KR20120112662A - Organic particulate loaded polishing pads and method of making and using the same - Google Patents

Abstract

Polishing pads comprising organic particulates in a continuous polymer phase, and methods of making and using such pads in a polishing process are disclosed. In one exemplary embodiment, the polishing pad includes a plurality of polishing elements integrally formed in the sheet. In another exemplary embodiment, the polishing element is bonded to the support layer, for example by thermal bonding. In certain embodiments, the polishing pad can further include a flexible layer attached to the support layer, and optionally a polishing composition distribution layer.

Description

ORGANIC PARTICULATE LOADED POLISHING PADS AND METHOD OF MAKING AND USING THE SAME}

Cross-reference to related application

This application claims the benefit of US Provisional Patent Application 61 / 291,182, filed December 30, 2009, the disclosure content of which is incorporated herein by reference in its entirety.

The present invention relates to a polishing pad and a method of manufacturing the polishing pad and a method of using the polishing pad in a polishing process, for example in a chemical mechanical planarization process.

During the fabrication of semiconductor devices and integrated circuits, silicon wafers are repeatedly processed through a series of deposition and etching steps to form an overlying material layer and device structure. A polishing technique known as chemical mechanical planarization (CMP) is deposited for the purpose of obtaining a smooth wafer surface with high uniformity across the wafer surface and free of scratches or depressions (known as dishing). And surface irregularities (eg, bumps, areas of different heights, troughs, and trenches) remaining after the etching steps.

In a typical CMP polishing process, a substrate, such as a wafer, is pressed against and relative to a polishing pad in the presence of a working liquid, which is typically a slurry of abrasive particles in water and / or etching compounds. Is moved to. Various CMP polishing pads for use with abrasive slurries are disclosed, for example, in US Pat. Nos. 5,257,478, 5,921,855, 6,126,532, 6,899,598 B2, and 7,267,610. Fixed abrasive polishing pads are also known, as illustrated by US Pat. No. 6,908,366 B2, wherein the abrasive particles are generally fixed to the surface of the pad in the form of a precisely shaped abrasive composite that often extends from the pad surface. Recently, a polishing pad having a plurality of polishing elements extending from the compressible underlayer and attached to the underlayer by a guide plate has been described in PCT International Publication No. WO 2006/057714. Although a wide variety of polishing pads are known and used, the art is new and improved polishing pads for CMP, especially in CMP processes where larger die diameters are used or where higher levels of wafer surface flatness and polishing uniformity are required. I continue to look for.

In one aspect, the present disclosure provides a sheet having a first major side and a second major side opposite the first major side, and along a first direction substantially perpendicular to the first major side. A polishing pad comprising a plurality of polishing elements extending outwardly from a first major face, wherein at least some of the polishing elements are integrally formed with the sheet and the side of the polishing element relative to one or more of the other polishing elements. Organic particulate filler dispersed laterally in connection with a lateral connection to limit directional movement, but still movable in an axis substantially perpendicular to the polishing surface of the polishing element, at least some of the plurality of polishing elements being dispersed in a continuous polymer phase It includes.

In another aspect, the present disclosure provides a polishing pad comprising a support layer having a first major face and a second major face opposite the first major face, and a plurality of polishing elements bonded to the first major face of the support layer. Wherein each polishing element has an exposed polishing surface, the polishing element extending from the first major surface of the support layer along a first direction substantially perpendicular to the first major surface and further comprising a plurality of polishing elements. At least some include organic particulate filler dispersed in the continuous polymer phase. In some exemplary embodiments, each polishing element is attached to the first major surface by bonding to the support layer, preferably using direct thermal bonding. In some demonstrative embodiments, the polishing elements are arranged in a two dimensional array pattern on the first major face.

In further exemplary embodiments, at least one of the polishing elements is a porous polishing element, wherein each porous polishing element comprises a plurality of pores. In certain exemplary embodiments, substantially all of the polishing elements are porous polishing elements. In some particular exemplary embodiments, the pores are distributed substantially throughout the porous polishing element.

In certain presently preferred embodiments, at least one of the polishing elements is a transparent polishing element. In some exemplary embodiments, the support layer, optional guide plate, optional polishing composition distribution layer, optional compliant layer, optional adhesive layer, at least one polishing element, or a combination thereof is transparent. In certain exemplary embodiments, at least one transparent polishing element is attached to the transparent portion of the sheet.

In another exemplary embodiment of a polishing pad as described above, the polishing pad includes an optional flexible layer attached to the second major face. In a further exemplary embodiment of the polishing pad as described above, the polishing pad includes an optional pressure sensitive adhesive layer attached to the flexible layer opposite the second major face. In a further exemplary embodiment, the polishing pad includes a polishing composition distribution layer overlying the first major face of the sheet or support layer.

In another exemplary embodiment of a polishing pad as described above, the polishing element further comprises abrasive particulates having a median diameter of less than 1 micron. In further exemplary embodiments, at least some of the polishing elements are substantially free of abrasive particulates. In a further exemplary embodiment, the polishing pad as described above is substantially free of abrasive particulates.

In another aspect, the present disclosure describes a method of using a polishing pad as described above, the method comprising contacting a surface of a substrate with a polishing surface of a polishing pad, and relative to the substrate. Moving to wear the surface of the substrate. In some exemplary embodiments, the method further includes providing a polishing composition at an interface between the polishing pad surface and the substrate surface.

In a further aspect, the present disclosure describes a method of making a polishing pad as described above, the method comprising forming a plurality of polishing elements comprising organic particulate filler dispersed in a continuous polymer phase, supporting the polishing elements. Bonding to the first major face of the layer, wherein the support layer has a second major face opposite the first major face to form a polishing pad.

In a further aspect, the present disclosure describes a method of making a polishing pad as described above, the method comprising dispersing an organic particulate filler in a curable composition comprising a polymeric precursor material, dispensing the curable composition into a mold A curable composition in the mold, the polymer sheet comprising dispersed organic particulate filler and having a second major face opposite the first major face and the first major face, and a first substantially perpendicular to the first major face Forming a plurality of polishing elements extending outwardly from the first major surface along the direction, wherein the polishing elements are integrally formed with the sheet and move laterally of the polishing element relative to at least one of the other polishing elements. Are laterally connected to limit the angle, but still in an axis substantially perpendicular to the polishing surface of the polishing element. It is possible.

In some exemplary embodiments, dispersing the organic particulate filler in the continuous polymer phase comprises melt mixing, kneading, extrusion, or a combination thereof. In certain exemplary embodiments, dispensing the fluid molding composition into a mold may comprise reaction injection molding, extrusion molding, compression molding, vacuum molding, or these At least one of the combinations. In some particular exemplary embodiments, dispensing includes continuously extruding the fluid molding composition through the film die onto the casting roller, where the surface of the casting roller comprises a mold.

In a further exemplary method of manufacturing a polishing pad as described above, the mold comprises a three-dimensional pattern and the first major surface comprises a plurality of polishing elements corresponding to the impression of the three-dimensional pattern. The plurality of polishing elements extend outwardly from the first main surface along a first direction substantially perpendicular to the first main surface, and the polishing elements are integrally formed with the sheet and polish to one or more of the other polishing elements. Although connected laterally to limit the lateral movement of the element, it is still movable in an axis substantially perpendicular to the polishing surface of the polishing element.

In some exemplary methods of making a polishing pad as described above, the method further includes attaching the flexible layer to the second major face. In a further exemplary embodiment, the method further includes attaching a polishing composition distribution layer covering at least a portion of the first major face. In certain exemplary embodiments, the method further includes forming a pattern with polishing elements on the first major face. In certain exemplary embodiments, forming the pattern may include reacting injection molding the polishing elements into a pattern, extruding the polishing elements into a pattern, compression molding the polishing elements into a pattern, and a template corresponding to the pattern. arranging the polishing elements in a template, or arranging the polishing elements in a pattern on a support layer. In some particular exemplary embodiments, bonding the polishing element to the support layer includes thermal bonding, ultrasonic bonding, actinic radiation bonding, adhesive bonding, and combinations thereof.

In certain exemplary embodiments that are presently preferred, at least some of the polishing elements include a porous polishing element. In some demonstrative embodiments, at least some of the polishing elements comprise a polishing element that is substantially non-porous. In some particular exemplary embodiments, the porous polishing element is injection molding of a gas saturated polymer melt, injection molding of a reactive mixture that releases gas upon reaction to form a polymer, injection of a mixture comprising a polymer dissolved in a supercritical gas. It is formed by molding, injection molding of a mixture of incompatible polymers in a solvent, injection molding of porous thermosetting microparticles dispersed in a thermoplastic polymer, injection molding of a mixture comprising microballoons, and combinations thereof. In further exemplary embodiments, the pores are formed by reaction injection molding, gas dispersion foaming, and combinations thereof.

Exemplary embodiments of polishing pads according to the present disclosure have a variety of features and characteristics that enable their use in a variety of polishing applications. In some presently preferred embodiments, the polishing pad of the present disclosure may be particularly well suited for chemical mechanical planarization (CMP) of wafers used to fabricate integrated circuits and semiconductor devices. In certain exemplary embodiments, the polishing pads described in this disclosure can provide some or all of the following advantages.

For example, in some exemplary embodiments, a polishing pad according to exemplary embodiments of the present disclosure may better retain the working liquid used in the CMP process at the interface between the polishing surface of the pad and the substrate surface being polished. It can act to improve the effectiveness of the working liquid in increasing polishing. In another exemplary embodiment, the polishing pad according to the present disclosure can reduce or eliminate dishing and / or edge erosion of the wafer surface during polishing.

In a further exemplary embodiment, the use of a polishing pad having a porous element according to exemplary embodiments of the present disclosure is directed to processing wafers of larger diameters while maintaining the required surface uniformity to achieve high chip yield, It may be possible to process more wafers before conditioning of the pad surface is needed to maintain polishing uniformity of the wafer surface, or to reduce processing time and wear on the pad conditioner. In certain embodiments, CMP pads with porous polishing elements can also provide the benefits and advantages of conventional CMP pads with grooved surface textures, but can be made more reproducible at lower cost. . In a further embodiment, bonding the polishing element to the support layer may obviate the need to use a guide plate or adhesive to attach the element to the support layer.

Various aspects and advantages of exemplary embodiments of the invention have been summarized. The above summary is not intended to describe each illustrated embodiment of the present invention or every implementation of this given exemplary embodiment. The following figures and detailed description more particularly exemplify certain preferred embodiments using the principles disclosed herein.

Exemplary embodiments of the invention are further described with reference to the accompanying drawings.
1 is a side cross-sectional view of a polishing pad including a sheet of integrally formed polishing elements, according to one exemplary embodiment of the present invention.
2 is a side cross-sectional view of a polishing pad including a plurality of polishing elements bonded to a support layer, in accordance with another exemplary embodiment of the present invention.
3A is a perspective view of a polishing pad having polishing elements arranged in a pattern, in accordance with an exemplary embodiment of the present invention.
3B is a plan view of a polishing pad having polishing elements arranged in a pattern, in accordance with another exemplary embodiment of the present invention.
Like reference numerals in the drawings indicate like elements. The drawings herein are not drawn to scale, in which the components of the polishing pad are sized to highlight selected features.

