KR20120087581A - Light emitting device package - Google Patents

Abstract

An embodiment relates to a light emitting device package. The light emitting device package according to the embodiment is coupled to the first body, at least one pair of lead frames provided in the first body, at least one light emitting device electrically connected to the lead frame, and the first body, and inclined. And a second body having a portion. Thereby, the efficiency of the phosphor used at the time of white light conversion can be increased.

Description

A light emitting device package

The embodiment relates to a light emitting device package in which a structure is attached to improve white conversion efficiency of a vertical light emitting device.

LED (Light Emitting Diode) is a device that converts an electric signal into infrared, visible light or light by using the characteristics of compound semiconductor.It is used in home appliances, remote controls, electronic signs, indicators, and various automation devices. Increasingly, the usage area is expanding.

On the other hand, the external quantum efficiency, which is the light efficiency of the light emitting device, is determined by the product of the internal quantum efficiency and the light extraction efficiency, and the internal quantum efficiency is determined by the quality of the semiconductor and the efficiency of current injection. The light extraction efficiency is reduced by total internal reflection due to the difference in refractive index between gallium nitride (GaN) and air in the light emitting device. In order to increase light extraction efficiency, a vertical light emitting device has been developed, and a method of forming surface irregularities has been developed.

The embodiment provides a light emitting device package capable of improving white light conversion efficiency as light emitted from a vertical light emitting device is reflected on a second body having a reflective layer, thereby adjusting the directivity angle in various directions. There is a purpose.

The light emitting device package according to the embodiment is coupled to the first body, at least one pair of lead frames provided in the first body, at least one light emitting device electrically connected to the lead frame, and the first body, and inclined. And a second body having a portion.

According to the embodiment, by providing a reflective layer to allow the light to travel at various angles, it is possible to increase the efficiency of the phosphor used in the white light conversion. That is, the white light conversion efficiency can be improved by using most of the phosphor contained in the resin layer.

In addition, it is possible to improve the luminous efficiency by reducing the probability that the light reflected from the phosphor is reabsorbed by the light emitting device.

1 is a cross-sectional view showing the basic structure of a light emitting device package according to the embodiment.
2 is a view showing a light emitting device package according to an embodiment.
3 to 4 are views illustrating a coupling form of the first body and the second body according to the embodiment.
5 is a cross-sectional view showing a light emitting device package according to another embodiment.
6A is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 6B is a cross-sectional view taken along line AA ′ of the lighting device of FIG. 6A.
7 is an exploded perspective view of a liquid crystal display according to an embodiment.
8 is an exploded perspective view of a liquid crystal display according to an embodiment.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Thus, in some embodiments, well known process steps, well known device structures, and well-known techniques are not specifically described to avoid an undesirable interpretation of the present invention. Like reference numerals refer to like elements throughout.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when flipping a device shown in the figure, a device described as "below" or "beneath" of another device may be placed "above" of another device. Thus, the exemplary term "below" can include both downward and upward directions. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

Although the terms first, second, etc. may be used to describe various elements, components, regions, layers and / or regions, such elements. Ingredients. Areas. Layers and / or regions should not be limited by this term.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Also, the size of the component does not fully reflect its actual size.

Hereinafter, embodiments will be described in more detail with reference to FIGS. 1 to 8.

1 is a cross-sectional view showing the basic structure of a light emitting device package according to the embodiment.

The light emitting device package 100 includes a first body 110, at least one light emitting device 130 electrically connected to the lead frames 140 and 150 and the lead frames 140 and 150 provided in the first body 110. ) May include a second body 170 coupled to the first body 110 and having an inclined portion 175.

In addition, the inclined portion 175 may include a reflective layer 190 on the upper surface.

The first body 110 and the second body 170 may be made of any one of a silicon material, a synthetic resin material or a metal material. Specifically, a resin material such as poly phthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG, photo sensitive glass), polyamide 9T (PA9T) , May be formed of at least one of neo-geotic polystyrene (SPS), a metal material, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), a printed circuit board (PCB). The first body 110 and the second body 170 may be formed by injection molding, etching process, etc., but are not limited thereto.

