KR20110128579A - Thin film deposition apparatus for OLD manufacturing - Google Patents

Abstract

A thin film deposition apparatus for manufacturing an OLED is disclosed. The thin film deposition apparatus for manufacturing an OLED of the present invention includes a chamber; A substrate support plate on which the substrate is supported; And an optional magnetic force adding unit coupled to the substrate supporting plate and releasing the magnetic force when aligning the substrate with respect to the mask, and applying magnetic force to the mask so that the mask adheres to the substrate during the patterning process. It is characterized by. According to the present invention, the magnetic force applied to the mask is reduced so that the scratch does not occur during the alignment of the substrate and the mask, and after the alignment is completed, the magnet array can adhere the mask to the substrate. In addition, the pattern formed on the substrate may be improved in quality by making the density of the magnet uniform while reducing outgas from the magnet array.

Description

Thin film deposition apparatus for OLD manufacturing {THIN LAYERS DEPOSITION APPARATUS FOR MANUFACTURING OLED}

The present invention relates to a thin film deposition apparatus for manufacturing an OLED, and more particularly, to reduce the magnetic force applied to the mask in the magnet array so that no scratch occurs during the alignment of the substrate and the mask and after the alignment is completed Thin film deposition for OLED manufacturing, which allows the magnet array to closely adhere the mask to the substrate and improves the quality of patterns formed on the substrate by making the density of magnets uniform while generating less outgas from the magnet array. Relates to a device.

In general, organic light emitting display (OLED), which is a flat panel display element, is an ultra-thin display device that realizes color images by self-emission of organic materials, and is promising next-generation in that its structure is simple and its light efficiency is high. It is attracting attention as a display device.

OLEDs include anodes and cathodes and organic layers sandwiched between anodes and cathodes. The organic layers include a light emitting layer, and further include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer in addition to the light emitting layer. Such OLEDs are classified into a polymer organic light emitting device and a low molecular organic light emitting device according to an organic layer, in particular, a light emitting layer.

In order to realize full color in OLED, the light emitting layer needs to be patterned. In particular, the patterning method of large OLEDs includes a direct patterning method using a fine metal mask (FMM) and a laser induced thermal imaging (LITI). ) And the method using a color filter.

In large OLED manufacturing, a patterned mask is required to apply a mask method, and a film such as flexible PET and PES is required to apply a LITI method that can realize higher resolution than this, and a film tray for fixing it flat (film tray) is required.

On the other hand, in the above-described direct patterning method using a mask of the OLED manufacturing method, a magnet array is usually used to fix the mask on the substrate.

The magnet array is installed to generate a magnetic force that pulls the mask across the substrate so that the mask is tightly fixed to the substrate. However, if the magnet array continuously applies magnetic force to the mask even when the substrate is aligned with the mask, scratches may occur on the substrate, and thus there is a need to solve the problem.

In addition, two types of magnet arrays, a neodymium (Nd) magnet and a rubber (rubber) magnet, are generally used. However, in the case of a conventional neodymium (Nd) magnet, less outgas is generated. However, there is a problem that a so-called twist phenomenon occurs in which a desired pattern does not come out on the substrate because the magnet density is not uniform. In the case of a conventional rubber magnet, the magnet density is uniform so that a desired pattern is well generated. There is an advantage, but there is a problem that occurs out gas (Out gas) is required to compensate for this situation.

The object of the present invention is to reduce the magnetic force applied to the mask so that the magnet array does not scratch during the alignment of the substrate and the mask, so that the magnet array can adhere the mask to the substrate after the alignment is completed. In addition, the present invention provides a thin film deposition apparatus for manufacturing an OLED that can improve the quality of a pattern formed on a substrate by making the magnet density uniform while reducing outgas from the magnet array.

