KR20100071871A - Optically anisotropic compound and resin composition and optical member comprising the same - Google Patents
Optically anisotropic compound and resin composition and optical member comprising the same Download PDFInfo
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- KR20100071871A KR20100071871A KR1020080130730A KR20080130730A KR20100071871A KR 20100071871 A KR20100071871 A KR 20100071871A KR 1020080130730 A KR1020080130730 A KR 1020080130730A KR 20080130730 A KR20080130730 A KR 20080130730A KR 20100071871 A KR20100071871 A KR 20100071871A
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- South Korea
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- chch
- halogen substituted
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- 150000001875 compounds Chemical class 0.000 title claims abstract description 53
- 230000003287 optical effect Effects 0.000 title claims abstract description 36
- 239000011342 resin composition Substances 0.000 title claims abstract description 31
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- 229920003002 synthetic resin Polymers 0.000 claims abstract description 37
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 22
- 229910052736 halogen Inorganic materials 0.000 claims description 19
- 125000005843 halogen group Chemical group 0.000 claims description 18
- 125000003342 alkenyl group Chemical group 0.000 claims description 17
- 125000000217 alkyl group Chemical group 0.000 claims description 17
- 125000000304 alkynyl group Chemical group 0.000 claims description 17
- 101150065749 Churc1 gene Proteins 0.000 claims description 14
- 102100038239 Protein Churchill Human genes 0.000 claims description 14
- 125000002947 alkylene group Chemical group 0.000 claims description 14
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- -1 polyethylene terephthalate Polymers 0.000 claims description 10
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 9
- GVNVAWHJIKLAGL-UHFFFAOYSA-N 2-(cyclohexen-1-yl)cyclohexan-1-one Chemical compound O=C1CCCCC1C1=CCCCC1 GVNVAWHJIKLAGL-UHFFFAOYSA-N 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
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- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 claims description 6
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- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 125000001424 substituent group Chemical group 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 125000004991 fluoroalkenyl group Chemical group 0.000 claims description 3
- 125000003709 fluoroalkyl group Chemical group 0.000 claims description 3
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- 229920006389 polyphenyl polymer Polymers 0.000 claims 1
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 18
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- 239000010410 layer Substances 0.000 description 13
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- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 12
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical group C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 4
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- LXCFILQKKLGQFO-UHFFFAOYSA-N methylparaben Chemical compound COC(=O)C1=CC=C(O)C=C1 LXCFILQKKLGQFO-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
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- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229940125782 compound 2 Drugs 0.000 description 3
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- 125000001153 fluoro group Chemical group F* 0.000 description 3
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- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 2
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- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
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- 230000000704 physical effect Effects 0.000 description 2
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- BCNZYOJHNLTNEZ-UHFFFAOYSA-N tert-butyldimethylsilyl chloride Chemical compound CC(C)(C)[Si](C)(C)Cl BCNZYOJHNLTNEZ-UHFFFAOYSA-N 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
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- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
- C07F7/081—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Abstract
본 발명은 고분자 수지의 광학 이방성을 부여하기 위하여 사용되는 광학 이방성 화합물 및 이를 포함하는 수지 조성물 및 광학 부재에 관한 것으로, 본 발명에 따른 광학 이방성의 화합물을 고분자 수지에 첨가하여 사용할 경우, 고분자 수지의 변형에 의한 광학 이방성의 발현이 크고 고분자 수지와의 상용성이 우수하여 고분자 수지의 광학 특성 제어에 용이하다.The present invention relates to an optically anisotropic compound used to impart optical anisotropy of a polymer resin, a resin composition comprising the same, and an optical member. When the optically anisotropic compound according to the present invention is used in addition to a polymer resin, It is easy to control the optical properties of the polymer resin because of its high expression of optical anisotropy due to deformation and excellent compatibility with the polymer resin.
Description
본 발명은 고분자 수지의 광학 이방성을 부여하기 위하여 사용되는 광학 이방성 화합물, 및 이를 포함하는 수지 조성물 및 광학 부재에 관한 것이다.The present invention relates to an optically anisotropic compound used for imparting optical anisotropy of a polymer resin, and a resin composition and an optical member comprising the same.
최근 전자 산업의 발달로 광학용 고분자 수지의 사용이 급증하고 있는 추세이다. 예를 들면 저장 매체로 사용되는 광디스크 기판, 광학용 렌즈, 광통신에 사용되는 광화이버, 프로젝션 스크린용 프레넬 렌즈 및 액정 디스플레이에 사용되는 프리즘시트, 편광판 보호필름, 보상필름 등 여러 광학용 고분자에 대한 수요가 급증하고 있다. Recently, with the development of the electronics industry, the use of optical polymer resins is rapidly increasing. For example, optical disc substrates used as storage media, optical lenses, optical fibers used for optical communication, Fresnel lenses for projection screens, and prism sheets used for liquid crystal displays, polarizer protective films, compensation films, etc. Demand is surging.
이러한 광학용 고분자 수지들은 일반적으로 광학적으로 등방성을 요구하는 경우가 많으나, 고분자 수지 자체의 구조상 또는 가공 중 응력으로 인하여 최종 제품의 고분자 수지가 이방성을 가질 수 있다. 또한 광학 수지가 다층 구조에 삽입되어 있는 경우 각 층과의 열 팽창 수축 등으로 인하여 광학적으로 이방성을 가질 수 있다. 이러한 이방성을 가지는 필름, 렌즈 등이 광로 중에 존재한다면, 상의 성질 의 변화를 일으켜 신호 판독에 악영향을 줄 수 있어서 이방성을 가능한 작게 억제한 광학 수지로 구성되는 광학 부재의 사용이 바람직하다. Such optical polymer resins generally require optically isotropy, but due to the structural or processing stress of the polymer resin itself, the polymer resin of the final product may have anisotropy. In addition, when the optical resin is inserted into the multilayer structure, the optical resin may have optical anisotropy due to thermal expansion and contraction with each layer. If a film, lens or the like having such anisotropy exists in the optical path, it is preferable to use an optical member composed of an optical resin which can change the properties of the image and adversely affect the signal reading, thereby suppressing the anisotropy as small as possible.
반면에 인위적으로 광학적 복굴절성을 부여하는 경우도 있다. 예를 들면 특히 편광판이 점착제에 의해 고정되어 있는 경우에 고온, 고온고습 조건 하에서의 편광판 수축 또는 팽창에 의한 TAC(Triacetylcellulose)층에 응력이 집중, 복굴절이 발생되어 빛샘이 생기게 된다. On the other hand, it may artificially impart optical birefringence. For example, especially when the polarizing plate is fixed by an adhesive, stress is concentrated and birefringence is generated in the TAC (Triacetylcellulose) layer due to the contraction or expansion of the polarizing plate under high temperature and high temperature and high humidity conditions, resulting in light leakage.
빛샘을 억제하기 위해서는 편광판에 고정되어 있는 점착제의 응력 완화 특성이 매우 우수하여 잔류응력이 남아 있지 않도록 조절하면 가능하다. 이러한 경우, 사용되는 점착제가 미 가교구조인 경우에 달성 가능하다. In order to suppress light leakage, it is possible to adjust so that the residual stress remains because the stress relaxation property of the adhesive fixed to the polarizing plate is very excellent. In this case, this can be achieved when the pressure-sensitive adhesive used is an uncrosslinked structure.
