KR20120006714A - Lighting device - Google Patents

Abstract

An illumination device is provided.
An illumination apparatus according to an embodiment of the present invention includes a light source module including a substrate and at least one light emitting device mounted on the substrate; Cooling means arranged to face the other surface of the substrate on which the light emitting device is mounted, and having a plurality of injection holes on a surface thereof to inject air to the light source module; A vortex generating unit provided on the other surface of the substrate so as to face the cooling means and forming a vortex in the space between the light source module and the cooling means by the air injected from the cooling means; And an electrical connection part electrically connected to the light source module and the cooling means to supply an electrical signal from the outside.

Description

Lighting Device {Illuminating Device}

The present invention relates to a lighting device, and more particularly to a lighting device using a light emitting element as a light source.

A light emitting device (LED) refers to a semiconductor device capable of realizing various colors of light by configuring a light emitting source by changing compound semiconductor materials such as GaAs, AlGaAs, GaN, and InGaInP.

Such light emitting devices are widely used in various fields such as TVs, computers, lighting, automobiles, etc. due to their excellent monochromatic peak wavelength, excellent light efficiency, miniaturization, eco-friendliness, and low power consumption. It is going out.

Lighting devices using such a light emitting device as a light source has a great response due to the advantage that the life is longer than conventional incandescent lamps or halogen lamps.

However, the light emitting device generates a lot of heat in accordance with the increase in the amount of current applied, which causes a problem of lowering the luminous efficiency and shortening the lifespan.

Therefore, in order to maintain a long life, which is an advantage of the lighting device, research on a structure capable of maximizing heat dissipation is required, and many studies have been conducted for improving the structure and miniaturization and weight reduction for more efficient heat dissipation.

An object of the present invention is to provide a lighting device having a simple structure, improving heat dissipation efficiency, increasing light output of a light emitting device, and improving reliability, such as service life.

In addition, by replacing the existing aluminum housing with a heat dissipation resin to provide a lighting device capable of compact and lightweight by integrating with the cooling means.

An illumination apparatus according to an embodiment of the present invention, a light source module including a substrate and at least one light emitting element mounted on the substrate; Cooling means arranged to face the other surface of the substrate on which the light emitting device is mounted, and having a plurality of injection holes on a surface thereof to inject air to the light source module; A vortex generating unit provided on the other surface of the substrate so as to face the cooling means and forming a vortex in the space between the light source module and the cooling means by the air injected from the cooling means; And an electrical connection part electrically connected to the light source module and the cooling means to supply an electrical signal from the outside.

In addition, a heat sink having a cavity open toward the front in the center and a plurality of ventilation holes penetrating along the circumference of the cavity so as to mount the light source module and the heat sink plate; And a housing including a plurality of heat dissipation fins radially provided along a plurality of heat dissipation fins formed in a center thereof to communicate with the cavity so as to mount the cooling means and the electrical connection at the center thereof.

In addition, the plurality of heat dissipation fins may be disposed between the plurality of ventilation holes, respectively, to form a ventilation passage communicating with the ventilation holes.

In addition, the plurality of heat dissipation fins may be provided along the inner circumferential surface of the accommodating hole, and may have exhaust holes communicating with the ventilation passages, respectively.

The cooling means may include: a main body having an internal space having a predetermined size and having a plurality of injection holes formed therethrough on a surface facing the vortex generator; A membrane structure provided in the main body and configured to spray air flow generated by the up and down rocking motion to the protrusion through the injection hole; And an actuator for driving the membrane structure to oscillate vertically when an electrical signal is applied.

The light source module may be mounted on one surface of the light source module to support the light source module and receive and radiate heat generated from the light source module, and a support plate on which the vortex generator is formed on the other surface of the light source module. .

The vortex generator may include at least one of a plurality of protrusions protruding from the surface of the substrate or the support plate and a plurality of grooves recessed from the surface of the substrate or the support plate.

