KR20020021556A - Apparatus and method for singularizing chip size package - Google Patents

Abstract

PURPOSE: A method for singulating a chip-size package is provided to complete every process regarding a singulation operation in one process flow of a chip-size package, by separating the chip-size package of a strip type into window-type package of a square type and by cutting the window-type package in X and Y directions while using two spindles and a plurality of blades. CONSTITUTION: The chip-size package of a strip type is cut to the window-type package of a substantial square type. The window-type package is transferred to the first spindle(31) having the plurality of blades. The plurality of blades of the first spindle cut the window-type package in the X direction. The package cut in the X direction is transferred to the second spindle(32) having a plurality of blades. The plurality of blades of the second spindle cut the window-type package in the Y direction.

Description

Singulation device and method of chip size package {Apparatus and method for singularizing chip size package}

The present invention relates to a singulation device and method for separating chip size packages into one chip, and more particularly, to a singulation of a chip size package in the form of a strip.

Recently, with the rapid trend of high integration and miniaturization of semiconductor chips, the size of semiconductor packages, which are aggregates of semiconductor chips, has also been reduced in size and size, and chip size packages have also been developed to enable high integration and high performance of semiconductor packages. Typical small packages include a micro ball grid array (Micro-BGA) and a chip array ball grid array (CABGA).

The package uses a multi-layer matrix type printed circuit board. The printed circuit board is in a state in which each unit is arranged in a lattice form, and molded at the same time to wrap these units at the same time. Obtain the device. That is, after the mold process of the semiconductor package (the process of forming a certain shape to protect the material from external impact and contact by using a thermosetting resin and forming the appearance of the product) is completed, the cutting process is performed and singulation is performed.

Singulation means cutting the chip size package to the desired size in order to obtain the final semiconductor device of the required size from the wide plate size chip size package.

In the prior art, the operation of singulating the chip size package in strip form as shown in FIG. 1 has a disadvantage in that the work efficiency is low since the simple cutting operation by one blade is repeated. That is, since the process of singulating the chip size packages in the X and Y directions as one blade, the matrix type chip size package must be reciprocally cut several times in the X direction and many times in the Y direction. As a result, since the flow distance in the singulation work process is inevitably long, it takes a lot of work time. In addition, since the cutting operation for one chip size package is repeatedly performed several times, the wear rate of the product occurs during the cutting process, and the defective rate of the final product is increased.

Accordingly, an object of the present invention is to provide a singulation device and method capable of overcoming the problems of the prior art and improving the singulation efficiency of chip size packages.

1 is a plan view showing the shape of a strip size chip size package to which the present invention is applied.

2 is a schematic perspective view of a device for cutting a chip size package in the form of a strip into a window in accordance with the present invention and mounting it on a singulation machine.

3 is a schematic perspective view of a device for singulating a chip size package cut in the form of a window in the device of FIG.

FIG. 4 is a diagram for describing a process of singulating a chip size package in the apparatus of FIG. 2.

FIG. 5 is an exploded perspective view showing the blade mounted on the spindle of the apparatus of FIG. 3; FIG.

6 is an enlarged perspective view illustrating a fixing table of the chip size package of FIG. 3.

* Brief description of symbols for the main parts of the drawings

W: window size chip size package

20: holder

20a: protrusion

21: chip size package in strip form

22: cutting machine

23: transfer unit

23a: slide bar

24, 37: vision camera

31, 32: spindle

33, 33a, 33b, 33c, 33d: ultra precision blade

34: chip size package cut in the X and Y direction

35: fixing table

36: table transfer unit

38: control computer

39, 41, 43: drive source

40, 42, 44: reduction gear

45: linear reciprocating motion in the X direction

46: straight reciprocating motion in the Y direction

47: Z direction up and down reciprocating part

48: push

50: horizontal movement table

51a, 51b: plunge

52: fixture

53: blade spacing

61 chuck

In order to achieve the above object, the present invention includes the steps of cutting the chip size package in the form of a strip into a package of window units in a substantially square form; Cutting the package of the window unit in the X direction by using a plurality of blades mounted on a first spindle; It provides a singulation method comprising the step of cutting the package cut in the X direction to a plurality of blades mounted to the second spindle in the Y direction.

Here, the package cut by the window unit is fixed by the chuck is cut in the X and Y directions.

In addition, the package cut in the X direction is rotated 90 ° is transported in the direction of the second spindle and then cut in the Y direction.