In a typical CMP slurry process for wafer polishing, a wafer with characteristic topography is placed in contact with a polishing pad and a polishing solution comprising an abrasive and a polishing compound. If the polishing pad is flexible, the phenomenon of dishing and erosion may occur due to the soft pad polishing the low area on the wafer at the same rate as the raised area. If the polishing pad is rigid, dishing and erosion can be greatly reduced, but rigid polishing pads also disadvantageously occur on the wafer perimeter, although rigid polishing pads can advantageously yield good results in die planarization uniformity. The rebound effect can yield poor results in wafer uniformity. This bounce effect leads to poor edge yield and a narrow CMP polishing process window. In addition, it may be difficult to develop a stable polishing process with a rigid polishing pad, because such a pad is sensitive to different wafer topography and provides an optimal polishing texture that maintains the polishing solution and contacts the wafer. This is because it relies entirely on the use of pad conditioners to generate.

Thus, in some exemplary embodiments, the present invention, in various embodiments, combines some of the advantageous features of both the flexible polishing pad and the rigid polishing pad while simultaneously eliminating some of the disadvantageous features of each pad. An improved CMP polishing pad is provided.

Various exemplary embodiments of the invention will now be described in particular with reference to the drawings. Exemplary embodiments of the invention may take various modifications and changes without departing from the spirit and scope of the invention. Accordingly, it should be understood that the embodiments of the present invention should not be limited to the exemplary embodiments described below, but should be limited by the limitations described in the claims and any equivalents thereof.

Referring to FIG. 1, in one exemplary embodiment, the present invention provides a sheet 13 ′ having a first major face 32 and a second major face 33 opposite the first major face 32, and A polishing pad 2 comprising a plurality of polishing elements 4 extending outwardly from the first major surface 32 along a first direction substantially perpendicular to the first major surface 32 as shown in FIG. 1. ) Wherein at least some of the polishing elements 4 are integrally formed with the sheet 13 ′ and limit lateral movement of the polishing element 4 relative to one or more of the other polishing elements 4. Laterally connected, but still movable in an axis substantially perpendicular to the polishing surface 14 of the polishing element 4, at least some of the plurality of polishing elements 4 being organic particulate filler 15 in the continuous polymer phase. ).

In the particular exemplary embodiment shown by FIG. 1, the sheet 13 ′ is provided with an optional flexible layer located on the opposite side of the plurality of polishing elements 4 (ie, on the second major face 33). 16) is attached. Also, an optional adhesive layer 12 is shown at the interface between the flexible layer 16 and the sheet 13 ′. An optional adhesive layer 12 may be used to attach the second major face 33 of the sheet 13 ′ to the flexible layer 16. Additionally, an optional pressure sensitive adhesive layer 18 attached to the flexible layer 16 opposite the plurality of polishing elements 4 polishes the polishing pad 2 to the CMP polishing apparatus (not shown in FIG. 1). It may be used to temporarily (eg, removable) secure the platen (not shown in FIG. 1).

In some exemplary embodiments, the polishing pad 2 further comprises an optional polishing composition distribution layer 8 covering at least a portion of the first major face as shown in FIG. 1. During the polishing process, an optional polishing composition distribution layer 8 helps to distribute the working liquid and / or polishing slurry to the individual polishing elements 4. A plurality of openings 6 are provided that extend through the polishing composition distribution layer 8. A portion of each polishing element 4 extends into the corresponding opening 6.

In the alternative embodiment shown in FIG. 2, the present invention provides a support layer 10 having a first major face 34 and a second major face 35 opposite the first major face 34, and a support layer. A polishing pad 2 'comprising a plurality of polishing elements 4 bonded to the first major face 34 of (10), wherein each polishing element 4 is an exposed polishing surface 14. And the polishing element 4 extends from the first major face 34 of the support layer 10 along a first direction substantially perpendicular to the first major face 34 and further comprises a plurality of polishing elements 4. At least some of) comprise the organic particulate filler 15 in the continuous polymer phase.

In some exemplary embodiments of the polishing pad 2 ′, each polishing element 4 may be directly thermally bonded to the support layer 10, or an adhesive for bonding the polishing element 4 to the support layer 10. By attaching to the first major face 34. In certain exemplary embodiments, the polishing pad further comprises an optional guide plate 28 opposite the support layer 10 on the first major face 34, where the guide plate 28 is a guide plate. A plurality of openings 6 extending through 28, and at least a portion of each polishing element 4 extends into a corresponding opening 6. In certain exemplary embodiments, a portion of each polishing element 4 passes through the corresponding opening 6. In some particular exemplary embodiments, each polishing element has a flange 17, and each flange 17 has a periphery larger than the periphery of the corresponding opening 6, as shown in FIG. 2.

In the particular exemplary embodiment illustrated by FIG. 2, the support layer 10 is a support layer 10 opposite the plurality of polishing elements 4 attached to the first major face 34 of the support layer 10. Is attached to an optional flexible layer 16 located on the second major face 35 of the < RTI ID = 0.0 > In addition, an optional adhesive layer 12 is shown at the interface between the flexible layer 16 and the support layer 10. An optional adhesive layer 12 may be used to attach the second major face 35 of the support layer 10 to the flexible layer 16. Additionally, an optional pressure sensitive adhesive layer 18 attached to the flexible layer 16 opposite the plurality of polishing elements 4 may cause the polishing pad 2 'to be removed from the CMP polishing apparatus (not shown in FIG. 2). It may be used to temporarily (eg, removable) secure to a polishing platen (not shown in FIG. 2).

An optional guide plate 28 is also shown in the exemplary embodiment of FIG. 2. An optional guide plate 28, which can also serve as an alignment template for arranging a plurality of polishing elements 4 on the first major face of the support layer 10, is a polishing according to the invention. It is generally not required to manufacture the pad 2 '. In certain exemplary embodiments, the optional guide plate 28 may be completely removed from the polishing pad as shown by the polishing pad 2 of FIG. 1. Such embodiments may advantageously be easier and less expensive to manufacture than other known polishing pads comprising a plurality of polishing elements.

An optional polishing composition distribution layer 8 ′, which can also serve as a guide plate for the polishing element 4, is additionally shown in FIG. 2. During the polishing process, an optional polishing composition distribution layer 8 'helps to distribute the working liquid and / or polishing slurry to the individual polishing elements 4. When used as a guide plate, the polishing composition distribution layer 8 has a first major surface of the polishing composition distribution layer 8 ′ far from the support layer 10, as shown in FIG. 2, and a polishing composition distribution layer. Support to facilitate the arrangement of the plurality of polishing elements 4 such that the second major surface of the polishing composition distribution layer 8 'opposite the first major surface of 8' is close to the support layer 10. It may be located on the first major face 34 of layer 10. A plurality of openings 6 extending through at least an optional guide plate 28 (if present) and / or an optional polishing composition distribution layer 8 '(if present) as shown in FIG. It may also be provided.

As shown by FIG. 2, each polishing element 4 is from the first major surface of the optional guide plate 28 along a first direction substantially perpendicular to the first major surface of the support layer 10. Is extended. In some embodiments shown in FIG. 2, each polishing element 4 has a mounting flange 17, and each polishing element 4, 4 ′ has a first major face 34 of the support layer 10. And, optionally, the second major surface of the optional polishing composition distribution layer 8 'or the first major surface of the support layer 10 by engagement of the corresponding flange 17 to the optional guide plate 28. Is bonded to. As a result, during the polishing process, the polishing element 4 is freely independently displaced in a direction substantially perpendicular to the first major face 34 of the support layer 10 while still being bonded to the support layer 10. And optionally additionally attached to the support layer 10 by an optional polishing composition distribution layer 8 ′ and / or an optional guide plate 28.

In such embodiments, preferably at least a portion of each polishing element 4 extends into the corresponding opening 6, more preferably each polishing element 4 also passes through the corresponding opening 6 and It extends outwardly from the first major surface of the optional guide plate 28. Thus, the plurality of openings 6 of the optional guide plate 28 and / or the optional polishing composition distribution layer 8 ′ also has a polishing element 4 on the first major face 34 of the support layer 10. It can serve as a template to guide the lateral arrangement of these. In other words, the optional guide plate 28 and / or the optional polishing composition distribution layer 8 ′ is provided with a plurality of polishing elements 4 on the first major face 34 of the support layer 10 during the polishing pad manufacturing process. ) Can be used as a template or a guide to arrange them.

In the particular embodiment shown by FIG. 2, the optional guide plate 28 may include an adhesive (not shown) located at the interface between the support layer 10 and the polishing composition distribution layer 8 ′. . The optional guide plate 28 thus adheres the optional polishing composition distribution layer 8 ′ to the support layer 10 such that the plurality of polishing elements 4 are first major face 34 of the support layer 10. Can be used to attach firmly to However, other joining methods can be used, including, for example, direct thermal bonding of the polishing element 4 to the support layer 10 using heat and pressure.

In a related exemplary embodiment of the polishing pad 2 ′ of FIG. 2, a plurality of openings may be arranged as an array of openings, where at least some of the openings 6 are optional polishing composition distribution layer 8 ′. A main bore formed by and an undercut area formed by an optional guide plate 28, which undercut area engages with the corresponding polishing element flange 17 to support the polishing element 4. A shoulder is formed that firmly attaches the polishing element 4 to the support layer 10 without requiring direct bonding to the layer 10. In addition, in some exemplary embodiments not shown by FIG. 2, the plurality of polishing elements 4 are patterned, for example, on the major surface of the support layer 10, or to bond to the support layer 10. It may be arranged as a two-dimensional array of elements previously arranged in a template or jig used to arrange the polishing elements 4.

In any of the embodiments of the polishing pads 2, 2 ′ shown in FIGS. 1 and 2, at least some of the polishing elements 4 may be porous polishing elements, and some of the polishing elements 4 ′. ) May be a substantially non-porous polishing element. However, in other exemplary embodiments, it will be understood that all of the polishing elements 4 may be selected to be porous polishing elements, or that all of the polishing elements may be selected to be substantially non-porous polishing elements 4 '. will be. In some exemplary embodiments, at least one of the polishing elements is a porous polishing element, wherein each porous polishing element includes a plurality of pores. In certain exemplary embodiments, substantially all of the polishing elements are porous polishing elements. In some particular exemplary embodiments, the pores are distributed substantially throughout the porous polishing element.

Suitable porous polishing elements are disclosed in PCT International Publication No. WO 2009/158665.

In certain presently preferred embodiments, the plurality of pores at least partially removes at least a portion of the organic particulate filler 15 from at least some of the polishing elements 4 of the polishing pads 2, 2 ′, so that the organic particulate filler ( 15) by leaving a void or pore volume corresponding to the volume previously occupied. In some exemplary embodiments, the organic particulate filler 15 may be soluble in a solvent in which the remaining polymer phase of the polishing element 4 is substantially insoluble or only partially soluble.

