KR20180040691A - 초음파 진동 접합 장치 - Google Patents
초음파 진동 접합 장치 Download PDFInfo
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- KR20180040691A KR20180040691A KR1020187007581A KR20187007581A KR20180040691A KR 20180040691 A KR20180040691 A KR 20180040691A KR 1020187007581 A KR1020187007581 A KR 1020187007581A KR 20187007581 A KR20187007581 A KR 20187007581A KR 20180040691 A KR20180040691 A KR 20180040691A
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- ultrasonic vibration
- lead wire
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- H10P72/0428—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/103—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding using a roller
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
- B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/24—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/012—Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses
- H01B13/01209—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
- H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
- H01L2021/60097—Applying energy, e.g. for the soldering or alloying process
- H01L2021/60195—Applying energy, e.g. for the soldering or alloying process using dynamic pressure, e.g. ultrasonic or thermosonic bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0495—Cold welding
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- H10W72/07141—
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- H10W72/07163—
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- H10W72/07173—
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- H10W72/07183—
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- H10W72/07188—
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- H10W72/07231—
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- H10W72/07233—
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
도 2는 기판 테이블 상에 유리 기판이 배치되고, 유리 기판 상에 리드선이 접합된 상태를 도시하는 사시도이다.
도 3은 본 실시 형태의 초음파 진동 접합 장치에 의한 초음파 진동 처리의 실행 시의 상태를 모식적으로 도시하는 단면도이다.
도 4는 본 실시 형태의 초음파 진동 접합 장치에 의한 초음파 진동 처리의 비실행 시의 상태를 모식적으로 도시하는 단면도이다.
도 5는 본 실시 형태의 초음파 진동 접합 장치의 제어계를 모식적으로 도시하는 블록도이다.
도 6은 종래의 초음파 진동 접합 장치의 문제점을 지적하는 설명도이다.
도 7은 종래의 초음파 진동 접합 장치의 문제점을 지적하는 설명도이다.
4: 본딩 툴
4t: 맞닿음 선단부
6: 진동 혼부
10: 기판 테이블
11: 유리 기판
12: 리드선
15: 제어부
16: 구동부
17: 초음파 진동자
20, 30: 압박 기구
23, 33: 압박 롤러
Claims (2)
- 기판(11)을 적재하는 기판 테이블(10)과,
상기 기판 상에, 도전성을 갖는 리드선(12)을 배치한 상태에서, 상기 기판 테이블측에 소정의 압력을 가하면서, 맞닿음 선단부(4t)로부터 상기 리드선 상의 인가부(12p)에 초음파 진동을 인가하는 초음파 진동 처리를 실행하는 본딩 툴(4)과,
회전 동작이 가능한 제1 및 제2 압박 롤러(23, 33)를 갖는 제1 및 제2 압박 기구(20, 30)를 구비하고,
상기 제1 및 제2 압박 기구는,
상기 본딩 툴에 의한 상기 초음파 진동 처리의 실행 시에, 상기 리드선 상에 있어서의 상기 인가부의 양측을 상기 제1 및 제2 압박 롤러에 의하여 압박하는 압박 처리를 실행하고,
상기 본딩 툴에 의한 상기 초음파 진동 처리의 비실행 시에, 상기 제1 및 제2 압박 롤러에 의한 회전 동작을 실행시켜, 상기 리드선을 압박하면서 상기 리드선 상을 이동하는, 이동 처리를 실행하는,
초음파 진동 접합 장치. - 제1항에 있어서,
상기 제1 및 제2 압박 기구를 제어하는 제어부(15)를 더 구비하고,
상기 제어부는,
상기 제1 및 제2 압박 롤러에 의한 압박력을 가변으로 제어하는 것을 특징으로 하는,
초음파 진동 접합 장치.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2015/077423 WO2017056175A1 (ja) | 2015-09-29 | 2015-09-29 | 超音波振動接合装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180040691A true KR20180040691A (ko) | 2018-04-20 |
| KR102100067B1 KR102100067B1 (ko) | 2020-04-10 |
Family
ID=58423001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187007581A Active KR102100067B1 (ko) | 2015-09-29 | 2015-09-29 | 초음파 진동 접합 장치 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10953487B2 (ko) |
| JP (1) | JP6480595B2 (ko) |
| KR (1) | KR102100067B1 (ko) |
| CN (1) | CN108140584B (ko) |
| DE (1) | DE112015006985B4 (ko) |
| TW (1) | TWI615227B (ko) |
| WO (1) | WO2017056175A1 (ko) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4269019B1 (en) * | 2017-04-04 | 2025-07-09 | Kulicke and Soffa Industries, Inc. | Ultrasonic welding system and method of operating an ultrasonic welding system |
