KR20020038035A - EMI shielding heat sink using carbon nanotube - Google Patents
EMI shielding heat sink using carbon nanotube Download PDFInfo
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- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
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Abstract
본 발명에 따른 탄소나노튜브를 이용한 전자파 차폐 방열판은, 소자에서 발생된 열을 외부로 방출하는 방열판에 있어서, 탄소나노튜브를 열 전달물질로 이용하여 방열판이 형성된다.Electromagnetic shielding heat sink using carbon nanotubes according to the present invention, in the heat sink for dissipating heat generated from the device to the outside, the heat sink is formed using the carbon nanotubes as a heat transfer material.
여기서, 방열판을 형성하는 탄소나노튜브는 버키 페이퍼(bucky paper) 형태로 구성되며 또한, 버키 페이퍼는 자기장을 이용하여 일차원적으로 정렬된 탄소나노튜브의 구조를 갖는다.Here, the carbon nanotubes forming the heat sink are configured in the form of a bucky paper, and the bucky paper has a structure of one-dimensionally aligned carbon nanotubes using a magnetic field.
이와 같은 본 발명에 의하면, 탄소나노튜브를 이용하여 방열판을 형성함으로써, 소자에서 발생되는 열을 효과적으로 방출시킬 뿐만 아니라, 전자파를 차폐/흡수하여 전자기파에 의한 간섭 및 오동작을 방지할 수 있는 장점이 있다.According to the present invention, by forming a heat sink using carbon nanotubes, there is an advantage that can effectively not only release the heat generated from the device, but also shield / absorb electromagnetic waves to prevent interference and malfunction due to electromagnetic waves. .
Description
본 발명은 소자에서 발생되는 열을 방출하는 방열판에 관한 것으로서, 특히 탄소나노튜브(CNT: Carbon NanoTube)를 이용하여 방열판을 형성함으로써, 소자에서 발생되는 열을 효과적으로 방출시킬 뿐만 아니라, 전자파를 차폐/흡수하여 전자기파에 의한 간섭 및 오동작을 방지할 수 있는 탄소나노튜브를 이용한 전자파 차폐 방열판에 관한 것이다.The present invention relates to a heat sink for dissipating heat generated from a device, and in particular, by forming a heat sink using carbon nanotubes (CNT), not only effectively dissipating heat generated from the device, but also shielding / It relates to an electromagnetic shielding heat sink using carbon nanotubes that can absorb and prevent interference and malfunction by electromagnetic waves.
최근 인체에 대한 유해성으로 인하여 전자파에 대한 규제가 강화되고 있다.전자파는 전기장과 자기장이 결합된 에너지 파로, 200MHz 이상에서의 전자파는 전기장의 역할이 지배적이므로 전기장의 차폐를 통해 전자파가 차단될 수 있지만, 200MHz 이하의 전자파에서는 전기장과 자기장이 함께 차폐되어야 한다.In recent years, regulations on electromagnetic waves have been tightened due to the harmfulness to the human body.Electromagnetic waves are energy waves that combine electric and magnetic fields.Since electromagnetic waves dominate over 200MHz, electromagnetic waves can be blocked by shielding electric fields. For electromagnetic waves below 200MHz, the electric and magnetic fields must be shielded together.
상기 전자파를 차폐하는 전자파 차폐 및 흡수재는 구성 물질의 도전성, 즉 이동가능 전하의 보유정도에 따라 전자파를 투과, 반사 또는 흡수함으로서 차폐할 수 있다. 전자파 차폐 및 흡수재가 이동전하를 갖지 않는 경우, 전자파는 상기 차폐재를 투과하게 되고, 이동전하는 있으나 저항이 작아 주울(Joule) 열로 에너지가 소모되지 않는 경우에는 반사되며, 이동시 저항이 적당히 큰 경우는 전자파를 흡수한다.The electromagnetic shielding and absorbing material for shielding the electromagnetic wave can be shielded by transmitting, reflecting or absorbing the electromagnetic wave according to the conductivity of the constituent material, that is, the retention of the movable charge. When the electromagnetic shielding and absorbing material does not have a mobile charge, the electromagnetic wave is transmitted through the shielding material, and when the electric charge is small but the resistance is small and energy is not consumed by Joule heat, the electromagnetic wave is reflected. Absorb it.
