KR20120010201A - Manufacturing method of display panel and display panel - Google Patents

Abstract

(Problem) Providing a manufacturing method of a display panel which can suppress the crack of a product and can improve workability.
(Solution means) The first and second scribe lines 31 and 32 orthogonal to each other are formed on the surface 11 of the mother glass substrate 10, and the plate is formed from the first and second scribe lines 31 and 32. In the manufacturing method of the display panel which has a process of cutting | disconnecting the mother glass substrate 10 by extending a crack in the thickness direction, 1st corresponding to the long side (namely, the long side 6 of the cell 4) of a display panel. When the scribe line 31 is formed, 0? When using the first wheel cutter 50 having five notches, on the other hand, when forming the second scribe line 32 corresponding to the short side of the display panel (that is, the short side 8 of the cell 4), Along the outsourcing 50? The second wheel cutter 60 having 300 cutouts 63 is used.

Description

Manufacturing method of display panel and display panel {METHOD FOR PRODUCING DISPLAY PANEL AND DISPLAY PANEL}

TECHNICAL FIELD This invention relates to the manufacturing method of a display panel, and a display panel. Specifically, It is related with the manufacturing method of a liquid crystal panel, and a liquid crystal panel.

A method for efficiently producing a liquid crystal panel (LCD), comprising: filling a liquid crystal material between two mother glass substrates (hereinafter, simply referred to as a "substrate") to produce a panel, and cutting the panel to produce a plurality of cells. The method is widely used (for example, refer patent document 1). In this method, the scribe-break method is used when cutting a panel.

In the scribe-break method, first, the first and second scribe lines (initial cracks) orthogonal to each other are formed on one substrate constituting the panel by pressing and rotating the outer peripheral edge of the wheel cutter. Thereafter, the panel is turned upside down, and the brake bar is pressed at a predetermined position on another substrate to apply bending stress to one substrate. Thereby, tensile stress is applied to the bottom portions of the first and second scribe lines, the cracks are extended in the plate thickness direction, and one substrate is cut. Next, other substrates are cut in the same manner. In this way, the panel is cut to produce a plurality of cells.

By the way, after forming a 1st scribe line in a vertical direction, when forming a 2nd scribe line in a horizontal direction, what is called a cross bounce may arise. Interline bounce is considered to occur by springing out due to a sudden change in resistance when the wheel cutter forming the second scribe line crosses the first scribe line. If cross bounce occurs, the substrate is cut at an unintended position and the cut quality is degraded.

On the other hand, in patent document 1, as a peripheral edge of the wheel cutter which forms a 2nd scribe line, it is proposed to use the blade whose grinding | polishing degree is coarser than the wheel cutter which forms a 1st scribe line. Since a sparse blade is easy to penetrate into a board | substrate, it can suppress generation | occurrence | production of an intersection jump when crossing a 1st scribe line. The polishing degree is disclosed by being determined by the blade tip angle of the outer edge.

Moreover, in patent document 1, forming a 1st scribe line in the surface which needs higher intensity | strength among the cut surfaces of a board | substrate is proposed. As the outer edge of the wheel cutter for forming the first scribe line, since a sharp blade having a fine grinding degree is used, the cutting surface is smoothed and the edge strength is disclosed to be high.

Moreover, in recent years, as a peripheral edge of the wheel cutter which forms a scribe line, the blade in which many notches were formed along the outer periphery (so-called high penetrating blade) was developed (for example, refer patent document 2). When the scribe line is formed using the high penetrating blade, the load is concentrated on the convex portion of the high penetrating blade. Therefore, the depth of the scribe line is increased to about 80% of the plate thickness by simply inserting the convex portion of the high penetrating blade into the substrate several micrometers. To this. Therefore, it discloses that a board | substrate can be cut | disconnected along a scribe line to the extent that a worker exerts a force with a thumb.

Japanese Unexamined Patent Publication No. 2007-140131 Japanese Unexamined Patent Publication No. 2010-6672

However, in the method described in Patent Literature 1, since tensile stress is applied to the bottom portions of the first and second scribe lines that are perpendicular to each other, the brake bar is changed in two directions so that the workability is poor.

On the other hand, also in the method of patent document 2, since a worker needs to apply a force with a thumb, there exists a room to improve workability.

Moreover, in the method of patent document 2, when the convex part of a high penetrating blade is dug into a board | substrate, a stress concentrates in the corner of the recessed area | region (region shown with a diagonal line in FIG. 9), and intersects with the scribe line 101. The crack 102 is also formed in the direction. Therefore, the edge strength of the display panel is low, and the display panel is easily cracked.

