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KR20120023417A - Multilayered led module circuit board having layered heat emitting structure and led bulb using the same - Google Patents

Multilayered led module circuit board having layered heat emitting structure and led bulb using the same Download PDF

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Publication number
KR20120023417A
KR20120023417A KR1020100086538A KR20100086538A KR20120023417A KR 20120023417 A KR20120023417 A KR 20120023417A KR 1020100086538 A KR1020100086538 A KR 1020100086538A KR 20100086538 A KR20100086538 A KR 20100086538A KR 20120023417 A KR20120023417 A KR 20120023417A
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South Korea
Prior art keywords
substrate
led
led module
heat dissipation
laminated
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Korean (ko)
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김영철
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소닉스자펜 주식회사
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Priority to KR1020100086538A priority Critical patent/KR20120023417A/en
Priority to PCT/KR2011/006477 priority patent/WO2012030173A2/en
Publication of KR20120023417A publication Critical patent/KR20120023417A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

본 발명은 상부에 엘이디가 결합되는 세라믹기판; 상기 세라믹기판의 하면에 적층된 금속기판; 및 상기 금속기판의 하면에 적층된 적층방열기판으로 이루어진 적층방열구조물을 포함하는 엘이디모듈다층기판 및 이를 장착한 엘이디 전구를 제공한다.The present invention is a ceramic substrate is coupled to the LED on the top; A metal substrate stacked on a bottom surface of the ceramic substrate; And it provides an LED module multi-layer substrate and a LED bulb comprising the laminated heat dissipation structure consisting of a laminated heat dissipation substrate laminated on the lower surface of the metal substrate.

Description

적층방열구조를 갖춘 엘이디모듈다층기판 및 이를 장착한 엘이디 전구{MULTILAYERED LED MODULE CIRCUIT BOARD HAVING LAYERED HEAT EMITTING STRUCTURE AND LED BULB USING THE SAME}LED module with multilayer heat dissipation structure and LED bulb equipped with LED lamp {MULTILAYERED LED MODULE CIRCUIT BOARD HAVING LAYERED HEAT EMITTING STRUCTURE AND LED BULB USING THE SAME}

본 발명은 엘이디모듈(LED MODULE) 다층기판 및 이를 장착한 엘이디 전구에 관한 것으로, 보다 상세하게는 방열능력이 각기 다른 재질의 다층구조의 적층방열구조를 취함으로써 엘이디 구동 중 발생된 열을 효과적으로 분산하여 광원이 보다 효율적으로 열을 방출할 수 있는 방열구조를 갖춘 엘이디모듈 다층기판 및 이를 장착한 엘이디 전구에 관한 것이다.
The present invention relates to an LED module multilayer board and an LED bulb equipped with the same. More specifically, by taking a laminated heat dissipation structure of a multi-layered structure having different heat dissipation ability, it effectively dissipates heat generated during LED driving. The present invention relates to an LED module multilayer board having a heat dissipation structure capable of emitting heat more efficiently, and an LED bulb equipped with the same.

종래에는 도 1에 도시된 바와 같이, 단순히 알루미늄판 또는 철판위(2)에 인쇄회로기판(PCB)을 구성한 후 엘이디(1)를 부착한 엘이디모듈기판이 사용되고 있다. 이러한 구조의 엘이디모듈기판은 사용되는 엘이디의 출력에 따라 그 적층되는 방열판의 크기를 달리하여야 하므로 방열판의 설계에 많은 한계가 따르고, 더욱이 단일층의 방열구조만으로는 엘이디에서 발생하는 열이 효과적으로 방열이 이루어지지 않아 잦은 고장의 원인이 되기도 한다.
In the related art, as illustrated in FIG. 1, an LED module substrate having a printed circuit board (PCB) formed on an aluminum plate or an iron plate 2 and then having an LED 1 attached thereto is used. Since the LED module substrate of such a structure must vary the size of the laminated heat sink according to the output of the LED used, there are many limitations in the design of the heat sink, and moreover, the heat generated from the LED is effectively radiated by only a single layer heat dissipation structure. It can also cause frequent breakdowns.