The object is, according to the present invention, a chamber; A substrate support plate on which the substrate is supported; And a selective magnetic force coupled to the substrate support plate, the magnetic force being released when the substrate is aligned with respect to the mask, and applying a magnetic force to the mask so that the mask is in close contact with the substrate during the patterning process. It is achieved by a thin film deposition apparatus for producing an OLED, characterized in that it comprises an additional unit.

Here, the selective magnetic force adding unit, the magnet array; And a magnet array driver for relatively moving the magnet array with respect to the substrate supporting plate.

The magnet array includes an array frame; And a plurality of neodymium (Nd) magnets arranged in the same pole in the array frame.

The array frame may have a plurality of receiving grooves in which the neodymium (Nd) magnet is removably received.

The magnet array includes an array frame; And a rubber magnet fixed on the array frame in the form of a plurality of stripes having a predetermined length.

The selective magnetic force adding unit may include a cover coupled to the magnet array to cover the plurality of rubber magnets to prevent generation of out gas; And an O-ring interposed between the cover and the magnet array.

The substrate supporting plate may be a cooling plate.

The optional magnetic force adding unit may be an electromagnet.

The apparatus may further include a substrate holding alignment unit configured to align the substrate with respect to the mask in a state in which the substrate is disposed in parallel with the mask.

The substrate holding alignment unit may include: a unit body to which the substrate supporting plate is coupled to be relatively movable; A substrate holding part for holding the substrate in contact with the substrate supporting plate at a corresponding position; And a substrate aligner connected to the unit main body to align the substrate with respect to the mask.

The substrate aligner may further include a vision unit to photograph an alignment mark of the mask.

The magnet array driver may be driven independently of the unit body.

The substrate supporting plate may be disposed along a direction crossing the bottom surface of the chamber.

The apparatus may further include an alignment reference part provided in the chamber along a direction crossing the bottom surface of the chamber to form an alignment reference of the mask.

The alignment reference part may be a plate type alignment reference plate which forms an alignment reference of the mask but is partially coupled to one side of an inner wall surface of the chamber.

A mask chucking unit provided at a position adjacent to the alignment reference unit to chuck the mask disposed in contact with the alignment reference unit at a corresponding position; A mask driver connected to the mask to drive the mask toward the alignment reference part; A tray transfer unit for transferring the tray supporting the substrate; And a source disposed on one side of the mask to provide a predetermined deposition material to the substrate through the mask.

According to the present invention, the magnetic force applied to the mask is reduced so that the scratch does not occur during the alignment of the substrate and the mask, and after the alignment is completed, the magnet array can adhere the mask to the substrate. In addition, the pattern formed on the substrate may be improved in quality by making the density of the magnet uniform while reducing outgas from the magnet array.

1 to 3 are schematic structural diagrams showing the operation of the thin film deposition apparatus for manufacturing OLED according to the first embodiment of the present invention step by step, respectively.
4 is an exploded perspective view of the magnet array.
5 is a schematic structural diagram of a thin film deposition apparatus for manufacturing an OLED according to a second embodiment of the present invention.
6 is a schematic structural diagram of a thin film deposition apparatus for manufacturing OLED according to a third embodiment of the present invention.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

1 to 3 are schematic structural diagrams showing the operation of a thin film deposition apparatus for manufacturing an OLED according to a first embodiment of the present invention, respectively, and FIG. 4 is an exploded perspective view of a magnet array.

As shown in these figures, in the thin film deposition apparatus for manufacturing an OLED of the present embodiment, unlike the prior art, the mask 120 (Fine Metal Mask, FMM) and the substrate are respectively crossed with respect to the bottom surface 101 of the chamber 100, That is, by being disposed in a vertical direction and being folded, the deposition can be performed while maintaining a precise flatness with each other. Here, the precision flatness means that the mask 120 and the substrate are in uniform contact with each other over the entire area. As described above, the substrate may be an organic light emitting display (OLED).