This invention is made | formed in view of the above, and an object of this invention is to provide the manufacturing method of the display panel which can suppress the crack of a product and can improve workability.

In order to solve the said subject, 1st aspect of this invention is

A display panel having a step of cutting the mother glass substrate by forming first and second scribe lines perpendicular to each other on the surface of the mother glass substrate and extending cracks in the plate thickness direction from the first and second scribe lines. In the manufacturing method of

When forming the first scribe line corresponding to the long side of the display panel, 0? Using the first wheel cutter with five notches,

When forming the second scribe line corresponding to the short side of the display panel, 50? A second wheel cutter with 300 cutouts is used.

According to a second aspect of the present invention, in the method for manufacturing a display panel according to the first aspect,

After forming the first scribe line using the first wheel cutter, it is preferable to form the second scribe line using the second wheel cutter.

In the manufacturing method of the display panel which concerns on this invention,

The depth of the first scribe line is 5? Of the plate thickness of the mother glass substrate. It is preferable that it is 25%.

Moreover, the depth of the said 2nd scribe line is 75? Of the plate | board thickness of the said mother glass substrate. It is preferable that it is 85%.

In addition, the thickness of the said mother glass substrate is 0.1? It is preferable that it is 3 mm.

Moreover, it is preferable that the said 1st and 2nd wheel cutter provided the outer peripheral edge in the disk-shaped object which has a shaft hole in the center.

Moreover, this invention provides the display panel obtained by the manufacturing method of the display panel of this invention.

It is preferable that the said display panel is a liquid crystal panel.

According to a 1st aspect, the manufacturing method of the display panel which can suppress the crack of a product and can improve workability can be provided.

According to a 2nd aspect, it can suppress that a 2nd wheel cutter jumps when crossing a 1st scribe line, and can suppress that a 2nd scribe line breaks along the way.

1 is a flowchart of a method of manufacturing a display panel according to an embodiment of the present invention.
2A is an explanatory diagram (1) of a cell fabrication step.
2B is an explanatory diagram (2) of the cell fabrication step.
2C is an explanatory diagram (3) of the cell fabrication step.
2D is an explanatory diagram (4) of a cell fabrication step.
2E is an explanatory diagram (5) of the cell fabrication step.
3: A is explanatory drawing (1) of the cutting method of a mother glass substrate.
It is explanatory drawing (2) of the cutting method of a mother glass substrate.
4 is a perspective view of the first wheel cutter.
5 is a cross-sectional view of the mother glass substrate in a state of use of the first wheel cutter.
6 is a perspective view of a second wheel cutter.
7 is a cross-sectional view of the mother glass substrate in a state of use of the second wheel cutter.
8A is a perspective view 1 illustrating an example of a mounting state of a display device with respect to a portable device.
8B is a perspective view 2 illustrating an example of a mounting state of the display panel with respect to the portable device.
9 is an enlarged plan view of a scribe line formed by a conventional high-penetration blade.

EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing this invention is demonstrated with reference to drawings. In addition, this invention is not limited to embodiment mentioned later, A various deformation | transformation and substitution can be added to embodiment mentioned later, without deviating from the range of this invention.

1 is a flowchart of a method of manufacturing a display panel according to an embodiment of the present invention. Although this embodiment demonstrates the manufacturing method of a liquid crystal panel (LCD), you may apply this invention to the manufacturing method of other display panels, such as a plasma display panel (PDP) and an organic electroluminescent panel, for example.

As shown in FIG. 1, the manufacturing method of a liquid crystal panel includes a TFT substrate preparation process (step S11), a CF substrate preparation process (step S12), a panel preparation process (step S13), and a cell preparation process (step S14). And a module assembly process (step S15).

In a TFT substrate preparation process (step S11), TFT (thin film transistor) etc. are formed in a predetermined pattern on one mother glass substrate (henceforth a "substrate"), and a TFT substrate is produced. In the CF substrate production process (step S12), CF (color filter) or the like is formed on a different substrate in a predetermined pattern to produce a CF substrate. There is no restriction | limiting in the order of these process S11, S12, You may carry out simultaneously.

In a panel manufacturing process (step S13), a TFT substrate and a CF board | substrate are bonded together through a spacer. In that case, a TFT substrate and a CF board | substrate are bonded together so that TFT, CF, etc. may be arrange | positioned between two board | substrates. Subsequently, a liquid crystal material is sealed between the TFT substrate and the CF substrate to produce a panel.

In a cell preparation process (step S14), a panel is cut | disconnected and a some cell is produced. In that case, although it mentions later in detail, each board | substrate is cut | disconnected in order to cut | disconnect a panel.

In the module assembly step (step S15), a liquid crystal panel is produced by mounting components such as a control circuit that electrically controls the TFT and the like, and a backlight, such as a light source, in the cell.

In addition, in this embodiment, after cutting two board | substrates after sealing a liquid crystal material, you may seal a liquid crystal material after cutting two board | substrates.

Next, FIG. 2A? 2E and 3A? Based on FIG. 3B, the cell manufacturing process shown in FIG. 1 is demonstrated in detail. In a cell production process, each board | substrate is cut | disconnected in order to cut | disconnect a panel.

First, FIGS. 2A and 3A? As shown to FIG. 3B, the 1st and 2nd scribe line (initial crack) 31 and 32 orthogonal to each other are formed in the outer surface 11 of the one board | substrate 10 which comprises the panel 2. As shown in FIG. The 1st scribe line 31 is formed in multiple numbers in parallel with each other at intervals. Similarly, the 2nd scribe line 32 is also formed in multiple numbers in parallel with each other at intervals. The interval is shown in Figure 3a? As shown to FIG. 3B, it may be uneven and may be equal. In addition, TFT, CF, etc. which are not shown in figure are previously formed in the inner surface 12 of one board | substrate 10. As shown in FIG.

Next, as shown in FIG. 2B, the panel 2 is turned upside down, the brake bar 3 is pressed at a predetermined position of the outer surface 21 of the other substrate 20, and a bending stress is applied to one substrate 10. . Thereby, tensile stress is applied to the bottom portions of the first and second scribe lines 31 and 32 to extend cracks from the bottom portion in the plate thickness direction, thereby cutting one substrate 10.

Subsequently, as shown to FIG. 2C, the outer surface 21 of the other board | substrate 20 is similar to FIG. 2A, and the 1st and 2nd scribe line orthogonal to each other (FIG. 2C, 1st scribe line ( 41) only shown). In addition, CF, TFT, etc. which are not shown in figure are previously formed in the inner surface 22 of the other board | substrate 20. As shown in FIG.

Finally, as shown in FIG. 2D, the panel 2 is turned upside down, the brake bar 3 is pressed at a predetermined position of the outer surface 11 of the one substrate 10, and the other substrate ( 20) cut off. Thus, as shown to FIG. 2E, the panel 2 is cut | disconnected and the some cell 4 is produced.

In the present embodiment, after the first and second scribe lines 31 and 32 are formed on the outer surface 11 of one substrate 10, the first and second scribe lines 31 and 32 are formed on the outer surface 21 of the other substrate 20. Although the 2nd scribe line was formed, you may implement these processes simultaneously.

Next, FIG. 2A? The cutting process of the board | substrate 10 shown in FIG. 2B is demonstrated in detail. 2c? Since the cutting process of the board | substrate 20 shown in FIG. 2D is the same, description is abbreviate | omitted.

In this embodiment, in the process shown to FIG. 2A, the long side of a liquid crystal panel, ie, FIG. When forming the 1st scribe line 31 corresponding to the long side 6 of the cell 4 shown in FIG. 3B, it is 0? The first cutter wheel 50 having five cuts is used. On the other hand, when forming the 2nd scribe line 32 corresponding to the short side of a liquid crystal panel, ie, the short side 8 of the cell 4, it is 50? A second wheel cutter 60 having 300 cutouts is used. The first and second wheel cutters 50, 60 may be incorporated in one holder, and may be configured to be movable between the use position and the unused position, respectively, or may be used separately according to circumstances.

4 is a perspective view of the first wheel cutter 50. 5 is a cross-sectional view of the substrate in the use state of the first wheel cutter 50.

As shown in FIG. 4, the 1st wheel cutter 50 is a disk-shaped object which has the axial hole 51 in the center, and has the outer peripheral blade 52. As shown in FIG. The outer circumferential edge 52 is formed of diamond, a super alloy or the like. This outer edge 52 is called what is called a normal blade, and is 0? 5 cutouts (0 in Fig. 4). By making the number of notches five or less, the smooth 1st scribe line 31 can be formed and the edge strength of the long side 6 of the cell 4 can be improved. Furthermore, the edge strength of the long side of a liquid crystal panel can be raised. The outer circumferential diameter of the first wheel cutter is φ1? It is preferable that it is (phi) 10 mm.

When using the 1st wheel cutter 50, as shown in FIG. 5, the 1st scribe line 31 is formed by pressing and rotating the outer edge 52 on the board | substrate 10, rotating. At this time, the outer circumferential edge 52 only penetrates several micrometers in the board | substrate 10, but the 1st scribe line 31 is formed to the position deeper than the outer circumferential edge 52. As shown in FIG.