In addition, the cooling means may be arranged such that the plurality of injection holes are located between the plurality of protrusions so that the vortex occurs in the space between the substrate or the support plate to inject air between each of the protrusions.

In addition, the cooling means may be arranged so that the plurality of injection holes are located facing the plurality of grooves so that the vortex occurs in the space between the substrate or the support plate to inject air into each groove.

The apparatus may further include a cover part provided on the front surface of the cavity of the heat sink to protect the light source module.

In addition, the cover portion may have a lens structure on the inner side corresponding to the position of each light emitting device.

According to the present invention, the air circulation is easy, and thus the heated air can be easily discharged without being accumulated, thereby maximizing the heat radiation efficiency. Therefore, it is possible to develop a high power light emitting device lighting device applicable to the ceiling sealing structure.

In addition, it is possible to reduce the manufacturing cost of the lighting product by reducing the size of the heat dissipation unit.

1 is a view schematically showing a lighting device according to an embodiment of the present invention.
FIG. 2 is a view schematically illustrating a light source module and a vortex generating unit in the lighting apparatus of FIG. 1.
3 is a view schematically showing another embodiment of the light source module and the vortex generator in the lighting apparatus of FIG. 1.
4 is a view schematically showing a cooling means in the lighting device of FIG.
5 is a view schematically illustrating the operating principle of the cooling means of FIG.
6 is a view schematically showing an arrangement relationship between an injection hole of a cooling means and a vortex generator in the lighting apparatus of FIG. 1.
7 is a view schematically showing the air flow in the housing coupled with the cooling means.

Description of the lighting device according to an embodiment of the present invention will be described with reference to the drawings. However, embodiments of the present invention may be modified in many different forms and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.

Therefore, the shape and size of the components shown in the drawings may be exaggerated for more clear description, components having substantially the same configuration and function in the drawings will use the same reference numerals.

A lighting device according to an embodiment of the present invention will be described with reference to FIGS. 1 to 7.

1 is a view schematically showing a lighting device according to an embodiment of the present invention, FIG. 2 is a view schematically showing a light source module and a vortex generator in the lighting device of FIG. 1, and FIG. 3 is a light source in the lighting device of FIG. 1. 2 is a diagram schematically showing another embodiment of the module and the vortex generator. 4 is a view schematically showing the cooling means in the lighting device of FIG. 1, FIG. 5 is a view schematically illustrating the operating principle of the cooling means of FIG. 4, and FIG. 6 is a spray of the cooling means in the lighting device of FIG. 1. FIG. 7 is a view schematically showing an arrangement relationship between a hole and a vortex generating unit, and FIG. 7 is a view schematically showing an air flow in a housing coupled with a cooling means.

1 to 7, the lighting device 1 according to the embodiment of the present invention includes a light source module 100, a cooling unit 200, a vortex generating unit 300, and an electrical connection unit 500. The light source module may further include a housing 400 accommodating the light source module, a cooling unit, a vortex generating unit, and an electrical connection unit, and a cover unit 600 protecting the light source module.

As shown in FIG. 1, the light source module 100 includes a substrate 110 and one or more light emitting devices 120 mounted on the substrate.

The light emitting device 120 used as a light source of the light source module 100 is a kind of semiconductor device that emits light having a predetermined wavelength by an electric signal applied from the outside, and includes an LED chip or an LED package on which the LED chip is mounted. can do.

The substrate 110 is a type of printed circuit board (PCB) formed of an organic resin material and other organic resin material containing epoxy, triazine, silicon, polyimide and the like, or a ceramic material such as AlN, Al ₂ O ₃ Or, it may be formed of a metal and a metal compound as a material, specifically MCPCB which is a kind of metal PCB is preferable.

The substrate 110 on which the light emitting device 120 is mounted is provided with a circuit wiring (not shown) electrically connected to the light emitting device 120, an insulating layer having a withstand voltage characteristic, and the like.

