KR20100131756A - Printed Circuit Board for LED and Manufacturing Method - Google Patents

Abstract

The present invention relates to a printed circuit board for LED and a method for manufacturing the same, the printed circuit board for LED of the present invention, the first metal layer for dissipating heat generated from the LED chip; An insulation layer provided on the first metal layer; A second metal layer provided on the insulating layer and having a groove protecting a wire for electrically connecting the LED chip and the circuit; And a cavity penetrating from a lower surface of the groove to a lower surface of the insulating layer, wherein the cavity has a diameter smaller than that of the groove, and the cavity is formed to be stepped with the groove. Accordingly, to improve the manufacturing process efficiency of the printed circuit board for LED, to disclose a technology that can provide an LED package excellent in heat dissipation characteristics and light extraction efficiency.

Description

Printed circuit board for light emitting diode and manufacturing method

The present invention relates to a printed circuit board for mounting the LED chip and a method of manufacturing the same.

In general, in order to mount an LED chip on a printed circuit board (PCB) consisting of a wiring layer, an insulating layer, and a heat dissipating layer, the LED chip is manufactured as an LED package, and each LED package is separately mounted on the printed circuit board. The LED package is mounted on the surface (wiring layer) of a printed circuit board using a process). However, when the LED package is mounted on the printed circuit board using the SMT process, the heat dissipation efficiency decreases because heat generated from the LED chip passes through various thermal resistances in the process of being transferred to the lower heat dissipation layer of the printed circuit board. There is this.

On the other hand, as a method for solving the above problems has been proposed a COB (chip on board) structure for mounting the LED chip close to the lower heat dissipation layer. In the COB structure, the LED chip is mounted on the insulating layer of the printed circuit board. Since the heat resistance element is reduced while heat generated from the LED chip is transferred to the lower heat dissipation layer, the heat dissipation efficiency can be increased. However, since the LED chip is mounted on the insulating layer, the COB structure also has a heat resistance element remaining due to the insulating layer, so that the heat dissipation efficiency is low, and the light extraction efficiency is also low because no reflective surface is provided to increase the light extraction efficiency. There is a problem.

Therefore, in order to solve the problems in the COB structure, various techniques for minimizing the heat resistance element, specifically, mounting the LED chip on the lower heat dissipation layer of the printed circuit board, have been proposed. Publication 10-2008-0014808 (hereinafter referred to as "advanced technology").

As shown in FIG. 1, the insulating layer 11 having the LED attachment hole 14 formed thereon is bonded to the flat surface of the heat dissipation unit 10, and the wiring having the wiring pattern on the insulating layer 11. The LED board | substrate using the board | substrate for LEDs and the said board | substrate for which the part 12 was formed is related. Here, the resin sheet 16 of the LED substrate has a diameter larger than that of the LED attachment hole 14 so that an aluminum ring 18 to serve as a reflector is inserted therein, and the diameter increases toward the opening side. 17) is insulated.

Since the LED substrate is mounted directly on the heat dissipation unit 10, the heat dissipation efficiency is good, and since the aluminum ring 18 serving as the reflector is provided, the light efficiency is also excellent.

However, the prior art as described above has the following problems.

Since the heat press process is performed several times in order to join together the heat radiating part 10, the wiring board 15, and the resin sheet 16, process efficiency falls. That is, a heat press process is performed to join the heat dissipation unit 10 and the wiring board 15, and a heat press process is also performed to join the resin sheet 16 to the wiring board 15, which makes the process complicated and inefficient. will be.

In addition, a separate aluminum ring 18 must be prepared to serve as a reflector, and the process of inserting the prepared aluminum ring 18 into the conical hole 17 of the resin sheet 16 is added. The efficiency is even worse. Here, although it is disclosed that a conical reflective member 35 (see FIG. 3A of the prior art) can be used without the resin sheet 16 and the aluminum ring 18, the conical reflective member 35 is used. Since a separate structure and process for protecting the bonding wire 21 are required, the process efficiency is also lowered at this time.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a printed circuit board for LEDs and a method of manufacturing the same, which improve heat dissipation characteristics and light extraction efficiency without complicated manufacturing processes.

