KR20150045077A - Light emitting device package and backlight unit having it - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device package and a backlight unit having the same, which can be used for lighting or display applications, A first light emitting device mounted at a first position of the substrate to be electrically connected to the substrate, the first light emitting device generating a first color light; A second light emitting device mounted on a second location of the substrate to be electrically connected to the substrate, the second light emitting device generating a second color light; A third light emitting device mounted at a third position of the substrate to be electrically connected to the substrate, the third light emitting device generating a third color light; And the first color light of the first light emitting device, the second color light of the second light emitting device, and the third color light of the third light emitting device are mixed to be converted into the fourth color light, And a light path guide member formed to surround the seating surface including the first position, the second position, and the third position, wherein the first light emitting device includes a first LED chip, The second light emitting device includes a second LED chip, and the third light emitting device includes a third LED chip, and the first LED chip, the second LED chip, and the third LED chip And may be in the form of a flip chip.

Description

[0001] Light emitting device package and backlight unit having same [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device package and a backlight unit having the same, and more particularly, to a light emitting device package and a backlight unit having the same.

A light emitting diode (LED) is a kind of semiconductor device that can emit light of various colors by forming a light emitting source through the formation of a PN diode of a compound semiconductor. Such a light emitting device has a long lifetime, can be reduced in size and weight, has a strong directivity of light, and can be driven at a low voltage. Further, such an LED is resistant to impact and vibration, does not require preheating time and complicated driving, can be packaged in various forms, can be modularized for various purposes, and can be applied to various lighting devices and display devices.

In the conventional light emitting device package, when the LED chip is in the form of a lateral chip, since the gold wire is used as a signal transmitting member, the entire inside of the cup must be filled with the sealing material, Use was inevitable.

In addition, when white light is realized by combining RGB chips related to a conventional multi-chip, cups are manufactured around each chip, and the chips are simply listed to reduce color conversion efficiency And positional defects.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a color display device capable of significantly improving a color conversion rate, enabling color dimming and color rendering, greatly increasing a light quantity and a light efficiency, And a backlight unit having the light emitting device package. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a light emitting device package including: a substrate; A first light emitting device mounted at a first position of the substrate to be electrically connected to the substrate, the first light emitting device generating a first color light; A second light emitting device mounted on a second location of the substrate to be electrically connected to the substrate, the second light emitting device generating a second color light; A third light emitting device mounted at a third position of the substrate to be electrically connected to the substrate, the third light emitting device generating a third color light; And the first color light of the first light emitting device, the second color light of the second light emitting device, and the third color light of the third light emitting device are mixed to be converted into the fourth color light, And a light path guide member formed to surround the seating surface including the first position, the second position, and the third position, wherein the first light emitting device includes a first LED chip, The second light emitting device includes a second LED chip, and the third light emitting device includes a third LED chip, and the first LED chip, the second LED chip, and the third LED chip And may be in the form of a flip chip.

Also, according to an aspect of the present invention, the first LED chip, the second LED chip, and the third LED chip may generate light of the same wavelength.

According to an aspect of the present invention, the first LED chip, the second LED chip, and the third LED chip are blue LED chips, and the second light emitting device emits blue light of the second LED chip And a red phosphor emitting red fluorescence, wherein the third light emitting device further comprises a green phosphor which emits green fluorescence by receiving the blue light of the third LED chip.

According to an aspect of the present invention, the red phosphor and the green phosphor are coated on the adhesive sheet bonded to the second LED chip and the third LED chip, respectively, or on the second LED chip and the third LED chip, respectively Or the like.

In addition, according to an aspect of the present invention, the substrate may include a first electrode connected to the first electrode and a second electrode of the first light emitting device so as to enable individual dimming control of the first light emitting device, And a 1-2 electrode; A second-first electrode and a second-second electrode respectively connected to the first electrode and the second electrode of the second light emitting device so as to enable individual dimming control of the second light emitting device; And a third-1 electrode and a third-second electrode respectively connected to the first electrode and the second electrode of the third light emitting device so as to enable individual dimming control of the third light emitting device.

According to an aspect of the present invention, the substrate may include a first electrode of the first light emitting device and a second electrode of the first light emitting device so that the first light emitting device, the second light emitting device, A first integrated electrode connected to the first electrode of the second light emitting device and the first electrode of the third light emitting device; And a second integrated electrode connected to a second electrode of the first light emitting device, a second electrode of the second light emitting device, and a second electrode of the third light emitting device.

Further, according to an aspect of the present invention, the optical path guide member surrounds the rim of the seating surface on which the first light emitting device, the second light emitting device, and the third light emitting device are placed, And the second light emitting device and the third light emitting device are opened.