본 발명은 상기한 바와 같이 종래기술이 가지는 문제점을 해결하기 위해 제안된 것으로서, 그 목적은 방열능력이 각기 다른 재질의 다층구조의 적층방열구조를 취함으로써 엘이디 구동 중 발생된 열을 효과적으로 분산하여 광원이 보다 효율적으로 열을 방출할 수 있는 방열구조를 갖춘 엘이디모듈 다층기판을 제공함에 있다.The present invention has been proposed to solve the problems of the prior art as described above, the object is to take a laminated heat radiation structure of a multi-layered structure of different heat dissipation ability to effectively dissipate the heat generated during the LED driving light source The present invention provides an LED module multilayer board having a heat dissipation structure capable of dissipating heat more efficiently.

본 발명의 다른 목적은 방열능력이 각기 다른 재질의 다층구조의 적층방열구조를 취함으로써 엘이디 구동 중 발생된 열을 효과적으로 분산하여 광원이 보다 효율적으로 열을 방출할 수 있는 방열구조를 갖춘 엘이디모듈 다층기판이 장착된 엘이디 전구를 제공함에 있다.
Another object of the present invention is to take a multi-layer laminated heat dissipation structure of a material having a different heat dissipation ability to effectively dissipate heat generated during the LED driving light source LED module multilayer having a heat dissipation structure that can emit heat more efficiently An LED bulb equipped with a substrate is provided.

상기한 바와 같은 본 발명의 기술적 과제는 다음과 같은 수단에 의해 달성되어진다.The technical problem of the present invention as described above is achieved by the following means.

(1) 상부에 엘이디가 결합되는 세라믹기판; 상기 세라믹기판의 하면에 적층된 금속기판; 및 상기 금속기판의 하면에 적층된 적층방열기판으로 이루어진 적층방열구조물을 포함하는 엘이디모듈다층기판.
(1) a ceramic substrate having an LED coupled to the upper portion; A metal substrate stacked on a bottom surface of the ceramic substrate; And LED module multi-layer substrate comprising a laminated heat dissipation structure consisting of a laminated heat dissipation substrate laminated on the lower surface of the metal substrate.

(2) 상부에 엘이디가 결합되는 세라믹과 금속의 혼합기판; 및 상기 혼합기판의 하면에 적층된 적층방열판으로 이루어진 적층방열구조물을 포함하는 엘이디모듈다층기판.
(2) a mixed substrate of a ceramic and a metal to which the LED is coupled at the top; And a laminated heat dissipation structure including a laminated heat dissipation plate laminated on a lower surface of the mixed substrate.

(3) 제 1항 또는 제 2항에 있어서,(3) The method according to the above 1 or 2,

금속은 구리인 것을 특징으로 하는 엘이디모듈다층기판.
LED module multi-layer substrate, characterized in that the metal is copper.

(4) 제 1항에 있어서,(4) The method according to 1,

적층방열판은 알루미늄으로 이루어진 것을 특징으로 하는 엘이디모듈다층기판.
The laminated heat sink is an LED module multi-layer substrate, characterized in that made of aluminum.

(5) 제 1항에 있어서,(5) The method according to claim 1,

상기 각 기판은 화학적 증착방법에 의해 형성된 것을 특징으로 하는 엘이디모듈다층기판.
LED module multi-layer substrate, characterized in that each substrate is formed by a chemical vapor deposition method.

(6) 제 1항 내지 제5항 중 선택된 어느 한 항에 의한 엘이디모듈다층기판이 장착된 엘이디 전구.(6) An LED bulb equipped with the LED module multilayer board according to any one of items 1 to 5.

본 발명에 의하면 방열능력이 각기 다른 재질의 다층구조의 적층방열구조를 취함으로써 엘이디 구동 중 발생된 열을 효과적으로 분산하여 광원이 보다 효율적으로 열을 방출할 수 있는 방열구조를 갖춘 엘이디모듈 다층기판 및 이를 포함하는 엘이디 전구를 제공한다.
According to the present invention, the LED module multilayer board having a heat dissipation structure capable of dissipating heat generated during LED driving effectively by taking a multilayer heat dissipation structure having a multi-layered heat dissipation ability and emitting light efficiently It provides an LED bulb comprising the same.