The present invention to achieve the above object, the first metal layer for dissipating heat generated from the LED chip; An insulation layer provided on the first metal layer; A second metal layer provided on the insulating layer and having a groove protecting a wire for electrically connecting the LED chip and the circuit; And a cavity penetrating from a lower surface of the groove to a lower surface of the insulating layer, wherein the cavity has a diameter smaller than that of the groove, and the cavity provides a printed circuit board for stepping with the groove. For reference, the cavity may be provided in the form of a hole penetrating from the lower surface of the groove to the lower surface of the insulating layer.

Here, the groove is characterized in that it has a height for receiving the wire.

In addition, the cavity is characterized in that the diameter is smaller toward the lower surface of the insulating layer is inclined to the first metal layer.

In addition, the cavity, characterized in that the reflective surface plated with a metal material that reflects the light of the LED chip is provided.

At this time, the reflective surface is characterized in that the cross section is provided in any one form of straight, concave round and convex round. For reference, the cross section of the reflective surface refers to a surface viewed from the front when the printed circuit board for the LED is cut perpendicularly to the ground.

Here, when the reflective surface is provided in the cavity, the land portion for increasing the plating adhesion of the cavity and the metal material is further provided on the stepped surface of the groove when the circuit pattern is formed on the second metal layer.

In addition, the printed circuit board for LED of the present invention is characterized in that the through-hole further penetrating the first metal layer, the insulating layer and the second metal layer.

Here, the through hole is characterized in that the plated or filled with a metal material that radiates heat.

In addition, the thickness of each of the first metal layer and the second metal layer is characterized in that 0.06 ~ 2mm.

In addition, the thickness of the insulating layer is characterized in that 0.1 ~ 1.5mm.

On the other hand, the present invention to achieve the above object, a) preparing a substrate laminated with a first metal layer, an insulating layer, a second metal layer; b) forming a groove in the second metal layer to protect a wire electrically connecting the LED chip and the circuit; c) forming a cavity having a diameter smaller than that of the groove from the lower surface of the groove to the lower surface of the insulating layer; And d) provides a method of manufacturing a printed circuit board for LED comprising the step of forming a circuit pattern on the second metal layer.

Here, in the step b) is characterized in that the groove is formed to have a height for receiving the wire.

In addition, in the step c), the cavity is smaller in diameter toward the lower surface of the insulating layer, characterized in that formed to be inclined with the first metal layer.

In addition, the step c) further comprises the step of providing a reflective surface reflecting light of the LED chip by plating the cavity with a metal material.

In this case, when the reflective surface is provided in the cavity in step c), when the circuit pattern is formed in the second metal layer in step d), a land is formed on the step surface of the groove to increase the plating adhesion between the cavity and the metal material. Providing a wealth; characterized in that it further comprises.

In addition, the method of manufacturing a printed circuit board for LEDs of the present invention may further include forming through holes penetrating the first metal layer, the insulating layer, and the second metal layer between the steps c) and d). It is characterized by including.

In the step d), when the circuit pattern is formed on the second metal layer, the metal other than the circuit pattern is left without being removed.

On the other hand, the present invention is a printed circuit board for LED having the above characteristics; And an LED chip electrically connected to the LED printed circuit board.

The printed circuit board for LED and its manufacturing method according to the present invention has at least the following effects.

First, since a substrate stacked with a first metal layer, an insulating layer, and a second metal layer is used, a conventional heat press process is not required. Since a reflective surface is formed only by plating a metal material on the cavity, a reflective surface is formed. There is no need for a separate structure and process to improve the efficiency of the overall manufacturing process.

Second, since the through-hole not only the first metal layer but also the second metal layer can serve as a heat dissipation layer, heat dissipation characteristics can be improved.

Third, since the LED chip is directly mounted on the first metal layer that performs the heat dissipation role, the heat dissipation characteristics can be improved without considering the heat resistance element by the insulating layer, and thus an insulating layer having various materials and thicknesses can be used.