그러나 점착제층은 내구 신뢰성을 유지하기 위해서 높은 고온 응집력을 필요로 하는데, 이를 위하여 부분 가교된 점탄성체(viscoelastic materal) 형태로 적합한 점착 특성을 나타내게 된다. 점착제층에 부분 가교구조의 도입은 주어진 응력 하에서 잔류응력을 가지게 되고 가교구조 내의 고분자가 특정 방향으로 배향되어 복굴절(Birefringence)을 나타내게 된다. 이러한 배향 하에서 아크릴계 점착제는 음수값의 복굴절을 나타내게 된다. However, the pressure-sensitive adhesive layer requires high high temperature cohesive force in order to maintain durability, and for this, it exhibits suitable adhesive properties in the form of a partially crosslinked viscoelastic material. The introduction of the partial crosslinked structure into the pressure-sensitive adhesive layer has residual stress under a given stress, and the polymer in the crosslinked structure is oriented in a specific direction to exhibit birefringence. Under this orientation, the acrylic pressure sensitive adhesive will exhibit negative birefringence.
한편, LCD 패널의 대형화에 따라 편광판도 대형화 되고, 이에 따라 내열, 내습열 조건에서 편광판의 수축도 커지고 점착제층의 잔류응력도 커지게 되어, 전체적으로 음수값의 복굴절이 크게 되어 빛샘 현상이 심하게 나타난다. On the other hand, as the LCD panel is enlarged, the polarizing plate is also enlarged. Accordingly, the shrinkage of the polarizing plate is increased and the residual stress of the pressure-sensitive adhesive layer is increased under heat and moisture resistant conditions, resulting in a large birefringence of negative values, resulting in severe light leakage.
따라서, 이러한 빛샘 현상을 최소화하기 위해서는 잔류응력에 의해 나타나는 점착제의 음수값의 복굴절을 양수값의 복굴절로 조절할 경우 편광판의 수축에 의해 나타나는 음수값의 복굴절을 광학적으로 보상을 해줌으로써 가능하다. 따라서 점착제를 이용하여 광학적으로 복굴절을 보상해 주기 위해서는 광학 이방성이 큰 화합물들을 사용하여 잔류응력 하에서 점착제가 양수값의 복굴절을 나타내게 하는 것이 중요하다. Accordingly, in order to minimize the light leakage phenomenon, it is possible to optically compensate for the birefringence of the negative value caused by the contraction of the polarizer when the birefringence of the negative value of the pressure-sensitive adhesive caused by the residual stress is adjusted to the positive birefringence. Therefore, in order to compensate the birefringence optically by using the pressure-sensitive adhesive, it is important that the pressure-sensitive adhesive exhibits a positive birefringence under residual stress using compounds having high optical anisotropy.
대한민국 공개특허 제2003-0069461호에서는 응력 하에서 양수값의 복굴절을 나타내는 저분자량체를 아크릴계 점착제층에 혼입하여 잔류응력 하에서 아크릴계 점착제층이 나타내는 음수값의 복굴절을 보정하는 기술적 사상이 공보되어 있다. 그러나 사용된 저분자량체가 점착제와의 상용성이 문제가 될 수 있어 과량을 사용하면 점착제와의 상분리 현상이 나타날 가능성이 크며, 따라서 광투과성이나 내구성에 문제가 될 가능성이 있다. 또한 단분자의 경우 고분자 수지의 배열에 따라 같이 배열되는 정도가 미미하여 이방성의 발현 정도가 미미할 수 있다.Korean Patent Laid-Open Publication No. 2003-0069461 discloses a technical idea of incorporating a low molecular weight material exhibiting positive birefringence under stress into an acrylic pressure sensitive adhesive layer to correct birefringence of negative value represented by an acrylic pressure sensitive adhesive layer under residual stress. However, the low molecular weight used may be a compatibility problem with the pressure-sensitive adhesive, and if an excessive amount is used, there is a high possibility of phase separation with the pressure-sensitive adhesive, which may cause a problem in light transmittance or durability. In addition, in the case of a single molecule, the degree of anisotropy may be insignificant because the degree of alignment is insignificant according to the arrangement of the polymer resin.
본 발명은 상기 문제점을 해결하기 위해, 광학 이방성이 크고, 적은 양의 사용으로도 효과적으로 고분자 수지의 광학 특성의 제어가 가능하고, 고분자 수지와의 상용성이 우수한 광학 이방성 화합물을 제공하고자 한다. In order to solve the above problems, the present invention is to provide an optically anisotropic compound having a large optical anisotropy, effective control of the optical properties of the polymer resin even with a small amount of use, and excellent compatibility with the polymer resin.
또한, 본 발명은 상기 광학 이방성 화합물 및 고분자 수지를 포함하는 수지 조성물 및 상기 수지 조성물을 사용한 광학 부재를 제공하고자 한다.In addition, the present invention is to provide a resin composition comprising the optically anisotropic compound and a polymer resin and an optical member using the resin composition.
본 발명은 하기 화학식 1로 표시되는 화합물을 제공한다. 하기 화학식 1로 표시되는 화합물은 광학 이방성 화합물이다.The present invention provides a compound represented by the following formula (1). The compound represented by the following formula (1) is an optically anisotropic compound.
[화학식 1][Formula 1]
M1-L-M2 M 1 -LM 2
화학식 1에서, L은 C2~C60의 알킬렌옥사이드, C2~C60의 알킬렌, 또는 C2~C60의 실록산이며;In formula 1, L is C 2 ~ C 60 Alkylene oxide, C 2 ~ C 60 Alkylene, or C 2 ~ C 60 siloxane;
M1 및 M2는 각각 독립적으로 하기 화학식 2로 표시되는 치환기이며;M 1 and M 2 are each independently a substituent represented by formula (2);
[화학식 2][Formula 2]
화학식 2에서, In Formula 2,
는 또는 이며; Is or Is;
는 또는 이며; Is or Is;
는 또는 이며; Is or Is;
R1 내지 R5 및 하기의 R6 내지 R8은 각각 독립적으로 -H, C1~C20의 알 킬(alkyl), C1~C20의 플루오르알킬(fluoroalkyl), C2~C20의 알케닐(alkenyl), C2~C20의 플루오르알케닐(fluoroalkenyl), C2~C20의 알키닐(alkynyl), C2~C20의 플루오르알키닐(fluoroalkynyl), -(CH2CH2O)oCH3, -(CH2CHCH3O)oCH3, 또는 -(CHCH3CH2O)oCH3이고, o는 1~5의 정수이며;R 1 to R 5 and the following R 6 to R 8 are each independently —H, C 1 to C 20 alkyl, C 1 to C 20 fluoroalkyl, C 2 to C 20 Alkenyl, C 2 ~ C 20 fluoroalkenyl, C 2 ~ C 20 alkynyl, C 2 ~ C 20 fluoroalkynyl,-(CH 2 CH 2 O) o CH 3 ,-(CH 2 CHCH 3 O) o CH 3 , or-(CHCH 3 CH 2 O) o CH 3 , o is an integer from 1 to 5;
