KR102818968B1 - Substrate processing device - Google Patents

Abstract

(Task) By monitoring the pressure on the primary side, it is possible to prevent in advance improper cleaning treatment of the substrate.
(Solution) The control unit (161) adjusts the pressure by manipulating the input signal to the pressure actuator (89), and acts on the upper surface of the substrate (W) by the pressure mechanism to cause the brush (99) to act. Since the control unit (161) monitors the primary pressure gauge (155) and the secondary pressure gauge (159), it can determine that there is an abnormality in the primary pressure. The control unit (161) can determine that a situation has arisen in which the pressure of the brush (99) cannot be adjusted to a desired value. As a result, it is possible to prevent in advance the inappropriate cleaning treatment for a new substrate (W) from being continuously performed.

Description

SUBSTRATE PROCESSING DEVICE

The present invention relates to a substrate processing device and a substrate processing method for performing a cleaning process by applying a brush to a substrate such as a semiconductor substrate, a substrate for an FPD (Flat Panel Display) such as a liquid crystal display or an organic EL (Electroluminescence) display device, a glass substrate for a photomask, a substrate for an optical disk, etc.

Conventionally, as this type of device, there is a substrate processing device having a rotating holding portion, a nozzle, an arm, an air supply pipe, an electro-pneumatic regulator, a pressure gauge, an air cylinder, a load cell, and a brush (see, for example, Patent Document 1).

The rotating support member maintains the cleaning surface of the substrate in an upwardly facing position. The nozzle supplies the treatment liquid to the upper surface of the substrate. The arm maintains the brush at the tip. The arm rotates the brush and applies pressure so as to achieve a target load, thereby pressing the brush against the substrate and acting on the substrate. As a result, the cleaning process is performed.

Air piping, etc. are built into the arm. One end of the air supply piping is connected to the air supply source of the utility provided in the clean room. The other end of the air supply piping is connected to an air cylinder. In the air supply piping, an electric regulator, a pressure gauge, and an air cylinder are connected in that order from the upstream side near the air supply section.

The electro-pneumatic regulator adjusts the opening according to the input signal. The electro-pneumatic regulator adjusts the pressure of the air on the primary side, which is the air supply source side, and supplies it to the secondary side, which is the downstream side of the electro-pneumatic regulator. The pressure gauge detects the pressure on the secondary side of the electro-pneumatic regulator. The air cylinder expands and contracts the load according to the pressure of the secondary side of the air. As a result, the air cylinder applies pressure to the brush. The load cell, whose corresponding relationship with the pressure of the brush is corrected, outputs an output signal according to the pressure of the brush. The input signal to the electro-pneumatic regulator is adjusted according to the output signal from the load cell, and the pressure of the brush is adjusted to the target load. After adjusting the pressure according to the output signal from the load cell, a cleaning process is performed on the substrate by the brush while maintaining the input signal to the electro-pneumatic regulator at the time of adjustment.

Japanese Patent Publication No. 2020-109862

However, in the case of conventional examples having this configuration, there are the following problems.

That is, conventional devices do not have a problem if they can supply air at a sufficiently high pressure from the air supply source. However, since the air supply source is a utility of the clean room, it also supplies air to other devices, etc. Therefore, there are cases where the supply timing overlaps for many devices, etc. Then, the pressure on the primary side of the air supply pipe decreases. In this state, while maintaining the input signal to the electropneumatic regulator at the time of adjustment, the pressure decreases below the target load. In addition, in this state, even if the opening of the electropneumatic regulator is adjusted to increase, the pressure on the secondary side does not rise above the specified value.

Therefore, after adjusting the pressure by adjusting the input signal to the main regulator according to the output signal from the load cell, if the pressure on the primary side decreases, the pressure of the brush decreases below the target load. That is, there is a concern that the pressure of the brush cannot be adjusted to the target load. As a result, there are cases where processing with an inappropriate pressure is performed on the substrate.

The present invention has been made in consideration of these circumstances, and has as its object the provision of a substrate processing device and a substrate processing method capable of preventing in advance improper cleaning treatment of a substrate by monitoring the pressure of the primary side.

In order to achieve this purpose, the present invention adopts the following configuration.

That is, the invention described in claim 1 is a substrate processing device that performs a cleaning process by acting a brush on a substrate, the device comprising: a rotating holding unit that maintains the substrate in a horizontal position and rotates the substrate; a brush that acts on an upper surface of the substrate held by the rotating holding unit; a pressing mechanism that elastically presses the brush toward the substrate by applying pressure by supplying air; an air supply pipe having one end communicatively connected to an air supply source and the other end communicatively connected to the pressing mechanism; an electropneumatic regulator that adjusts the pressure of the air in the air supply pipe by adjusting the opening degree according to an input signal; a primary pressure gauge that is disposed between the air supply source and the electropneumatic regulator among the air supply pipes and detects the pressure on the primary side of the electropneumatic regulator as the primary pressure; a secondary pressure gauge that is disposed between the electropneumatic regulator and the pressing mechanism among the air supply pipes and detects the pressure on the secondary side of the electropneumatic regulator as the secondary pressure; and a pressure gauge that operates the input signal and operates the primary pressure gauge and the secondary pressure gauge. It is characterized by having a control unit that monitors the side pressure gauge.