현재 사용되는 전자파 차폐 및 흡수재는 금속을 이용하는 것으로, 금속을 이용한 전자파 차폐 및 흡수재는 다음과 같은 방법으로 제조되어 전자파를 반사 또는 차폐한다.Currently used electromagnetic shielding and absorbing material is a metal, the electromagnetic shielding and absorbing material using a metal is manufactured by the following method to reflect or shield the electromagnetic waves.
첫 번째는 금속입자 즉, 동 또는 은을 이용하여, 전자파를 차폐하기 위한 대상, 예를 들면 휴대폰 내면에 도포하는 방법이다. 두 번째는 플라스틱 또는 폴리머와 같은 매트릭스에 금속섬유를 분산시켜 사용하는 방법으로, 상기 금속섬유들이 그물망 구조를 이루어 전자파를 차폐하는 방법이다. 세 번째로는 금속박막 또는 금속후막에 이한 차폐법이 있다.The first method is to apply metal particles, that is, copper or silver, to an object for shielding electromagnetic waves, for example, to the inside of a mobile phone. The second method is to disperse metal fibers in a matrix such as plastic or polymer. The metal fibers form a mesh structure to shield electromagnetic waves. Thirdly, there is a shielding method following the metal thin film or the metal thick film.
이때, 상기 금속섬유를 이용한 전자파 차폐 및 흡수재는 다음과 같은 문제점이 발생된다.At this time, the electromagnetic shielding and absorbing material using the metal fiber has the following problems.
첫 째, 상기 차폐재는 전자파를 단순히 반사 또는 차폐한다. 따라서, 상기차폐재는 인체를 보호할 수는 있지만, 반사된 전자파는 다시 기기에 영향을 주어 기기의 오동작과 노이즈를 증가시킨다.First, the shielding material simply reflects or shields electromagnetic waves. Therefore, while the shielding material can protect the human body, the reflected electromagnetic waves again affect the device, increasing the malfunction and noise of the device.
둘 째, 매트릭스 내에 금속섬유의 그물망 구조를 얻기 위해 입경이 작고 길이가 긴 금속섬유가 요구되나, 입경이 작은 금속섬유는 제조 비용이 높고 쉽게 부러질 수 있다.Second, although a small particle diameter and a long metal fiber are required to obtain a mesh structure of the metal fiber in the matrix, the metal fiber having a small particle diameter is expensive to manufacture and can be easily broken.
한편, 소자의 연산 속도의 고속화와 더불어 고집적화는 필연적으로 작은 크기의 소자를 요구하게 되었고, 이는 nano-electronic device라는 신조어를 낳았다. 이와 같은 나노 크기의 전자소자에서 소자의 냉각은 필연적인 기술이다.On the other hand, high integration with high speed computing speed inevitably required small size devices, which gave rise to the coinword of nano-electronic devices. In such nano-scale electronic devices, cooling of the device is an inevitable technique.
일반적으로 반도체 소자의 수명은 온도가 10도 상승할 때마다 반으로 줄어드는 것으로 알려질 정도로 방열은 중요한 문제이다.In general, the heat dissipation is an important problem so that the life of the semiconductor device is known to decrease in half every 10 degrees of temperature rise.
이에 따라, 해결 방안으로 제시된 것 중의 하나는, 다이아몬드 박막을 이용하여 다중 층의 방열판을 만든다는 것이다. 이는 다이아몬드가 탁월한 열 전달 특성과 전기적 절연성을 가지기 때문에 가능한 것이다.Accordingly, one of the solutions proposed is to make a multi-layer heat sink using a diamond thin film. This is possible because diamonds have excellent heat transfer properties and electrical insulation.
