KR20070029993A - Semiconductor module test facility with individual heating means - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor module test facility having individual heating means, and to test and apply high temperature heat to only a semiconductor module in a high temperature test of the semiconductor module. The present invention comprises a motherboard provided with a socket, and heating means for wrapping the semiconductor module mounted on the socket and heating the semiconductor module individually, wherein the heating means has a rectangular parallelepiped shape in which the semiconductor module is received. And a heating unit comprising a ceramic heater into which a heating wire for heat generation is inserted, and a control unit for controlling the temperature and the heating time of the heating unit.

According to this, since the semiconductor module is accommodated in the heating unit and heated individually, the heating temperature is uniformly supplied to the various semiconductor devices, and thus the reliability of the test is increased. In addition, it is possible to prevent the motherboard or peripheral devices from being damaged by the heated heat.

Description

TEST EQUIPMENTS FOR SEMICONDUCTOR MODULE WITH INDEPENDENT HEATING MEANS}

1 is a perspective view schematically showing a semiconductor module test fixture having individual heating means in accordance with an embodiment of the present invention;

2 is a partial cross-sectional view showing a cross section taken along the line AA ′ of FIG. 1.

3 is a view schematically showing a heating unit according to an embodiment of the present invention.

4 is a view showing another embodiment of a heating unit according to the present invention.

5 is a perspective view schematically showing a semiconductor module test fixture having individual heating means in accordance with another embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

100, 300: semiconductor module test equipment 110: semiconductor module

111 semiconductor element 112 memory element

113: special logic element 120: motherboard

121: Socket 130: Table

200, 400: individual heating means 210, 410: heating part

211: accommodation unit 220, 420: control unit

212: heating wire 213: first heating wire

214: second heating wire 214: third heating wire

230: transfer means

The present invention relates to a mounting test apparatus for a semiconductor module, and more particularly, to a semiconductor module test facility having individual heating means capable of individually applying and controlling high temperature heat only to a semiconductor module during a high temperature test.

The semiconductor module generally refers to a structure in which a plurality of semiconductor devices and other electronic devices are mounted on one substrate to form an independent circuit. The semiconductor module is tested in various environments to determine whether there is an abnormality, and a process of mounting a semiconductor module on a motherboard used by a real consumer and testing it is called a mounting test process.

During such a mounting test process, a high temperature test is conducted to test whether the semiconductor module functions normally even under extreme temperature conditions. For high temperature test, semiconductor modules are mounted on a motherboard and transferred into a heating chamber, and the test is performed under a predetermined temperature condition in a sealed heating chamber. An example of such a heating chamber is disclosed in Korean Patent Laid-Open Publication No. 2004-. 06309 and the like.

According to this, the conventional heating chamber mainly uses a method of blowing air by using a fan after heating the air using a heater to form a temperature condition suitable for the test.

However, the conventional heating method forms the same temperature condition not only for the semiconductor module but also for peripheral devices such as a motherboard on which the semiconductor module is mounted and a graphic card mounted thereon. Therefore, when the temperature of the heating chamber is formed to be suitable for the test temperature of the semiconductor module, a temperature condition is formed higher than a threshold temperature at which the peripheral devices can operate, thereby causing a problem in that the peripheral devices are broken.

In addition, the temperature near the heater is high because the heat is supplied smoothly, but the temperature in the heating chamber is uniformly distributed. There is no problem.

Therefore, an object of the present invention is to solve the problems of the prior art as described above, when testing the semiconductor module in a high temperature conditions, the individual that can apply and control the high temperature heat only to the semiconductor module independently of the peripheral devices It is to provide a semiconductor module test facility having heating means.

The semiconductor module test facility having the individual heating means of the present invention for achieving the above object is to test the semiconductor module mounted with a plurality of semiconductor elements mounted on the motherboard, the plurality of sockets in which the semiconductor module is mounted in parallel Motherboard, which is individually wrapped around the semiconductor module mounted in a particular socket of the socket and includes a heating means for heating the semiconductor module, the heating means is made of a ceramic heater with a heating wire inserted therein, surrounding the semiconductor module And a heating unit for heating the semiconductor elements, and a control unit connected to the heating unit to control the temperature and the heating time of the heating unit.