| EP3603826B1 (en) * | 2018-07-31 | 2023-05-10 | Infineon Technologies AG | Method for calibrating an ultrasonic bonding machine |
| KR102397667B1 (ko) * | 2018-09-20 | 2022-05-16 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 초음파 진동 접합 장치 |
| JP6769689B1 (ja) * | 2019-06-28 | 2020-10-14 | 東芝三菱電機産業システム株式会社 | 剥離把持装置、剥離検査装置及び超音波振動接合システム |
| CN111347148A (zh) * | 2020-01-15 | 2020-06-30 | 吉林大学 | 铁素体不锈钢超声波辅助焊接装置及方法 |
| KR20220160553A (ko) * | 2020-03-29 | 2022-12-06 | 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 | 와이어 본딩 머신 상의 지지 구조에 대한 반도체 소자의 클램핑 최적화 방법, 및 관련된 방법 |
| EP3974121A1 (de) * | 2020-09-23 | 2022-03-30 | Liebherr-Verzahntechnik GmbH | Vorrichtung zum automatisierten herstellen einer steckverbindung |
| CN115846451A (zh) * | 2022-11-07 | 2023-03-28 | 烟台产研鑫合新材料有限公司 | 拉拔、辊压、超声摩擦固结复合式铜基复合材料制备工艺 |
| CN117583715A (zh) * | 2023-12-04 | 2024-02-23 | 江苏阳帆机电设备制造有限公司 | 一种高速复合焊接不锈钢与异种金属的自动化设备 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04343240A (ja) * | 1991-05-20 | 1992-11-30 | Shinkawa Ltd | テープ搬送装置 |
| JPH11163041A (ja) * | 1997-11-28 | 1999-06-18 | Hitachi Ltd | 半導体集積回路装置の製造方法およびそれに使用されるボンディング装置 |
| JP2011009262A (ja) | 2009-06-23 | 2011-01-13 | Toshiba Mitsubishi-Electric Industrial System Corp | 加圧式超音波振動接合方法および加圧式超音波振動接合装置 |
| JP2011096769A (ja) * | 2009-10-28 | 2011-05-12 | Kuroda Techno Co Ltd | 半田付け方法および装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3534583B2 (ja) | 1997-01-07 | 2004-06-07 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
| US6299050B1 (en) | 2000-02-24 | 2001-10-09 | Hitachi, Ltd. | Friction stir welding apparatus and method |
| JP3788351B2 (ja) * | 2002-01-21 | 2006-06-21 | 松下電器産業株式会社 | 電子部品のボンディング装置および電子部品のボンディングツール |
| JP4697246B2 (ja) * | 2008-02-28 | 2011-06-08 | ブラザー工業株式会社 | 超音波溶着装置及び溶着体の製造方法 |
| JP2011194453A (ja) * | 2010-03-23 | 2011-10-06 | Honda Motor Co Ltd | シーム溶接方法及びその装置 |
| JP5374528B2 (ja) * | 2011-02-18 | 2013-12-25 | 三菱重工業株式会社 | 摩擦攪拌接合装置及び摩擦攪拌接合方法 |
| EP2990180B1 (en) * | 2013-06-14 | 2019-08-07 | Zuiko Corporation | Ultrasonic welding device and method of producing disposable diaper using same |
| WO2015068219A1 (ja) * | 2013-11-06 | 2015-05-14 | 東芝三菱電機産業システム株式会社 | 電極接合装置および電極接合方法 |
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2015
- 2015-09-29 JP JP2017542546A patent/JP6480595B2/ja active Active
- 2015-09-29 DE DE112015006985.2T patent/DE112015006985B4/de active Active
- 2015-09-29 KR KR1020187007581A patent/KR102100067B1/ko active Active
- 2015-09-29 CN CN201580083461.2A patent/CN108140584B/zh active Active
- 2015-09-29 WO PCT/JP2015/077423 patent/WO2017056175A1/ja not_active Ceased
- 2015-09-29 US US15/762,254 patent/US10953487B2/en active Active
-
2016
- 2016-02-04 TW TW105103750A patent/TWI615227B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04343240A (ja) * | 1991-05-20 | 1992-11-30 | Shinkawa Ltd | テープ搬送装置 |
| JPH11163041A (ja) * | 1997-11-28 | 1999-06-18 | Hitachi Ltd | 半導体集積回路装置の製造方法およびそれに使用されるボンディング装置 |
| JP2011009262A (ja) | 2009-06-23 | 2011-01-13 | Toshiba Mitsubishi-Electric Industrial System Corp | 加圧式超音波振動接合方法および加圧式超音波振動接合装置 |
| JP2011096769A (ja) * | 2009-10-28 | 2011-05-12 | Kuroda Techno Co Ltd | 半田付け方法および装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102100067B1 (ko) | 2020-04-10 |
| DE112015006985B4 (de) | 2023-10-12 |
| JP6480595B2 (ja) | 2019-03-13 |
| US20180272463A1 (en) | 2018-09-27 |
| JPWO2017056175A1 (ja) | 2018-05-10 |
| TWI615227B (zh) | 2018-02-21 |
| US10953487B2 (en) | 2021-03-23 |
| TW201711778A (en) | 2017-04-01 |
| WO2017056175A1 (ja) | 2017-04-06 |
| CN108140584B (zh) | 2021-06-01 |
| HK1249803A1 (zh) | 2018-11-09 |
| CN108140584A (zh) | 2018-06-08 |
| DE112015006985T5 (de) | 2018-06-07 |
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