KR20170026711A - Snap cure type apparatus for attaching array PCB and sus plate - Google Patents

Abstract

The present invention discloses a Snap Cure type array PCB and a SUSP plate splicing device. According to the present invention, there is provided a semiconductor device comprising: a heating jig heated to a predetermined temperature; loading means for mounting and detaching the thin metal plate and the array PCB which are mutually superimposed via an adhesive on the heating jig; And a pressing means for bonding the array PCB to the array PCB, wherein the pressing means comprises: a body having a plurality of assembly holes corresponding to the unit PCBs of the array PCB vertically, A plurality of plungers assembled so as to protrude downward from the bottom of the body to the respective holes of the array PCB to press the unit PCBs of the array PCB and elastic means for biasing the plungers downward; And elevating means for elevating and lowering the press jig to a predetermined stroke.
Since the plurality of plungers provided on the press jig are elastically barbed downwardly by the elastic means and act independently of each other, the flatness of the metal thin plate or the array PCB can be reduced, It becomes possible to reliably pressurize.

Description

[0001] The present invention relates to a snap-cure type PCB and a sus-

The present invention relates to an apparatus for connecting an array PCB for a camera module to a sus plate, and more particularly, to an apparatus for bonding an array PCB for a camera module to a sus plate by individually pressing each PCB of the array PCB on which a plurality of PCBs are arranged The present invention relates to a snap cure type PCB and a splash plate splicing device capable of uniformly and accurately splicing all the PCBs included in the array PCB regardless of the flatness of the array PCB or the splash plate.

2. Description of the Related Art In recent years, with the rapid development of electronic communication technology, various electronic communication devices such as a mobile phone, a notebook computer and a digital camera have various multimedia functions. The importance of a small camera module More and more. In particular, the demand for high-definition camera modules is increasing in accordance with the desire of consumers to enjoy smart multimedia with a variety of contents while having a small size for easy portability of smart phones.

As shown in FIG. 1, the miniature camera module M is manufactured by bonding a CCD or CMOS image sensor chip C to a thin film-like PCB B printed with a circuit of a predetermined pattern, After the object is condensed on the chip C through the lens L, the optical signal is converted into an electric signal, and the image signal is transmitted through the PCB B so that an object is displayed on a display medium such as an LCD.

In order to ensure the stability of the operation, a PCB (B) for transmitting a video signal while supplying power is very important. The PCB (B) for such a small camera module (M) It is general to take an array method in which a plurality of unit PCBs B are printed at one time on a film original plate F having a predetermined size and then cut into individual pieces.

However, since the array PCB A is very thin and flexible, bonding defects frequently occur depending on its flatness when the image sensor chips C are bonded to each unit PCB B, M). ≪ / RTI >

3, a releasing paper R on which an adhesive E such as a thermosetting epoxy is applied in a predetermined pattern is brought into contact with the thin metal sheet P, And the flatness of the array PCB B is improved when the array PCB B is joined to the image sensor chip C by joining the array PCB B onto the thin metal plate P on which the adhesive E is spread Do.

The thin metal sheet P is mainly made of stainless steel (SUS).

Fig. 4 schematically shows a conventional Snap Cure type apparatus for joining the thin metal plate P and the array PCB B in this way.

This is because when the array PCB B placed on the thin metal plate P is mounted on a boat 2 mounted on a loading jig 1 and then the boat 2 is moved to the loading jig 1 And is then horizontally and vertically conveyed to be placed on a heating jig 3 and then pressed against the unit PCBs B of the array PCB A by a press jig having a plurality of plungers 5, jig 4 is lowered to press the unit PCBs B at the same time so that the thin metal plate P and the array PCB A are integrally joined.

However, in the conventional apparatus, a plurality of plungers 5 for pressing each unit PCB B of the array PCB A are fixed to the press jig 4, and the thin metal plate P and the array PCB A ), And the like, the bonding state is inevitably affected, and there is a problem that defective bonding, in which the two are not uniformly bonded as a whole, is likely to occur. This eventually adversely affects the bonding between the image sensor chip C and the array PCB A, thereby causing the manufacturing failure of the camera module M. [

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide a method of bonding an array PCB having a plurality of PCBs to a metal thin plate, The present invention provides a snap-cure type PCB and a suscepter joining apparatus that can uniformly and accurately bond a plurality of metal plates to a metal thin plate.