X1 내지 X5는 각각 독립적으로 -SiW1W2-, -O-, -NR6-, -S-, -SO-, -SO2-, -(CH2)p-, -C(=O)NR6-, -NR6C(=O)-, -NR6C(=O)NR6-, -C(=O)-, -C(=O)O-, -OC(=O)-, 또는 -OC(=O)O-이고, p는 0~2의 정수이며;X 1 to X 5 are each independently —SiW 1 W 2 —, —O—, —NR 6 —, —S—, —SO—, —SO 2 —, — (CH 2 ) p —, —C (= O) NR 6- , -NR 6 C (= 0)-, -NR 6 C (= 0) NR 6- , -C (= 0)-, -C (= 0) O-, -OC (= 0) )-Or -OC (= 0) O- and p is an integer of 0 to 2;
W1은 -R7, -NHR7, 또는 -N(R7)2 이며;W 1 is -R 7 , -NHR 7 , or -N (R 7 ) 2 ;
W2는 -R8, -NHR8, 또는 -N(R8)2 이며;W 2 is -R 8 , -NHR 8 , or -N (R 8 ) 2 ;
Q1 내지 Q8은 각각 독립적으로 -H, -F, -Cl, -Br, -I, -CN, -CF3, -OCF3, -R6, -OR6, -NHR6, -NR6R6 또는 -C(=O)R6 이며;Q 1 to Q 8 are each independently -H, -F, -Cl, -Br, -I, -CN, -CF 3 , -OCF 3 , -R 6 , -OR 6 , -NHR 6 , -NR 6 R 6 or —C (═O) R 6 ;
Z는 C 또는 N 이며, 이때 Z가 N이면 해당되는 Q1 내지 Q8과의 결합은 존재하지 않으며;Z is C or N, wherein when Z is N, no bond with the corresponding Q 1 to Q 8 is present;
Y 및 G는 각각 독립적으로 -(CH2)rSiW1W2(CH2)s-, -O-, -NR6-, -S-, -SO-, -SO2-, -(CH2)q-, -CH=CH-, -C≡C-, -C(=O)O(CH2)q-, -OC(=O)(CH2)q-, -(CH2)qC(=O)O-, -(CH2)qOC(=O)-, -C(=O)-, -C(=O)NR6-, -NR6C(=O)-, -C(=O)S-, 또는 -SC(=O)-이고, q는 0~5의 정수이고, r 및 s는 각각 독립적으로 0 또는 1이며;Y and G are each independently — (CH 2 ) r SiW 1 W 2 (CH 2 ) s —, —O—, —NR 6 —, —S—, —SO—, —SO 2 —, — (CH 2) ) q- , -CH = CH-, -C≡C-, -C (= O) O (CH 2 ) q- , -OC (= O) (CH 2 ) q -,-(CH 2 ) q C (= O) O-,-(CH 2 ) q OC (= O)-, -C (= O)-, -C (= O) NR 6- , -NR 6 C (= O)-, -C (= O) S-, or -SC (= O)-, q is an integer from 0 to 5, and r and s are each independently 0 or 1;
l 및 m은 각각 독립적으로 0~2의 정수이고, l+m은 1~4의 정수이다.l and m are each independently an integer of 0-2, and l + m is an integer of 1-4.
또한 본 발명은 고분자 수지; 및 상기 화학식 1로 표시되는 화합물을 포함하는 수지 조성물을 제공한다.In addition, the present invention is a polymer resin; And it provides a resin composition comprising a compound represented by the formula (1).
또한 본 발명은 상기 수지 조성물로부터 제조되는 고분자 필름 또는 점착제를 포함하는 광학 부재를 제공한다.In another aspect, the present invention provides an optical member comprising a polymer film or pressure-sensitive adhesive prepared from the resin composition.
본 발명에 따른 화학식 1로 표시되는 광학 이방성의 화합물을 고분자 수지에 첨가하여 사용할 경우, 고분자 수지의 변형에 의한 광학 이방성의 발현이 크고, 고분자 수지와의 상용성이 우수하여 고분자 수지의 광학 특성 제어에 용이하다.When the optically anisotropic compound represented by the formula (1) according to the present invention is used in addition to the polymer resin, the optical anisotropy is largely expressed by the deformation of the polymer resin, and the compatibility with the polymer resin is excellent, thereby controlling the optical properties of the polymer resin. It is easy to
본 발명의 화학식 1로 표시되는 화합물은 다양한 고분자 수지와 쉽게 혼합되고, 고분자 수지의 변형에 대한 광학 특성의 제어가 우수하며, 또한 액정 표시 장치가 통상으로 사용되는 조건 하에서 물리적, 화학적으로 안정할 뿐 아니라 열, 빛에 안정하다.The compound represented by Formula 1 of the present invention is easily mixed with various polymer resins, and has excellent control of optical properties against deformation of the polymer resin, and is also physically and chemically stable under the conditions in which liquid crystal displays are commonly used. Not stable to heat and light.
따라서, 상기 화학식 1로 표시되는 화합물은 여러 다양한 고분자 수지와 혼합하여 고분자 수지의 광특성 제어에 사용될 수 있다.Therefore, the compound represented by Chemical Formula 1 may be used to control optical properties of the polymer resin by mixing with various various polymer resins.
본 발명의 화학식 1로 표시되는 화합물에서, L은 M1 및 M2을 연결하는 링커(linker)로서 C2~C60의 알킬렌옥사이드, C2~C60의 알킬렌, 또는 C2~C60의 실록산이다.In the compound represented by Formula 1 of the present invention, L is a linker (linker) connecting M 1 and M 2 C 2 ~ C 60 Alkylene oxide, C 2 ~ C 60 Alkylene, or C 2 ~ C 60 siloxanes.
상기 L에서 C2~C60의 알킬렌옥사이드는 하기 화학식 3으로 표시되는 알킬렌옥사이드가 바람직하며, C2~C60의 에틸렌옥사이드 또는 C3~C60의 프로필렌옥사이드가 보다 바람직하다.The alkylene oxide of C 2 ~ C 60 In L is preferably an alkylene oxide represented by the following formula (3), more preferably C 2 ~ C 60 ethylene oxide or C 3 ~ C 60 propylene oxide.
[화학식 3](3)
화학식 3에서, R9 및 R10은 각각 독립적으로 -H, C1~C20의 알킬, 할로겐 치환된 C1~C20의 알킬, C2~C20의 알케닐, 할로겐 치환된 C2~C20의 알케닐, C2~C20의 알키닐, 할로겐 치환된 C2~C20의 알키닐, -(CH2CH2O)uCH3, -(CH2CHCH3O)uCH3, 또는 -(CHCH3CH2O)uCH3이고, u는 1~5의 정수이며;In formula (3), R 9 and R 10 are each independently -H, C 1 ~ C 20 Alkyl, halogen substituted C 1 ~ C 20 Alkyl, C 2 ~ C 20 Alkenyl, halogen substituted C 2 ~ of C 20 alkenyl, C 2 ~ C 20 alkynyl, halogen substituted C 2 ~ C 20 of the alkynyl, - (CH 2 CH 2 O ) u CH 3, - (CH 2 CHCH 3 O) u CH 3 Or-(CHCH 3 CH 2 O) u CH 3 , u is an integer from 1 to 5;
t는 1~30의 정수이다.t is an integer of 1-30.
또한, 상기 L에서 C2~C60의 알킬렌은 C3~C60의 분지형 알킬렌이 바람직하다.In addition, the alkylene of C 2 ~ C 60 In L is preferably C 3 ~ C 60 Branched alkylene.
또한, 상기 L에서 C2~C60의 실록산은 하기 화학식 4로 표시되는 실록산이 바람직하고, 하기 화학식 4에서 v가 2~30의 정수인 실록산이 보다 바람직하다.In addition, the siloxane of the C 2 ~ C 60 in L is preferably a siloxane represented by the following formula (4), more preferably a siloxane in which v is an integer of 2 to 30 in the formula (4).
