KR20040034744A - Fabrication method for Liquid crystal display - Google Patents

Abstract

According to an aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device comprising the steps of: preparing a first substrate having a predetermined electrode pattern and a second substrate having a connection terminal corresponding to the electrode pattern; Depositing a conductive film on one of the two substrates; Patterning the conductive film to form a conductive region electrically connecting the electrode pattern of the first substrate and the connection terminal of the second substrate; Characterized in that it comprises a.

Here, a seal region for joining the two substrates may be further formed in a predetermined region of another substrate corresponding to the inner region of the conductive region or the conductive region. At this time, the seal region is characterized in that it is formed with the same line width.

As described above, the present invention has the advantage that the actual image display area can be enlarged by the reduced area by reducing the width of the conductive area formed around the outer side of the substrate.

Description

Fabrication method for liquid crystal display

The present invention relates to a method for manufacturing a liquid crystal display device, and more particularly, to a method for manufacturing a liquid crystal display device suitable for securing a wider image display area at the same substrate size.

The liquid crystal display includes a first substrate on which a color filter and a common electrode are formed, a second substrate facing the first substrate, a thin film transistor (TFT) and an array of pixel electrodes, and a liquid crystal material injected between both substrates. Including a device, a display device using the light switching properties of the liquid crystal material injected therein. The liquid crystal display device has been in the spotlight as the next generation display device to replace the CRT monitor because of its low power consumption and light weight.

The substrate bonding process, which is one of manufacturing processes of the liquid crystal display, is bonded to form a predetermined cell gap (hereinafter, referred to as a 'gap gap') between the first substrate and the second substrate, and injects liquid crystal into the inner space. In this way, the first and second substrates are electrically conductive. In this process, a sealant, a gap agent, a conductive agent and the like are used.

The sealant is a thermosetting resin material such as an epoxy resin, and is formed in a line shape (hereinafter, referred to as 'seal') around the periphery of the first or second substrate to bond the two substrates together. In addition to the role, the foreign material is prevented from entering the liquid crystal layer injected into the gap between the two substrates.

The gap agent is made of a material such as a plastic ball or glass fiber, which is located in the inner region of the seal line to maintain a constant gap between the two bonded substrates.

The conductive agent is a conductive material such as nickel or silver, and is electrically connected to a connection terminal of the second substrate, the pad pattern drawn out of the common electrode of the first substrate and positioned at an outer region of the seal line.

1 is a view showing a seal region and a conductive region formed on a conventional liquid crystal display substrate.

Referring to FIG. 1, a sealant is printed on an edge of the substrate to form a seal region 120, and a conductive agent is coated on an outer region of the seal region to form a conductive region 110.

In this case, the seal region 120 and the conductive region 110 should not overlap each other, because when the conductive agent overlaps the seal region 120, the adhesiveness is weakened. As a result, bending of the seal line occurs in the conductive region 110. As a result, the image display region Pa actually used becomes smaller than the substrate area.

2 is a view showing a seal region and a conductive region formed on another conventional liquid crystal display substrate.

Referring to FIG. 2, in order to avoid sacrificing the image display area Pa ′, the substrate is formed by reducing the line width of the seal line at the portion where the conductive area 210 is located. As a result, when the substrate is bonded, the substrate adhesion force varies depending on the portion with and without the conductive region 210. This difference in substrate adhesion makes it difficult to secure the gap between the two substrates. If the gap is not constant, the transmittance of light passing through the portion is changed, resulting in uniformity defects indicating spatially uneven brightness. In addition, the difference in the adhesive strength of the substrate may cause an unstable electrical connection between the two substrates by the conductive region 210, resulting in a flicker phenomenon in which an image of the screen is shaken.

As such, in the conventional liquid crystal display, the reason for forming the seal regions 120 and 220 as shown in FIG. 1 or FIG. 2 is due to a technical problem. The width (or thickness) of the conductive regions 110 and 210 may be reduced. There is a limit to the reduction. As is well known, the conduction regions 110 and 210 are formed by a dotting method that imprints a conduction agent on a substrate or a printing method that prints a predetermined pattern. The conduction region formed by such a mechanical method is generally 300. It had a width of ˜500 μm, and there was a limit to reducing it below.

As described above, the conventional liquid crystal display device has a large conduction area due to technical limitations. As a result, the gap of uniformity and flicker of the gap is reduced when the actual image display area is reduced or when the substrate is bonded. There was a problem that caused the phenomenon.