Hereinafter, a printed circuit board for LED and a method of manufacturing the same according to the present invention as described above will be described in detail with reference to the drawings and embodiments.

2 and 3 are cross-sectional views of the printed circuit board for LEDs according to the embodiment of the present invention before the circuit pattern is formed (including the LED chip and wire to help understand the description).

Referring to FIG. 2, the printed circuit board for LED of the present invention (hereinafter, referred to as a substrate) includes a first metal layer 100, an insulating layer 200, a second metal layer 300, and a cavity 400. do.

The first metal layer 100 serves as a heat dissipation layer for dissipating heat generated from the LED chip. The material to be used is not particularly limited and can be used as long as it has excellent electrical and heat transfer characteristics. Examples of the material to be used include copper (Cu), aluminum (Al), a steel sheet, or a plated steel sheet. Here, if the first metal layer 100 is too thin, the heat dissipation property is inferior. On the contrary, if the first metal layer 100 is too thick, the manufacturing cost increases with respect to the heat dissipation property.

The insulating layer 200 is provided on the first metal layer 100 to insulate the first metal layer 100 and the second metal layer 300. Examples of the material used include resins, ceramics, polyimide (PI), composite materials, and the like, and among them, glass epoxy sheets impregnated with epoxy resins are preferably used. This is because the glass epoxy sheet is excellent in electrical and mechanical properties and at the same time flexible, so that no cracking occurs during formation of the cavity 400 to be described later, thereby easily forming the cavity 400. If the insulation layer 200 is too thin, the electrical insulation effect may be reduced and substrate warpage may occur. On the contrary, if the insulation layer 200 is too thick, the LED chip is deeply buried (because the depth of the cavity 400 is deep), and thus wire bonding is performed. Since it becomes difficult, it is preferable to provide in thickness of 0.1-1.5 mm.

The second metal layer 300 serves as a wiring layer by forming a circuit pattern, and a groove 310 for protecting a wire electrically connecting the LED chip mounted on the printed circuit board and the circuit is formed. . That is, the lower surface of the groove 310 formed on the second metal layer 300 (a later stepped surface) serves as a pad to which wires are bonded. Thus, the pad is the upper surface of the second metal layer 300. If not present in the inside (where the wire is bonded to be present inside) it is possible to stably protect the portion (P) to which the wire is bonded from the outside. In addition, the outer wall of the groove 310 serves as a dam during resin sealing in the future to protect the wire by simply sealing the groove 310 with resin without a separate structure for protecting the wire. As a result, the process efficiency of the substrate manufacturing can be improved.

Here, the groove 310 is preferably formed to have a height (H) for completely receiving a wire (wire). That is, the height H of the groove 310 is spaced apart from the bottom surface of the groove 310 so as to more stably protect the bonded wire before the groove 310 is sealed with the resin. It is provided to be larger than the longest distance (D _max ).

The second metal layer 300 may be used without particular limitation as long as it is a material having excellent electrical and heat transfer characteristics, such as the first metal layer 100. Non-limiting examples include copper (Cu) and aluminum (Al). And steel sheets or plated steel sheets. At this time, if the second metal layer 300 is too thin or too thick, the heat dissipation effect is reduced and the circuit pattern work becomes difficult, so it is preferable to provide a thickness between 0.06 and 2 mm.

The cavity 400 is formed to provide a reflecting surface reflecting light of the LED chip and a space in which the LED chip is mounted, and is formed from the lower surface of the groove 310 formed in the second metal layer 300. It is formed to penetrate to the lower surface. At this time, the cavity 400 is adjusted to have a diameter smaller than the diameter of the groove 310 and is formed stepped with the groove 310. Here, the “step difference” means that a stepped structure is formed between the groove 310 and the cavity 400 because the diameter of the lower surface of the groove 310 formed in the second metal layer 300 is larger than the diameter of the cavity 400. . In addition, a portion remaining without the cavity 400 formed in the lower surface of the groove 310 is defined as a stepped surface B. FIG.

