KR20040040101A - CMP Operating a Dresser with a Sweep Motor - Google Patents

Abstract

PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus having a sweep motor for driving a dresser is provided to effectively remove particles from a pad. CONSTITUTION: A CMP apparatus having a sweep motor for driving a dresser is provided with a turntable(11) for carrying out a linear and rotational motion to a predetermined direction, and a pad(13) attached on the turntable. The CMP apparatus further includes a dresser(17) for removing and exhausting the slurry residues existing at the pad while rotating to a predetermined direction in a cohesive state with the pad and a sweep motor(21) for sweeping the dresser to a predetermined direction on a plane surface. Preferably, the sweep motor is used for linearly moving the dresser to an arbitrary direction on the pad.

Description

Chemical mechanical polishing device with sweep motor for dresser driving {CMP Operating a Dresser with a Sweep Motor}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mechanical chemical polishing apparatus (CMP), and more particularly, to a dresser driving apparatus of a polishing apparatus capable of effectively discharging and removing residues such as slurry in a pad that may occur after polishing. will be.

In the manufacture of semiconductor products such as integrated circuits, the degree of integration of circuits has increased due to the demand for increasing the capacity of integrated circuits, and with this, the insulating films between the layers of the circuits have also become thinner. According to one example of a semiconductor manufacturing process that satisfies this demand, a wiring groove is formed on a silicon substrate according to a wiring pattern, and a conductive material layer such as aluminum is formed on the entire surface of the silicon substrate on which the wiring groove is formed. The wiring pattern is formed by grinding the conductive material layer so that the conductive material remains only in the wiring groove. When the multilayer wirings are stacked, this process is repeated. Thus, a chemical mechanical polishing apparatus (CMP) is used to grind an application layer such as a conductive material layer to form a constant thickness.

1 is a perspective view schematically showing a dresser driving device of a conventional chemical mechanical polishing device. As shown in Fig. 1, a pad 13, which is a polishing mechanism, is attached to the rotatable turntable 11. On the surface of the pad 13 there is a hair composed of a plurality of micro holes that can contain slurry, which is an abrasive. On the upper side of the turntable 11 to which the pad 13 is attached, a wafer support part for adsorbing the wafer to move the upper portion of the turntable 11 and pushing and rotating the wafer while the adsorbed wafer is polished by the pad 13 ( 15) is provided. In addition, on the other side of the upper side of the turntable 11 to which the pad 13 is attached, a slurry or the like remaining on the pad 13 is discharged while pushing and rotating after polishing the wafer, and worn and flattened when polishing the wafer. A dresser 17 is provided to planarize the broken pad 3. In addition, a slurry supply line 19 for supplying a slurry used as an abrasive when polishing the wafer while the wafer support 15 and the turntable 11 rotates is provided.

In operation of a general chemical mechanical polishing apparatus having such a configuration, the wafer supporting portion 15 moves on the turntable 11 after absorbing the wafer. The slurry is supplied through the slurry supply line 19 while rotating the turntable 11. The supplied slurry is inserted into a plurality of micro holes formed in the pad 13. Then, the wafer support 15 is pushed and rotated, and the wafer is polished by the slurry in the pad 13 rotating in the opposite direction.

When polishing is completed and the wafer support part 15 is returned to its original position, the dresser 17 is moved to the upper part of the turntable 11, and pure ion water is supplied while the turntable 11 is rotated. The slurry precipitated in the microholes of the pad 13 is discharged while pushing and rotating the dresser 17. After dressing is complete, the dresser 17 is returned to its original position.

In the conventional chemical mechanical polishing apparatus, the dresser 17 rotates in a constant direction, and the lower pad 13 rotates in a direction opposite to the dresser rotation direction, and moves in a predetermined direction along the plane. According to the conventional dresser operation which performs such an operation, it is not effective to remove the slurry residue, the particle, etc. which are stuck in the pad | dye hair while making use of the pad | dye hair.

An object of the present invention is to provide a dresser drive device capable of efficiently removing slurry residues or particles stuck to a pad wool while keeping the pad hair in the dressing process of the dresser.

1 is a perspective view of a conventional chemical mechanical polishing apparatus (CMP), and

2 is a perspective view of a CMP having a dresser drive with a sweep motor according to the present invention.

Explanation of symbols on the main parts of the drawing

11: turntable 13: pad

15: wafer support 17: dresser

19: slurry supply line 21: sweep motor

In order to achieve the above object, the present invention provides a CMP assembly having a sweep motor for sweeping the dresser to simultaneously rotate and sweep to improve the function of the dresser.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a perspective view schematically showing a dresser drive device having a sweep motor according to the present invention. As shown in Fig. 2, the dresser driving apparatus of the present invention includes a turntable 11, a pad 13, a dresser 17, a sweep motor 21 and the like.

The pad 13 is positioned on the turntable 11, and the wafer support 15 and the dresser 17 which are movable on the turntable 11 are provided. In addition, the upper portion of the turntable 11 is provided with a slurry supply line 19 for supplying a slurry inserted into the microhole of the pad 13.

On the other hand, the dresser 17 movable to the upper portion of the ten table 11 is in close contact with the pad 13 and rotates in a predetermined direction, the dresser 17 is driven by the sweep motor 21 provided on one side of the dresser 17. Sweep in the direction of the arrow on the turntable (11).

In view of the action of the dresser drive device having such a structure, a plurality of micro holes are formed on the surface of the pad 13 attached to the rotatable turntable 11, and these micro holes are supplied from the slurry supply line 19. Abrasive slurry is inserted. Thereafter, pushing and rotation of the wafer support 15 of the abrasive and rotation and movement of the pad on the turntable 11 are performed. At this time, the wafer is polished while the slurry inserted into the microhole of the pad and the wafer supported by the wafer support 15 are rubbed.

When polishing of the wafer is completed, the wafer support 15 is removed from the tentable 11, and the dresser 17 moves on the turntable 11 to bring the bottom surface of the dresser 17 into close contact with the pad 13. Then, the remaining slurry residues and the like on the pad 13 are discharged by the rotation and movement of the turntable 11 and the rotation of the dresser 17 to recover the pad flatness broken by wafer polishing. At this time, while the sweep motor 21 operates simultaneously, the dresser 17 sweeps. The sweep direction of the dresser 17 by the sweep motor 21 may be linearly moved in the direction of the arrow of FIG. 2, but is not limited thereto and may be swept in multiple directions. By sweeping the dresser 17 in this manner, the surface of the pad 13 can be used to the maximum, and the service life of the pad 13 can be increased.

According to the dresser drive device having the above structure and action, it is possible to efficiently remove slurry residues or particles stuck to the pad wool while keeping the pad hair in the dressing process of the CMP.

Claims (3)

A turntable for performing planar motion and rotational motion in a predetermined direction; A pad attached to an upper surface of the turntable; A dresser which is in close contact with the pad and rotates in a predetermined direction to discharge and remove slurry residues remaining on the pad; And And a sweep motor for sweeping the dresser in a predetermined direction on a plane. The sweep motor of claim 1, wherein And a sweep motor for driving a dresser, wherein the dresser moves linearly on the pad. The sweep motor of claim 1, wherein A chemical mechanical polishing apparatus having a dresser driving sweep motor, wherein the dresser is moved in an arbitrary direction on the pad.