KR102876094B1 - Stack-based high temperature superconductor joint, current lead, stacks-in-conduit conductor and magnet - Google Patents

Abstract

A conductor assembly according to one embodiment of the present invention comprises a high-temperature superconducting wire stack in which a plurality of high-temperature superconducting wires are laminated; and a copper wrapping or copper tube arranged to surround each of the high-temperature superconducting wire stacks.

Description

STACK-BASED HIGH TEMPERATURE SUPERCONDUCTOR JOINT, CURRENT LEAD, STACKS-IN-CONDUIT CONDUCTOR AND MAGNET

The present invention relates to a stack-based high-temperature superconducting conductor and magnet, and more particularly, to a conductor inside a high-temperature superconducting magnet manufactured by stacking high-temperature superconducting wires, a high-temperature superconducting magnet, a stack-based high-temperature superconducting joint, and a stack-based high-temperature superconducting current lead.

A compact fusion reactor for neutron and energy production consists of a toroidal plasma chamber and a plasma confinement system that generates a magnetic field. Superconducting toroidal magnets operating at temperatures below 77K are used to generate the plasma. The toroidal magnetic field can be increased to 5T or more to increase neutron and energy output. The performance of these magnet cables is a critical factor in determining the performance of the large magnets that generate large amounts of plasma.

However, in the case of the toroidal low-temperature superconducting magnets used in the past, it is difficult to generate an ultra-high magnetic field of 16 T or more due to the characteristics of the material itself, and the cooling cost is very high due to the operation of liquid helium around 4.2 K, so not only is it low in economic feasibility, but it is also difficult to protect the magnet from damage due to overcurrent, so there is a problem that the thermal stability is low and the mechanical strength characteristics that can withstand the strong Lorentz force without performance degradation occur, resulting in a decrease in performance due to repeated application of electromagnetic force.

Accordingly, development of a high-current cable in the form of a conductor inside a conduit is being carried out so that it can be used as a replacement for a high-temperature superconducting magnet. Specifically, the high-temperature superconductor developed by Advanced Conductor technology in the United States (https://www.advancedconductor.com/corccable/cables-and-wires-for-fusion-magnets/) is composed of a hollow circular cable with multiple high-temperature superconductors in the form of cables with a circular cross-section surrounding the hollow core, and the high-temperature superconductor developed by ENEA in Italy (celentano, G., et al. "Design of an Industrially Feasible Twisted-Stack HTS Cable-in-Conduit Conductor for Fusion Application", IEEE Trans. Appl. Supercon. 24, no. 3 (2013):1-5.) is composed of a long cylindrical cable with twisted copper spacers arranged around the hollow core. In the case of the high-temperature superconductor developed by MIT PSFC in the U.S. (Hartwig, Zachary S., et al. "an industrially scalable high-current high-temperature super conductor cable.", Supercond. Sci. Technol. 33, no. 11(2020); 11LT01), it is also configured to include a hollow section within a cable with a circular cross-section and to have multiple HTSs in the form of a cable with a square cross-section arranged around the hollow section, and in the case of the high-temperature superconductor developed by Accelerator Research Laboratory in the U.S. (Mclntyre, Peter M., John Rogers, and Akhdiyor Sattarov. "Blocks-in-Conduit: REBCO cable for a 20T@20K toroid for compact fusion tokamaks.", IEEE Trans. Appl. Supercond. 31, no. 5 (2021): 1-5.), multiple rectangular high-temperature superconductors are also arranged around a cylindrical cable with a hollow section. It has been configured so that there are additional cylindrical spaces between multiple superconductors.

Furthermore, Korean Patent Publication No. 2021-0026613 discloses a high-temperature superconducting wire having a multilayer structure in which superconducting layers are laminated. The high-temperature superconducting wire manufactured in the above prior art document was manufactured by stacking multiple layers on top of a single layer.

However, the configuration of these conventional high-temperature superconductors (HTS) under development has the problem of not being able to exhibit sufficient performance and system life as a toroidal superconductor.

The purpose of the present invention to solve the above problems is to provide a high-temperature superconducting magnet or a conductor inside a tube for a high-temperature superconducting magnet, which can generate an ultra-high magnetic field of 20 T or more and operate at 20 K, thereby exhibiting high economic efficiency due to low cooling costs, as well as exhibiting high stability due to non-insulation or partial insulation, and increasing the operating life of the system due to excellent mechanical properties.

According to one embodiment of the present invention, even if different currents flow due to lead resistance among high-temperature superconducting stacks, when the resistance increases due to a heat source, a current redistribution phenomenon occurs in which the current flows uniformly throughout the stack.

The technical problem to be solved by the present invention is to provide a high-temperature superconducting wire stack, a high-temperature superconducting bundle, a lead, a connector, an electromagnet, and an electromagnet system, in which, even if different currents flow due to the lead resistance of one high-temperature superconducting stack among high-temperature superconducting bundles, when the resistance increases due to a heat source, a current redistribution phenomenon occurs in which the current flows uniformly throughout the entire stack.

The technical problem to be solved by the present invention is to provide a wound coil by winding using a high-temperature superconducting wire stack, and to provide an electromagnet in which structural stability and ?? stability are secured by filling the space area with SUS reinforcing material during winding.

The technical problem to be solved by the present invention is to provide a wound coil wound with a high-temperature superconducting wire stack including a metal insulating layer, reduce the charge/discharge time by using the metal insulating layer due to small inductance, and provide an electromagnet with secured voltage stability.

The technical problem to be solved by the present invention is to provide a joint, connector, and lead using a high-temperature superconducting wire stack to provide a stable electrical connection.

The technical problems to be solved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

The scope of the present invention is indicated by the claims described below, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention.

A conductor assembly according to one embodiment of the present invention comprises a high-temperature superconducting wire stack in which a plurality of high-temperature superconducting wires are laminated; and a copper wrapping or copper tube arranged to surround each of the high-temperature superconducting wire stacks.

In one embodiment of the present invention, a high-temperature superconducting wire bundle in which the high-temperature superconducting wire stack is two-dimensionally arranged can be provided.

In one embodiment of the present invention, in the high-temperature superconducting wire stack, the number of times the high-temperature superconducting wires are stacked may have a thickness corresponding to the width of the high-temperature superconducting wire.

In one embodiment of the present invention, each of the high-temperature superconducting wires includes: a substrate; a buffer layer disposed on the substrate; a high-temperature superconducting layer disposed on the buffer layer; and a protective layer disposed to surround the high-temperature superconducting layer and the substrate, wherein the protective layer may be a copper thin film.

In one embodiment of the present invention, the thickness of each of the high-temperature superconducting wires may be 40 to 150 micrometers, and the width of each of the high-temperature superconducting wires may be 2 to 12 millimeters.

In one embodiment of the present invention, the copper wrapping may have a thickness of 40 micrometers to 120 micrometers, and the width of the copper wrapping may be 20 millimeters to 120 millimeters.

In one embodiment of the present invention, the copper wrapping is spiral wrapping, and the ratio of the area with the copper wrapping and the area without the copper wrapping along the longitudinal direction of the high-temperature superconducting wire may be 1:0 to 1:3.

In one embodiment of the present invention, the high-temperature superconductor wire bundle may be a multiple of 2 in the width direction of the high-temperature superconducting wire stack and a multiple of 2 in the height direction of the high-temperature superconducting wire stack.

In one embodiment of the present invention, the copper tube arranged to surround each of the high-temperature superconducting wire stacks may have a rectangular shape in cross-section and may have a portion that is soldered to each other in the longitudinal direction of the high-temperature superconducting wire stack.

In one embodiment of the present invention, the copper tubes arranged to surround each of the high-temperature superconducting wire stacks may have five sides, but may be overlapped and then soldered to have a square shape in the cross-section.

An assembly conductor according to one embodiment of the present invention includes a high-temperature superconducting wire stack in which a plurality of high-temperature superconducting wires are stacked and a solder layer is included between adjacent high-temperature superconducting wires.

In one embodiment of the present invention, the high-temperature superconducting wire stacks may include a high-temperature superconducting wire bundle arranged two-dimensionally.

In one embodiment of the present invention, the thickness of the solder layer may be 5 micrometers to 30 micrometers.

In one embodiment of the present invention, in the high-temperature superconducting wire stack, the number of times the high-temperature superconducting wires are stacked may have a thickness corresponding to the width of the high-temperature superconducting wire.

In one embodiment of the present invention, each of the high-temperature superconducting wires includes: a substrate; a buffer layer disposed on the substrate; a superconducting layer disposed on the buffer layer; and a protective layer disposed to surround the superconducting layer and the substrate, wherein the protective layer may be a copper thin film.

In one embodiment of the present invention, the thickness of each of the high-temperature superconducting wires may be 40 to 150 micrometers, and the width of each of the high-temperature superconducting wires may be 4 to 12 millimeters.

A conductor assembly according to one embodiment of the present invention comprises: a high-temperature superconducting wire bundle in which high-temperature superconducting wire stacks are two-dimensionally arranged; a conduit arranged to surround the high-temperature superconducting wire bundle; and a copper spiral that surrounds the high-temperature superconducting wire bundle and provides a cooling channel.

In one embodiment of the present invention, the porosity (the ratio of the area of the refrigerant passage to the total cross-sectional area within the conduit) of the assembly conductor may be 10 to 30 percent.

In one embodiment of the present invention, the thickness of the copper spiral may be 1 millimeter to 5 millimeters.

In one embodiment of the present invention, the ratio of the area with the copper spiral and the area without the copper spiral along the longitudinal direction of the conduit may be 1:0.3 to 1:3.

In one embodiment of the present invention, the high-temperature superconducting wire bundle may further include rigid plates arranged on the upper and lower surfaces, respectively.

A conductor assembly according to one embodiment of the present invention may include a high-temperature superconducting wire bundle in which high-temperature superconducting wire stacks are two-dimensionally arranged; a conduit arranged to surround the high-temperature superconducting wire bundle; and a copper capping portion providing a cooling channel between the high-temperature superconducting wire bundle and the conduit.

In one embodiment of the present invention, the copper capping portion may include a first copper capping portion arranged to surround the upper surface and upper side surface of the high-temperature superconducting wire bundle; and a second copper capping portion arranged to surround the lower surface and lower side surface of the high-temperature superconducting wire bundle.

In one embodiment of the present invention, the first copper capping portion includes a trench formed on its upper surface, the second copper capping portion includes a trench formed on its lower surface, and the trench can provide an auxiliary refrigerant passage through which refrigerant flows.

In one embodiment of the present invention, the copper capping portion and the SUS spiral arranged to surround the high-temperature superconducting wire bundle may be further included.

In one embodiment of the present invention, the thickness of the copper capping portion may be 1 millimeter to 5 millimeters.

A high-temperature superconducting wire stack according to one embodiment of the present invention comprises: a plurality of high-temperature superconducting wires stacked in sequence; and at least one metal insulating tape stacked together with the high-temperature superconducting wires.

In one embodiment of the present invention, the metal insulating tape may be placed on at least one of the uppermost surface or the lowermost surface of the high-temperature superconducting wire stack.

In one embodiment of the present invention, the high-temperature superconducting wires can slide relative to each other.

In one embodiment of the present invention, the contact resistance of the adjacent high-temperature superconducting wires may be several uOmh/m.

In one embodiment of the present invention, the length of the high-temperature superconducting wire stack may be 100 meters to 500 meters.

In one embodiment of the present invention, the thicknesses of the high-temperature superconducting wires may be different from each other.

A high-temperature superconducting electromagnet according to one embodiment of the present invention is wound with a stack of high-temperature superconducting wires having a rectangular cross-section. The high-temperature superconducting electromagnet comprises: a bobbin; and a stack of high-temperature superconducting wires wound around the bobbin to form a plurality of layers. In each of the wound layers, an unwound space is arranged, and the space is filled with a reinforcing material.

In one embodiment of the present invention, the width of the space space is the same as the width of the high-temperature superconducting wire stack, and the reinforcing material may be stainless steel.

In one embodiment of the present invention, the electromagnet has a straight section and a curved section, and in the development view, the space area in the straight section is a triangle, and in the development view, the space area in the curved section is a rectangle, and in each layer, the space area of the curved section is arranged on the left or the right, and in each layer, the space area of the straight section includes a first triangular area on the left and a second triangular area on the right, and when the first triangular area and the second triangular area are in contact with each other, they can form a rectangle.

In one embodiment of the present invention, when the layers change as the high-temperature superconducting wire stack is wound, the reinforcing material disposed thereunder may have a tapered slope.

In one embodiment of the present invention, a clamp for fixing the coiled high-temperature superconducting wire stack may be further included.

In one embodiment of the present invention, the clamp may include a pair of half rings arranged to surround the uppermost winding; and a clamp connecting portion that connects the half rings to each other. The half rings may be connected to each other to form a closed curve.

In one embodiment of the present invention, the electromagnet has a straight section and a curved section, and the second layer wound in the side view may be composed solely of a reinforcing material, or the third layer wound in the side view may be composed solely of a reinforcing material. In the side view, the straight section may be composed solely of a reinforcing material.

In one embodiment of the present invention, the space between the high-temperature superconducting wire stacks in each coiled layer can be filled by impregnation with a conductive epoxy.

In one embodiment of the present invention, the high-temperature superconducting wire stack may include a plurality of high-temperature superconducting wires stacked in sequence; and at least one metal insulating tape stacked together with the high-temperature superconducting wires.

In one embodiment of the present invention, a connection lead connected to one end of the high-temperature superconducting wire stack may be further included.

A high-temperature superconducting electromagnet according to one embodiment of the present invention is wound with a winding unit including a high-temperature superconducting wire stack having a rectangular cross-section. The high-temperature superconducting electromagnet includes: a bobbin; and a winding unit wound around the bobbin to form a plurality of layers. In each of the wound layers, an unwound space is arranged, and the width of the space is the same as the width of the high-temperature superconducting wire stack. The space is filled with a reinforcing material.

In one embodiment of the present invention, the winding unit may include a high-temperature superconducting bundle arranged with at least one high-temperature superconducting wire stack; and at least one conductive cooling channel extending in parallel and in contact with the high-temperature superconducting bundle.

In one embodiment of the present invention, the winding unit may further include a copper plate on which the high-temperature superconducting bundle and the conductive cooling channel are mounted.

In one embodiment of the present invention, the reinforcing agent may be stainless steel.

In one embodiment of the present invention, the high-temperature superconducting wire stack may include a plurality of high-temperature superconducting wires stacked in sequence; and at least one metal insulating tape stacked together with the high-temperature superconducting wires.

In one embodiment of the present invention, a connection lead connected to one end of the winding unit may be further included.

A high-temperature superconducting stack lead according to one embodiment of the present invention includes a high-temperature superconducting wire stack in which a plurality of high-temperature superconducting wires are stacked; and a connection lead connected to one end of the high-temperature superconducting wire stack.

In one embodiment of the present invention, the connection lead comprises: a lower plate having a solder bath for accommodating one end of the high-temperature superconducting wire stack; an upper plate having a supply port for supplying solder to the solder bath; and a copper tape inserted between the high-temperature superconducting wires accommodated in the solder bath. The solder fills the solder bath and bonds the high-temperature superconducting wires and the copper tape to each other.

In one embodiment of the present invention, the upper plate further includes a protrusion that protrudes in response to the solder bath. The protrusion can align with the solder bath and press one end of the high-temperature superconducting wire stack.

In one embodiment of the present invention, the high-temperature superconducting wire stack may include a plurality of high-temperature superconducting wires stacked in sequence; and at least one metal insulating tape stacked together with the high-temperature superconducting wires.

In one embodiment of the present invention, the connection lead may include a lower plate having a solder bath that accommodates one end of the high-temperature superconducting wire stack; and an upper plate having a supply port that supplies solder to the solder bath. The solder may fill the solder bath and join the high-temperature superconducting wires to each other.

A high-temperature superconducting stack joint according to one embodiment of the present invention includes: a first high-temperature superconducting wire stack in which a plurality of high-temperature superconducting wires are stacked; a second high-temperature superconducting wire stack in which a plurality of high-temperature superconducting wires are stacked; and a joint that connects one end of the first high-temperature superconducting wire stack to one end of the first high-temperature superconducting wire stack.

In one embodiment of the present invention, the joint may include a lower plate having a solder bath that accommodates one end of the first high-temperature superconducting wire stack and one end of the second high-temperature superconducting wire stack; and an upper plate having a supply port that supplies solder to the solder bath. The high-temperature superconducting wires constituting the first high-temperature superconducting wire stack and the high-temperature superconducting wires constituting the second high-temperature superconducting wire stack may be alternately stacked. The solder may join the alternately stacked high-temperature superconducting wires to each other.

In one embodiment of the present invention, the joint may include a lower plate having a solder bath that accommodates one end of the first high-temperature superconducting wire stack and one end of the second high-temperature superconducting wire stack; and an upper plate having a supply port that supplies solder to the solder bath. One end of the first high-temperature superconducting wire stack and one end of the second high-temperature superconducting wire stack may extend parallel to each other, and a copper tape may be inserted between the high-temperature superconducting wires of the first high-temperature superconducting wire stack accommodated in the solder bath and the high-temperature superconducting wires of the second high-temperature superconducting wire stack. The solder may fill the solder bath and bond the high-temperature superconducting wire and the copper tape to each other.

In one embodiment of the present invention, each of the first high-temperature superconducting wire stack and the first high-temperature superconducting wire stack may include a plurality of high-temperature superconducting wires sequentially stacked; and at least one metal insulating tape stacked together with the high-temperature superconducting wires.

