KR20120109201A - Method for preparation of light emitting diode package and molding frame for preparation of light emitting diode package - Google Patents

Abstract

As a light emitting diode manufacturing method which can improve the quality of the light emitting diode and can reduce the manufacturing cost of the light emitting diode by omitting equipment investment such as manufacturing equipment in the light emitting diode manufacturing, a light emitting chip on a substrate using a molding frame Forming a mold space having an upper surface open to the outside while surrounding the periphery, and filling the mold space to surround the light emitting chip by dropping a liquid mold material from an upper portion to a lower portion of the mold space; A method of manufacturing a light emitting diode package is provided.

Description

METHOD FOR PREPARATION OF LIGHT EMITTING DIODE PACKAGE AND MOLDING FRAME FOR PREPARATION OF LIGHT EMITTING DIODE PACKAGE}

Provided are a manufacturing method of a light emitting diode package and a mold for manufacturing a light emitting diode package. In more detail, the quality of the light emitting diode can be improved, and in manufacturing the light emitting diode, a method of manufacturing a light emitting diode package and a light emitting diode package for reducing manufacturing cost of the light emitting diode by omitting facility investment such as manufacturing equipment, etc. Molding molds are provided.

Light Emitting Diode (LED) is a semiconductor device that emits light when current flows, and is a PN junction diode composed of gallium arsenide (GaAs) and gallium nitride (GaN) optical semiconductors. It is an electronic component that turns into.

The area of light emitted from the light emitting diodes ranges from red (630 nm to 700 nm) to blue-violet (400 nm), including blue, green and white, and consumes less power than conventional light sources such as incandescent bulbs and fluorescent lamps. Due to the advantages of high efficiency, long operating life, etc., the demand is continuously increasing.

Recently, the application range of the light emitting diode has been gradually expanded from the small light of the mobile terminal to the interior lighting, automotive lighting, backlight for large LCD (Liquid Crystal Display).

In general, the LED package includes a molding part formed by a transfer molding process to protect the LED chip mounted on the substrate from external force. As the material of the molding part, an epoxy molding compound (EMC) having excellent economical efficiency, mass productivity, and excellent water absorption resistance is used as the light transmitting resin material.

When manufacturing a light emitting diode package by such transfer molding, transfer molding is divided into a case of molding only the lens of the light emitting diode and a case of molding the entire upper package. When only the lens is formed by molding in the transfer molding of the LED package, the adhesion of the lens is not good, the gate number of the mold for the transfer molding is increased, and the transfer molding method is difficult. On the other hand, in the case where the transfer molding is formed entirely on the package, resin dropping is likely to occur at the interface between the ceramic and the resin in the sorting and tapping process after package cutting.

1 is a cross-sectional view of a conventional transfer molding apparatus, and FIG. 2 is a plan view of the transfer molding apparatus of FIG. 1.

Referring to these drawings, the transfer molding apparatus has a structure including an upper mold 70 and a lower mold 80, and a substrate 10a is disposed in an empty space formed between the upper mold 70 and the lower mold 80. The top mold 70 is provided with the intaglio portions 40 having shapes corresponding to the lens portions surrounding the light emitting chips (not shown) mounted on the substrate 10a. In addition, the resin injection portion 60a and the resin discharge portion 60b are formed in the upper mold 70 and the lower mold 80, respectively, and the resin injection portion 60a and the resin discharge portion 60b are engraved portions. 40 are connected by mold connections 50a, 50b, 50c.

In the transfer molding method using the transfer molding apparatus, a substrate 10a on which a light emitting chip is mounted is disposed between the upper mold 70 and the lower mold 80, and a liquid translucent resin is injected into the resin injecting part 60a. Translucent resins are forced through the mold connecting portions 50a, 50b, and 50c in the direction of the resin discharge portion 60b, and pressurized to fill the intaglio portions 40, and then the intaglio portion 40 having a shape corresponding to the lens portion. ) And the translucent resins filled in the mold connecting portions 50a, 50b, and 50c, and the upper mold 70 and the lower mold 80 are separated from the substrate 10a, and then, using dicing equipment or the like. Separation and cutting at a predetermined position 9 are performed to manufacture respective light emitting diodes mounted with a light emitting chip surrounded by a lens unit.

3 is a perspective view of a light emitting diode manufactured using a conventional transfer molding apparatus.