According to an aspect of the present invention, the first light emitting device, the second light emitting device, and the third light emitting device may be arranged in three rows side by side.

According to an aspect of the present invention, the first light emitting device, the second light emitting device, and the third light emitting device may be arranged at three points with a triangular shape.

Further, according to the idea of the present invention, a plurality of the first light emitting device, the second light emitting device, and the third light emitting device may be respectively provided and alternately arranged in a circular shape and multipoint.

According to another aspect of the present invention, there is provided a backlight unit having a light emitting device package, the backlight unit including: a substrate; A first light emitting device mounted at a first position of the substrate to be electrically connected to the substrate, the first light emitting device generating a first color light; A second light emitting device mounted on a second location of the substrate to be electrically connected to the substrate, the second light emitting device generating a second color light; A third light emitting device mounted at a third position of the substrate to be electrically connected to the substrate, the third light emitting device generating a third color light; And the first color light of the first light emitting device, the second color light of the second light emitting device, and the third color light of the third light emitting device are mixed to be converted into the fourth color light, And a light path guide member formed to surround the seating surface including the first position, the second position, and the third position, wherein the first light emitting device includes a first LED chip, The second light emitting device includes a second LED chip, and the third light emitting device includes a third LED chip, and the first LED chip, the second LED chip, and the third LED chip May be in the form of a flip chip.

According to some embodiments of the present invention as described above, a wire is omitted using a flip chip, a chip is directly contacted with an adhesive sheet or a phosphor in the form of a coating layer, and the chips are arranged in a triangular arrangement or a circle, For dimming and color rendering by individually controlling each chip and by broadening the half width of the output optical frequency to thereby greatly increase the light quantity and the light efficiency, It has an effect that can be utilized. Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view illustrating a light emitting device package according to some embodiments of the present invention.
2 is a plan view of the light emitting device package of FIG.
3 is a cross-sectional view showing a III-III cross-sectional view of the light emitting device package of FIG.
4 is a cross-sectional view of a light emitting device package of FIG. 1 taken along line IV-IV.
5 is a plan view illustrating a light emitting device package according to some other embodiments of the present invention.
6 is a cross-sectional view showing an adhesive sheet according to another example of Fig.
7 is a cross-sectional view showing an adhesive sheet according to another example of Fig.
Figs. 8 to 10 are plan views showing various electrode arrangements. Fig.
11 is a plan view showing a light emitting device package according to still another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It will be appreciated that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, if the element is inverted in the figures, the elements depicted as being on the upper surface of the other elements will have a direction on the lower surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

1 is a perspective view illustrating a light emitting device package 100 according to some embodiments of the present invention. 2 is a plan view of the light emitting device package 100 of FIG. 1, FIG. 3 is a cross-sectional view of the light emitting device package 100 of FIG. 1 taken along line III-III, Sectional view taken along line IV-IV of Fig.

1 to 4, a light emitting device package 100 according to some embodiments of the present invention includes a substrate 10, a first light emitting device E1, a second light emitting device E1, (E2), a third light emitting device (E3), and an optical path guide member (30).

The substrate 10 is electrically connected to the first light emitting device E1, the second light emitting device E2 and the third light emitting device E3 described above. The first light emitting device E1 The second light emitting device E2, the third light emitting device E3, and the optical path guide member 30, and may be made of a material having an appropriate mechanical strength and conductivity or an insulating material.

For example, the substrate 10 may include a plurality of (preferably two or more) light emitting devices E1, E2, and E3 based on electrode separation lines so that the first light emitting device E1, the second light emitting device E2, And may be a lead frame made of a metal such as copper or aluminum, which is divided into electrode pairs.

More specifically, for example, as shown in FIGS. 1 to 4, the substrate 10 includes a pair of first 1-1 electrodes 11-1 and 1-2 electrodes 11-2, A pair of the second-first electrode 12-1 and the second-second electrode 12-2, a pair of the third-first electrode 13-1, and the third-second electrode 13-2 .

2, the first 1-1 electrode 11-1 and the 1-2 first electrode 11-2 are connected to the first light emitting device E1 (1) by using the first controller CTL1, The first electrode B1 and the second electrode B2 of the first light emitting device E1 may be connected to the first electrode B1 and the second electrode B2, respectively.

The second-first electrode 12-1 and the second-second electrode 12-2 are controlled so that the individual dimming control of the second light emitting device E2 can be performed using the second controller CTL2 May be respectively connected to the first electrode (B1) and the second electrode (B2) of the second light emitting device (E2).