다이아몬드의 열 전달은 주로 phonon mode(음자 모드)에 의해서 이루어진다. 즉, 탄소 원자들이 열적인 진동에 의해 열에너지가 전달되는 방식에 주로 의존하며 이는 조화 진동자 모델(harmonic oscillator model)로 볼 때, 같은 질량을 가지는 진동자가 가장 효율적으로 열을 전달할 수 있기 때문에, 단일 원자인 탄소만으로 이루어진 다이아몬드가 열 전달에 매우 유리한 것이다.The heat transfer of diamond is mainly done by phonon mode. That is, the carbon atoms are mainly dependent on the way the thermal energy is transferred by thermal vibration, which is the single atom because the same mass of the oscillator can transfer heat most efficiently in terms of the harmonic oscillator model. Diamonds consisting only of phosphorus carbon are very advantageous for heat transfer.
그러나, 다이아몬드 기판이 방열판으로써 실용화되기에는 비용적인 문제가 심각하여, 현재에는 아주 고가 소자나 특수 소자에서 일부 사용되고 있는 실정이다. 또한, 다이아몬드 박막은 그 특성상 전자기파에 대해서는 대부분의 전자기파를 투과하는 성질을 가지고 있으므로 전자파 차폐 흡수용으로는 적당하지 않은 단점이 있다.However, since a diamond substrate is a cost problem to be practically used as a heat sink, it is currently used in some very expensive devices or special devices. In addition, since the diamond thin film has a property of transmitting most electromagnetic waves with respect to electromagnetic waves, it is not suitable for absorbing electromagnetic shielding.
본 발명은 상기와 같은 여건을 감안하여 창출된 것으로서, 탄소나노튜브를 이용하여 방열판을 형성함으로써, 소자에서 발생되는 열을 효과적으로 방출시킬 뿐만 아니라, 전자파를 차폐/흡수하여 전자기파에 의한 간섭 및 오동작을 방지할 수 있는 탄소나노튜브를 이용한 전자파 차폐 방열판을 제공함에 그 목적이 있다.The present invention was created in view of the above conditions, and by forming a heat sink using carbon nanotubes, it not only effectively releases heat generated from the device, but also shields / absorbs electromagnetic waves to prevent interference and malfunctions caused by electromagnetic waves. Its purpose is to provide an electromagnetic shielding heat sink using carbon nanotubes that can be prevented.
도 1은 일반적인 탄소나노튜브를 이용하여 제조된 버키 페이퍼의 형태를 나타낸 도면.1 is a view showing the shape of a bucky paper produced using a common carbon nanotubes.
도 2는 일반적인 자장을 이용하여 정렬된 탄소나노튜브 버키 페이퍼를 만드는 공정을 나타낸 도면.2 is a view showing a process of making aligned carbon nanotube bucky paper using a common magnetic field.
도 3은 일반적인 음자 모드에 의한 열 전달을 설명하기 위한 개념적인 모델을 나타낸 도면.3 is a conceptual model for explaining heat transfer by a general phonetic mode.
상기의 목적을 달성하기 위하여 본 발명에 따른 탄소나노튜브를 이용한 전자파 차폐 방열판은, 소자에서 발생된 열을 외부로 방출하는 방열판에 있어서, 탄소나노튜브를 열 전달물질로 이용하여 방열판이 형성된 점에 그 특징이 있다.In order to achieve the above object, an electromagnetic wave shielding heat sink using carbon nanotubes according to the present invention is a heat sink that emits heat generated from a device to an outside, in which a heat sink is formed using carbon nanotubes as a heat transfer material. It has its features.
여기서, 상기 방열판을 형성하는 탄소나노튜브는 버키 페이퍼(bucky paper) 형태로 구성되는 점에 그 특징이 있다.Here, the carbon nanotubes forming the heat sink is characterized in that it is configured in the form of a bucky paper (bucky paper).