In some exemplary embodiments, the organic particulate filler 15 comprises a water soluble, water expandable or hydrophilic polymer, wherein water or an aqueous solvent dissolves at least a portion of the organic particulate filler 15 from one or more polishing elements 4. In removal, it is used to create one or more porous polishing elements. In certain exemplary embodiments, the aqueous solvent is selected to be a working liquid used in a chemical mechanical polishing process, which working liquid is dissolved and removed by dissolving at least a portion of the organic particulate filler 15 from one or more polishing elements 4. It is used to create one or more porous polishing elements.

In the particular embodiment shown by FIGS. 1 and 2, two porous polishing elements 4 are shown with one substantially non-porous polishing element 4 ′. However, any number of polishing elements 4 may be used, and any number of polishing elements 4 may be selected to be porous polishing element 4 or substantially non-porous polishing element 4 '. Will understand.

In some presently preferred embodiments, at least some of the polishing elements 4 have a porous polishing surface (FIGS. 1 and 2) that can slide or rotate contact with a substrate (not shown in FIG. 1) to be polished in certain embodiments. A porous polishing element having at least 14). Referring again to FIGS. 1 and 2, the polishing surface 14 of the polishing element 4 may be a substantially flat surface or may be textured. In certain presently preferred embodiments, at least the polishing surface of each polishing element 4 is made porous by microscopic surface openings or pores 15 which may take the form of, for example, orifices, passages, grooves, channels or the like. do. Such pores 15 on the polishing surface distribute and maintain a polishing composition (eg, working liquid and / or abrasive polishing slurry not shown in the figures) at the interface between the substrate (not shown) and the corresponding porous polishing element. Act to facilitate doing so.

In certain exemplary embodiments, the polishing surface 14 includes pores 15 which are generally cylindrical capillaries. The pores 15 may extend from the polishing surface 14 into the polishing element 4. In a related embodiment, the polishing surface comprises pores 15 which are generally cylindrical capillaries extending from the polishing surface 14 into the porous polishing element 4. The pores need not be cylindrical, but other pore geometries are possible, such as cones, rectangles, pyramids, and the like. Characteristic dimensions of the pores can generally be defined as depth along with width (or diameter) and length. Characteristic pore dimensions can range from about 25 μm to about 6,500 μm in depth, from about 5 μm to about 1000 μm in width (or diameter), and from about 10 μm to about 2,000 μm in length.

In some exemplary embodiments, the porous polishing element may not have a porous polishing surface 14, but in these and other exemplary embodiments, the pores 15 may be substantially distributed throughout the porous polishing element 4. Can be. Such porous polishing elements can be useful as flexible polishing elements that exhibit some of the advantageous features of the flexible polishing pad. In certain presently preferred embodiments, the polishing element 4 may comprise a plurality of pores distributed substantially throughout the polishing element 4 in the form of a porous foam. The foam can be a closed cell foam or an open cell foam. In some embodiments a closed cell foam may be desirable. Preferably, the plurality of pores 15 in the foam exhibit a unimodal distribution of pore sizes, eg pore diameter.

In some particular exemplary embodiments, the plurality of pores exhibit an average pore size of at least about 1 nanometer (nm), at least about 100 nm, at least about 500 nm, or at least about 1 μm. In other exemplary embodiments, the plurality of pores exhibit an average pore size of about 300 μm or less, about 100 μm or less, about 50 μm or less, about 10 μm or less, or about 1 μm or less. In certain presently preferred embodiments, the plurality of pores exhibit an average pore size of about 1 nm to about 300 μm, about 0.5 μm to about 100 μm, about 1 μm to about 100 μm, or about 2 μm to about 50 μm.

In a further exemplary embodiment of the polishing pads 2, 2 ′ comprising a substantially non-porous polishing element 4 ′ as described above, at least one of the non-porous polishing elements 4 ′ is It is preferably a transparent polishing element. In some exemplary embodiments, sheet 13 ′ or support layer 10, optional guide plate 28, optional polishing composition distribution layers 8, 8 ′, optional flexible layer 16, optional The adhesive layer 12, at least one substantially non-porous polishing element 4 ′, or a combination thereof is transparent. In certain exemplary embodiments shown in FIG. 1, the at least one transparent non-porous polishing element 4 ′ is formed using a sheet 13, for example using direct thermal bonding or with an adhesive (not shown in FIG. 1). Is attached to the transparent portion of the first major face 32 of ').

It will also be appreciated that the polishing pads 2, 2 ′ do not need to comprise only substantially identical polishing elements 4. Thus, for example, porous polishing elements and non-porous polishing elements in any combination or arrangement can constitute a plurality of polishing elements 4. It will be appreciated that any number, combination or arrangement of porous polishing elements and substantially non-porous polishing elements 4 'may advantageously be used to form a polishing pad having a plurality of polishing elements 4 in certain embodiments. Will also understand.

In some exemplary embodiments, the polishing elements (4, 4 'in FIGS. 1 and 2) may be in the sheet 13' (FIG. 1) or support layer 10 (FIG. 2) in a wide variety of patterns depending on the intended application. It may be distributed on the first major surface of the pattern, the pattern may be regular or irregular. Thus, in some exemplary embodiments of the polishing pads 2, 2 ′, the plurality of polishing elements 4 are for example on the major surface of the support layer 10 or before bonding to the support layer 10. In a template or jig (not shown in the figure) used to arrange the polishing elements, it may be arranged in a pre-determined regular pattern. After arranging the plurality of polishing elements 4 in a pattern using a template or jig, the first major face 34 of the support layer 10 is in contact with the plurality of polishing elements 4, for example, By direct thermal bonding to 10) or by using an adhesive or other bonding material.

The polishing element may be on substantially the entire surface of the sheet 13 ′ or support layer 10, or there may be an area of the sheet 13 ′ or support layer 10 that does not include the polishing element. In some embodiments, the polishing elements have an average surface coverage of at least 30%, at least 40%, or at least 50% of the support layer. In further embodiments, the polishing elements are about 80% or less, about 70% or less of the total area of the major surface of the support layer, as determined by the number of polishing elements, the cross-sectional area of each polishing element, and the cross-sectional area of the polishing pad. Or an average surface coverage of the support layer of about 60% or less.

In the exemplary embodiment of the presently preferred polishing pad 2 shown by FIGS. 3A and 3B, the polishing element 4 is integrally formed with the sheet 13 ′ and the first major surface ( 32) arranged in a two-dimensional array pattern. Optional layers as described above as suitable for use in the polishing pad 2 (eg, optional polishing composition distribution layer 8, optional adhesive 12, optional flexible layer 16, optional) It will be appreciated that any of the pressure sensitive adhesive layer 18, and at least one substantially non-porous / transparent polishing element 4 ′) can be combined to form the polishing pad shown in FIGS. 3A and 3B. will be.

3a shows one particular shape of the polishing element 4. The polishing elements 4 may be formed in substantially any shape, and a plurality of polishing elements 4 having two or more different shapes advantageously form the polishing pads 2, 2 ′ as described above. It will be appreciated that it can be used and optionally arranged in a pattern. It will also be appreciated that the same shape or different shapes may be used to prepare the porous polishing element or alternatively the substantially non-porous polishing element.

In some exemplary embodiments, the cross-sectional shape of the polishing element 4 taken through the polishing element 4 in a direction generally parallel to the polishing surface 14 may vary greatly depending on the intended application. Although FIG. 3A shows a generally cylindrical polishing element 4 having a generally circular cross section, other cross sectional shapes are possible and may be desirable in certain embodiments. Thus, in a further exemplary embodiment of the polishing pads 2, 2 ′ comprising the polishing elements 4, 4 ′ as described above, the polishing elements may be circular, elliptical, triangular, square, rectangular, and trapezoidal, And a cross section taken in the first direction, selected from a combination thereof.

In the case of a generally cylindrical polishing element 4 having a circular cross section as shown in FIGS. 3A and 3B, the cross-sectional diameter of the polishing element 4 in a direction generally parallel to the polishing surface 14 is in some embodiments. At least about 50 μm, more preferably at least about 1 mm, even more preferably at least about 5 mm. In certain embodiments, the cross-sectional diameter of the polishing element 4 in a direction generally parallel to the polishing surface 14 is about 20 mm or less, more preferably about 15 mm or less, even more preferably about 12 mm or less. . In some embodiments, the diameter of the polishing element taken at the polishing surface 14 may be about 50 μm to about 20 mm, in certain embodiments the diameter is about 1 mm to about 15 mm, and in other embodiments the cross-sectional diameter is From about 5 mm to about 12 mm.

In a further exemplary embodiment of the polishing pads 2, 2 ′, the polishing element 4 may be characterized by characteristic dimensions in terms of height, width, and / or length. In certain exemplary embodiments, the characteristic dimension may be selected to be at least about 50 μm, more preferably at least about 1 mm, even more preferably at least about 5 mm. In certain embodiments, the cross-sectional diameter of the polishing element 4 in a direction generally parallel to the polishing surface 14 is about 20 mm or less, more preferably about 15 mm or less, even more preferably about 12 mm or less. . In further exemplary embodiments, the polishing element is characterized by at least one of a height of 250 to 2,500 μm, a width of 1 mm to 50 mm, a length of 5 mm to 50 mm, or a diameter of 1 mm to 50 mm. In certain exemplary embodiments, one or more of the polishing elements 4, 4 ′ may be hollow.

In another exemplary embodiment, the cross-sectional area of each polishing element 4 in a direction generally parallel to the polishing surface 14 is at least about 1 mm 2, in other embodiments at least about 10 mm 2, and in yet another embodiment about It may be 20 mm 2 or more. In another exemplary embodiment, the cross-sectional area of each polishing element 4 in a direction generally parallel to the polishing surface 14 is about 1,000 mm 2 or less, in another embodiment about 500 mm 2 or less, and in yet another embodiment about It may be up to 250 mm 2.

The cross-sectional area of the polishing pad in a direction generally parallel to the major surface of the polishing pad is about 100 cm 2 to about 300,000 cm 2 in some exemplary embodiments, about 1,000 cm 2 in other embodiments. To about 100,000 cm 2, and in yet other embodiments, from about 2,000 cm 2 to about 50,000 cm 2.

Before the first use of the polishing pad (2 in FIG. 1, 2 'in FIG. 2) in a polishing operation, in some exemplary embodiments, each polishing element (4, 4' in FIGS. 1 and 2) is formed of a support layer ( 1 and 2, extend along a first direction substantially perpendicular to the first major plane of 10). In certain exemplary embodiments, the polishing element is in a first direction over a plane that includes an optional polishing composition distribution layer (8 'in FIG. 1, 8' in FIG. 2) and / or an optional guide plate (28 in FIG. 2). Along at least about 0 mm, at least about 0.1 mm, at least about 0.25 mm, at least about 0.3 mm, or at least about 0.5 mm. In another exemplary embodiment, the polishing element is directed in a first direction over a plane that includes an optional polishing composition distribution layer (8 'in FIG. 1, 8' in FIG. 2) and / or an optional guide plate (28 in FIG. 2). Accordingly, about 10 mm or less, about 7.5 mm or less, about 5 mm or less, about 3 mm or less, about 2 mm or less, or about 1 mm or less.