The present invention also provides an apparatus for implementing the above method, comprising: a cutting portion for cutting a chip size package in the form of a strip into a package in the form of square windows; A transfer unit for transferring a package of a window unit cut at the cutting unit; A fixing table for fixing a package of a window unit transferred from the transfer unit; A linear reciprocating unit for linearly reciprocating the fixing table; A first spindle having a blade mounting portion to which a plurality of blades are mounted, arranged in a direction perpendicular to the linear reciprocating direction in a first position, and rotating in one direction; A second spindle arranged in parallel with said first spindle at a second position spaced from said first position, said second spindle having a blade mounting portion and rotating in one direction; A fixing table rotating part for rotating the fixing table by 90 degrees between the first spindle and the second spindle; It provides a singulation device including a vertical reciprocating motion for lifting the first and second spindles.

The fixing table is provided with a chuck for fixing the package of the window unit.

The present invention also preferably further comprises a vision camera capable of detecting whether the package of the window type fixed to the fixing table is fixed to the normal position.

The present invention also preferably further includes a vision camera for detecting whether the cut-out chip size package is in a position where it can be cut properly.

The linear reciprocating portion and the vertical reciprocating portion are driven by a motor and a motor, respectively, and have a drive shaft formed with a thread.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a chip size package in a conventional strip form, in which a plurality of square packages indicated by W are connected in one direction.

FIG. 2 is a perspective view illustrating a cutting part for cutting the chip size package of FIG. 1 in a window (W) unit, wherein the chip size package 21 is seated on the holder 20, and a plurality of chips are provided at the edges of the holder 20. Two projections 20a are positioned so that the chip size package 21 is seated in place. The first vision camera 24 is positioned on the upper part of the fixture 20 to detect whether the chip size package 21 is seated in position. Operation and configuration of this vision camera 24 is similar to a conventional vision camera, so detailed description thereof will be omitted.

The chip size package 21 seated on the holder 20 is cut into a package of a window W unit as shown in FIG. 1 by the cutter 22. This window unit package usually includes 15 to 20 units, and the number of units in the present invention is not limited. However, the package of the window unit is formed in a substantially square shape to facilitate the cutting in the X and Y directions to be described later. The cutter 22 may be formed in various forms, for example, a small crop method may be applied.

The package W of one window unit separated by the cutter 22 is mounted to the transfer unit 23 and transferred to a singulation machine, which will be described later. The transfer unit 23 may be formed in various forms, and for example, as shown in the drawing, a plurality of slide rods 23a may be adopted to push the plate at both edges in a general plate shape.

Figure 3 shows an example of a singulation machine according to the present invention, Figure 4 is a detailed enlarged view, the singulation machine is a fixing table for fixing the package (W) of the window unit transferred from the transfer unit is fixed (35), the X-direction linear reciprocating portion 45 consisting of a motor 39, the reduction portion 40 and the shaft 36 to linearly move the fixing table in one direction, and the X-direction linear reciprocating portion ( 45 perpendicularly parallel to each other, and having the first and second spindles 31 and 32 on which the blades 33 are mounted, and the first and second spindles 31 and 32, respectively, in the Z direction. The reciprocating part 47 is provided.

The fixing table 35 is shown in detail in FIG. 6, and a chuck 61 capable of fixing the package W in a window unit is mounted on the bar 35. The fixing table 35 may be a single layer, or may be formed in a two-layer structure as shown in the figure, and the lower portion thereof is fixed to the horizontal movement table 50 reciprocating by the X-direction linear reciprocating portion 45. It is.

The fixed table 35, that is, the linear reciprocating motion 45 in the X direction for linear reciprocating motion of the horizontal motion table 50 has a motor 39 and a gear box for reducing the rotational speed of the motor 39. Phosphorus reduction unit 40 and the shaft 36 is connected to the outlet of the reduction unit 40. The motor 39 is a motor capable of rotating by automatically or manually converting forward / reverse rotation by a controller (not shown). The shaft 36 is formed with a screw thread and penetrates the horizontal movement table 50. Accordingly, when the motor 39 is operated, the shaft 36 is rotated in a state in which the rpm is decelerated in the reduction unit 40, and the horizontal movement table 50 is rotated along the rotation of the shaft along the guide not shown in FIG. 4. It is moved in the direction of the arrow or vice versa. The guide may be a guide rail type installed below the horizontal movement table 50.