In the present invention, a plurality of hot wires may be independently disposed at portions facing the semiconductor devices so as to correspond to the threshold temperatures of the semiconductor devices, and the plurality of hot wires may be individually controlled by being connected to the controller. In addition, the hot wire may be disposed at different densities on the portions facing the semiconductor devices so as to correspond to the threshold temperatures of the semiconductor devices.

In this case, it is preferable that the heating portion has a rectangular parallelepiped shape for accommodating the semiconductor module therein and that the lower surface is open to accommodate the semiconductor module mounted on the socket through the lower surface. In this case, the heating means may further include a conveying means fastened to the upper surface of the heating part to move the heating part freely in the x-axis, y-axis, and z-axis directions.

In addition, in the present invention, the heating unit has a rectangular parallelepiped shape for accommodating the semiconductor module therein, the lower surface is open and is fastened to the motherboard so that a specific socket is inserted into the lower surface, and the upper surface is open so that the semiconductor module is connected to the motherboard through the upper surface. I can attach it.

In the present invention, the heating unit is preferably any one of the surfaces facing the semiconductor elements in contact with the semiconductor module or spaced apart by 1 mm or less.

In addition, in this invention, it is preferable that more than one heating part is provided.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In describing the embodiments of the present invention, components having substantially the same configuration and function are given the same reference numerals, and redundant descriptions will be omitted, and the description will be given based on the components modified according to the embodiments. I'll do it.

1 is a perspective view schematically showing a semiconductor module test facility having individual heating means according to an embodiment of the present invention, and FIG. 2 is a partial cross-sectional view showing a cross section taken along the line AA ′ of FIG. 1.

1 and 2, the semiconductor module test fixture 100 of the present embodiment includes a motherboard 120, a table 130, and a heating means 200.

The motherboard 120 is a place where the test of the semiconductor module 110 is actually performed, and a plurality of sockets 121 in which the semiconductor module 110 is mounted is installed in parallel on the upper surface. In this embodiment, the sockets 121 are located on the upper surface of the motherboard 120, and other peripheral devices (for example, a CPU, a graphics card, etc.) are reverse boards installed on the lower surface of the motherboard 120. To illustrate. However, it is also possible to use a front board in which both the sockets 121 and other peripheral devices are formed on the upper surface.

The table 130 supports and fixes the motherboard 120 at the bottom of the motherboard 120 to prevent the motherboard 120 from moving during the test.

The heating means 200 includes a heating unit 210, a control unit 220 and a transfer means 230.

The heating unit 210 is formed in a rectangular parallelepiped shape having an accommodating part 211 capable of accommodating the semiconductor module 110 mounted in the socket 121 of the motherboard 120 therein. In addition, the heating unit 210 is a heating wire 212 is inserted into a portion facing the semiconductor element 111 to heat the semiconductor module 110. Therefore, as the heating unit 210, it is preferable to use a ceramic heater made of a material to block the discharge and leakage to the outside.

In addition, the heating unit 210 has an open lower surface so that the semiconductor module 110 mounted on the socket 121 is accommodated through the lower surface, and the heating wire 212 for heating it is connected to the outside and applied from the outside. It generates heat as the current flows. In addition, the heating unit 210 has a minimum spacing (for example, a spacing of 1 mm or less) between the semiconductor elements 111 of the semiconductor module 110 and the surfaces of the heating unit 210 corresponding thereto to effectively transfer heat. It is installed to achieve, it is possible to be installed to contact each other.

Here, although the heating part 210 is shown to accommodate the semiconductor module 110 together with the semiconductor module 110 in the accommodating part 211 up to the socket 121 of the motherboard 120, the semiconductor module ( Only 110 is included in the accommodating part 211, and the semiconductor elements 111 and the heating part 210 may be formed to contact each other.

The controller 220 is connected to the heating unit 210 to control the temperature and heating time of the heating unit 210, and the like. At this time, the temperature, heating time and the like are preset by the operator.

The transfer means 230 is installed at the upper portion of the motherboard 120, is fastened to the upper surface of the heating unit 210 to move the heating unit 210 freely in the x-axis, y-axis, z-axis direction. Therefore, even if the semiconductor module 110 is mounted in any socket 121 of the plurality of sockets 121 installed on the motherboard 120, the heating module 210 is moved through the transfer means 230 to move the semiconductor module. 110 may be heated. In addition, although one heating unit 210 is illustrated in FIG. 1, a plurality of heating units 210 may be installed to heat the plurality of semiconductor modules 110 at the same time.

The operation of the semiconductor module test facility 100 having the individual heating means 200 configured as described above is as follows.