도 1은 종래기술에 따른 엘이디모듈기판의 구성도이다.
도 2는 본 발명에 따른 엘이디모듈다층기판의 구성도이다.
도 3a는 본 발명에 따른 엘이디모듈다층기판(도 3)의 상단면도이고, 3b는 엘이디모듈다층기판(도 3)의 하단면도를 나타낸다.
도 4는 본 발명에 따른 엘이디모듈다층기판이 내부에 장착된 엘이디전구의 구성도이다. 1 is a block diagram of an LED module substrate according to the prior art.
2 is a configuration of the LED module multilayer board according to the present invention.
3A is a top view of the LED module multilayer board (FIG. 3) according to the present invention, and 3B is a bottom view of the LED module multilayer board (FIG. 3).
Figure 4 is a block diagram of the LED bulb is mounted inside the LED module multilayer board according to the present invention.

이하, 본 발명의 내용을 보다 상세하게 설명하면 다음과 같다. Hereinafter, the content of the present invention in more detail as follows.

본 발명은 상부에 엘이디가 결합되는 세라믹기판; 상기 세라믹기판의 하면에 적층된 금속기판; 및 상기 금속기판의 하면에 적층된 적층방열기판으로 이루어진 적층방열구조물을 포함하는 엘이디모듈다층기판을 제공한다.
The present invention is a ceramic substrate is coupled to the LED on the top; A metal substrate stacked on a bottom surface of the ceramic substrate; And LED module multi-layer substrate comprising a laminated heat dissipation structure consisting of a laminated heat dissipation substrate laminated on the lower surface of the metal substrate.

이하, 본 발명의 내용을 실시예가 도시된 도면을 참조하여 그 제조공정과 함께 보다 상세하게 설명하기로 한다.Hereinafter, with reference to the drawings showing the embodiments of the present invention will be described in more detail with the manufacturing process.

도 2는 본 발명에 따른 엘이디모듈다층기판의 구성도로서, 본 발명에 따른 엘이디모듈다층기판은 상부에 엘이디(14) 및 이를 구동하는 전자회로가 형성되는 세라믹기판(13), 상기 세라믹기판(13)의 하면에 적층된 금속기판(12), 및 상기 금속기판(12)의 하면에 적층된 적층방열기판(11)으로 이루어진 적층방열구조물을 포함한다.2 is a configuration diagram of the LED module multilayer board according to the present invention, the LED module multilayer board according to the present invention is a ceramic substrate 13, the ceramic substrate (13) is formed on the LED 14 and the electronic circuit for driving the same (top) 13, a laminated heat dissipation structure including a metal substrate 12 stacked on a lower surface of the metal substrate 12 and a laminated heat radiation substrate 11 stacked on a lower surface of the metal substrate 12.

상기 세라믹기판(13)과 금속기판(12)은 다양한 방법에 따라 형성될 수 있으며, 바람직하게는 공지의 화학증착방법을 이용하여 증착되어진다. The ceramic substrate 13 and the metal substrate 12 may be formed according to various methods, and are preferably deposited using a known chemical vapor deposition method.

세라믹기판(13)은 그 상면에 엘이디(14) 및 이를 구동할 수 있는 전자회로가 부착되어지며, 0.5 내지 1.0mm, 바람직하게는 0.6 내지 0.8 mm의 두께로 증착되어진다.The ceramic substrate 13 has an LED 14 and an electronic circuit capable of driving the ceramic substrate 13 attached thereto, and is deposited to a thickness of 0.5 to 1.0 mm, preferably 0.6 to 0.8 mm.

금속기판(12)은 상기 세라믹기판(13)의 하면에 증착되어지며, 상기 금속으로 열전도도가 좋은 구리를 사용하는 것이 바람직하다. 이러한 금속기판은 상기 세라믹기판(13) 상에 0.5 내지 1.0mm, 바람직하게는 0.6 내지 0.8 mm의 두께로 증착되어진다.The metal substrate 12 is deposited on the lower surface of the ceramic substrate 13, and it is preferable to use copper having good thermal conductivity as the metal. The metal substrate is deposited on the ceramic substrate 13 to a thickness of 0.5 to 1.0 mm, preferably 0.6 to 0.8 mm.