The third-first electrode 13-1 and the third-second electrode 13-2 are controlled so that the individual dimming control of the third light emitting device E3 can be performed using the third controller CTL3 May be connected to the first electrode (B1) and the second electrode (B2) of the third light emitting device (E3), respectively.

Therefore, when the first controller CTL1, the second controller CTL2, and the third controller CTL3 are used, the first light emitting device E1, the second light emitting device E2, The third light emitting devices E3 may be individually dimmed so that the colors can be mixed and displayed in various colors or brightness.

On the other hand, the substrate 10 includes an epoxy resin sheet (not shown) in which various wiring layers are formed to connect the first light emitting device E1, the second light emitting device E2, and the third light emitting device E3 with an external power source. A printed circuit board (PCB) having a plurality of layers formed thereon. The substrate 10 may be a Flexible Printed Circuit Board (FPCB) made of a flexible material.

In addition, the substrate 10 may be a synthetic resin substrate such as a resin or a glass epoxy or a ceramic substrate in consideration of a thermal conductivity. In addition, the substrate 10 may be formed of an insulating material such as aluminum, copper, zinc, tin, A metal substrate such as silver can be applied, and a plate or a lead frame substrate can be applied.

The substrate 10 may be made of at least one selected from EMC (Epoxy Mold Compound), PI (polyimide), ceramic, graphene, glass synthetic fiber and combinations thereof to improve workability have.

In addition, although not shown in the figure, the wiring layer may be provided in the form of a conductive layer pattern. The wiring layer may be made of at least one selected from copper, aluminum, and combinations thereof, which are excellent in thermal conductivity and relatively inexpensive materials.

At this time, such a pattern forming method may be thermocompression processing, plating processing, adhesive processing, sputtering processing, other etching processing, printing processing, spray processing and the like.

1 to 4, the first light emitting device E1 is mounted at a first position of the substrate 10 so as to be electrically connected to the substrate 10, (L1), and may include a first LED chip (C1).

The second light emitting device E2 is mounted on the substrate 10 at a second position to be electrically connected to the substrate 10 and generates a second color light L2, And an LED chip C2.

The third light emitting device E3 is mounted at a third position of the substrate 10 to be electrically connected to the substrate 10 and generates a third color light L3, And an LED chip C3.

Here, the first LED chip C1, the second LED chip C2, and the third LED chip C3 may be in the form of a flip chip that does not require wires.

For example, the first LED chip C1, the second LED chip C2, and the third LED chip C3 all have the same wavelength in consideration of productivity, assemblability, unit cost, and the like The first LED chip C1, the second LED chip C2, and the third LED chip C3 may be a blue LED chip B, as shown in FIG.

1 to 4, the second light emitting device E2 further includes a red phosphor (RP) that emits red fluorescence by receiving the blue light of the second LED chip C2 The third light emitting device E3 may further include a green phosphor GP that emits blue light of the third LED chip C3 and emits green fluorescence.

3 and 4, the red phosphor RP and the green phosphor GP are formed on the second LED chip C2 and the third LED chip C3, respectively, (SH) to be adhered to the adhesive sheet (SH).

In addition, the red phosphor RP and the green phosphor GP may be coating layers applied to the second LED chip C2 and the third LED chip C3, respectively.

4, the operation of the light emitting device package 100 according to some embodiments of the present invention will be described. In the light emitting device package 100 according to some embodiments of the present invention, 1 The light emitting device E1 can generate the first color light L1 of the blue light series generated from the first LED chip C1.

The second light emitting device E2 emits light of the blue light system generated from the second LED chip C2 to the second color light L2 of the red light system by using the red phosphor RP, Can be generated.

The third light emitting device E3 also emits light of the blue light system generated from the third LED chip C3 to the third color light L3 Can be generated.

4, the first color light L1 of the first light emitting device E1, the second color light L2 of the second light emitting device E2, and the third color light L2 of the second light emitting device E2, The third color light L3 of the third color light E3 may be mixed into RGB and converted into a white color or a daylight color of the fourth color light L4.

Here, the blue light of the first light emitting device E1 is relatively widely used and utilizes the light generated from the blue LED chip forming a cheap unit price as it is. Since the half width of the frequency is narrow, The light efficiency may be somewhat low. However, blue light is excellent in visibility and can have excellent discriminating power even at a low light efficiency.

Further, the red light of the second light emitting device E2 can be formed by using the light emitted from the blue LED chip, which is relatively widespread and inexpensive, without using expensive red chips, It is converted into fluorescence having a half full width of the frequency by using the phosphor (RP) and used. As a result, the optical efficiency is high and excellent discrimination power can be obtained.