First, when the semiconductor module 110 is mounted on the motherboard 120 socket 121, the operator controls the transfer means 230 to move the heating unit 210 of the heating means 200 to the upper portion of the semiconductor module 110. Move to. Thereafter, the heating unit 210 is lowered to position the semiconductor module 110 in the accommodation unit 211.

When the semiconductor module 110 is located in the accommodating part 211, the controller 220 heats the heating wire 212 inserted into the heating part 210 based on a temperature and a heating time set by a worker in advance.

Accordingly, the surface temperature of the semiconductor devices 111 of the semiconductor module 110 accommodated in the accommodating part 211 is increased by heat transmitted from the heating wire 212. When the surface temperature of the semiconductor devices 111 rises to a target temperature (eg, 82.5 ± 2.5 ° C.), the semiconductor module test facility 100 may test the semiconductor module 110. At this time, the measurement of the target temperature can be detected by installing a sensor (not shown) inside the heating unit 210, or using a variety of methods such as calculating the temperature rise value according to the heating time through several pre-tests. Can be.

When the test of the semiconductor module 110 is completed, the worker raises the heating unit 210 through the transfer means 230 and separates the tested semiconductor module 110 from the socket 121.

Thereafter, the new semiconductor module 110 is mounted in the socket 121, and the test of the semiconductor module 110 is continued by repeating the above-described method.

Here, the arrangement of the heating wire 212 inserted into the heating unit 210 may be variously modified according to the characteristics of the semiconductor module 110 to be tested, which will be described below with reference to the drawings.

3 is a view schematically showing a heating unit according to an embodiment of the present invention.

Referring to FIG. 3, the heating unit 210 according to the present exemplary embodiment includes a heating wire divided into a first heating wire 213, a second heating wire 214, and a third heating wire 215. The heating wires 213, 214, and 215 are connected to the control unit 220, respectively, and the control unit 220 generates heat to the same temperature for each of the heating wires 213, 214, and 215, or to different temperatures. Can be.

In general, the semiconductor devices 111 mounted on the semiconductor module 110 are mostly composed of the memory devices 112. However, in the case of the recently developed semiconductor module 111, a special logic element 113 having a special function is mounted in addition to the memory element 112. An example of such a semiconductor module 110 is illustrated in FIG. 3. It is. The semiconductor module 110 illustrated in FIG. 3 represents a fully buffered (FB) -DIMM, and memory devices 112 are mounted on both sides of the module substrate, and a memory device 112 and a memory controller (at the center of one surface) are shown. And a special logic element (e.g., AMB; Advanced Memory Buffer; 113) that acts as a buffer between them.

The special logic element 113 generates more heat than the memory element 112 during operation. Accordingly, when the heating unit 210 applies high temperature heat in the same manner as the memory device 112, the heating unit 210 may have a higher surface temperature (eg, about 100 ° C.) than the memory device 112, and may be damaged. .

To this end, the heating unit 210 of the present exemplary embodiment includes a plurality of heating wires 213, 214, and 215 to correspond to the positions of the semiconductor elements 111 mounted on the semiconductor module 110, and the plurality of heating wires 213. , 214, 215 are connected to the control unit 220, respectively. Accordingly, the controller 220 controls the memory element 112 to maintain a target temperature by using the first and third heating wires 213 and 215 installed to correspond to the memory element 112, and the special logic element 113. The special logic element 113 is controlled to maintain the temperature below the threshold temperature by using the second heating wire 214 that is installed to correspond to the &lt; RTI ID = 0.0 &gt;

4 is a view showing another embodiment of the heating unit according to the present invention. Referring to this, the heating wire 212 of the heating unit 210 is formed of one heating wire 212, the insertion of the heating wire 212 The density is formed differently according to the characteristics of the semiconductor elements 111 corresponding to the heating wire 212 when the semiconductor module 110 is inserted into the heating unit 210.

That is, the hot wire 212 is formed at a high density at a position corresponding to the memory element 112, and the hot wire 212 is formed at a low density at a position corresponding to the special logic element 113. Therefore, when the temperature is applied by the heating unit 210, relatively less heat is applied to the special logic element 113 than the memory element 112. Therefore, it is possible to prevent the semiconductor elements 111 from being damaged by high temperature heat.

