KR20030025007A - 쉴드링을 가지는 식각장비 - Google Patents
쉴드링을 가지는 식각장비 Download PDFInfo
- Publication number
- KR20030025007A KR20030025007A KR1020010057886A KR20010057886A KR20030025007A KR 20030025007 A KR20030025007 A KR 20030025007A KR 1020010057886 A KR1020010057886 A KR 1020010057886A KR 20010057886 A KR20010057886 A KR 20010057886A KR 20030025007 A KR20030025007 A KR 20030025007A
- Authority
- KR
- South Korea
- Prior art keywords
- etching
- shield ring
- semiconductor wafer
- plasma
- ceramic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32651—Shields, e.g. dark space shields, Faraday shields
-
- H10P72/0421—
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (3)
- 반도체 웨이퍼에 형성된 막을 식각하기 위한 식각장비에 있어서,반도체 웨이퍼에 형성된 막을 식각하기 위한 분위기를 제공하는 챔버와;상기 챔버의 상부쪽에 설치되어 플라즈마를 생성하기 위한 전원을 공급하는 상부 전극과;상기 상부전극의 외곽에 장착되어 상기 플라즈마가 상기 반도체 웨이퍼의 상부로 집중되도록 하고 주위의 부품을 식각으로부터 보호하는 세라믹 재질의 쉴드링을 구비함을 특징으로 하는 식각장비.
- 제1항에 있어서, 상기 세라믹 재질은 산화 알루미나 또는 산화 티타늄계열의 세라믹 재질임을 특징으로 하는 식각장비.
- 제2항에 있어서, 상기 쉴드 링은,내경이 형성되어 링형상을 가지는 제1단부와,상기 제1단부에서 웨이퍼의 설치방향으로 굽어 상기 제1단부와는 단차를 가지며 상기 제1단부와 일체로 형성된 제2단부를 가짐을 특징으로 하는 식각장비.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020010057886A KR20030025007A (ko) | 2001-09-19 | 2001-09-19 | 쉴드링을 가지는 식각장비 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020010057886A KR20030025007A (ko) | 2001-09-19 | 2001-09-19 | 쉴드링을 가지는 식각장비 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20030025007A true KR20030025007A (ko) | 2003-03-28 |
Family
ID=27724671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020010057886A Withdrawn KR20030025007A (ko) | 2001-09-19 | 2001-09-19 | 쉴드링을 가지는 식각장비 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20030025007A (ko) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100766417B1 (ko) * | 2006-07-11 | 2007-10-12 | 이기정 | 수납 부재 및 이를 포함하는 박판화 장치 |
| WO2015009745A1 (en) * | 2013-07-19 | 2015-01-22 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based thin film coatings on process rings |
| US9034199B2 (en) | 2012-02-21 | 2015-05-19 | Applied Materials, Inc. | Ceramic article with reduced surface defect density and process for producing a ceramic article |
| US9090046B2 (en) | 2012-04-16 | 2015-07-28 | Applied Materials, Inc. | Ceramic coated article and process for applying ceramic coating |
| US9212099B2 (en) | 2012-02-22 | 2015-12-15 | Applied Materials, Inc. | Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics |
| US9343289B2 (en) | 2012-07-27 | 2016-05-17 | Applied Materials, Inc. | Chemistry compatible coating material for advanced device on-wafer particle performance |
| US9583369B2 (en) | 2013-07-20 | 2017-02-28 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles |
| US9604249B2 (en) | 2012-07-26 | 2017-03-28 | Applied Materials, Inc. | Innovative top-coat approach for advanced device on-wafer particle performance |
| US9725799B2 (en) | 2013-12-06 | 2017-08-08 | Applied Materials, Inc. | Ion beam sputtering with ion assisted deposition for coatings on chamber components |
| US9850568B2 (en) | 2013-06-20 | 2017-12-26 | Applied Materials, Inc. | Plasma erosion resistant rare-earth oxide based thin film coatings |
| US9865434B2 (en) | 2013-06-05 | 2018-01-09 | Applied Materials, Inc. | Rare-earth oxide based erosion resistant coatings for semiconductor application |
| US9869013B2 (en) | 2014-04-25 | 2018-01-16 | Applied Materials, Inc. | Ion assisted deposition top coat of rare-earth oxide |
| US9976211B2 (en) | 2014-04-25 | 2018-05-22 | Applied Materials, Inc. | Plasma erosion resistant thin film coating for high temperature application |
| US11047035B2 (en) | 2018-02-23 | 2021-06-29 | Applied Materials, Inc. | Protective yttria coating for semiconductor equipment parts |