Referring to FIG. 3, a light emitting diode corresponds to a shape of a mold connecting portion formed to allow a translucent resin to flow in a transfer molding process on both sides of a lens unit 40 formed of a translucent resin surrounding a light emitting chip on a substrate 10. The gate portion 50 is formed.

As such, the light emitting diode manufactured by the transfer molding method may degrade the optical characteristics of the light emitting diode due to the unnecessary gate part 50 connected to the lens part 40, and a large load is applied to the substrate during the transfer molding process. As a result, the substrate may be damaged or cracked.

According to an embodiment of the present invention, a method of manufacturing a light emitting diode package which can improve the quality of a light emitting diode and can reduce manufacturing cost of a light emitting diode by omitting facility investment such as manufacturing equipment in manufacturing a light emitting diode. And a mold for manufacturing a light emitting diode package is provided.

In the method of manufacturing a light emitting diode package according to an embodiment of the present invention, forming a mold space having an upper surface open to the outside so as to surround a light emitting chip on a substrate using a molding frame, and a lower portion from an upper portion of the mold space. The method of manufacturing a light emitting diode package including the step of filling the mold space so as to surround the light emitting chip by dropping the liquid mold material.

According to one aspect of the invention, the molding die may be bonded by a heat-peelable adhesive sheet on a substrate on which the light emitting chip is mounted.

According to one side of the present invention, the heat-peelable pressure-sensitive adhesive sheet may have a structure in which a pressure-sensitive adhesive layer is formed on one surface of the base film, and a heat-peelable adhesive layer is formed on the other surface of the base film.

According to one aspect of the invention, after curing the mold material of the liquid surrounding the light emitting chip surroundings, it may further comprise the step of separating the mold and the substrate.

According to one aspect of the present invention, the mold material may be a translucent liquid resin containing phosphor particles.

In the mold for manufacturing a light emitting diode package according to an embodiment of the present invention, an inner surface of the molding frame is formed to surround a light emitting chip on a substrate, and an upper surface thereof is opened to the outside so that a molding material may be injected in a vertical direction. A mold for manufacturing a light emitting diode package.

According to one aspect of the invention, the molding die may be combined by a heat-peelable pressure-sensitive adhesive sheet on a substrate on which the light emitting chip is mounted.

According to one side of the invention, the mold space may be a trapezoidal cylindrical shape.

Provided are a manufacturing method of a light emitting diode package and a molding frame for manufacturing a light emitting diode package, which can improve the quality of the light emitting diode and can reduce the manufacturing cost of the light emitting diode by omitting facility investment such as manufacturing equipment. do.

1 is a cross-sectional view of a conventional transfer molding apparatus;
2 is a plan view of the transfer molding apparatus of FIG. 1;
3 is a perspective view of a light emitting diode manufactured using a conventional transfer molding apparatus;
4 is a cross-sectional view of a mold for manufacturing a light emitting diode package according to an embodiment of the present invention;
FIG. 5 is an enlarged view illustrating an enlargement of a connection between the mold and the substrate of FIG. 4; FIG.
6 to 11 are cross-sectional views sequentially illustrating a method of manufacturing a light emitting diode package according to an embodiment of the present invention;
12 is a perspective view of a light emitting diode manufactured by a method of manufacturing a light emitting diode package according to an embodiment of the present invention.

Hereinafter, the Example of this invention is described concretely.

In the method of manufacturing a light emitting diode package according to the present invention, forming a mold space having an upper surface open to surround the light emitting chip on a substrate by using a molding mold, and forming a liquid mold material from the top of the mold space to the bottom thereof. Dropping to fill the mold space to surround the light emitting chip.

That is, in the method of manufacturing a light emitting diode package of the present invention, a light emitting chip is mounted on a substrate, and a mold is formed on the substrate to form a mold space having an upper surface open to the outside while surrounding the light emitting chip on the substrate. The liquid crystal material may be dropped from the upper portion to the lower portion of the mold space to form a package part including a lens and a filler of the light emitting diode by a simple method of filling the mold space to surround the light emitting chip.

Therefore, unlike conventional transfer molding method or compression molding method, it is possible to emit light with excellent quality by simple process without using complicated and various molding equipment such as extrusion equipment and mold gate used in the method of manufacturing a light emitting diode package. Diode packages can be manufactured.

In addition, since the mechanical stress is not applied to the printed circuit board and the light emitting chip on which the light emitting chip is mounted, a light emitting diode having excellent quality can be manufactured and the manufacturing cost of the light emitting diode can be reduced.