Further, the green light of the third light emitting device E3 can be obtained without using a costly green chip, without using the light generated from the blue LED chip which is relatively widespread and low cost, It is converted into fluorescence having a half full width of the frequency by using the phosphor (GP), and it is high in light efficiency and can have excellent discrimination power.

 Meanwhile, the first LED chip C1, the second LED chip C2, and the third LED chip C3 described above may all be light emitting devices emitting blue light of the same wavelength.

1, the first LED chip C1, the second LED chip C2, and the third LED chip C3 are mounted on the substrate 10, And the three chips are placed on top of each other.

In addition, a plurality of chips may be mounted on the substrate 10.

The light emitting device may be formed of a semiconductor. For example, LEDs of blue, green, red, and yellow light emission, and LEDs of ultraviolet light emission, which are made of a nitride semiconductor, can be applied. The nitride semiconductor is represented by a general formula Al _x Ga _y In _z N (0? X? 1, 0? Y? 1, 0? Z? 1, x + y + z = 1).

The light emitting element is formed by epitaxially growing a nitride semiconductor such as InN, AlN, InGaN, AlGaN, or InGaAlN on a sapphire substrate for growth or a silicon carbide substrate by a vapor phase growth method such as MOCVD can do. The light emitting device 20 may be formed using semiconductors such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, and AlInGaP in addition to the nitride semiconductor. These semiconductors can be stacked in the order of an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer. The light emitting layer (active layer) may be a laminated semiconductor having a multiple quantum well structure or a single quantum well structure or a laminated semiconductor having a double hetero structure. In addition, the light emitting device 20 can be selected to have an arbitrary wavelength depending on the application such as display use and illumination use.

Here, as the growth substrate, an insulating, conductive or semiconductor substrate may be used if necessary. For example, the growth substrate may be sapphire, SiC, Si, MgAl 2 O 4, MgO, LiAlO 2, LiGaO 2, GaN. A GaN substrate, which is a homogeneous substrate, is preferable for epitaxial growth of a GaN material, but a GaN substrate has a problem of high production cost due to its difficulty in manufacturing.

Sapphire and silicon carbide (SiC) substrates are mainly used as the different substrates. Sapphire substrates are more utilized than expensive silicon carbide substrates. When using a heterogeneous substrate, defects such as dislocation are increased due to the difference in lattice constant between the substrate material and the thin film material. Also, due to the difference in the thermal expansion coefficient between the substrate material and the thin film material, warping occurs at a temperature change, and warping causes a crack in the thin film. This problem may be reduced by using a buffer layer between the substrate and the GaN-based light emitting laminate.

In addition, the substrate for growth may be completely or partially removed or patterned in order to improve the optical or electrical characteristics of the LED chip before or after the growth of the LED structure.

For example, in the case of a sapphire substrate, the substrate can be separated by irradiating the laser to the interface with the semiconductor layer through the substrate, and the silicon or silicon carbide substrate can be removed by a method such as polishing / etching.

Another supporting substrate may be used for removing the growth substrate. In order to improve the light efficiency of the LED chip on the opposite side of the growth substrate, the supporting substrate may be bonded using a reflective metal, As shown in FIG.

In addition, patterning of the growth substrate improves the light extraction efficiency by forming irregularities or slopes before or after the LED structure growth on the main surface (front surface or both sides) or side surfaces of the substrate. The size of the pattern can be selected from the range of 5 nm to 500 μm and it is possible to make a structure for improving the light extraction efficiency with a rule or an irregular pattern. Various shapes such as a shape, a column, a mountain, a hemisphere, and a polygon can be adopted.

In the case of the sapphire substrate, the crystals having a hexagonal-rhombo-cubic (Hexa-Rhombo R3c) symmetry have lattice constants of 13.001 and 4.758 in the c-axis direction and the a-axis direction, respectively, and have C plane, A plane and R plane. In this case, the C-plane is relatively easy to grow the nitride film, and is stable at high temperature, and thus is mainly used as a substrate for nitride growth.

Another material of the growth substrate is a Si substrate, which is more suitable for large-scale curing and relatively low in cost, so that mass productivity can be improved.

In addition, since the silicon (Si) substrate absorbs light generated from the GaN-based semiconductor and the external quantum efficiency of the light emitting device is lowered, the substrate may be removed as necessary, and Si, Ge, SiAl, A support substrate such as a metal substrate is further formed and used.