Although the depth D1 of the 1st scribe line 31 is determined by the load which presses the outer peripheral blade 52, the blade tip angle of the outer peripheral blade 52, etc., it is 5? Of the plate | board thickness T of the board | substrate 10. FIG. It is preferable that it is 25%. By setting it as 5% or more, when tensile stress acts on the bottom part of the 1st scribe line 31, it can cut along the 1st scribe line 31. On the other hand, when it exceeds 25%, since a load becomes high too much, a crack is formed also in the direction which intersects with the 1st scribe line 31, and the intensity | strength of a cut surface falls. On the other hand, the plate thickness T of the substrate 10 is usually 0.1? 3 mm.

6 is a perspective view of the second wheel cutter 60. 7 is a cross-sectional view of the substrate in the use state of the second wheel cutter 60.

As shown in FIG. 6, the 2nd wheel cutter 60 is a disk-shaped object which has the axial hole 61 in the center, and has the outer peripheral edge 62. As shown in FIG. The outer circumferential edge 62 is made of diamond, super alloy or the like. This outer blade 62 is called a high penetrating blade, and has 50? It has 300 cutouts 63. The outer circumferential diameter of the second wheel cutter is φ1? It is preferable that it is (phi) 10 mm.

When using the 2nd wheel cutter 60, as shown in FIG. 7, the 2nd scribe line 32 is formed by pressing and rotating the outer edge 62 on the board | substrate 10, rotating. At this time, the outer circumferential edge 62 only penetrates several micrometers in the board | substrate 10, but the 2nd scribe line 32 is formed to the position deeper than the outer circumferential edge 62. FIG.

The depth D2 of the second scribe line 32 is determined by the load pressing the outer circumferential edge 62, the blade tip angle of the outer circumferential edge 62, the number of cutouts 63, and the like. For example, as the number of the notches 63 increases, the load concentrates on the convex portion 64 of the outer circumferential edge 62, so that the depth D2 of the second scribe line 32 becomes deeper. On the other hand, when the number of the notches 63 increases too much, the individual notches 63 become too small, and the effect of forming the notches 63 is not sufficiently obtained. Therefore, the number of cutouts 63 is 50? It is set to 300. 50? In the case of 300, the depth D2 of the second scribe line 32 is 75? Of the plate thickness T of the substrate 10. It becomes about 85% (for example, about 80%). For this reason, the both glass which sandwiched the 2nd scribe line 32 became able to divide about the force of a thumb.

Subsequently, as shown in FIG. 2B, the panel is turned over, and the brake bar 3 is pressed against a portion of the outer surface 21 of the other substrate 20 that faces the first scribe line 31, so as to form one substrate 10. ) Is subjected to bending stress. Then, a tensile stress acts on the bottom part of the 1st scribe line 31, a crack extends from a bottom part to a plate thickness direction, and reaches the inner surface 12 of one board | substrate 10. FIG.

Thereby, a stress, an impact, etc. act on the 2nd scribe line 32. FIG. In this case, since both glasses having the second scribe line 32 interposed therebetween can be divided by the force of the thumb, cracks are also extended in the plate thickness direction from the bottom of the second scribe line 32. To the inner surface 12 of the substrate 10.

Thus, in this embodiment, since the board | substrate 10 can be cut | disconnected only by performing a brake operation once, without changing the direction of the brake bar 3, workability can be improved.

In addition, in this embodiment, FIG. Cutting process of the board | substrate 10 shown to FIG. 2B, and FIG. Although the cutting process of the board | substrate 20 shown in FIG. 2D made the same thing, this invention is not limited to this. For example, any cutting process may be the same as before.

By the way, in the portable apparatus (for example, cellular phone) 70 in which a liquid crystal panel (including a liquid crystal pen tablet, a touch panel, etc.) is mounted, FIG. As shown to FIG. 8B, the 2nd case body 72 provided with the liquid crystal panel 74 was connected to the 1st case body 71 provided with the input key 73 etc. so that opening and closing is possible. As a coupling mechanism, there exists a thing which connects the 1st case body 71 and the 2nd case body 72 so that rotation movement is possible. In this case, as shown in FIG. 8A, the short side 78 of the liquid crystal panel 74 is often parallel to the rotational motion axis 75.

8A illustrates a state in which the portable device 70 is opened. In this state, the operator operates the input key 73 or the like based on the screen display of the liquid crystal panel 74 to perform various processes. When not in use, as shown to FIG. 8B, the 2nd case body 72 is rotated with respect to the 1st case 71, and is folded. As a result, the portable device 70 is closed, and erroneous operation of the input key 73 is prevented, and the liquid crystal panel 74 is protected.