The first and second spindles 31 and 32 are arranged in parallel with each other, and for example, as shown in FIG. 4, may rotate in the same direction or may rotate in opposite directions. There are a plurality of blades 33 mounted on each spindle 31, 32, which can be understood through FIG. 5. The blade mounting portion of the spindle 31 has a plurality of blade spacing adjusting members 53 positioned between the first and second flanges 51a and 51b in a tapered rod shape so that the ends thereof are narrow. The blades 33a, 33b, 33c, 33d are mounted on the blades. The spacing controlled by the plurality of spacing adjusters 53 may have various widths depending on the size of the package W of the window unit to be cut, the spacing of the internal unit elements, and the like. The blades and the spacing adjuster between the first and second flanges 51a and 51b are fixed to the rods of the spindles 31 and 32 by fasteners 52 located at the outer side, and the threads and the inside of the fixtures formed at the ends of the rods. The threads of the teeth are engaged with each other, and is firmly coupled by a not shown fixing bolt penetrating the fixture 52 and the second flange 51b.

Each spindle 31, 32 is movable by the Y-direction linear reciprocating portion 46 and the pusher 48 in the Y-direction on the drawing by the same principle as the X-direction linear reciprocating movement portion 45 described above. In addition, the Z-direction up and down movement portion 47 is also composed of a similar assembly to move each spindle 31, 32 in the Z direction. In addition, the second vision camera 37 is located next to the X-direction side of the first spindle 31, which detects whether the package (W) in the unit of the window seated on the fixing table 35 is seated in place. As a camera, it is similar in function and function to a conventional vision camera.

38, which is not described, shows a computer system for controlling the apparatus according to the present embodiment.

Hereinafter, referring to FIG. 4, a process in which the first and second spindles 31 and 32 cut the package W in the window unit in the unit according to the present embodiment will be described. 4 shows the fixing table 35 at each position as the horizontal movement table 50 moves in the direction of the arrow for convenience of description.

First, when the package unit W in the unit of window is transferred to and seated on the fixing table 35, the second vision camera 37 detects whether it is seated in position and is normally mounted. In this case, the horizontal table 50 is moved by the X-direction linear reciprocating unit (45 in FIG. 3), and is fixed in the lower part of the first spindle 31 in the cutting position by moving in the Y-direction and Z-direction beforehand. 35).

In this position, the package W in the window unit is cut in the X direction by the blade 33 mounted on the first spindle 31. The package W of the window unit cut in the X direction is rotated by 90 ° before being moved to the second spindle 32, and this rotation can be made by a common rotation axis, and the present invention does not limit the rotation structure. .

The package W rotated by 90 ° is cut in the Y direction (package basis) by the blade 33 of the second spindle 32, which is also moved to the cutting position, so that the desired unit 34 can be finally removed. do. The cutting in the X direction and the cutting in the Y direction can be performed by separating the strip-shaped chip size package into square window packages.

While the embodiments of the present invention have been described above, these are merely examples, and the spirit of the present invention is not limited thereto, and various changes and modifications may be possible. However, it will be understood through the appended claims that such changes and modifications fall within the scope of the present invention.

As described above, according to the present invention, the chip size package in the form of a strip is first divided into packages of square window units, and then one chip is cut by two spindles and a plurality of blades in the X and Y directions. By minimizing the movement of each unit (package) by completing all singulation operations by the process flow of the size package, there is no time to move the spindle, so the time loss for each unit's position can be minimized. You can enjoy the advantages of installing multiple blades as much as the total number of X and Y cuts of the chip size package of the shape, and also increase the accuracy of larger products because the cutting process is performed less during singulation.

Claims (4)

Cutting the chip size package in strip form into a window-shaped package in substantially square form; Transferring the package in units of windows to a first spindle having a plurality of blades; Cutting the package of the window unit with the plurality of blades of the first spindle in the X direction; Conveying the package cut in the X direction to a second spindle having a plurality of blades; Cutting the package of the window unit in the Y direction with a plurality of blades of the second spindle Singulation method of chip size package in the form of strips The method according to claim 1, The package cut in the X direction is rotated by 90 ° is transferred to the second spindle direction and the singulation method is cut in the Y direction. A cutting unit for cutting a chip size package in a strip shape into a package in a window unit having a square shape; A transfer unit for transferring a package of a window unit cut at the cutting unit; A fixing table for fixing a package of a window unit transferred from the transfer unit; A linear reciprocating unit for linearly reciprocating the fixing table; A first spindle having a blade mounting portion on which a plurality of blades are mounted, arranged in a direction perpendicular to the linear reciprocating direction in a first position, and rotating in one direction; A second spindle arranged in parallel with said first spindle at a second position spaced from said first position, said second spindle having a blade mounting portion and rotating in one direction; A fixing table rotating part for rotating the fixing table by 90 degrees between the first spindle and the second spindle; Z direction up and down reciprocating unit for raising and lowering the first and second spindles Singulation device of the chip size package of the strip type including a The method according to claim 3, A singulation device further comprising a vision camera that can detect whether the package of the window type fixed to the fixing table is fixed to the normal position