The thin film deposition apparatus for manufacturing an OLED, as shown in FIGS. 1 to 3, a substrate supporting plate on which a chamber disposed along a direction intersecting the chamber 100 and the bottom surface 101 of the chamber 100 is supported. It is coupled to the substrate holding alignment unit 130 having a 132 and the substrate supporting plate 132, and when aligning the substrate with respect to the mask 120, the magnetic force is released and the patterning process is performed. When the mask 120 is in close contact with the substrate includes a selective magnetic force adding unit 180 to apply a magnetic force to the mask 120.

The chamber 100 is a portion indicated by dark dotted lines in FIGS. 1 to 3 to form a place where a deposition process for a substrate is performed. The interior of the chamber 100 forms a vacuum atmosphere so that the deposition process on the substrate can be performed reliably. Therefore, although not shown, a vacuum pump may be connected to one side of the chamber 100 to suck the air in the chamber 100 to maintain the vacuum in the chamber 100.

The mask 120 is in contact with the surface of the substrate in order to proceed with the deposition process in a predetermined pattern on the surface of the substrate. The mask 120 may be disposed in a fixed position within the chamber 100 or may be moved toward the substrate for relative alignment with the substrate.

One side of the mask 120 is provided with a source 150 for providing a predetermined deposition material required for deposition to the substrate through the mask 120, the mask 120 is a deposition material from the source 150 A plurality of through holes (not shown) are formed to pass through.

The substrate holding alignment unit 130 serves to align the substrate with respect to the mask 120 in a state of holding a substrate disposed in parallel with the mask 120.

The substrate holding alignment unit 130 includes a unit main body 131 to which the substrate supporting plate 132 is coupled to be relatively movable, and a substrate holding the substrate contacting the substrate supporting plate 132 at a corresponding position. And a gripper 133 and a substrate aligner 134 connected to the unit main body 131 to align the substrate with respect to the mask 120.

The unit body 131 is provided with components for moving the substrate support plate 132 toward the mask 120 or returning to the opposite original position. One unit is inside the chamber 100 and the other is It is disposed outside the chamber 100.

The substrate support plate 132 is a place where the substrate is supported on the surface. For reference, the substrate may be transferred into the chamber 100 along the tray transfer part 140 in the form of a roller through a separate tray 141, and after the substrate is transferred, the substrate support plate 132 may be Is placed on the surface. As described above, the surface of the substrate supporting plate 132 is also in parallel with the mask 120 because the substrate is supported on the surface of the substrate supporting plate 132 after being fed vertically, ie, standing up like the mask 120. Keep it.

In this embodiment, the substrate supporting plate 132 is applied as a cooling plate 132. The substrate supporting plate 132, which may be applied to the cooling plate 132, may improve the deposition efficiency by lowering the temperature of the substrate before the actual deposition process is performed on the surface of the substrate. Of course, since the scope of the present invention does not need to be limited thereto, instead of providing the substrate supporting plate 132 as the cooling plate 132, the cooling water or the cooling air injection line is disposed in the substrate supporting plate 132. It is also possible enough.

The board | substrate holding part 133 is a means for holding the board | substrate arrange | positioned at the surface of the board | substrate support plate 132 in the said position. In particular, in the case of the present embodiment, since the substrate is supplied vertically and the substrate is a large substrate, the substrate should be held without shaking. In this embodiment, the structure capable of elastically supporting the substrate is schematically illustrated, but the scope of the present invention is not necessarily limited thereto.

In the provision of the substrate holding part 133, since the substrate must be substantially in surface contact with the mask 120 as shown in FIG. 2, it is difficult for the substrate holding part 133 to interfere with it. Therefore, it is not preferable that the distal end portion of the substrate holding part 133 protrude more toward the mask 120 than the surface of the substrate.