[Operation/Effect] According to the invention described in claim 1, the control unit manipulates the input signal to adjust the pressure and causes the brush to act on the upper surface of the substrate through the pressure mechanism. Since the control unit monitors the primary pressure gauge and the secondary pressure gauge, it can determine that there is an abnormality in the primary pressure. Accordingly, the control unit can determine that a situation has arisen in which the pressure of the brush cannot be adjusted to a desired value. As a result, it is possible to prevent in advance the substrate from being subjected to inappropriate cleaning treatment.

In addition, in the present invention, it is preferable that the control unit generates an alarm when the primary side pressure is below a predetermined value (claim 2).

The control unit issues an alarm when the primary side pressure is below a predetermined value. Accordingly, the operator of the device can take measures such as stopping processing. As a result, inappropriate cleaning processing of the substrate can be prevented in advance.

In addition, in the present invention, it is preferable that the control unit stops the processing at the point in time when the cleaning process for the substrate held in the rotating holding unit is completed when the primary side pressure is below a predetermined value (claim 3).

The control unit stops the processing when the cleaning process for the substrate during the cleaning process is completed if the primary side pressure is lower than a predetermined value. Therefore, although the cleaning process is likely to be performed under a condition where the pressure does not reach the target load, the processing is stopped after performing the same process as for other substrates processed with the pressure of the target load. As a result, the processing history can be matched with that of other substrates. In addition, since the processing is stopped after performing a rinsing process or a drying process, damage to the substrate can be reduced compared to an immediate stop without performing these.

In addition, in the present invention, the control unit, in a state where an electronic balance is placed at a position where a substrate is placed in the rotation holding unit, adjusts the input signal so that the secondary side pressure gauge becomes the secondary side pressure corresponding to the opening degree of the electropneumatic regulator obtained in advance based on a correspondence relationship between the opening degree of the electropneumatic regulator and the measured load of the measured value of the electronic balance, and a correspondence relationship between the opening degree of the electropneumatic regulator and the secondary side pressure, so that the pressure of the brush is adjusted to the target load (claim 4).

Based on the correspondence relationship of the actual load acquired in advance and the correspondence relationship between the opening degree of the electropneumatic regulator and the secondary pressure, the opening degree of the electropneumatic regulator is obtained from the correspondence relationship between the target load to be applied to the substrate and the actual load. The secondary pressure gauge is adjusted to the target load by applying an input signal so that the secondary pressure corresponds to the opening degree. In a state where the primary pressure is not lower than a predetermined value, the relationship between the opening degree of the electropneumatic regulator and the secondary pressure is maintained. Therefore, when the input signal is adjusted so that the secondary pressure gauge is the secondary pressure corresponding to the opening degree, the pressure becomes the target load. Therefore, the cleaning process can be accurately performed with the pressure of the target load.

In addition, in the present invention, it is preferable that the pressure mechanism comprises a seesaw member configured to be swayable about a fulcrum member as a fulcrum, and having a stress point on one side of the fulcrum and an operating point on the other side of the fulcrum, and a pressure actuator that applies a pressure to press the brush against the upper surface of the substrate by applying a driving force based on air to the stress point to cause the seesaw member to sway about the fulcrum (claim 5).

The motion of the pressure actuator is applied to the working point through the pivot point of the seesaw member. Therefore, by providing the seesaw member, the degree of freedom in the arrangement of the pressure actuator can be increased. Therefore, the height of the substrate processing device can be suppressed. As a result, the arrangement of stacking the substrate processing devices in multiple stages can be easily realized.

In addition, in the present invention, the pressure mechanism comprises a brush moving member that is elastically pressed at one end according to the pressure and moves the brush at the other end, a support member that supports the upper and lower surfaces of the brush moving member and allows movement in the longitudinal direction, a bracket on which the brush is mounted at the lower end and arranged at the other end of the brush moving member, and a rod that is supplied with air according to the pressure and moves forward and backward, and a pressure actuator that moves the brush moving member by bringing the tip end of the rod into contact with the one end side of the brush moving member, wherein the rod has a rod inclined surface at the tip end that is inclined with respect to the longitudinal axis, the brush moving member has a first inclined surface that is inclined with respect to the longitudinal axis at the one end and is inclined along the rod inclined surface, and a second inclined surface at the other end that is inclined with respect to the longitudinal axis, and the bracket has a bracket inclined surface at the upper end that is inclined along the second inclined surface, and the brush moving member advances and retreats in the longitudinal direction according to the advance and retreat of the rod. Preferable (claim 6).

When the rod of the pressure actuator advances and retreats, the rod inclined surface advances and retreats and translates. Accordingly, the first inclined surface and the second inclined surface of the brush moving member supported by the supporting member advance and retreat in the longitudinal direction. In addition, the bracket inclined surface advances and retreats in the longitudinal direction of the bracket. Accordingly, the brush moves in accordance with the advance and retreat of the rod. Since the brush moving member is supported by the supporting member, the dead weight of the brush moving member is canceled when viewed from the pressure actuator. Accordingly, even when the rod of the pressure actuator advances and retreats slightly, the brush moving member can be moved in accordance with the slight advance and retreat. As a result, even when a slight pressure is applied, the pressure can be applied accurately.