In order to accomplish the above object, according to the present invention, there is provided a snap cure type PCB and a seat plate joining apparatus comprising: a heating jig heated to a predetermined temperature; and a metal thin plate and an array PCB which are overlapped with each other with an adhesive interposed therebetween, And a pressing means for pressing the array PCB from the upper portion of the heating jig so as to bond the thin metal plate and the array PCB. In the snap cure type PCB and the sus plate bonding apparatus,

The pressing means includes a body having a plurality of assembly holes vertically corresponding to the unit PCBs of the array PCB and a lower end portion projecting toward the lower side of each of the assembly holes of the body to press the unit PCBs of the array PCB A pressing jig having a plurality of plungers and elastic means for elastically biasing each plunger downward; And an elevating means for elevating and lowering the press jig to a predetermined stroke.

The press jig preferably moves along the guide means for accurate elevation, and a thermosetting epoxy resin can be used as the adhesive.

According to the present invention, since the plurality of plungers provided on the press jig are elastically barbed downward by the elastic means and act independently of each other, the metal plate or the array PCB It is possible to reliably press each unit PCB against the thin metal plate regardless of flatness.

Accordingly, it is possible to uniformly and stably bond a plurality of unit PCBs printed on the array PCB to the metal thin plate regardless of the flatness of the metal thin plate or the like, and to further minimize the defective connection of the camera module.

1 is a perspective view showing a general camera module,
2 is a plan view showing an array PCB for a camera module,
3 is a side view schematically showing an example of a manufacturing process of an array PCB for a camera module,
FIG. 4 is a side view illustrating a conventional Snap Cure type PCB and a SUS plate splicing device,
5 is a perspective view illustrating a snap cure type PCB and a seat plate splicing device according to the present invention.
6 is an exploded perspective view showing the loading means of the bonding apparatus according to the present invention,
Fig. 7 is a perspective view of the coupled state of Fig. 6,
8 is an exploded perspective view showing a boat of the joining apparatus according to the present invention,
9 is a front view showing the pressing means of the bonding apparatus according to the present invention,
10 is an exploded perspective view showing a press jig of a bonding apparatus according to the present invention,
11 is an excerptable cross-sectional view showing the engagement state of Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following description of the preferred embodiments with reference to the attached drawings. And a portion not shown will be described with reference to Figs.

5 to 11, a snap cure type PCB and suscepter joining apparatus according to the present invention includes a main body 10, a thin metal plate P on which an adhesive E is applied and an array PCB A, And a heating jig 40 (hereinafter referred to as " array PCB ") for supporting the thin metal plate P and the array PCB A Loading means 30 for loading and unloading the boat 20 on which the array PCB assembly A is mounted onto the heating jig 40 and array PCB assembly A mounted on the heating jig 40, A pressing means 50 for completely pressing the metal thin plate P and the array PCB A by pressing the metal thin plate P and the array PCB A from above and a lifting means for lifting the press means 50 by a press cylinder 58 .

The main body 10 is provided with a table 11 for loading and unloading the array PCB assembly A to be joined to the front side of the opening portion. The main body 10 is provided with a control panel 13 having various operation switches 13 such as on / off.

The boat 20 includes a plate-shaped carrier body 21 on which the array PCB assembly A is mounted and a cover plate 24 for gripping the edge portions of the array PCB assembly A placed on the carrier body 21 ).

The carrier body 21 is formed with an opening 21a through which a heating jig 40 is inserted at the center so as to support the array PCB assembly A, And a plurality of pilot pins 22 are provided at appropriate intervals so as to be fitted in the fixing holes H to set the seating position of the array PCB assembly A.

Handle brackets 23 for gripping the boats 20 are provided on both sides of the carrier body 21, respectively.

The cover plate 24 also has an opening 24a at the center so that the array PCB assembly A is exposed upwardly so that the plungers 53 of the press jig 51 described below press the array PCB assembly A, And the edge portion has a plurality of fixing holes 24b through which the pilot pins 22 of the carrier body 21 are fitted.