When a GaN thin film is grown on a different substrate such as the Si substrate, the dislocation density increases due to the lattice constant mismatch between the substrate material and the thin film material, and cracks and warpage Lt; / RTI > The buffer layer may be disposed between the growth substrate and the light emitting stack for the purpose of preventing dislocation and cracking of the light emitting stack. The buffer layer also functions to reduce the scattering of the wavelength of the wafer by adjusting the degree of warping of the substrate during the growth of the active layer.

Here, the buffer layer may be made of Al _x In _y Ga _1-xy N (0? X? 1, 0? _Y? 1, x + y? 1), in particular GaN, AlN, AlGaN, InGaN or InGaNAlN. Materials such as ZrB2, HfB2, ZrN, HfN and TiN can also be used as needed. Further, a plurality of layers may be combined, or the composition may be gradually changed.

Further, although not shown, the light emitting element may be a flip chip type light emitting element having a signal transmitting medium such as a bump, a pad, or a solder.

On the other hand, the light path guide member 30 is arranged so that the first color light L1 of the first light emitting device E1, the second color light L2 of the second light emitting device E2, The second position and the third position of the substrate 10 so that the third color light L3 of the light emitting device E3 is mixed and converted into the fourth color light L4, And may be formed in a shape surrounding the seating surface 10a.

1 to 4, the light path guide member 30 includes the first light emitting device E1, the second light emitting device E2, and the third light emitting device E3, An opening 30a which surrounds the rim of the seating surface 10a on which the first light emitting device E2 and the third light emitting device E3 are mounted and which opens above the first light emitting device E1 and the second light emitting device E2 and the third light emitting device E3, May be formed, and may be a light reflective sealing material or a white sealing material or a transparent sealing material on which the inclined surface 31 is formed.

1, the light path guide member 30 is provided on the substrate 10 so as to surround the periphery of the light emitting element, It can be installed in the light path of the device.

1, the optical path guide member 30 may have a rectangular block shape whose top surface is concave as a whole, for example. In addition, the optical path guide member 30 can be in various forms such as a circular block, a triangular column block, a square column block, a pentagonal column, a hexagonal columnar shape, a polygonal columnar shape, an elliptical columnar shape, a composite columnar shape, have. Therefore, the shape of the light path guide member 30 of the light emitting device package 100 according to some embodiments of the present invention is not limited to the shape shown in FIG.

Further, the optical path guide member 30 may be molded on the substrate 10, or may be dispensed or screen-printed.

More specifically, for example, the optical path guide member 30 may be formed of a modified epoxy resin composition such as an epoxy resin composition, a silicone resin composition, or a silicone modified epoxy resin, or a modified silicone resin composition such as an epoxy modified silicone resin , A polyimide resin composition, a modified polyimide resin composition, polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin and PBT resin Resin or the like may be applied.

It is also possible to add a light reflective reflecting material such as titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, chromium, . That is, as described above, the light path guide member 30 may be a reflective or translucent encapsulant.

In addition, the shape of the light path guide member 30 may vary widely. Therefore, the shape of the light path guide member 30 of the light emitting device package 100 according to some embodiments of the present invention is not limited to the shape shown in FIG.

The light emitting device package 100 according to some embodiments of the present invention may further include a first zener chip Z1, diode, a second zener chip Z2, and a third zener chip Z3.

For example, as shown in FIGS. 1 to 4, the first zener chip Z1 includes a pair of the first 1-1 electrode 11-1 and the 1-2 first electrode 11-2, And the second zener chip Z2 may be electrically connected to the pair of the second-first electrodes 12-1 and the second-second electrodes 12-2, The third zener chip Z3 may be electrically connected to a pair of the third-first electrode 13-1 and the third-second electrode 13-2.

Therefore, by using the first LED chip C1 and the second LED chip C1 described above using the first zener chip Z1, the second zener chip Z2 and the third zener chip Z3, C2 and the third LED chips C3 can be safely protected from static electricity or electromagnetic waves.

Meanwhile, as shown in FIG. 2, the first light emitting device E1, the second light emitting device E2, and the third light emitting device E3 may be arranged in three rows side by side. Here, the first light emitting device E1, the second light emitting device E2, and the third light emitting device E3 may be arranged in a row in the same direction in the longitudinal direction, .

5 is a plan view illustrating a light emitting device package 200 according to some other embodiments of the present invention.

As shown in FIG. 5, the first light emitting device E1, the second light emitting device E2, and the third light emitting device E3 may be arranged at three points with a triangle.

Therefore, in the triangular arrangement method, the distance between the first light emitting device E1 and the second light emitting device E2 and the distance between the first light emitting device E1 and the third light emitting device E3 The distance may be closer than the array method.