[화학식 4][Formula 4]
화학식 4에서, R11 및 R12는 각각 독립적으로 -H, C1~C20의 알킬, 할로겐 치환된 C1~C20의 알킬, C2~C20의 알케닐, 할로겐 치환된 C2~C20의 알케닐, C2~C20의 알키닐, 할로겐 치환된 C2~C20의 알키닐, -(CH2CH2O)wCH3, -(CH2CHCH3O)wCH3, 또는 -(CHCH3CH2O)wCH3이고, w는 1~5의 정수이며;In formula (4), R 11 and R 12 are each independently -H, C 1 ~ C 20 Alkyl, halogen substituted C 1 ~ C 20 Alkyl, C 2 ~ C 20 Alkenyl, halogen substituted C 2 ~ of C 20 alkenyl, C 2 ~ C 20 alkynyl, halogen substituted C 2 ~ C 20 of the alkynyl, - (CH 2 CH 2 O ) w CH 3, - (CH 2 CHCH 3 O) w CH 3 Or-(CHCH 3 CH 2 O) w CH 3 , w is an integer from 1 to 5;
v는 1~30의 정수이다.v is an integer of 1-30.
본 발명의 화학식 1로 표시되는 화합물에서, M1 및 M2는 상기 화학식 2로 표시되는 치환기로서 메소젠기이다. In the compound represented by the formula (1) of the present invention, M 1 and M 2 is a mesogen group as a substituent represented by the formula (2).
상기 화학식 2의 치환기는 아로마틱 링-단일결합-아로마틱 링, 아로마틱 링-이중결합-아로마틱 링, 아로마틱 링-삼중 결합-아로마틱 링, 아로마틱 링-단일결합-아로마틱 링-에스테르-아로마틱 링, 아로마틱 링-이중결합-아로마틱 링-에스테르-아로마틱 링, 또는 아로마틱 링-삼중 결합-아로마틱 링-에스테르-아로마틱 링 구조가 바람직하며, 더욱 바람직하기로는 아로마틱 링-단일결합-아로마틱 링, 또는 아로마틱 링-단일결합-아로마틱 링-에스테르-아로마틱 링 구조가 바람직하다.Substituents of Formula 2 are aromatic ring-single bond-aromatic ring, aromatic ring-double bond-aromatic ring, aromatic ring-triple bond-aromatic ring, aromatic ring-single bond-aromatic ring-ester-aromatic ring, aromatic ring- A double bond-aromatic ring-ester-aromatic ring, or aromatic ring-triple bond-aromatic ring-ester-aromatic ring structure is preferred, and more preferably aromatic ring-single bond-aromatic ring, or aromatic ring-single bond- Aromatic ring-ester-aromatic ring structures are preferred.
또한, 본 발명의 화학식 2에서, R1 내지 R8의 C1~C20의 알킬은 각각 독립적으 로 -CH3, -CH2CH3, -CH2CH2CH3, -CH(CH3)2, -CH2CH2CH2CH3, -CH(CH3)CH2CH3, 또는 -CH2CH(CH3)2 등의 선형 또는 가지형 알킬일 수 있으나, 이에 한정되는 것은 아니다. 또한, 화학식 2에서 R1 내지 R8의 플루오르알킬은 상기 정의하고 있는 알킬에 한 개 이상의 플루오르기가 수소 대신 치환된 것이다.Further, in the general formula (2) of the present invention, of R 1 to R 8 Alkyl of C 1 to C 20 is independently -CH 3 , -CH 2 CH 3 , -CH 2 CH 2 CH 2 CH 3 , -CH (CH 3 ) 2 , -CH 2 CH 2 CH 2 CH 3 , -CH Linear or branched alkyl such as (CH 3 ) CH 2 CH 3 , or —CH 2 CH (CH 3 ) 2 , but is not limited thereto. Further, in Formula 2, of R 1 to R 8 Fluoroalkyl is one wherein at least one fluorine group is substituted for hydrogen in the alkyl as defined above.
또한, 상기 화학식 2에서 R1 내지 R8의 C2~C20의 알케닐은 각각 독립적으로 -CH=CH2, -CH=CHCH3, -CCH3=CH2, -CH2CH=CH2, -CH=CHCH2CH3, -CH=C(CH3)2, -CCH3=CHCH3, -CH2CH=CHCH3, -CH2CCH3=CH2, -CHCH3CH=CH2, 또는 -CH2CH2CH=CH2 등의 선형 또는 가지형 알케닐일 수 있으나, 이에 한정되는 것은 아니다. 또한, 화학식 2에서 R1 내지 R8의 플루오르알케닐은 상기 정의하고 있는 알케닐에 한 개 이상의 플루오르기가 수소 대신 치환된 것이다.In addition, in Formula 2 of R 1 to R 8 Alkenyl of C 2 ~ C 20 are each independently -CH = CH 2 , -CH = CHCH 3 , -CCH 3 = CH 2 , -CH 2 CH = CH 2 , -CH = CHCH 2 CH 3 , -CH = C (CH 3 ) 2 , -CCH 3 = CHCH 3 , -CH 2 CH = CHCH 3 , -CH 2 CCH 3 = CH 2 , -CHCH 3 CH = CH 2 , or -CH 2 CH 2 CH = CH 2, etc. It may be a linear or branched alkenyl of, but is not limited thereto. Further, in Formula 2, of R 1 to R 8 Fluoroalkenyl is one in which at least one fluorine group is substituted for hydrogen in alkenyl as defined above.
또한, 상기 화학식 2에서 R1 내지 R8의 C2~C20의 알키닐은 각각 독립적으로 -C≡CH, -CH2C≡CH, -C≡CCH3, -CH2CH2C≡CH, -CHCH3C≡CH, -CH2C≡CCH3, 또는 -C≡CCH2CH3 등의 선형 또는 가지형 알키닐일 수 있으나, 이에 한정되는 것은 아니다. 또한, 화학식 2에서 R1 내지 R8의 플루오르알키닐은 상기 정의하고 있는 알키닐에 한 개 이상의 플루오르기가 수소 대신 치환된 것이다.In addition, in Formula 2 of R 1 to R 8 Alkynyl of C 2 to C 20 is independently -C≡CH, -CH 2 C≡CH, -C≡CCH 3 , -CH 2 CH 2 C≡CH, -CHCH 3 C≡CH, -CH 2 C Linear or branched alkynyl such as —CCH 3 or —C≡CCH 2 CH 3 , but is not limited thereto. Further, in Formula 2, of R 1 to R 8 Fluoroalkynyl is one in which one or more fluorine groups are substituted for hydrogen in the alkynyl as defined above.
본 발명의 화학식 1로 표시되는 화합물을 보다 자세하게 표현하면 하기 화합 물들과 같으나, 본 발명에 따른 화합물은 하기 예시된 것들에 한정되는 것은 아니다.In more detail, the compound represented by the formula (1) of the present invention is the same as the following compounds, but the compound according to the present invention is not limited to those illustrated below.
본 발명에 따른 수지 조성물은 고분자 수지 및 본 발명의 상기 화학식 1로 표시되는 화합물을 포함한다. 이때, 상기 화학식 1로 표시되는 화합물은 고분자 수지의 광학 특성을 제어하는 역할을 할 수 있다. The resin composition according to the present invention includes a polymer resin and a compound represented by Chemical Formula 1 of the present invention. In this case, the compound represented by Formula 1 may play a role of controlling the optical properties of the polymer resin.
이러한 목적으로 사용할 경우에 상기 화학식 1로 표시되는 화합물은 1종 내지는 2종 이상이 혼합되어 사용될 수도 있다. 또한, 본 발명의 수지 조성물 내에서 고분자 수지 및 화학식 1로 표시되는 화합물의 사용량은, 중량비로 고분자 수지: 화학식 1로 표시되는 화합물 = 50: 50 ~ 99: 1이며, 바람직하게는 70: 30 ~ 95: 5, 보다 바람직하게는 80: 20 ~ 95: 5이다.When used for this purpose, the compound represented by Formula 1 may be used by mixing one or two or more kinds. In addition, the amount of the polymer resin and the compound represented by the formula (1) in the resin composition of the present invention is a polymer resin: the compound represented by the formula (1) in a weight ratio = 50: 50 ~ 99: 1, preferably 70: 30 ~ 95: 5, More preferably, it is 80: 20-95: 5.