The substrate aligner 134 is connected to the unit main body 131 and performs alignment of the substrate with respect to the mask 120. Although shown in a schematic box structure in the drawing, the substrate aligner 134 is connected to the unit main body 131 or the unit main body 131, and the substrate supporting plate 132 which is substantially in contact with the substrate. It may include a UVW driving force providing unit (not shown) for providing a driving force to move in the at least one direction selected from the X-axis, Y-axis, θ axis. In practice, the unit main body 131 or the substrate supporting plate 132 connected to the unit main body 131 to be substantially in contact with the substrate is moved in at least one direction selected from among X, Y, and θ axes. Since the structure may vary, a detailed description thereof will be omitted.

Since the alignment of the substrate with respect to the mask 120 is performed through the substrate aligner 134 as described above, the substrate aligner 134 captures an image of alignment marks formed on the mask 120. A part (not shown) and, in some cases, may further include a displacement sensor (not shown) for detecting a relative displacement with respect to the mask 120. Image information photographed by the vision unit and the displacement information from the displacement sensor are transmitted to a controller (not shown), and the controller controls the unit body 131 through the control of the UVW driving force providing unit provided in the substrate aligner 134, or Alignment of the substrate with respect to the mask 120 by moving the substrate support plate 132, which is connected to the unit body 131 and is substantially in contact with the substrate, in at least one direction selected from among X, Y, and θ axes. Allow work to proceed.

Meanwhile, as described above, the selective magnetic force adding unit 180 is coupled to the substrate support plate 132, and releases the magnetic force and patterning process when aligning the substrate with respect to the mask 120. In this case, the mask 120 serves to apply a magnetic force to the mask 120 to be in close contact with the substrate.

In other words, the selective magnetic force adding unit 180 is coupled to the substrate supporting plate 132 to generate a magnetic force when the mask 120 is in contact with the substrate so that the mask 120 made of metal may be in close contact with the substrate. By preventing the deposition failure due to the lifting phenomenon between the mask and the substrate, and by selectively applying a magnetic force to the mask 120 according to whether the alignment of the substrate with respect to the mask 120 is completed, In detail, the magnetic force is not transmitted to the mask 120 in the process of aligning the substrate with respect to the mask 120 after the mask 120 and the substrate are close to each other, and the magnetic force is transmitted to the mask 120 after the alignment is completed. It is to be possible. When the selective magnetic force adding unit 180 is applied as in this embodiment, the substrate is prevented from being scratched by continuously applying magnetic force to the mask 120 in the process of aligning the substrate with respect to the mask 120 as in the related art. You can do it.

The selective magnetic force adding unit 180 includes a magnet array 181 and a magnet array driver 185 for moving the magnet array 181 relative to the substrate supporting plate 132.

As shown in FIG. 4, the magnet array 181 includes an array frame 182 and a plurality of neodymium (Nd) magnets 183 arranged in the same pole in the array frame 182. The array frame 182 is formed with a plurality of receiving grooves 182a in which a plurality of neodymium (Nd) magnets 183 are detachably accommodated.

In the present embodiment, the array frame 182 may be provided in a quadrangular shape corresponding to the shape of the substrate, and has a plurality of receiving grooves 182a to which the neodymium (Nd) magnet 183 is detachably accommodated.

The neodymium (Nd) magnet 183 has an advantage of generating less out-gas itself than the rubber magnet 183a described later as a permanent magnet of metal.

In providing the neodymium (Nd) magnet 183, unlike the present embodiment, if one permanent magnet having a large size is provided in the entire area of the array frame 182, the entire mask 120 is made of metal. In this case, the magnetic force may not be transmitted, and thus the edge region of the mask 120 may be twisted, resulting in poor deposition. Accordingly, in order to compensate for this phenomenon, in the present embodiment, a plurality of neodymium (Nd) magnets 183 are provided in the array frame 182, and in this case, the uniformity of the entire area of the mask 120 is more uniform. Magnetic force may be transmitted and the mask 120 may be minimized to increase the deposition efficiency.

In this case, as shown in FIG. 4, the neodymium (Nd) magnets 183 are arranged in plural so that all of the same polarity regions (which may be N or S poles in the drawing) face the mask 120, respectively. do. By properly adjusting the number of neodymium (Nd) magnets 183 arranged in the array frame 182, the intensity of the magnetic field directed to the mask 120 may be adjusted.