The mold may be, for example, a structure bonded on a substrate on which a light emitting chip is mounted, and specifically, may be a structure bonded by an adhesive sheet such as a heat-peelable adhesive sheet. In the heat-peelable pressure-sensitive adhesive sheet, when the temperature rises by heating in a state in which the mold is adhered on the substrate, the pressure-sensitive adhesive sheet is foamed by the foaming agent inside the pressure-sensitive adhesive sheet to lower the adhesive force, thereby forming the mold and the substrate. It is an adhesive sheet that can be easily separated.

The kind and structure of the heat-peelable pressure-sensitive adhesive sheet are not particularly limited, and, for example, a heat-peelable adhesive layer is formed on one surface of the base film, and a heat-peelable adhesive layer is formed on the other surface of the base film. An adhesive sheet can be used.

The method of manufacturing a light emitting diode package includes forming a mold space having an upper surface open to the outside while surrounding a light emitting chip on a substrate using a molding mold, and dropping a liquid mold material from an upper portion to a lower portion of the mold space. Filling the mold space to surround the light emitting chip, and then curing the liquid mold material surrounding the light emitting chip to finish the manufacture of the light emitting diode, and then separating the mold and the substrate. It may include. After this step, the liquid mold material is formed on the substrate with the lens and package portion of the light emitting diode having a predetermined shape.

As the mold material, a translucent liquid resin including phosphor particles may be used to serve as a package part including a lens and a filler, which are cured and emitted from the light emitting chip to the outside. Such translucent liquid resins include at least one phosphor, such as nitride-based phosphors, sulfide-based phosphors, and silicate-based phosphors, which exhibit blue, red, or green colors in translucent resins such as epoxy resins or silicone resins. It may be a translucent liquid resin containing.

The present invention also provides a mold for manufacturing a light emitting diode package in which an inner side of the inner surface is formed to surround a light emitting chip on a substrate, and an upper surface thereof is opened to the outside so that the molding material may be injected in a vertical direction.

The mold for manufacturing a light emitting diode package may be formed by dropping a liquid mold material from an upper portion to a lower portion of the mold space to fill a mold space having a closed surface formed on the inner side thereof to surround a light emitting chip. It can be used to form a package portion consisting of a lens and a filler.

Therefore, unlike the conventional transfer molding method or the compression molding method, it is excellent by a simple process without using complicated and various molding equipment such as extrusion equipment and mold gate used in the manufacturing method of the LED package. Quality LED packages can be manufactured. In addition, it is possible to manufacture a light emitting diode having excellent quality by reducing mechanical stress on the printed circuit board and the light emitting chip itself is mounted, it is possible to reduce the manufacturing cost of the light emitting diode.

The molding die may be one bonded by a heat-peelable pressure-sensitive adhesive sheet on a substrate on which a light emitting chip is mounted, so that the mold may be easily manufactured. When the temperature rises by heating in the state bonded on the adhesive sheet, the pressure-sensitive adhesive sheet is foamed by the foaming agent inside the pressure-sensitive adhesive sheet to lower the adhesive force, thereby making it possible to easily separate the mold and the substrate.

The mold space may be formed in various shapes such as a cylindrical shape and a hexahedral shape. For example, the mold space may be formed in a trapezoidal cylindrical shape that is easy to form a stable package part on a substrate.

Since a specific configuration and manufacturing method of a general light emitting diode is well known in the art, a detailed description thereof will be omitted.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to or limited by the embodiments.

FIG. 4 is a cross-sectional view of a mold for manufacturing a light emitting diode package according to an embodiment of the present invention, and FIG. 5 is an enlarged view illustrating an enlarged connection between the mold and the substrate.

Referring to these drawings, the mold 100 for manufacturing a light emitting diode package is a trapezoidal cylindrical shape surrounding the light emitting chip (not shown) on the substrate, the inner side is a closed curved surface and the molding material in the vertical direction The upper surface of the mold space is opened to the outside to be injected. The mold 100 is bonded to the substrate 110 by a heat-peelable pressure-sensitive adhesive sheet 111, the heat-peelable pressure-sensitive adhesive sheet 111 is a pressure-sensitive adhesive layer (111a) on one surface of the base film (111b) It is formed and has a structure in which the heat-peelable adhesive layer 111c is formed on the other surface of the base film 111b.

6 to 11 are cross-sectional views sequentially illustrating a method of manufacturing a light emitting diode package according to an embodiment of the present invention;

Referring to these drawings, a method of manufacturing a light emitting diode package, as shown in FIG. 6, first places a light emitting chip 120 on a substrate 110, and then uses a wire 130 to form a light emitting chip 120. Circuit portions (not shown) formed on the substrate 110 are electrically connected to each other. Then, using the heat-peelable pressure-sensitive adhesive sheet 111, the molding die is formed to form a mold space in which a trapezoidal cylindrical shape is formed around the light emitting chip 120 on the substrate 110 and the upper surface is opened to the outside. )

Next, as shown in FIG. 7, phosphor particles are formed as a mold material from the upper part to the lower part of the mold space formed by the mold 100 on the substrate 110 on which the light emitting chip 120 and the mold 100 are formed. The translucent liquid resin 141 is dropped to fill the mold space to surround the light emitting chip 120.

Next, as shown in FIG. 8, the translucent liquid resin 140 filled in the mold space formed by the mold 100 on the substrate 110 is heated to a temperature of about 60 ° C. to 80 ° C. using a heating oven or the like. It is cured by heating after cooling as a whole.

Next, as shown in FIG. 9, the substrate 110 is separated and cut by using the blade 170 on the opposite side (the back side of the substrate) to the surface on which the forming mold 100 of the substrate 110 is coupled. do. Here, the substrate 110 is separated from each other to be coupled to the LED package unit, and the molding die 100 is still coupled to the respective substrates 100.

Next, as illustrated in FIGS. 10 and 11, the heat-peelable pressure-sensitive adhesive sheet is formed between the mold 100 and the substrate 110 in the LED package in which the substrates 110 are separated. The substrate 110 and the mold 100 are separated from each other by heating the 111 to a temperature of approximately 150 ° C. to 250 ° C. using an electric heater, a hot air dryer, or a near infrared lamp. Here, in order to facilitate separation of the substrate 110 and the molding die 100, a lubricity drill machining entry board 200 is disposed on the molding die 100, and the lubricity drill is penetrated through the entry board, thereby transmitting a transparent liquid. The substrate 110 and the molding die 100 may be separated by pushing the lens portion in which the resin 140 is cured.

12 is a perspective view of a light emitting diode manufactured by a method of manufacturing a light emitting diode package according to an embodiment of the present invention.

Referring to FIG. 12, in the light emitting diode, a lens unit 140 made of a translucent resin surrounding a light emitting chip on a substrate 110 has a trapezoidal cylindrical shape, and may be generated in a transfer molding process around the lens unit 140. Since unnecessary gate portions and the like are not formed, optical characteristics of the light emitting diode can be improved, and light emission having excellent quality with minimized damage or crack generation in the substrate 110, the circuit portion 133, and the terminal portion 122, etc. It is made of a diode.

As described above, the present invention has been described by way of limited embodiments and drawings, but the present invention is not limited to the above embodiments, and those skilled in the art to which the present invention pertains various modifications and variations from such descriptions. This is possible.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the equivalents of the claims, as well as the claims.

100: forming mold 110: substrate
120: light emitting chip 111: heat release adhesive sheet
160: translucent liquid resin

Claims (8)

Forming a mold space having an upper surface open to the outside while surrounding a light emitting chip on a substrate using a mold; And
Filling the mold space so as to surround the light emitting chip by dropping a liquid mold material from the top to the bottom of the mold space;
Light emitting diode package manufacturing method comprising a.
The method of claim 1,
The forming mold is a light emitting diode package manufacturing method is bonded by a heat-peelable adhesive sheet on a substrate on which the light emitting chip is mounted.
The method of claim 2,
The heat-peelable pressure-sensitive adhesive sheet is a light emitting diode package manufacturing method having a pressure-sensitive adhesive layer is formed on one surface of the base film, the heat-peelable adhesive layer is formed on the other surface of the base film.
The method of claim 1,
And curing the mold material of the liquid surrounding the light emitting chip, and separating the mold from the substrate.
The method of claim 1,
The mold material is a light emitting diode package manufacturing method of a transparent liquid resin containing phosphor particles.
A mold for manufacturing a light emitting diode package having a structure surrounding a light emitting chip on a substrate and forming a mold space having an upper surface open to the outside.
The method according to claim 6,
The forming mold is a mold for manufacturing a light emitting diode package that is bonded by a heat-peelable adhesive sheet on a substrate on which a light emitting chip is mounted.
The method according to claim 6,
The mold space is a mold for manufacturing a light emitting diode package having a trapezoidal cylindrical shape.

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