In another exemplary embodiment (not shown in the figures), the polishing surface of the polishing element may be coplanar with the exposed major surface of the optional polishing composition distribution layer. In another exemplary embodiment, the polishing surface of the polishing element is indented below the exposed major surface of the optional polishing composition distribution layer, followed by selective polishing by, for example, removal of a portion of the optional polishing composition distribution layer. It may be made to be coplanar or extend beyond the exposed major surface of the composition distribution layer. Such embodiments may be advantageously used with a polishing composition distribution layer selected to be worn or eroded during the polishing process, or in an optional conditioning process applied to the polishing pad prior to, during, or after contact with the workpiece.

In a further exemplary embodiment, each polishing element 4, 4 ′ is about 0.25 along the first direction over the plane comprising the sheet 13 ′ (FIG. 1) or the support layer 10 (FIG. 2). At least about mm, at least about 0.3 mm, or at least about 0.5 mm. In a further exemplary embodiment, the height of the polishing surface (14 of FIGS. 1 and 2) above the base or bottom of the polishing element, ie the height H of the polishing element, is the material selected for the polishing composition and the polishing element used. And 0.25 mm, 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 5.0 mm, 10 mm or more.

Referring again to FIGS. 1 and 2, openings throughout the optional polishing composition distribution layer (8 in FIG. 1, 8 ′ in FIG. 2) and / or optional guide plate 28 (FIG. 2) (FIG. 1). And the depth and spacing of 6) of FIG. 2 may vary as needed for a specific CMP process. In some embodiments, the polishing elements (4, 4 'in FIGS. 1 and 2) are respectively substantially relative to each other and to the polishing composition distribution layer (8 in FIG. 1, 28 in FIG. 2) and the guide plate 31. It is maintained in a planar orientation and protrudes over the surface of the optional polishing composition distribution layer (8 'in FIG. 1, 8' in FIG. 2) and / or optional guide plate 28.

In some exemplary embodiments, the extension of the polishing element 4 over any optional guide plate (28 in FIG. 2) and any optional polishing composition distribution layer (8 in FIG. 1, 8 'in FIG. 2). The void volume generated may provide a place for dispensing the polishing composition onto the surface of the optional polishing composition distribution layer (8 in FIG. 1, 8 'in FIG. 2). The polishing element 4 is at least partially dependent on the material properties of the polishing element and the desired flow of the polishing composition (working liquid and / or polishing slurry) on the surface of the polishing composition distribution layer (8 'in FIG. 1, 8' in FIG. 2). It protrudes over the polishing composition distribution layer (8 in FIG. 1, 8 'in FIG. 2) in a dependent amount.

In another alternative and exemplary embodiment (not shown in the figures), the present invention provides a textured polishing pad comprising an organic particulate filler and a second continuous polymer phase, wherein the polishing pad comprises a first major face and a first major face. At least one of the first main surface and the second main surface has a second main surface opposite the main surface, and includes a plurality of grooves extending into the surface. In certain exemplary embodiments, the groove has a depth of about 1 micrometer (μm) to about 5,000 μm. In a further exemplary embodiment, the polishing pad has a circular cross section in a direction substantially perpendicular to the first and second faces, wherein the circle defines a radial direction, and the plurality of grooves are circular and concentric. ) And spaced apart in the radial direction.

In another exemplary embodiment (not shown in the figures), the polishing surface of the textured polishing pad includes pores in the form of a plurality of channels, wherein each channel extends over at least a portion of the polishing surface, preferably the polishing surface. Extends in a generally parallel direction. Preferably, each channel is a circular channel extending radially around the circumference of the polishing surface in a direction generally parallel to the polishing surface. In another embodiment, the plurality of channels form a series of concentric circular grooves radially spaced in the polishing surface. In another exemplary embodiment (not shown), the pores may take the form of a two dimensional array of channels in which each channel extends over only a portion of the polishing surface.

In further exemplary embodiments (not shown in the figures), the channels can be substantially any shape, such as cylindrical, triangular, rectangular, trapezoidal, hemispherical, and combinations thereof. In some exemplary embodiments, the depth of each channel in a direction substantially perpendicular to the polishing surface of the polishing element is about 10 μm, 25 μm, 50 μm, 100 μm or more; To about 10,000 μm, 7,500 μm, 5,000 μm, 2,500 μm, 1,000 μm. In another exemplary embodiment, the cross-sectional area of each channel in a direction substantially parallel to the polishing surface of the polishing element is selected to be in the range of about 75 square micrometers (μm ² ) to about 3 × 10 ⁶ μm ² .

The composition of the polishing pad as described above comprises a continuous polymer phase filled with a non-interacting organic filler. The continuous polymer phase is characterized as being a thermoplastic or thermoset elastomer, while the dispersed phase is characterized as a thermoplastic or thermoset polymer. In some exemplary embodiments of the polishing pad as described above, at least a portion of the polishing surface is a thermoplastic polyurethane, acrylated polyurethane, epoxidized polyurethane, epoxidized rubber, vinyl resin, cyclopentadiene resin, vinyl ether resin , And combinations thereof. In some exemplary embodiments of a polishing pad comprising a plurality of polishing elements 4, at least some of the polishing elements are a continuous polyurethane phase as thermoplastic polyurethane, acrylated polyurethane, epoxidized polyurethane, epoxidized rubber, Vinyl resins, cyclopentadiene resins, vinyl ether resins, polyacrylates, or combinations thereof.

In certain exemplary embodiments, the organic particulate filler comprises at least one of a thermoplastic polymer or a thermoset polymer. In some exemplary embodiments, the organic particulate filler comprises at least one of a polyolefin, a cyclic polyolefin, or a polyolefin-based thermoplastic elastomer. In some specific exemplary embodiments, the polyolefin is selected from polyethylene, polypropylene, polybutylene, polyisobutylene, polyoctene, copolymers thereof, and combinations thereof. In another exemplary embodiment, the organic particulate filler is, for example, polyvinyl alcohol, poly (ethylene oxide), poly (vinyl alcohol), poly (vinyl pyrrolidone), polyacrylic acid, poly (meth) acrylic acid, combinations thereof Water-soluble or water-swellable polymers such as and the like.

In further exemplary embodiments, the organic particulate filler is included from about 5% to about 90% by weight of each polishing element. In further exemplary embodiments, the organic particulate filler comprises at least one of a length of 5 to 5,000 micrometers, a width of 5 to 250 micrometers, an equivalent spherical diameter of 5 to 100 micrometers, or a combination thereof. It is characterized by.

The polishing element may also include reinforcing polymers or other composite materials, including, for example, metal particulates, ceramic particulates, polymeric particulates, fibers, combinations thereof, and the like. In certain embodiments, the polishing element may be made electrically conductive and / or thermally conductive by including a filler therein, such as carbon, graphite, metal, or a combination thereof. In another embodiment, an electrically conductive polymer, such as polyaniline (PANI), sold for example under the trade name "ORMECOM" (available from Ormecon Chemie, Ammersbeck, Germany), is described above. It may be used without or with a conductive filler or a thermally conductive filler.

In some exemplary embodiments, to produce a polishing element, the continuous phase polymer resin precursor system may be milled with the micronized organic particulate powder to produce a reactive slurry comprising a dispersed organic particulate phase. The filled reactive slurry can then be cast directly into the mold or b-staged and molded under pressure to create a patterned surface comprising integrally shaped polishing elements. As soon as the polymer resin precursor is at least partially cured, a sheet having a desired pattern of polishing elements can be obtained, and the sheet can subsequently be secured to the flexible support layer to form a flexible polishing pad. Alternatively, the flexible support layer may be laminated to the integrally molded polishing surface during film casting or molding operations. Pressure sensitive adhesives can also be used to adhere the bottom surface of the flexible material to the surface of the polishing plate used for semiconductor polishing.

In any of the exemplary embodiments of the polishing pad as described above, the polishing surface is separated by a phase separated polymer blend comprising organic particulate filler that cannot be mixed in the continuous polymer phase and in the continuous polymer phase at room temperature. Is formed. The size of the dispersed organic particulate phase can be adjusted by adjusting the particle size of the dispersed organic particulates, for example by adjusting the milling conditions and / or duration. Polymer films resulting from these types of immiscible blend systems characteristically release the dispersed organic particulate phase when subjected to fracture or scoring. Thus, if the pad surface is produced from this type of polymer blend, the surface will be characterized as having a porosity resulting from the release or discharge of dispersed organic particulates.

In another exemplary embodiment, at least a portion of the organic particulate filler 15 is at least partially removed from at least some of the polishing elements 4 of the polishing pads 2, 2 ′, thereby allowing the organic particulate filler 15 to be removed by the organic particulate filler 15. By leaving the void or pore volume corresponding to the previously occupied volume, a plurality of pores are created in at least some of the polishing elements. In some exemplary embodiments, the organic particulate filler may be soluble in a solvent in which the first continuous polymer phase 13 is substantially insoluble or only partially soluble.

In some exemplary embodiments, the organic particulate filler comprises a water soluble, water expandable or hydrophilic thermoplastic polymer, wherein water or an aqueous solvent dissolves and removes at least a portion of the organic particulate filler 15 from one or more polishing elements 4. It is used to create one or more porous polishing elements. Suitable water soluble polymers include poly (ethylene oxide), poly (vinyl alcohol), poly (vinyl pyrrolidone), polyacrylic acid, poly (meth) acrylic acid, copolymers of these and other monomers, and combinations thereof.

In certain exemplary embodiments, the aqueous solvent is selected to be a working liquid used in a chemical mechanical polishing process, which working liquid is dissolved and removed by dissolving at least a portion of the organic particulate filler 15 from one or more polishing elements 4. It is used to create one or more porous polishing elements.

In further exemplary embodiments of the polishing pad as described above, the organic particulate filler may comprise about 1%, 2.5%, 5%, or 10% by weight of each polishing element; To about 50%, 60%, 70%, 80%, or 90%. In certain exemplary embodiments, the organic particulate filler is characterized by at least one of a length of 5 to 5,000 μm, a width of 5 to 250 μm, an equivalent sphere diameter of 5 to 100 μm, or a combination thereof. Preferably, the organic particulate filler is substantially uniform spherical in shape and comprises at least 1 μm, 5 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm; And median diameters of 200 μm, 150 μm, 100 μm, 90 μm, 80 μm, 70 μm, or 60 μm or less.