In addition, the invention described in claim 7 is characterized in that, in a substrate processing method for performing a cleaning treatment by applying a brush to a substrate, when performing a process of applying pressure to an upper surface of a substrate held by a rotating holding member by applying pressure to the brush through a pressure mechanism, a process of detecting a primary pressure between an electropneumatic regulator that adjusts the pressure of air in an air supply pipe, one end of which is connected to an air supply source and the other end of which is connected to the pressure mechanism, and the air supply source is performed, and a process of sounding an alarm when the primary pressure is below a predetermined value.

[Operation/Effect] According to the invention described in claim 7, during the process of applying pressure to the upper surface of the substrate with a brush through a pressure mechanism, a process of detecting the primary pressure and a process of generating an alarm when the primary pressure is below a predetermined value are performed. Accordingly, it is possible to determine that a situation has arisen in which the pressure of the brush cannot be adjusted to a desired value. As a result, it is possible to prevent in advance an inappropriate cleaning treatment of the substrate.

According to the substrate processing device according to the present invention, the control unit manipulates an input signal to adjust the pressure and causes the brush to act on the upper surface of the substrate through the pressure mechanism. Since the control unit monitors the primary pressure gauge and the secondary pressure gauge, it can determine that there is an abnormality in the primary pressure. Accordingly, the control unit can determine that a situation has arisen in which the pressure of the brush cannot be adjusted to a desired value. As a result, it is possible to prevent in advance an inappropriate cleaning process for the substrate from being performed.

Fig. 1 is a plan view showing the overall configuration of a substrate processing device according to an embodiment.
Figure 2 is a drawing of the substrate processing device of Figure 1 as seen from the rear (X).
Fig. 3 is a plan view showing a schematic configuration of a back cleaning unit according to an embodiment.
Figure 4 is a side view showing a schematic configuration of a back cleaning unit.
Figure 5 is a cross-sectional view of the cleaning arm.
Figure 6 is a block diagram showing the control system of the back cleaning unit.
Figure 7 is a flow chart showing the preprocessing performed in advance.
Fig. 8 (a) is a graph showing the relationship between the opening of the electro-pneumatic regulator and the load of the electronic balance, (b) is a graph showing the relationship between the secondary pressure of the electro-pneumatic regulator and the opening, and (c) is a graph showing the relationship between the load of the pressure actuator and the secondary pressure of the electro-pneumatic regulator.
Figure 9 is a flow chart showing the cleaning process.
Fig. 10 is a longitudinal cross-sectional view of a cleaning arm according to a modified example.
Figure 11 is a diagram explaining the operation of a cleaning arm according to a modified example.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Fig. 1 is a plan view showing the overall configuration of a substrate processing device according to an embodiment. Fig. 2 is a drawing of the substrate processing device of Fig. 1 as seen from the rear (X).

＜1. Overall composition＞

The substrate processing device (1) is equipped with an import/export block (3), an indexer block (5), and a processing block (7).

The substrate processing device (1) processes a substrate (W). The substrate processing device (1) performs, for example, a cleaning process on the substrate (W). The substrate processing device (1) processes the substrate (W) in a single wafer manner in a processing block (7). The single wafer manner processes one sheet of substrate (W) at a time in a horizontal position.

In this specification, for convenience, the direction in which the load-out block (3), the indexer block (5), and the processing block (7) are lined up is called the “front-back direction (X).” The front-back direction (X) is horizontal. Among the front-back directions (X), the direction from the processing block (7) toward the load-out block (3) is called the “front.” The direction opposite to the front is called the “rear.” The horizontal direction orthogonal to the front-back direction (X) is called the “width direction (Y).” One direction of the “width direction (Y)” is called the “right” as appropriate. The direction opposite to the right is called the “left.” The direction perpendicular to the horizontal direction is called the “vertical direction (Z).” In each drawing, front, back, right, left, up, and down are appropriately indicated for reference.

＜2. Import/Export Block＞

The loading/unloading block (3) has an input section (9) and an output section (11). The input section (9) and the output section (11) are arranged in the width direction (Y). A plurality of substrates (W) (for example, 25 substrates) are stacked and stored in a horizontal position at a certain interval within one carrier (C). The carrier (C) storing the unprocessed substrates (W) is placed on the input section (9). The input section (9) has, for example, two mounting tables (13) on which the carriers (C) are placed. The carrier (C) has a plurality of grooves (not shown) formed so that the surfaces of the substrates (W) are spaced apart from each other and each receives the substrates (W) one by one. The carrier (C) receives the substrates (W) in an attitude such that the surfaces thereof face upward. As the carrier (C), for example, there is a FOUP (Front Opening Unify Pod). FOUP is a closed container. The carrier (C) may be an open container or of any type.