A high-temperature superconducting current connector according to one embodiment of the present invention comprises: a high-temperature superconducting bundle including at least one high-temperature superconducting wire stack; a first connection lead arranged at one end of the high-temperature superconducting bundle; and a second connection lead arranged at one end of the high-temperature superconducting bundle. The high-temperature superconducting wire stack comprises a plurality of high-temperature superconducting wires stacked together.

In one embodiment of the present invention, each of the first connection lead and the second connection lead comprises: a lower plate having a solder bath for accommodating one end of the high-temperature superconducting bundle; an upper plate having a supply port for supplying solder to the solder bath; and a copper tape inserted between high-temperature superconducting wires constituting the high-temperature superconducting bundle accommodated in the solder bath. The solder can fill the solder bath and bond the high-temperature superconducting wires and the copper tape to each other.

In one embodiment of the present invention, the high-temperature superconducting wire stack may include a plurality of high-temperature superconducting wires stacked in sequence; and at least one metal insulating tape stacked together with the high-temperature superconducting wires.

According to one embodiment of the present invention, a superconducting electromagnet device comprises: a vacuum chamber; a toroidal liquid nitrogen chamber disposed inside the vacuum chamber for heat shielding and storing liquid nitrogen; a pair of connecting rods having a central hole formed in a central axis and connected to the liquid nitrogen chamber to supply liquid nitrogen through the central hole and to be cooled to an absolute temperature of 77 K; a pair of cryogenic refrigerators disposed inside the vacuum chamber for cooling to an absolute temperature of 20 K; a pair of thermal links respectively connected to the refrigerators; a high-temperature superconducting electromagnet cooled by thermal contact with the pair of thermal links; an insulating block coupled to the thermal links; a conductive cooling block coupled to the insulating block and maintained at the absolute temperature of 20 K; and a high-temperature superconducting current connector interconnecting the connecting rod and the conductive cooling block. The high-temperature superconducting electromagnet can supply current through the connecting rod, the high-temperature superconducting current connector, and the conductive cooling block.

In one embodiment of the present invention, the high-temperature superconducting current connector may include a high-temperature superconducting bundle including at least one high-temperature superconducting wire stack; a first connection lead disposed at one end of the high-temperature superconducting bundle; and a second connection lead disposed at a terminal end of the high-temperature superconducting bundle.

In one embodiment of the present invention, the high-temperature superconducting electromagnet comprises: a bobbin; and a stack of high-temperature superconducting wires having a rectangular cross-section wound around the bobbin to form a plurality of layers. In each of the wound layers, an unwound space is arranged, and the space can be filled with a reinforcing material.

According to an embodiment of the present invention, it is an object to provide a laminated tube conductor for a high-temperature superconducting magnet that can generate an ultra-high magnetic field of 20 T or more and operate at 20 K, thereby exhibiting high economic efficiency due to low cooling costs, as well as exhibiting high thermal stability due to non-insulation or partial insulation and increasing the operating life of the system due to excellent mechanical properties.

In addition, according to an embodiment of the present invention, a method for lengthening a high-temperature superconducting wire capable of being extended can be provided.

The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the composition of the invention described in the claims.

FIG. 1 is a schematic diagram showing an example of manufacturing an internal conductor for a high-temperature superconducting magnet according to one embodiment of the present invention.
Figure 2 is a schematic diagram showing an example of manufacturing an in-tube conductor for a high-temperature superconducting magnet according to another embodiment of the present invention.
FIG. 3 is a schematic diagram showing an example of manufacturing an in-tube conductor for a high-temperature superconducting magnet according to another embodiment of the present invention.
Fig. 4 is a schematic diagram showing an example of manufacturing an in-tube conductor for a high-temperature superconducting magnet according to another embodiment of the present invention.
Fig. 5 is a schematic diagram showing an example of manufacturing an in-tube conductor for a high-temperature superconducting magnet according to another embodiment of the present invention.
FIG. 6 is a schematic diagram showing a method for lengthening a high-temperature superconducting wire of a conductor in a high-temperature superconducting magnet according to an embodiment of the present invention.
FIG. 7 is a schematic diagram showing a method for forming a high-temperature superconducting wire of a conductor inside a high-temperature superconducting magnet according to another embodiment of the present invention.
This is a schematic diagram showing a cryogenic circuit model for an experiment of an in-tube conductor for a high-temperature superconducting magnet according to an embodiment of the present invention of FIG. 8.
FIG. 9 is a graph showing the hysteresis loss of an in-tube conductor for a high-temperature superconducting magnet according to one embodiment of the present invention.
FIG. 10 is a graph showing the change in temperature during a magnet charging process according to an example of manufacturing conductors in a high-temperature superconducting magnet according to an embodiment of the present invention.
FIG. 11a is a graph showing changes in pressure, temperature, and mass flow rate over time in a conductor inside a high-temperature superconducting magnet according to one embodiment of the present invention.
FIG. 11b is a graph showing changes in pressure, temperature, and mass flow rate over time in a conductor inside a high-temperature superconducting magnet according to another embodiment of the present invention.
FIG. 12a is a perspective view showing a high-temperature superconducting wire stack of a collective conductor according to one embodiment of the present invention.
Figure 12b is a cross-sectional view of the high-temperature superconducting wire stack of Figure 12a.
Fig. 13 is a cross-sectional view showing the high-temperature superconducting wires that constitute the high-temperature superconducting wire stack of Fig. 12b.
Figure 14 is a perspective view showing a high-temperature superconductor wire bundle in which the high-temperature superconducting wire stacks of Figure 12a are arranged.
FIG. 15a is a perspective view showing a high-temperature superconducting wire stack of a collective conductor according to one embodiment of the present invention.
Figures 15b, 15c, and 15d are cross-sectional views of the high-temperature superconducting wire stack of Figure 15a.
Figure 16 is a perspective view showing a high-temperature superconductor wire bundle in which the high-temperature superconducting wire stacks of Figure 15a are arranged.
FIG. 17a is a perspective view showing a high-temperature superconducting wire stack of a collective conductor according to one embodiment of the present invention.
Figures 17b and 17a are cross-sectional views of the high-temperature superconducting wire stack.
Figure 18 is a perspective view showing a high-temperature superconductor wire bundle in which the high-temperature superconducting wire stacks of Figure 17a are arranged.
FIG. 19a is a perspective view of a composite conductor according to one embodiment of the present invention.
Figure 19b is a cross-sectional view of the composite conductor of Figure 19a.
Figure 19c is a cross-sectional view of the high-temperature superconducting wire bundle of Figure 19a.
FIG. 20a is a perspective view of a composite conductor according to one embodiment of the present invention.
Figure 20b is a cross-sectional view of the composite conductor of Figure 20a.
Figure 20c is a cross-sectional view of the high-temperature superconducting wire bundle of Figure 20a.
Figure 21 is a conceptual diagram illustrating a method for manufacturing a composite conductor according to one embodiment of the present invention.
Figure 22 is a conceptual diagram illustrating a method for manufacturing a composite conductor according to one embodiment of the present invention.
Figure 23a is a perspective view illustrating a high-temperature superconducting magnet device according to one embodiment of the present invention.
Figures 23b, 23c, and 23d are drawings showing the cryogenic refrigerator, cooling structure, and electrical connection structure of the high-temperature superconducting magnet device of Figure 23a.
Figure 24 is a conceptual diagram illustrating a high-temperature superconducting magnet device according to one embodiment of the present invention.
Fig. 25 is a plan view illustrating the high-temperature superconducting magnet device of Fig. 24.
Figure 26 is a conceptual diagram illustrating a high-temperature superconducting magnet device according to another embodiment of the present invention.
FIG. 27 is a drawing showing a D-type high-temperature superconducting electromagnet according to one embodiment of the present invention.
Fig. 28 is a drawing showing the D-type high-temperature superconducting electromagnet of Fig. 27.
FIGS. 29a and 29b are conceptual diagrams showing a high-temperature superconducting wire stack lead according to one embodiment of the present invention.
FIG. 29c is an exploded perspective view showing a high-temperature superconducting wire stack lead according to one embodiment of the present invention.
Fig. 30 is a conceptual diagram showing a series-connected high-temperature superconducting electromagnet according to one embodiment of the present invention.
FIGS. 31a and 31b are conceptual diagrams illustrating a high-temperature superconducting stack joint according to one embodiment of the present invention.
FIG. 31c is an exploded perspective view showing a high-temperature superconducting stack joint according to one embodiment of the present invention.
FIGS. 32a and 32b are conceptual diagrams illustrating a high-temperature superconducting stack joint according to one embodiment of the present invention.
FIG. 32c is an exploded perspective view showing a high-temperature superconducting stack joint according to one embodiment of the present invention.
FIG. 33a is a conceptual diagram illustrating a high-temperature superconducting current connector according to one embodiment of the present invention.
Figure 33b is an exploded perspective view showing the high-temperature superconducting current connector of Figure 33a.
Figure 34 is a conceptual diagram showing a high-temperature superconducting bundle according to one embodiment of the present invention.
FIG. 35 is a photograph showing a high-temperature superconducting current connector according to one embodiment of the present invention.
Figures 36a and 36b are experimental results showing the current-voltage characteristics of the high-temperature superconducting current connector of Figure 35.
FIG. 37 is a drawing showing the structure of a high-temperature superconducting current connector according to one embodiment of the present invention.
Figure 38a shows the time-dependent change in the current applied to the bundle including the 2X2 stack of Figure 37.
Figure 38b shows the voltage variations between individual stacks, stacks, and the entire stack, between leads.
Figure 38c shows the voltage change between stacks.
Figure 38d shows the voltage changes between individual stacks, the entire stack, and the leads.
FIG. 39a is an exploded perspective view showing a high-temperature superconducting bundle lead according to one embodiment of the present invention.
Figure 39b is a conceptual diagram showing the high-temperature superconducting bundle lead of Figure 39a.
Figure 40 is a drawing showing a winding coil having an insulating layer and a winding coil not having an insulating layer.
FIG. 41a is a conceptual diagram illustrating a high-temperature superconducting wire stack according to one embodiment of the present invention.
Figure 41b is a circuit diagram showing the contact resistance and inductance of the high-temperature superconducting wire stack of Figure 41a.
Figure 41c is a circuit diagram showing the contact resistance and inductance of the high-temperature superconducting wire stack of Figure 41a.
Figure 42 is a conceptual diagram showing a high-temperature superconducting wire stack according to one embodiment of the present invention.
Figure 43 is a conceptual diagram showing a high-temperature superconducting wire stack according to one embodiment of the present invention.
Figure 44 is a conceptual diagram showing a high-temperature superconducting wire stack and a thickness distribution of the high-temperature superconducting wire according to one embodiment of the present invention.
Figure 45a shows a coil wound with one high-temperature superconducting wire.
FIG. 45b illustrates a coil wound using a high-temperature superconducting wire stack according to one embodiment of the present invention.
FIG. 46a is a perspective view showing a high-temperature superconducting electromagnet according to one embodiment of the present invention.
Figure 46b is a conceptual diagram showing the high-temperature superconducting magnet of Figure 46a.
Fig. 47 is a development diagram showing the high-temperature superconducting magnet of Fig. 46.
Figure 48 is a conceptual diagram illustrating an electromagnet according to another embodiment of the present invention.
FIGS. 49a and 49b are side views illustrating an electromagnet according to another embodiment of the present invention.
FIG. 50 is a drawing illustrating a method for manufacturing a high-temperature superconducting electromagnet according to one embodiment of the present invention.
FIG. 51 is a drawing showing epoxy impregnation of a high-temperature superconducting electromagnet according to one embodiment of the present invention.
FIG. 52 is a photograph showing a high-temperature superconducting electromagnet according to one embodiment of the present invention. FIG. 51 is a photograph showing a high-temperature superconducting electromagnet according to one embodiment of the present invention.
Figure 53 shows a current-voltage characteristic curve when the current in a D-type coil according to one embodiment of the present invention is linearly increased over time, briefly stopped, and then linearly decreased again.
Figure 54 is a drawing showing a section in which current is applied to a D-type coil over time.
Figure 55 is actual measurement data showing changes in current over time applied to a D-type coil according to one embodiment of the present invention.
Figures 56a to 56c are simulation results showing the current redistribution phenomenon in a high-temperature superconducting stack or bundle.
Figure 57 is a conceptual diagram showing an electromagnet according to one embodiment of the present invention.
FIG. 58a is a plan view showing a high-temperature superconducting wire lead according to one embodiment of the present invention and a perspective view showing a high-temperature superconducting wire stack.
Figure 58b is a conceptual diagram showing the high-temperature superconducting wire lead of Figure 58a.

Hereinafter, the present invention will be described with reference to the attached drawings. However, the present invention can be implemented in various different forms and is therefore not limited to the embodiments described herein. In the drawings, irrelevant parts have been omitted for clarity of description, and similar parts have been designated with similar reference numerals throughout the specification.

FIG. 1 is a schematic diagram showing an example of manufacturing an internal conductor for a high-temperature superconducting magnet according to one embodiment of the present invention.

Referring to FIG. 1, (a) is a high-temperature superconducting tube including an inner conductor for the high-temperature superconducting magnet, and the high-temperature superconducting tube may include a jacket (110), a high-temperature superconducting wire (120), a metal plate (130), and a metal wrapping (140). (b) shows a side view of the inner conductor for the high-temperature superconducting magnet.

The jacket (110) is formed to surround the conductor inside the high-temperature superconducting magnet, and includes a high-temperature superconducting wire (120), a metal plate (130), and a metal wrapping (140) inside the jacket (110).

High-temperature superconducting wires (120) are overlapped and laminated within the jacket (110), and may be laminated spaced apart from each other left and right as shown in FIG. 1. The space between the high-temperature superconducting wires (120) laminated spaced apart from each other left and right can be utilized as a coolant passage for cooling the high-temperature superconducting wires (120). In addition, the high-temperature superconducting wires (120) can be extended, and the extension of the high-temperature superconducting wires (120) can be achieved by soldering a connecting portion for extension with another high-temperature superconducting wire for connection using copper or copper-coated SUS.

A metal plate (130) can be positioned between the laminated high-temperature superconducting wires (120), and the metal plate (130) can be fixed in a fixing manner including soldering, if necessary. The metal plate (130) can be made of copper, but is not limited thereto.

The metal wrapping (140) can be formed to surround the plurality of stacked high-temperature superconducting wires (120) and can be utilized to fix the high-temperature superconducting wires (120) inside the jacket (110). The space between the metal plate (130) and the metal wrapping (140) can be utilized as a coolant passage for cooling the high-temperature superconducting wires (120).

The metal for the above metal wrapping (140) may include, but is not limited to, copper or SUS.

The above high-temperature superconducting tube can perform cooling of the high-temperature superconducting wire (220) by a porous/refrigerant cooling method in which a coolant is injected into the space created by the high-temperature superconducting wire (120) and the metal plate (130).

Figure 2 is a schematic diagram showing an example of manufacturing an in-tube conductor for a high-temperature superconducting magnet according to another embodiment of the present invention.

Referring to FIG. 2, (a) is a high-temperature superconducting tube including an inner conductor for the high-temperature superconducting magnet, and the high-temperature superconducting tube may include a jacket (210), a high-temperature superconducting wire (220), a metal jig part (240), and a coolant passage (250). (b) shows a side view of the inner conductor for the high-temperature superconducting magnet.

The jacket (210) is formed to surround the inner conductor for the high-temperature superconducting magnet, and includes a high-temperature superconducting wire (220), a metal jig part (240), and a coolant passage (250) inside the jacket (210).

A plurality of high-temperature superconducting wires (220) can be stacked and wrapped with a wrapping portion (230) containing copper to form a high-temperature superconducting wire sub-unit. A plurality of high-temperature superconducting wire (220) sub-units can be stacked to form an assembly of high-temperature superconducting wires (220), and as illustrated in FIG. 2, the high-temperature superconducting wire (220) sub-units can be stacked while being spaced apart from each other left and right to form an assembly of high-temperature superconducting wires (220). In addition, the high-temperature superconducting wire (220) can be extended, and the extension of the high-temperature superconducting wire (220) can be achieved by performing copper wrapping on a connection portion with another high-temperature superconducting wire for extension and soldering the copper-wrapped connection portion.

The wrapping unit (230) can form the high-temperature superconducting wire (220) sub-unit by wrapping a plurality of stacked high-temperature superconducting wires (220) with copper, and the copper wrapping can be performed at least once per high-temperature superconducting wire (220) sub-unit.

The metal jig (240) can be positioned between the upper surface of the assembly of the high-temperature superconducting wires (220) and the inner wall of the tube and between the lower surface of the assembly of the high-temperature superconducting wires (220) and the inner wall of the tube, thereby allowing the assembly of the high-temperature superconducting wires (220) to be fixed inside the jacket (210). The metal jig (240) can include copper or aluminum, but is not limited thereto.

The coolant passage (250) is a space provided for cooling the high-temperature superconducting wires (120), and may include a space between the high-temperature superconducting wires (220) sub-units that are spaced apart from each other and stacked on the left and right, and a space between the assembly of the high-temperature superconducting wires (220) and the jacket (210).

The above high-temperature superconducting tube can cool the high-temperature superconducting wire (220) by a method that combines a method of injecting a coolant into the coolant passage (250) as a cooling method and a method of cooling by conduction of the metal jig (240) with the coolant coming into direct contact with the high-temperature superconducting wire (220).

FIG. 3 is a schematic diagram showing an example of manufacturing an in-tube conductor for a high-temperature superconducting magnet according to another embodiment of the present invention.

Referring to FIG. 3, (a) to (d) are high-temperature superconducting tubes including the above-described conductor for the high-temperature superconducting magnet, and show a method of fixing a high-temperature superconducting wire with different types of structures.

(a) to (c) may include a jacket (310), a high-temperature superconducting wire (320), a support structure (330), an elastic structure (340a), and a coolant passage (350).