Here, when the groove 310 and the cavity 400 are formed on the substrate on which the first metal layer 100, the insulating layer 200, and the second metal layer 300 are stacked, a space for mounting the LED chip is provided. In this case, the cavity 400 may be plated with a metal material to increase the extraction efficiency of light emitted from the mounted LED chip. That is, the cavity 400 is provided with a reflective surface R on which an inner wall surface is plated with a metal material and reflects light of the LED chip. Here, the metal material to be plated is not particularly limited, but copper (Cu) may be used as a non-limiting example. In addition, in order to improve the reflectivity of the reflective surface R, aluminum (Al), gold (Au), silver (Ag) may be additionally plated on the reflective surface R on which a metal material is plated.

In order to further improve the reflectivity of the reflective surface R provided in the cavity 400, the cavity 400 is formed to be inclined with the first metal layer 100 by decreasing in diameter toward the lower portion of the insulating layer 200. It is preferable to be. When the cavity 400 is formed to have a constant diameter (the cylinder 400 having a cylindrical shape), the reflected light may move around only in the cavity 400 without being smoothly emitted to the outside. In addition, when bonding the LED chip and the wire (wire), the wire (wire) may reach the inlet side of the cavity 400 may cause interference. Accordingly, the cavity 400 is formed to form an inclination angle α with the first metal layer 100 in order to smoothly emit reflected light to the outside and minimize interference with the bonded wire (inverted truncated cone shape). Cavity 400 is formed). Here, the inclination angle α formed by the cavity 400 and the first metal layer 100 may be provided in a range of 15 ° 15α∠90 °.

In addition, even if the cavity 400 is not formed to be inclined, the reflecting surface R to be plated may be inclined to improve the reflectivity. That is, the cavity 400 may not be inclined with the first metal layer 100 but may be plated so that the reflective surface R is inclined with the first metal layer 100. Here, the plated reflective surface (R) may be provided in any one form of a straight line (or diagonal), concave round and convex round. Of course, as the cross section of the cavity 400 is formed in any one of a straight line, a concave round, and a convex round, and the reflecting surface R is plated, the cross section of the reflecting surface R may exhibit the above-described form.

Meanwhile, when forming a circuit pattern on the second metal layer 300, a land portion may be further provided on the second metal layer 300 in preparation for the case where the adhesion strength between the cavity 400 and the metal material to be plated falls. . This will be described with reference to FIGS. 4A and 4B as follows.

The circuit pattern forms a path through which a current flows. When the circuit pattern is formed on the stepped surface B of the groove 310 formed in the second metal layer 300, the second metal layer 300 except for the circuit pattern is mostly formed. Will be removed. That is, as shown in FIG. 4A, the second metal layer 300 is removed except for the circuit portion P ′ on which the wire is bonded to the stepped surface B. FIG. However, when the adhesion strength between the cavity 400 and the metal material drops, when the metal material portion (A, FIG. 4B) plated on the second metal layer 300 is removed, the metal material may fall off without maintaining the plated state. have. Therefore, when the circuit pattern is formed on the stepped surface B of the groove 310 formed in the second metal layer 300, the land portion L may be provided to increase the plating adhesion between the cavity 400 and the metal material. The part A on which the metal material is plated is left.

In addition, the substrate may further include a through hole 500 penetrating the first metal layer 100, the insulating layer 200, and the second metal layer 300 in order to increase heat dissipation characteristics. That is, the through hole 500 may serve as a thermal via to transfer heat existing in the first metal layer 100 to the second metal layer 300, thereby improving heat dissipation characteristics of the substrate. The through hole 500 may be formed in plural, and may be plated or filled together when the cavity 400 is plated with a metal material. That is, as shown in FIG. 2, the through hole 500 is plated with a metal material or filled with a metal material as shown in FIG. 3. Here, the metal material used may be any one as long as it dissipates heat, but copper (Cu) may be used as a non-limiting example. When the through hole 500 is plated or filled with a metal material that dissipates heat as described above, the heat of the first metal layer 100 is effectively transferred to the second metal layer 300 (the insulating layer 200 is plated with a metal material). The heat dissipation characteristics can be increased.