또한, 상기 버키 페이퍼는 자기장을 이용하여 일차원적으로 정렬된 탄소나노튜브의 구조를 갖는 점에 그 특징이 있다.In addition, the bucky paper has a feature of having a structure of carbon nanotubes aligned one-dimensionally by using a magnetic field.
또한, 상기 방열판은 2차원적인 버키 페이퍼를 이용할 수도 있으며, 3차원적으로 연결된 버키 블록을 이용할 수도 있다.In addition, the heat sink may use a two-dimensional bucky paper, or may use a bucky block connected three-dimensionally.
이와 같은 본 발명에 의하면, 탄소나노튜브를 이용하여 방열판을 형성함으로써, 소자에서 발생되는 열을 효과적으로 방출시킬 뿐만 아니라, 전자파를 차폐/흡수하여 전자기파에 의한 간섭 및 오동작을 방지할 수 있는 장점이 있다.According to the present invention, by forming a heat sink using carbon nanotubes, there is an advantage that can effectively not only release the heat generated from the device, but also shield / absorb electromagnetic waves to prevent interference and malfunction due to electromagnetic waves. .
이하 첨부된 도면을 참조하여 본 발명에 따른 실시 예를 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 일반적인 탄소나노튜브를 이용하여 제조된 버키 페이퍼(bucky paper)의 형태를 나타낸 도면이다.1 is a view showing the form of a bucky paper (bucky paper) prepared using a common carbon nanotubes.
버키 페이퍼 제조는 크게 분산(dispersion)과 정렬(alignment)의 두 단계로 나누어진다. 분산은 SDS(Sodium Dodecyl Sulfate), LDS(Lithium Dodecyl Sulfate) 등의 수용액이나 Triton-X를 주로 사용한다. 이 수용액에 탄소나노튜브 분말을 섞은 후, 초음파 처리(sonication)를 통하여 분산시킨다.Bucky paper manufacturing is largely divided into two stages: dispersion and alignment. Dispersion mainly uses Triton-X or an aqueous solution of SDS (Sodium Dodecyl Sulfate) or LDS (Lithium Dodecyl Sulfate). The carbon nanotube powder is mixed with this aqueous solution and then dispersed through sonication.
그리고, 도 1에 나타낸 바와 같이, 필요에 따라 2차원적으로 또는 일차원적으로 정렬시킨다. 이때, 2차원적인 정렬 방법은 스핀 코팅(spin coating)이나 딥 코팅(dip coating)을 응용하는 방법이 있다. 그리고, 일차원적인 정렬 방법은 extrusion이나 elongational flow를 이용하는 방법, 자기장을 이용하는 방법 또는 stretch drying 등의 방법이 있다.And as shown in FIG. 1, it arranges two-dimensionally or one-dimensionally as needed. At this time, the two-dimensional alignment method is a method of applying spin coating (dip coating) or dip coating (dip coating). One-dimensional alignment methods include extrusion or elongational flow, magnetic fields, or stretch drying.
도 2는 일반적인 자장을 이용하여 정렬된 탄소나노튜브 버키 페이퍼를 만드는 공정을 나타낸 도면이다.2 is a view showing a process of making aligned carbon nanotube bucky paper using a common magnetic field.
도 2에 나타낸 바와 같이 자기장이 걸린 상태에서 탄소나노튜브 서스펜션 (CNT suspension)을 흘려 줌으로써, 원하는 방향으로 정렬된 탄소나노튜브 버키 페이퍼를 만들 수 있다.As shown in Figure 2 by flowing a carbon nanotube suspension (CNT suspension) in a magnetic field is caught, it is possible to make a carbon nanotube bucky paper aligned in the desired direction.