The jacket (310) is formed to surround the inner conductor for the high-temperature superconducting magnet, and includes a high-temperature superconducting wire (320), a support structure (330), an elastic structure (340a), and a coolant passage (350) inside the jacket (310).

High-temperature superconducting wires (320) are overlapped and stacked within the tube to form an assembly of a plurality of high-temperature superconducting wires (320), and the assembly may be formed by stacking the plurality of high-temperature superconducting wires (320) spaced apart from each other on the left and right. In addition, the high-temperature superconducting wire (320) can be extended, and the extension of the high-temperature superconducting wire (320) can be achieved by performing copper wrapping on a connection portion with another high-temperature superconducting wire for extension and soldering the copper-wrapped connection portion.

The support structure (330) may be positioned on the upper surface of the assembly so that the assembly can be stably aligned inside the jacket (310).

The elastic structure (340a) is positioned between the support structure (330) and the jacket (310) and may include an empty space therein. The elastic structure (340a) may, together with the support structure (330), serve to secure the assembly within the jacket (310). The elastic structure (340a) may be manufactured in various forms as illustrated in (a) to (c), but is not limited thereto.

The coolant passage (350) is a space provided for cooling the high-temperature superconducting wires (320), and may include a space between the elastic structure (340a) and the jacket or a space between the high-temperature superconducting wires (320) and the jacket (310).

The above high-temperature superconducting tube can cool the high-temperature superconducting wire (320) by injecting a coolant into the coolant passage (250) as a cooling method and using a method in which the coolant comes into direct contact with the high-temperature superconducting wire (320).

The above (d) is a form in which the high-temperature superconducting wire (320) is fixed inside the jacket (310) using an H-shaped steel (340b) without an elastic structure (340a), unlike the above (a) to (c), and the other forms are not significantly different from (a) to (c).

Fig. 4 is a schematic diagram showing an example of manufacturing an in-tube conductor for a high-temperature superconducting magnet according to another embodiment of the present invention.

Referring to FIG. 4, (a) is a high-temperature superconducting tube including the inner conductor for the high-temperature superconducting magnet, and the high-temperature superconducting tube is manufactured by integrating the manufacturing methods of the inner conductor for the high-temperature superconducting magnet of FIG. 1 and FIG. 2.

(b) shows a side view of the inner conductor for the high-temperature superconducting magnet manufactured by integrating the methods of the above-described FIG. 1 and FIG. 2.

The jacket (410) is formed to surround the conductor inside the high-temperature superconducting magnet, and includes a high-temperature superconducting wire (420), a metal plate (440), and a coolant passage (450) inside the jacket (410).

A plurality of high-temperature superconducting wires (420) can be stacked and wrapped with a wrapping portion (430) containing copper to form a high-temperature superconducting wire sub-unit. The high-temperature superconducting wire (420) sub-units are stacked to form an assembly of high-temperature superconducting wires (420), and as illustrated in FIG. 4, the high-temperature superconducting wire (420) sub-units can be stacked while being spaced apart from each other left and right to form an assembly of high-temperature superconducting wires (420). In addition, the high-temperature superconducting wire (420) can be extended, and the extension of the high-temperature superconducting wire (420) can be achieved by performing copper wrapping on a connection portion with another high-temperature superconducting wire for extension and soldering the copper-wrapped connection portion.

The wrapping unit (430) can form the high-temperature superconducting wire (420) sub-unit by wrapping a plurality of stacked high-temperature superconducting wires (420) with copper, and the copper wrapping can be performed at least once per high-temperature superconducting wire (420) sub-unit.

A metal plate (440) may be positioned between the stacked high-temperature superconducting wire (420) sub-units, and may serve to stabilize the high-temperature superconducting wires (420) by fixing them inside the jacket (410). The metal plate (440) may be made of copper, but is not limited thereto.

The coolant passage (450) is a space provided for cooling the high-temperature superconducting wires (420), and may include a space between the high-temperature superconducting wire (420) sub-units that are spaced apart from each other and stacked on the left and right, a space between the sub-units and the jacket (410), and a space between the jacket (410) and the metal plates (440).

The above high-temperature superconducting tube can cool the high-temperature superconducting wire (420) by injecting a coolant into the coolant passage (450) as a cooling method so that the coolant comes into direct contact with the high-temperature superconducting wire (420).

Fig. 5 is a schematic diagram showing an example of manufacturing an in-tube conductor for a high-temperature superconducting magnet according to another embodiment of the present invention.

Referring to FIG. 5, the high-temperature superconducting tube including the inner conductor for the high-temperature superconducting magnet was manufactured by integrating the manufacturing methods of the inner conductor for the high-temperature superconducting magnet of FIG. 2 and FIG. 3.

A jacket (510) is formed to surround the inner conductor for the high-temperature superconducting magnet, and includes a high-temperature superconducting wire (520), a metal jig (540a), an H-shaped steel (540b), and a coolant passage (550) inside the jacket (510), and is formed to surround them.

High-temperature superconducting wires (520) are overlapped and stacked within the tube to form an assembly of a plurality of high-temperature superconducting wires (520), and the assembly may be formed by stacking the plurality of high-temperature superconducting wires (520) spaced apart from each other on the left and right. In addition, the high-temperature superconducting wire (520) can be extended, and the extension of the high-temperature superconducting wire (520) can be achieved by performing copper wrapping on a connection portion with another high-temperature superconducting wire for extension and soldering the copper-wrapped connection portion.

The support structure (530) may be positioned on the upper surface of the assembly so that the assembly can be stably aligned inside the jacket (510).

The metal jig part (540a) may be positioned between the lower surface of the assembly of the high-temperature superconducting wires (520) and the inner wall of the jacket (510), thereby allowing the assembly of the high-temperature superconducting wires (520) to be fixed inside the jacket (510). The metal jig part (540a) is formed on the lower surface of the assembly of the high-temperature superconducting wires (520) in FIG. 5, but may also be formed on the upper surface. The metal jig part (540a) may include copper or aluminum, but is not limited thereto.

The H-shaped steel (540b) can be positioned between the upper surface of the assembly of the high-temperature superconducting wires (520) and the inner wall of the jacket (510), thereby allowing the assembly of the high-temperature superconducting wires (520) to be fixed inside the jacket (510).

The coolant passage (550) is a space provided for cooling the high-temperature superconducting wires (520), and may include the space between the H-shaped steel (540b) and the jacket.

The above high-temperature superconducting tube can cool the high-temperature superconducting wire (520) by injecting a coolant into the coolant passage (550) as a cooling method and using a method in which the coolant comes into direct contact with the high-temperature superconducting wire (520).

FIG. 6 is a schematic diagram showing a method for lengthening a high-temperature superconducting wire of a conductor in a high-temperature superconducting magnet according to an embodiment of the present invention.

Referring to Fig. 6, Fig. 6 provides a method of connecting a high-temperature superconducting wire (620) laminated on a metal plate (630) to another high-temperature superconducting wire for extension by partial soldering (622) in order to extend the length of the high-temperature superconducting wire (620) that can be used in the lamination method as in Fig. 1. The partial soldering (622) must be performed with sufficient spacing so that the positions of the high-temperature superconducting wires (620) to be connected do not overlap.

Fig. 7 is a schematic diagram showing a method for lengthening a high-temperature superconducting wire of an in-tube conductor for a high-temperature superconducting magnet according to another embodiment of the present invention.

Referring to FIG. 7, FIG. 7 is a method for extending the length of a high-temperature superconducting wire (720) sub-unit formed by wrapping it with a wrapping portion (730) that is laminated multiple times and includes copper, and copper wrapping (724) is performed on the connection portion with another high-temperature superconducting wire for extension, and the length of the high-temperature superconducting wire (720) sub-unit can be extended by partial soldering (722) of the copper-wrapped connection portion.

This is a schematic diagram showing a cryogenic circuit model for an experiment of an in-tube conductor for a high-temperature superconducting magnet according to an embodiment of the present invention of FIG. 8.

Referring to Fig. 8, (a) is a cryogenic circuit model, and the experimental results below basically represent the results of the experiment in the form of (a). (b) is a cross-sectional view of (a), and in the present invention, as part of the circuit model, the toroidal magnet winding pack method and the representative double pancake type (DP) were treated. In (a), the circulator is represented by the triangle at the bottom. SICC refers to the high-temperature superconductor shown in Figs. 1 to 5, and below, SICC I is defined as a high-temperature superconductor manufactured by the method of Fig. 1, SICC II as Fig. 2, and SICC III as Fig. 3. The SICC used above has a length of 160.0 m and an area of 3.5 x 10-4 m2. The refrigerant flows from 1 in (a) through the circulator in the direction of 2 to 6, and before passing through the circulator as shown in 7, the refrigerant is controlled again to an initial temperature of 20 K to cool the high-temperature superconductor. The above cooling can be accomplished by cooling the double pancake-shaped coils with a single cooling loop.

FIG. 9 is a graph showing the hysteresis loss of an in-tube conductor for a high-temperature superconducting magnet according to one embodiment of the present invention.

Referring to Figure 9, the graph illustrates the hysteresis loss exhibited by rapid charging at 50 kA per hour during the magnetic charging process of SICC III. Assuming that the magnetic fields of SICCs located in the same layer are identical, it can be seen that the magnetic field of SICC increases stepwise, reaches a maximum in the middle, and then decreases stepwise, and the hysteresis loss also increases proportionally to ~6 W/m in the middle.

FIG. 10 is a graph showing the change in temperature during a magnet charging process according to an example of manufacturing conductors in a high-temperature superconducting magnet according to an embodiment of the present invention.

Referring to Fig. 10, in the case of a toroidal magnet, there is no need to charge the magnet quickly, but in the present invention, it is assumed that the magnet is charged quickly at 50 kA per hour.

(a) is a graph showing the temperature change according to the length of SICC I in chronological order, (b) is a graph showing the temperature change according to the length of SICC II in chronological order, and (c) is a graph showing the temperature change according to the length of SICC III in chronological order. In the case of SICC I, the heat load is fixed inside, so the temperature change is similar to the hysteresis loss shown in FIG. 9. In addition, in the case of SICC I, it was confirmed that the magnet could not be charged up to 12 T, and quenching occurred when it was charged to ~8 T at approximately 2400 s. On the other hand, dynamic temperature changes were observed in the case of SICC II and SICC III, and it can be seen in the graphs (b) and (c) that the peak temperature is not located in the middle, but moves toward the outlet over time. In both SICC II and SICC III, it was confirmed that the magnet could be charged up to 12 T, but the maximum temperature was much lower than the current sharing temperature of 42.4 K. Additionally, it can be seen that the maximum temperature rise inside the SICC II is about 37 K, which is higher than that of the SICC III, which is about 31 K.

FIG. 11a is a graph showing changes in pressure, temperature, and mass flow rate over time in an in-tube conductor for a high-temperature superconducting magnet according to one embodiment of the present invention. FIG. 11b is a graph showing changes in pressure, temperature, and mass flow rate over time in an in-tube conductor for a high-temperature superconducting magnet according to another embodiment of the present invention.

Referring to Figs. 11a and 11b, the difference between SICC I and SICC III can be clearly seen, and the pressure, temperature, and mass flow changes over time at the inlet and outlet shown in Fig. 8 are shown. Looking at Fig. 11a (a) showing the pressure change over time of SICC I and Fig. 11b (a) showing the pressure change over time of SICC III, the pressure at the inlet initially increases and the pressure decreases at the outlet. When the magnetic charging starts after 50 seconds, Fig. 11a (a) shows a steady increase in pressure, but Fig. 11b (a) shows a decrease in pressure within 10 minutes as soon as the charging is stopped.

Since the refrigerant passage of the SICC I is smaller than that of the SICC III, when comparing Fig. 11a (c) showing the flow rate of the SICC I with Fig. 11b (c) showing the flow rate of the SICC III, the flow rate of the SICC I is found to be more than 10 times lower than that of the SICC III.

Looking at Fig. 11a (b) showing the temperature change over time of SICC I and Fig. 11b (b) showing the temperature change over time of SICC III, it can be seen that for both SICC I and SICC III, when the circulation device is operated and the refrigerant starts to flow, the inlet temperature increases and the outlet temperature decreases due to the Joule-Thomson effect. The magnet charging is performed after 50 seconds, and the temperature increase inside the tube due to hysteresis loss can be directly observed at the outlet of the SICC III, whereas the outlet of the SICC I maintains almost the same temperature around the initial temperature of 20 K. In addition, in the case of the SICC III, the low temperature recovered to the original value within 10 minutes as soon as the charging was stopped.

In Fig. 11b (c), the mass flow rates for the SICC III and SICC II are presented together, and the mass flow rate of the SICC II is shown to be about 70% lower than that of the SICC III. Due to this lower flow rate, the maximum temperature rise inside the SICC II is shown to be higher than that of the SICC III, as can be seen in Fig. 10.

The results of the above experiments showed that a porous structure such as SICC I was not effective in removing the thermal load caused by hysteresis loss, which was confirmed to be caused by the heat being trapped due to the impeded fluid flow. In addition, compared to SICC III without copper, the maximum temperature increased and the flow rate decreased in SICC II using copper. Therefore, copper does not appear to be helpful in reducing the thermal load, but is desirable for effective current sharing and adequate heat conduction between high-temperature superconductors.

The foregoing description of the present invention is for illustrative purposes only, and those skilled in the art will readily appreciate that the present invention can be readily modified into other specific forms without altering the technical spirit or essential characteristics of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. For example, each component described as a single entity may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined manner.

In summary, there are three types of high-temperature superconductor (HTS) wire stacked conduit composite conductors (Type 1, Type 2, and Type 3) as follows.

<Type 1>. As shown in Fig. 1, a high-temperature superconducting wire (a structure in which HTS materials are laminated in multiple layers on a SUS substrate and have a thickness of about several tens of micrometers) is arranged on a thin copper plate (about 40 micrometers thick) (by fixing it by soldering, etc., if necessary). A plurality of spaced-apart high-temperature superconducting wires can be arranged between adjacent copper plates that are vertically spaced from each other. There are coolant passages (with a gap of about several tens of micrometers) between the high-temperature superconducting wires. A plurality of spaced-apart high-temperature superconducting wires are respectively arranged between the vertically spaced copper plates to form a stack structure. The entire stack structure can be spiral-wrapped with SUS tape, aluminum tape, or copper tape. The wrapped stack structure can be arranged in a conduit or a jacket. The conduit or jacket can be a copper pipe, an aluminum pipe, or an SUS pipe. Advantage (1) is the extremely large surface area in direct contact with the superconducting wire and the refrigerant. Advantage (2) is that the high-temperature superconducting wire can be connected continuously and secured by soldering or other methods. This provides the same effect as using a continuous, long wire.

<Type 2>. As shown in Fig. 2, a stack of high-temperature superconducting wires (approximately 30 layers) is spiral-wrapped with SUS tape or Cu tape. The high-temperature superconducting wire stack is arranged two-dimensionally to form a high-temperature superconducting wire bundle. The high-temperature superconducting wire bundle can be fixed inside a jacket using a Cu support (Cu jig) or an Al support. The Cu support has a C shape in the cross-section. The Cu support is arranged on the upper and lower surfaces of the high-temperature superconducting wire bundle, respectively. Accordingly, coolant passages are formed on the left and right surfaces of the high-temperature superconducting wire bundle. The jacket may have a chamfered square shape in the cross-section. As an advantage (1), the upper and lower surfaces of the high-temperature superconducting wire bundle are cooled by conductive cooling, and the left and right surfaces of the high-temperature superconducting wire bundle are cooled by direct contact with the coolant. Accordingly, conductive cooling and direct cooling are performed in combination. As an advantage (2), the Cu or Al used as a support acts as a copper stabilizer for the composite conductor.

<Type 3>. As shown in Fig. 3, the stacked (approximately 30 layers) high-temperature superconducting wires are arranged two-dimensionally to form a high-temperature superconducting wire bundle. The high-temperature superconducting wire bundle does not use a cupper stabilizer, but is fixed inside a jacket to withstand various internal forces in various forms with structures (support structures and elastic support structures) such as SUS. The support structure can be a combined structure of a plate-shaped support and a C-shaped elastic body, a combined structure of a plate-shaped support and an elliptical elastic body, or an H-beam-shaped structure. As an advantage (1), it is the form in which it is easiest to secure a refrigerant space. As an advantage (2), it has excellent mechanical stability through the use of internal structures such as SUS.

Various types of high-temperature superconducting wire composite conductors are possible by combining the above concepts.

<Example 1>. As shown in Fig. 4, the method of utilizing a copper plate of type 1 (fixing it with soldering, etc., if necessary) and the method of spiral wrapping a stack of laminated high-temperature superconducting wires with Cu, etc. of type 2 are combined. That is, after the laminated (approximately 30 layers) high-temperature superconducting wire stack is spiral wrapped with Cu, etc., it is two-dimensionally arranged on a copper plate (approximately 40 μm thick), thereby forming a bundle of high-temperature superconducting wires as a whole. The high-temperature superconducting wire stacks spirally wrapped with Cu tape, etc. can be arranged spaced apart from each other on the copper plate to provide a coolant passage. Copper plates can be arranged on the top and bottom surfaces of the high-temperature superconducting wire bundle. The high-temperature superconducting wire bundle is arranged inside a jacket or a conduit. A composite conductor can provide a coolant passage between the jacket and the bundle of high-temperature superconducting wires.