Therefore, the closer the distance between the light emitting devices is, the more advantageous for color mixing. Therefore, the light emitting device packages of the present invention using such a triangular arrangement method are advantageous for color mixing, thereby enhancing color expressing power and enabling accurate and delicate color representation.

Fig. 6 is a cross-sectional view showing an adhesive sheet SH according to another example of Fig. 3, and Fig. 7 is a cross-sectional view showing an adhesive sheet SH according to another example of Fig.

3 and 4, the red phosphor RP and the green phosphor GP are formed on the upper surfaces of the second LED chip C2 and the third LED chip C3, respectively, May be in the form of an adhesive sheet (SH) having an upper surface adhesive sheet (SH-1) to be adhered.

6 and 7, the red phosphor RP and the green phosphor GP are formed on the upper surfaces of the second LED chip C2 and the third LED chip C3, respectively, May be in the form of an adhesive sheet SH having an upper surface adhesive sheet SH-1 to be adhered and a side adhesive sheet SH-2 adhered to the side surface, respectively.

The adhesive sheet SH may be separately cut and adhered separately to the upper surface and the side surface of the second LED chip C2 and the third LED chip C3, A groove into which the third LED chip (C3) can be inserted is formed on the adhesive sheet (SH) and bonded together at the same time.

The red phosphors (RP) and the green phosphors (GP) may have the following composition formula and color.

Oxide system: yellow and green Y3Al5O12: Ce, Tb3Al5O12: Ce, Lu3Al5O12: Ce

(Ba, Sr) 2SiO4: Eu, yellow and orange (Ba, Sr) 3SiO5: Ce

Eu, Sr2Si5N8: Eu, SrSiAl4N7: Eu, Eu3O3: Eu, Eu3O3: Eu,

The composition of the phosphor should basically correspond to stoichiometry, and each element may be substituted with another element in each group on the periodic table. For example, Sr can be substituted with Ba, Ca, Mg, etc. of the alkaline earth (II) group, and Y can be replaced with lanthanum series of Tb, Lu, Sc, Gd and the like. Ce, Tb, Pr, Er, Yb and the like, and the active agent may be used alone or as a negative active agent for the characteristic modification.

As a substitute for the phosphor, materials such as a quantum dot may be used. Alternatively, a fluorescent material and QD may be mixed with the LED or used alone.

QD can be composed of a core (3 to 10 nm) such as CdSe and InP, a shell (0.5 to 2 nm) such as ZnS and ZnSe, and a ligand for stabilizing the core and the shell. Can be implemented.

In addition, the coating method of the fluorescent material or the quantum dot may include at least one of a method of being applied to an LED chip or a light emitting device, a method of covering the material in a film form, a method of attaching a sheet form such as a film or a ceramic fluorescent material .

Dispensing and spray coating are common methods of spraying, and dispensing includes mechanical methods such as pneumatic method and screw, linear type. It is also possible to control the amount of dyeing through a small amount of jetting by means of a jetting method and control the color coordinates thereof. The method of collectively applying the phosphor on the wafer level or the light emitting device substrate by the spray method can easily control productivity and thickness.

The method of directly covering the light emitting device or the LED chip in a film form can be applied by a method of electrophoresis, screen printing or phosphor molding, and the method can be different according to necessity of application of the side of the LED chip.

In order to control the efficiency of the long-wavelength light-emitting phosphor that reabsers light emitted from a short wavelength among two or more kinds of phosphors having different emission wavelengths, two or more kinds of phosphor layers having different emission wavelengths can be distinguished. A DBR (ODR) layer may be included between each layer to minimize absorption and interference.

In order to form a uniform coating film, the phosphor may be formed into a film or ceramic form and then attached onto the LED chip or the light emitting device.

In order to make a difference in light efficiency and light distribution characteristics, a photoelectric conversion material may be located in a remote format. In this case, the photoelectric conversion material is located together with a transparent polymer, glass, or the like depending on its durability and heat resistance.

Since the phosphor coating technique plays a major role in determining the optical characteristics in the light emitting device, control techniques such as the thickness of the phosphor coating layer and the uniform dispersion of the phosphor have been studied variously. QD can also be placed in the LED chip or the light emitting element in the same manner as the phosphor, and can be positioned between the glass or translucent polymer material for light conversion.

Figs. 8 to 10 are plan views showing various electrode arrangements. Fig.

8 to 10, the substrate 10 of the light emitting device packages 300, 400, and 500 according to still another embodiment of the present invention includes the first integrated electrode 14-1, And a second integrated electrode 14-2.