The magnet array driver 185 relatively moves the magnet array 181 with respect to the substrate support plate 132.

That is, when the substrate on the substrate support plate 132 approaches the mask 120 to align the substrate with respect to the mask 120, the magnet array driver 185 moves the magnet array 181 from the mask 120. The magnetic force of the neodymium (Nd) magnet 183 is not transmitted by moving in the direction to be spaced apart. Therefore, during the alignment process of aligning the substrate with respect to the mask 120, the substrate and the mask 120 may be prevented from coming into close contact with each other to prevent scratches on the substrate. However, when the alignment of the substrate with respect to the mask 120 is completed, the magnet array driver 185 moves the magnet array 181 toward the mask 120 so that the magnetic force of the neodymium (Nd) magnet 183 becomes the mask 120. By transferring the mask 120, which is a metal material, the mask 120 and the substrate may be brought into close contact with each other without being lifted.

The magnet array driver 185 may be connected to the unit body 131 of the substrate holding alignment unit 130. In this case, the magnet array driver 185 may be driven independently of the unit body 131. The magnet array driver 185 may be applied to a cylinder, a linear motor, a combination of a motor and a ball screw, or a robot.

Referring to the operation of the thin film deposition apparatus for manufacturing an OLED having such a configuration is as follows.

First, when the substrate vertically transferred into the chamber 100 along the tray transfer unit 140 is disposed on the surface of the substrate supporting plate 132, the substrate holding unit 133 may be formed on the surface of the substrate supporting plate 132. The substrate is gripped by

Next, a vision portion (not shown) provided on the substrate aligner 134 photographs an alignment mark formed on the mask 120. Then, the controller controls the unit main body 131 or the substrate supporting plate 132 connected to the unit main body 131 to substantially support the substrate, and selected from among X, Y, and θ axes. By moving in one direction, the substrate is aligned with respect to the mask 120. At this time, the magnet array driving unit 185 moves the magnet array 181 in a direction away from the mask 120 so that the magnetic force of the neodymium (Nd) magnet 183 is not transmitted to freeze the substrate with respect to the mask 120. It is possible to prevent scratches on the substrate during the phosphorus process.

When the alignment of the substrate, which is also perpendicular to the vertical mask 120, is aligned, the unit body 131 moves the substrate supporting plate 132 in the direction of arrow A of FIG. The completed mask 120 and the substrate may be in surface contact with each other. In this case, the magnet array driving unit 185 moves the magnet array 181 toward the mask 120 as shown in FIG. 3 so that the magnetic force of the neodymium (Nd) magnet 183 is transmitted to the mask 120. The mask 120 and the substrate may be pulled together so as to be in close contact with each other without being lifted.

Once all the preparation for deposition is complete, i.e., once the precise flatness of the substrate is aligned with the mask 120, which intersects with respect to the bottom surface 101 of the chamber 100, or is placed vertically, the source 150 The deposition material is provided and deposited through the vertically disposed mask 120 to the surface of the vertically disposed substrate, and when the deposition time is completed, the deposited substrate is extracted.

According to the thin film deposition apparatus for manufacturing an OLED of the present embodiment having the structure and operation as described above, the magnetic force applied to the mask 120 by the magnet array 181 so that scratches do not occur when the substrate and the mask 120 are aligned. This allows the magnet array 181 to bring the mask 120 into close contact with the substrate after the alignment is completed, and to reduce the outgas from the magnet array 181 while keeping the magnet density uniform. The quality of the pattern formed on the substrate can be improved.

5 is a schematic structural diagram of a thin film deposition apparatus for manufacturing an OLED according to a second embodiment of the present invention.

In this embodiment, the magnet array 181a forming the selective magnetic force adding unit 180a is fixed to the array frame 183a and the array frame 182a in the form of a plurality of stripes having a predetermined length. Most of the configurations are the same as those of the above-described embodiment except that the magnet 183a is provided.