In further exemplary embodiments of any of the polishing pads described above, the sheet 13 ′, support layer 10, or textured polishing pad may be substantially incompressible, such as a rigid film or other rigid substrate, but is preferred. Preferably compressive to provide positive pressure directed towards the polishing surface. In some exemplary embodiments, the sheet or support layer may comprise a flexible and flexible material, such as a flexible rubber or polymer. In another exemplary embodiment, the sheet, support layer or pad is preferably made from a compressible polymer material, with a foamed polymer material being preferred. In certain embodiments, closed cell foam may be preferred, but in other embodiments, open cell foam may be used. In further exemplary embodiments, the polishing element may be formed with the support layer as a unitary sheet of polishing elements attached to the support layer, which may be a compressible or flexible support layer.

The sheet or support layer is preferably liquid impermeable to prevent penetration or permeation of the working liquid into or through the support layer. However, in some embodiments, the sheet or support layer may comprise a liquid permeable material, alone or in combination with an optional barrier that acts to prevent or inhibit liquid penetration or permeation through the support layer. Also in other embodiments, porous sheets or support layers may be advantageously used to retain the working liquid (eg, polishing slurry) at the interface between the polishing pad and the workpiece, for example, during polishing.

In certain exemplary embodiments, the sheet or support layer may comprise a polymeric material selected from silicone, natural rubber, styrene-butadiene rubber, neoprene, polyurethane, polyester, polyethylene, and combinations thereof. The sheet or support layer may further comprise a wide variety of additional materials such as fillers, particulates, fibers, reinforcing agents and the like.

Polyurethanes have been found to be particularly useful sheet or support layer materials, with thermoplastic polyurethanes (TPUs) being particularly preferred. In some presently preferred embodiments, the support layer is available from one or more TPUs, such as ESTANE TPU (Lubrizol Advanced Materials, Inc., Cleveland, Ohio). ), TEXIN or DESMOPAN TPU (available from Bayer Material Science, Pittsburgh, Pa.), PELLETHANE TPU (Dow Chemical Company, Midland, Mich.) Available from Dow Chemical Company).

In some exemplary embodiments, the polishing pad further includes a flexible layer 16 attached to a support layer opposite the polishing element. The flexible layer may be attached to the support layer by any means of bonding the surfaces, but preferably an adhesive layer located at the interface between the flexible layer and the support layer attaches the support layer to the flexible layer opposite the polishing element. Used to.

In certain embodiments, the flexible layer is preferably compressible to provide a positive pressure that directs the polishing surface of the polishing element towards the workpiece during polishing. In some exemplary embodiments, the support layer may comprise a flexible and flexible material, such as a flexible rubber or polymer. In another exemplary embodiment, the support layer is preferably made of a compressible polymeric material, with foamed polymeric materials being preferred. In certain embodiments, closed cell foam may be preferred, but in other embodiments, open cell foam may be used.

In some specific embodiments, the flexible layer may comprise a polymeric material selected from silicone, natural rubber, styrene-butadiene rubber, neoprene, polyurethane, polyethylene and copolymers thereof, and combinations thereof. The flexible layer can further include a wide variety of additional materials, such as fillers, particulates, fibers, reinforcing agents, and the like. The flexible layer is preferably liquid impermeable (though the permeable material can be used in combination with an optional barrier that prevents or inhibits liquid penetration into the flexible layer).

The presently preferred polymer material for use in the flexible layer is polyurethane, with TPU being particularly preferred. Suitable polyurethanes are available, for example, under the trade name "PORON" from Rogers Corp. of Rogers, Connecticut, as well as under the trade name "Peletan" from Dow Chemical of Midland, Michigan, USA. Available ones, in particular Peletan 2102-65D. Other suitable materials are, for example, polyethylene terephthalate (PET), such as biaxially oriented PET, widely available under the trade name "MYLAR", as well as bonded rubber sheets (e.g., of Santa Ana, CA, USA). Rubberlite Cypress Sponge Rubber Products, Inc., a rubber sheet available under the trade name " BONDTEX " from Rubberite Cypress Rubber Products, Inc.

In some exemplary embodiments, the polishing pads 2, 2 ′ according to the present invention have certain advantages when used in CMP processes, such as improved polishing uniformity in wafers, flatter polished wafer surfaces, from wafers. Increasing edge die yield and improved CMP process operation tolerance and consistency can be achieved. While not wishing to be bound by any particular theory, these advantages separate the polishing surface of the polishing element from the flexible layer underneath the support layer, such that the polishing element contacts the polishing surface of the element when the polishing pad contacts the workpiece during the polishing process. From "float" in a substantially vertical direction.

In some embodiments of the polishing pad 2 ', the separation of the polishing surface of the polishing element from the flexible underlayer is passed through the optional guide plate 28 -guide plate from the first major surface to the second major surface in the polishing article. Including a plurality of openings extending, wherein at least a portion of each polishing element extends into a corresponding opening, and each polishing element extends outwardly from the second major surface of the guide plate. An optional guide plate, preferably comprising a rigid or non-flexible material, can be used to maintain the lateral movement of the element on the polishing pad as well as to maintain the spatial orientation of the polishing surface. However, in other embodiments, an optional guide plate is not necessary, because the spatial orientation of the polishing element is maintained and lateral by bonding the element to the support layer, preferably by direct thermal bonding of the polishing element to the support layer. This is because movement is prevented.

The optional guide plate 28 can be made from a wide variety of materials, for example polymers, copolymers, polymer blends, polymer composites, or combinations thereof. Rigid, non-flexible, non-conductive, liquid impermeable polymeric materials are generally preferred, and polycarbonates have been found to be particularly useful.

In further embodiments, the polishing pad of the present invention covers an optional polishing composition distribution layer 8 that covers at least a portion of the first major surface of the optional guide plate (if present) as well as the first major surface of the sheet or support layer. , 8 ') may be further included. Optional polishing composition distribution layers can be made from a wide variety of polymeric materials. The optional polishing composition distribution layer may comprise at least one hydrophilic polymer in some embodiments. Preferred hydrophilic polymers include polyurethanes, polyacrylates, polyvinyl alcohols, polyoxymethylenes, and combinations thereof. In one particular embodiment, the polishing composition layer preferably comprises water absorbing hydrophilic polyurethane or polyacrylate, preferably in the range of about 5 to about 60 weight percent, to provide a slippery surface during polishing operations, for example. The same hydrogel material may be included.

In further exemplary embodiments, the optional polishing composition distribution layer includes a flexible material, such as a porous polymer or foam, to provide a positive pressure directed towards the substrate when the polishing composition distribution layer is compressed during the polishing operation. In certain exemplary embodiments, the compliance of the polishing composition distribution layer is selected to be less than the compliance of the optional flexible layer. Porous or foamed materials with open or closed cells may be preferred flexible materials for use in the optional polishing composition distribution layer in certain embodiments. In some specific embodiments, the optional polishing composition distribution layer has about 10 to about 90% porosity.

In certain exemplary embodiments, the flexible layer is attached to the second major face by an adhesive layer at the interface between the flexible layer and the second major face.

In further exemplary embodiments, the polishing surface of the polishing element may be adapted to coplanar or be indented below the exposed major surface of the optional polishing composition distribution layer. Such embodiments can be advantageously employed to maintain a working liquid, for example a polishing slurry, at the interface between the workpiece and the exposed polishing surface of the polishing element. In such embodiments, the polishing composition dispensing layer advantageously includes a material that is worn or eroded during the polishing process or in an optional conditioning process applied to the polishing surface of the polishing pad prior to, during, or after contact with the workpiece. Can be selected.

In further exemplary embodiments, the polishing composition distribution layer can serve to distribute the polishing composition substantially uniformly over the surface of the substrate undergoing polishing, which can provide more uniform polishing. The polishing composition distribution layer may optionally include flow resistive elements such as baffles, grooves (not shown in the figure), pores, and the like to adjust the flow rate of the polishing composition during polishing. In further exemplary embodiments, the polishing composition distribution layer can include various layers of different materials to achieve the desired polishing composition flow rate at various depths from the polishing surface.

In some demonstrative embodiments, one or more of the polishing elements may include an open core region or cavity defined within the polishing element, but such an arrangement is not required. In some embodiments, as described in PCT International Publication No. WO 2006/055720, the core of the polishing element may comprise a sensor that detects pressure, conductivity, capacitance, eddy current, and the like. In yet another embodiment, the polishing pad has a window extending through the pad in a direction perpendicular to the polishing surface to allow optical termination-instruction of the polishing process as described in PCT International Publication WO 2009/140622. Or transparent layers and / or transparent polishing elements can be used.

The invention also relates to a method of using a polishing pad as described above in a polishing process, the method comprising contacting a surface of a substrate with a polishing surface of a polishing pad comprising a plurality of polishing elements at least partially porous; and Moving the polishing pad relative to the substrate to wear the surface of the substrate. In certain exemplary embodiments, a working liquid may be provided at the interface between the polishing pad surface and the substrate surface. Suitable working liquids are known in the art and are described, for example, in US Pat. No. 6,238,592 B1; 6,491,843 B1; And PCT International Publication WO 2002/33736.

The polishing pads described herein can be relatively easy and inexpensive to manufacture in some embodiments. A brief discussion of some exemplary methods for manufacturing a polishing pad according to the present invention is described below, which is not intended to be exhaustive or otherwise limiting.

Thus, in another exemplary embodiment, the present invention provides a method of making a polishing pad as described above, the method comprising applying heat to mix a first polymer and a second polymer to form a fluid molding composition, Dispensing the fluid molding composition into a mold, cooling the fluid molding composition to form a polishing pad comprising a first continuous polymer phase comprising a first polymer and an organic particulate filler comprising a second polymer; , Wherein the polishing pad has a first major face or surface, and a second major face or surface opposite the first major face or surface.

In a further embodiment, the present invention provides a method of making a polishing pad as described above, the method comprising dispersing an organic particulate filler in a curable composition comprising a polymer precursor material, dispensing the curable composition into a mold A curable composition in the mold, the polymer sheet comprising dispersed organic particulate filler and having a second major face opposite the first major face and the first major face, and a first substantially perpendicular to the first major face Forming a plurality of polishing elements extending outwardly from the first major surface along the direction, wherein the polishing elements are integrally formed with the sheet and move laterally of the polishing element relative to at least one of the other polishing elements. Are laterally connected to limit the angle, but still in an axis substantially perpendicular to the polishing surface of the polishing element. It is possible.

In some exemplary embodiments, dispersing the organic particulate filler in the continuous polymer phase comprises melt mixing, kneading, extrusion, or a combination thereof. In certain exemplary embodiments, dispensing the fluid molding composition into a mold includes at least one of reaction injection molding, extrusion molding, compression molding, vacuum molding, or a combination thereof. In some particular exemplary embodiments, dispensing includes continuously extruding the fluid molding composition through the film die onto the casting roller, where the surface of the casting roller comprises a mold.

In a further exemplary embodiment of making a textured polishing pad as described above, the method further comprises milling at least one of the first and second major faces to form a plurality of grooves extending into the face. Include. In certain exemplary embodiments, the groove has a depth of about 1 μm to about 5,000 μm. In some particular exemplary embodiments, the polishing pad has a circular cross section in a direction substantially perpendicular to the first and second faces, wherein the circle defines a radial direction and the plurality of grooves are circular, concentric , Radially spaced apart.