한편, 폴리머에 도전성을 가지는 재료를 섞거나 코팅하여, 정전기 방지 목적으로 사용하는 예는 많이 있으며, 탄소나노튜브를 이와 같이 응용하는 경우에 다음과 같은 다양한 장점이 있다.On the other hand, by mixing or coating a conductive material to the polymer, there are many examples of using for the purpose of antistatic purposes, there are a variety of advantages when applying the carbon nanotubes in this way.
1. 극히 소량의 첨가로도 탄소나노튜브의 상호 연결이 가능하므로 비용이 많이 발생되지 않는다.1. It is possible to interconnect carbon nanotubes even with the addition of very small amount, so there is no cost.
2. 극소량의 첨가로도 원하는 물성을 얻을 수 있으므로 기존의 제조 공정을 큰 변화없이 그대로 이용할 수 있다.2. The desired physical properties can be obtained by the addition of very small amount, so the existing manufacturing process can be used as it is without any big change.
3. 첨가하는 탄소나노튜브의 배합비 조절을 통하여 원하는 물성을 디자인할 수 있다.3. The desired physical properties can be designed by adjusting the mixing ratio of the added carbon nanotubes.
4. 폴리머 자체의 기계적 강도가 증진된다.4. The mechanical strength of the polymer itself is enhanced.
5. 전자파 차폐 능력 저하 현상이 발생되지 않는다. 금속 섬유의 경우에는 표면층의 쉽게 산화되어 산화물을 형성하므로 기계적인 강도 저하와 EMI 차폐 능력 저하가 나타난다. 그러나, 화학적으로 안정한 탄소나노튜브를 사용하면 표면과 계면이 안정하므로 이러한 문제는 발생되지 않는다.5. The electromagnetic wave shielding ability is not degraded. In the case of metal fibers, the surface layer is easily oxidized to form oxides, resulting in lower mechanical strength and lower EMI shielding ability. However, when the chemically stable carbon nanotubes are used, the surface and the interface are stable, so this problem does not occur.
6. 폴리머와의 친화력이 뛰어나다. 카본을 기본으로 하는 폴리머와 탄소나노튜브는 화학적 친화력이 뛰어나므로 박리나, 섬유의 분리 등이 발생되지 않는다.6. Excellent affinity with polymer. Carbon-based polymers and carbon nanotubes have excellent chemical affinity, and therefore do not cause peeling or separation of fibers.
7. 환경 친화적이며 자원 절약적이다. 금속 섬유의 경우에는 금속 자원의 낭비가 심하고, 회수 및 재활용시 비용이 소모되나, 카본은 자연계에서 순환하는 물질이므로 특별한 재처리가 필요없다.7. Environment friendly and resource saving. In the case of metal fibers, the waste of metal resources is severe, and the cost of recovery and recycling is expensive, but since carbon is a circulating material in nature, no special reprocessing is required.
8. 극소량 첨가로 인해 제품 외관상의 변화가 없다. 제품의 성능뿐 아니라 제품의 디자인이나 외관도 제품의 경쟁력 제고에 큰 영향을 미치는 요소이다. 금속 섬유의 경우에는 많은 양이 첨가되어 제품의 표면 상태나 외관에 악 영향을 미친다. 그러나, 극소량이 첨가된 탄소나노튜브의 경우에는 제품 미관에 영향을 미치지 않는다.8. There is no change in appearance due to the addition of very small amount. Not only the performance of the product but also the design and appearance of the product have a great influence on the competitiveness of the product. In the case of metal fibers, a large amount is added, which adversely affects the surface state or appearance of the product. However, in the case of carbon nanotubes added with a very small amount does not affect the product aesthetics.
한편, 탄소나노튜브의 열전도도는 2500~2980 W/mK의 높은 값을 가지며, 표 1에 나타낸 일반적인 재료들에 비해 월등히 높은 값을 가진다. 이는 열전달의 음자 모드(phonon mode)를 설명하는 조화 진동자 모드를 통해 쉽게 설명할 수 있다.On the other hand, the thermal conductivity of carbon nanotubes has a high value of 2500 ~ 2980 W / mK, and has a much higher value than the general materials shown in Table 1. This can be easily explained through the harmonic oscillator mode, which describes the phonon mode of heat transfer.