<Example 2>. As shown in Fig. 5, the method of utilizing the second type of Cu support (or jig) and the method of utilizing the third type of internal structure such as the H-beam can be integrated. That is, the stacked (approximately 30 layers) high-temperature superconducting wire stacks are arranged two-dimensionally to form a high-temperature superconducting wire bundle. The high-temperature superconducting wire bundle is fixed inside the jacket by a structure (support structure, and elastic support structure) such as SUS without using a copper stabilizer. However, the lower surface of the high-temperature superconducting wire bundle is supported by the copper support. Accordingly, a coolant passage is formed between the H-beam-shaped support structure and the jacket.

< Long-wire technique for constructing a conduit composite conductor>

Copper plate, long-linearization technique using partial soldering technique. As shown in Fig. 6, when a composite conductor longer than the manufacturing length of high-temperature superconducting wires (typically less than several hundred meters) is required, adjacent high-temperature superconducting wires can be extended to the required length through soldering. When multiple high-temperature superconducting wires are run parallel on a copper plate, the soldering locations must be sufficiently spaced longitudinally to prevent the wires from overlapping.

<Long-line drawing technique using partial lamination and partial soldering techniques>

As shown in Fig. 7, even in the case of a stack of high-temperature superconducting wires (approximately 30 layers), the wires can be locally soldered in the area requiring extension (the uppermost wire of the stack) and then wrapped with Cu to extend them to the required length. That is, the high-temperature superconducting wire stack includes stacked high-temperature superconducting wires, the high-temperature superconducting wires are connected to each other by soldering in the same layer, and the soldered area is locally wrapped with Cu. The stacked high-temperature superconducting wire stack (approximately 30 layers) is supported by Cu spiral wrapping. These superconducting wire stacks are arranged two-dimensionally to form a high-temperature superconducting wire bundle.

The characteristic of the present invention described above is that, for ensuring the thermal stability of the conduit composite conductor, the essential element is not the cupper stabilizer, but rather the refrigerant passage structure that facilitates the smooth flow of refrigerant. In other words, the refrigerant passage through which the refrigerant passes to ensure thermal stability requires a porosity of at least a certain value (10%). However, if the porosity exceeds 30%, space utilization is reduced.

Another feature of the present invention is a structure capable of current redistribution, which is essential in the event of thermal instability in a superconducting conductor due to an accidental situation. The inventor of the present invention confirmed through simulation analysis results that mutual propagation (current redistribution) is possible within a high-temperature superconducting wire stack of approximately 30 layers due to the protective layer (copper layer) provided to each of the high-temperature superconducting wires. In addition, the high-temperature superconducting wire stack is arranged two-dimensionally to form a high-temperature superconducting wire bundle. Therefore, within the high-temperature superconducting wire bundle, each high-temperature superconducting wire stack requires a structure capable of current redistribution, such as by spiral wrapping, copper conduit, or soldering.

According to the simulation results of the present invention, in a structure capable of current redistribution within a 30-layer high-temperature superconducting wire stack, a structure with improved contact resistance between each high-temperature superconducting wire stack enables stable current redistribution in situations where problems such as quenching, which causes superconducting characteristics to be lost, may occur. Based on the simulation analysis results of the present invention, the following three bundle structures are proposed. The high-temperature superconducting wire bundle is composed of 30-layer or nearby high-temperature superconducting wire stacks arranged two-dimensionally.

FIG. 12a is a perspective view showing a high-temperature superconducting wire stack of a collective conductor according to one embodiment of the present invention.

Figure 12b is a cross-sectional view of the high-temperature superconducting wire stack of Figure 12a.

Fig. 13 is a cross-sectional view showing the high-temperature superconducting wires that constitute the high-temperature superconducting wire stack of Fig. 12b.

Figure 14 is a perspective view showing a high-temperature superconductor wire bundle in which the high-temperature superconducting wire stacks of Figure 12a are arranged.

Referring to FIGS. 12 to 14, a conductor assembly (13) according to one embodiment of the present invention includes a high-temperature superconducting wire stack (10) in which a plurality of high-temperature superconducting wires (10a) are stacked; and a copper wrapping (11a) or copper tube (21a) arranged to surround each of the high-temperature superconducting wire stacks (10). The high-temperature superconducting wire stack (10) provides a two-dimensionally arranged high-temperature superconducting wire bundle (12).

In the high-temperature superconducting wire stack (10), the number of times the high-temperature superconducting wires (10a) are stacked may have a thickness corresponding to the width of the high-temperature superconducting wire (10a). For example, when the thickness of the high-temperature superconducting wire (10a) is 0.1 mm and the width of the high-temperature superconducting wire (10a) is 4 mm, the number of times the wires are stacked may be about 40. The cross-section of the high-temperature superconducting wire stack (10) may be a square or a rectangle close to a square. Accordingly, when the high-temperature superconducting wire stack (10) is copper wrapped, smooth connection of the copper tape is possible.

Each of the above high-temperature superconducting wires (10a) includes a substrate (10b); a buffer layer (10c) disposed on the substrate (10b); a high-temperature superconducting layer (10d) disposed on the buffer layer (10c); and a protective layer (10e) disposed to surround the high-temperature superconducting layer (10d) and the substrate (10b). The protective layer (10e) may be a copper or silver thin film. The substrate (10b) may be a SUS substrate. The buffer layer (10c) may include a MgO layer. The high-temperature superconducting layer (10d) may be ReBCO or YBCO. The protective layer (10e) may be a plating layer of a copper or silver thin film having a thickness of several micrometers. Accordingly, the high-temperature superconducting wires (10a) are covered with a protective layer made of copper or silver.

The thickness of each of the high-temperature superconducting wires (10a) may be 40 to 150 micrometers, and the width of each of the high-temperature superconducting wires (10a) may be 2 to 12 millimeters. If the width of the high-temperature superconducting wires (10a) exceeds 12 millimeters, stacking of the high-temperature superconducting wires is not easy.

The copper wrapping (11a) may have a thickness of 40 micrometers to 120 micrometers, and a width of the copper wrapping (11a) may be 20 millimeters to 120 millimeters. The copper wrapping (11a) may be performed on each of the high-temperature superconducting wire stacks (10). When the high-temperature superconducting wire stacks (10) are arranged two-dimensionally, the copper wrappings (11a) may contact each other to reduce contact resistance. The copper wrapping (11a) may be spiral wrapping, and the ratio of an area with copper wrapping and an area without copper wrapping along the longitudinal direction of the high-temperature superconducting wire may be 1:0 to 1:3. The copper wrappings (11a) may be wrapped by overlapping each other.

The high-temperature superconductor wire bundle (12) may be a multiple of 2 in the width direction of the high-temperature superconducting wire stack (10) and a multiple of 2 in the height direction of the high-temperature superconducting wire stack (10). The high-temperature superconductor wire bundle (12) may be selected for a given current and magnetic field. For example, for a current of 54 kA and a magnetic field of 12 Tesla, the high-temperature superconductor wire bundle (12) may be 4x5 or 6x5.

The high-temperature superconductor wire bundle (12) or the high-temperature superconductor wire stack (10) can be cooled directly by a coolant or by conduction. The collective conductor (13) further includes a jacket or conduit (not shown) having a coolant passage, and the high-temperature superconductor wire bundle (12) or the high-temperature superconductor wire stack (10) can be arranged inside the jacket.

FIG. 15a is a perspective view showing a high-temperature superconducting wire stack of a collective conductor according to one embodiment of the present invention.

Figures 15b, 15c, and 15d are cross-sectional views of the high-temperature superconducting wire stack of Figure 15a.

Figure 16 is a perspective view showing a high-temperature superconductor wire bundle in which the high-temperature superconducting wire stacks of Figure 15a are arranged.

Referring to FIGS. 15 and 16, a conductor assembly (23) according to one embodiment of the present invention includes a high-temperature superconducting wire stack (10) in which a plurality of high-temperature superconducting wires (10a) are stacked; and a copper wrapping (11a) or copper tube (21a) arranged to surround each of the high-temperature superconducting wire stacks (10). The high-temperature superconducting wire stack (10) provides a two-dimensionally arranged high-temperature superconducting wire bundle (22).

The copper pipe (21a) can be implemented by a plating method, a method of inserting into a tube, a method of soldering a plate material in the shape of a bent tube, etc.

Referring to Fig. 15c, the copper tube (21a) arranged to surround each of the high-temperature superconducting wire stacks (10) has five sides, but can be soldered (21b) after overlapping each other to have a square shape in the cross-section.

Referring to FIG. 15d, the copper tube (21a) arranged to surround each of the high-temperature superconducting wire stacks (10) has a rectangular shape in the cross-section, and the portions where they are soldered together (21c) can be in the longitudinal direction of the high-temperature superconducting wire stack.

FIG. 17a is a perspective view showing a high-temperature superconducting wire stack of a collective conductor according to one embodiment of the present invention.

Figures 17b and 17a are cross-sectional views of the high-temperature superconducting wire stack.

Figure 18 is a perspective view showing a high-temperature superconductor wire bundle in which the high-temperature superconducting wire stacks of Figure 17a are arranged.

Referring to FIGS. 17 and 18, a conductor assembly (33) according to one embodiment of the present invention includes a high-temperature superconducting wire stack (30) in which a plurality of high-temperature superconducting wires (10a) are stacked and a solder layer (31a) is included between adjacent high-temperature superconducting wires (10a).

The above high-temperature superconducting wire stacks (30) are arranged two-dimensionally to provide a high-temperature superconducting wire bundle (32). The thickness of the solder layer (31a) may be 5 micrometers to 30 micrometers. The solder layer (31a) may also be formed on the outer surface of the high-temperature superconducting wire stack (30).

In the high-temperature superconducting wire stack (30), the number of times the high-temperature superconducting wires (10a) are stacked may have a thickness corresponding to the width of the high-temperature superconducting wire. Each of the high-temperature superconducting wires (10a) includes: a substrate; a buffer layer disposed on the substrate; a superconducting layer disposed on the buffer layer; and a protective layer disposed to surround the superconducting layer and the substrate. The protective layer may be a copper thin film.

The thickness of each of the above high-temperature superconducting wires (10a) may be 40 to 150 micrometers, and the width of each of the above high-temperature superconducting wires (10a) may be 4 to 12 millimeters.

Each high-temperature superconducting wire stack (10, 30) is contacted with the high-temperature superconducting wire stacks above, below, and on the left or right by copper or soldering. That is, each high-temperature superconducting wire stack is contacted with each other by copper wrapping, copper conduit, or soldering. Accordingly, a structure is provided in which the high-temperature superconducting wire stacks have low contact resistance with each other. When using a solder layer (31a), after the high-temperature superconducting wire stack is compressed, soldering can be performed to form the solder layer (31a). In addition, after the entire high-temperature superconducting wire bundle is compressed, additional soldering is possible.

Another feature of the present invention relates to structural stability within the superconducting assembly conductor, requiring a structural design that takes into account processes that minimize damage to the high-temperature superconducting wire during the tube-making process. To minimize damage to the high-temperature superconducting wire, capping structures and spiral structures can be used.

In stability analysis to minimize damage to high-temperature superconducting wires, it is necessary to consider key stability-degrading factors, such as screening currents due to the characteristics of high-temperature superconductivity itself, as well as the magnetic field distribution considering the application. To analyze the internal structural stability, shear stress and hoop stress were simulated. In addition, the torque due to screening current, critical current density, and angular dependence were simulated. Considering the above, if applied as a giant magnet, the Lorentz force, the largest internal force, was analyzed by considering the most vulnerable part and the magnetic field at that part. The internal force is calculated based on the simulation results and utilized in the design of the internal structure.

Consequently, a cap structure on a high-temperature superconducting wire bundle and a spiral-shaped protective structure between the jacket and the high-temperature superconducting wire bundle are required to counteract distortion of the jacket or conduit during the tube making process.

FIG. 19a is a perspective view of a composite conductor according to one embodiment of the present invention.

Figure 19b is a cross-sectional view of the composite conductor of Figure 19a.

Figure 19c is a cross-sectional view of the high-temperature superconducting wire bundle of Figure 19a.

Referring to FIGS. 19a to 19c, a conductor assembly (2) according to one embodiment of the present invention includes a high-temperature superconducting wire bundle (12, 22, 32) in which high-temperature superconducting wire stacks (10) are arranged two-dimensionally; a conduit (19) arranged to surround the high-temperature superconducting wire bundle; and a copper spiral (17) that surrounds the high-temperature superconducting wire bundle (12, 22, 32) and provides a cooling channel (18). The cooling channel (18) may be a passage through which a coolant flows.

The porosity (ratio of the area of the refrigerant passage to the total cross-sectional area within the conduit) of the above-mentioned conductor (2) may be 10 to 30 percent.

The copper spiral (17) above can prevent damage to the high-temperature superconducting wire bundle (12, 22, 32) during a compression process of the conduit (19) or jacket while providing a cooling passage. The thickness of the copper spiral (17) may be 1 millimeter to 5 millimeters. The ratio of the area with the copper spiral (17) and the area without the copper spiral along the length direction of the conduit (19) may be 1:0.3 to 1:3.

The rigid plate (15) can be placed on the upper and lower surfaces of the high-temperature superconducting wire bundle (12, 22, 32), respectively. The rigid plate (15) can be made of SUS and have a thickness of 1 mm to 3 mm. The rigid plate (15) can suppress damage to the high-temperature superconducting wire bundle (12, 22, 32) during the compression process of the conduit (19) or jacket.

The material of the above conduit (19) may be SUS. The thickness of the above conduit (19) may be 1 mm to 3 mm.

The high-temperature superconductor wire bundle (12, 22, 32) has a rectangular cross-section and is composed of a two-dimensional arrangement of high-temperature superconductor wire stacks. The high-temperature superconductor wire bundle (12, 22, 32) is covered with a rigid plate, such as SUS, on its upper and lower surfaces, respectively. The rigid plate may have a thickness of several millimeters. Then, a copper strip (having a thickness of about 3 mm) is spirally wrapped around the high-temperature superconductor wire bundle capped with the rigid plate. A coolant passage is formed by the spiral wrapping of the copper strip.

FIG. 20a is a perspective view of a composite conductor according to one embodiment of the present invention.

Figure 20b is a cross-sectional view of the composite conductor of Figure 20a.

Figure 20c is a cross-sectional view of the high-temperature superconducting wire bundle of Figure 20a.

Referring to FIGS. 20a to 20c, a conductor assembly (4) according to one embodiment of the present invention includes a high-temperature superconducting wire bundle (12, 22, 32) in which high-temperature superconducting wire stacks (10) are arranged two-dimensionally; a conduit (19) arranged to surround the high-temperature superconducting wire bundle (12, 22, 32); and a copper capping portion (45a, 45b) providing a cooling channel between the high-temperature superconducting wire bundle and the conduit.

The copper capping portion (45a, 45b) includes a first copper capping portion (45a) arranged to surround the upper surface and upper side surface of the high-temperature superconducting wire bundle (12, 22, 32); and a second copper capping portion (45b) arranged to surround the lower surface and lower side surface of the high-temperature superconducting wire bundle.

The first copper capping portion (45a) includes a trench formed on its upper surface, and the second copper capping portion (45b) includes a trench formed on its lower surface, and the trench provides an auxiliary refrigerant passage (18a) through which refrigerant flows. The thickness of the copper capping portions (45a, 45b) may be 1 millimeter to 5 millimeters.

The SUS spiral (47) is arranged to surround the copper capping portion (45a, 45b) and the high-temperature superconducting wire bundle (12, 22, 32). The thickness of the SUS spiral (47) may be 1 mm to 3 mm. The SUS spiral (47) can suppress damage to the high-temperature superconducting wire bundle (12, 22, 32).

A high-temperature superconductor wire bundle (12, 22, 32) has a rectangular shape in cross-section and is composed of a two-dimensional arrangement of high-temperature superconductor wire stacks. The high-temperature superconductor wire bundle is covered with a Cu plate having a stabilizing material such as Cu on its upper and lower surfaces, respectively. The Cu plate may have a thickness of several millimeters. The Cu plate may be arranged to surround the upper surface and upper edge of the high-temperature superconductor wire bundle. The Cu plate may be arranged to surround the lower surface and lower edge of the high-temperature superconductor wire bundle. The Cu plate may be chamfered. The Cu plate may include a trench extending longitudinally on its upper surface or lower surface that is not in contact with the high-temperature superconductor wire bundle. The trench may provide an additional coolant passage. Afterwards, the SUS strip (1 mm thick) spirally wraps a bundle of high-temperature superconductor wires capped with a Cu plate. A coolant passage is formed by the Cu plate.

Figure 21 is a conceptual diagram illustrating a method for manufacturing a composite conductor according to one embodiment of the present invention.

Referring to Fig. 21, in the first step, high-temperature superconducting wires are stacked. The number of stacked layers may be about 30. To stack the high-temperature superconducting wires, in the second step, high-temperature superconducting wires are stacked in about 30 layers to form a high-temperature superconducting wire stack. In the third step, each high-temperature superconducting wire stack is spiral-wrapped with a Cu tape. In the fourth step, the high-temperature superconducting wire stacks wrapped with the Cu tape are two-dimensionally arranged to form a high-temperature superconducting wire bundle. In the fifth step, rigid plates having rigidity such as SUS are arranged on the upper and lower surfaces of the high-temperature superconducting wire bundle, respectively. In the sixth step, a copper strip (having a thickness of about 3 mm) is spiral-wrapped to surround the lower rigid plate, the high-temperature superconducting wire bundle, and the upper rigid plate. A coolant passage is formed by the spiral-wrapping of the copper strip. In the seventh step, the bundle of high-temperature superconducting wires wrapped by copper strips is inserted into a magnet or a conduit and then compressed to finally form a composite conductor.

Figure 22 is a conceptual diagram illustrating a method for manufacturing a composite conductor according to one embodiment of the present invention.