The shape of the first body 110 is not limited and may have various shapes as shown in FIGS. 1A to 1C. In addition, the first body 110 may include at least one cavity 180 and the partition wall 120, and a structure without the partition wall 120 may be provided so as not to obstruct the path of the emitted light. However, it is not limited thereto.

An inclined surface may be formed on an inner side surface of the partition wall 120. The angle of reflection of the light emitted from the light emitting device 130 may vary according to the angle of the inclined surface, thereby adjusting the directivity of the light emitted to the outside.

As the directivity of the light decreases, the concentration of light emitted from the light emitting device 130 to the outside increases. On the contrary, the greater the directivity of the light, the less the concentration of light emitted from the light emitting device 130 to the outside.

The partition wall 120 may further include a reflective film (not shown) on an inner side surface thereof, thereby improving brightness and light efficiency. The reflective film (not shown) may be formed of a metal or an alloy including at least one of silver (Ag), aluminum (Al), platinum (Pt), palladium (Pd), or copper (Cu) having high reflectance, and the like. Not.

Meanwhile, an adhesive layer (not shown) may be formed between the reflective film (not shown) and the inner surface of the partition wall 120 to enhance the interface bonding force, but is not limited thereto. When a reflective layer (not shown) is formed on the inner surface of the partition wall 120, light scattering may be prevented, thereby improving luminous efficiency of the light emitting device package 100.

On the other hand, the shape of the at least one cavity 180 formed on the first body 110 as viewed from above may be circular, rectangular, polygonal, elliptical, or the like, and may have a curved shape, but is not limited thereto. .

The light emitting device 130 may be electrically connected to at least one pair of lead frames 140 and 150. When the lead frame illustrated in the drawing is classified into a first lead frame 140 and a second lead frame 150, for example, when the light emitting device 130 is vertical, the lead frame is mounted on the first lead frame 140 and emits light. The device 130 and the second leadframe 150 may be wire bonded by a wire. Alternatively, the light emitting device 130 may be wire-bonded with the first lead frame 140 and the second lead frame 150 by a wire, but is not limited thereto.

The light emitting device 130 may be, for example, a light emitting diode. The light emitting diode may be, for example, a colored light emitting diode emitting light of red, green, blue, white, or the like, or an Ultra Violet (UV) emitting diode emitting ultraviolet light, but is not limited thereto. In addition, one or more light emitting diodes may be mounted.

In addition, the light emitting diode may be a horizontal type (Horizontal type), all of its electrical terminals formed on the upper surface, a vertical type (Vertical type) or flip chip type formed on the upper and lower surfaces, but according to the embodiment Mounting the device has the most excellent effect on luminous efficiency.

Meanwhile, the resin layer 160 may be positioned between the first body 110 and the second body 170 including at least one cavity 180 to cover the light emitting device 130. In addition, the transparent layer 185 may be located between the first body 110 and the second body 170. Since the transparent layer 185 does not include the phosphor 165, the light emitted from the light emitting device 130 may be reflected by the phosphor 165 to be reabsorbed by the light emitting device 130. Without the transparent layer 185, only the resin layer 160 including the phosphor 165 may be located. Even in this case, the amount of light reabsorbed by the light emitting device 130 may be reduced, rather than being directly emitted from the light emitting device 130 and emitted to the outside of the package.

The resin layer 160 may be formed of silicon, epoxy, and other resin materials, and may include a phosphor 165. The phosphor 165 may be selected according to a wavelength of light emitted from the light emitting device 130. White light may be implemented by the light emitting device package 100.

 The phosphor is one of a blue light emitting phosphor, a blue green light emitting phosphor, a green light emitting phosphor, a yellow green light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light emitting phosphor according to a wavelength of light emitted from the light emitting element 130. Is applicable, but is not limited thereto. When the first body 110 includes a plurality of cavities, the light emitting devices mounted in the respective cavities may be light emitting devices emitting light of different colors. An ultraviolet light emitting element may be mounted.

That is, the phosphor 165 may be excited by the light having the first light emitted from the light emitting device 130 to generate the second light. For example, when one of the light emitting devices 130 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and the blue light and blue light generated from the blue light emitting diode As yellow light generated by being excited by light is mixed, the light emitting device package 100 may provide white light. In addition, the light emitting device package 100 may provide green light, blue light, and the like, but is not limited thereto.

Similarly, when one of the light emitting devices 130 is a green light emitting diode, magenta phosphor or a mixture of blue and red phosphors is used, and when one of the light emitting devices 130 is a red light emitting diode, a cyan phosphor or The case where blue and green fluorescent substance are mixed is mentioned as an example.

Such phosphors may be known phosphors such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride, phosphate, etc. Do not.

The lead frames 140 and 150 are made of metal, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), and platinum (Pt). , Tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf) It may include one or more materials or alloys among ruthenium (Ru) and iron (Fe). In addition, each of the lead frames 140 and 150 may be formed to have a single layer or a multilayer structure, and each of the lead frames 140 and 150 may be supported by the first body 110. Several lead frames (not shown) may be disposed in addition to the lead frames 140 and 150 shown in the drawings, but are not limited thereto.

 The lead frames 140 and 150 may be spaced apart from each other and electrically separated from each other. The lead frames 140 and 150 and the light emitting element 130 may be directly contacted or connected by wire bonding through a conductive wire. Each of the lead frames 140 and 150 protrudes out of the first body 110 to be electrically connected to an external power source. In addition, the lead frames 140 and 150 are any one of the pair of lead frames 140 and 150 to facilitate light emission to the top when the light emitting device package 100 is mounted on the PCB. It may extend to protrude to the bottom of the 110, the other of the pair of lead frames 140, 150 may extend to protrude to the bottom of the second body 170. However, the present invention is not limited thereto, and the lead frames 140 and 150 may have various shapes and arrangements to mount the light emitting device package 100 on the PCB.

The lead frames 140 and 150 protruding to the outside may have various shapes and may be bent in various shapes. When external power is connected to the lead frames 140 and 150, power may be applied to the light emitting device 130.

The first body 110 has at least one cavity 180 exposing the leadframes 140 and 150. The number, shape, and position of the cavity 180 are not limited to the drawings.

When the plurality of cavities 180 are provided in the first body 110, at least one light emitting device 130 is mounted on each of the cavities 180.

On the other hand, when a plurality of cavities is provided, each cavity depth, the bottom surface area may be different, it is not limited to the drawings.

The second body 170 is coupled to at least a portion of the first body 110 and includes an inclined portion 175. In addition, the second body 170 may be coupled to at least a portion of the partition wall 120 of the first body 110.

The inclined portion 175 is inclined to face the first body 110, and in the embodiment having a second body coupled to a portion of the first body 110 without a cavity as shown in FIG. 1 (a), The inclined portion 175 of the first body 110 and the second body 170 forms an acute angle. Similarly, as shown in FIG. 1B, the inclined portion 175 forms an acute angle with the bottom surface of the first body 110. Preferably, in order to reflect light emitted from the light emitting device 130 to be emitted to the outside of the upper portion of the package, θ of the drawing may be formed at 10 degrees to 80 degrees. This can be adjusted by varying the angle when forming the inclined portion 175 of the second body 170.

The transparent layer 185 is preferably made of a mixture formed by adding at least one element selected from the group consisting of tin, zinc, magnesium, copper, silver, and aluminum to indium oxide. In addition, the plasma layer may be made of a transparent layer subjected to a plasma oxidation treatment and an etching treatment. In this case, the short between the electrodes of the light emitting element 130 can be prevented by changing the transparent layer into a non-conductive thin film.

In addition, the polymer resin may be composed of PMMA (Polymethacrylate), PC (Polycarbonate), and COC (Cyclic Olefin Copolymer), which is excellent in light transmittance and light resistance, but is not limited thereto.

Since the phosphor 165 is not coated on a portion where the transparent layer 185 is formed, the light emitted from the light emitting device 130 is reflected and reflected by the phosphor 165 to block a path of being reabsorbed by the light emitting device 130. The luminous efficiency can be improved. In addition, the light and thermal stability may be prevented from coming into contact with the light emitting device 130 itself, and ultimately, aging of the light emitting device 130 may be prevented.

Specifically, the light emitted from the light emitting device 130 proceeds through the transparent layer, and is reflected through the reflective layer 190 positioned on the upper surface of the second body 170, and the resin layer 160 positioned on the transparent layer 185. The white light may be emitted through contact with the phosphor 165 inside.

The reflective layer 190 may be formed of a metal or an alloy including at least one of silver (Ag), aluminum (Al), platinum (Pt), palladium (Pd), or copper (Cu) having high reflectance, and the like. Not.

By being disposed along the upper surface of the second body 170, the light emitted from the light emitting device 130 may be reflected by the reflective layer 190 to be emitted to the outside of the light emitting device 130. The reflective layer 190 may be formed and disposed to correspond to the shape of the inclined portion 175 of the second body 170.

The first body 110 and the second body 170 may be integrally formed by injection molding or the like, but may be combined by the bonding layer 195 in consideration of cost-effectiveness of molding.

The bonding layer 195 may be a high temperature polymer adhesive such that adhesiveness is maintained in a high temperature atmosphere and is not melted. Alternatively, gold (Au), tin (Sn), silver (Ag), and lead (Pb) may be formed of at least one or an alloy thereof. In order to bond the first body 110 and the second body 170, and to prevent the second body 170 from breaking or falling off, a dam (not shown) supporting the second body 170 is provided. It may be further disposed on at least a portion of the second body 170.

FIG. 1A illustrates an embodiment in which the light emitting device 130 is mounted on a portion of the first body 110 that does not include the cavity 180, and unlike the embodiment of FIG. 1B. Since the cavity 180 does not exist and the partition wall 120 does not exist, at least a portion of the first body 110 may be coupled to the second body 170.

FIG. 2 is a view illustrating a light emitting device package having an inclined portion of a second body having a concave or convex shape or a curved surface having a predetermined curvature. According to the shape of the inclined portion 175, the reflective layer 190 may be positioned on the upper surface of the second body 170. The curvature of the inclined portion 175 and the shape of the curved surface are not limited to those shown in the drawings.

3 to 4 are views illustrating a coupling form of the first body and the second body according to the embodiment.

The partition wall 120 of the first body 110 may include at least one first insertion hole 210. In this case, the second body 170 may include a first protrusion 222 inserted into the first insertion hole 210. The first insertion hole 210 and the first protrusion 222 may have the same size so as to be fixed to each other. The number of the first insertion holes 210 and the first protrusions 222 corresponding thereto may be plural, and the first protrusions 222 may correspond to the first insertion holes according to the shape of the first insertion holes 210. It has a shape that can be fitted to (210).

In addition, the partition wall 120 of the first body 110 may include at least one second protrusion 212, and the second body 170 may include at least one second insertion hole 220. . The second protrusion 212 and the second insertion hole 220 are formed of a male and female, and the second protrusion 212 is inserted into the second insertion hole 220 to connect the first body 110 and the second body 170. Can be fixed

That is, the partition wall 120 of the first body 110 may include at least one first insertion hole 210 and a second protrusion 212 corresponding to at least one second insertion hole 220. The second body 170 includes a first protrusion 222 and at least one second insertion hole 220 corresponding to the at least one first insertion hole 210, so that the first body 110 and the second body 170 are provided. The coupling force of the body 170 can be improved.

In addition, as shown in FIG. 4, when the partition 120 of the first body 110 has the second protrusion 212, and the second body 170 has the second insertion hole 220, the second insertion hole ( The second body 170 having the 220 may surround the second protrusion 212 so that the lower portion of the second body 170 may protrude more than the lower portion of the partition wall 120 of the first body 110. As the second body 170 surrounds the first body 110, the second body 170 may be more stably coupled to the first body 110. 3 to 4, the resin layer 160 including the phosphor 165 may be formed directly without the transparent layer 185.

5 is a cross-sectional view showing a light emitting device package according to another embodiment.

Referring to FIG. 5, the resin layer 160 of the light emitting device package 100 according to the embodiment may have any one of a dome shape, a lens shape, or a flat shape, but is not limited thereto. Can be.

6A is a perspective view illustrating a lighting apparatus including a light emitting device package according to an embodiment, and FIG. 6B is a cross-sectional view illustrating a cross-sectional view taken along line AA ′ of the lighting apparatus of FIG. 6A.

Hereinafter, in order to describe the shape of the lighting apparatus 300 according to the embodiment in more detail, the longitudinal direction (Z) of the lighting apparatus 300, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), and the length The height direction X perpendicular to the direction Z and the horizontal direction Y will be described.

That is, FIG. 6B is a cross-sectional view of the lighting apparatus 300 of FIG. 6A cut in the plane of the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. FIG.

6A and 6B, the lighting device 300 may include a body 310, a cover 330 fastened to the body 310, and a closing cap 350 positioned at both ends of the body 310. have.

The lower surface of the body 310 is fastened to the light emitting device module 340, the body 310 is conductive and so as to emit heat generated from the light emitting device 344 to the outside through the upper surface of the body 310 It may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device package 344 may be mounted on the PCB substrate 342 in multiple colors and in multiple rows to form an array. The light emitting device package 344 may be mounted at the same interval or may be mounted at various separation distances as necessary to adjust brightness. Can be. The PCB substrate 342 may be a MCPCB (Metal Core PCB) or a PCB made of FR4.

The cover 330 may be formed in a circular shape to surround the lower surface of the body 310, but is not limited thereto.

The cover 330 protects the light emitting device module 340 from the outside and the like. In addition, the cover 330 may include diffusing particles to prevent the glare of the light generated from the light emitting device package 344 and to uniformly emit light to the outside, and may also include at least one of an inner surface and an outer surface of the cover 330. A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 330.

On the other hand, since the light generated from the light emitting device package 344 is emitted to the outside through the cover 330, the cover 330 should have excellent light transmittance, and should have sufficient heat resistance to withstand the heat generated by the light emitting device. The cover 330 may be formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like.

Closing cap 350 is located at both ends of the body 310 may be used for sealing the power supply (not shown). In addition, the closing cap 350 is formed with a power pin 352, the lighting device 300 according to the embodiment can be used immediately without a separate device to the terminal from which the existing fluorescent lamps are removed.

7 is an exploded perspective view of a liquid crystal display according to an embodiment.

7 is an edge-light method, the liquid crystal display device 400 may include a liquid crystal display panel 410 and a backlight unit 470 for providing light to the liquid crystal display panel 410.

The liquid crystal display panel 410 may display an image using light provided from the backlight unit 470. The liquid crystal display panel 410 may include a color filter substrate 412 and a thin film transistor substrate 414 facing each other with the liquid crystal interposed therebetween.

The color filter substrate 412 may implement a color of an image displayed through the liquid crystal display panel 410.

The thin film transistor substrate 414 is electrically connected to the printed circuit board 418 on which a plurality of circuit components are mounted through the driving film 417. The thin film transistor substrate 414 may apply a driving voltage provided from the printed circuit board 418 to the liquid crystal in response to a driving signal provided from the printed circuit board 418.

The thin film transistor substrate 414 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 470 may convert the light provided from the light emitting device module 420, the light emitting device module 420 into a surface light source, and provide the light guide plate 430 to the liquid crystal display panel 410. Reflective sheet reflecting the light emitted to the light guide plate 430 to the plurality of films 450, 466, 464 and the light guide plate 430 to uniform the luminance distribution of the light provided from the light source 430 and to improve vertical incidence ( 440).

The light emitting device module 420 may include a PCB substrate 422 such that a plurality of light emitting device packages 424 may be mounted to form an array.

On the other hand, the backlight unit 470 is a diffusion film 466 for diffusing light incident from the light guide plate 430 toward the liquid crystal display panel 410, and a prism film 450 for condensing the diffused light to improve vertical incidence. It may be configured as), and may include a protective film 464 for protecting the prism film 450.

8 is an exploded perspective view of a liquid crystal display according to an embodiment. However, the parts shown and described in Fig. 6 are not repeatedly described in detail.

8, the liquid crystal display 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510.