The discharge unit (11) is arranged on the opposite side of the input unit (9) with respect to the center of the width direction (Y) of the substrate processing device (1). The discharge unit (11) is arranged on the left side (Y) of the input unit (9). The discharge unit (11) stores the substrate (W) that has been processed in the carrier (C) and discharges it for each carrier (C). The discharge unit (11) that functions in this manner, like the input unit (9), has, for example, two loading tables (13) for loading the carrier (C). The input unit (9) and the discharge unit (11) are also called load ports.

＜3. Indexer Block＞

The indexer block (5) is positioned adjacent to the rear (X) of the load/unload block (3) in the substrate processing device (1). The indexer block (5) is equipped with an indexer robot (IR) and a receiving section (15).

The indexer robot (IR) is configured to be rotatable around the vertical direction (Z). The indexer robot (IR) is configured to be movable in the width direction (Y). The indexer robot (IR) has a first hand (19) and a second hand (21). In Fig. 1, only one hand is shown due to the relationship between the illustrations. The first hand (19) and the second hand (21) each hold one substrate (W). The first hand (19) and the second hand (21) are configured to be independently moved forward and backward in the forward and backward direction (X). The indexer robot (IR) moves in the width direction (Y) and rotates around the vertical direction (Z), and moves the first hand (19) or the second hand (21) forward and backward to move the substrate (W) between each cassette (C). Similarly, the indexer robot (IR) moves the substrate (W) between the moving section (15).

The water supply unit (15) is arranged at the boundary with the processing block (7) among the indexer blocks (5). The water supply unit (15) is arranged, for example, at the center in the width direction (Y). As shown in Fig. 2, the water supply unit (15) is formed long in the vertical direction (Z).

The water supply unit (15) is provided with a first inversion unit (23), a pass unit (25), a pass unit (27), and a second inversion unit (29) from the downward to the upward direction in the vertical direction (Z).

The first inversion unit (23) inverts the top and bottom of the substrate (W) received from the indexer block (5). The first inversion unit (23) inverts the horizontal position of the substrate (W). Specifically, the first inversion unit (23) converts the substrate (W) whose surface is facing upward into a position in which the surface is facing downward. In other words, it converts the position of the substrate (W) so that the back side is facing upward.

The second inversion unit (29) performs the opposite operation. That is, the second inversion unit (29) inverts the top and bottom of the substrate (W) received from the processing block (7). The second inversion unit (29) converts the substrate (W) with its surface facing downward into a posture in which its surface faces upward. In other words, it converts the posture of the substrate (W) so that its back side faces downward.

The inversion directions of the first inversion unit (23) and the second inversion unit (29) described above may be opposite to each other. That is, the first inversion unit (23) changes the posture of the substrate (W) so that the surface faces upward. The second inversion unit (29) changes the posture of the substrate (W) so that the back surface faces upward.

The pass section (25, 27) is used to transfer the substrate (W) between the indexer block (5) and the processing block (7). The pass section (25) is used, for example, to return the substrate (W) from the processing block (7) to the indexer block (5). The pass section (27) is used, for example, to return the substrate (W) from the indexer block (5) to the processing block (7). In addition, the return directions of the substrate (W) in the pass sections (25, 27) may be opposite to each other.

＜4. Processing Block＞

The processing block (7) performs, for example, a cleaning treatment on the substrate (W). The cleaning treatment is, for example, a treatment using a brush in addition to a processing liquid. The processing block (7), as shown in Fig. 1, is divided into, for example, a first column (R1), a second column (R2), and a third column (R3) in the width direction (Y). Specifically, the first column (R1) is arranged on the left side (Y). The second column (R2) is arranged in the center portion in the width direction (Y). In other words, the second column (R2) is arranged on the right side (Y) of the first column (R1). The third column (R3) is arranged on the right side (Y) of the second column (R2).

＜4-1. Column 1＞

The first row (R1) of the processing block (7) has a plurality of processing units (31). The first row (R1) has, for example, four processing units (31). The first row (R1) has the four processing units (31) stacked in the vertical direction (Z) and arranged. Each processing unit (31) will be described in detail later. Each processing unit (31) is, for example, a cleaning unit. The cleaning unit cleans the substrate (W). As the cleaning unit, there are a surface cleaning unit that cleans the surface of the substrate (W) and a back cleaning unit that cleans the back surface of the substrate (W). In this embodiment, the back cleaning unit (SSR) will be described as an example of the processing unit (31).

＜4-2. Column 2＞

The second row (R2) of the processing block (7) is equipped with a center robot (CR). The center robot (CR) is configured to be rotatable around the vertical direction (Z). The center robot (CR) is configured to be able to ascend and descend in the vertical direction (Z). The center robot (CR) is equipped with, for example, a first hand (33) and a second hand (35). The first hand (33) and the second hand (35) each hold one substrate (W). The first hand (33) and the second hand (35) are configured to be able to advance and retreat independently in the forward-backward direction (X) and the width direction (Y).