The vortex generator 200 is disposed on the other surface of the substrate 110 to face the cooling means 300 to be described later, and the light source module is formed by air G injected from the cooling means 300. A vortex is formed in the space between the 100 and the cooling means 300.

The vortex generator 200 may be provided on the other surface of the surface of the substrate 110 opposite to one surface on which the light emitting device 120 is mounted. 2A and 2B, the vortex generator 200 includes a plurality of protrusions 201 protruding from the surface of the substrate 110 and a plurality of grooves 202 recessed from the surface of the substrate 110. It may include at least one of.

In detail, the vortex generator 200 may have a structure in which a plurality of protrusions 201 protrude from the surface of the substrate 110. In this case, the plurality of protrusions 201 may be spaced apart from each other and provided along the surface of the substrate 110. In the drawings, the protrusion 201 is illustrated as being formed in the form of a rectangular pillar, but is not limited thereto. The protrusion 201 may be formed in various shapes such as a cylinder, a ladder, a cone, and the like.

In addition, the vortex generator 200 may have a structure in which a plurality of grooves 202 are recessed from the surface of the substrate 110. Similarly, the plurality of grooves 202 may be spaced apart from each other and provided along the surface of the substrate 110, and may be formed in various structures such as a square or a circle.

Meanwhile, as shown in FIG. 3, the light source module 100 is mounted on one surface so as to support the light source module 100 and receive and radiate heat generated from the light source module 100, and on the other surface opposite to the one surface. The vortex generator 200 may further include a support plate 210 formed thereon.

The support plate 210 is preferably formed in a shape corresponding to the shape of the substrate 110 for mounting the light source module 100, and may be made of a metal material having excellent thermal conductivity, preferably Al. It is not limited. A thermal interface material (TIM) (not shown) such as a heat dissipation pad, a phase change material, or a heat dissipation tape may be coupled between the substrate 110 and the support plate 210 to minimize thermal resistance. have. As shown in FIG. 2, the vortex generating unit 200 may protrude from the surface of the support plate 210 or may be recessed.

The vortex generating unit 200 promotes turbulence to improve heat transfer by causing vortices to be generated near the surface of the substrate or the support plate 210 by the air G injected through the cooling means 300 to be described later. Brings effect.

The cooling means 300 is disposed to face the other surface facing the one surface of the substrate 110 on which the light emitting device 120 is mounted and the vortex generator 200, and a plurality of injection holes 311 on the surface thereof. It is provided to spray the air (G) to the substrate 110 and the vortex generator 200. That is, by forcibly generating an air flow to cool the light source module 100. In this case, the air G injected through the injection hole 311 may be injected in the form of a micro air jet.

As shown in FIGS. 4 and 5, the cooling means 300 includes a main body 310 having an internal space of a predetermined size, a membrane structure 320 provided in the main body 310, and the membrane structure ( Actuator 330 for driving 320 may be included.

Specifically, the main body 310 preferably has a disk-shaped structure as a whole so as to correspond to the structure of the substrate 110 or the support plate 210 of the light source module 100, but is not limited thereto. It is also possible to form a structure of. The plurality of injection holes 311 are formed through the surface of the main body 310 facing the vortex generator 200.

In this case, the formation position of the plurality of injection holes 311 may be adjusted to correspond to the structure of the vortex generator 200.

That is, when the vortex generator 200 has a structure of a plurality of protrusions 201 protruding from the surface of the substrate 110 or the support plate 210, the cooling means 300 is the substrate 110 or The plurality of injection holes 311 are disposed between the plurality of protrusions 201 so that vortices are generated in the space between the support plates 210 to inject air G between the protrusions 201. can do. Alternatively, the plurality of injection holes 311 may be disposed at positions corresponding to the plurality of protrusions 201 to directly cool the protrusions 201 by injecting air G into each of the protrusions 201. Do.

