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KR20180129789A - 전자 디바이스 패키지용 테이프 - Google Patents

전자 디바이스 패키지용 테이프 Download PDF

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Publication number
KR20180129789A
KR20180129789A KR1020187027717A KR20187027717A KR20180129789A KR 20180129789 A KR20180129789 A KR 20180129789A KR 1020187027717 A KR1020187027717 A KR 1020187027717A KR 20187027717 A KR20187027717 A KR 20187027717A KR 20180129789 A KR20180129789 A KR 20180129789A
Authority
KR
South Korea
Prior art keywords
tape
metal layer
adhesive layer
electronic device
device package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020187027717A
Other languages
English (en)
Korean (ko)
Inventor
마사미 아오야마
지로우 스기야마
구니히꼬 이시구로
도루 사노
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Priority to KR1020257013007A priority Critical patent/KR20250065418A/ko
Publication of KR20180129789A publication Critical patent/KR20180129789A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H10W20/40—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H10W70/453—
    • H10W72/30—
    • H10W72/701—
    • H10W74/10—
    • H10W74/40—
    • H10W99/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020187027717A 2016-03-31 2016-11-25 전자 디바이스 패키지용 테이프 Ceased KR20180129789A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257013007A KR20250065418A (ko) 2016-03-31 2016-11-25 전자 디바이스 패키지용 테이프

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-072251 2016-03-31
JP2016072251A JP6429824B2 (ja) 2016-03-31 2016-03-31 電子デバイスパッケージ用テープ
PCT/JP2016/084926 WO2017168827A1 (ja) 2016-03-31 2016-11-25 電子デバイスパッケージ用テープ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020257013007A Division KR20250065418A (ko) 2016-03-31 2016-11-25 전자 디바이스 패키지용 테이프

Publications (1)

Publication Number Publication Date
KR20180129789A true KR20180129789A (ko) 2018-12-05

Family

ID=59963823

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020187027717A Ceased KR20180129789A (ko) 2016-03-31 2016-11-25 전자 디바이스 패키지용 테이프
KR1020257013007A Pending KR20250065418A (ko) 2016-03-31 2016-11-25 전자 디바이스 패키지용 테이프

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020257013007A Pending KR20250065418A (ko) 2016-03-31 2016-11-25 전자 디바이스 패키지용 테이프

Country Status (7)

Country Link
JP (1) JP6429824B2 (ja)
KR (2) KR20180129789A (ja)
CN (1) CN108885980B (ja)
MY (1) MY187765A (ja)
SG (1) SG11201807407SA (ja)
TW (1) TWI624885B (ja)
WO (1) WO2017168827A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6440657B2 (ja) * 2016-07-27 2018-12-19 古河電気工業株式会社 電子デバイス用テープ
WO2019187186A1 (ja) * 2018-03-28 2019-10-03 古河電気工業株式会社 半導体加工用テープ
JP6535118B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ
KR102789194B1 (ko) * 2020-05-12 2025-03-28 삼성전자주식회사 반도체 칩 실장용 테이프 및 상기 테이프를 이용한 반도체 패키지 제조 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4954569B2 (ja) * 2006-02-16 2012-06-20 日東電工株式会社 半導体装置の製造方法
JP2007235022A (ja) 2006-03-03 2007-09-13 Mitsui Chemicals Inc 接着フィルム
JP4157898B2 (ja) * 2006-10-02 2008-10-01 株式会社神戸製鋼所 プレス打ち抜き性に優れた電気電子部品用銅合金板
JP2008124141A (ja) * 2006-11-09 2008-05-29 Shin Etsu Chem Co Ltd ダイシング・ダイボンド用接着フィルム
JP2010120239A (ja) * 2008-11-19 2010-06-03 Nippon Steel Chem Co Ltd 金属張積層体およびその製造方法
JP5487847B2 (ja) 2009-09-25 2014-05-14 日本電気株式会社 電子デバイスパッケージ及びその製造方法、並びに電子機器
PH12012501010A1 (en) * 2009-11-30 2017-08-23 Denki Kagaku Kogyo Kk Adhesive sheet and electronic component
JP5419226B2 (ja) 2010-07-29 2014-02-19 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
JP5762556B2 (ja) * 2010-12-17 2015-08-12 スリーエム イノベイティブ プロパティズ カンパニー ヒートシール、及び電子部品をパッケージングするためのカバーテープ
JP6418756B2 (ja) * 2013-02-28 2018-11-07 善治 堀田 アルミニウム合金導体の製造方法及びアルミニウム合金導体を用いた電線の製造方法
TWI586815B (zh) * 2014-07-22 2017-06-11 新日鐵住金股份有限公司 蓄電裝置容器用鋼箔、蓄電裝置用容器及蓄電裝置、以及蓄電裝置容器用鋼箔之製造方法

Also Published As

Publication number Publication date
KR20250065418A (ko) 2025-05-12
CN108885980B (zh) 2023-04-07
TWI624885B (zh) 2018-05-21
JP6429824B2 (ja) 2018-11-28
CN108885980A (zh) 2018-11-23
TW201737369A (zh) 2017-10-16
JP2017183641A (ja) 2017-10-05
MY187765A (en) 2021-10-20
SG11201807407SA (en) 2018-09-27
WO2017168827A1 (ja) 2017-10-05

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