The loading means 30 includes a base plate 31 having a pair of guide rails 32 arranged in the front and rear direction on the upper surface thereof and a pair of guide blocks 32 movably coupled to the guide rails 32, A loading plate 34 mounted on the guide block 33 so as to be able to move up and down and a first cylinder 37 reciprocating the loading plate 34 forward and backward.

The base plate 31 is horizontally mounted to the main body 10 and the guide block 33 is preferably movably coupled to the guide rail 32 with an LM guide 33a on the bottom surface for precise transport . Each guide block 33 has guide bushes 33b on the front and back sides thereof for smoothly lifting and lowering the loading plate 34. [

The loading plate 34 is vertically supported on the guide bush 33b of the guide block 33 by vertically arranging the guide pins 36 at the four corners of the lower surface of the guide block 33. At least one guide block 33 And the second cylinder 35 is provided to move up and down with respect to the guide block 33. An opening 34a is formed at the center of the loading plate 34 so that a die 42 of a heating jig 40 described later can be inserted.

The first cylinder 37 is provided on the base plate 31 and has a bracket 37a fixed to the lower surface of the loading plate 34 in the cylinder rod to transport the loading plate 34 in the forward and backward directions.

Front and rear stoppers 38 and 39 are provided on the front and rear ends of the guide rail 32 to limit the movement stroke of the loading plate 34 by limiting the back and forth movement of the guide block 33.

The heating jig 40 is provided with a press jig 41 having a die 42 for supporting the array PCB assembly A from below on the upper surface thereof and a support block 44 to be described later on which the press jig 41 is mounted. And a fixing plate 43 fixed on the base plate.

The die 42 has an irregular top surface so that a plurality of unit PCBs B printed on the array PCB assembly A can be bonded more reliably. In the interior of the die 42, a heating means (not shown) such as a hot wire is embedded for fixing the thermosetting adhesive E transferred on the thin metal plate P of the array PCB assembly A.

Two support blocks 44 are provided so as to be spaced laterally from the upper surface of the base plate 31 of the loading means 30 so as to be located inside the guide rail 32. The support block 44 is positioned at an appropriate level so that the loading plate 34 can seat the array PCB assembly A on the die 42 of the heating jig 40 with a minimum lift stroke .

9, the press means 50 includes a press jig 51 for pressing and raising the array PCB assembly A placed on the die 42 of the heating jig 40 from above, A press cylinder 58 for raising and lowering the jig 51 to a predetermined stroke and an elevation guide 60 for guiding the up and down movement of the press jig 51.

The press jig 51 includes a press jig 51 mounted on a cylinder rod of a press cylinder 58 through a moving plate 62 of a lift guide 60 described later according to a feature of the present invention, And a plurality of plungers 53 which protrude downward from the bottom surface 51 of the array PCB assembly A to individually contact the upper surfaces of the unit PCBs B of the array PCB assembly A and elastically press each of them.

The press jig 51 may be formed of a single body but is preferably formed on the top of a striper 52 for supporting a plurality of plungers 53 on a frame- A spacer 54 is provided and a spring support plate 55 for supporting the spring 56 is stacked on the spacer 54. [ Further, at least one adjustment plate 57 (57a, 57b) for adjusting the level of the plunger 53 may be further provided on the upper side of the spring support plate 55.

A plurality of assembly holes 52a are arranged in the press jig 51 so as to correspond to a plurality of unit PCBs B printed on the array PCB assembly A and plungers 53 are mounted on the assembly holes 52a Respectively. The plunger 53 has a head portion 53a at an upper end thereof and is engaged with an assembling hole 52a of the stripper 52 so that the plunger 53 protrudes only a predetermined length below the stripper 52. The head portion 53a, And a plurality of springs 56 for elastically biasing the respective plungers 53 downward are provided between the upper and lower plates 55, respectively.

For this, a spring groove 56a is formed on the upper surface of the head portion 53a and the bottom surface of the spring support plate 55 for stably inserting the respective springs 56.

On the other hand, the press cylinder 58 is vertically fixed on a cylinder mounting plate 59 fixed to the upper ends of the guide posts 61 of a lift guide 60 described later, and the cylinder rod is projected downward, 60 to move the press jig 51 up and down.