And, when the vortex generating unit 200 is provided with a plurality of grooves 202 structure formed recessed from the surface of the substrate 110 or the support plate 210, the cooling means 300 is the substrate 110 or The plurality of injection holes 311 are disposed to face the plurality of grooves 202 so that the vortices are generated in the space between the support plate 210 and the air G in each of the grooves 202. Can spray

The membrane structure 320 is provided in the main body 310 to generate an air flow through the up and down or left and right rocking motion, and to spray it to the vortex generator 200 through the injection hole (311). The membrane structure 320 is preferably made of a material having an elastic force, such as rubber (rubber).

The actuator 330 is a kind of driving source for driving the membrane structure 320 to move up and down (or left and right) when an electric signal is applied, and a stepping motor or a piezoelectric motor may be used. have. The actuator 330 may be provided in the main body 310 together with the membrane structure 320, or may be provided outside the main body 310.

As described above, the cooling means 300 according to the present embodiment promotes a wake effect due to the vortex through the air flow forcedly injected into the vortex generating unit 210 as shown in FIG. 7. By improving heat transfer at the surface of 210, it is possible to maximize the cooling effect of the light source module 100.

The housing 400 functions as a housing for receiving and supporting the light source module 100 and the vortex generator 200, and as a heat sink for dissipating heat generated from the light source module 100 to the outside. do. The housing 400 may be formed of a metal material such as Al or may be formed of a plastic series such as a heat dissipating resin so as to be integrally formed with the cooling means 300.

As shown in FIGS. 1 and 7, the housing 400 includes a cavity 411 that is open toward the front to mount the vortex generator 200 including the light source module 100 and the finger plate 210. The heat sink 410 and a plurality of heat sink fins 420 extending radially along the edge of the heat sink 410 extending to the rear of the heat sink 410. The heat sink 410 includes a plurality of ventilation holes 412 formed through the circumference of the cavity 411, and the plurality of heat sink fins 420 are disposed between the plurality of ventilation holes 412. It is disposed so as to form a ventilation passage 422 communicating with the ventilation hole 412.

Therefore, the heated air G does not stagnate between the heat dissipation fins 420, and maintains a flow along the ventilation passage 422 formed between the heat dissipation fins 420 so that the outer surface of the heat dissipation fins 420 is maintained. The heat dissipation fin 420 is cooled by being discharged directly to the outside or through the vent hole 412 to the outside.

Meanwhile, the plurality of heat dissipation fins 420 are radially disposed on the rear surface of the heat dissipation plate 410 to form a receiving hole 421 communicating with the cavity 411 at the center thereof. Accordingly, the heat dissipation unit 400 has a structure in which the center pierces the entire body by communicating with the cavity 411 provided at the center of the heat dissipation plate 410 and the receiving hole 421 provided at the center of the heat dissipation fin 420. Have In addition, the cooling means 300 is mounted in the accommodation hole 421.

The plurality of heat dissipation fins 420 are provided along the inner circumferential surface of the accommodation hole 421 and have exhaust holes 423 communicating with the ventilation passage 422, respectively. That is, the exhaust hole 423 communicating the space between the substrate 110 or the support plate 210 and the cooling means 300 and the ventilation passage 422 with each other along the inner circumferential surface of the accommodation hole 421. By providing the air (G) heated by the heat conducted to the substrate 110 or the support plate 210 to be exhausted to the outside. Specifically, the air G injected through the cooling means 300 is vortexed in the space between the substrate 110 or the support plate 210 and the cooling means 300 by the vortex generator 200. , Which promotes turbulence to improve heat transfer to air (G). The heated air G is discharged into the ventilation passage 422 between the heat dissipation fins 420 through the exhaust hole 423, thereby lowering the temperature of the vortex generator 200 including the support plate 210. The module 100 is cooled.