In an alternative and exemplary embodiment in which the polishing pad 2 comprises organic particulate filler wherein at least some of the plurality of polishing elements are dispersed in a continuous polymer phase as described above, the mold comprises a three-dimensional pattern, The first major surface comprises a plurality of polishing elements corresponding to the impression of the three-dimensional pattern, wherein the plurality of polishing elements extend outwardly from the first major plane along a first direction substantially perpendicular to the first major plane, The polishing elements are also formed integrally with the sheet and are laterally connected to limit the lateral movement of the polishing element relative to one or more of the other polishing elements, but still moveable on an axis substantially perpendicular to the polishing surface of the polishing element. Do.

The plurality of polishing elements may be formed from a molten polymer continuous phase comprising organic particulates dispersed using, for example, extrusion or compression molding. To produce a polishing element using extrusion molding, a mixture of molten polymer comprising dispersed organic particulates is introduced into a twin screw extruder with a casting roll and film die having a desired pre-determined pattern of polishing elements. Can be supplied. Alternatively, a polymer film comprising dispersed organic particulates may be produced and compression molded in a second operation by a forming plate having a desired pre-determined pattern of polishing elements. In creating the desired pattern of polishing elements on the sheet, the sheet can be fixed to the flexible support layer, for example by thermal bonding to a thermal bonding film or by the use of an adhesive. Alternatively, the flexible support layer can be laminated to the polishing surface during film casting or compression molding.

In one particularly advantageous embodiment illustrating a unitary polishing pad, a back-fill chamber may be provided in a multi-cavity mold, where each cavity corresponds to a polishing element. A plurality of polishing elements, which may include porous polishing elements and non-porous polishing elements as described herein, injection molded a suitable polymer melt into a multi-cavity mold and the backfill chamber into the same polymer melt or another polymer melt. It can be formed by backfilling to form a support layer. The polishing element is still attached to the support layer upon cooling of the mold, forming a plurality of polishing elements as a unitary sheet of polishing element and support layer. The mold may include a rotating roll mold in some embodiments.

In another embodiment, an integrally molded sheet of polishing elements may be scored between the individual raised polishing elements to create a polishing surface of individual floating polishing elements. Alternatively, segregation in the molding process can also be achieved by including raised areas in the mold between the individual raised elements.

Suitable molding materials, molds, apparatus and methods for forming an integral sheet of polishing elements are described in the examples below and in PCT International Publication No. WO 2009/158665.

In a further alternative embodiment, the present invention provides a method of manufacturing the polishing pad 2 'as described above, wherein the method comprises a plurality of polishings comprising a first continuous polymer phase and an organic particulate filler dispersed therein. Forming an element, and bonding the polishing element to a first major face of the support layer, the support layer having a second major face opposite the first major face, to form a polishing pad. In some exemplary embodiments, the method further includes attaching the flexible layer to the second major face. In a further exemplary embodiment, the method further includes attaching a polishing composition distribution layer covering at least a portion of the first major face.

In some demonstrative embodiments, the method further includes forming a pattern with polishing elements on the first major face. In certain exemplary embodiments, forming the pattern may include reacting injection molding the polishing elements into a pattern, extruding the polishing elements into a pattern, compression molding the polishing elements into a pattern, and a template corresponding to the pattern. Arranging the polishing elements within, or arranging the polishing elements in a pattern on the support layer. In some particular exemplary embodiments, bonding the polishing element to the support layer includes thermal bonding, ultrasonic bonding, actinic radiation bonding, adhesive bonding, and combinations thereof.

In certain presently preferred embodiments, the polishing element is thermally bonded to the support layer. Thermal bonding, for example, is the temperature at which the major surface of the support layer is in contact with the surface of each polishing element to form a bond interface, and the polishing element and the support layer soften, melt, or flow together to form a bond at the bond interface. By heating the polishing element and the support layer up to. Ultrasonic welding can also be used to effect thermal bonding of the polishing element to the support layer. In some presently preferred embodiments, pressure is applied to the bonding interface while heating the polishing element and the support layer. In a further presently preferred embodiment, the support layer is heated up to a temperature higher than the temperature at which the polishing element is heated.

In another exemplary embodiment, bonding the polishing element to the support layer includes using a bonding material to form a physical and / or chemical bond at the interface between the polishing element and the major surface of the support layer. Such physical and / or chemical bonds may be formed using an adhesive located at the bonding interface between each polishing element and the major surface of the support layer in certain embodiments. In other embodiments, the bonding material may be cured, for example, by thermal curing, radiation curing (e.g., curing using actinic radiation such as ultraviolet light, visible light, infrared light, electron beams or other radiation sources), or the like. It may be a material forming the junction.

Suitable bonding film materials, devices and methods are described in PCT International Publication No. WO 2010/009420.

In a further exemplary embodiment presently preferred, at least some of the polishing elements comprise a porous polishing element. In some demonstrative embodiments, at least some of the polishing elements comprise a polishing element that is substantially non-porous. In some particular exemplary embodiments, the porous polishing element is injection molding of a gas saturated polymer melt, injection molding of a reactive mixture that releases gas upon reaction to form a polymer, injection of a mixture comprising a polymer dissolved in a supercritical gas. It is formed by molding, injection molding of a mixture of incompatible polymers in a solvent, injection molding of porous thermosetting fine particles dispersed in a thermoplastic polymer, injection molding of a mixture comprising microballoons, and combinations thereof. In further exemplary embodiments, the pores are formed by reaction injection molding, gas dispersed foaming, and combinations thereof.

In some exemplary embodiments, the porous polishing element has pores distributed substantially throughout the polishing element. In other embodiments, the pores may be distributed over the substantially polishing surface of the porous polishing element. In some further embodiments, the porosity imparted to the polishing surface of the porous polishing element is, for example, injection molding, calendaring, mechanical drilling, laser drilling, needle punching, gas dispersion foaming, chemical treatment, And combinations thereof.

It will be appreciated that the polishing pad need not include only substantially identical polishing elements. Thus, for example, any combination or arrangement of porous polishing elements and non-porous polishing elements can constitute a plurality of porous polishing elements. It will also be appreciated that any number, combination or arrangement of porous polishing elements and substantially non-porous polishing elements can be advantageously used to form a polishing pad having floating polishing elements bonded to a support layer in certain embodiments. will be.

In further exemplary embodiments, the polishing elements can be arranged to form a pattern. Any pattern can be advantageously employed. For example, the polishing elements can be arranged to form a two-dimensional array, for example a rectangular, triangular, or circular array of polishing elements. In a further exemplary embodiment, the polishing element may comprise both a porous polishing element arranged in a pattern on the support layer and a polishing element that is substantially non-porous. In certain exemplary embodiments, the porous polishing element can be advantageously arranged for any substantially non-porous polishing element to form an arrangement of the porous polishing element and the non-porous polishing element on the major surface of the support layer. have. In such embodiments, the number and arrangement of porous polishing elements relative to the substantially non-porous polishing element can be advantageously selected to achieve the desired polishing performance.

For example, in some exemplary embodiments, the porous polishing element may be arranged near substantially the center of the major surface of the polishing pad, and the substantially non-porous polishing element is the substantially peripheral edge of the major surface of the polishing pad. Can be arranged in the vicinity. Such exemplary embodiments preferably can more effectively retain a working liquid, such as an abrasive polishing slurry, in the contact area between the polishing pad and the wafer surface, thereby improving wafer surface polishing uniformity (eg, at the wafer surface). Reduced dishing) as well as reducing the amount of waste sludge produced by the CMP process. Such exemplary embodiments may also preferably provide more aggressive polishing at the edge of the die, thereby reducing or eliminating the formation of edge ridges and improving yield and die polishing uniformity.

In another exemplary embodiment, the porous polishing element can be arranged near the substantially edge of the major surface of the polishing pad, and the substantially non-porous polishing element can be arranged near the substantially center of the major surface of the polishing pad. have. Other arrangements and / or patterns of polishing elements are contemplated as falling within the scope of the present invention.

In certain embodiments of manufacturing the polishing pad 2 'as described above, the polishing elements may be arranged in a pattern by placement on the major surface of the support layer. In another exemplary embodiment, the polishing elements can be arranged in a pattern using a template of a desired pattern, and the support layer can be positioned above or below the polishing elements and template before bonding, wherein the major surface of the support layer is bonded In contact with each polishing element at the interface.

Exemplary embodiments of polishing pads with a polishing element according to the present invention may have various features and characteristics that enable their use in a variety of polishing applications. In some presently preferred embodiments, the polishing pad of the present invention may be particularly well suited for chemical mechanical planarization (CMP) of wafers used to fabricate integrated circuits and semiconductor devices. In certain exemplary embodiments, the polishing pads described herein can provide advantages over polishing pads known in the art.

For example, in some exemplary embodiments, the polishing pad according to the present invention retains the working liquid used in the CMP process at the interface between the polishing surface of the pad and the substrate surface being polished, thereby increasing the It can act to improve the effectiveness of the working liquid. In another exemplary embodiment, the polishing pad according to the present invention can reduce or eliminate dishing and / or edge erosion of the wafer surface during polishing. In some exemplary embodiments, the use of a polishing pad according to the present invention in a CMP process may result in improved in-wafer polishing uniformity, flatter polished wafer surface, increased edge die yield from the wafer, and improved CMP process operation. This can result in tolerance and consistency.

In a further exemplary embodiment, the use of a polishing pad having a porous element according to an exemplary embodiment of the present invention is to process a larger diameter wafer while maintaining the required surface uniformity to achieve high chip yield, wafer It may be possible to process more wafers before conditioning of the pad surface is required to maintain polishing uniformity of the surface, or to reduce processing time and wear on the pad conditioner.

Another advantage of using dispersed organic particulates in the continuous polymer phase in forming a textured polishing pad is the apparent ease of machining or milling the surface. Commercially available CMP pads typically consist of crosslinked polyurethane foam resistant to milling, which is extremely difficult to mill without tearing or damaging the foam. Solid thermoplastic textured polishing pad materials as described herein are less deformed during milling operations, thus making it easier to mill and to produce a clean surface.

Exemplary polishing pads according to the present invention will now be described with reference to the following non-limiting examples.

Example

The non-limiting examples below describe various methods for making both porous and non-porous polishing elements that can be used to make a polishing pad comprising a plurality of polishing elements bonded to a support layer.