-
2001
- 2001-09-19 KR KR1020010057886A patent/KR20030025007A/ko not_active Withdrawn
Cited By (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100766417B1 (ko) * | 2006-07-11 | 2007-10-12 | 이기정 | 수납 부재 및 이를 포함하는 박판화 장치 |
| US9034199B2 (en) | 2012-02-21 | 2015-05-19 | Applied Materials, Inc. | Ceramic article with reduced surface defect density and process for producing a ceramic article |
| US10336656B2 (en) | 2012-02-21 | 2019-07-02 | Applied Materials, Inc. | Ceramic article with reduced surface defect density |
| US11279661B2 (en) | 2012-02-22 | 2022-03-22 | Applied Materials, Inc. | Heat treated ceramic substrate having ceramic coating |
| US10364197B2 (en) | 2012-02-22 | 2019-07-30 | Applied Materials, Inc. | Heat treated ceramic substrate having ceramic coating |
| US9212099B2 (en) | 2012-02-22 | 2015-12-15 | Applied Materials, Inc. | Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics |
| US9090046B2 (en) | 2012-04-16 | 2015-07-28 | Applied Materials, Inc. | Ceramic coated article and process for applying ceramic coating |
| US9604249B2 (en) | 2012-07-26 | 2017-03-28 | Applied Materials, Inc. | Innovative top-coat approach for advanced device on-wafer particle performance |
| US9343289B2 (en) | 2012-07-27 | 2016-05-17 | Applied Materials, Inc. | Chemistry compatible coating material for advanced device on-wafer particle performance |
| US9865434B2 (en) | 2013-06-05 | 2018-01-09 | Applied Materials, Inc. | Rare-earth oxide based erosion resistant coatings for semiconductor application |
| US10734202B2 (en) | 2013-06-05 | 2020-08-04 | Applied Materials, Inc. | Rare-earth oxide based erosion resistant coatings for semiconductor application |
| US11680308B2 (en) | 2013-06-20 | 2023-06-20 | Applied Materials, Inc. | Plasma erosion resistant rare-earth oxide based thin film coatings |
| US11053581B2 (en) | 2013-06-20 | 2021-07-06 | Applied Materials, Inc. | Plasma erosion resistant rare-earth oxide based thin film coatings |
| US9850568B2 (en) | 2013-06-20 | 2017-12-26 | Applied Materials, Inc. | Plasma erosion resistant rare-earth oxide based thin film coatings |
| US10501843B2 (en) | 2013-06-20 | 2019-12-10 | Applied Materials, Inc. | Plasma erosion resistant rare-earth oxide based thin film coatings |
| US10119188B2 (en) | 2013-06-20 | 2018-11-06 | Applied Materials, Inc. | Plasma erosion resistant rare-earth oxide based thin film coatings |
| KR20160034298A (ko) * | 2013-07-19 | 2016-03-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 공정 고리들 상에 희토류 옥사이드 기반 박막 코팅을 위한 이온 보조 증착 |
| WO2015009745A1 (en) * | 2013-07-19 | 2015-01-22 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based thin film coatings on process rings |
| US9711334B2 (en) | 2013-07-19 | 2017-07-18 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based thin film coatings on process rings |
| US10796888B2 (en) | 2013-07-19 | 2020-10-06 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based thin film coatings on process rings |
| US9812341B2 (en) | 2013-07-20 | 2017-11-07 | Applied Materials, Inc. | Rare-earth oxide based coatings based on ion assisted deposition |
| US9583369B2 (en) | 2013-07-20 | 2017-02-28 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles |
| US11424136B2 (en) | 2013-07-20 | 2022-08-23 | Applied Materials, Inc. | Rare-earth oxide based coatings based on ion assisted deposition |
| US9869012B2 (en) | 2013-07-20 | 2018-01-16 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based coatings |
| US10930526B2 (en) | 2013-07-20 | 2021-02-23 | Applied Materials, Inc. | Rare-earth oxide based coatings based on ion assisted deposition |