Since the liquid crystal display panel 510 is the same as that described with reference to FIG. 6, a detailed description thereof will be omitted.

The backlight unit 570 includes a plurality of light emitting device modules 523, a reflective sheet 524, a lower chassis 530 in which the light emitting device modules 523 and the reflective sheet 524 are accommodated, and an upper portion of the light emitting device module 523. It may include a diffusion plate 540 and a plurality of optical film 560 disposed in the.

The light emitting device module 523 may include a PCB substrate 521 so that a plurality of light emitting device packages 522 may be mounted to form an array.

The reflective sheet 524 reflects the light generated from the light emitting device package 522 in the direction in which the liquid crystal display panel 510 is positioned to improve light utilization efficiency.

Meanwhile, the light generated by the light emitting device module 523 is incident on the diffusion plate 540, and the optical film 560 is disposed on the diffusion plate 540. The optical film 560 includes a diffusion film 566, a prism film 550, and a protective film 564.

Although the preferred embodiments have been illustrated and described above, the invention is not limited to the specific embodiments described above, and does not depart from the gist of the invention as claimed in the claims. Various modifications may be made by the person having the above, and these modifications should not be individually understood from the technical spirit or the prospect of the present invention.

100: light emitting device package 110: first body
120: partition 130: light emitting element
140, 150: lead frame 160: resin layer
165 phosphor 170: second body
175: inclined portion 180: cavity
185: transparent layer 190: reflective layer

Claims (18)

A first body;
At least one pair of lead frames provided in the first body;
At least one light emitting device electrically connected to the lead frame; And
A light emitting device package coupled to the first body, comprising a second body having a slope. The method of claim 1,
Any one of the pair of lead frames extends to the lower portion of the first body and protrudes,
The other one of the pair of lead frame is a light emitting device package extending to the lower portion of the second body. The method of claim 1,
The first body includes at least one cavity and a partition wall around the cavity,
The second body is a light emitting device package coupled to the partition wall of the first body. 4. The method according to any one of claims 1 to 3,
The light emitting device,
Light emitting device package, characterized in that the vertical light emitting device. 4. The method according to any one of claims 1 to 3,
The second body,
Light emitting device package including a reflective layer on the inclined portion. 4. The method according to any one of claims 1 to 3,
The reflective layer,
A light emitting device package comprising a metal or an alloy containing at least one of silver (Ag), aluminum (Al), platinum (Pt), palladium (Pd), or copper (Cu). 4. The method according to any one of claims 1 to 3,
The light emitting device package including a transparent layer on at least a portion between the first body and the second body. 8. The method of claim 7,
A light emitting device package coated with a resin layer containing a phosphor on the transparent layer. The method of claim 8,
The resin layer,
A light emitting device package, characterized in that it has any one of a dome shape, a lens shape or a flat shape. 4. The method according to any one of claims 1 to 3,
The inclined portion,
A light emitting device package having any one of concave, convex and flat shapes. 4. The method according to any one of claims 1 to 3,
The inclined portion,
A light emitting device package, characterized in that the curved surface having a predetermined curvature. 4. The method according to any one of claims 1 to 3,
The inclined portion,
The light emitting device package inclined at a predetermined angle in the direction of the first body. 4. The method according to any one of claims 1 to 3,
The light emitting device package further comprises a bonding layer between the first body and the second body. The method of claim 13,
The bonding layer,
A light emitting device package comprising at least one of gold (Au), tin (Sn), silver (Ag), and lead (Pb) or an alloy thereof. The method of claim 3, wherein
Wherein,
At least one first insertion hole,
The second body has a light emitting device package having a first protrusion that is inserted into the first insertion hole. The method of claim 1,
The second body,
Has at least one second insertion hole,
The partition wall, the light emitting device package having a second protrusion that is inserted into the second insertion hole. 4. The method according to any one of claims 1 to 3,
The light emitting device package applied between the first body and the second body, further comprising a resin layer containing a phosphor. 4. The method according to any one of claims 1 to 3,
The first body and the second body,
A light emitting device package made of any one of silicon, synthetic resin, or metal.

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