Example 1

Preparation of the polishing pad 2 according to an exemplary embodiment of the present invention was carried out using the following procedure. In a container, 14.9 g of micronized synthetic wax, MP-22XF (from Micro Powders, Inc., Tarrytown, NY) was added TDI-polyether prepolymer, airtane. Airthane® was mixed with 92.5 g of PHP-75D (from Air Products and Chemicals, Inc., Allentown, Pa.) To form a dispersion. Oligomer diamine, polytetramethylene-dioxide-di-p-aminobenzoate, VERSALINKP-650® oligomer diamine (air products and chemicals) in 1 pint metal container 12.0 g, 4,4'-methylene-bis (3-chloro-2,6-diethylaniline), Versalink® MCDEA curing agent (Air Products and Chemicals) 50.0 g). By placing the metal container on a hot plate, the mixture was heated to the temperature at which the mixture melts. MP-22XF / Airtan® PHP-75D dispersion was then added to a 1 pint vessel to form a resinous slurry. The resulting resin-based slurry was poured at 1,000 rpm for 25 seconds in an Awatori-Rentaro AR-500 Thinky Mixer (from Thinky Corporation, Tokyo, Japan). Mix and degas at 1,500 rpm for 1 minute.

Using a knife coater measuring approximately 53.3 cm (21 inches) wide, the slurry was subjected to a 30.5 cm (12 inch) wide, 51 micron thick PET film liner and a 48 cm (19 inch) release liner, 3M. (3M) Secondary Liner 4935 (from 3M Company, St. Paul, Minn.) Was coated and allowed to b-step cure for 10 minutes at ambient temperature. The face of the release liner with release properties was contacted with the slurry. The thickness of the resin slurry coating was about 1,016 μm. The release liner was quickly removed to expose the surface of the partially cured resin.

Teflon, about 30.5 cm × 45.7 cm (12 inches × 18 inches), with a thickness of about 1.6 mm (0.0625 inches), with a hexagonal array of circular holes each about 6.2 mm in diameter and about 8 mm in center distance. The coated metal screen was placed on top of the b-step cured resin. PET liners, b-staged cured resins and metal screens were placed on aluminum plates 30.5 cm × 45.7 cm (12 inches × 18 inches) and 3.2 mm (0.125 inches) thick. A Teflon® sheet of 30.5 cm × 45.7 cm (12 inches × 18 inches) and 1.6 mm (0.0625 inches) thick was placed on top of the screen. The entire stack was then passed through a rubber roll loaded up to 0.23 kg / cm (mass per linear inch of film width) and two roll laminators with a speed of 0.6 m / sec.

The stack was placed in an air flow through oven set at 125 ° C. The resin was cured in the oven for 2 hours. The oven was turned off and the resin was allowed to cool in the oven overnight. After removal from the oven, the metal screen was removed from the cured resin to form a textured pad surface that adhered to the original PET liner. Using a 127 μm thick transfer adhesive, 3M adhesive transfer tape 9672 (from 3M Company), the PET liner on the structured pad surface was polyurethane foam, Rogers Poron urethane foam, part number 4701- 30.5 cm x 30.5 cm (12 inches x 12 inches) of 50-20062-04 (from American Flexible Products, Inc., Chaska, Minnesota, USA) and having a thickness of 1.59 mm ( 0.0625 inches) by hand lamination. A 23 cm (9 inch) diameter pad was die cut from the resulting laminate to form an exemplary polishing pad 2 of the present invention.

Example 2

Preparation of another exemplary polishing pad 2 of the present invention was carried out using the following procedure. In a vessel, 67.25 g of 45-75 μm spherical polyethylene beads (from Cospheric, LLC, Santa Barbara, Calif.) Were added TDI-polyether prepolymer, airtan (registered). Trade mark) PHP-75D (from Air Products and Chemicals, Inc.) 185.00 g to form a homogeneous dispersion. Oligomer diamine, polytetramethylene oxide-di-p-aminobenzoate, Versalinkpi-650® oligomeric diamine (from Air Products and Chemicals, Inc.) in one pint of metal containers 24.0 g and 60.0 g of 4,4'-methylene-bis (3-chloro-2,6-diethylaniline), Versalink® MCDEA curing agent (from Air Products and Chemicals, Inc.) United. By placing the metal container on a hot plate, the mixture was heated to the temperature at which the mixture melts. A polyethylene bead / airtan® PHP-75D dispersion was then added to a 1 pint vessel to form a resinous slurry. The resulting resin-based slurry was mixed in an AR-500 Sinky mixer (from Sinky Coroation) for 1 minute at 1,000 rpm and degassed at 2,000 rpm for 30 seconds.

Thermoplastic polyurethane (TPU), ESTANE 58887-NAT02 (available from Lubrizol Advanced Materials, Inc., Cleveland, Ohio) using a knife coater approximately 21 inches (53 inches) wide. A slurry of 1,448 μm thick, 53 cm (21 inch) wide was prepared on a 26 μm thick support layer formed by extruding the film at 182 ° C. onto a paper release liner in the form of a film. The coated slurry and support layer were placed on an aluminum plate 61 cm by 61 cm (24 inches by 24 inches) and 6.35 mm (0.25 inches) thick. 36 magnets with a diameter of 1.25 cm (0.5 inch) and a thickness of 0.48 cm (3/16 inch) were fitted into the recesses on the back of the aluminum plate. The magnets were evenly distributed in a square array.

A Teflon® coated metal screen was placed on top of the resin as described in Example 1 and the entire stack was placed in an air flow through oven set to 125 ° C. The resin was cured in the oven for 2 hours. After removal from the oven, the metal screen was removed from the cured resin to form a textured pad surface that adhered to the original paper backed polyurethane support layer. The paper was removed to expose the opposite side of the polyurethane support layer.

Using a 127 μm thick transfer adhesive, 3M adhesive transfer tape 9672 (from 3M Company), the polyurethane support layer on the textured pad surface was polyurethane foam, Rogers Poron urethane foam, part number 4701-50-20062-04. (61 inches by 61 inches (24 inches by 24 inches)) (from American Flexible Products, Inc.) and laminated by hand to 1.59 mm (0.0625 inches) thick. A 20 inch diameter pad was die cut from the laminate to form the pad of the present invention.

Embodiments 1 and 2 above are a sheet having a first main surface and a second main surface opposite the first main surface, and from the first main surface along a first direction substantially perpendicular to the first main surface. And to a polishing pad comprising a plurality of polishing elements extending outwardly, wherein at least some of the polishing elements are integrally formed with the sheet and the lateral movement of the polishing elements relative to at least one of the other polishing elements. Although connected laterally to limit, it is still movable in an axis substantially perpendicular to the polishing surface of the polishing element, at least some of the plurality of polishing elements comprising organic particulate filler in the continuous polymer phase.

However, any of the above molded or roller embossed films of Examples 1 and 2 has a first major face and a second major face opposite the first major face, and a support layer A plurality of polishing elements bonded to one major face, wherein each polishing element has an exposed polishing surface, the polishing element being along a first direction substantially perpendicular to the first major face; Extending from the face, at least some of the plurality of polishing elements may be used to produce a polishing element 4 for use in making a polishing pad 2 'comprising a first continuous polymer phase and an organic particulate filler. I will understand that. The molded or embossed polishing element is for example cut from the film (eg using die cutting) and, as described above, is preferably subsequently used to direct the first major face of the support layer, using direct thermal bonding. Can be bonded.

It will also be appreciated that in the exemplary polishing pads and methods, the relative order and arrangement of the elements may vary without departing from the scope of the present invention. Thus, for example, the support layer aligns the polishing elements in a template in a two-dimensional array pattern, for example as described in PCT International Publication No. WO 2010/009420, and is overlaid on the support layer (ie, thermal bonding film). Prior to thermal bonding the polishing element to the substrate, it may be overlaid with a template disposed on the temporary release layer and having a desired pattern for the polishing element.

It will also be appreciated that the relative order and arrangement of elements in the exemplary polishing pads and methods described above may vary without departing from the scope of the present invention. It will further be appreciated that the polishing pad of an exemplary embodiment of the present invention need not include only substantially identical polishing elements. Thus, for example, any combination or arrangement of porous polishing elements and non-porous polishing elements can constitute a plurality of porous polishing elements. It will also be appreciated that any number, combination or arrangement of porous polishing elements and substantially non-porous polishing elements can be advantageously used to form a polishing pad having floating polishing elements bonded to a support layer in certain embodiments. will be. In addition, porous polishing elements may replace any number, arrangement, or combination of non-porous polishing elements. Thus, using the teachings provided in the description and examples above, individual porous polishing elements and optionally non-porous polishing elements are attached to (or integrally formed with) a support layer to provide various additional embodiments of the present invention. A polishing pad can be provided.

Finally, a polishing pad as disclosed herein generally comprises any combination of optional elements disclosed herein, for example, an optional flexible layer attached to the second major face with an optional adhesive layer, a second note. It will be appreciated that it may include an optional pressure sensitive adhesive layer attached to the flexible layer opposite the face, an optional guide plate (for a polishing pad embodiment such as 2 '), an optional polishing composition distribution layer, and the like.

Reference throughout this specification to “one embodiment”, “predetermined embodiment”, “one or more embodiments” or “embodiment” includes the term “exemplary” preceding the term “embodiment”. Whether or not included, it means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of certain exemplary embodiments of the invention. Thus, the appearances of the phrases such as "in one or more embodiments", "in certain embodiments", "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily limited to certain aspects of the invention. It is not intended to say the same among the exemplary embodiments of. In addition, certain features, structures, materials, or properties may be combined in any suitable manner in one or more embodiments.

While the specification has described certain exemplary embodiments in detail, it will be appreciated that those skilled in the art will readily recognize modifications, variations, and equivalents thereof, upon understanding the above. Therefore, it should be understood that the present invention should not be unduly limited to the exemplary embodiments described above. In particular, as used herein, reference to a numerical range by an endpoint is intended to include all numbers falling within the range (eg, 1 to 5 is 1, 1.5, 2, 2.75, 3). , 3.80, 4, and 5). In addition, all numbers used herein are assumed to be modified by the term “about”. In addition, all publications and patents referenced herein are incorporated by reference in their entirety to the same extent as if each individual publication or patent was specifically and individually indicated to be incorporated by reference.

Various exemplary embodiments have been described. These and other embodiments are within the scope of the following claims.

Claims (69)

As a polishing pad,
A sheet having a first major side and a second major side opposite the first major side; And
A plurality of polishing elements extending outwardly from the first main surface along a first direction substantially perpendicular to the first major surface, wherein at least some of the polishing elements are integrally formed with the sheet, among other polishing elements Are laterally connected to limit lateral movement of the polishing element relative to one or more, but are still movable in an axis substantially perpendicular to the polishing surface of the polishing element, at least some of the plurality of polishing elements being a continuous polymer phase polishing pad comprising organic particulate filler in phase). As a polishing pad,
A support layer having a first major face and a second major face opposite the first major face; And
A plurality of polishing elements bonded to the first major face of the support layer, each polishing element having an exposed polishing surface,
The polishing element extends from the first major face of the support layer along a first direction substantially perpendicular to the first major face, and wherein at least some of the plurality of polishing elements comprise organic particulate filler in the continuous polymer phase. The polishing pad of claim 2, wherein each polishing element is attached to the first major surface by bonding to a support layer. The device of claim 3, further comprising a guide plate opposite the support layer, the guide plate comprising a plurality of openings extending through the guide plate, wherein at least a portion of each polishing element is correspondingly corresponding. Polishing pads extending into the openings. The polishing pad of claim 4, wherein a portion of each polishing element passes through the corresponding opening. 5. The polishing pad of claim 4 wherein each polishing element has a flange and each flange has a perimeter greater than the perimeter of the corresponding opening. The polishing pad of claim 2, wherein the guide plate comprises a polymer, a copolymer, a polymer blend, a polymer composite, or a combination thereof. The polishing pad of claim 2, wherein the guide plate maintains the orientation of the polishing elements along the first direction while allowing the polishing elements to independently translate along the first direction relative to the guide plate. The polishing pad of claim 2, further comprising a polishing composition distribution layer covering at least a portion of the guide plate. The polishing pad of claim 1, further comprising a polishing composition distribution layer covering at least a portion of the first major face. The polishing pad of claim 9, wherein each polishing element extends at least about 0.25 mm in a first direction above a plane comprising the polishing composition distribution layer. The polishing pad of claim 9, wherein at least some of the polishing elements have a polishing surface coplanar with the exposed surface of the polishing composition distribution layer. The polishing pad of claim 9, wherein at least some of the polishing elements have a polishing surface indented below the exposed surface of the polishing composition distribution layer. The polishing pad of claim 12 or 13, wherein the polishing composition distribution layer comprises an abrasive material having a hardness less than that of the polishing element. The polishing pad of claim 9, wherein the polishing composition distribution layer comprises at least one hydrophilic polymer. The polishing pad of claim 9, wherein the polishing composition distribution layer comprises a foam. 10. The polishing pad of claim 2 or 9 wherein each polishing element is thermally bonded to a support layer. 10. The polishing pad of claim 2 or 9 wherein the support layer comprises a thermoplastic polyurethane. 11. The polishing pad of any one of claims 1, 2, 9, and 10 further comprising a compliant layer attached to the second major side opposite the plurality of polishing elements. The polishing pad of claim 19, wherein the compliance of the polishing composition distribution layer is less than the compliance of the flexible layer. 20. The polishing pad of claim 19 wherein the flexible layer is attached to the second major face by an adhesive layer at an interface between the flexible layer and the second major face. 20. The polishing pad of claim 19 wherein the flexible layer comprises a polymeric material selected from silicone, natural rubber, styrene-butadiene rubber, neoprene, polyurethane, polyethylene, and combinations thereof. 20. The polishing pad of claim 19 further comprising a pressure sensitive adhesive layer attached to the flexible layer opposite the second major face. 11. A polishing pad according to any one of the preceding claims, wherein each polishing element extends at least about 0.25 mm in a first direction over a plane comprising the first major surface. . The process of claim 1, 2, 9, or 10, wherein the continuous polymer phase is a thermoplastic polyurethane, acrylated polyurethane, epoxidized polyurethane, epoxidized rubber, vinyl resin, cyclopenta. A polishing pad comprising diene resin, vinyl ether resin, and combinations thereof. The polishing pad of claim 1, 2, 9, or 10, wherein the organic particulate filler comprises at least one of a thermoplastic polymer, a thermoset polymer, a water soluble polymer, or a combination thereof. 27. The method of claim 26, wherein the organic particulate filler comprises a polyolefin, a cyclic polyolefin, a polyolefin-based thermoplastic elastomer, polyvinyl alcohol, poly (ethylene oxide), poly (vinyl alcohol), poly (vinyl pyrrolidone), polyacrylic acid, poly ( A polishing pad comprising at least one of meth) acrylic acid, or a combination thereof. The polishing pad of claim 27 wherein the polyolefin is selected from polyethylene, polypropylene, polybutylene, polyisobutylene, polyoctene, copolymers thereof, and combinations thereof. The polishing pad of claim 1, 2, 9, or 10, wherein the organic particulate filler is comprised from about 5% to about 90% by weight of each polishing element. The organic particulate filler of any one of claims 1, 2, 9, and 10, wherein the organic particulate filler is 5 to 5,000 micrometers long, 5 to 250 micrometers wide, 5 to 100 micrometers equivalent. A polishing pad characterized by at least one of an equivalent spherical diameter, or a combination thereof. The polishing pad of claim 1, 2, 9, or 10, wherein the polishing element further comprises abrasive particulates having a median diameter of less than 1 micron. 11. The method of any one of claims 1, 2, 9, and 10, wherein at least one of the polishing elements comprises a porous polishing element, each porous polishing element comprising a plurality of pores ( pore). 33. The polishing pad of claim 32 wherein substantially all of the polishing elements are porous polishing elements. 33. The polishing pad of claim 32 wherein the pores constituting each porous polishing element are substantially distributed throughout the porous polishing element. 33. The polishing pad of claim 32 wherein the plurality of pores constitute a closed cell foam. 33. The polishing pad of claim 32 wherein the plurality of pores constitutes an open cell foam. 33. The polishing pad of claim 32 wherein the plurality of pores exhibit a unimodal pore size distribution. 33. The polishing pad of claim 32, wherein the plurality of pores exhibits an average pore size of about 1 nanometer to about 300 micrometers. 33. The polishing pad of claim 32, wherein the plurality of pores exhibits an average pore size of about 1 micrometer to about 100 micrometers. The polishing element of claim 1, 2, 9, or 10, wherein the polishing element is selected in a first direction, selected from circular, oval, triangular, square, rectangular, and trapezoidal, and combinations thereof. A polishing pad selected to have a cross section taken. The polishing pad of claim 1, 2, 9, or 10, wherein the polishing element has at least one dimension of about 0.1 mm to about 30 mm. 11. A polishing pad according to any one of the preceding claims, wherein the polishing elements are arranged in a two dimensional array pattern on the first major face. 10. The polishing pad of claim 2 or 9 wherein at least one of the polishing elements is a transparent polishing element. 10. The polishing pad of claim 9 wherein the support layer, guide plate, polishing composition distribution layer, at least one polishing element, or a combination thereof is transparent. The polishing pad of claim 19, wherein the support layer, guide plate, polishing composition distribution layer, flexible layer, adhesive layer, at least one polishing element, or a combination thereof is transparent. The polishing pad of claim 1, further comprising at least one transparent polishing element attached to the transparent portion of the sheet. 47. A method of using the polishing pad according to any one of claims 1 to 46,
Contacting the surface of the substrate with the polishing surface of the polishing pad of any one of claims 1-46; And
Moving the polishing pad relative to the substrate to wear the surface of the substrate. 48. The method of claim 47, further comprising providing a polishing composition at an interface between the polishing pad surface and the substrate surface. 47. A method of manufacturing the polishing pad according to any one of claims 1, 10-42 and 46,
Dispersing the organic particulate filler in the curable composition comprising the curable polymer precursor material;
Dispensing the curable composition into a mold; And
A polymer sheet comprising organic particulate filler dispersed in at least partially cured polymer precursor material and having a first major face and a second major face opposite the first major face, and a first substantially perpendicular to the first major face Curing the curable composition in the mold to form a plurality of polishing elements extending outwardly from the first major face along the direction, wherein the polishing elements are integrally formed with the sheet and to one or more of the other polishing elements. Connecting laterally to limit lateral movement of the polishing element, but still moveable in an axis substantially perpendicular to the polishing surface of the polishing element. The method of claim 49, wherein dispersing the organic particulate filler comprises high shear mixing, media milling, media-less milling, or a combination thereof. 51. The method of claim 49 or 50, wherein dispensing the curable composition into the mold comprises at least one of reaction injection molding, extrusion molding, compression molding, or a combination thereof. How to include. The method of any one of claims 49-51, wherein curing the curable composition is accomplished by thermal curing, thermal curing under pressure, actinic radiation curing, or a combination thereof. 46. A method for manufacturing a polishing pad according to any one of claims 2 to 9 and 11 to 45,
Forming a plurality of polishing elements comprising organic particulate filler dispersed in the continuous polymer phase; And
Bonding the polishing element to a first major face of the support layer, the support layer having a second major face opposite the first major face, to form a polishing pad. 54. The method of any one of claims 49-53, further comprising forming a pattern with a plurality of polishing elements on the first major face. 55. The method of claim 54, wherein forming the pattern comprises reaction injection molding the polishing elements into a pattern, extruding the polishing elements into a pattern, compression molding the polishing elements into a pattern, and a template corresponding to the pattern. Arranging polishing elements), or arranging the polishing elements in a pattern on a support layer. 56. The method of any one of claims 50-55, wherein bonding the polishing element to the support layer comprises thermal bonding, ultrasonic bonding, actinic radiation bonding, adhesive bonding, and combinations thereof. The continuous polymer phase of claim 49, wherein the continuous polymer phase is a thermoplastic polyurethane, acrylated polyurethane, epoxidized polyurethane, epoxidized rubber, vinyl resin, cyclopentadiene resin, vinyl ether resin, and these How to include a combination of. 58. The method of any one of claims 49-57, wherein the organic particulate filler comprises at least one of a thermoplastic polymer, a thermoset polymer, a water soluble polymer, or a combination thereof. 59. The method of claim 58, wherein the organic particulate filler comprises polyolefin, cyclic polyolefin, polyolefin-based thermoplastic elastomer, polyvinyl alcohol, poly (ethylene oxide), poly (vinyl alcohol), poly (vinyl pyrrolidone), polyacrylic acid, poly ( Meth) acrylic acid, or a combination thereof. 60. The method of claim 59, wherein the polyolefin is selected from polyethylene, polypropylene, polybutylene, polyisobutylene, polyoctene, copolymers thereof, and combinations thereof. 61. The method of any one of claims 49-60, wherein the organic particulate filler is comprised from about 5% to about 90% by weight of each polishing element. 62. The organic particulate filler of claim 49, wherein the organic particulate filler comprises at least 5 to 5,000 micrometers in length, 5 to 250 micrometers in width, 5 to 100 micrometers in equivalent sphere diameter, or a combination thereof. How to feature one. 63. The method of any one of claims 49-62, wherein the polishing element further comprises abrasive particulates having a median diameter of less than 1 micrometer. 64. The method of any one of claims 49-63, wherein at least some of the polishing elements comprise a porous polishing element. 65. The method of claim 64, wherein the porous polishing element is injection molding of a gas saturated polymer melt, injection molding of a reactive mixture that releases gas upon reaction to form a polymer, injection molding of a mixture comprising a polymer dissolved in a supercritical gas, solvent Injection molding of a mixture of heavy incompatible polymers, injection molding of porous thermosetting particulates dispersed in a thermoplastic polymer, including micro-balloons, and combinations thereof. 66. The method of claim 65, wherein the pores are formed by reaction injection molding, gas dispersion foaming, and combinations thereof. 67. The method of any one of claims 49-66, wherein at least some of the polishing elements comprise a polishing element that is substantially non-porous. 68. The method of any one of claims 49-67, further comprising attaching the flexible layer to the second major face. 69. The method of any one of claims 49-68, further comprising attaching a polishing composition distribution layer covering at least a portion of the first major face.

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