Referring to Fig. 22, in the first step, high-temperature superconducting wires are stacked. The number of layers may be on the order of 30. In the second step, high-temperature superconducting wires are stacked on the order of 30 layers to form a high-temperature superconducting wire stack. In the third step, each high-temperature superconducting wire stack is covered by a copper tube. In the fourth step, the high-temperature superconducting wire stacks wrapped by the copper tube are two-dimensionally arranged to form a high-temperature superconducting wire bundle.

In the fifth step, Cu plates (thickness approximately 3 mm) are placed on the upper and lower surfaces of the high-temperature superconducting wire bundle, respectively. In the sixth step, SUS strips (thickness approximately 1 mm) are spirally wrapped to surround the lower Cu plate, the high-temperature superconducting wire bundle, and the upper Cu plate. In the seventh step, the high-temperature superconducting wire bundle wrapped by the SUS strips is inserted into a magnet or a conduit and then compressed to ultimately form a composite conductor.

According to one embodiment of the present invention, a conductor assembly having a high-temperature superconducting wire stack or bundle provides a structure that allows for a straight or spiral flow of refrigerant rather than a porous structure that impedes the flow of refrigerant.

According to one embodiment of the present invention, a collective conductor having a stack or bundle of high-temperature superconducting wires provides a structure in which a coolant can directly contact a certain portion of the high-temperature superconducting wire bundle, particularly a side portion of the bundle, considering that the shear stress of the bundle is relatively small.

According to one embodiment of the present invention, a conductor assembly comprising a stack or bundle of high-temperature superconducting wires generates a strong force perpendicular to the plane of the wires during normal operation, and makes stronger contact with structural reinforcement. The structural reinforcement can directly contact the refrigerant, thereby enhancing conduction cooling efficiency.

According to one embodiment of the present invention, a structure comprising a copper spiral and a cap plate capable of minimizing damage to wires during the manufacture of a bundled conductor is provided. The cap plate is arranged above and below a wire bundle, and can serve to evenly distribute force applied during a compression process to adjust the dimensions of a pipe shape or during operation on the wire surface. The copper spiral positioned between the bundle and the conduit, which are covered on the upper and lower surfaces with the cap plate, serves as a buffer layer that prevents the pressure applied to the pipe for forming a rectangular conduit from directly contacting the bundle during the compression process of the pipe for forming a rectangular conduit. The pipe for forming a rectangular conduit is formed through the compression process.

According to one embodiment of the present invention, one of the copper spirals or cap plates is manufactured from a material capable of plastic deformation, such as copper. Accordingly, if excessive force is applied during the manufacturing process or operation, the copper spirals or cap plates automatically deform to protect the bundle. To this end, the copper spirals or cap plates have a relatively thick structure, which, in addition to providing structural stability, also serves a structural role of creating a space for the passage of refrigerant.

In a copper spiral and stainless steel cap structure, the stainless steel cap distributes the force during compression or operation. The copper spiral acts as a buffer during pipe compression. The copper spiral has sufficient thickness to provide space for the refrigerant to flow.

In a SUS spiral and copper cap structure, the SUS spiral distributes the force during compression or operation. The copper cap acts as a buffer during pipe compression. The copper cap has sufficient thickness to provide space for the refrigerant to flow.

High-temperature superconducting wire stacks are formed by stacking 10 to 100 sheets of high-temperature superconducting wires with widths of 4 to 12 mm. High-temperature superconducting wire bundles are formed by re-stacking high-temperature superconducting wire stacks in a matrix configuration such as 2x2 or 4x4. Each wire stack is classified into 1) Cu wrapping, 2) Cu plate forming, and 3) solder press. Each wire stack can be re-stacked in a matrix configuration to improve current redistribution, heat transfer, and structural stability between stacks.

The laminated high-temperature superconducting wire stack is composed of 10 to 100 sheets. When forming a coil, hundreds of wire sheets are continuously connected and then wound, eliminating the need for winding. This means that the laminated high-temperature superconducting wire stack can be stacked on its own to carry a large current, reducing the number of coil turns required to create a large magnetic field, thereby improving manufacturability. The length of the high-temperature superconducting wire stack can be extended by using a bonding technique.

Hereinafter, a high-temperature superconducting magnet system is described. The high-temperature superconducting magnet system uses a high-temperature superconducting magnet using a high-temperature superconducting wire stack, and components such as connectors, joints, or leads using the high-temperature superconducting wire stack.

Figure 23a is a perspective view illustrating a high-temperature superconducting magnet device according to one embodiment of the present invention.

Figures 23b, 23c, and 23d are drawings showing the cryogenic refrigerator, cooling structure, and electrical connection structure of the high-temperature superconducting magnet device of Figure 23a.

Referring to FIGS. 23A to 23D , a high-temperature superconducting magnet device (1000) according to an embodiment of the present invention comprises: a vacuum chamber (1080); a toroidal liquid nitrogen chamber (1182) disposed inside the vacuum chamber (1080) for heat shielding and storing liquid nitrogen; a pair of connecting rods (1184) having a central hole formed in the central axis and connected to the liquid nitrogen chamber to supply liquid nitrogen to the central hole and maintain the cooled device at an absolute temperature of 77 K; a pair of cryogenic refrigerators (1186) disposed inside the vacuum chamber (1080) for cooling to an absolute temperature of 20 K; a pair of thermal links (1187) connected to each of the cryogenic refrigerators (1186); a high-temperature superconducting electromagnet (1100) that is cooled by thermal contact with the pair of thermal links (1187); an insulating block (1185) coupled to the thermal links (1187); A conductive cooling block (1189) coupled to the insulating block (1185) and maintained at the absolute temperature of 20 K; and a high-temperature superconducting current connector (1040) connecting the connecting rod (1184) and the high-temperature superconducting electromagnet (1100) to each other. The high-temperature superconducting electromagnet (1100) is supplied with current through the connecting rod (1184) and the high-temperature superconducting current connector (1040).

The high-temperature superconducting magnet device (1000) may be a device for measuring the characteristics of a high-temperature superconducting magnet or a device for applying a magnetic field. The high-temperature superconducting magnet device (1000) may be modified in various ways as long as it forms a magnetic field.

The vacuum chamber (1180) may be a metal vacuum chamber. The vacuum chamber (1180) may be insulated by maintaining a vacuum within it. The vacuum chamber (1180) may have a cylindrical shape.

A liquid nitrogen chamber (1182) may be placed inside the vacuum chamber (1180). The liquid nitrogen chamber (1182) may be a toroidal chamber having a rectangular cross-section. The central axis of the toroidal chamber may be the same as the central axis of the vacuum chamber (1180). The liquid nitrogen chamber (1182) may be filled with liquid nitrogen. The liquid nitrogen chamber (1182) may perform a heat shielding function for shielding radiant heat radiated from the vacuum chamber. The liquid nitrogen chamber (1182) includes a pair of pipes (1182a, 1182b), and the first pipe (1182a) may be an inlet for liquid nitrogen. The second pipe (1182b) may be an outlet for evaporated nitrogen gas.

The cryogenic refrigerator (1186) can control the temperature to an extremely low temperature of 8K (-265 degrees Celsius) using pulse-tube refrigerator or Gifford-McMahon refrigeration technology. One end of the cryogenic refrigerator (1186) can be cooled to 8K to 20K. A pair of cryogenic refrigerators (1186) can be installed within the vacuum chamber.

A pair of connection rods (1184) may penetrate the upper surface of the vacuum chamber and be connected to the liquid nitrogen chamber (1182). The connection rod (1184) may be in the form of a copper pipe and may have a center hole arranged therein. One end of the connection rod (1184) is connected to the liquid nitrogen chamber, so that liquid nitrogen may flow to one end of the connection rod (1184) to cool it to an absolute temperature of 77 K. The other end of the connection rod (1184) may be maintained at room temperature outside the vacuum chamber and connected to a current source or a voltage source to supply current to a high-temperature superconducting magnet (1100) or a device under test (DUT).

A thermal link (1187) can be cooled to 20K by thermal contact with the cooling end of the cryogenic refrigerator (1186). The thermal link (1187) may be a copper plate. The thermal link (1187) can cool the high-temperature superconducting magnet by thermal contact with a flange of a bobbin constituting the high-temperature superconducting magnet. Accordingly, the high-temperature superconducting magnet can be cooled to an absolute temperature of 20K and maintain high-temperature superconductivity.

A high-temperature superconducting electromagnet (1100) or device under test (DUT) may have a structure in which a high-temperature superconducting wire stack (10) is wound around a bobbin. The high-temperature superconducting wire stack (10) may have a laminated structure of 10 to 100 tape-shaped high-temperature superconducting wires. Both ends of the high-temperature superconducting electromagnet (1100) may have a high-temperature superconducting wire stack lead structure. A pair of high-temperature superconducting wire stack leads (1010) may be connected by the high-temperature superconducting wire stack (10) wound around the bobbin. The high-temperature superconducting electromagnet (1100) or DUT may be cooled to an absolute temperature of 20 K. The high-temperature superconducting electromagnet (1100) may be a poloidal high-temperature superconducting electromagnet for a tokamak, a toroidal high-temperature superconducting electromagnet for a tokamak, or another high-temperature superconducting electromagnet for magnetic resonance imaging (MRI).

An insulating block (1185) can be in contact with the thermal link and electrically insulated from the cryogenic refrigerator (1186). The insulating block (1185) can secure a high-temperature superconducting current connector (1040) and a high-temperature superconducting wire stack lead (1010) of a high-temperature superconducting electromagnet. The insulating block (1185) can be cooled to an absolute temperature of 20 K.

Alternatively, the conductive cooling block (1189) may be fixed to the insulating block (1185) and may connect the high-temperature superconducting current connector (1040) and the high-temperature superconducting wire stack lead (1010) of the high-temperature superconducting electromagnet to each other. The conductive cooling block (1189) may be a copper plate. The conductive cooling block (1189) may be cooled to an absolute temperature of 20K.

Meanwhile, a pair of high-temperature superconducting current connectors (1040) may be connected to each end of the high-temperature superconducting magnet (1100) directly or through the conductive cooling block (1189). Each end of the high-temperature superconducting current connector (1040) may have a high-temperature superconducting wire stack bundle lead structure. The pair of high-temperature superconducting wire stack bundle leads may be connected by a high-temperature superconducting wire stack bundle.

One end of the high-temperature superconducting current connector (1040) may be cooled to an absolute temperature of 77 K, and the other end of the high-temperature superconducting current connector (1040) may be cooled to an absolute temperature of 20 K. Accordingly, current may flow through the connecting rod (1184), the high-temperature superconducting current connector (1040), the conductive cooling block (1189), and the high-temperature superconducting electromagnet (1100).

The high temperature superconducting electromagnet (1100) may include or be connected by a high temperature superconducting current connector (1040), a high temperature superconducting wire stack bundle lead, a high temperature superconducting wire stack bundle, a high temperature superconducting joint, or a high temperature superconducting wire stack.

Figure 24 is a conceptual diagram illustrating a high-temperature superconducting magnet device according to one embodiment of the present invention.

Fig. 25 is a plan view illustrating the high-temperature superconducting magnet device of Fig. 24.

Referring to FIGS. 24 and 25, a high-temperature superconducting magnet device (1000a) according to an embodiment of the present invention comprises: a vacuum chamber (1180); a toroidal liquid nitrogen chamber (1182) disposed inside the vacuum chamber to provide heat shielding and store liquid nitrogen; a pair of connecting rods (1184) having a central hole formed in a central axis and connected to the liquid nitrogen chamber to supply liquid nitrogen to the central hole and maintain the cooled device at an absolute temperature of 77 K; a pair of cryogenic refrigerators (1186) disposed inside the vacuum chamber to cool the device to an absolute temperature of 20 K; a pair of thermal links (1187) respectively connected to the cryogenic refrigerators (1186); a high-temperature superconducting electromagnet (1100) that is cooled by thermal contact with the pair of thermal links (11187); an insulating block (1185) coupled to the thermal links; A conductive cooling block (1189) coupled to the insulating block and maintained at the absolute temperature of 20 K; and a high-temperature superconducting current connector (1040) connecting the connecting rod and the conductive cooling block to each other. The high-temperature superconducting electromagnet receives current through the connecting rod, the high-temperature superconducting current connector, and the conductive cooling block.

Figure 26 is a conceptual diagram illustrating a high-temperature superconducting magnet device according to another embodiment of the present invention.

Referring to FIG. 26, a high-temperature superconducting magnet device (2000) according to an embodiment of the present invention comprises: a vacuum chamber (2180); a toroidal liquid nitrogen chamber (2182a, 2182b) disposed inside the vacuum chamber (2180) for heat shielding and storing liquid nitrogen; a pair of connecting rods (2186) having a central hole formed in a central axis and connected to the liquid nitrogen chamber to supply liquid nitrogen through the central hole and maintain the cooled device at an absolute temperature of 77 K; a pair of cryogenic refrigerators (2186) disposed inside the vacuum chamber for cooling to an absolute temperature of 20 K; a pair of thermal links (2187) respectively connected to the cryogenic refrigerators (2186); a high-temperature superconducting electromagnet (2100) that is cooled by thermal contact with the pair of thermal links; an insulating block (1185) coupled to the thermal links; A conductive cooling block (1189) coupled to the insulating block and maintained at an absolute temperature of 20 K; and a high-temperature superconducting current connector (1040) connecting the connecting rod and the conductive cooling block to each other. The high-temperature superconducting electromagnet (2100) receives current through the connecting rod (2184), the high-temperature superconducting current connector (1040), and the conductive cooling block (1189).

A high-temperature superconducting magnet device (2000) may be a device for measuring the characteristics of a high-temperature superconducting magnet or a device for applying a magnetic field. The high-temperature superconducting magnet device may be modified in various ways as long as it forms a magnetic field.

The vacuum chamber (2180) may be a toroidal metal vacuum chamber. The vacuum chamber (2180) may be insulated by maintaining a vacuum inside it. The cross-section of the vacuum chamber (2180) may be D-shaped or rectangular. The central axis of the vacuum chamber (2180) may be exposed to the atmosphere.

A liquid nitrogen chamber (2182a, 2182b) may be disposed inside the vacuum chamber. The liquid nitrogen chamber (2182a, 2182b) may be a toroidal chamber having a rectangular cross-section. The central axis of the liquid nitrogen chamber (2182a, 2182b) may be the same as the central axis of the vacuum chamber. The liquid nitrogen chamber (2182a, 2182b) may be filled with liquid nitrogen. The liquid nitrogen chamber (2182a, 2182b) may include a pair of toroidal chambers. The pair of toroidal chambers may be disposed respectively on the inside and outside of a toroidal-shaped high-temperature superconducting electromagnet. The liquid nitrogen chamber (2182a, 2182b) may perform a heat shielding function of shielding radiant heat radiated from the vacuum chamber. The liquid nitrogen chamber (2182a, 2182b) includes a pair of pipes, the first pipe of which may be an inlet for liquid nitrogen. The second pipe may be an outlet for evaporated nitrogen gas. According to a modified embodiment of the present invention, a high-temperature superconducting electromagnet may be placed within the liquid nitrogen chamber.

The cryogenic refrigerator (2186) can control temperatures down to an extremely low temperature of 8K (-265 degrees Celsius) using pulse-tube refrigerator or Gifford-McMahon refrigeration technology. One end of the cryogenic refrigerator (2186) can be cooled to between 8K and 20K. A pair of cryogenic refrigerators (2186) can be installed within the vacuum chamber.

A pair of connecting rods (2184) may penetrate the upper surface of the vacuum chamber and be connected to the liquid nitrogen chamber. The connecting rods (2184) may be in the form of copper pipes and may have a center hole arranged therein. One end of the connecting rods (2184) is connected to the liquid nitrogen chamber, so that liquid nitrogen may flow to one end of the connecting rods (2184) to cool them to an absolute temperature of 77 K. The other end of the connecting rods (2184) may be maintained at room temperature outside the vacuum chamber and connected to a current source or a voltage source, so as to be connected to a high-temperature superconducting magnet or a device under test (DUT) to supply current.

A thermal link (2187) can be cooled to 20K by thermal contact with the cooling stage of the cryogenic refrigerator. The thermal link may be a copper plate. The thermal link can be in thermal contact with a flange of a bobbin (2101) constituting a high-temperature superconducting magnet. Accordingly, the high-temperature superconducting magnet (2100) can be cooled to an absolute temperature of 20K and maintain high-temperature superconductivity.

A high-temperature superconducting electromagnet (2100) or DUT may have a structure in which a high-temperature superconducting wire stack (10) is wound around a bobbin (2101). The high-temperature superconducting electromagnet (2100) is a wound coil and may have a toroidal shape. The high-temperature superconducting electromagnet (2100) may have a structure in which a high-temperature superconducting wire stack (10) is wound around a bobbin in a multi-layered winding shape. The high-temperature superconducting wire stack (10) is wound in a helical shape in each layer. The high-temperature superconducting wire stack (10) may have a laminated structure of 10 to 100 sheets of high-temperature superconducting wire in a tape shape. Both ends of the high-temperature superconducting electromagnet may have a high-temperature superconducting wire stack lead structure. A pair of high-temperature superconducting wire stack leads may be connected by the high-temperature superconducting wire stack. High-temperature superconducting electromagnets or devices under test (DUTs) can be cooled to an absolute temperature of 20 K. High-temperature superconducting electromagnets can be poloital high-temperature superconducting electromagnets for tokamak applications, toroidal high-temperature superconducting electromagnets for tokamak applications, or other high-temperature superconducting electromagnets for magnetic resonance imaging (MRI).

The insulating block can be in contact with the thermal link and electrically insulated from the cryogenic refrigerator. The insulating block can secure the high-temperature superconducting current connector and the high-temperature superconducting wire stack leads of the high-temperature superconducting electromagnet. The insulating block can be cooled to an absolute temperature of 20K.

