KR20080028761A - 프린트기판의 가공방법 및 프린트기판 가공기 - Google Patents
프린트기판의 가공방법 및 프린트기판 가공기 Download PDFInfo
- Publication number
- KR20080028761A KR20080028761A KR1020070083239A KR20070083239A KR20080028761A KR 20080028761 A KR20080028761 A KR 20080028761A KR 1020070083239 A KR1020070083239 A KR 1020070083239A KR 20070083239 A KR20070083239 A KR 20070083239A KR 20080028761 A KR20080028761 A KR 20080028761A
- Authority
- KR
- South Korea
- Prior art keywords
- spindle
- tool
- amount
- printed board
- machining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003672 processing method Methods 0.000 title abstract description 4
- 238000006073 displacement reaction Methods 0.000 claims abstract description 30
- 238000003754 machining Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
- B23B41/14—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor for very small holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2270/00—Details of turning, boring or drilling machines, processes or tools not otherwise provided for
- B23B2270/54—Methods of turning, boring or drilling not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Drilling And Boring (AREA)
- Numerical Control (AREA)
- Automatic Control Of Machine Tools (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
Abstract
Description
Claims (3)
- 스핀들의 운전시간과 상기 스핀들에 유지된 공구 선단의 축선방향 변위량간의 관계를 미리 상기 스핀들의 회전수마다 구해 두고,가공을 하기 위해 설정된 상기 스핀들의 회전수와 가공개시 후의 경과시간에 기초하여, 상기 공구의 절삭량을 미리 구해 둔 상기 변위량만큼 보정하는 것을 특징으로 하는 프린트기판의 가공방법.
- 스핀들의 회전을 제 1 회전수에서 제 2 회전수로 변경했을 경우의, 변경 후의 상기 스핀들의 운전시간과 상기 스핀들에 유지된 공구 선단의 축선방향 변위량 간의 관계를, 상기 제 1 및 제 2 회전수마다 미리 구해 두고,상기 제 2 회전수와 상기 제 2 회전수로 변경된 후의 경과시간에 기초하여, 상기 공구의 절삭량을 미리 구해 둔 상기 변위량만큼 보정하는 것을 특징으로 하는 프린트기판의 가공방법.
- 공구를 회전시키는 스핀들과, 상기 스핀들을 상기 공구의 축선방향으로 이동시키는 이동장치를 구비하고, 상기 공구를 상기 공구의 축선방향으로 지령값에 근거하는 거리만큼 이동시켜 가공하는 프린트기판 가공기로서,상기 스핀들의 운전시간과 상기 스핀들에 유지된 공구 선단의 축선방향 변위량간의 관계를 미리 상기 스핀들의 회전수마다 기억시킨 기억장치와, 연산장치와, 타이머를 설치하며,가공이 개시되었을 경우에는, 가공을 하기 위해 설정된 상기 스핀들의 회전수와 상기 타이머에 의해 계측된 가공개시 후의 경과시간에 기초하여, 상기 공구의 절삭량을 미리 구해 둔 상기 변위량만큼 보정하는 것을 특징으로 하는 프린트기판 가공기.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006262443A JP4311686B2 (ja) | 2006-09-27 | 2006-09-27 | プリント基板の加工方法 |
| JPJP-P-2006-00262443 | 2006-09-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080028761A true KR20080028761A (ko) | 2008-04-01 |
| KR101420259B1 KR101420259B1 (ko) | 2014-07-16 |
Family
ID=39134629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020070083239A Active KR101420259B1 (ko) | 2006-09-27 | 2007-08-20 | 프린트기판의 가공방법 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4311686B2 (ko) |
| KR (1) | KR101420259B1 (ko) |
| CN (1) | CN101152698B (ko) |
| DE (1) | DE102007039768B4 (ko) |