A method of manufacturing a substrate including the first metal layer 100, the insulating layer 200, and the second metal layer 300 described above will be described in detail with reference to FIGS. 5 and 6.

1.Substrate Preparation Step <S101>

A substrate stacked in the order of the first metal layer 100, the insulating layer 200, and the second metal layer 300 is prepared. At this time, the substrate is made of a substrate (for example, CCL core substrate) that is already made, and thus does not require a separate process (for example, the process of hot pressing and bonding each layer) for manufacturing the substrate. As a result, process efficiency can be improved.

2. Groove formation step <S102>

A groove 310 is formed in the second metal layer 300 to protect a wire for electrically connecting the LED chip and the circuit. The method of forming the groove 310 is not particularly limited, but may be formed by using, for example, a half etching of a metal, a routing drill, or the like. Here, in order to more stably protect the bonded wires before the grooves 310 are sealed with the resin, the grooves 310 may be formed to have a height that can fully accommodate the wires.

As such, since a structure for protecting the wire is provided only by forming the groove 310 in the second metal layer 300, a separate structure and an additional process for protecting the wire are not required on the substrate. It is possible to improve the overall substrate manufacturing process efficiency. That is, in the related art, an additional process of preparing a separate structure (for example, a resin sheet of the prior art) in order to protect the wire bonded to the upper surface of the second metal layer 300 (for example, the heat of the prior art) Press process), but the present invention does not require an additional process to protect the wire (wire), it is possible to improve the process efficiency.

3. Cavity forming step <S103>

A cavity 400 penetrating from the lower surface of the groove 310 of the second metal layer 300 to the lower surface of the insulating layer 200 is formed. In this case, the cavity 400 has a diameter smaller than the diameter of the groove 310 so as to be provided with a circuit portion to which the wire is bonded to the bottom surface of the groove 310 to be stepped with the groove 310. In addition, the cavity 400 may be formed to be inclined with the first metal layer 100 in order to increase the reflectance of the light reflected from the LED chip. Here, the method of forming the cavity 400 to form an inclination with the first metal layer 100 is not particularly limited, but the non-limiting example may be formed by using a drill bit having a flat bottom surface and an inclined side surface. For reference, when the cavity 400 is formed by using the drill bit, the cavity 400 penetrates only to the insulating layer 200 and the first metal layer 100 is not damaged.

On the other hand, after forming the cavity 400 on the substrate may further comprise the step of providing a reflective surface (R) by plating the inner wall surface of the metal chip with a metallic material in order to increase the light extraction efficiency of the mounted LED chip. In this case, the portion to be plated may be plated not only to the inner wall surface of the cavity 400 but also to the portion P _R of the first metal layer 100 on which the LED chip is mounted. Electroless plating or electroplating (electroplating) may be applied as a method of plating the metal material. The metal material to be plated is not particularly limited, but copper (Cu) may be used as a non-limiting example. In addition, in order to improve the reflectivity of the reflecting surface R, aluminum (Al), gold (Au), silver (Ag) may be additionally plated on the reflecting surface (R) plated with a metal material.

Here, when the through hole 500 is formed, the through hole 500 may also be plated or filled with a metal material when the cavity 400 is plated. That is, the substrate may further include forming a through hole 500 penetrating the first metal layer 100, the insulating layer 200, and the second metal layer 300. In this case, the through hole 500 is also plated with a metal material or filled with a metal material. As such, when the through hole 500 is formed in the substrate and the inside of the substrate is plated or filled with a metal material, the heat of the first metal layer 100 is transferred to the second metal layer 300, thereby further increasing heat dissipation efficiency. For reference, the through hole 500 may be formed using a conventional drill method, and a plurality of through holes 500 may be formed to increase heat transfer efficiency.