SUMMARY OF THE INVENTION The present invention was created to solve the above problems, and conducts a conductive film pattern formed by depositing a conductive film on a substrate for a liquid crystal display device and patterning the conductive film by an extremely fine etching technique such as a photolithography method. It is an object of the present invention to provide a method of manufacturing a liquid crystal display device capable of reducing the width of the conductive region by forming a region and enlarging the image display region by the reduced region.

1 is a view showing a seal region and a conductive region formed in a conventional liquid crystal display substrate.

2 is a view showing a seal region and a conductive region formed on another conventional liquid crystal display substrate.

3 is a view showing a substrate for a liquid crystal display device according to an embodiment of the present invention.

4 is a cross-sectional view illustrating II ′ of FIG. 3.

5A to 5F illustrate a manufacturing process of a substrate for a liquid crystal display according to an exemplary embodiment of the present invention.

6 is a view showing a panel for a liquid crystal display according to an embodiment of the present invention.

<Explanation of symbols for main parts of the drawings>

110, 210 ... conduction area 120, 220 ... seal area

300, 500 ... 310 substrate ... Seal line

320 ... board conduction part 330, 520 ... shield

330a, 521.Contact hole 501.Black matrix (BM)

502 color filter 510 common electrode (ITO)

530a ... Conductor 530b ... Conductor Pattern

540a ... photoresist film 540b ... photoresist pattern

600 substrate 610 pixel electrode

620 ... Connector 630 ... Spacer

Method of manufacturing a liquid crystal display device according to the present invention for achieving the above object,

Providing a first substrate having a predetermined electrode pattern and a second substrate having a connection terminal corresponding to the electrode pattern;

Depositing a conductive film on one of the two substrates;

Patterning the conductive film to form a conductive region electrically connecting the electrode pattern of the first substrate and the connection terminal of the second substrate; Characterized in that it comprises a.

Here, one end of the connection terminal of the second substrate is electrically connected to the power supply unit, and the other end is electrically connected to the conduction area.

Further, a seal region for joining the two substrates may be further formed in a predetermined region of another substrate corresponding to the inner region of the conductive region or the conductive region.

In particular, the seal area is formed with the same line width, the seal area is characterized in that formed in a straight line without bending.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

3 is a view showing a substrate for a liquid crystal display according to an exemplary embodiment of the present invention, and FIG. 4 is a cross-sectional view illustrating II ′ of FIG. 3.

Referring to FIG. 3, the substrate 300 has a seal line 310 formed along an outer portion thereof to define a seal region, and a plurality of substrate conduction portions 320 are patterned outside the seal region to form a conductive region. Define. A predetermined electrode pattern (not shown) is formed inside the seal area to define the image display area A. FIG.

Meanwhile, referring to FIG. 4, one end of the substrate conducting portion 320a is electrically connected to the electrode pattern of the image display area A through the contact hole 330a, and the other end corresponds to the substrate 300. And is electrically connected to a connection terminal of another substrate (not shown) bonded together.

The seal region bonds the substrate 300 and another substrate (not shown) corresponding thereto, and prevents foreign substances from flowing into the liquid crystal layer injected between the two bonded substrates. The seal region may be formed on another substrate corresponding thereto instead of the substrate 300.

Next, a process of manufacturing the liquid crystal display substrate will be described with reference to FIGS. 5A to 5E. 5A to 5E are views illustrating a manufacturing process of a substrate for a liquid crystal display according to an exemplary embodiment of the present invention.

First, when an insulating substrate 500 such as glass or plastic is provided, a chromium film is deposited on a predetermined area of the substrate 500 and then patterned to form a black matrix 501, and R, G, and B color filters are formed thereon. After forming 502, a common conductive material 510 is formed by depositing a transparent conductive material such as indium tin oxide (ITO) (FIG. 5A).

Subsequently, a non-conductive material is deposited on the common electrode 510 formed in the outer region of the black matrix 501 to form a passivation layer 520, and the passivation layer 520 is patterned to form a surface of the common electrode 510. A common electrode contact hole 521 exposing a portion is formed (FIG. 5B).

Subsequently, a conductive material such as copper or aluminum is deposited on the protective film 520 to form a conductive film 530a having a predetermined thickness (FIG. 5C). In this case, the conductive layer 530a is electrically connected to the lower common electrode 510 by the common electrode contact hole 521.

Meanwhile, a portion of the conductive film 530a is left in a predetermined pattern through a patterning process, and the substrate 500 is connected to another substrate to which the conductive film pattern is bonded, and thus, the conductive film 530a. Should be formed thicker than the gap between at least two substrates (usually 4.5um to 5.0um).

Subsequently, the conductive layer 530a is patterned to form a substrate conductive portion. In this case, an ultra-fine etching technique such as photolithography is used, which will be described below.

After forming the photoresist film 540a on the conductive film 530a (FIG. 5D), the photoresist film 540a is exposed with a mask having predetermined pattern information, and the exposed photoresist film and The developer is reacted to form a photoresist pattern 540b having the same pattern information as that of the mask (FIG. 5E).

Subsequently, when the photoresist pattern 540b is used as a mask, the conductive layer 530a is etched and the photoresist pattern 540b formed on the conductive layer 530a is removed. At the position, that is, the position corresponding to the connection terminal of the other substrate to be bonded, the protruding conductive film pattern 530b is left (FIG. 5F), and this pattern is used to form each substrate conducting portion (320 in FIG. 3) according to the present invention. Form. In this case, each of the substrate conducting portions 320 may be configured by combining a plurality of conductive film patterns, and may be configured of only one conductive film pattern 530b protruding as shown in FIG. 5F.

As such, when the conductive layer is patterned to form the substrate conduction portion 530b by using an ultra fine etching technique such as a photolithography method, the width L of the substrate conduction portion 530b defining the conduction region is set to a desired level, for example, 50 to 50. It can be reduced to 100 μm or less.

Thereafter, a seal line is formed to bond the two substrates to an inner region of the conductive region or a predetermined region of another substrate corresponding to the inner region of the conductive region.

At this time, the seal line, as shown in Figure 3, is formed in the same line width, even in a position where the substrate conductive portion 320 is formed in a straight line without bending. Therefore, the nonuniformity of the adhesion force due to the change in line width and the bending of the conventional seal line is improved, thereby reducing the uniformity defect and flicker phenomenon of the shock gap.

6 illustrates a panel for a liquid crystal display according to an exemplary embodiment of the present invention.

Referring to FIG. 6, the substrate 500 on which the conductive region and the seal region are formed is subjected to a known subsequent process such as a gap spreading process, a substrate bonding process, a liquid crystal injection process, and a substrate cutting process. Finished with a panel.

In the above-described embodiment, only the case where the conductive region is formed on the substrate on which the color filters are arranged has been described. However, it will be readily apparent to those skilled in the art that the conductive region can be formed on the substrate on which the TFT array is arranged. There will be. Accordingly, the technical scope of the present invention should be defined by the appended claims.

As described above, the manufacturing method of the liquid crystal display device according to the present invention reduces the width of the conduction area formed around the outside of the seal area so as to electrically connect the two substrates of the liquid crystal display device. It allows for flexible design. As a result, the line width of the seal line formed in the seal area can be made uniform, which can maintain the substrate adhesive force uniformly, which is advantageous for securing the gap. In addition, the flicker phenomenon can be substantially reduced.

In addition, since the seal line may be formed closer to the outermost part of the substrate, the actual image display area formed in the inner region of the seal line may be enlarged than before.

Claims (7)

Providing a first substrate having a predetermined electrode pattern and a second substrate having a connection terminal corresponding to the electrode pattern; Depositing a conductive film on one of the two substrates; Patterning the conductive film to form a conductive region electrically connecting the electrode pattern of the first substrate and the connection terminal of the second substrate; Method of manufacturing a liquid crystal display device comprising a. The method of claim 1, And one end of the connection terminal of the second substrate is electrically connected to the power supply unit, and the other end of the connection terminal is electrically connected to the conductive region. The method of claim 1, The conducting area is a liquid crystal display device characterized in that the width is formed to 50 ~ 100㎛ or less. The method of claim 1, Forming a seal region for bonding the two substrates to an inner region of the conductive region; Method of manufacturing a liquid crystal display device further comprising. The method of claim 1, Forming a seal region for bonding the two substrates to a predetermined region of another substrate corresponding to an inner region of the conductive region; Method of manufacturing a liquid crystal display device further comprising. The method according to claim 4 or 5, And the seal area is formed to have the same line width. The method according to claim 4 or 5, And the seal region is formed in a straight line without bending.