Meanwhile, in the present embodiments, the heating means according to the present invention has been exemplified to be applied to the FBDIMM, but is not limited thereto. In addition, the heating means according to the present invention may be applied to various semiconductor modules 110 such as NGDIMM, UDIMM, and RDIMM.

5 is a perspective view schematically showing a semiconductor module test fixture having individual heating means according to another embodiment of the present invention.

The heating means 400 according to the present embodiment has a shape similar to the above-described embodiment, and the heating part 410 is fastened on the motherboard 120 without being moved by the conveying means (230 of FIG. 1). It makes a difference.

The heating unit 410 is fastened on the motherboard 120 so that the lower surface is opened and the socket 121 is inserted into the lower surface. In this case, the upper surface of the heating unit 410 is open, and the semiconductor module 110 may be mounted on the socket 121 through the upper surface.

The semiconductor module test facility 300 according to the present exemplary embodiment having such a configuration heats the semiconductor devices immediately without adjusting the position of the heating unit 410 after mounting the semiconductor module 110 to the socket 121, and the test is completed. Even when the semiconductor module 110 can be replaced quickly.

The heating unit 410 of this embodiment has been illustrated that the heating unit 410 is installed in all of the plurality of sockets 121 installed on the motherboard 120, but is not limited to this, one socket 121 or a specific It is also possible that the heating unit 410 is installed only in some sockets 121.

On the other hand, the semiconductor module test facility having individual heating means according to the present invention is not limited to the embodiments, various modifications are possible by those skilled in the art within the technical idea of the present invention. For example, the heating unit is formed in a rectangular parallelepiped shape, but is not limited thereto. The heating unit may be variously applied as long as it can accommodate a semiconductor module.

In addition, in the present embodiment, a facility for mounting and testing a semiconductor module is exemplified, but may be applied to all facilities for high temperature test. In addition, the various elements and regions in the drawings are schematically drawn

 will be. Accordingly, the present invention is not limited by the relative size or spacing drawn in the accompanying drawings.

As described above, the semiconductor module test facility having the individual heating means of the present invention provides individual heating means capable of individually applying high-temperature heat to the semiconductor module during the mounting test of the semiconductor module.

Therefore, it is possible to prevent the motherboard or peripheral devices from being damaged by the heated heat. In addition, since the heating temperature can be uniformly supplied to various semiconductor devices mounted in the semiconductor module, the test reliability is improved.

Claims (8)

A test apparatus for testing a semiconductor module mounted with a plurality of semiconductor devices mounted on a motherboard, A motherboard in which a plurality of sockets on which the semiconductor module is mounted are installed in parallel; And heating means for individually wrapping a circumference of the semiconductor module mounted in a specific one of the sockets and heating the semiconductor module. The heating means, A heating unit formed of a ceramic heater having a heating wire inserted therein and surrounding the semiconductor module to heat the semiconductor elements; And a control unit connected to the heating unit for controlling the temperature and the heating time of the heating unit. The method of claim 1, wherein a plurality of the heating wires are independently disposed at portions facing the semiconductor devices so as to correspond to the threshold temperatures of the semiconductor devices, and the plurality of heating wires are connected to the controller and individually controlled. A semiconductor module test fixture having individual heating means. 2. The semiconductor module test fixture of claim 1, wherein the hot wires are disposed at different densities on the portions facing the semiconductor elements so as to correspond to the threshold temperatures of the semiconductor elements. The method of claim 1, wherein the heating unit, And a rectangular parallelepiped shape for accommodating the semiconductor module therein, the bottom surface of which is open so that the semiconductor module mounted to the socket is accommodated through the bottom surface of the semiconductor module test facility. The method of claim 4, wherein the heating means, And a transfer means fastened to the upper surface of the heating part to move the heating part freely in the x-axis, y-axis, and z-axis directions. The method of claim 1, wherein the heating unit, A rectangular parallelepiped shape for accommodating the semiconductor module therein, the bottom surface of which is opened and fastened to the motherboard so that the specific socket is inserted into the bottom surface of the semiconductor module, and the top surface of which is opened to mount the semiconductor module to the motherboard through the top surface A semiconductor module test facility having individual heating means. The individual heating according to any one of claims 1 to 6, wherein the heating portion is any one of surfaces facing the semiconductor elements in contact with the semiconductor module or spaced apart by 1 mm or less. Semiconductor module test fixture with means. 7. The semiconductor module test fixture according to any one of claims 1 to 6, wherein a plurality of said heating units are provided.

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