes: 90 to 96% by weight of silicon carbide; 1 to 5% by weight of boron carbide; (SiC) powder, boron carbide (B 4 C) and the carbon-based additive are weighed, mixed and pulverized to obtain a mixed powder containing 3 to 5% by weight of carbon (C)
상기 탄소계 첨가제는 소결조제인 탄소(C)를 제공하는 탄소원으로서의 역할을 하는 구성 요소로서, 바람직하게는 페놀계 수지 등 소결 단계에서 가열에 의해 분해되어 탄소를 생성할 수 있는 고분자 수지 또는 그라파이트, 카본블랙, 활성탄소 등의 원자성 탄소 소재일 수 있다.The carbon-based additive is a component which serves as a carbon source for providing carbon (C) as a sintering aid, and is preferably a polymer resin or graphite capable of decomposing by heating in a sintering step such as a phenol resin to generate carbon, Carbon black, activated carbon, and the like.
다음으로, 상기 단계 (b)는 상기 세라믹 혼합 분말을 이용해 성형체를 제조하는 단계이다.Next, the step (b) is a step of producing a molded body using the ceramic mixed powder.
본 단계에서 성형체를 제조하기 위한 성형 방법은 특별히 제한되지 않으며, 일례로, 프레스 성형법을 이용해 본 단계를 수행할 수 있다. 프레스 성형은, 예를 들면 상기 세라믹 혼합 분말을 금형에 충전하고 가압함으로써, 원하는 형상을 갖는 성형체를 얻는 방식이며, 복잡한 형상의 성형체를 얻는 데 적합하다.The molding method for producing the molded article in this step is not particularly limited, and for example, this step can be carried out by using the press molding method. The press molding is a method in which a molded body having a desired shape is obtained by, for example, filling and pressurizing the ceramic mixed powder into a mold, and is suitable for obtaining a molded body having a complicated shape.
나아가, 본 단계에서는 필요에 따라 일축 가압 성형 등의 통상의 프레스 성형을 행한 후에 CIP(Cold Isostatic Press) 성형을 추가적으로 실시할 수 있다. 예를 들어, 상기 세라믹 혼합 분말을 통상의 프레스 성형에 제공한 후, 얻어진 성형체를 CIP 성형기를 이용하여 가압한다. CIP 성형은 상기 프레스 금형과 동일한 형을 갖는 고무형에 상기 가압 성형품을 배치하고, 물 등의 매체로 상하 좌우 전방향에서 균등하게 가압할 수 있어 고밀도의 성형체를 얻는 것을 가능하게 한다.Further, in this step, CIP (Cold Isostatic Press) molding can be additionally performed after performing normal press molding such as uniaxial pressing if necessary. For example, after the ceramic mixed powder is provided in a conventional press molding, the obtained molded article is pressed using a CIP molding machine. The CIP molding can arrange the press-molded article in a rubber mold having the same shape as the press mold, press uniformly in all directions up, down, left, and right by means of a medium such as water, thereby making it possible to obtain a high-density molded article.
이어서, 상기 (c) 단계에서는 상기 성형체를 2000 내지 2400 ℃의 온도에서 상압소결한다.In the step (c), the compact is sintered at a temperature of 2000 to 2400 ° C.
즉, 본 단계에서는 탄화규소의 분해를 방지하기 위하여 2000 ℃ 이상 2400 ℃ 이하의 온도, 보다 바람직하게는 2000 내지 2200 ℃의 온도에서 압력을 가하지 않고 비산화성 분위기(진공 분위기, 환원성 가스 분위기, 불활성 가스 분위기 등)에서 소결을 실시한다.That is, in this step, in order to prevent the decomposition of silicon carbide, a non-oxidizing atmosphere (a vacuum atmosphere, a reducing gas atmosphere, an inert gas (for example, nitrogen gas) Atmosphere, etc.).
한편, 본 단계에서 상압소결을 실시하기 전에 필요에 따라 상기 성형체를 비산화성 분위기에서 600 내지 1000 ℃의 온도로 가열해 성형체 제조를 위해 첨가된 유기 결합제 등을 제거하는 탈지처리 단계를 추가적으로 실시할 수 있다. Meanwhile, a degreasing step for removing the organic binder added for the production of the molded body may be additionally carried out by heating the shaped body in a non-oxidizing atmosphere at a temperature of 600 to 1000 ° C, if necessary, before performing the normal pressure sintering in this step have.
그리고, 상기와 같이 단계 (a) 내지 단계 (c)를 거쳐 얻어진 탄화규소 소결체에 유리 탄소(free carbon)가 많이 포함되는 경우에는, 상기 탄화규소 소결체를 공기 중에서 400 내지 1000℃의 온도로 열처리하여 유리 탄소를 제거할 수 있다. 이때, 상기 유리 탄소는 탄화규소 또는 탄화붕소의 결정 구조 내에 화학 결합에 의해 속박되어 있지 않은 탄소를 의미한다.When the silicon carbide sintered body obtained through steps (a) to (c) contains a lot of free carbon, the silicon carbide sintered body is heat-treated at a temperature of 400 to 1000 ° C in the air Free carbon can be removed. Here, the free carbon means carbon which is not bound by a chemical bond in the crystal structure of silicon carbide or boron carbide.
앞서 상세히 설명한 본 발명에 따른 탄화규소 소결체의 제조방법에 의하면, 상압소결을 통한 탄화규소 소결체를 제조함에 있어서 소결조제인 탄화붕소(B4C)와 탄소의 첨가량을 최적화하여 최소 97.3%의 높은 상대밀도를 가지는 치밀화된 탄화규소 소결체를 제조할 수 있다.According to the manufacturing method of the silicon carbide sintered body according to the present invention as described above, the sintered silicon carbide sintered body can be produced by optimizing the addition amount of boron carbide (B 4 C) and carbon, Densified silicon carbide sintered body having a high density can be produced.
이하, 바람직한 실시예를 들어 본 발명을 더욱 상세하게 설명하도록 한다. 제시된 실시예는 본 발명의 구체적인 예시일 뿐이며, 본 발명의 범위를 제한하기 위한 목적으로 제공되는 것이 아니다.Hereinafter, the present invention will be described in more detail with reference to preferred embodiments. The embodiments presented are only a concrete example of the present invention and are not provided for the purpose of limiting the scope of the present invention.
<실시예> 상압소결을 통한 탄화규소 소결체의 제조 및 소결체의 치밀화에 대한 고찰<Examples> Preparation of silicon carbide sintered body by pressureless sintering and densification of sintered body
도 1에 도시한 본원 발명에 따른 탄화규소 소결체 제조방법의 일례에 따라 상압소결 탄화규소를 제조하고, 소결조제에 따른 치밀화 거동에 이어 각 소결시편의 미세구조와 열전도도와 같은 물성을 살폈다. 상압소결 탄화규소 소재는 열교환기 튜브에 적용되기 위해 열전도도 및 고온강도가 높아야 하므로 탄화규소를 주원료로 하고 B4C나 C와 같은 소결조제를 소량으로 사용하여 2000℃ 이상에서 상압소결하는 소재이다.The sintering pressureless sintered silicon carbide was manufactured according to one example of the method of producing the silicon carbide sintered body according to the present invention shown in FIG. 1, and the properties such as the microstructure and thermal conductivity of each sintered specimen were investigated following the densification behavior according to the sintering assistant. Atmospheric pressure sintered silicon carbide material is a material which is mainly sintered with silicon carbide and sintered at a temperature of 2000 ℃ or higher by using a small amount of sintering auxiliary such as B 4 C or C because high heat conductivity and high temperature strength are required to be applied to a heat exchanger tube .
상압소결 탄화규소의 소결조제와 소결온도에 따른 소결특성을 살피기 위하여, 아래 표 1에서와 같이 소결조제인 B4C와 C을 각각 5 질량비%씩 각각 혹은 함께 첨가한 비교예 1 내지 4 및 실시예 1 내지 2의 조성에 대하여 일축가압성형 후의 성형밀도와 2070℃와 2160℃에서 각각 상압소결 후의 소결밀도를 평가하였다. 조성에서 C는 페놀수지 형태로 첨가되었으며 잔탄량 50%로 가정하여 조성을 계산하였다.In order to examine the sintering characteristics of the pressureless sintered silicon carbide and the sintering characteristics according to the sintering temperature, Comparative Examples 1 to 4, in which the sintering additives B 4 C and C were added at a ratio of 5 mass% The molding densities after uniaxial pressing and the sintered densities after normal pressure sintering at 2070 ° C and 2160 ° C were evaluated for the compositions of Examples 1 and 2, respectively. In the composition, C was added in the form of phenolic resin, and the composition was calculated assuming that the amount of residue was 50%.
(g/cm3)Forming density
(g / cm 3)
(%)Relative density
(%)
(g/cm3)Sintered density
(g / cm 3)
(%)Relative density
(%)
(g/cm3)Sintered density
(g / cm 3)
(%)Relative density
(%)
상기 표 1에 SSC 소재의 조성과 소결온도에 따른 성형밀도와 소결밀도 값을 보였다. 성형밀도는 시편의 직경과 두께로부터 부피를 계산하고 시편의 질량을 측정하여 계산하였다. 상대밀도는 각 조성에서부터 혼합률을 사용한 이론밀도를 기준으로 성형밀도와 소결밀도 값의 백분율을 구한 값이다.Table 1 shows the molding density and sintering density according to the composition of the SSC material and the sintering temperature. Molding density was calculated by calculating the volume from the diameter and thickness of the specimen and measuring the mass of the specimen. The relative density is a value obtained from the composition density and the percentage of the sintered density value based on the theoretical density using the mixing ratio from each composition.