When the rod-shaped object 80 such as a pen-type input device or a ball pen is placed on the first or second case bodies 71 and 72 in the state in which the portable device 70 is opened, the portable device 70 When the state is closed, the long side 76 of the liquid crystal panel 74 is often pressed by the rod-shaped article 80. This is because the rod-shaped object 80 is easily disposed to cross the long side 76 of the liquid crystal panel 74 because of the presence of the rotational motion axis 75.

In this embodiment, since the long side 76 of the liquid crystal panel 74 is formed with the normal scribe line 31, the cut surface of glass is smooth compared with the case where it is formed with the high penetrating blade. . Therefore, the long side 76 of the liquid crystal panel 74 has a high edge strength and hardly cracks even when pressed. Therefore, the crack of the liquid crystal panel 74 can be suppressed.

In addition, in this embodiment, although the liquid crystal panel 74 is mounted in the folding-type portable device 70, there is no restriction | limiting in the use of the liquid crystal panel 74, For example, FIG. You may mount the liquid crystal panel 74 in the portable apparatus which does not have the rotary motion shaft 75 shown to FIG. 8B. Also in this case, if the edge strength on the long side 76 side of the liquid crystal panel 74 is high, since the average edge strength of the entire outer edge of the liquid crystal panel 74 is high, the crack of the liquid crystal panel 74 can be suppressed. have.

Next, FIG. 3A? With reference to FIG. 3B over and over, the formation procedure of the 1st scribe line 31 and the 2nd scribe line 32 is demonstrated.

First, as shown to FIG. 3A, the 1st scribe line 31 is formed using the 1st wheel cutter 50 which has a normal blade. The 1st scribe line 31 is formed in multiple numbers in parallel with each other at intervals.

Next, as shown to FIG. 3B, the 2nd scribe line 32 is formed using the 2nd wheel cutter 60 which has a high penetrating blade. Since the 2nd wheel cutter 60 has the sufficient number of cutouts 63 formed along the outer periphery, it is easy to penetrate into the board | substrate 10. FIG. Therefore, when the second wheel cutter 60 crosses the first scribe line 31, it is possible to suppress the springing from being caused by a sudden change in resistance, and the second scribe line 32 can be prevented from being broken in the middle. have. As a result, the cut surface quality can be improved.

While the invention has been described in detail and with reference to specific embodiments thereof, it will be apparent to one skilled in the art that various modifications or changes can be made therein without departing from the spirit and scope thereof.

This application is based on the JP Patent application 2010-166346 of an application on July 23, 2010, The content is taken in here as a reference.

2: Panel
3: brake bar
4: cell
6: long side
8: short side
10: mother glass substrate
11: outer surface
12: inner surface
20: mother glass substrate
21: outer surface
22: inner surface
31: First scribe ship
32: second scribe ship
41: the first scribe
50: first wheel cutter
51: shaft hole
52: Outsourcing Day
60: second wheel cutter
61: shaft hole
62: Outsourcing Day
63: notch
70: mobile device
71: first case body
72: second case body
73: input key
74: liquid crystal panel (display panel)
75: rotational movement axis
76: long side
78: short side
80: rod-shaped object

Claims (8)

A step of cutting the mother glass substrate by forming first and second scribe lines perpendicular to each other on the surface of the mother glass substrate and extending the cracks in the plate thickness direction from the first and second scribe lines. In the manufacturing method of the display panel which has
When forming the first scribe line corresponding to the long side of the display panel, 0? Using the first wheel cutter with five notches,
When forming the second scribe line corresponding to the short side of the display panel, 50? A manufacturing method of a display panel using a second wheel cutter having 300 cutouts. The method of claim 1,
And after forming the first scribe line using the first wheel cutter, forming the second scribe line using the second wheel cutter. The method according to claim 1 or 2,
The depth of the first scribe line is 5? Of the plate thickness of the mother glass substrate. The manufacturing method of the display panel which is 25%. The method according to claim 1 or 2,
The depth of the second scribe line is 75? Of the plate thickness of the mother glass substrate. The manufacturing method of the display panel which is 85%. The method according to claim 1 or 2,
The thickness of the mother glass substrate is 0.1? The manufacturing method of the display panel which is 3 mm. The method according to claim 1 or 2,
The said 1st and 2nd wheel cutters are provided with the outer periphery in the disk-shaped object which has a shaft hole in the center. The display panel obtained by the manufacturing method of the display panel of Claim 1 or 2. The method of claim 7, wherein
The display panel is a liquid crystal panel.

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