상기 금속기판(12)의 하면에 적층방열기판(11)이 형성된다. 상기 적층방열기판(11)은 효율적으로 분산하여 방열을 수행하기 위해 적층구조를 취하며, 바람직하게는 방열특성이 우수하면서도 무게가 가벼운 재질인 알루미늄으로 구성하는 것이 좋다.The laminated heat dissipation substrate 11 is formed on the lower surface of the metal substrate 12. The laminated heat dissipation substrate 11 has a laminated structure in order to efficiently dissipate and dissipate heat, and preferably, the laminated heat dissipation substrate 11 is made of aluminum, which is excellent in heat dissipation characteristics and light in weight.

상기와 같은 구성에 의하면 엘이디(14)에서 구동 중 발생된 열은 하부의 세라믹기판(13)을 통해 금속기판(12), 바람직하게는 구리기판으로 매우 빨리 열전달이 이루어지게 되고, 이때 구리기판의 온도가 급상승하게 되지만 그 하단에 형성된 적층알루미늄방열기판(11)을 통해 열이 매우 빠른 속도로 분산이동하게 되어 방열효과가 매우 크다.
According to the configuration as described above, the heat generated during driving in the LED 14 is heat transfer to the metal substrate 12, preferably a copper substrate very quickly through the lower ceramic substrate 13, wherein the copper substrate Although the temperature rises rapidly, the heat is dispersed and moved at a very high speed through the laminated aluminum heat-dissipating substrate 11 formed at the bottom thereof, and the heat dissipation effect is very large.

본 발명의 다른 실시예에 따르면, 상기 세라믹기판(13)과 금속기판(12)은 단일층으로 구성되어도 좋다. 예를 들어, 세라믹과 금속을 혼합하여 화학증착하는 것에 의해 단일층의 혼합증착기판을 형성하여도 본 발명이 의도하는 목적을 달성하는 것이 가능하다. 이러한 구성에 의하면 상기 혼합증착기판의 하면에 적층방열기판(11)이 증착되어진다.
According to another embodiment of the present invention, the ceramic substrate 13 and the metal substrate 12 may be composed of a single layer. For example, it is possible to achieve the object intended by the present invention even when a mixed vapor deposition substrate of a single layer is formed by mixing and chemically depositing a ceramic and a metal. According to this structure, the laminated heat radiation substrate 11 is deposited on the lower surface of the mixed deposition substrate.

도 3a 및 3b는 각각 도 3에 도시된 본 발명에 따른 엘이디모듈다층기판의 상단면 및 하단면의 도면으로서, 상단면은 방열판을 부착할 때 열전달이 잘 이루어지도록 나사(15)를 이용하여 고정하고, 하단면은 세라믹기판(13) 상에 엘이디(14)를 장착할 수 있도록 전자회로를 구성한다.
3A and 3B are views of the top and bottom surfaces of the LED module multilayer board according to the present invention shown in FIG. 3, respectively, and the top surface is fixed by using screws 15 so that heat transfer is performed well when attaching the heat sink. In addition, the bottom surface constitutes an electronic circuit to mount the LED 14 on the ceramic substrate 13.

도 4는 본 발명에 따른 엘이디모듈다층기판이 내부에 장착된 엘이디 전구의 구성도로서, 꼭지(101), 꼭지쇠(102), 전원공급부(내부에 포함), 적층방열판(103), 엘이디모듈다층기판(100), 및 유리구(104)로 구성되어 있다.Figure 4 is a block diagram of the LED bulb is mounted inside the LED module multilayer board according to the present invention, the faucet 101, the clasp 102, the power supply (inside), the laminated heat sink 103, LED module It is composed of a multilayer substrate 100 and a glass sphere 104.