| US9725799B2 (en) | 2013-12-06 | 2017-08-08 | Applied Materials, Inc. | Ion beam sputtering with ion assisted deposition for coatings on chamber components |
| US11566317B2 (en) | 2013-12-06 | 2023-01-31 | Applied Materials, Inc. | Ion beam sputtering with ion assisted deposition for coatings on chamber components |
| US11566318B2 (en) | 2013-12-06 | 2023-01-31 | Applied Materials, Inc. | Ion beam sputtering with ion assisted deposition for coatings on chamber components |
| US11566319B2 (en) | 2013-12-06 | 2023-01-31 | Applied Materials, Inc. | Ion beam sputtering with ion assisted deposition for coatings on chamber components |
| US12195839B2 (en) | 2013-12-06 | 2025-01-14 | Applied Materials, Inc. | Ion beam sputtering with ion assisted deposition for coatings on chamber components |
| US9797037B2 (en) | 2013-12-06 | 2017-10-24 | Applied Materials, Inc. | Ion beam sputtering with ion assisted deposition for coatings on chamber components |
| US9976211B2 (en) | 2014-04-25 | 2018-05-22 | Applied Materials, Inc. | Plasma erosion resistant thin film coating for high temperature application |
| US10815562B2 (en) | 2014-04-25 | 2020-10-27 | Applied Materials, Inc. | Plasma erosion resistant thin film coating for high temperature application |
| US10563297B2 (en) | 2014-04-25 | 2020-02-18 | Applied Materials, Inc. | Ion assisted deposition top coat of rare-earth oxide |
| US10544500B2 (en) | 2014-04-25 | 2020-01-28 | Applied Materials, Inc. | Ion assisted deposition top coat of rare-earth oxide |
| US9970095B2 (en) | 2014-04-25 | 2018-05-15 | Applied Materials, Inc. | Ion assisted deposition top coat of rare-earth oxide |
| US11773479B2 (en) | 2014-04-25 | 2023-10-03 | Applied Materials, Inc. | Plasma erosion resistant thin film coating for high temperature application |
| US9869013B2 (en) | 2014-04-25 | 2018-01-16 | Applied Materials, Inc. | Ion assisted deposition top coat of rare-earth oxide |
| US11047035B2 (en) | 2018-02-23 | 2021-06-29 | Applied Materials, Inc. | Protective yttria coating for semiconductor equipment parts |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7244336B2 (en) | Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift | |
| KR20030025007A (ko) | 쉴드링을 가지는 식각장비 | |
| US20040072426A1 (en) | Process chamber for manufacturing a smiconductor device | |
| CN101584031B (zh) | 用于晶片边缘处理的方法和装置 | |
| CN114664622A (zh) | 一种等离子体处理装置及调节方法 | |
| US20040112294A1 (en) | Magnetic mirror for protection of consumable parts during plasma processing | |
| JP2009194125A (ja) | 半導体装置の製造装置 | |
| CN113725059B (zh) | 一种下电极组件,其安装方法及等离子体处理装置 | |
| KR100631384B1 (ko) | 플라즈마 처리 장치 | |
| CN118280800A (zh) | 一种等离子体处理装置及等离子体工艺的调整方法 | |
| KR20050091854A (ko) | 반도체 웨이퍼 제조 장치의 포커스 링 | |
| JP5893260B2 (ja) | プラズマ処理装置および処理方法 | |
| KR20090100543A (ko) | 진공처리장치 | |
| US6326574B1 (en) | Sleeve for an adapter flange of the gasonics L3510 etcher | |
| CN114038749B (zh) | 掩膜装置及其制备方法 | |
| CN114695046B (zh) | 一种等离子体处理装置和处理方法 | |
| WO2009075544A2 (en) | A liner for semiconductor chamber | |
| WO1999013489A2 (en) | Apparatus for improving etch uniformity and methods therefor | |
| CN113745083B (zh) | 一种等离子体处理装置 | |
| JP2011124295A (ja) | プラズマ処理装置 | |
| JP2004047500A (ja) | プラズマ処理装置およびその初期化方法 | |
| KR20170070938A (ko) | 플라즈마 강화 화학 기상 증착 장치 | |
| KR100476588B1 (ko) | 반도체 식각장치의 프로세스 챔버 | |
| KR20050120862A (ko) | 기판 식각 장치 | |
| KR20040011839A (ko) | 라이너를 갖는 플라즈마 식각 챔버 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PC1203 | Withdrawal of no request for examination |
St.27 status event code: N-1-6-B10-B12-nap-PC1203 |
|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |