KR102811816B1 - 로봇 및 이를 구비한 기판 반송 시스템 - Google Patents
로봇 및 이를 구비한 기판 반송 시스템 Download PDFInfo
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- KR102811816B1 KR102811816B1 KR1020227031011A KR20227031011A KR102811816B1 KR 102811816 B1 KR102811816 B1 KR 102811816B1 KR 1020227031011 A KR1020227031011 A KR 1020227031011A KR 20227031011 A KR20227031011 A KR 20227031011A KR 102811816 B1 KR102811816 B1 KR 102811816B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
-
- H10P72/7602—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0093—Programme-controlled manipulators co-operating with conveyor means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/06—Programme-controlled manipulators characterised by multi-articulated arms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H10P72/3302—
-
- H10P72/3402—
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Manipulator (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
Description
도 2는 수평 다관절 로봇의 평면도이다.
도 3은 기판처리설비의 개략적인 평면도이다.
도 4는 로봇의 기능 블록도이다.
도 5는 제1 커버를 제거한 상태의 기대의 측면도이다.
110 기판반송시스템
1 기대
11a 제1 측부
11b 제2 측부
11c 제3 측부
11d 제4 측부
12 메인터넌스부
13a 제1 커버(커버)
18 팬
21a 가동부의 상단부(아암과 기대의 연결부분)
24 제1 보드(제어에 관련된 부품)
25 제2 보드(제어에 관련된 부품)
26 배터리(제어에 관련된 부품)
3 아암
31a 제1 단부(아암과 기대의 연결부분)
8 핸드(엔드이펙터)
111 케이스
111a 제1 측벽
111b 제2 측벽
111c 제3 측벽
111d 제4 측벽
114 개폐부
121A 풉(용기)
121B 처리장치
S 기판
Claims (15)
- 케이스와,
상기 케이스내에 배치되어 기판을 반송하는 로봇을 구비하고,
상기 케이스는 소정의 제1 방향에 있어서 대향하는 제1 측벽 및 제3 측벽과, 상기 제1 방향과 다른 방향인 제2 방향에 있어서 대향하는 제2 측벽 및 제4 측벽을 가지고,
상기 제2 측벽에는 상기 로봇을 메인터넌스하기 위한 개폐부가 설치되고,
상기 로봇은 복수의 측부를 가지는 기대와, 상기 기대에 회전 가능하게 연결된 아암과, 상기 아암에 연결된 엔드이펙터를 가지고,
상기 기대는 상기 아암 및 상기 엔드이펙터의 적어도 한쪽의 제어에 관련된 부품을 수용함과 함께 상기 제3 측벽보다 상기 제1 측벽에 접근하여 배치되고,
상기 기대의 상기 복수의 측부 중 하나의 측부인 제1 측부는 상기 제1 측벽과 대향하고 있고,
상기 기대의 상기 복수의 측부 중 상기 제2 측벽 쪽을 향하는 제2 측부에는 상기 부품의 적어도 일부의 부품이 배치된, 상기 적어도 일부의 부품에 메인터넌스를 수행하기 위한 메인터넌스부가 설치되어 있고,
상기 제2 측벽과 상기 제4 측벽의 간격은 상기 제1 측벽과 상기 제3 측벽의 간격보다 크며,
상기 아암과 상기 기대의 연결부분은 평면시로 상기 복수의 측부 중 상기 제1 측부에 가장 접근하여 배치되어 있는, 기판 반송 시스템. - 제1항에 있어서,
상기 케이스는 평면시로 사각형상으로 형성되어 있는, 기판 반송 시스템. - 삭제
- 삭제
- 제1항 또는 제2항에 있어서,
상기 기대의 복수의 측부는 상기 제1 측부와, 상기 제2 측부와, 상기 제1 측부와 대향하는 제3 측부와, 상기 제2 측부와 대향하는 제4 측부를 포함하고,
상기 기대는 평면시로 사각형상으로 형성되어 있는, 기판 반송 시스템. - 제1항 또는 제2항에 있어서,
상기 메인터넌스부에 배치되는 부품은 전기부품인, 기판 반송 시스템. - 제1항 또는 제2항에 있어서,
상기 기대는 상기 제2 측부에 설치되고, 상기 기대 내부의 공기를 배출하는 팬을 가지고,
상기 제2 측부에는 상기 메인터넌스부를 가리는 커버가 착탈 가능하게 부착되고,
상기 팬은 상기 제2 측부 중 상기 커버 이외의 부분에 배치되어 있는, 기판 반송 시스템. - 제1항 또는 제2항에 있어서,
상기 엔드이펙터는 기판을 홀딩하는 핸드인, 기판 반송 시스템. - 제8항에 있어서,
상기 제1 측벽 및 상기 제3 측벽의 한쪽에는 반도체 웨이퍼를 수용하는 용기가 인접하여 배치되고,
상기 제1 측벽 및 상기 제3 측벽의 다른 쪽에는 반도체 웨이퍼를 처리하는 처리장치가 인접하여 배치되고,
상기 핸드는 기판으로서의 반도체 웨이퍼를 홀딩하고,
상기 로봇은 상기 용기와 상기 처리장치의 사이에서 반도체 웨이퍼를 반송하는, 기판 반송 시스템. - 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020019880A JP7545805B2 (ja) | 2020-02-07 | 2020-02-07 | ロボット及びそれを備えた基板搬送システム |
| JPJP-P-2020-019880 | 2020-02-07 | ||
| PCT/JP2021/003670 WO2021157553A1 (ja) | 2020-02-07 | 2021-02-02 | ロボット及びそれを備えた基板搬送システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20220139945A KR20220139945A (ko) | 2022-10-17 |
| KR102811816B1 true KR102811816B1 (ko) | 2025-05-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227031011A Active KR102811816B1 (ko) | 2020-02-07 | 2021-02-02 | 로봇 및 이를 구비한 기판 반송 시스템 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12202684B2 (ko) |
| JP (1) | JP7545805B2 (ko) |
| KR (1) | KR102811816B1 (ko) |
| CN (1) | CN115066744A (ko) |
| TW (1) | TWI839595B (ko) |
| WO (1) | WO2021157553A1 (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI831505B (zh) * | 2022-12-07 | 2024-02-01 | 迅得機械股份有限公司 | 收放板機構及移載機構 |
| CN117699401B (zh) * | 2024-02-05 | 2024-05-31 | 四川省科学城久信科技有限公司 | 一种电容器测试用上料装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019140379A (ja) * | 2018-02-09 | 2019-08-22 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP2020011303A (ja) * | 2018-07-13 | 2020-01-23 | 株式会社安川電機 | 搬送ロボットおよびロボットシステム |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH072318B2 (ja) * | 1987-07-03 | 1995-01-18 | 三菱電機株式会社 | 多関節ロボット |
| JPH04102794U (ja) * | 1990-04-26 | 1992-09-04 | 株式会社安川電機 | コントロ−ラ内蔵形水平多関節ロボツト |
| JPH10303588A (ja) | 1997-04-24 | 1998-11-13 | Fujitsu Ltd | 強制空冷用ファンユニット取付け構造 |
| JP4098338B2 (ja) * | 2006-07-20 | 2008-06-11 | 川崎重工業株式会社 | ウェハ移載装置および基板移載装置 |
| JP2011189415A (ja) | 2010-03-12 | 2011-09-29 | Ihi Corp | ロボットハンドとその爪部材交換方法 |
| JP5569544B2 (ja) | 2012-01-31 | 2014-08-13 | 株式会社安川電機 | 搬送ロボット |
| JP5667996B2 (ja) | 2012-02-21 | 2015-02-12 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP6295037B2 (ja) * | 2013-08-08 | 2018-03-14 | 日本電産サンキョー株式会社 | 産業用ロボット |
| JP6374156B2 (ja) | 2013-08-09 | 2018-08-15 | 日本電産サンキョー株式会社 | 水平多関節ロボットおよび水平多関節ロボットの製造方法 |
| JP5937249B1 (ja) | 2015-03-20 | 2016-06-22 | Dmg森精機株式会社 | 加工機械 |
| US9929034B2 (en) * | 2015-09-03 | 2018-03-27 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer device |
| JP6645993B2 (ja) | 2016-03-29 | 2020-02-14 | 株式会社Kokusai Electric | 処理装置、装置管理コントローラ、及びプログラム並びに半導体装置の製造方法 |
| JP7017306B2 (ja) * | 2016-11-29 | 2022-02-08 | 株式会社日立ハイテク | 真空処理装置 |
| CN110137121B (zh) * | 2018-02-09 | 2024-03-26 | 东京毅力科创株式会社 | 基板处理装置 |
| JP2019207930A (ja) * | 2018-05-29 | 2019-12-05 | 川崎重工業株式会社 | ロボットシステム |
| JP6798591B2 (ja) | 2019-08-30 | 2020-12-09 | 株式会社安川電機 | ロボット、ロボットシステム、ロボットのメンテナンス方法 |
-
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- 2020-02-07 JP JP2020019880A patent/JP7545805B2/ja active Active
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2021
- 2021-02-02 US US17/797,446 patent/US12202684B2/en active Active
- 2021-02-02 CN CN202180013132.6A patent/CN115066744A/zh active Pending
- 2021-02-02 WO PCT/JP2021/003670 patent/WO2021157553A1/ja not_active Ceased
- 2021-02-02 KR KR1020227031011A patent/KR102811816B1/ko active Active
- 2021-02-05 TW TW110104352A patent/TWI839595B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019140379A (ja) * | 2018-02-09 | 2019-08-22 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP2020011303A (ja) * | 2018-07-13 | 2020-01-23 | 株式会社安川電機 | 搬送ロボットおよびロボットシステム |
Also Published As
| Publication number | Publication date |
|---|---|
| US20230084971A1 (en) | 2023-03-16 |
| JP7545805B2 (ja) | 2024-09-05 |
| JP2021125641A (ja) | 2021-08-30 |
| CN115066744A (zh) | 2022-09-16 |
| TW202144143A (zh) | 2021-12-01 |
| US12202684B2 (en) | 2025-01-21 |
| KR20220139945A (ko) | 2022-10-17 |
| WO2021157553A1 (ja) | 2021-08-12 |
| TWI839595B (zh) | 2024-04-21 |
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