| TW (1) | TWI411492B (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114245576A (zh) * | 2021-11-17 | 2022-03-25 | 南京晟通信息技术有限公司 | 一种基于Mark点对PCB分板程序的轨迹校正方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012071404A (ja) * | 2010-09-29 | 2012-04-12 | Howa Mach Ltd | 工作機械の熱変位補正方法及び工作機械 |
| JP4927985B1 (ja) * | 2010-11-22 | 2012-05-09 | ファナック株式会社 | 工作機械のテーブル又は工具を移動させる互いに直交した少なくとも二つの送り軸を有するサーボモータの駆動制御装置 |
| JP6444717B2 (ja) * | 2014-12-12 | 2018-12-26 | Towa株式会社 | 切断装置及び切断方法 |
| JP6235453B2 (ja) * | 2014-12-24 | 2017-11-22 | Towa株式会社 | 切断装置及び切断方法 |
| CN115781798A (zh) * | 2022-12-06 | 2023-03-14 | 苏州维嘉科技股份有限公司 | 电路板加工设备及其控制方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0623647A (ja) | 1992-07-06 | 1994-02-01 | Hitachi Seiko Ltd | プリント基板穴明機 |
| JP3418453B2 (ja) | 1994-06-06 | 2003-06-23 | 日立ビアメカニクス株式会社 | プリント基板加工機における主軸ユニットの冷却装置 |
| JP3792266B2 (ja) | 1994-06-16 | 2006-07-05 | 森精機興産株式会社 | 工作機械の熱変位補正方法及びその装置 |
| JPH0970739A (ja) * | 1995-09-08 | 1997-03-18 | Mitsui Seiki Kogyo Co Ltd | ダイナミック熱変位補正方法 |
| JP3783260B2 (ja) * | 1995-12-19 | 2006-06-07 | イビデン株式会社 | 多層プリント配線板のスルーホール穴明け機 |
| JP3711629B2 (ja) * | 1996-05-30 | 2005-11-02 | 日立ビアメカニクス株式会社 | 座ぐり加工方法 |
| JP3413068B2 (ja) | 1997-08-19 | 2003-06-03 | オークマ株式会社 | 工作機械の熱変位推定方法 |
| US6030154A (en) * | 1998-06-19 | 2000-02-29 | International Business Machines Corporation | Minimum error algorithm/program |
| JP2001062677A (ja) * | 1999-08-24 | 2001-03-13 | Canon Inc | 工作機械における加工方法及び装置 |
| JP3805945B2 (ja) * | 1999-10-15 | 2006-08-09 | 株式会社ムラキ | 基準穴穴開け機 |
| CN1500234A (zh) * | 2001-01-09 | 2004-05-26 | Զ���� | 增量步进钻孔系统和方法 |
| JP4080181B2 (ja) * | 2001-06-22 | 2008-04-23 | 日立ビアメカニクス株式会社 | 加工装置およびプリント基板加工機 |
| JP2004090199A (ja) * | 2002-09-03 | 2004-03-25 | Toshiba Mach Co Ltd | 加工機の回転工具接触検知装置、その回転工具接触検知装置を使用した加工機の回転工具補正装置、加工機のnc装置、加工機の回転工具接触検知装置を使用した加工機の回転工具位置補正方法 |
| JP4554460B2 (ja) * | 2005-07-22 | 2010-09-29 | 日立ビアメカニクス株式会社 | 穴明け加工方法 |
| JP5138273B2 (ja) * | 2007-05-24 | 2013-02-06 | 日立ビアメカニクス株式会社 | プリント基板加工機 |
-
2006
- 2006-09-27 JP JP2006262443A patent/JP4311686B2/ja active Active
-
2007
- 2007-08-09 TW TW096129359A patent/TWI411492B/zh active
- 2007-08-20 KR KR1020070083239A patent/KR101420259B1/ko active Active
- 2007-08-21 CN CN2007101452877A patent/CN101152698B/zh active Active
- 2007-08-22 DE DE102007039768.4A patent/DE102007039768B4/de active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114245576A (zh) * | 2021-11-17 | 2022-03-25 | 南京晟通信息技术有限公司 | 一种基于Mark点对PCB分板程序的轨迹校正方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102007039768A1 (de) | 2008-04-03 |
| TWI411492B (zh) | 2013-10-11 |
| CN101152698B (zh) | 2012-06-06 |
| KR101420259B1 (ko) | 2014-07-16 |
| CN101152698A (zh) | 2008-04-02 |
| TW200821085A (en) | 2008-05-16 |
| JP4311686B2 (ja) | 2009-08-12 |
| DE102007039768B4 (de) | 2022-03-31 |
| JP2008080434A (ja) | 2008-04-10 |
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