상기 화학식 1로 표시되는 화합물과 혼합 가능한 상기 고분자 수지는 특별히 제한되지 않으며, 일반적으로 광학적 목적으로 사용되는 고분자 수지가 사용될 수 있다. 예를 들면, 상기 고분자 수지는 폴리이미드, 폴리아미드이미드, 폴리아미드, 폴리에테르이미드, 폴리에테르에테르케톤, 폴리에테르케톤, 폴리케톤설파이드, 폴리에테르술폰, 시클로올레핀폴리머, 폴리술폰, 폴리페닐렌설파이드, 폴리페닐렌옥사이드, 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 폴리에틸렌나프탈레이트, 폴리아세탈, 폴리카보네이트, 폴리아크릴레이트, 아크릴 수지, 폴리비닐알콜, 폴리프로필렌, 셀룰로오스, 트리아세틸셀룰로오스, 에폭시 수지, 페놀 수지 등이 있으나, 이에 한정되지 않는다. 또한, 이들 고분자 수지는 단독으로 또는 2종 이상 혼합하여 사용할 수 있다.The polymer resin that can be mixed with the compound represented by Formula 1 is not particularly limited, and a polymer resin generally used for optical purposes may be used. For example, the polymer resin may be polyimide, polyamideimide, polyamide, polyetherimide, polyetheretherketone, polyetherketone, polyketone sulfide, polyether sulfone, cycloolefin polymer, polysulfone, polyphenylene sulfide , Polyphenylene oxide, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyacetal, polycarbonate, polyacrylate, acrylic resin, polyvinyl alcohol, polypropylene, cellulose, triacetyl cellulose, epoxy resin, phenol Resin and the like, but is not limited thereto. In addition, these polymeric resins can be used individually or in mixture of 2 or more types.
또한, 본 발명의 화학식 1로 표시되는 화합물은 상기 고분자 수지로서 광학용 점착제 수지, 바람직하게는 아크릴계 점착제 수지와 혼합하여 사용할 수 있다. In addition, the compound represented by the formula (1) of the present invention can be used as the polymer resin mixed with an optical pressure-sensitive adhesive resin, preferably acrylic pressure-sensitive adhesive resin.
일반적으로 빛샘현상을 개선하기 위해서 고분자량 공중합체에 가소제 또는 저분자량체를 첨가하거나, 또는 가교구조의 조절을 통하여 점착제에 응력완화 기능을 부여하는 방법을 사용하고 있다. 그러나 응력완화만을 통해 빛샘 현상을 완벽하게 억제하기는 어렵다. 이는 편광판용 점착제의 내구 신뢰성을 유지하기 위해 점착제에 부분 가교구조를 도입해야 하기 때문에 가교구조에 의해 나타나는 점착제층의 잔류응력을 완전히 제거할 수 없기 때문이다. 따라서 이러한 잔류응력 하에서 일반 적으로 사용되는 아크릴계 점착제층에는 음의 복굴절이 존재하게 되며, 이는 수축된 편광판의 TAC층에 존재하는 음의 복굴절과 더불어 빛샘을 더 이상 개선시키기 어려운 주요 원인이 된다. In general, in order to improve light leakage, a method of adding a plasticizer or a low molecular weight to the high molecular weight copolymer or providing a stress relaxation function to the pressure-sensitive adhesive by controlling the crosslinking structure is used. However, it is difficult to completely suppress light leakage through stress relaxation only. This is because a partial crosslinked structure must be introduced into the pressure sensitive adhesive in order to maintain the durability reliability of the pressure sensitive adhesive for polarizing plate, and thus the residual stress of the pressure sensitive adhesive layer exhibited by the crosslinked structure cannot be completely removed. Therefore, there is a negative birefringence in the acrylic pressure-sensitive adhesive layer commonly used under such residual stress, which is a major cause that is difficult to further improve the light leakage with the negative birefringence present in the TAC layer of the contracted polarizer.
따라서, 이러한 빛샘현상을 개선하기 위해 잔류응력 하에서 음의 복굴절을 나타내는 아크릴계 점착제 수지에 광학 이방성이 큰 화합물인 상기 화학식 1로 표시되는 화합물을 도입하여 잔류응력 하에서 양의 복굴절을 가지게 함으로써 수축된 편광판의 TAC층에 존재하는 음의 복굴절을 광학적으로 보상을 하여 빛샘현상을 개선하는 것을 특징으로 한다.Therefore, in order to improve the light leakage phenomenon, a compound represented by Chemical Formula 1, which is a compound having a large optical anisotropy, is introduced into an acrylic pressure-sensitive adhesive resin exhibiting negative birefringence under residual stress to have a positive birefringence under residual stress. Optical compensation of negative birefringence present in the TAC layer is characterized by improving light leakage.
또한, 본 발명의 수지 조성물은 고분자 수지와 화학식 1로 표시되는 화합물 이외에 필요에 따라서 유기 용매를 포함할 수 있다. 유기 용매가 포함됨으로써, 본 발명의 수지 조성물을 사용하여 기재 상에 도포(코팅)하기가 용이해진다.In addition, the resin composition of the present invention may include an organic solvent, if necessary, in addition to the polymer resin and the compound represented by the formula (1). By containing an organic solvent, it becomes easy to apply | coat (coat) on a base material using the resin composition of this invention.
상기 유기 용매는 특별히 한정되는 것은 아니고, 당업계에 알려진 통상의 것을 사용할 수 있다. 이의 비제한적인 예로는, 시클로헥산, 시클로펜탄, 벤젠, 톨루엔, 크실렌, 부틸벤젠 등의 탄화수소류; 아세톤, 메틸에틸케톤, 메틸이소부틸케톤, 시클로헥사논 등의 케톤류, 아세트산에틸, 에틸렌글리콜모노메틸에테르아세테이트, 프로필렌글리콜모노메틸에테르아세테이트, 감마-부티로락톤 등의 에스테르류; 2-피롤리돈, N-메틸-2-피롤리돈, 디메틸포름아미드, 디메틸아세트아미드 등의 아미드류; 클로로포름, 디클로로메탄, 사염화탄소, 디클로로에탄, 테트라클로로에탄, 케트라클로로에틸렌, 클로로벤젠 등의 할로겐류; t-부틸알콜, 디아세톤알콜, 글리세린, 모노아세틴, 에틸렌글리콜, 트리에틸렌글리콜, 헥실렌글리콜, 에틸렌글리콜모 노메틸에테르 등의 알코올류; 페놀, 파라클로로페놀 등의 페놀류; 메톡시벤젠, 1,2-디메톡시벤젠, 디에틸렌글리콜 디메틸에테르, 에틸렌글리콜다이메틸에테르, 에틸렌글리콜다이에틸에테르, 프로필렌글리콜다이메틸에테르, 프로필렌글리콜다이에틸에테르, 다이에틸렌글리콜다이메틸에테르, 다이에틸렌글리콜다이에틸에테르, 다이프로필렌글리콜다이메틸에테르, 다이프로필렌글리콜다이에틸에테르 등의 에테르류 등이 있다. 또한, 이들 유기 용매는 단독으로 또는 2종 이상 혼합하여 사용할 수 있으며, 사용량은 특별히 한정하지 않는다.The organic solvent is not particularly limited, and common ones known in the art may be used. Non-limiting examples thereof include hydrocarbons such as cyclohexane, cyclopentane, benzene, toluene, xylene and butylbenzene; Ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone, esters such as ethyl acetate, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, and gamma-butyrolactone; Amides such as 2-pyrrolidone, N-methyl-2-pyrrolidone, dimethylformamide and dimethylacetamide; Halogens such as chloroform, dichloromethane, carbon tetrachloride, dichloroethane, tetrachloroethane, ketrachloroethylene and chlorobenzene; alcohols such as t-butyl alcohol, diacetone alcohol, glycerin, monoacetin, ethylene glycol, triethylene glycol, hexylene glycol, and ethylene glycol monomethyl ether; Phenols such as phenol and parachlorophenol; Methoxybenzene, 1,2-dimethoxybenzene, diethylene glycol dimethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol dimethyl ether, di Ethers such as ethylene glycol diethyl ether, dipropylene glycol dimethyl ether and dipropylene glycol diethyl ether. In addition, these organic solvents can be used individually or in mixture of 2 or more types, and the use amount is not specifically limited.
또한, 본 발명의 수지 조성물은 필요에 따라서 계면활성제를 포함할 수 있다. 계면활성제는 기재 상에 도포를 용이하게 하기 위해서 사용될 수 있다. 상기 계면활성제는 특별히 한정되는 것은 아니고 당업계에 알려진 통상의 것을 사용할 수 있으며, 첨가량은 계면활성제의 종류, 혼합물의 구성 성분의 조성비, 용매의 종류, 또는 기재의 종류에 따라 달라질 수 있다. Moreover, the resin composition of this invention can contain surfactant as needed. Surfactants can be used to facilitate application onto the substrate. The surfactant is not particularly limited and conventional ones known in the art may be used, and the amount of the surfactant may vary depending on the kind of the surfactant, the composition ratio of the components of the mixture, the kind of the solvent, or the kind of the substrate.
또한, 본 발명의 수지 조성물은 기타 첨가제로서 카이럴 도펀드, 응력 완화제 및/또는 leveling agent 등을 포함할 수 있다.In addition, the resin composition of the present invention may include a chiral dopant, a stress relaxer and / or a leveling agent, or the like as other additives.
본 발명에 따른 광학 부재는 상기 본 발명의 수지 조성물로부터 제조되는 고분자 필름 또는 점착제를 포함한다.The optical member which concerns on this invention contains the polymeric film or adhesive manufactured from the resin composition of the said invention.
본 발명의 수지 조성물을 사용하여 제조되는 상기 고분자 필름은 일축 연신 필름 또는 이축 연신 필름일 수도 있고, 상기 고분자 필름은 친수성 처리나 소수성 처리 등의 표면 처리된 것일 수 있고, 적층 필름이거나 glass 일 수도 있다.The polymer film produced using the resin composition of the present invention may be a uniaxially stretched film or a biaxially stretched film, the polymer film may be a surface treated such as hydrophilic treatment or hydrophobic treatment, may be a laminated film or glass. .
본 발명의 수지 조성물을 사용한 고분자 필름의 제조방법은 특별히 한정되지 않고, 당업계에 알려진 통상의 방법에 따를 수 있다. 또한, 본 발명에 따라 유기 용매를 포함하는 수지 조성물을 사용하여 고분자 필름을 제조하는 경우, 상기 화학식 1로 표시되는 화합물을 포함하는 수지 고형분은 용매를 포함하는 전체 수지 조성물에 대하여 통상 0.1~90 중량%, 바람직하게는 1~50 중량%, 더욱 바람직하게는 5~40 중량%가 되도록 한다. 수지 조성물의 농도가 상기 하한 미만의 경우에는 필름의 두께를 확보 하기가 어려워지며, 상기 상한 초과의 경우에는 용액의 점도가 너무 커서 균일한 두께의 필름을 얻기가 어렵다. The manufacturing method of the polymer film using the resin composition of this invention is not specifically limited, It can follow the conventional method known in the art. In addition, when preparing a polymer film using a resin composition containing an organic solvent according to the present invention, the resin solid content containing the compound represented by the formula (1) is usually 0.1 to 90% by weight relative to the total resin composition containing a solvent %, Preferably 1 to 50% by weight, more preferably 5 to 40% by weight. When the concentration of the resin composition is less than the lower limit, it is difficult to secure the thickness of the film. When the concentration of the resin composition is higher than the upper limit, the viscosity of the solution is too large to obtain a film having a uniform thickness.
이하 본 발명을 실시예를 통하여 상세히 설명하면 다음과 같다. 단, 하기 실시예는 본 발명을 예시하는 것일 뿐 본 발명이 하기 실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in detail with reference to the following Examples. However, the following examples are merely to illustrate the present invention and the present invention is not limited by the following examples.
(제조예 1)(Production Example 1)
질소가스가 환류되고 온도조절이 용이하도록 냉각장치를 설치한 1L 반응기에 98 중량부의 n-부틸아크릴레이트(n-butylacrylate:BA) 및 2 중량부의 2-하이드록시에틸메타아클릴레이트 (2-hydroxyethyl(metha)acrylate: 2-HEMA)로 구성되는 단량체들의 혼합물을 투입하였다. 그리고, 용제로서 120 중량부의 에틸아세테이트(ethylacetate:EtOAc)를 투입하였다. 산소를 제거하기 위하여 질소가스를 60분간 퍼징(purging)한 후 온도는 60℃로 유지하고, 반응 개시제인 0.03 중량부의 아조비수이소부티로니트릴 (azobisisobutyronitrile:AIBN)를 투입하고 8시간 동안 반응시켰다. 반응 후 에틸아세테이트(EAc)로 희석하여 고형분 20중량%, 중량 평균 분자량이 150만인 아크릴계 공중합체를 제조하였다.98 parts by weight of n-butylacrylate (BA) and 2 parts by weight of 2-hydroxyethyl methacrylate (2-hydroxyethyl) in a 1 L reactor equipped with a refrigeration system to allow nitrogen gas to be refluxed and for easy temperature control. A mixture of monomers consisting of (metha) acrylate: 2-HEMA) was added. Then, 120 parts by weight of ethyl acetate (EtOAc) was added as a solvent. After purging with nitrogen gas for 60 minutes to remove oxygen, the temperature was maintained at 60 ° C., and 0.03 parts by weight of azobiisoisobutyronitrile (AIBN), a reaction initiator, was added and reacted for 8 hours. After the reaction was diluted with ethyl acetate (EAc) to prepare an acrylic copolymer having a solid content of 20% by weight, a weight average molecular weight of 1.5 million.
(제조예 2)(Manufacture example 2)
1 당량의 Tripropylene glycol을 CH2Cl2용매에 용해시킨 뒤에 0℃에서 2.2 당량의 TsCl (p-toluenesulfonyl chloride) 및 2.4 당량의 TEA (triethyl amine)을 넣고 상온으로 온도를 올려서 20시간 정도 교반하였다. 반응 종료 후 물과 CH2Cl2로 work-up을 하고 실리카겔 컬럼으로 정제하여 상기의 화합물 1을 92%의 수율로 합성하였다. After dissolving 1 equivalent of Tripropylene glycol in CH 2 Cl 2 solvent, 2.2 equivalents of TsCl (p-toluenesulfonyl chloride) and 2.4 equivalents of TEA (triethyl amine) were added at 0 ° C., and the temperature was raised to room temperature and stirred for about 20 hours. After completion of the reaction, work-up with water and CH 2 Cl 2 was purified by silica gel column, and Compound 1 was synthesized in a yield of 92%.
