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KR20100028033A - 발광장치 및 발광장치용 패키지 집합체 - Google Patents

발광장치 및 발광장치용 패키지 집합체 Download PDF

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Publication number
KR20100028033A
KR20100028033A KR1020097025641A KR20097025641A KR20100028033A KR 20100028033 A KR20100028033 A KR 20100028033A KR 1020097025641 A KR1020097025641 A KR 1020097025641A KR 20097025641 A KR20097025641 A KR 20097025641A KR 20100028033 A KR20100028033 A KR 20100028033A
Authority
KR
South Korea
Prior art keywords
light emitting
substrate
metal substrate
emitting diode
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020097025641A
Other languages
English (en)
Korean (ko)
Inventor
히로시 후시미
Original Assignee
씨. 아이. 카세이 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 씨. 아이. 카세이 가부시기가이샤 filed Critical 씨. 아이. 카세이 가부시기가이샤
Publication of KR20100028033A publication Critical patent/KR20100028033A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
KR1020097025641A 2007-05-09 2008-04-24 발광장치 및 발광장치용 패키지 집합체 Withdrawn KR20100028033A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-124551 2007-05-09
JP2007124551 2007-05-09

Publications (1)

Publication Number Publication Date
KR20100028033A true KR20100028033A (ko) 2010-03-11

Family

ID=40002185

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097025641A Withdrawn KR20100028033A (ko) 2007-05-09 2008-04-24 발광장치 및 발광장치용 패키지 집합체

Country Status (5)

Country Link
JP (1) JPWO2008139981A1 (fr)
KR (1) KR20100028033A (fr)
CN (1) CN101681960B (fr)
TW (1) TW200921945A (fr)
WO (1) WO2008139981A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102412346A (zh) * 2010-09-23 2012-04-11 展晶科技(深圳)有限公司 发光二极管制造方法
KR20120045880A (ko) * 2010-11-01 2012-05-09 삼성엘이디 주식회사 Ｌｅｄ 패키지의 광특성 측정 장치
US8933548B2 (en) 2010-11-02 2015-01-13 Dai Nippon Printing Co., Ltd. Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
CN102544325B (zh) * 2012-02-14 2013-06-12 张家港市金港镇东南电子厂 一种led集成模组及其制作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP2006066409A (ja) * 2004-07-28 2006-03-09 Kyocera Corp 発光素子用配線基板および発光装置ならびに発光素子用配線基板の製造方法
JP4608294B2 (ja) * 2004-11-30 2011-01-12 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP4915058B2 (ja) * 2005-06-06 2012-04-11 パナソニック株式会社 Ｌｅｄ部品およびその製造方法
US20070200133A1 (en) * 2005-04-01 2007-08-30 Akira Hashimoto Led assembly and manufacturing method
JP4979896B2 (ja) * 2005-04-25 2012-07-18 パナソニック株式会社 発光装置
JP4836230B2 (ja) * 2005-06-17 2011-12-14 株式会社小糸製作所 発光デバイス及びこれを用いた光源装置
JP2007005722A (ja) * 2005-06-27 2007-01-11 Toshiba Corp 光半導体素子用外囲器およびそれを用いた光半導体装置

Also Published As

Publication number Publication date
CN101681960B (zh) 2011-09-07
TW200921945A (en) 2009-05-16
WO2008139981A1 (fr) 2008-11-20
CN101681960A (zh) 2010-03-24
JPWO2008139981A1 (ja) 2010-08-05

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20091208

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid