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KR20030060285A - manufacturing method of pilot lamp - Google Patents

manufacturing method of pilot lamp Download PDF

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Publication number
KR20030060285A
KR20030060285A KR1020020000913A KR20020000913A KR20030060285A KR 20030060285 A KR20030060285 A KR 20030060285A KR 1020020000913 A KR1020020000913 A KR 1020020000913A KR 20020000913 A KR20020000913 A KR 20020000913A KR 20030060285 A KR20030060285 A KR 20030060285A
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KR
South Korea
Prior art keywords
led
thin plate
wire
pilot lamp
module
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Ceased
Application number
KR1020020000913A
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Korean (ko)
Inventor
장세희
Original Assignee
(주) 청송상공
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Priority to KR1020020000913A priority Critical patent/KR20030060285A/en
Publication of KR20030060285A publication Critical patent/KR20030060285A/en
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

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Abstract

본 발명은 LED와 와이어를 하나의 칩 LED모듈로 제작하여 PCB 기판에 부착함으로써 온도상승에 의한 열변형을 방지하고, 습기에 의한 들뜸 현상을 방지할 수 있고, 제품 취급시 와이어 접촉의 위험을 배제할 수 있으며, 제품 취급이 간편하고, 칩 마운트에서만 작업이 가능하므로 생산성을 향상할 수 있는 파일럿 램프의 제작방법에 관한 것이다.The present invention prevents heat deformation due to temperature rise, prevents the phenomenon of lifting due to moisture, and eliminates the risk of wire contact when handling the product by attaching the LED and the wire as a single chip LED module to the PCB board. The present invention relates to a method of manufacturing a pilot lamp that can improve productivity because the product can be easily handled and can only be operated in a chip mount.

본 발명은, 소정크기의 전도성 박판을 소정 간격을 두고 설치하고, 상기 일측 박판에 LED를 올려놓고 도전성 접착제로 부착하는 제1 단계; 상기 LED와 타측 박판을 와이어로 본딩하는 제2 단계; 와이어 본딩된 LED와 박판을 에폭시 몰딩하여 모듈화하는 제3 단계; 및 상기 모듈을 PCB 기판의 배선부재에 올려놓고, 상기 모듈의 외부를 도전성 접착제로 부착하는 제4 단계를 포함하는 파일럿 램프의 제작방법을 제공한다.The present invention, the first step of installing a predetermined size of the conductive thin plate at a predetermined interval, put the LED on the one side of the thin plate attached with a conductive adhesive; Bonding the LED and the other thin plate to a wire; A third step of epoxy molding the wire-bonded LED and the thin plate to be modularized; And a fourth step of placing the module on the wiring member of the PCB board and attaching the outside of the module with the conductive adhesive.

Description

파일롯 램프의 제작방법{manufacturing method of pilot lamp}Manufacturing method of pilot lamp

본 발명은 LED 다이오드를 칩 LED로 대체하여 파일럿 램프의 사용중 열 발생에 의한 와이어의 단선을 방지하고, 에폭시 수지의 특성변화에 의한 점등불량을 방지할 수 있는 파일럿 램프의 제작방법에 관한 것이다.The present invention relates to a method for manufacturing a pilot lamp that can replace the LED diode with a chip LED to prevent wire breakage due to heat generation during use of the pilot lamp, and to prevent lighting failure due to the change of the properties of the epoxy resin.

일반적으로, 파일럿 램프는 차량등에 장착되어 연료(fuel), 오일(oil), 공기(air)등의 충전상태나 과열(over heat)상태를 검사할 수 있도록 발광하는 기능을 하는 것으로, 도1a 내지 도1c에 도시된 바와 같이 케이스(1)와, 상기 케이스의 일측 외면에 형성된 베이스(2)와, 상기 케이스(1)에 내장된 PCB(3)와, 상기 PCB(3)에 연결된 리드 핀(4)과, 저항(6)과, 상기 리드핀(4)에 연결되어 발광하는 칩 LED(7)와 상기 리드핀(4)과 칩 LED(7)를 몰딩하는 에폭시(5)로 구성된다.In general, the pilot lamp is mounted on a vehicle and functions to emit light so that the state of charge or overheating of fuel, oil, air, and the like can be inspected. As shown in FIG. 1C, a case 1, a base 2 formed on one outer surface of the case, a PCB 3 embedded in the case 1, and lead pins connected to the PCB 3 ( 4), a resistor 6, and a chip LED 7 connected to the lead pin 4 to emit light, and an epoxy 5 molding the lead pin 4 and the chip LED 7 to emit light.

이러한 파일럿 팸프의 제작방법을 도2a 및 도2b를 참조하여 설명하면 다음과 같다.The fabrication method of the pilot pamp will be described with reference to FIGS. 2A and 2B.

도면에 도시된 바와 같이, PCB 기판의 배선부재에 LED를 올려놓고, 상기 배선부재와 LED 사이를 도전성 접착제로 부착하고, 와어어 본더를 이용하여 상기 LED와 PCB기판상의 다른 배선부재를 골드 와이어(gold wire)로 연결한다. 그 다음에, 점등 치구를 이용하여 와이어 본딩까지 완료된 제품의 품질을 검사하고, 측정이 끝난 양품의 PCB를 케이스에 세트시킨 후, 에폭시 수지로 몰딩처리한다. 다음에 규정의 저항을 부착한 후 베이스와 조립하고, 다시 점등치구를 이용하여 조립이 완료된 제품의 단선을 최종 검사하고 출하한다.As shown in the figure, the LED is placed on the wiring member of the PCB board, and the conductive member is attached between the wiring member and the LED, and the wire and other wiring members on the PCB board are connected to the gold wire using a wire bonder. gold wire). Then, the quality of the finished product until the wire bonding is inspected using the lighting jig, the PCB of the measured good product is set in a case, and then molded with epoxy resin. Next, attach the specified resistance, assemble it with the base, and use the lighting jig again to finally inspect and ship the disconnection of the finished product.

상기와 같은 일련의 제조공정을 통해 제조된 파일럿 램프는 장시간 사용에 따른 온도상승으로 에폭시 수지와 PCB, 골드 와이어간의 특성변화로 점등이 안되는 현상이 발생하고, 습기가 많은 곳에 파일럿 램프가 설치될 경우 PCB와 에폭시간의분리현상이 발생하고, 이로 인하여 와이어의 들뜸현상이 발생하여 부등될 뿐만 아니라, 상기 파일럿 램프의 취급시, 수작업에 의한 조립생산으로 손 또는 핀셋과 같은 치구등으로 인하여 와이어를 건드리는 경우 와이어 접촉에 의한 부등이 발생하는 문제점이 있다.The pilot lamp manufactured through the series of manufacturing processes as described above does not turn on due to changes in the properties between epoxy resin, PCB, and gold wire due to the temperature rise due to prolonged use, and the pilot lamp is installed in a humid place. Separation phenomenon occurs between PCB and epoxy, and this causes not only the lifting of wires but also the inequality, and the handling of the pilot lamps by hand or tweezers such as tweezers, etc. In this case, there is a problem in which inequality occurs due to wire contact.

또한, 상기 파일럿 램프가 소형제품이므로 제품의 취급이 어려워 생산성이 저하되고, 제조에 따른 고가의 생산설비, 즉 다이 본더나 와이어 본더와 같은 고가의 설비가 필요한 문제점이 있다.In addition, since the pilot lamp is a small product, the handling of the product is difficult and productivity is lowered, and there is a problem that an expensive production facility such as a die bonder or an expensive facility such as a wire bonder is required.

본 발명은 상기의 제반 문제점을 해결하기 위하여 안출된 것으로서, LED와 와이어를 하나의 칩 LED모듈로 제작하여 PCB 기판에 부착함으로써 온도상승에 의한 열변형을 방지하고, 습기에 의한 들뜸 현상을 방지할 수 있는 파일럿 램프의 제작방법을 제공함에 그 목적이 있다.The present invention has been made in order to solve the above problems, by making the LED and the wire as a single chip LED module attached to the PCB substrate to prevent thermal deformation due to temperature rise, to prevent the lifting phenomenon caused by moisture The purpose is to provide a method for manufacturing a pilot lamp that can be.

또한, 본 발명은 칩 LED 모듈로 제작됨으로써 제품 취급시 와이어 접촉의 위험을 배제할 수 있으며, 제품 취급이 간편하고, 칩 마운트에서 작업이 가능하므로 생산성을 향상시킬 수 있는 파일럿 램프의 제작방법을 제공함에 다른 목적이 있다.In addition, the present invention can be eliminated the risk of wire contact when the product is manufactured by the chip LED module, it is easy to handle the product, it is possible to work in the chip mount provides a method of manufacturing a pilot lamp that can improve productivity. Has a different purpose.

도1a 내지 도1c는 일반적인 파일롯 램프의 구성을 개략적으로 나타낸 정면도, 평면도 및 측면도.1A to 1C are a front view, a plan view, and a side view schematically showing the configuration of a typical pilot lamp.

도2a 및 도2b는 종래기술에 따른 파일롯 램프의 제작방법을 설명하기 위한 공정도.Figures 2a and 2b is a process chart for explaining the manufacturing method of the pilot lamp according to the prior art.

도3은 본 발명에 의한 파일롯 램프의 제작방법을 설명하기 위한 공정도.Figure 3 is a process chart for explaining a manufacturing method of a pilot lamp according to the present invention.

*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

1: LED 2: 도전성 접착제1: LED 2: conductive adhesive

3: PCB 기판 4: 골드 와이어3: PCB board 4: gold wire

5: 박판 6: 에폭시5: lamination 6: epoxy

상기 목적을 달성하기 위하여 본 발명은, 소정크기의 전도성 박판을 소정 간격을 두고 설치하고, 상기 일측 박판에 LED를 올려놓고 도전성 접착제로 부착하는제1 단계; 상기 LED와 타측 박판을 와이어로 본딩하는 제2 단계; 와이어 본딩된 LED와 박판을 에폭시 몰딩하여 모듈화하는 제3 단계; 및 상기 모듈을 PCB 기판의 배선부재에 올려놓고, 상기 모듈의 외부를 도전성 접착제로 부착하는 제4 단계를 포함하는 파일럿 램프의 제작방법을 제공한다.In order to achieve the above object, the present invention provides a first step of installing a conductive thin plate of a predetermined size at a predetermined interval, and placing the LED on the one side thin plate and attaching it with a conductive adhesive; Bonding the LED and the other thin plate to a wire; A third step of epoxy molding the wire-bonded LED and the thin plate to be modularized; And a fourth step of placing the module on the wiring member of the PCB board and attaching the outside of the module with the conductive adhesive.

이하, 첨부된 도3의 도면을 참조하여 본 발명의 실시예를 상세히 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings of FIG. 3.

본 발명에 의한 파일럿 램프의 제작방법은 열변형에 의한 부등이나 습기에 의한 와이어의 들뜸을 방지하여 신뢰성있는 제품을 얻을 수 있도록 구현한 것으로, 본 실시예에서는 LED와 와이어를 모듈화하여 PCB기판에 부착한 예를 제시하고 있다.The manufacturing method of the pilot lamp according to the present invention is implemented to prevent a floating of wires due to heat deformation or moisture and to obtain a reliable product. In this embodiment, the LED and the wires are modularized and attached to the PCB board. An example is given.

즉, 도면에 도시된 바와 같이, 칩 마운터(도면에 도시하지 않음)의 상부에 소정크기의 전도성 박판(5, 5')을 소정 간격을 두고 설치하고, 상기 일측 박판(5)에 LED(1)를 올려놓고 도전성 접착제(2)로 부착한다. 그리고, 상기 LED(1)와 타측 박판(5')을 와이어로 본딩하고, 와이어 본딩된 LED(1)와 박판(5, 5')을 에폭시 몰딩하여 모듈화한 칩LED를 구성한다.That is, as shown in the figure, the conductive thin plates 5 and 5 'of a predetermined size are installed on the chip mounter (not shown in the drawing) at predetermined intervals, and the LED 1 on the one side thin plate 5 is installed. ) And attach with conductive adhesive (2). The LED 1 and the other thin plate 5 'are bonded by wire, and the wire-bonded LED 1 and the thin plates 5 and 5' are epoxy-molded to form a modular chip LED.

상기 칩 LED를 PCB 기판(3)의 배선부재에 올려놓고, 상기 모듈의 외부를 도전성 접착제(2)로 부착하여 파일럿 램프를 완성한다.The chip LED is placed on the wiring member of the PCB board 3, and the outside of the module is attached with a conductive adhesive 2 to complete the pilot lamp.

여기서, 상기 도전성 접착제(2)는 납땜으로 이루어질 수 있다.Here, the conductive adhesive 2 may be made of soldering.

상기와 같이 칩LED를 모듈화함으로써 열변형에 견딜 수 있는 온도가 증가하여 온도상승에 의한 에폭시와 PCB, 골드 와이어 간의 특성변화를 주지 않으므로 점등이 되지 않는 현상 뿐만 아니라, 습기에 의해 PCB가 접착제로부터 분리되어 와이어가 들뜨는 현상을 배제할 수가 있는 것이다.By modularizing the chip LED as described above, the temperature that can withstand thermal deformation increases, so it does not change the characteristics between epoxy, PCB, and gold wire due to the temperature rise. Therefore, the PCB is separated from the adhesive due to moisture. This can eliminate the phenomenon of the wire floating.