The first integrated electrode 14-1 is connected to the first light emitting device E1 and the second light emitting device E2 so that the first light emitting device E1 and the second light emitting device E2 and the third light emitting device E3 can be simultaneously controlled. An electrode connected to the first electrode B1 of the light emitting device E1 and the first electrode B1 of the second light emitting device E2 and the first electrode B1 of the third light emitting device E3 .

The second integrated electrode 14-2 is connected to the second electrode B2 of the first light emitting device E1 and the second electrode B2 of the second light emitting device E2, And an electrode connected to the second electrode B2 of the light emitting device E3.

Therefore, the first light emitting device E1, the second light emitting device E2, and the second light emitting device E2 are connected to each other using a controller (not shown) connected to the first integrated electrode 14-1 and the second integrated electrode 14-2. All of the third light emitting devices E3 can be integrally dimmed to produce various brightness.

11 is a plan view illustrating a light emitting device package 600 according to still another embodiment of the present invention.

11, a light emitting device package 600 according to still another embodiment of the present invention includes a first light emitting device E1, a second light emitting device E2, and a third light emitting device E3 ) Are arranged in a total of nine, three of which are alternately arranged in a circle.

At this time, the light emitting device package 600 includes a first integrated electrode (not shown) for electrically connecting the first light emitting device E1, the second light emitting device E2, and the third light emitting device E3 15-1 and a second integrated electrode 15-2.

Here, the first integrated electrode 15-1 may include a first integrated electrode 15-1 and a second integrated electrode 15-2 so that the first light emitting device E1 and the second light emitting device E2 and the third light emitting device E3 can be simultaneously controlled. An electrode connected to the first electrode B1 of the light emitting device E1 and the first electrode B1 of the second light emitting device E2 and the first electrode B1 of the third light emitting device E3 .

The second integrated electrode 15-2 is connected to the second electrode B2 of the first light emitting device E1 and the second electrode B2 of the second light emitting device E2, And an electrode connected to the second electrode B2 of the light emitting device E3. Although not shown in the drawing, individual electrodes individually connected to the respective light emitting devices can also be applied.

Therefore, in this circular arrangement method, the distance between the first light emitting device E1 and the second light emitting device E2 and the distance between the first light emitting device E1 and the third light emitting device E3 The distance may be closer than the array method.

Therefore, the closer the distance between the light emitting devices is, the more advantageous for color mixing. Therefore, the light emitting device packages of the present invention using such a triangular arrangement method are advantageous for color mixing, thereby enhancing color expressing power and enabling accurate and delicate color representation.

Meanwhile, a backlight unit having a light emitting device package according to some embodiments of the present invention may selectively include the light emitting device packages described in FIGS. 1 to 11, and a detailed description thereof will be omitted.

In addition, the backlight unit having the light emitting device package according to some embodiments of the present invention may further include a light guide plate (not shown).

Here, the light guide plate is installed in a path of light generated in the light emitting devices E1, E2, and E3, so that light emitted from the light emitting devices E1, E2, , And the material is polycarbonate series, polysulfone series, polyacrylate series, polystyrene series, polyvinyl chloride series, polyvinyl alcohol series, polynorbornene series, polyester, and the like. A translucent resin-based material can be applied. Further, the light guide plate may be formed by various methods such as forming fine patterns, fine protrusions, diffusion films, or the like on the surface, or forming fine bubbles therein.

The backlight unit having the light emitting device package according to some embodiments of the present invention may be a direct type backlight unit in which the light emitting devices E1, E2, and E3 are installed below the light guide plate, ) E2 and E3 are provided at edge portions of the light guide plate.

Therefore, according to the present invention, a wire is omitted using a flip chip which is a relatively inexpensive blue LED for the light emitting devices (E1), (E2) and (E3), and the chip is directly contacted with the adhesive sheet or the phosphor in the form of a coating layer , The chips are arranged in a triangular arrangement or a circular shape to greatly improve the color conversion rate, and each chip is individually controlled to enable color dimming and color rendering, and the half width of the output optical frequency is widened to increase the light quantity and the light efficiency And can be used for display purposes such as a Pachinko game with high visibility.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: substrate
10a:
11-1: 1-1 electrode
11-2: 1-2 electrode
12-1: electrode 2-1
12-2: electrode 2-2
13-1: Electrode No. 3-1
13-2: electrode 3-2
14-1: first integrated electrode
14-2: second integrated electrode
15-1: first integrated electrode
15-2: second integrated electrode
L1: first color light
L2: second color light
L3: Third color light
L4: fourth color light
E1: First light emitting device
E2: Second light emitting device
E3: Third light emitting device
30: Optical path guide member
30a: opening
31:
C1: 1st LED chip
C2: second LED chip
C3: Third LED chip
Z1: 1st Zener chip
Z2: Second Zener chip
Z3: Third Zener chip
B: Blue LED chip
RP: Red phosphor
GP: green phosphor
SH: adhesive sheet
SH-1: Top Adhesive Sheet
SH-2: Side Adhesive Sheet
CTL1: first controller
CTL2: Second controller
CTL3: Third controller
B1: first electrode
B2: Second electrode
100, 200, 300, 400, 500, 600: Light emitting device package