The rubber magnet 183a is a permanent magnet made of rubber-rubber material, and has an advantage that the magnet density is uniform and can be easily cut and used to a desired size by the operator, compared to the above-mentioned neodymium (Nd) magnet 183, but the outgas itself Out gas) may be transferred to the deposition space in the chamber 100 to act as a factor that inhibits the deposition process.

In order to prevent such a phenomenon, in other words, when the rubber magnet 183a is applied as the selective magnetic force adding unit 180a, the rubber magnet 183a is coupled to the magnet array 181a to cover the rubber magnet 183a to prevent outgassing. By providing the cover 191 and the O-ring 192 interposed between the cover 191 and the magnet array 181a, side effects due to the outgas can be blocked. That is, even if outgas is generated from the rubber magnet 183a, the cover 191 and the O-ring 192 can block the diffusion thereof, thereby eliminating side effects due to the outgas.

These matters, namely, the cover 191 and the O-ring 192 are provided, in addition to the case in which the rubber magnet 183a is applied as the selective magnetic force adding unit 180a, an electromagnet not shown as the selective magnetic force adding unit 180a is applied. The same may be applied to the case. That is, since the electromagnet basically includes a coil impregnated, like the rubber magnet 183a, outgassed by the impregnating material may be generated and diffused into the space in the chamber 100. By applying a cover 191 and the O-ring 192, it is preferable to eliminate the side effects from the out gas.

6 is a schematic structural diagram of a thin film deposition apparatus for manufacturing OLED according to a third embodiment of the present invention.

Referring to this figure, in the thin film deposition apparatus for manufacturing an OLED of the present embodiment, an alignment is formed in the chamber 100 along a direction crossing the bottom surface 101 of the chamber 100 to form an alignment reference of the mask 120. The phosphorus reference unit 110 is further provided.

The alignment reference unit 110 is a portion that forms an alignment reference of the mask 120 and serves as a medium for the deposition process to be performed in a state where both the mask 120 and the substrate are perpendicular to each other in the chamber 100. .

In the present exemplary embodiment, the alignment reference unit 110 includes a plate-type alignment reference plate in which a through hole 111 is formed in a central region and an outer wall thereof is partially coupled to one side of an inner wall surface of the chamber 100. 110). In this case, the substrate supporting plate 132a may be processed into a partially stepped shape so that a portion holding the substrate is inserted into the through hole 111 region of the alignment reference plate 110.

Since the alignment reference plate 110 must form an alignment reference of the mask 120, one side wall of the alignment reference plate 110 to which the mask 120 is in contact with the mask 120 is manufactured as a surface plate. The mask 120 and the substrate on which the alignment is completed may be brought into surface contact with each other through the through hole 111. The outer wall of the alignment reference plate 110 may be coupled (fixed) to the inner wall surface of the chamber 100 by welding, fastening using a separate bracket, or the like.

On the other hand, since the mask 120 should be in contact with and supported on one side wall of the alignment reference plate 110 during the deposition process, a means for driving (moving) the mask 120 toward the alignment reference plate 110, and the mask. Means for chucking the mask 120 are required after the 120 is contacted and supported on one side wall of the alignment reference plate 110. The former is in charge of the mask driver (not shown), and the latter is in charge of the mask chucking unit 125 schematically shown in FIGS. 1 and 2.

In detail, the mask driving unit may be applied to a cylinder, a linear motor, a combination of a motor and a ball screw, or a robot. As shown in FIG. 2, the mask 120 is moved so that the mask 120 is in contact with and supported on one side wall of the alignment reference plate 110 forming the reference.

The mask chucking unit 125 may be applied to a cylinder, an actuator, or the like, and is provided at a position adjacent to the alignment reference plate 110 to be in contact with and supported on the alignment reference plate 110. It serves to chuck the mask 120 so that the mask 120 is not randomly displaced or repositioned.