상기 구성에 의하면, 엘이디에서 발생된 열이 상기 엘이디모듈다층기판(100)을 통해 1차 방열이 이루어지고, 하부에 형성된 적층방열판(103)을 통해 2차적으로 방열이 이루어지는 이중 방열을 통해 열을 효과적으로 분산시킬 수 있게 되어 엘이디와 엘이디모듈기판의 주변온도를 항시 낮게 유지하는 것이 가능하다.
According to the configuration, the heat generated from the LED is the first heat dissipation is made through the LED module multi-layer substrate 100, the heat through the double heat dissipation secondary heat is radiated through the laminated heat dissipation plate 103 formed at the bottom Since it can be effectively dispersed, it is possible to keep the ambient temperature of the LED and the LED module substrate at all times low.

본 발명의 실험결과에 의하면, 도 1에 도시된 종래의 엘이디기판을 사용한 경우에 비하여 본 발명에 따른 다층구조의 엘이디모듈기판의 온도가 특히 낮았으며, 이를 적용한 엘이디 전구의 외관은 기존의 것과 비교할 때 매우 미려한 장점이 있다.According to the experimental results of the present invention, the temperature of the LED module substrate of the multi-layer structure according to the present invention was particularly low compared to the case of using the conventional LED substrate shown in Figure 1, the appearance of the LED bulb to which it is applied compared with the conventional When you have a very beautiful advantage.

상술한 바와 같이, 본 발명의 바람직한 실시예를 참조하여 설명하였지만 해당 기술 분야의 숙련된 당업자라면 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.
Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. It will be understood that the present invention can be changed.

11: 적층방열기판
12: 금속기판
13: 세라믹기판
14: 엘이디11: laminated heat dissipation board
12: metal substrate
13: ceramic substrate
14: LED

Claims (6)

상부에 엘이디가 결합되는 세라믹기판; 상기 세라믹기판의 하면에 적층된 금속기판; 및 상기 금속기판의 하면에 적층된 적층방열기판으로 이루어진 적층방열구조물을 포함하는 엘이디모듈다층기판.A ceramic substrate having an LED coupled thereto; A metal substrate stacked on a bottom surface of the ceramic substrate; And LED module multi-layer substrate comprising a laminated heat dissipation structure consisting of a laminated heat dissipation substrate laminated on the lower surface of the metal substrate. 상부에 엘이디가 결합되는 세라믹과 금속의 혼합기판; 및 상기 혼합기판의 하면에 적층된 적층방열기판으로 이루어진 적층방열구조물을 포함하는 엘이디모듈다층기판. A mixed substrate of a ceramic and a metal having an LED coupled thereon; And a laminated heat dissipation structure including a laminated heat dissipation substrate laminated on a lower surface of the mixed substrate. 제 1항 또는 제 2항에 있어서,
금속은 구리인 것을 특징으로 하는 엘이디모듈다층기판.3. The method according to claim 1 or 2,
LED module multi-layer substrate, characterized in that the metal is copper. 제 1항에 있어서,
적층방열기판은 알루미늄으로 이루어진 것을 특징으로 하는 엘이디모듈다층기판.The method of claim 1,
The laminated heat dissipation substrate is an LED module multi-layer substrate, characterized in that made of aluminum. 제 1항에 있어서,
상기 각 기판은 화학적 증착방법에 의해 형성된 것을 특징으로 하는 엘이디모듈다층기판.The method of claim 1,
LED module multi-layer substrate, characterized in that each substrate is formed by a chemical vapor deposition method. 제 1항 내지 제5항 중 선택된 어느 한 항에 의한 엘이디모듈다층기판이 장착된 엘이디 전구.An LED bulb equipped with an LED module multilayer board according to any one of claims 1 to 5.
KR1020100086538A 2010-09-03 2010-09-03 Multilayered led module circuit board having layered heat emitting structure and led bulb using the same Abandoned KR20120023417A (en)

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PCT/KR2011/006477 WO2012030173A2 (en) 2010-09-03 2011-08-31 Multiple-substrate led module having stacked heat-dissipating structure and led light bulb provided with same

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KR20100049841A (en) * 2008-11-04 2010-05-13 삼성전기주식회사 Radiant heat substrate and method of manufacturing the same
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