4. Circuit pattern forming step <S104>

The second metal layer 300 is etched to form a circuit pattern. In general, all metal layers are removed to expose the insulating layer except for the path (wiring) through which the current flows. In the present invention, a through hole penetrating the first metal layer 100 and the second metal layer 300 is formed. When forming the 500, the second metal layer 300 except for the circuit pattern 300a (see FIG. 6) is left without being removed so that the second metal layer 300 may also serve as a heat dissipation layer. As described above, the substrate according to the present invention may further improve heat dissipation efficiency since the circuit pattern is formed so that not only the first metal layer 100 but also the second metal layer 300 may serve as a heat dissipation layer.

On the other hand, in the plating of the metal material to provide the reflective surface (R) in the cavity 400, when the metal material to be plated does not exhibit sufficient plating adhesion with the cavity 400, plating of the cavity 400 and the metal material In order to increase the adhesive force, the method may further include providing a land portion L (see FIG. 6) on the stepped surface B of the groove 310. That is, the land portion L is provided by blocking the portion of the metal material plated on the second metal layer 300 from being etched by using a mask when forming the circuit pattern on the second metal layer 300.

In the present invention, it is possible to provide an LED package in which an LED chip is mounted on the above-described substrate, which will be described below with reference to FIGS. 7A and 7B.

7A and 7B are cross-sectional views of an LED package according to an embodiment of the present invention. The LED package of the present invention includes a substrate 600 and an LED chip 700.

Since the description of the substrate 600 is the same as described above, a description thereof will be omitted.

The LED chip 700 is mounted on the first metal layer 100 of the substrate 600, and may be used without being limited to a type as long as the LED chip 700 has a thickness smaller than the thickness of the insulating layer 200. The LED chip is electrically connected to the substrate 600 by wire bonding. Here, after wire-bonding the LED chip 700 and the substrate 600, the grooves 310 and the cavity 400 are sealed with a resin to protect the LED chip 700 and the wires. It may be in the form of a dome so as to perform a plane or lens role. For reference, resins may be mixed with phosphors so that the LED chip may display light of various colors.

When the LED package described above cannot implement high output with only one LED chip 700, a plurality of LED chips 700 are provided in the LED chip 700 mounting space provided by one cavity 400 as shown in FIG. 8A. 8B and 8C, a plurality of cavities 400 may be formed, and an LED chip 700 may be mounted on each of them to implement a high power LED package.

Hereinafter, to simulate the LED package with a substrate according to an embodiment of the present invention, the test results will be described.

* LED package simulation

[Simulation 1]

60 × 60 mm sized substrates stacked in the order of the lower copper foil layer (first metal layer), which is provided in the range of 0.05 to 1 mm, FR4 (epoxy glass: insulation layer) of 1 mm, and upper copper foil layer (second metal layer) of 0.2 mm It was simulated by. As shown in FIG. 9, the LED package was constructed by mounting a 3 × 3 array of LED chips on the lower copper layer on the simulated substrate as shown in FIG. 9. At this time, the size of the LED chip was 0.5 × 0.5 × 0.2 mm, the power of the LED chip was 0.1W.

[Simulation 2]

The LED package was constructed under the same conditions as in Simulation 1, except that the LED package was formed in a structure in which the LED chip was mounted on the insulating layer.

* Test

The LED package simulated in Simulation 1 and Simulation 2 was simulated using the FEMLAB program of COMSOL, and the temperature change according to the thickness of the lower copper layer of the LED package was measured and shown in FIG. 10. Referring to FIG. 10, it can be seen that the maximum temperature decreases as the thickness of the lower copper foil layer increases. In particular, when the thickness of the lower copper foil layer was 0.4 mm, the LED package of the simulation 1 in which the LED chip was mounted on the lower copper foil layer showed a temperature of 52 ° C., but the LED package of the simulation 2 in which the LED chip was mounted on the insulating layer. It can be seen that the temperature rises to 173 ° C. The simulation result shows that the heat dissipation characteristics of the LED package proposed by the present invention are excellent.

As described above, the detailed description of the present invention has been made by the accompanying drawings and the embodiment, but the above-described embodiment has only been described with reference to a preferred example of the present invention, the present invention is limited to the above embodiment only It should not be understood that the scope of the present invention is to be understood by the claims and equivalent concepts described below.

1 is a cross-sectional view for explaining the prior art.