Claims (11)

Board;
A first light emitting device mounted at a first position of the substrate to be electrically connected to the substrate, the first light emitting device generating a first color light;
A second light emitting device mounted on a second location of the substrate to be electrically connected to the substrate, the second light emitting device generating a second color light;
A third light emitting device mounted at a third position of the substrate to be electrically connected to the substrate, the third light emitting device generating a third color light; And
The first color light of the first light emitting device, the second color light of the second light emitting device, and the third color light of the third light emitting device are mixed to be converted into the fourth color light, And a light path guide member formed to surround the seating surface including the second position and the third position,
The first light emitting device includes a first LED chip,
The second light emitting device includes a second LED chip,
The third light emitting device includes a third LED chip,
Wherein the first LED chip, the second LED chip, and the third LED chip are in the form of a flip chip. The method according to claim 1,
Wherein the first LED chip, the second LED chip and the third LED chip both generate light of the same wavelength. 3. The method of claim 2,
The first LED chip, the second LED chip and the third LED chip are blue LED chips,
The second light emitting device may further include a red phosphor emitting blue light of the second LED chip and emitting red fluorescence,
And the third light emitting device further comprises a green phosphor which emits green fluorescence upon receiving the blue light of the third LED chip. The method of claim 3,
Wherein the red phosphor and the green phosphor are an adhesive sheet adhered to each of the second LED chip and the third LED chip or a coating layer applied to each of the second LED chip and the third LED chip. The method according to claim 1,
Wherein:
A first 1-1 electrode and a 1-2 first electrode connected to the first electrode and the second electrode of the first light emitting device so as to enable individual dimming control of the first light emitting device;
A second-first electrode and a second-second electrode respectively connected to the first electrode and the second electrode of the second light emitting device so as to enable individual dimming control of the second light emitting device; And
A third-first electrode and a third-second electrode respectively connected to the first electrode and the second electrode of the third light-emitting device so as to enable individual dimming control of the third light-emitting device;
Emitting device package. The method according to claim 1,
Wherein:
The first electrode of the first light emitting device and the first electrode of the second light emitting device and the third light emitting device of the second light emitting device are arranged so that the first light emitting device, A first integrated electrode connected to the first electrode of the first electrode; And
A second integrated electrode connected to a second electrode of the first light emitting device, a second electrode of the second light emitting device, and a second electrode of the third light emitting device;
Emitting device package. The method according to claim 1,
The optical path guide member
The first light emitting device, the second light emitting device, and the third light emitting device, and the second light emitting device, the second light emitting device, and the third light emitting device, Wherein the light emitting device package is an encapsulant in which an opening of a predetermined shape is formed. The method according to claim 1,
Wherein the first light emitting device, the second light emitting device, and the third light emitting device are arranged in three rows in parallel with each other. The method according to claim 1,
Wherein the first light emitting device, the second light emitting device, and the third light emitting device are arranged at three points with a triangle. The method according to claim 1,
Wherein a plurality of the first light emitting device, the second light emitting device, and the third light emitting device are provided, and are alternately arranged in a circle and multipoint. Board;
A first light emitting device mounted at a first position of the substrate to be electrically connected to the substrate, the first light emitting device generating a first color light;
A second light emitting device mounted on a second location of the substrate to be electrically connected to the substrate, the second light emitting device generating a second color light;
A third light emitting device mounted at a third position of the substrate to be electrically connected to the substrate, the third light emitting device generating a third color light; And
The first color light of the first light emitting device, the second color light of the second light emitting device, and the third color light of the third light emitting device are mixed to be converted into the fourth color light, And a light path guide member formed to surround the seating surface including the second position and the third position,
The first light emitting device includes a first LED chip,
The second light emitting device includes a second LED chip,
The third light emitting device includes a third LED chip,
Wherein the first LED chip, the second LED chip, and the third LED chip are in the form of a flip chip.

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