＜4-3. Column 3＞

The third row (R3) of the processing block (7) has the same configuration as the first row (R1). That is, the third row (R3) has a plurality of processing units (31). The third row (R3) has, for example, four processing units (31). The third row (R3) has the four processing units (31) stacked and arranged in the vertical direction (Z). Each processing unit (31) of the first row (R1) and each processing unit (31) of the third row (R3) are arranged to face each other in the width direction (Y). Due to this, the center robot (CR) can access the opposing processing units (31) of the first row (R1) and the third row (R3) at the same height in the vertical direction (Z).

The processing block (7) is configured as described above. Here, an operation example of the center robot (CR) will be briefly described. The center robot (CR) receives, for example, a substrate (W) from the first inversion unit (23). The center robot (CR) returns the substrate (W) to the back-side cleaning unit (SSR) of one of the first column (R1) and the third column (R3) to perform a cleaning process on the back side of the substrate (W). The center robot (CR) receives the substrate (W) that has been cleaned in the back-side cleaning unit (SSR) of one of the first column (R1) and the third column (R3). The center robot (CR) returns the substrate (W) to the second inversion unit (29).

＜4-4. Processing Unit＞

Here, with reference to FIGS. 3 to 5, the back cleaning unit (SSR) (processing unit (31)) will be described. FIG. 3 is a plan view showing a schematic configuration of a back cleaning unit according to an embodiment. FIG. 4 is a side view showing a schematic configuration of a back cleaning unit. FIG. 5 is a cross-sectional view of a cleaning arm.

In addition, here, the back cleaning unit (SSR) equipped in the first column (R1) is explained as an example. The back cleaning unit (SSR) of the third column (R3) is configured as if the arrangement in the width direction (Y) has been changed.

The back cleaning unit (SSR) is equipped with a rotating maintenance part (37), a guard (39), a first treatment liquid arm (41), a second treatment liquid arm (43), a cleaning arm (45), and a waiting port (47).

＜4-4-1. Rotation maintenance part＞

The rotation support member (37) is arranged almost at the center of the back cleaning unit (SSR) when viewed from the plane. The rotation support member (37) rotates the substrate (W) within the horizontal plane while maintaining the substrate (W) in a horizontal position. The rotation support member (37) is equipped with an electric motor (49), a rotation shaft (51), a spin chuck (53), and a support pin (55).

The electric motor (49) is arranged in a posture in which the rotation axis (51) is directed in the vertical direction (Z). The rotation axis (51) has a spin chuck (53) mounted on the upper end. The spin chuck (53) has a diameter slightly larger than the diameter of the substrate (W). The spin chuck (53) is a circular plate-shaped member. The spin chuck (53) has a plurality of support pins (55). In this embodiment, for example, six support pins (55) are provided. The six support pins (55) contact the outer periphery of the substrate (W) and support the substrate (W) in a horizontal posture. The number of support pins (55) is not limited to six as long as the plurality of support pins (55) can stably support the substrate (W) in a horizontal posture. The six support pins (55) are installed so as to stand near the outer periphery of the substrate (W) in the spin chuck (53). The six support pins (55) release the support of the periphery of the substrate (W) when loading the substrate (W) into the spin chuck (53) and when removing the substrate (W) from the spin chuck (53). Therefore, each support pin (55) is configured to be rotatable around the vertical direction (Z). A description of the specific configuration for performing the operation is omitted. The rotation holding unit (37) rotates the spin chuck (53) around the rotation center (P1) when the electric motor (49) is rotated. The rotation center (P1) is in the vertical direction (Z).

＜4-4-2. Guard＞

The guard (39) is arranged to surround the rotational support member (37) when viewed from a plan view. Specifically, the guard (39) has a cylindrical body (57) and an inclined member (59). The guard (39) is configured to be raised and lowered in the vertical direction (Z). The guard (39) can be raised and lowered to a lowered standby position and a processing position higher than the standby position. A description of the specific configuration for raising and lowering the guard (39) is omitted.

The body (57) of the guard (39) has a cylindrical shape. The body (57) is arranged so that the inner surface thereof is spaced outward from the outer surface of the rotational support member (37). The inclined portion (59) is narrowed from the upper portion of the body (57) to approach the rotational axis (51). The inclined portion (59) has an opening (61) at the upper portion. The opening (61) is formed in the central portion of the inclined portion (59). The opening (61) is larger than the diameter of the substrate (W). The opening (61) is larger than the diameter of the spin chuck (53). When the substrate (W) is loaded or unloaded, the guard (39) is lowered in the vertical direction (Z) to a position where the spin chuck (53) protrudes upward from the opening (61). When cleaning the substrate (W), the guard (39) has an inclined portion (59) positioned near the height of the substrate (W) held on the spin chuck (53). The inclined portion (59) guides the treatment liquid, etc., flying around from the substrate (W) on the inclined inner surface to the lower side of the guard (39).