The elevation guide 60 includes four guide posts 61 fixed in a rectangular shape in the main body 10 and movable to the guide posts 61 so as to be connected to the cylinder rod of the press cylinder 59 And a moving plate 62 ascending and descending along the guide post 61.

It is preferable to connect the guide bushes 63 to the respective guide posts 61 and secure the moving plate 62 to these guide bushes 63 for more smooth elevation of the moving plate 62.

Next, operation of the snap cure type array PCB and the sus plate bonding apparatus according to the present invention having such a structural feature will be described.

First, as shown in Fig. 3, a thin metal plate P in which the adhesive agent E is transferred on one side is placed on the carrier body 21 of the boat 20, And the array PCB A on which a plurality of unit PCBs B are printed in a predetermined pattern is laminated on the metal thin plate P. At this time, the thin metal plate P and the array PCB A are precisely set by the plurality of pilot pins 22 provided on the carrier body 21.

In this state, the cover plate 24 of the boat 20 is coupled to the upper side of the array PCB A to fix the array PCB assembly A so as not to flow.

Next, the boat 20 on which the array PCB assembly A is mounted is mounted on the loading plate 34, and the apparatus is operated by operating the control panel 12 provided on the main body 10. The loading plate 34 is then moved backward along the guide rail 32 by the first cylinder 37 of the loading means 30 and transported directly above the heating jig 40.

The boat 20 is lowered by the second cylinder 35 provided in the guide block 33 of the loading means 30 after the boat 20 is transported directly above the heating jig 40. [ Then, the array PCB assembly A is placed on the die 42 of the heating jig 40 through the opening 21a of the carrier body 21, thereby completing the loading.

When the loading of the array PCB assembly A is completed, the press jig 51 is lowered by the press cylinder 58 to move the plunger 53 through the opening 24a formed in the cover plate 24 of the boat 20, The upper surface of the array PCB assembly A is pressed.

Since the plungers 53 of the present invention are vertically coupled to the stripper 52 and elastically biased downward by the respective springs 56, the elastic force of the springs 56 together with the hydraulic pressure of the press cylinders 58 . Therefore, even if the flatness of the thin metal plate P, etc. of the array PCB assembly A is not uniform as a whole, the elasticity of the spring 56 acting on the plungers 53 individually, So that the unit PCBs (B) can be reliably pressed.

Accordingly, unlike the related art, a problem that the bonding failure occurs in some unit PCBs (B) due to the flatness of the array PCB (B) or the thin metal plate (P) is reliably prevented.

10: main body 20: boat
30: loading means 32: guide rail
33: guide block 34: loading plate
35: second cylinder 37: first cylinder
40: Heating jig 42: Die
50: press means 51; Press jig
52: Stripper 52a: Assembly hole
53: plunger 56: spring
58: press cylinder 60: lift guide
A: Array PCB P: Metal foil
E; Adhesive H: Fixing hole
M: Camera module

Claims (4)

Loading means for placing and removing the metal foil and the array PCB superimposed on each other via the adhesive on the heating jig and pressing the array PCB at the top of the heating jig to press the metal foil and the array PCB And a pressing means for joining the bottom plate and the bottom plate to each other,
Wherein the press means comprises:
A body having a plurality of assembly holes corresponding to the unit PCBs of the array PCB vertically and a plurality of assembly holes each of which is assembled so as to protrude downward from a lower end of each of the assembly holes of the body, A pressing jig having a plunger of the plunger and an elastic means for elastically biasing the plungers downward;
And elevating means for elevating and lowering the press jig to a predetermined stroke by a press cylinder.
The method according to claim 1,
The pressing jig includes a stripper for supporting the plunger, a spacer for providing a space for the elastic means on the upper side of the stripper, a spring support plate provided on the upper side of the spacer, and an adjustment plate provided on the upper side of the spring support plate Wherein the first and second substrates are laminated.
The method of claim 2,
Wherein the elastic means is a spring, and a spring groove for receiving the upper and lower ends of the spring is formed on an upper end of the plunger and a bottom surface of the spring support plate.
The method according to claim 1,
A moving plate mounted on the upper side of the press jig and being lifted and lowered by the press cylinder and a lifting guide comprising a plurality of guide posts for vertically guiding the lifting plate and guiding the lifting and lowering of the press jig Cure type PCB and SUSP plate joint device.

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