When such a structure is applied, alignment of the substrate and the mask 120 may be precisely performed, and thus, may be particularly suitable for mass production of large OLEDs.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

100: chamber 101: bottom surface
110: alignment reference unit 120: mask
125 mask chucking unit 130 substrate holding alignment unit
131: unit body 132: substrate support plate
133: substrate holding portion 134: substrate aligner
140: tray transfer unit 150: source
180: optional magnetic force addition unit 181: magnet array
182: array frame 183: neodymium (Nd) magnet
185: magnet array drive unit

Claims (16)

chamber;
A substrate support plate on which the substrate is supported; And
A selective magnetic force coupled to the substrate support plate to release the magnetic force when aligning the substrate with respect to the mask, and apply a magnetic force to the mask so that the mask adheres to the substrate during the patterning process Thin film deposition apparatus for manufacturing an OLED comprising a unit. The method of claim 1,
The optional magnetic force addition unit,
Magnet arrays; And
And a magnet array driver for relatively moving the magnet array with respect to the substrate support plate. The method of claim 2,
The magnet array,
Array frames; And
Thin film deposition apparatus for manufacturing an OLED comprising a plurality of neodymium (Nd) magnets arranged in the same pole in the array frame. The method of claim 3,
The array frame is a thin film deposition apparatus for manufacturing an OLED, characterized in that a plurality of receiving grooves are formed to be removably coupled to the neodymium (Nd) magnet. The method of claim 2,
The magnet array,
Array frames; And
Thin film deposition apparatus for manufacturing an OLED comprising a rubber (rubber) magnet is fixed on the array frame in the form of a plurality of stripes having a predetermined length. The method of claim 5,
The optional magnetic force addition unit,
A cover coupled to the magnet array to cover the plurality of rubber magnets to prevent generation of out gas; And
The thin film deposition apparatus for manufacturing an OLED, further comprising an O-ring interposed between the cover and the magnet array. The method of claim 1,
The substrate supporting plate is a thin film deposition apparatus for manufacturing an OLED, characterized in that the cooling plate (cooling plate). The method of claim 1,
The selective magnetic force adding unit is a thin film deposition apparatus for manufacturing an OLED, characterized in that the electromagnet. The method of claim 2,
And a substrate holding alignment unit for aligning the substrate with respect to the mask in a state in which the substrate is held in parallel with the mask. 10. The method of claim 9,
The substrate holding alignment unit,
A unit body to which the substrate supporting plate is coupled to be relatively movable;
A substrate holding part for holding the substrate in contact with the substrate supporting plate at a corresponding position; And
And a substrate aligner connected to the unit body to align the substrate with respect to the mask. The method of claim 10,
The substrate aligner further comprises a vision unit for photographing the alignment mark (align mark) of the mask. The method of claim 10,
And the magnet array driver is driven independently of the unit body. The method of claim 1,
The substrate supporting plate is a thin film deposition apparatus for manufacturing an OLED, characterized in that disposed along the direction crossing the bottom surface of the chamber. The method of claim 1,
The thin film deposition apparatus of claim 1, further comprising an alignment reference unit disposed in the chamber along a direction crossing the bottom surface of the chamber to form an alignment reference of the mask. The method of claim 14,
The alignment reference unit is a thin film deposition apparatus for manufacturing an OLED, characterized in that the alignment reference plate of the plate type (plate type) which forms an alignment reference of the mask, but is partially coupled to one side of the inner wall surface of the chamber. The method of claim 14,
A mask chucking unit provided at a position adjacent to the alignment reference unit to chuck the mask disposed in contact with the alignment reference unit at a corresponding position;
A mask driver connected to the mask to drive the mask toward the alignment reference part;
A tray transfer unit for transferring the tray supporting the substrate; And
And a source disposed on one side of the mask to provide a predetermined deposition material to the substrate through the mask.

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