＜4-4-3. First treatment liquid arm＞

The first treatment liquid arm (41) is arranged at the rear (X) of the rotation support member (37) when viewed from the plane. The first treatment liquid arm (41) is equipped with an electric motor (42) on the base side. The first treatment liquid arm (41) is swung around a rotation center (P2) on the base side by the electric motor (42). The rotation center (P2) is in the vertical direction (Z). The first treatment liquid arm (41) is equipped with one nozzle (63). The nozzle (63) is equipped with a discharge port on the lower side. The nozzle (63) discharges the treatment liquid. The first treatment liquid arm (41) is configured so that the tip of the nozzle (63) can swung between the standby position shown in Fig. 3 and the supply position near the rotation center (P1). When the first treatment liquid arm (41) supplies the treatment liquid to the substrate (W), the tip end of the nozzle (63) moves to the supply position. When the first treatment liquid arm (41) does not supply the treatment liquid to the substrate (W), the tip end of the nozzle (63) moves to the standby position. When the first treatment liquid arm (41) supplies the treatment liquid to the substrate (W), the nozzle (63) may be moved in a swing manner above the substrate (W) so as not to interfere with the cleaning arm (45).

As the treatment liquid discharged from the nozzle (63), for example, a rinse liquid can be mentioned. As the rinse liquid, for example, pure water, carbonated water, electrolytic ion water, hydrogen water, ozone water, etc. can be mentioned.

＜4-4-4. Second treatment liquid arm＞

The second treatment liquid arm (43) is arranged on the left side (Y) of the rotation support member (37) when viewed from the plane. The second treatment liquid arm (43) is equipped with an electric motor (44) on the base side. The second treatment liquid arm is swung around the rotation center (P3) on the base side by the electric motor (44). The rotation center (P3) is in the vertical direction (Z). The second treatment liquid arm (43) is equipped with three nozzles (65, 67, 69). Each nozzle (65, 67, 69) is equipped with a discharge port on the lower side. The nozzles (65, 67, 69) discharge the treatment liquid. The second treatment liquid arm (43) is configured so that the tip portions of the nozzles (65, 67, 69) can swing between the standby position shown in FIG. 3 and the supply position near the center of rotation (P1). When the second treatment liquid arm (43) supplies the treatment liquid to the substrate (W), the tip portions of the nozzles (65, 67, 69) move to the supply position. When the second treatment liquid arm (43) does not supply the treatment liquid to the substrate (W), the tip portions of the nozzles (65, 67, 69) move to the standby position. When the second treatment liquid arm (43) supplies the treatment liquid to the substrate (W), the nozzles (65, 67, 69) may swing above the substrate (W) so as not to interfere with the cleaning arm (45).

As the treatment liquid discharged from the nozzle (65, 67, 69), for example, a chemical liquid can be mentioned. As the chemical liquid, for example, a chemical liquid containing at least one of sulfuric acid, nitric acid, acetic acid, hydrochloric acid, hydrofluoric acid, ammonia water, and hydrogen peroxide water can be mentioned. As a more specific chemical liquid, for example, SC-1, which is a mixture of ammonia water and hydrogen peroxide water, can be used.

＜4-4-5. Washing Arm＞

The cleaning arm (45) is composed as follows.

The cleaning arm (45) is equipped with a rotating lifting mechanism (71), a support (73), a housing (75), and a cleaning unit (77).

The rotary elevating mechanism (71) is configured such that the support (73), the housing (75), and the cleaning section (77) can be raised and lowered in the vertical direction (Z). The rotary elevating mechanism (71) is configured such that the support (73), the housing (75), and the cleaning section (77) can swing around the rotation center (P4). Specifically, the rotary elevating mechanism (71) is configured by combining an electric motor and an air cylinder, for example. The rotary elevating mechanism (71) raises the cleaning section (77) in the vertical direction (Z) from the standby port (47) at the standby position. The rotary elevating mechanism (71) swings the cleaning section (77) within the horizontal plane so that it passes near the rotation center (P1).

The support (73) has a cylindrical shape. The support (73) has a lower part connected to a rotary lifting mechanism (71). The support (73) has an upper part connected to one lower part of a housing (75). The housing (75) has a major axis within a horizontal plane. The housing (75) has a cleaning part (77) on the other lower part. The cleaning part (77) rotates around a rotation center (P5). The rotation center (P5) is in the vertical direction (Z).

The housing (75) has a lower housing (75a) and an upper housing (75b). The lower housing (75a) constitutes the lower part of the housing (75). The upper housing (75b) constitutes the upper part of the housing (75). The upper housing (75b) and the lower housing (75a) are connected to each other.

The housing (75) is equipped with a pressing mechanism (81) and a rotating mechanism (83). Specifically, the lower housing (75a) is equipped with a pressing mechanism (81) and a rotating mechanism (83).

The pressure mechanism (81) is equipped with a branch member (85), a seesaw member (87), a pressure actuator (89), and a support mechanism (91).

The pivot member (85) is mounted on the upper surface of the lower housing (75a). The pivot member (85) is installed so as to be erected at approximately the center of the lower housing (75a) in the front-back direction (X). The pivot member (85) has a pivot shaft (85a) on the upper portion. The pivot shaft (85a) is rotatable around the width direction (Y). The seesaw member (87) is pivotally mounted to the pivot member (85) via the pivot shaft (85a) at the center portion (87c). The seesaw member (87) can alternately be raised and lowered in the vertical direction (Z) at both ends on one side (87l) (working point) and the other side (87r) (reverse point). The seesaw member (87) has the pivot shaft (85a) as a pivot point.

The pressure actuator (89) has an operating shaft (89a) arranged in the vertical direction (Z). The pressure actuator (89) raises one side (87l) of the seesaw member (87) by extending the operating shaft (89a). The pressure actuator (89) is preferably an air bearing actuator, for example.

The air bearing actuator is supported by an operating shaft (89a) that can be moved forward and backward by air with a microscopic gap. Therefore, theoretically, the sliding resistance of the operating shaft (89a) becomes zero, and friction does not occur. Therefore, the air bearing actuator can move the operating shaft (89a) forward and backward even with a microscopic air pressure, compared to a normal air cylinder. Therefore, it is possible to move forward and backward linearly according to the air pressure. However, a normal air cylinder can also be used as the pressure actuator (89).

In the forward/backward direction (X), a support mechanism (91) is installed on the opposite side of the pressure actuator (89) with the support member (85) in between. The support mechanism (91) supports the cleaning unit (77). The support mechanism (91) suspends and supports the cleaning unit (77) below the housing (75).

The support mechanism (91) is equipped with a holding member (93), an elastic pressure member (95), and a guide member (97).

The support mechanism (91) supports the cleaning unit (77) in a suspended manner. The cleaning unit (77) is equipped with a brush (99) and a brush holder (101). The brush (99) acts on the substrate (W) to clean it. The brush holder (101) holds the brush (99). The brush holder (101) holds the brush (99) in a detachable manner. The brush holder (101) has a rotational shaft (103) mounted at the center when viewed from the plane. The rotational shaft (103) extends in the vertical direction (Z) from the brush holder (101).

The retaining member (93) freely maintains the rotational shaft (103). The rotational shaft (103) is configured as, for example, a spline shaft. The rotational shaft (103) is mounted to the retaining member (93) via a spline nut (103a). The rotational shaft (103) is movable in the vertical direction (Z) with respect to the spline nut (103a). The retaining member (93) maintains the spline nut (103a) in a state where it can rotate around the vertical direction (Z). The spline nut (103a) is mounted to the retaining member (93) via a bearing (not shown). The rotational shaft (103) is rotatable around the rotation center (P5). A pulley (105) is mounted on the spline nut (103a) protruding from the upper portion of the retaining member (93). The pulley (105) is fixed to the outer surface of the spline nut (103a). When the pulley (105) rotates, the spline nut (103a) rotates, and the rotation shaft (103) also rotates in the same direction.

An elastic pressure member (95) is arranged on the upper portion of the pulley (105). The elastic pressure member (95) is provided with an upper holding member (107), a lower holding member (109), and a coil spring (111). The upper holding member (107) is mounted on the upper side of the rotation shaft (103) via a bearing (not shown). In other words, the upper holding member (107) remains stationary even when the rotation shaft (103) rotates. The lower holding member (109) is arranged spaced apart from the upper holding member (107). The lower holding member (109) is arranged below the upper holding member (107) and above the pulley (105). The lower holding member (109) is arranged below the upper holding member (107) and above the pulley (105). The lower retaining member (109) is arranged with its inner surface spaced from the outer surface of the rotation shaft (103). Therefore, the lower retaining member (109) remains stationary even when the rotation shaft (103) rotates. In addition, the lower retaining member (109) is mounted on the upper surface of the pulley (105) via a bearing. Therefore, the lower retaining member (109) is not affected by the rotation of the pulley (105).

The coil spring (111) is mounted on the upper holding member (107) and the lower holding member (109). The upper end of the coil spring (111) is fixed to the upper holding member (107). The lower end of the coil spring (111) is fixed to the lower holding member (109). The coil spring (111) has, for example, a cylindrical shape. The coil spring (111) is a compression coil spring. Therefore, the upper holding member (107) is elastically pressed upward from the upper surface of the pulley (105) and the lower holding member (109). As a result, the rotation shaft (103) is elastically pressed upward in the vertical direction (Z). Therefore, in a normal state where the pressure actuator (89) is not operating, the brush (99) is maintained at a constant height from the lower surface of the lower housing (75a). In other words, in normal conditions, the load by the brush (99) is zero.

The support mechanism (91) supports a rotation shaft (103) that rises and falls in the vertical direction (Z). The support mechanism (91) has a linear guide (113) and a shaft holding member (115). The linear guide (113) is arranged adjacent to the holding member (93). The linear guide (113) is installed so as to be erected in the vertical direction (Z). The linear guide (113) has a rail (113a) and a carriage (113b). The rail (113a) is arranged longitudinally in the vertical direction (Z). The carriage (113b) is mounted on the rail (113a) so as to be movable in the vertical direction (Z). The carriage (113b) is arranged below the other side (87r) of the seesaw member (87). The carriage (113b) is positioned so that it comes into contact with the other side (87r) of the seesaw member (87) when it is lowered.