그리고, 도 3은 일반적인 음자 모드에 의한 열 전달을 설명하기 위한 개념적인 모델을 나타낸 도면이다.3 is a diagram illustrating a conceptual model for explaining heat transfer by a general consonant mode.
음자를 통하여 열전달이 이루어질 경우, 이는 원자의 진동 전달에 의해 열 전달이 이루어지는 것이다(결국 열이란 근본적으로는 물질의 진동이다). 이때, 도 3에 나타낸 바와 같이, 열 전달을 하는 원자들의 질량차이가 크면 제대로 열이 전달되지 않고, 두 열 전달자 사이의 질량이 같을 때 가장 높은 진동주파수를 가져 열 전달이 가장 효율적으로 이루어진다.When heat transfers through the negative, it is heat transfer by vibration transfer of atoms (after all, heat is basically vibration of matter). At this time, as shown in Figure 3, if the mass difference of the heat transfer atoms is large, the heat is not properly transferred, when the mass between the two heat carriers have the highest vibration frequency to achieve the most efficient heat transfer.
또한, 두 열 전달자 사이의 힘 상수(스프링 상수)가 클 때, 가장 효율적인 열 전달이 이루어진다. 이러한 이유로 다이아몬드의 열 전달 특성이 우수한 것이며 탄소나노튜브도 이러한 이유로 매우 우수한 열 전달 특성을 가진다.Also, when the force constant (spring constant) between the two heat transferrs is large, the most efficient heat transfer is achieved. For this reason, diamond has excellent heat transfer properties, and carbon nanotubes also have very good heat transfer properties.
더욱이, 탄소나노튜브의 경우에는 다이아몬드의 sp3혼성 결합보다 더 결합력이 세고, 힘 상수 값이 큰 sp2결합으로 이루어져 있어 다이아몬드보다 더 우수한 열 전달 특성을 보인다.Moreover, in the case of carbon nanotubes, the bonding force is stronger than that of diamond sp 3 hybrid bonds, and sp 2 bonds having a large force constant value show better heat transfer characteristics than diamond.
한편, 이러한 탄소나노튜브를 이용하여 제조된 버키 페이퍼는 기존의 패키징이 된 소자에 적용할 수 있다. 예컨대, 적당한 soft solder를 이용하면 강한 접착력으로 기존의 패키징된 소자에 쉽게 부착이 가능하므로 응용범위도 다양하며, 공랭 특성도 다이아몬드 박막보다 유리하다.On the other hand, the bucky paper produced using such carbon nanotubes can be applied to the existing packaged device. For example, if a suitable soft solder is used, it can be easily attached to an existing packaged device with strong adhesive force, and thus has various application ranges, and air-cooling properties are more advantageous than diamond thin films.
그리고, 본 발명에 따른 탄소나노튜브를 이용한 전자파 차폐 방열판을 이용하면, 소자의 방열과 전자파 차폐의 두 가지 효과를 거둘 수 있으며, 특히 나노미터 크기의 작은 소자들에 적용하기 쉬운 방열판을 만들 수 있다.In addition, by using the electromagnetic shielding heat sink using carbon nanotubes according to the present invention, it is possible to achieve two effects of heat radiation and electromagnetic shielding of the device, in particular, it is possible to make a heat sink that is easy to apply to small devices of the nanometer size .
이상의 설명에서와 같이, 본 발명에 따른 탄소나노튜브를 이용한 전자파 차폐 방열판에 의하면, 탄소나노튜브를 이용하여 방열판을 형성함으로써, 소자에서 발생되는 열을 효과적으로 방출시킬 뿐만 아니라, 전자파를 차폐/흡수하여 전자기파에 의한 간섭 및 오동작을 방지할 수 있는 장점이 있다.As described above, according to the electromagnetic shielding heat sink using the carbon nanotubes according to the present invention, by forming a heat sink using the carbon nanotubes, not only effectively radiates heat generated from the device, but also shields / absorbs electromagnetic waves There is an advantage that can prevent interference and malfunction by electromagnetic waves.