1 당량의 화합물 1을 butanone 용매에 용해시키고 2 당량의 p-hydroxybenzoic acid methylester 및 2.5 당량의 K2CO3를 넣고 90℃에서 40시간 정도 교반하였다. 반응 종료 후 물과 에테르로 work-up하였다. 이 화합물 1 당량을 물과 메탄올 (3:7) 혼합 용매에 용해한 후 2.2 당량의 KOH를 넣고 100℃에서 1시간 정도 교반하였다. 반응 종료 후 메탄올을 증류한 후 물과 헥산을 넣으면 화합물 2가 결정으로 석출되었다. Filtration하여 화합물 2를 85%의 수율로 얻었다. One equivalent of Compound 1 was dissolved in a butanone solvent, two equivalents of p-hydroxybenzoic acid methylester and 2.5 equivalents of K 2 CO 3 were added and stirred at 90 ° C. for about 40 hours. After the reaction, work-up was performed with water and ether. One equivalent of this compound was dissolved in a mixed solvent of water and methanol (3: 7), and 2.2 equivalent of KOH was added thereto, followed by stirring at 100 ° C for about 1 hour. After completion of the reaction, methanol was distilled off, and then water and hexane were added to thereby precipitate Compound 2 as crystals. Filtration gave Compound 2 in a yield of 85%.
1 당량의 화합물 2를 CH2Cl2 용매에 녹이고 2 당량의 p-hydroxybiphenyl, 2.2 당량의 EDC (1-Ethyl-3-(3-dimethylaminopropyl)carbodiimide) 및 0.1 당량의 DMAP (p-dimethylaminopyridine)를 넣고 상온에서 20시간 정도 교반하였다. 반응 종료 후 물과 CH2Cl2로 work-up 한 후 실리카겔 컬럼으로 정제하여 최종 화합물 3을 80% 수율로 만들었다. Dissolve 1 equivalent of Compound 2 in CH 2 Cl 2 solvent and add 2 equivalents of p-hydroxybiphenyl, 2.2 equivalents of EDC (1-Ethyl-3- (3-dimethylaminopropyl) carbodiimide) and 0.1 equivalent of DMAP (p-dimethylaminopyridine) Stir at room temperature for 20 hours. After completion of the reaction, work-up with water and CH 2 Cl 2 was purified by silica gel column to obtain the final compound 3 in 80% yield.
1HNMR (400MHz, CDCl3): δ 1.19~1.24 (m, 3H), 1.24~1.40 (m, 6H), 3.45~4.10 (m, 8H), 4.53~4.62 (m, 1H), 6.99 (d, 4H), 7.10 (d, 4H), 7.31~7.43 (m, 6H), 7.47 (d, 4H), 7.56 (d, 4H), 7.79 (d, 4H). 1 HNMR (400 MHz, CDCl 3 ): δ 1.19-1.24 (m, 3H), 1.24-1.40 (m, 6H), 3.45-4.10 (m, 8H), 4.53-4.62 (m, 1H), 6.99 (d, 4H), 7.10 (d, 4H), 7.31-7.43 (m, 6H), 7.47 (d, 4H), 7.56 (d, 4H), 7.79 (d, 4H).
(제조예 3)(Production Example 3)
1 당량의 p-Hydroxybenzoic acid methylester를 CH2Cl2용매에 용해시킨 뒤에 0℃에서 1.0 당량의 TBSCl (tert-butyldimethylsilyl chloride) 및 1.1 당량의 TEA (triethyl amine)을 넣고 상온으로 온도를 올려서 5시간 정도 교반하였다. 반응 종료 후 물과 CH2Cl2로 work-up을 하고 실리카겔 컬럼으로 정제하여 화합물 4를 97%의 수율로 합성하였다. After dissolving 1 equivalent of p-Hydroxybenzoic acid methylester in CH 2 Cl 2 solvent, add 1.0 equivalent of TBSCl (tert-butyldimethylsilyl chloride) and 1.1 equivalent of TEA (triethyl amine) at 0 ℃, and raise the temperature to room temperature for about 5 hours. Stirred. After completion of the reaction, work-up with water and CH 2 Cl 2 was purified by silica gel column, and compound 4 was synthesized in a yield of 97%.
1 당량의 화합물 4를 CH2Cl2 용매에 녹이고 1 당량의 p-ydroxybiphenyl, 1.1 당량의 EDC (1-Ethyl-3-(3-dimethylaminopropyl)carbodiimide) 및 0.1 당량의 DMAP (p-dimethylaminopyridine)를 넣고 상온에서 10시간 정도 교반하였다. 반응 종료 후 물과 CH2Cl2로 work-up 한 후 실리카겔 컬럼으로 정제하여 화합물 5를 95% 수율로 만들었다. Dissolve 1 equivalent of Compound 4 in CH 2 Cl 2 solvent and add 1 equivalent of p-ydroxybiphenyl, 1.1 equivalent of EDC (1-Ethyl-3- (3-dimethylaminopropyl) carbodiimide) and 0.1 equivalent of DMAP (p-dimethylaminopyridine) Stirred at room temperature for about 10 hours. After completion of the reaction, work-up with water and CH 2 Cl 2 and then purified by silica gel column to give compound 5 in 95% yield.
1 당량의 화합물 5를 THF 용매에 용해시킨 후에 1.2 당량의 10% aq. HCl을 넣고 1시간 정도 교반하였다. 반응 종료 후 물과 에테르로 work-up한 후 헥산을 넣으면 80%의 수율로 고체 화합물을 얻었다. 1 당량의 화합물 6과 상기의 고체 화합물 2 당량을 CH2Cl2 용매에 용해시킨 후 2.2 당량의 TEA (triethylamine) 및 0.2 당량의 DMAP (p-dimethylaminopyridine)을 넣고 상온에서 20시간 정도 교반하였다. 반응 종료 후 물과 CH2Cl2로 work-up 한 후 실리카겔 컬럼으로 정제하여 최종 화합물 7을 70% 수율로 만들었다. 1.2 equivalents of Compound 5 was dissolved in THF solvent followed by 1.2 equivalents of 10% aq. HCl was added and stirred for about 1 hour. After completion of the reaction, work-up with water and ether and hexane was added to give a solid compound in 80% yield. After dissolving 1 equivalent of Compound 6 and 2 equivalents of the solid compound in a CH 2 Cl 2 solvent, 2.2 equivalent of TEA (triethylamine) and 0.2 equivalent of DMAP (p-dimethylaminopyridine) were added thereto, and the resultant was stirred at room temperature for about 20 hours. After completion of the reaction, work-up with water and CH 2 Cl 2 was purified by silica gel column to obtain the final compound 7 in 70% yield.
1HNMR (400MHz, CDCl3): δ 0.33 (s, 12H), 0.39 (s, 12H), 6.89 (d, 4H), 7.12 (d, 4H), 7.30~7.41 (m, 6H), 7.43 (d, 4H), 7.50 (d, 4H), 7.69 (d, 4H). 1 HNMR (400 MHz, CDCl 3 ): δ 0.33 (s, 12H), 0.39 (s, 12H), 6.89 (d, 4H), 7.12 (d, 4H), 7.30-7.41 (m, 6H), 7.43 (d , 4H), 7.50 (d, 4H), 7.69 (d, 4H).
(제조예 4)(Production Example 4)
1 당량의 p-Hydroxybiphenyl을 CH2Cl2 용매에 녹이고 1 당량의 benzoic acid, 1.1 당량의 EDC (1-Ethyl-3-(3-dimethylaminopropyl)carbodiimide) 및 0.1 당량의 DMAP (p-dimethylaminopyridine)를 넣고 상온에서 5시간 정도 교반하였다. 반응 종료 후 물과 CH2Cl2로 work-up 한 후 실리카겔 컬럼으로 정제하여 화합물 8을 95% 수율로 만들었다. Dissolve 1 equivalent of p-Hydroxybiphenyl in CH 2 Cl 2 solvent, add 1 equivalent of benzoic acid, 1.1 equivalent of EDC (1-Ethyl-3- (3-dimethylaminopropyl) carbodiimide) and 0.1 equivalent of DMAP (p-dimethylaminopyridine) Stir at room temperature for 5 hours. After completion of the reaction, work-up with water and CH 2 Cl 2 was purified by silica gel column to obtain compound 8 in 95% yield.
1HNMR (400MHz, CDCl3): δ 6.95 (d, 2H), 7.08 (d, 2H), 7.29~7.33 (m, 2H), 7.37~7.44 (m, 2H), 7.45 (d, 2H), 7.58 (d, 2H), 7.71 (d, 2H). 1 HNMR (400 MHz, CDCl 3 ): δ 6.95 (d, 2H), 7.08 (d, 2H), 7.29-7.73 (m, 2H), 7.37-7.44 (m, 2H), 7.45 (d, 2H), 7.58 (d, 2H), 7.71 (d, 2H).
(실시예 1)(Example 1)
상기의 제조예 1에서 얻어진 고분자량 아크릴계 공중합체 100 중량부(고형분)와 제조예 2에서 얻어진 광학 이방성 화합물 5 중량부를 균일하게 혼합한 후, 코팅성 및 두께를 고려하여 에틸 아세테이트 용매에 녹여서 적정의 농도로 희석하여 코팅액 (수지 조성물)을 제조하였다. 100 parts by weight (solid content) of the high molecular weight acrylic copolymer obtained in Preparation Example 1 and 5 parts by weight of the optically anisotropic compound obtained in Preparation Example 2 were uniformly mixed, and then dissolved in an ethyl acetate solvent in consideration of coating properties and thickness, Dilution to concentration produced a coating solution (resin composition).
(실시예 2)(Example 2)
제조예 2에서 합성한 이방성 화합물 대신 제조예 3에서 합성한 화합물을 사용한 것을 제외하고는 실시예 1과 동일하게 진행하여 코팅액 (수지 조성물)을 제조하였다.A coating solution (resin composition) was prepared in the same manner as in Example 1 except that the compound synthesized in Preparation Example 3 was used instead of the anisotropic compound synthesized in Preparation Example 2.
(비교예 1)(Comparative Example 1)
제조예 2에서 합성한 이방성 화합물 대신 제조예 4에서 합성한 화합물을 사용한 것을 제외하고는 실시예 1과 동일하게 진행하여 코팅액 (수지 조성물)을 제조하였다.A coating solution (resin composition) was prepared in the same manner as in Example 1 except that the compound synthesized in Preparation Example 4 was used instead of the anisotropic compound synthesized in Preparation Example 2.
(비교예 2)(Comparative Example 2)
제조예 1에서 합성한 점착제 수지만 사용하고 제조예 2에서 합성한 이방성 화합물은 사용하지 않은 것을 제외하고는 실시예 1과 동일하게 진행하여 코팅액 (수지 조성물)을 제조하였다.The coating solution (resin composition) was prepared in the same manner as in Example 1 except that only the adhesive resin synthesized in Preparation Example 1 was used and the anisotropic compound synthesized in Preparation Example 2 was not used.
(실험예)Experimental Example
실시예 1~2 및 비교예 1~2에서 제조된 코팅액(수지 조성물) 각각의 물성은 다음의 방법으로 측정하였다.The physical properties of each of the coating liquids (resin compositions) prepared in Examples 1 and 2 and Comparative Examples 1 and 2 were measured by the following method.
1. 고분자 수지와 이방성 물질의 상용성 실험1. Compatibility test of polymer resin and anisotropic material
이형필름에 코팅액을 3㎛ 두께가 되도록 코팅하고 100℃에서 2분간 건조 후 상온에서 보관하면서 광학 이방성 화합물의 결정화가 일어나는지를 확인하였다 The coating solution was coated on the release film to have a thickness of 3 μm, dried at 100 ° C. for 2 minutes, and stored at room temperature to determine whether crystallization of the optically anisotropic compound occurred.
2. 이방성 실험2. Anisotropy Experiment
유리 기판에 코팅액을 25㎛ 두께가 되도록 균일하게 코팅한 후 형성된 필름 위에 유리 기판을 합착하였다. 각각의 유리 기판을 만능 테스터기(UTM, ZWICK사)를 이용해 반대 방향으로 당겨서 필름층을 200% 연신한 후 micrometer로 두께 변화를 측정하였다. 위상차 측정기(axoscan, Axometrics사)로 필름층의 위상차 변화를 측정하였다.The coating liquid was uniformly coated on the glass substrate to have a thickness of 25 μm, and then the glass substrate was bonded onto the formed film. Each glass substrate was pulled in the opposite direction using a universal tester (UTM, ZWICK Co., Ltd.) to stretch the film layer by 200%, and the thickness change was measured by a micrometer. The phase difference change of the film layer was measured by the phase difference measuring instrument (axoscan, Axometrics company).
필름의 면내 위상차(Re) 및 두께 방향의 위상차(Rth)는 아래의 식으로 정의된다. 이때 nx 및 ny는 면내 굴절율로, nx는 굴절율이 면내에서 가장 큰 방향이고 ny는 nx의 면내 수직 방향이다. nz는 두께 방향의 굴절율, d는 필름의 두께(㎚)이다.The in-plane retardation Re and the retardation Rth in the thickness direction of the film are defined by the following equation. Where n x and n y are in-plane refractive indices, n x is the direction in which the refractive index is largest in plane, and n y is the in-plane vertical direction of n x . n z is a refractive index in the thickness direction, d is the thickness (nm) of the film.
Re = (nx-ny) x dRe = (n x- n y ) xd
Rth = ((nx+ny)/2 - nz) x dRth = ((n x + n y ) / 2-n z ) xd
측정한 물성은 다음 표 1과 같다.The measured physical properties are shown in Table 1 below.
위 표 1에서 볼 수 있는 바와 같이 본 발명의 이방성 화합물을 아크릴 수지에 첨가하여 사용한 경우(실시예 1 내지 2), 수지의 변형에 따른 이방 특성이 우수하여 광 특성 제어에 용이하다. As can be seen in Table 1 above, when the anisotropic compound of the present invention is used in addition to the acrylic resin (Examples 1 to 2), the anisotropy property according to the deformation of the resin is excellent, and thus it is easy to control the optical properties.
또한 실시예 1 내지 2의 경우 상온에서 1주일 보관 후에도 이방성 물질이 결정화되지 않았다. 반면에 비교예 1의 경우 1주일 후 관찰 한 결과 일부에서 결정화된 입자들이 관찰되었다.In addition, in Examples 1 to 2, the anisotropic material did not crystallize even after 1 week storage at room temperature. In contrast, in Comparative Example 1, after one week, some crystallized particles were observed.
이상을 통해 본 발명의 바람직한 실시예에 대하여 설명하였지만, 본 발명은 이에 한정되는 것이 아니고 특허청구범위와 발명의 상세한 설명의 범위 안에서 여러 가지로 변형하여 실시하는 것이 가능하고 이 또한 본 발명의 범위에 속하는 것은 당연하다.Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention. It is natural to belong.
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