Alternatively, the conductive cooling block may be fixed to the insulating block and may be connected to the high-temperature superconducting current connector and the high-temperature superconducting wire stack leads of the high-temperature superconducting electromagnet. The conductive cooling block may be a copper plate. The conductive cooling block may be cooled to an absolute temperature of 20 K.

Meanwhile, a pair of high-temperature superconducting current connectors may be connected to both ends of the high-temperature superconducting magnet, either directly or through the conductive cooling block. Each end of the high-temperature superconducting current connector may have a high-temperature superconducting wire stack bundle lead structure. The pair of high-temperature superconducting wire stack bundle leads may be connected by a high-temperature superconducting wire stack bundle.

One end of the high-temperature superconducting current connector may be cooled to an absolute temperature of 77 K, and the other end of the high-temperature superconducting current connector may be cooled to an absolute temperature of 20 K. Accordingly, current may flow through the connecting rod, the high-temperature superconducting current connector, the conductive cooling block, and the high-temperature superconducting electromagnet.

The high temperature superconducting electromagnet may include and be connected by a high temperature superconducting current connector, a high temperature superconducting wire stack bundle lead, a high temperature superconducting wire stack bundle, a high temperature superconducting joint, or a high temperature superconducting wire stack.

FIG. 27 is a drawing showing a D-type high-temperature superconducting electromagnet according to one embodiment of the present invention.

Fig. 28 is a drawing showing the D-type high-temperature superconducting electromagnet of Fig. 27.

Referring to FIGS. 27 and 28, a high-temperature superconducting electromagnet (1100) is wound with a high-temperature superconducting wire stack (10) having a rectangular cross-section. The high-temperature superconducting electromagnet (1100) includes a bobbin (1101); and a high-temperature superconducting wire stack (1090) wound around the bobbin (1101) to form a plurality of layers. In each of the wound layers, an unwound space (not shown) is arranged, and the space is filled with a reinforcing material (not shown). The high-temperature superconducting electromagnet (1100) may have an electromagnet structure wound using the high-temperature superconducting wire stack (1090) as a wire.

The bobbin (1101) may include flanges positioned at both ends of the D-shaped central shaft. The flanges may have trenches through which the high-temperature superconducting wire stack begins winding. The high-temperature superconducting wire stack (1090) inserted into the trenches may begin winding in the first layer. The two ends of the high-temperature superconducting electromagnet may be high-temperature superconducting wire stack leads (1010).

The high temperature superconducting wire stack lead (1010) can be directly connected to the high temperature superconducting current connector (1040) or connected to the high temperature superconducting current connector through a conductive cooling block (1189).

A pair of support rods may be respectively fixed to the flange of the bobbin. An insulating block (1185) may be fixed between the pair of support rods. A conductive cooling block (1189) may be placed on the insulating block (1185). The conductive cooling block (1189) may be coupled to the high-temperature superconducting wire stack lead (1010) and the high-temperature superconducting wire stack bundle lead (1040).

FIGS. 29a and 29b are conceptual diagrams showing a high-temperature superconducting wire stack lead according to one embodiment of the present invention.

FIG. 29c is an exploded perspective view showing a high-temperature superconducting wire stack lead according to one embodiment of the present invention.

Referring to FIGS. 29a, 29b, and 29c, a high-temperature superconducting wire stack lead (1010) includes a high-temperature superconducting wire stack (10) in which a plurality of high-temperature superconducting wires are stacked; and a connection lead (1012, 1014) connected to one end of the high-temperature superconducting wire stack (10).

A high-temperature superconducting wire stack (10) may include a plurality of high-temperature superconducting wires (10a) sequentially stacked; and at least one metal insulating tape (1018) stacked together with the high-temperature superconducting wires. The high-temperature superconducting wire stack (10) may have a stacked structure of 10 to 100 sheets of high-temperature superconducting wires (10a) in the form of tapes.

The above-described connecting leads (1012, 1014) may include a lower plate (1014) having a solder bath (1014a, 1014b, 1014c) for accommodating one end of the high-temperature superconducting wire stack (10); an upper plate (1012) having a supply port (1013) for supplying solder to the solder bath (1014a, 1014b, 1014c); and a copper tape (1018) inserted between the high-temperature superconducting wires accommodated in the solder bath (1014a, 1014b, 1014c). The solder may fill the solder bath (1014a, 1014b, 1014c) and bond the high-temperature superconducting wire (10a) and the copper tape (1018) to each other.

The upper plate (1012) may further include protrusions (1012a, 1012b, 1012c) that protrude in response to the solder baths (1014a, 1014b, 1014c) that are embedded therein. The protrusions (1012a, 1012b, 1012c) may be aligned with the solder bath to press one end of the high-temperature superconducting wire stack. The upper plate (1012) may be a rectangular parallelepiped plate. The upper plate (1012) may include a hole (1016) in a side surface. A rod heater (1016a) inserted into the hole (1016) may heat the upper plate (1012). The heated upper plate may melt the solder to bond the high-temperature superconducting wire and the copper tape to each other. The protrusion of the upper plate can compress the high-temperature superconducting wire stack inserted into the solder bath. The protrusion of the upper plate can have the same shape as the solder bath. The protrusion of the upper plate can include a first portion (1012a) having a narrow width, a second portion (1012b) having an increasing width, and a third portion (1012c) having a decreasing width.

The lower plate (1014) may include a solder bath (1014a, 1014b, 1014c) that is sunken to accommodate one end of a high-temperature superconducting wire stack. The lower plate may include a hole (1015) in a side surface. A rod heater (1015a) inserted into the hole (1015) may heat the lower plate (1014). The heated lower plate (1014) may melt solder to bond the high-temperature superconducting wire and the copper tape to each other. The solder bath (1014a, 1014b, 1014c) may include a first portion (1014a) having a narrow width, a second portion (1014b) having a wider width than the first portion, and a third portion (1014c) having a narrower width than the second portion. The solder supplied through the supply port (1013) of the upper plate (1012) can bond the high-temperature superconducting wire (10a) and the copper tape (1018) alternately stacked in the solder bath. The width of the copper tape (1018) can be substantially the same as the width of the second portion of the solder bath. The width of the first portion of the lower plate can be substantially the same as the width of the high-temperature superconducting wire stack. The copper tape and the solder can reduce contact resistance. The high-temperature superconducting wire stack (10) can be copper-wrapped (11a). The high-temperature superconducting wire and the copper tape are bonded by the solder, and the gap between the high-temperature superconducting wire and the copper tape can be 10 micrometers to 30 micrometers.

Fig. 30 is a conceptual diagram showing a series-connected high-temperature superconducting electromagnet according to one embodiment of the present invention.

Referring to Fig. 30, a high-temperature superconducting electromagnet (1100a) is wound with a high-temperature superconducting wire stack (10) having a rectangular cross-section. The high-temperature superconducting electromagnet (1100a) includes a bobbin (1101); and a high-temperature superconducting wire stack (1090) wound around the bobbin (1101) to form a plurality of layers.

There are multiple high-temperature superconducting electromagnets (1100a), and they can be connected in series with each other by high-temperature superconducting stack joints (1020). The high-temperature superconducting wire stack leads (1010) can be connected to an external circuit such as a current source.

FIGS. 31a and 31b are conceptual diagrams illustrating a high-temperature superconducting stack joint according to one embodiment of the present invention.

FIG. 31c is an exploded perspective view showing a high-temperature superconducting stack joint according to one embodiment of the present invention.

Referring to FIGS. 31a, 31b, and 31c, a high-temperature superconducting stack joint (1020) includes a first high-temperature superconducting wire stack (10) in which a plurality of high-temperature superconducting wires are stacked; a second high-temperature superconducting wire stack (10) in which a plurality of high-temperature superconducting wires are stacked; and a joint (1022, 1024) that connects one end of the first high-temperature superconducting wire stack to one end of the first high-temperature superconducting wire stack.

The above joint (1022, 1024) includes a lower plate (1024) having a solder bath (1024a, 1024b, 1024c) that accommodates one end of the first high-temperature superconducting wire stack (10) and one end of the second high-temperature superconducting wire stack (10); and an upper plate (1022) having a supply port that supplies solder to the solder bath. The high-temperature superconducting wires constituting the first high-temperature superconducting wire stack and the high-temperature superconducting wires constituting the second high-temperature superconducting wire stack are alternately stacked. The solder joins the alternately stacked high-temperature superconducting wires to each other.

The upper plate (1022) may further include protrusions (1022a, 1022b, 1022c) that protrude in response to the solder bath. The protrusions (1022a, 1022b, 1022c) may be aligned with the solder bath to press one end of the first high-temperature superconducting wire stack and the second high-temperature superconducting wire. The upper plate (1022) may be a rectangular parallelepiped plate. The upper plate (1022) may include a hole in a side surface. A rod heater inserted into the hole may heat the upper plate. The heated upper plate may melt the solder to bond the high-temperature superconducting wire and the copper tape to each other. The protrusions (1022a, 1022b, 1022c) of the upper plate may press the high-temperature superconducting wire stack inserted into the solder bath. The protrusion of the upper plate may have the same shape as the solder bath. The protrusion of the upper plate may include a first portion (1022a) having a narrow width, a second portion (1022b) having an increasing width, and a third portion (1022c) having a decreasing width. The first portion (1022a) may be symmetrical with the third portion (1022c). The first portion (1022a) may be inclined, the second portion (1022b) may be parallel, and the third portion (1022c) may be inclined.

The lower plate (1024) may include a solder bath (1024a, 1024b, 1024c) that is sunken to accommodate one end of a first high-temperature superconducting wire stack and one end of a second high-temperature superconducting wire stack. The lower plate (1024) may include a hole in a side surface. A rod heater inserted into the hole may heat the lower plate. The heated lower plate may melt solder so that the respective wires of the first high-temperature superconducting wire stack and the second high-temperature superconducting wire stack may be alternately joined by the solder. The solder bath may include a first portion (1024a) having a narrow width, a second portion (1024b) having a wider width than the first portion, and a third portion (1024c) having a narrower width than the second portion. The solder supplied through the supply port (1023) of the upper plate can join the first high-temperature superconducting wire and the second high-temperature superconducting wire that are alternately stacked in the solder bath. The widths of the first portion (1024a) and the third portion (1024c) of the lower plate can be substantially the same as the width of the high-temperature superconducting wire stack. The solder can reduce contact resistance. The first portion (1024a) can be inclined, the second portion (1024b) can be parallel, and the third portion (1024c) can be inclined. The high-temperature superconducting wire stack (10) can be copper-wrapped (11a). The gap between the first high-temperature superconducting wire and the second high-temperature superconducting wire can be 10 micrometers to 30 micrometers.

FIGS. 32a and 32b are conceptual diagrams illustrating a high-temperature superconducting stack joint according to one embodiment of the present invention.

FIG. 32c is an exploded perspective view showing a high-temperature superconducting stack joint according to one embodiment of the present invention.

Referring to FIGS. 32a, 32b, and 32c, a high-temperature superconducting stack joint (1030) includes a first high-temperature superconducting wire stack (10) in which a plurality of high-temperature superconducting wires are stacked; a second high-temperature superconducting wire stack (10) in which a plurality of high-temperature superconducting wires are stacked; and a joint (1032, 1034) that connects one end of the first high-temperature superconducting wire stack to one end of the first high-temperature superconducting wire stack.

The above joint (1032, 1034) includes a lower plate (1034) having a solder bath that accommodates one end of the first high-temperature superconducting wire stack and one end of the second high-temperature superconducting wire stack; and an upper plate (1032) having a supply port (1033) that supplies solder to the solder bath. One end of the first high-temperature superconducting wire stack and one end of the second high-temperature superconducting wire stack extend parallel to each other. A copper tape (1038) is inserted between the high-temperature superconducting wires of the first high-temperature superconducting wire stack accommodated in the solder bath and the high-temperature superconducting wires of the second high-temperature superconducting wire stack. The solder fills the solder bath and joins the first high-temperature superconducting wire, the second high-temperature superconducting wire, and the copper tape to each other.

Each of the first high-temperature superconducting wire stack (10) and the second high-temperature superconducting wire stack (10) may include a plurality of high-temperature superconducting wires (10a) sequentially stacked; and at least one metal insulating tape (10d) stacked together with the high-temperature superconducting wires.

The upper plate (1032) may further include protrusions (1032a, 1032b, 1032c) that protrude in response to the solder bath that is inserted. The protrusions (1032a, 1032b, 1032c) may be aligned with the solder bath (1034a, 1034b, 1034c) to press one end of the first high-temperature superconducting wire stack and the second high-temperature superconducting wire. The upper plate (1032) may be a rectangular parallelepiped plate. The upper plate (1032) may include a hole in a side surface. A rod heater inserted into the hole may heat the upper plate. The heated upper plate may melt the solder to bond the high-temperature superconducting wire (10a) and the copper tape (1038) to each other. The protrusions (1032a, 1032b, 1032c) of the upper plate can compress the high-temperature superconducting wire stack inserted into the solder bath. The protrusions of the upper plate may have the same shape as the solder bath. The protrusions (1032a, 1032b, 1032c) of the upper plate may include a first portion (1032a) having a narrow width, a second portion (1032b) having an increasing width, and a third portion (1032c) having a decreasing width. The first portion (1032a) and the third portion (1032c) may be arranged to be offset from each other.

The lower plate (1034) may include a solder bath (1034a, 1034b, 1034c) sunken to accommodate one end of the first high-temperature superconducting wire stack and one end of the second high-temperature superconducting wire stack. The lower plate (1034) may include a hole in a side surface. A rod heater inserted into the hole may heat the lower plate. The heated lower plate (1034) may melt solder so that the respective wires of the first high-temperature superconducting wire stack and the second high-temperature superconducting wire stack and the copper tape may be alternately joined by the solder. The copper tape (1038) may connect each layer of the first high-temperature superconducting wire stack and each layer of the second high-temperature superconducting wire stack. The solder bath (1034a, 1034b, 1034c) may include a first portion (1034a) having a narrow width, a second portion (1034b) having a wider width than the first portion, and a third portion (1034c) having a narrower width than the second portion. The first portion and the third portion may be arranged to be offset from each other.

The solder supplied through the supply port (1033) of the upper plate can bond the first high-temperature superconducting wire, the second high-temperature superconducting wire, and the copper tape in the solder bath. The widths of the first portion (1034a) and the third portion (1034c) of the lower plate can be substantially the same as the width of the high-temperature superconducting wire stack (10). The solder can reduce contact resistance. The high-temperature superconducting wire stack can be copper-wrapped (11a). The gap between the first high-temperature superconducting wire, the second high-temperature superconducting wire, and the copper tape can be 10 micrometers to 30 micrometers.

FIG. 33a is a conceptual diagram illustrating a high-temperature superconducting current connector according to one embodiment of the present invention.

Figure 33b is an exploded perspective view showing the high-temperature superconducting current connector of Figure 33a.

Referring to FIGS. 33a and 33b, a high-temperature superconducting current connector (1040) includes a high-temperature superconducting bundle (bundle, 12) including at least one high-temperature superconducting wire stack; a first connection lead (1040a) arranged at one end of the high-temperature superconducting bundle (bundle, 12); and a second connection lead (1040b) arranged at the other end of the high-temperature superconducting bundle (bundle). The high-temperature superconducting wire stack (10) includes a plurality of high-temperature superconducting wires (10a) that are aligned and stacked. The high-temperature superconducting bundle (12) may have a structure in which the high-temperature superconducting wire stacks (10) are arranged one-dimensionally or two-dimensionally.

Each of the first connection lead (1040a) and the second connection lead (1040b) includes a lower plate (1044) having a solder bath (1044a, 1044b, 1044c) for accommodating one end of the high-temperature superconducting bundle (12); an upper plate (1042) having a supply port (1043) for supplying solder to the solder bath; and a copper tape (1048) inserted between high-temperature superconducting wires constituting the high-temperature superconducting bundle accommodated in the solder bath. The solder fills the solder bath and bonds the high-temperature superconducting wires and the copper tape to each other.

The above high-temperature superconducting wire stack (10) may include a plurality of high-temperature superconducting wires (10a) stacked in sequence; and at least one metal insulating tape (10d) stacked together with the high-temperature superconducting wires.

The upper plate (1042) may further include protrusions (1042a, 1042b, 1042c) that protrude in response to the solder bath. The protrusions may be aligned with the solder bath to compress the first high-temperature superconducting bundle and the copper tape. The upper plate (1042) may be a rectangular parallelepiped plate. The upper plate may include a hole in a side surface. A rod heater inserted into the hole may heat the upper plate. The heated upper plate may melt the solder to bond the high-temperature superconducting wire and the copper tape to each other. The protrusions of the upper plate may compress the high-temperature superconducting bundle inserted into the solder bath. The protrusions of the upper plate may have the same shape as the solder bath. The protrusion of the upper plate may include a first portion (1042a) having a narrow width, a second portion (1042b) having an increasing width, and a third portion (1042c) having a decreasing width.

The lower plate (1044) may include a solder bath (1044a, 1044b, 1044c) that is sunken to accommodate one end of the high-temperature superconducting bundle. The lower plate (1044) may include a hole in a side surface. A rod heater inserted into the hole may heat the lower plate. The heated lower plate may melt solder so that each wire of the high-temperature superconducting bundle and the copper tape may be alternately joined by the solder. The copper tape (1048) may connect the thin layers of the high-temperature superconducting bundle to each other. The solder bath may include a first portion (1044a) having a narrow width, a second portion (1044b) having a wider width than the first portion, and a third portion (1044c) having a narrower width than the second portion.

The solder supplied through the supply port of the upper plate can bond the high-temperature superconducting bundle and the copper tape (1048) in the solder bath. The widths of the first and third portions of the lower plate can be substantially the same as the width of the high-temperature superconducting wire stack. The solder can reduce contact resistance. The high-temperature superconducting bundle can be copper-wrapped (11a). The gap between each wire of the high-temperature superconducting bundle and the copper tape can be 10 micrometers to 30 micrometers.

Figure 34 is a conceptual diagram showing a high-temperature superconducting bundle according to one embodiment of the present invention.

Referring to Fig. 34, the high-temperature superconducting bundle (12) may have a structure in which the high-temperature superconducting wire stack (10) is arranged one-dimensionally or two-dimensionally. The high-temperature superconducting wire stack (10) is formed by stacking a plurality of high-temperature superconducting wires. The high-temperature superconducting bundle (12) may have a structure in which the high-temperature superconducting wire stack is arranged in a 2X1 or 2X2 configuration. The high-temperature superconducting bundle may be copper-wrapped (11a).

FIG. 35 is a photograph showing a high-temperature superconducting current connector according to one embodiment of the present invention.

Figures 36a and 36b are experimental results showing the current-voltage characteristics of the high-temperature superconducting current connector of Figure 35.

Referring to FIGS. 35, 36a, and 36b, a high-temperature superconducting current connector (1040) includes a high-temperature superconducting bundle (bundle, 12) including at least one high-temperature superconducting wire stack; a first connection lead (1040a) disposed at one end of the high-temperature superconducting bundle; and a second connection lead (1040b) disposed at the other end of the high-temperature superconducting bundle. The high-temperature superconducting wire stack is formed by stacking a plurality of high-temperature superconducting wires. The high-temperature superconducting bundle (12) may have a structure in which the high-temperature superconducting wire stacks are arranged one-dimensionally or two-dimensionally. The high-temperature superconducting bundle (bundle, 12) may have a structure of one high-temperature superconducting wire stack. The high-temperature superconducting wire stack may be formed by stacking 40 layers of high-temperature superconducting wires. The high-temperature superconducting wire may be a high-temperature superconducting wire with a width of 4 mm.

The critical current of the high-temperature superconducting current connector (1040) measured using the four-terminal method is displayed. The four-terminal method applies current to terminals ① and ⑥, and measures voltage at terminals ② and ⑤. Terminal ① may be the first connection lead (1040a). Terminal ⑥ may be the second connection lead (1040b).

Typically, near the critical current, the characteristic curve shows an exponential increase in voltage as shown below.

[Mathematical Formula 1]

Here, Vc is the reference voltage, Ic is the critical current (2004 A), and n is 15. The high-temperature superconducting current connector (1040) can flow a current of about 2 kA. The critical current of one high-temperature superconducting wire stack (10) can be 2 kA.

The high-temperature superconducting current connector (1040) represents the resistance of the high-temperature superconducting current connector measured using the three-terminal method. The three-terminal method applies current to terminals ① and ⑥, and measures voltage at terminals ① and ②.

Or, the three-terminal method applies current to terminals ① and ⑥, and measures voltage at terminals ⑤ and ⑥.

The lead resistance obtained by this method is 50 to 70 nOhm (nano ohm). Specifically, the lead resistance between terminals ⑤ and ⑥ is 69.7 nOhm (nano ohm). The lead resistance between terminals ① and ② is 54.0 nOhm (nano ohm). The junction resistance of the high-temperature superconducting wire (10a) is a good value, around ~1 micro Ohm (micro ohm). The higher the junction resistance, the greater the amount of heat generated when current is applied.

FIG. 37 is a drawing showing the structure of a high-temperature superconducting current connector according to one embodiment of the present invention.

Figure 38a shows the time-dependent change in the current applied to the bundle including the 2X2 stack of Figure 37.

Referring to Fig. 37, ① to ⑫ indicate measurement positions. The high-temperature superconducting current connector may include a high-temperature superconducting bundle (12). The high-temperature superconducting bundle (12) may be a 2 X 2 high-temperature superconducting wire stack (10).

Referring to Fig. 38a, the power supply can increase the current over time up to 8 kA. The critical current of one high-temperature superconducting wire stack may be about 2 kA. The critical current of the 2 X 2 stack may be 8 kA, which is the sum of the critical current densities of the individual stacks. The power supply can increase the current over time up to 8 kA. That is, the high-temperature superconducting current connector (1040) stacked in 2 X 2 stacks can apply a current of 8 kA. The high-temperature superconducting bundle (12) may be a 2 X 2 high-temperature superconducting wire stack (10). The current over time between terminals ⑪ and ⑫ is shown. It was confirmed that the current distribution between the stacks (10) was well performed in the high-temperature superconducting current connector (1040).

Figure 38b shows the voltage variations between individual stacks, stacks, and the entire stack, between leads.

Referring to FIG. 38b, the voltage between positions ① and ② is measured over time. The voltage between positions ① and ③ is measured over time. The voltage between positions ① and ⑤ is measured over time. The voltage between positions ③ and ④ is measured over time. The voltage between positions ⑤ and ⑥ is measured over time. The voltage between positions ⑤ and ⑦ is measured over time. The voltage between positions ⑦ and ⑧ is measured over time. The voltage between positions ⑨ and ⑩ is measured over time. The voltage between positions ⑪ and ⑫ is measured over time. The lead resistance between terminals ⑪ and ⑫ is approximately 40 nOhm (nanoohms).

Figure 38c shows the voltage variation between stacks.

Referring to Figure 38c, it is confirmed that the current is redistributed between adjacent stacks. Specifically, the voltage between positions ① and ③ is measured over time. The voltage between positions ① and ⑤ is measured over time. The voltage between positions ⑤ and ⑦ is measured over time. The voltage between adjacent stacks ① and ③ is measured.

Figure 38d shows the voltage changes between individual stacks, the entire stack, and the leads.

Referring to Fig. 38d, the voltage between positions ① and ② is measured over time. The voltage between positions ③ and ④ is measured over time. The voltage between positions ⑤ and ⑥ is measured over time. The stack voltage is measured between positions ⑦ and ⑧. The overall stack voltage between positions ⑨ and ⑩ shows that the superconducting current is flowing well.

FIG. 39a is an exploded perspective view showing a high-temperature superconducting bundle lead according to one embodiment of the present invention.

Figure 39b is a conceptual diagram showing the high-temperature superconducting bundle lead of Figure 39a.

Referring to FIGS. 39a and 39b, a high-temperature superconducting bundle lead (1060) includes a high-temperature superconducting wire bundle (12) in which a plurality of high-temperature superconducting wire stacks (10) are arranged; and a connection lead (1062, 1064) connected to one end of the high-temperature superconducting wire bundle (12). The high-temperature superconducting wire stack (10) is formed by stacking a plurality of high-temperature superconducting wires. The high-temperature superconducting bundle (12) may have a structure in which the high-temperature superconducting wire stacks (10) are arranged one-dimensionally or two-dimensionally.

The above-described connecting leads (1062, 1064) include a lower plate (1064) having a solder bath (1064a, 1064b, 1064c) for accommodating one end of the high-temperature superconducting wire bundle; an upper plate (1062) having a supply port for supplying solder to the solder bath; and a copper tape (1068) inserted between the high-temperature superconducting bundles accommodated in the solder bath. The solder fills the solder bath and bonds the high-temperature superconducting bundle and the copper tape to each other.

The upper plate (1062) may further include protrusions (1062a, 1062b, 1062c) that protrude in response to the solder base that has been inserted. The protrusions may be aligned with the solder base to press one end of the high-temperature superconducting bundle.

The above high-temperature superconducting wire stack (10) may include a plurality of high-temperature superconducting wires (10a) stacked in sequence; and at least one metal insulating tape (10d) stacked together with the high-temperature superconducting wires.

Figure 40 is a drawing showing a winding coil having an insulating layer and a winding coil not having an insulating layer.

Referring to Fig. 40, the first winding coil (1070a) having an insulating layer is laminated in multiple layers. The first winding coil (1070a) is composed of a single layer of superconducting wire. The first winding coil (1070a) is wound in multiple layers, and when quenching occurs in one layer, current cannot flow to the neighboring superconducting wire due to the insulating layer. Accordingly, when quenching occurs, the first winding coil (1070a) breaks down. Meanwhile, the first winding coil (1070a) has a large inductance due to the high number of turns. The large inductance increases the charge/discharge characteristic time. The charge/discharge characteristic time can be expressed as the product of resistance and inductance.

In the case of the second winding coil (1070b) without an insulating layer, if quenching occurs in one layer, the current can flow to the neighboring superconducting wire because there is no insulating layer. Accordingly, the second winding coil (1070b) does not break down when quenching occurs. Meanwhile, the second winding coil (1070b) has a small inductance. Since the current flow in the second winding coil (1070b) is unclear, it is difficult to know the structure for reinforcing the Lorentz force caused by the current.

Therefore, a high-temperature superconductor electromagnet is required that uses a high-temperature superconductor to reduce inductance and to enable current distribution even when quenching occurs, thereby enabling stable operation.

FIG. 41a is a conceptual diagram illustrating a high-temperature superconducting wire stack according to one embodiment of the present invention.

Figure 41b is a circuit diagram showing the contact resistance and inductance of the high-temperature superconducting wire stack of Figure 41a.

Figure 41c is a circuit diagram showing the contact resistance and inductance of the high-temperature superconducting wire stack of Figure 41a.

Referring to FIGS. 41a, 41b, and 41c, a high-temperature superconducting wire stack (1080) includes a plurality of high-temperature superconducting wires (10a) stacked in sequence; and at least one metal insulating tape (10d) stacked together with the high-temperature superconducting wires.

The above metal insulating tape (10d) may be arranged on at least one of the uppermost surface or the lowermost surface of the high-temperature superconducting wire stack (10). The high-temperature superconducting wires (10a) may slide against each other. The contact resistance of the adjacent high-temperature superconducting wires may be several uOhm/m. The length of the high-temperature superconducting wire stack may be 100 to 500 meters. The thicknesses of the high-temperature superconducting wires may be different from each other.

A high-temperature superconducting wire stack (1080) may include a metal insulating tape (10d) on the top layer of 30 layers of high-temperature superconducting wires (10a). The metal insulating tape (10d) may be a stainless steel (SUS) tape. When the metal insulating tape (10d) is wound in multiple layers, it may provide electrical insulation between the high-temperature superconducting wire stacks. The metal insulating tape (10d) may have a resistivity greater than that of copper. The thickness of the metal insulating tape (10d) may be the same as the thickness of one high-temperature superconducting wire. For example, the thickness of the metal insulating tape (10d) may be 0.11 mm.

Referring to FIG. 41b, the high-temperature superconducting wire stack (1080) may have a contact resistance (Rs) of adjacent high-temperature superconducting wires and an inductance (L) per unit length. Meanwhile, the metal insulating tape may include an inductance (Lm) and a series resistance (Rm) per unit length and may have a contact resistance.

Referring again to FIG. 41c, when current flows through the high-temperature superconducting wire stack (1080), if quenching occurs in the N-1th high-temperature superconducting wire, current is distributed from the location where quenching occurs to the surrounding high-temperature superconducting wires. Accordingly, even if quenching occurs, the high-temperature superconducting wire stack (1080) can operate stably.

Figure 42 is a conceptual diagram showing a high-temperature superconducting wire stack according to one embodiment of the present invention.

Referring to FIG. 42, a high-temperature superconducting wire stack (1080) includes a plurality of high-temperature superconducting wires stacked in sequence; and at least one metal insulating tape (10d) stacked together with the high-temperature superconducting wires (10a). The metal insulating tape may be placed on the uppermost layer of the plurality of stacked high-temperature superconducting wires. The metal insulating tape (10d) may be placed on the uppermost and lowermost layers of the plurality of stacked high-temperature superconducting wires. The metal insulating tape (10d) may be placed on the lowermost layer of the plurality of stacked high-temperature superconducting wires.

Figure 43 is a conceptual diagram showing a high-temperature superconducting wire stack according to one embodiment of the present invention.

Referring to FIG. 43, a high-temperature superconducting wire stack (1080) includes a plurality of high-temperature superconducting wires (10a) sequentially stacked; and at least one metal insulating tape (10d) stacked together with the high-temperature superconducting wires. The metal insulating tape (10d) may be arranged on the uppermost layer of the plurality of stacked high-temperature superconducting wires. The metal insulating tape (10d) may be arranged on the uppermost and lowermost layers of the plurality of stacked high-temperature superconducting wires. The metal insulating tape may be arranged on the lowermost layer of the plurality of stacked high-temperature superconducting wires. The high-temperature superconducting wire stack (10d) may be bent so that the arrangement plane becomes a curved surface. Accordingly, the high-temperature superconducting wires constituting the high-temperature superconducting wire stack may slide against each other.

The high-temperature superconducting wire stack (1080) may further include a copper wrapping (11a) surrounding the high-temperature superconducting wire stack. The copper wrapping binds the high-temperature superconducting wire stack so that the wires do not separate from each other and operate as a single conductor.

Figure 44 is a conceptual diagram showing a high-temperature superconducting wire stack and a thickness distribution of the high-temperature superconducting wire according to one embodiment of the present invention.

Referring to Fig. 44, the thickness of the first high-temperature superconducting wire may be t_1, and the thickness of the Nth high-temperature superconducting wire may be t_N. The thickness (t_1) of the first high-temperature superconducting wire may be different from the thickness (t_N) of the Nth high-temperature superconducting wire. For example, the thicknesses of the high-temperature superconducting wires may have a predetermined distribution.

Since the high-temperature superconducting wire stack (10) has multiple high-temperature superconducting wires, the total thickness of the high-temperature superconducting wire stack is expressed as the product of the average thickness and the number of layers. Therefore, the high-temperature superconducting wire stack performs the function of averaging the thickness changes of each high-temperature superconducting wire.

When forming a winding coil using a high-temperature superconducting wire stack (10), the thickness of each layer is averaged to have a constant value, so uniform winding is possible.

Figure 45a shows a coil wound with one high-temperature superconducting wire.

FIG. 45b illustrates a coil wound using a high-temperature superconducting wire stack according to one embodiment of the present invention.

Referring to Fig. 45a, the electromagnet may have 300 turns (N) to form a magnetic field (B = N x I) using a high-temperature superconducting wire (10a) having an insulating layer. In this case, the inductance may be proportional to the square of the number of turns (N). Since the high-temperature superconducting wire (10a) has a thickness of, for example, 0.11 mm, the total thickness of 300 turns may be 33 mm.

Meanwhile, since a high-temperature superconducting wire has a thickness of, say, 0.10 mm, the adjacent electromagnet may be 30 mm thick for 300 turns. Therefore, if electromagnets with different characteristics are connected in series, operational stability may be degraded.

Referring to Fig. 45b, a high-temperature superconducting wire stack (10) can stack 30 layers (M) of high-temperature superconducting wires. The high-temperature superconducting wires can have an average thickness of 0.1 mm. In this case, the number of turns (N) is 10, so that a desired magnetic field (B = N x M x I) can be formed. Meanwhile, since the inductance is proportional to the square of the number of turns (N = 10), the inductance can be significantly reduced. The charge/discharge characteristic time can be expressed as the product of the resistance and the inductance. Accordingly, when it is desired to change the magnetic field over time, the charge/discharge characteristic time can be significantly reduced.

FIG. 46a is a perspective view showing a high-temperature superconducting electromagnet according to one embodiment of the present invention.

Figure 46b is a conceptual diagram showing the high-temperature superconducting magnet of Figure 46a.

Fig. 47 is a development diagram showing the high-temperature superconducting magnet of Fig. 46.

Referring to FIGS. 46 and 47, a high-temperature superconducting electromagnet (1090) is wound with a high-temperature superconducting wire stack having a rectangular cross-section. The high-temperature superconducting electromagnet (1090) includes a bobbin (1091); and a high-temperature superconducting wire stack (10) wound around the bobbin to form a plurality of layers. In each of the wound layers, an unwound space (90) is arranged. The space (90) is filled with a reinforcing material (92). The width of the space (90) in each layer may be the same as the width of the high-temperature superconducting wire stack (10).

The width of the above space (90) is the same as the width of the high-temperature superconducting wire stack (10), and the reinforcing material (92) may be a metal or a metal alloy, for example, stainless steel.

A high-temperature superconducting wire stack (10) includes a plurality of high-temperature superconducting wires (10a) stacked in sequence; and at least one metal insulating tape (10d) stacked together with the high-temperature superconducting wires.

If the above electromagnet is a D-shaped coil, it may include a straight section (1090a) and a curved section (1090b). The electromagnet has a straight section and a curved section, and in the developed view, the space area (90) in the straight section (1090a) may be a triangle, and in the developed view, the space area (90) in the curved section (1090b) may be a rectangle.

In each layer, the space area (90) of the curved section (1090b) is arranged on the left or right, and in each layer, the space area (90) of the straight section (1090a) includes a first triangular area on the left and a second triangular area on the right, and when the first triangular area and the second triangular area are in contact with each other, they can form a rectangle.

A high-temperature superconducting wire stack (10) includes a plurality of high-temperature superconducting wires (10a) stacked in sequence; and at least one metal insulating tape (10d) stacked together with the high-temperature superconducting wires.

When the layers change as the high-temperature superconducting wire stack (10) above is wound, the reinforcing material (92) placed thereunder may have a tapered slope.

The above high-temperature superconducting wire stack (10) can be sequentially wound from the first layer to the right from points a, b, c, j, and k on the left side of the development diagram. The layer can be changed at point k. When the layer is changed as the high-temperature superconducting wire stack is wound, the reinforcing material arranged thereunder can have a tapered slope.

The above high-temperature superconducting wire stack (10) can be sequentially wound to the left from the k point, l point, and t point on the right side of the development diagram in the second layer.

The above high-temperature superconducting wire stack (10) can be sequentially wound to the right from the x point, y point, and z point on the left side of the development diagram in three layers.

Figure 48 is a conceptual diagram illustrating an electromagnet according to another embodiment of the present invention.

Referring to Fig. 48, a high-temperature superconducting electromagnet (1090a) is wound with a high-temperature superconducting wire stack (10) having a rectangular cross-section. The high-temperature superconducting electromagnet (1090a) includes a bobbin (1091); and a high-temperature superconducting wire stack (10) wound around the bobbin to form a plurality of layers. In each of the wound layers, an unwound space (90) is arranged. The space (90) is filled with a reinforcing material (92). The width of the space in each layer may be the same as the width of the high-temperature superconducting wire stack.

The width of the above space space is the same as the width of the high-temperature superconducting wire stack, and the reinforcing material may be stainless steel.

A clamp (1093) can secure a wound high-temperature superconducting wire stack (10). The clamp (1093) can include a pair of half rings (1093a) arranged to surround the uppermost winding; and a clamp connecting portion (1093b) that connects the half rings to each other. The half rings can be connected to each other to form a closed curve. The clamp can be made of stainless steel.

FIGS. 49a and 49b are side views illustrating an electromagnet according to another embodiment of the present invention.

Referring to FIGS. 49a and 49b, a high-temperature superconducting electromagnet (1090) is wound with a high-temperature superconducting wire stack (10) having a rectangular cross-section. The high-temperature superconducting electromagnet (1090) includes a bobbin (1091); and a high-temperature superconducting wire stack (10) wound around the bobbin to form a plurality of layers. In each of the wound layers, an unwound space (90) is arranged. The space (90) is filled with a reinforcing material (92). The width of the space in each layer may be the same as the width of the high-temperature superconducting wire stack.

Referring to Fig. 49a, the electromagnet (1090) may have a straight section (1090a) and a curved section (1090b). In the side view, the wound second layer may be composed solely of the reinforcing material (92). In the side view, the straight section (1090a) may be composed solely of the reinforcing material (92).

Referring to FIG. 49b, the electromagnet may have a straight section (1090a) and a curved section (1090b).

The third layer wound in the side view may be composed only of the reinforcing material (92). The straight section (1090a) in the side view may be composed only of the reinforcing material (92).

FIG. 50 is a drawing illustrating a method for manufacturing a high-temperature superconducting electromagnet according to one embodiment of the present invention.

Referring to FIG. 50, a high-temperature superconducting electromagnet (1090) is wound with a high-temperature superconducting wire stack having a rectangular cross-section. The high-temperature superconducting electromagnet includes a bobbin; and a high-temperature superconducting wire stack wound around the bobbin to form a plurality of layers. In each of the wound layers, an unwound space is arranged. The space is filled with a reinforcing material. The width of the space in each layer may be the same as the width of the high-temperature superconducting wire stack. The width of the space is the same as the width of the high-temperature superconducting wire stack, and the reinforcing material may be stainless steel.

The above reinforcement is formed by cutting a stainless steel strip of the same shape as the spacer region and inserting it into the spacer region. After inserting the reinforcement into each layer, a high-temperature superconducting wire stack is wound. The winding can be performed with one of the pair of flanges of the bobbin removed.

Next, the wound coil is fixed using a clamp (1093). The clamp (1093) can be divided into a straight section and a curved section.

Next, a silicone mold is formed and impregnated with a thermally conductive epoxy (e.g., stycast) to form the electromagnet. Accordingly, the thermally conductive epoxy can fill the space between the stacks of high-temperature superconducting wires wound in the same layer. The space between the stacks of high-temperature superconducting wires in each wound layer can be impregnated and filled with the conductive epoxy.

The above high-temperature superconducting wire stack (10) may include a plurality of high-temperature superconducting wires (10a) stacked in sequence; and at least one metal insulating tape (10d) stacked together with the high-temperature superconducting wires.

Next, the mold is removed, and the removed flange from among the pair of flanges of the bobbin (1091) can be joined to the bobbin.

Next, the joined flange can be welded to the bobbin by a method such as laser welding.

FIG. 51 is a drawing showing epoxy impregnation of a high-temperature superconducting electromagnet according to one embodiment of the present invention.

FIG. 52 is a photograph showing a high-temperature superconducting electromagnet according to one embodiment of the present invention. FIG. 51 is a photograph showing a high-temperature superconducting electromagnet according to one embodiment of the present invention.

Referring to FIGS. 51 and 52, a high-temperature superconducting electromagnet (1090) is wound with a high-temperature superconducting wire stack having a rectangular cross-section. The high-temperature superconducting electromagnet (1090) includes a bobbin (1091); and a high-temperature superconducting wire stack (10) wound around the bobbin to form a plurality of layers. In each of the wound layers, an unwound space is arranged. The space space (90) is filled with a reinforcing material (92). The width of the space space in each layer may be the same as the width of the high-temperature superconducting wire stack. The width of the space space may be the same as the width of the high-temperature superconducting wire stack, and the reinforcing material may be stainless steel. The wound coil is fixed using a clamp (1093). A thermally conductive epoxy may fill the space between the high-temperature superconducting wire stacks (10) wound in the same layer.

A connection lead (1010) can be connected to one end of the high-temperature superconducting wire stack. The connection lead includes a lower plate having a solder bath for accommodating one end of the high-temperature superconducting wire bundle; an upper plate having a supply port for supplying solder to the solder bath; and a copper tape inserted between the high-temperature superconducting bundles accommodated in the solder bath. The solder fills the solder bath and bonds the high-temperature superconducting bundle and the copper tape to each other.

Figure 53 shows a current-voltage characteristic curve when the current in a D-type coil according to one embodiment of the present invention is linearly increased over time, briefly stopped, and then linearly decreased again.

Figure 54 is a drawing showing a section in which current is applied to a D-type coil over time.

Referring to Fig. 54, the current in the D-type coil (1090) increases linearly over time, stops for a moment, and then decreases linearly again. It has a ① section where the current increases linearly over time, a ② section where the current is constant over time, and a ③ section where the current decreases linearly over time. In the ④ section, the current is zero. The S point is the point where the inductance voltage disappears and only the superconducting resistance remains.

Referring to Fig. 53, the voltage of the D-type coil (1090) is measured according to the current of Fig. 54. Section ① is a section in which the voltage rapidly increases due to coil inductance, and then a voltage due to superconductivity (resistance) appears.

Referring to Figure 53, in section ②, the inductance voltage disappears and changes to a voltage due to superconductivity (resistance).

Referring to Fig. 53, in section ③, an opposite voltage appears due to the coil inductance.

Referring to Figure 53, section ④ is the section where the inductance voltage disappears and changes to a voltage due to superconductivity (resistance). Point S is the point where the inductance voltage disappears and only the superconducting resistance remains.

Figure 55 is actual measurement data of the current applied to a D-type coil according to one embodiment of the present invention over time.

Referring to Figure 55, the current of the D-type coil (1090) increases linearly over time in section ①, and the current is constant over time in section ②, showing the change in current over time. The current increases linearly over time to about 1100 A in section ①, and then remains at a constant value in section ②. The D-type coil (1090) is operating normally.

The critical current (Ic) can be 1032 A, n=10, the inductance can be 0.177 mH, the characteristic time (τ) can be 8.4 s, and the resistance (Rc) can be 20 micro-ohms.

Figures 56a to 56c are simulation results showing the current redistribution phenomenon in a high-temperature superconducting stack or bundle.

Referring to FIGS. 56a to 56c, two high-temperature superconducting stacks form a bundle and may have different lead resistances. Accordingly, the value of the current flowing in each high-temperature superconducting stack may be different. For example, the lead resistance of the high-temperature superconducting wire forming the first high-temperature superconducting stack may be 0.5 microOhm. Meanwhile, the lead resistance of the high-temperature superconducting wire forming the second high-temperature superconducting stack may be 1.5 microOhm. In this case, the first high-temperature superconducting stack having a lead resistance of 0.5 microOhm may allow three times more current to flow than the first high-temperature superconducting stack having a lead resistance of 1.5 microOhm.

At this time, if a heat source is generated in a part of the central part of the coil, resistance is generated on the side where a lot of current flows due to the temperature rise caused by the heat source.

Due to this resistance value, the current is redistributed from the side with more current flowing to the side with less current flowing, resulting in a phenomenon where the current flows evenly throughout.

For example, if a heat source of 1500 W/m is generated in a 1-meter space in the central part for 0.5 seconds, the temperature rise caused by the heat source causes resistance to be generated on the side where more current flows, and the current (Good lead resistance) on the side where more current flows decreases and then increases linearly over time to reach the initial state.

For example, if a heat source of 2400 W/m is generated in a 1-meter space in the central part for 0.5 seconds, the temperature rise caused by the heat source causes resistance to be generated on the side where more current flows, and the current (Good lead resistance) on the side where more current flows decreases and then increases linearly over time to reach the initial state.

For example, if a heat source of 3500 W/m is generated in a 1-meter space in the central part for 0.5 seconds, the temperature rise caused by the heat source causes resistance to be generated in the side where more current flows, and the current (Good lead resistance) in the side where more current flows decreases. Due to this resistance value, the current is redistributed from the side where more current flows to the side where less current flows, resulting in a phenomenon where the current flows evenly throughout.

According to one embodiment of the present invention, even if different currents flow due to lead resistance among high-temperature superconducting stacks, when the resistance increases due to a heat source, a current redistribution phenomenon occurs in which the current flows uniformly throughout the stack.

According to one embodiment of the present invention, even if different currents flow due to the lead resistance of one high-temperature superconducting stack among high-temperature superconducting bundles, when the resistance increases due to a heat source, a current redistribution phenomenon occurs in which the current flows uniformly throughout the bundle.

According to one embodiment of the present invention, a high-temperature superconducting wire stack can perform multi-layer winding current redistribution. For example, current redistribution is possible in the event of a thermal problem within a 30-layer stack of wires. In other words, ??-value stability is secured.

According to one embodiment of the present invention, when manufacturing medium- to large-sized magnets, the bobbin size increases. Therefore, the high-temperature superconducting wire stack is less affected by the wire length limitation (typically 100 to 500 meters) when wound in a multilayer structure.

According to one embodiment of the present invention, a high-temperature superconducting wire stack is configured as a multilayer structure and includes a metal insulating layer. Accordingly, a coil wound with the high-temperature superconducting wire stack has a small inductance. This relatively small inductance reduces the characteristic time, enabling rapid magnetic field charging and discharging. Furthermore, the high-temperature superconducting wire stack has a clear current flow for each layer, eliminating the need to consider leakage current between the high-temperature superconducting wire stacks. Therefore, when designing structural reinforcement based on the Lorentz force, the structural reinforcement design can be performed solely through simulation.

According to one embodiment of the present invention, the electromagnet can be wound with a high-temperature superconducting wire stack and then the space area is filled with a reinforcing material to provide structural stability.

According to one embodiment of the present invention, the structural stability can be increased and heat transfer can be promoted by wrapping a high-temperature superconducting wire stack or bundle with copper or by impregnating a thermally conductive epoxy between bundles.

According to one embodiment of the present invention, the high-temperature superconducting wire stack further includes a cooling channel, and the high-temperature superconducting wire stack can maximize cooling efficiency.

Figure 57 is a conceptual diagram showing an electromagnet according to one embodiment of the present invention.

Referring to FIG. 57, the high-temperature superconducting wire stack may further include a cooling channel. The high-temperature superconducting wire stack may maximize cooling efficiency by the cooling channel.

An electromagnet (1090) according to one embodiment of the present invention is wound with a winding unit (20) including a high-temperature superconducting wire stack having a rectangular cross-section. The electromagnet includes a bobbin (1091); and a winding unit (20) wound around the bobbin to form a plurality of layers. In each of the wound layers, an unwound space (90) is arranged, the width of the space space being the same as the width of the high-temperature superconducting wire stack, and the space space (90) is filled with a reinforcing material (92).

The winding unit (20) comprises a high-temperature superconducting bundle (bundle, 12) arranged with at least one high-temperature superconducting wire stack; and at least one conduction cooling channel (29) extending in parallel and in contact with the high-temperature superconducting bundle. The winding unit (20) may further comprise a copper plate (29a) on which the high-temperature superconducting bundle (bundle, 12) and the conduction cooling channel (29) are mounted. The reinforcing material may be stainless steel. The conduction cooling channel (29) may be a copper rod having a square cross-section.

FIG. 58a is a plan view showing a high-temperature superconducting wire lead according to one embodiment of the present invention and a perspective view showing a high-temperature superconducting wire stack.

Figure 58b is a conceptual diagram showing the high-temperature superconducting wire lead of Figure 58a.

Referring to FIGS. 58a and 58b, a high-temperature superconducting wire lead (2010) according to an embodiment of the present invention includes a winding unit (20) that includes and winds a high-temperature superconducting wire stack (10) in which a plurality of high-temperature superconducting wires are stacked; and a connecting lead (1012, 1014) connected to one end of the winding unit. The high-temperature superconducting wire stack includes a conduction cooling channel (29), and the high-temperature superconducting wire stack can maximize cooling efficiency by the conduction cooling channel (29).

The high-temperature superconducting wire stack (10) may include a plurality of high-temperature superconducting wires sequentially stacked; and at least one metal insulating tape stacked together with the high-temperature superconducting wires. The connection lead (1012, 1014) may be connected to one end of the winding unit. The high-temperature superconducting wire stack may have a stacked structure of 10 to 100 high-temperature superconducting wires in the form of tapes.

The above-described connecting lead (1012, 1014) may include a lower plate (1014) having a solder bath that accommodates one end of the winding unit (20); an upper plate (1014) having a supply port that supplies solder to the solder bath; and a copper tape (1018) inserted between the high-temperature superconducting wires accommodated in the solder bath. The solder may fill the solder bath and bond the high-temperature superconducting wires and the copper tape to each other.

The upper plate (1012) may further include a protrusion that protrudes in response to the solder bath. The protrusion may be aligned with the solder bath to press one end of the winding unit. The upper plate may be a rectangular parallelepiped plate. The upper plate may include a hole in a side surface. A rod heater inserted into the hole may heat the upper plate. The heated upper plate may melt the solder to bond the high-temperature superconducting wire and the copper tape to each other. The protrusion of the upper plate may press the high-temperature superconducting wire stack inserted into the solder bath. The protrusion of the upper plate may have the same shape as the solder bath. There is. The protrusion of the above top plate may include a first portion having a narrow width, a second portion having an increasing width, and a third portion having a decreasing width.

The lower plate (1014) may include a solder bath recessed to accommodate one end of a high-temperature superconducting wire stack. The lower plate may include a hole in a side surface. A rod heater inserted into the hole may heat the lower plate. The heated lower plate may melt solder to bond the high-temperature superconducting wire and the copper tape to each other. The solder bath may include a first portion having a narrow width, a second portion having a width that is greater than the first portion, and a third portion having a width that is less than the second portion. Solder supplied through the supply port of the upper plate may bond the high-temperature superconducting wire and the copper tape alternately stacked in the solder bath. The width of the copper tape may be substantially the same as the width of the second portion of the solder bath. The width of the first portion of the lower plate may be substantially the same as the width of the high-temperature superconducting wire stack. The copper tape and the solder may reduce contact resistance. The high-temperature superconducting wire stack can be copper-wrapped (11a). The high-temperature superconducting wire and the copper tape are joined by solder, and the gap between the high-temperature superconducting wire and the copper tape can be 10 to 30 micrometers.

Although the present invention has been illustrated and described above with respect to specific preferred embodiments, the present invention is not limited to these embodiments, and includes various forms of embodiments that can be implemented by a person having ordinary skill in the art to which the invention pertains without departing from the technical spirit of the present invention claimed in the patent claims.

110: Jacket
120: High-temperature superconducting wire
130: Metal plate

Claims (7)

In high-temperature superconducting wire stacks,
A plurality of high-temperature superconducting wires stacked in sequence; and
A metal insulating tape laminated with the high-temperature superconducting wires, having a resistivity greater than that of copper;
The above metal insulating tape is laminated on the top or bottom surface of a plurality of high-temperature superconducting wires,
The above high-temperature superconducting wire stack is wound on a bobbin to form multiple layers,
In each of the coiled layers, an uncoiled space is arranged,
A high-temperature superconducting wire stack, wherein each of the high-temperature superconducting wires comprises: a substrate; a buffer layer disposed on the substrate; a superconducting layer disposed on the buffer layer; and a protective layer disposed to surround the superconducting layer and the substrate, wherein the protective layer is a copper thin film. delete In the first paragraph,
The thickness of the above metal insulating tape is equal to the thickness of one high-temperature superconducting wire,
A high-temperature superconducting wire stack characterized in that the high-temperature superconducting wires can slide relative to each other. In the first paragraph,
A high-temperature superconducting wire stack characterized in that the contact resistance of adjacent high-temperature superconducting wires is several uOmh/m. In the first paragraph,
A high-temperature superconducting wire stack, characterized in that the length of the high-temperature superconducting wire stack is 100 meters to 500 meters. In the first paragraph,
A high-temperature superconducting wire stack characterized in that the thicknesses of the high-temperature superconducting wires are different from each other. In the first paragraph,
The above high-temperature superconducting wire stack is wrapped by copper wrapping,
A high-temperature superconducting wire stack characterized in that the copper wrapping is spiral wrapping, and the ratio of the area with the copper wrapping and the area without the copper wrapping along the longitudinal direction of the high-temperature superconducting wire is 1:0 to 1:3.