또한, 본 발명에 따른 탄소나노튜브를 이용한 전자파 차폐 방열판에 의하면, 나노미터 크기의 작은 소자들에 적용하기 쉬운 방열판을 만들 수 있다.In addition, according to the electromagnetic shielding heat sink using the carbon nanotube according to the present invention, it is possible to make a heat sink that is easy to apply to small devices of the nanometer size.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100437093B1 (en) * | 2001-06-14 | 2004-06-26 | 명지대학교 | Carbon Nanotubes Filled PVDF/PVP Coating Material for Electromagnetic Interference Shielding, Method for Preparing the Same |
| US7118941B2 (en) * | 2003-06-25 | 2006-10-10 | Intel Corporation | Method of fabricating a composite carbon nanotube thermal interface device |
| FR2895987A1 (en) * | 2006-01-11 | 2007-07-13 | Univ Littoral Cote D Opale | STABLE AQUEOUS SUSPENSION OF CARBON NANOTUBES FOR FORMING CONDUCTIVE TRANSPARENT THIN FILMS |
| KR100873630B1 (en) * | 2002-01-16 | 2008-12-12 | 삼성에스디아이 주식회사 | Heat dissipation structure and its manufacturing method |
| US7588700B2 (en) | 2003-10-16 | 2009-09-15 | Electronics And Telecommunications Research Institute | Electromagnetic shielding material having carbon nanotube and metal as electrical conductor |
| US7847394B2 (en) | 2003-02-03 | 2010-12-07 | Intel Corporation | Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface |
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| KR101992570B1 (en) * | 2018-08-03 | 2019-06-24 | 한양대학교 산학협력단 | Method of manufacturing material to shield electromagnetic wave by using carbon nano tube sheet |
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| JP3325600B2 (en) * | 1992-05-01 | 2002-09-17 | 株式会社共和 | Rubber and / or plastic moldings with vibration damping and thermal conductivity |
| JPH11181118A (en) * | 1997-12-25 | 1999-07-06 | Tokai Rubber Ind Ltd | Antistatic elastic heat-dissipating sheet and process for continuously preparing the same |
| JP2000281802A (en) * | 1999-03-30 | 2000-10-10 | Polymatech Co Ltd | Thermoconductive formed shape, its production, and semiconductor device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100437093B1 (en) * | 2001-06-14 | 2004-06-26 | 명지대학교 | Carbon Nanotubes Filled PVDF/PVP Coating Material for Electromagnetic Interference Shielding, Method for Preparing the Same |
| KR100873630B1 (en) * | 2002-01-16 | 2008-12-12 | 삼성에스디아이 주식회사 | Heat dissipation structure and its manufacturing method |
| US7847394B2 (en) | 2003-02-03 | 2010-12-07 | Intel Corporation | Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface |
| US7118941B2 (en) * | 2003-06-25 | 2006-10-10 | Intel Corporation | Method of fabricating a composite carbon nanotube thermal interface device |
| US7588700B2 (en) | 2003-10-16 | 2009-09-15 | Electronics And Telecommunications Research Institute | Electromagnetic shielding material having carbon nanotube and metal as electrical conductor |
| FR2895987A1 (en) * | 2006-01-11 | 2007-07-13 | Univ Littoral Cote D Opale | STABLE AQUEOUS SUSPENSION OF CARBON NANOTUBES FOR FORMING CONDUCTIVE TRANSPARENT THIN FILMS |
| WO2007080323A3 (en) * | 2006-01-11 | 2007-12-06 | Univ Littoral Cote D Opale | Stable aqueous suspension of carbon nanotubes |
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