이상에서 설명한 본 발명은 전술한 실시예 및 첨부된 도면에 의해 한정되는 것이 아니고, 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경이 가능함은 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 있어 명백할 것이다.The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

전술한 바와 같이 본 발명에 따르면, LED와 와이어를 에폭시 몰딩하여 모듈화함으로써 장시간 사용에 의해 온도상승시에도 상기 모듈이 열변형에 견딜 수 있으므로, PCB, 골드 와이어간의 특성변화가 생기지 않아 부등의 염려가 없으며, 또한 습기에도 매우 강해 PCB의 분리현상에 의한 와이어의 들뜸을 방지할 수 있는 효과를 가진다. 또한, 파일럿 램프의 취급시 와이어 접촉을 방지할 수 있으며, 칩LED 모듈을 PCB기판에 직접 부착함으로써 제품의 취급이 쉽고, 또 칩 마운터를 이용하여 작업이 가능하므로 생산성을 향상시킬 수 있는 효과를 가진다.As described above, according to the present invention, since the module can withstand thermal deformation even when the temperature rises by prolonged use by epoxy molding the LEDs and the wires, the characteristics of the PCB and the gold wire are not changed, so there is no fear of inequality. In addition, it is very resistant to moisture and has the effect of preventing the lifting of the wire by the PCB separation phenomenon. In addition, wire contact can be prevented when handling the pilot lamp, and the chip LED module is directly attached to the PCB board, so that the product can be easily handled and the work can be performed using the chip mounter, thereby improving productivity. .

Claims (3)

소정크기의 전도성 박판을 소정 간격을 두고 설치하고, 상기 일측 박판에 LED를 올려놓고 도전성 접착제로 부착하는 제1 단계;A first step of installing a conductive thin plate having a predetermined size at a predetermined interval, and placing an LED on the thin plate on one side and attaching the conductive thin plate with a conductive adhesive; 상기 LED와 타측 박판을 와이어로 본딩하는 제2 단계;Bonding the LED and the other thin plate to a wire; 와이어 본딩된 LED와 박판을 에폭시 몰딩하여 모듈화하는 제3 단계; 및A third step of epoxy molding the wire-bonded LED and the thin plate to be modularized; And 상기 모듈을 PCB 기판의 배선부재에 올려놓고, 상기 모듈의 외부를 도전성 접착제로 부착하는 제4 단계A fourth step of placing the module on the wiring member of the PCB board and attaching the outside of the module with a conductive adhesive 를 포함하는 파일럿 램프의 제작방법.Method of manufacturing a pilot lamp comprising a. 제 1 항에 있어서,The method of claim 1, 상기 제1 단계는 칩 마운터를 이용하여 그의 상부에 소정간격을 두고 박판을 설치하는 제5단계를 포함하는 파일럿 램프의 제작방법.The first step is a manufacturing method of a pilot lamp comprising a fifth step of installing a thin plate at a predetermined interval on the top using a chip mounter. 제 1 항 또는 제 2 항에 있어서,The method according to claim 1 or 2, 상기 제4 단계의 도전성 접착제가 땜납으로 이루어진 파일럿 램프의 제작방법.The method of manufacturing a pilot lamp, wherein the conductive adhesive of the fourth step is made of solder.
KR1020020000913A 2002-01-08 2002-01-08 manufacturing method of pilot lamp Ceased KR20030060285A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000071343A (en) * 1999-03-03 2000-11-25 사토 게니치로 Chip-type electron component
KR200210801Y1 (en) * 1998-01-15 2001-02-01 한성수 Pilot lamp
KR20010111231A (en) * 2000-06-09 2001-12-17 김윤철 Structure of chip LED and the manufacturing method
JP2001352102A (en) * 2000-06-07 2001-12-21 Matsushita Electric Ind Co Ltd Optical semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200210801Y1 (en) * 1998-01-15 2001-02-01 한성수 Pilot lamp
KR20000071343A (en) * 1999-03-03 2000-11-25 사토 게니치로 Chip-type electron component
JP2001352102A (en) * 2000-06-07 2001-12-21 Matsushita Electric Ind Co Ltd Optical semiconductor device
KR20010111231A (en) * 2000-06-09 2001-12-17 김윤철 Structure of chip LED and the manufacturing method

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