상기 표 1와 도 2 내지 도 4를 참조하면, 페놀수지가 조성 내에 포함되어 가압성형시에 성형밀도가 확보된 경우에 B4C가 소결과정 중에 소결조제로서의 역할을 하는 것으로 드러났다. 예를 들어 C 혹은 B4C가 단일로 첨가된 조성(비교예 2, 비교예3)의 경우에는 소결밀도가 성형밀도에서 크게 변하지 않는 결과를 나타냈다.Referring to Table 1 and FIG. 2 to FIG. 4, it was revealed that B 4 C plays a role as a sintering aid during the sintering process when the phenolic resin is contained in the composition and the molding density is secured during the press molding. For example, in the case of a composition in which C or B 4 C is added singly (Comparative Example 2, Comparative Example 3), the sintered density is not significantly changed from the molding density.
반면에 C가 일정이상(3 질량비% 이상) 존재하여 성형밀도가 높은 시편들 중에서 B4C를 포함하는 조성에서 99%이상의 상대밀도를 보였다(실시예 1, 2).On the other hand, among the specimens having high molding densities, the relative density of 99% or more in the composition including B 4 C was present (Examples 1 and 2).
도 5는 본원 실시예 1 및 2와 비교예 4에 있어서, 2160℃에서 2시간동안 진공소결한 후 소결체의 단면미세구조를 보여주는 주사전자현미경(SEM) 결과로서, 이에 따르면 앞서 살펴본 바와 같이 높은 소결밀도를 가지는 것으로 확인된 실시예 1 및 2의 소결체는 비교예 4의 소결체와 달리 기공이 거의 관찰되지 않았다.FIG. 5 is a scanning electron microscope (SEM) showing the cross-sectional microstructure of the sintered body after vacuum sintering at 2160 ° C. for 2 hours in Examples 1 and 2 and Comparative Example 4 of the present invention, The sintered bodies of Examples 1 and 2, which were confirmed to have a density, showed almost no pores, unlike the sintered bodies of Comparative Example 4.
도 6은 본원 실시예 2와 비교예 2 및 3에 있어서, 2160℃에서 2시간동안 진공소결한 소결체 시편에 대해 온도에 따른 열전도도(thermal conductivity)를 측정한 결과로서, 앞서 살펴본 바와 같이 비교예 2 및 3에 비해 월등히 높은 소결밀도를 가지는 실시예 2의 소결체가 예상대로 현저히 높은 열전도도를 가지는 것으로 확인되었다.6 is a graph showing the results of measurement of thermal conductivity of a sintered body specimen vacuum-sintered at 2160 ° C for 2 hours in Example 2 and Comparative Examples 2 and 3. As shown above, The sintered bodies of Example 2 having significantly higher sintered densities than those of Examples 2 and 3 were found to have significantly higher thermal conductivity as expected.
Claims (7)
(b) 상기 세라믹 혼합 분말로 성형체를 제조하는 단계; 및
(c) 상기 성형체를 2000 내지 2400 ℃의 온도에서 상압소결하는 단계를 포함하는 탄화규소 소결체의 제조방법.(a) Weighing silicon carbide (SiC) powder, boron carbide (B 4 C) and a carbon-based additive, mixing and pulverizing, 90 to 96% by weight of silicon carbide; 1 to 5% by weight of boron carbide; And 3 to 5% by weight of carbon (C);
(b) preparing a shaped body from the ceramic mixed powder; And
(c) sintering the formed body at a temperature of 2000 to 2400 캜 under atmospheric pressure.
상기 탄소계 첨가제는 고분자 수지, 그라파이트, 카본블랙 또는 활성탄소로 이루어진 군으로부터 선택된 1종 이상인 것을 특징으로 하는 탄화규소 소결체의 제조방법.The method according to claim 1,
Wherein the carbon-based additive is at least one selected from the group consisting of a polymer resin, graphite, carbon black, and activated carbon.
상기 고분자 수지는 페놀계 수지인 것을 특징으로 하는 탄화규소 소결체의 제조방법.3. The method of claim 2,
Wherein the polymer resin is a phenolic resin.
상기 (c) 단계에서 상기 성형체를 2000 내지 2200 ℃의 온도에서 상압소결하는 것을 특징으로 하는 탄화규소 소결체의 제조방법.The method according to claim 1,
Wherein the shaped body is sintered at atmospheric pressure at a temperature of 2000 to 2200 ° C in the step (c).
상기 (c) 단계를 실시하기에 앞서, 상기 성형체를 600 내지 1000 ℃의 온도로 가열해 탈지처리하는 단계를 더 포함하는 것을 특징으로 하는 탄화규소 소결체의 제조방법.The method according to claim 1,
Further comprising degreasing the shaped body by heating the shaped body to a temperature of 600 to 1000 캜 before performing the step (c).
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