2 and 3 are cross-sectional views of a printed circuit board for LEDs according to an embodiment of the present invention.

4A and 4B are reference diagrams for explaining a printed circuit board for LEDs according to an exemplary embodiment of the present invention.

5 and 6 are reference diagrams for explaining a method of manufacturing a printed circuit board for LEDs according to an embodiment of the present invention.

7A, 7B, 8A, 8B, and 8C are cross-sectional views of LED packages according to embodiments of the present invention.

9 is a reference diagram showing a simulated structure of the LED package according to an embodiment of the present invention.

10 is a graph showing the heat radiation characteristics test results of the LED package according to the embodiment of the present invention.

* Description of the major symbols in the drawings *

100: first metal layer

200: insulation layer

300: second metal layer

400: Cavity

500: through hole

Claims (18)

A first metal layer that radiates heat generated from the LED chip; An insulation layer provided on the first metal layer; A second metal layer provided on the insulating layer and having a groove protecting a wire for electrically connecting the LED chip and the circuit; And And a cavity penetrating from a lower surface of the groove to a lower surface of the insulating layer. The cavity of the LED is printed circuit board, characterized in that the cavity is smaller than the diameter of the groove is formed stepped with the groove. The method of claim 1, The groove is a printed circuit board for the LED, characterized in that having a height for receiving the wire. The method of claim 1, The cavity is smaller in diameter toward the lower surface of the insulating layer, the printed circuit board for the LED, characterized in that inclined to the first metal layer. The method of claim 1, The cavity, the printed circuit board for the LED, characterized in that the reflection surface plated with a metal material reflecting the light of the LED chip is provided. The method of claim 4, wherein The reflective surface is a printed circuit board for LED, characterized in that the cross section is provided in any one form of straight, concave round and convex round. The method of claim 4, wherein When the circuit pattern is formed on the second metal layer, the printed circuit board for LEDs, characterized in that the land portion to increase the plating adhesion of the cavity and the metal material is further provided on the stepped surface of the groove. The method of claim 1, The printed circuit board for the LED, characterized in that the through-hole further penetrating the first metal layer, the insulating layer and the second metal layer. The method of claim 7, wherein The through hole is a printed circuit board for LED, characterized in that the plated or filled with a metal material that radiates heat. The method of claim 1, The printed circuit board for the LED, characterized in that the thickness of each of the first metal layer and the second metal layer is 0.06 ~ 2㎜. The method of claim 1, The printed circuit board for the LED, characterized in that the thickness of the insulating layer is 0.1 ~ 1.5㎜. a) preparing a substrate stacked with a first metal layer, an insulating layer, and a second metal layer; b) forming a groove in the second metal layer to protect a wire electrically connecting the LED chip and the circuit; c) forming a cavity having a diameter smaller than that of the groove from the lower surface of the groove to the lower surface of the insulating layer; And d) forming a circuit pattern on the second metal layer. The method of claim 11, In the step b), the groove is a manufacturing method of a printed circuit board for LED, characterized in that formed to have a height for receiving the wire. The method of claim 11, The method of claim c) wherein the cavity is smaller in diameter toward the lower surface of the insulating layer is formed to be inclined with the first metal layer. The method of claim 11, The c) step further comprises the step of providing a reflective surface reflecting the light of the LED chip by plating the cavity with a metal material. The method of claim 14, When the circuit pattern is formed in the second metal layer in step d) to provide a land portion on the step surface of the groove to increase the plating adhesion of the cavity and the metal material; LED printed circuit further comprising Method of manufacturing a substrate. The method of claim 11, Forming a through-hole penetrating the first metal layer, the insulating layer and the second metal layer between the step c) and the step d) further comprising a method for manufacturing a printed circuit board for LEDs. . The method according to claim 11 or 16, The method of manufacturing a printed circuit board for LEDs, wherein, in the step d), when the circuit pattern is formed on the second metal layer, metals other than the circuit pattern are not removed. A printed circuit board for LED according to any one of claims 1 to 10; And LED package comprising an LED chip electrically connected to the LED printed circuit board.

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