The electrical connection unit 500 supplies an electrical signal from the outside to the light source module 100 and the cooling means 300 through a power supply device (SMPS) 520 provided in the case 510. . The case 510 may be provided to cover and protect the power supply device 520 that is mounted in the accommodation hole 421 of the heat dissipation fin 420 and is exposed to the rear. In this case, an outer surface of the case 510 is provided. And the outer surface of the heat dissipation fin 420 is preferably provided with a structure that is connected to each other continuously along the bonding surface.

The cover part 600 is mounted on the front surface of the cavity 411 of the heat sink 410 to protect the light source module 100. The cover member 600 may be formed of a material such as PC, plastic, silica, acrylic, glass, and the like, but is not limited thereto.

In particular, the cover part 600 may include a lens structure 610 on the inner side corresponding to the position of each light emitting device 120 as shown in FIG. 7. The lens structure 610 is located directly above each of the light emitting devices 120, and adjusts the directing angle of the light emitted from the light emitting devices 120.

100 ....... Light source module 110 ....... Board
120 ....... Light emitting element 200 ...... Vortex generator
210 ....... Support plate 300 ....... Cooling means
400 ....... Housing 500 ....... Electrical connection
600 ....... Cover part

Claims (11)

A light source module including a substrate and at least one light emitting device mounted on the substrate;
Cooling means arranged to face the other surface of the substrate on which the light emitting device is mounted, and having a plurality of injection holes on a surface thereof to inject air to the light source module;
A vortex generating unit provided on the other surface of the substrate so as to face the cooling means and forming a vortex in the space between the light source module and the cooling means by the air injected from the cooling means; And
An electrical connection unit electrically connected to the light source module and the cooling unit to supply an electrical signal from the outside;
Lighting device comprising a.
The method of claim 1,
A heat sink having a cavity open toward the front in the center to mount the light source module and the heat sink plate, and a plurality of ventilation holes penetrating through the circumference of the cavity, and extending to a rear surface of the heat sink and along the edge of the heat sink; And a housing including a plurality of heat dissipation fins radially provided to form a receiving hole in communication with the cavity so as to mount the cooling means and the electrical connection in the center thereof.
The method of claim 2,
The plurality of heat dissipation fins are disposed so as to be positioned between the plurality of ventilation holes, respectively, characterized in that for forming a ventilation passage communicating with the ventilation holes.
The method of claim 3,
The plurality of heat dissipation fins are provided along the inner circumferential surface of the receiving hole is provided with a plurality of exhaust holes in communication with the ventilation passage, respectively.
The method of claim 1, wherein the cooling means,
A main body having an internal space having a predetermined size and having a plurality of injection holes formed therethrough on a surface facing the vortex generating unit;
A membrane structure provided in the main body and configured to spray air flow generated by the up and down rocking motion to the protrusion through the injection hole; And
An actuator for driving the membrane structure to swing up and down when an electric signal is applied;
Lighting device comprising a.
The method of claim 1,
And a support plate on one surface of which the light source module is mounted so as to support the light source module and receive and radiate heat generated from the light source module, and a vortex generating portion formed on the other surface opposite to the one surface.
The method according to claim 1 or 6,
And the vortex generator includes at least one of a plurality of protrusions protruding from a surface of the substrate or the support plate and a plurality of grooves recessed from the surface of the substrate or the support plate.
The method of claim 7, wherein
And the cooling means is arranged such that the plurality of injection holes are positioned between the plurality of protrusions so as to generate vortices in the space between the substrate or the support plate to inject air between the protrusions.
The method of claim 7, wherein
The cooling means is arranged to position the plurality of injection holes facing the plurality of grooves so as to generate a vortex in the space between the substrate or the support plate to illuminate the air to each groove .
The method of claim 2,
Lighting device further comprises a cover portion provided on the front surface of the cavity of the heat sink to protect the light source module.
The method of claim 10,
And the cover part has a lens structure on the inner side corresponding to the position of each light emitting element.

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