The shaft retainer (115) retains the upper portion of the rotation shaft (103). The shaft retainer (115) retains the rotation shaft (103) in a state in which the rotation shaft (103) is allowed to rotate. The shaft retainer (115) retains the rotation shaft (103) via, for example, a bearing (not shown). The carriage (113b) is connected to the shaft retainer (115). When the pressure actuator (89) raises the operating shaft (89a) with a driving force stronger than the elastic pressing force of the coil spring (111), one side (87l) (working point) rises. When one side (87l) rises, the other side (87r) (reverse point) lowers. At this time, the other side (87r) lowers the carriage (113b) together with the shaft retainer (115). Then, the rotation shaft (103) descends and the brush (99) moves downward from a predetermined position. When the pressure actuator (89) is driven in this way, pressure according to the driving force of the pressure actuator (89) is applied to the brush (99).

A rotating mechanism (83) is arranged adjacent to the support mechanism (91). The rotating mechanism (83) is arranged on the side of the support member (85). The rotating mechanism (83) has an installation member (117) and an electric motor (119). The installation member (117) is arranged so that the electric motor (119) is spaced upward from the bottom surface of the lower housing (75a). The electric motor (119) has a rotational axis arranged downward in the vertical direction (Z). The electric motor (119) rotates the rotational axis around the rotational center (P6). The rotational center (P6) is substantially parallel to the rotational center (P5) in the vertical direction (Z). The electric motor (119) has a pulley (121) mounted on the rotational axis. A timing belt (123) is stretched between the pulley (121) and the pulley (105). Accordingly, when the electric motor (119) rotates, the rotation shaft (103) rotates around the center of rotation (P5) through the timing belt (123), the pulleys (105, 121), and the spline nut (103a). Even if the rotation shaft (103) rotates in this way, the rotation shaft (103) can be raised and lowered in the vertical direction (Z).

As described above, the cleaning arm (45) is configured. That is, the operation of the pressure actuator (89) is applied to the other side (87r) (action point) through one side (87l) (reverse point) of the seesaw member (87). Therefore, by providing the seesaw member (87), the degree of freedom in the arrangement of the pressure actuator (89) can be increased. Accordingly, the height of the substrate processing device (1) can be suppressed. As a result, the arrangement in which the substrate processing devices (1) are stacked in multiple stages can be easily realized.

＜4-5. Control System＞

Referring here to Fig. 6, Fig. 6 is a block diagram showing the control system of the back cleaning unit.

The nozzle (63) described above is connected to one end of a pipe (125). The other end of the pipe (125) is connected to a rinse solution supply source (127). The rinse solution supply source (127) supplies the rinse solution described above. The pipe (125) is provided with a flow rate control valve (129). The flow rate control valve (129) controls the flow rate of the rinse solution in the pipe (125).

The nozzle (65) described above is connected to one end of a pipe (131). The other end of the pipe (131) is connected to a treatment liquid supply source (133). The treatment liquid supply source (133) supplies one of the various chemical liquids described above. The pipe (131) is equipped with a flow rate control valve (135). The flow rate control valve (135) controls the flow rate of the chemical liquid in the pipe (131).

The nozzle (67) described above is connected to one end of a pipe (137). The other end of the pipe (137) is connected to a treatment liquid supply source (139). The treatment liquid supply source (139) supplies one of the various chemical liquids described above. The pipe (137) is equipped with a flow rate control valve (141). The flow rate control valve (141) controls the flow rate of the chemical liquid in the pipe (139).

The nozzle (69) described above is connected to one end of a pipe (143). The other end of the pipe (143) is connected to a treatment liquid supply source (145). The treatment liquid supply source (145) supplies one of the various chemical liquids described above. The pipe (143) is equipped with a flow rate control valve (147). The flow rate control valve (147) controls the flow rate of the chemical liquid in the pipe (143).

In the above-described pressure actuator (89), one end of an air supply pipe (149) is connected to the pressure actuator. In addition, air is supplied to the pressure actuator (89) to support the operating shaft (89a) with a small gap, but this pipe, etc. are omitted. In the other end of the air supply pipe (149), an air supply source (151) is connected to the pressure actuator. The air supply source (151) supplies air, for example. The air is preferably dry air. The air supply source (151) is also connected to another device. The supply pressure of the air supply source (151) is affected by the operating status of the other device. That is, when the operating rate of the other device increases, the supply pressure may decrease. From the air supply source (151), in order, an on-off valve (153), a primary side pressure gauge (155), an electric regulator (157), and a secondary side pressure gauge (159) are provided.

The on-off valve (153) allows or blocks the flow of air in the air supply pipe (149). The primary pressure gauge (155) measures the pressure of air on the upstream side of the electropneumatic regulator (157). The electropneumatic regulator (157) adjusts the opening of the built-in valve according to an input signal. As a result, the electropneumatic regulator (157) adjusts the pressure of air in the air supply pipe (149). Specifically, the electropneumatic regulator (157) adjusts the valve opening according to a given input signal to reduce the primary pressure and make it the secondary pressure in the air supply pipe (149). The electropneumatic regulator (157) cannot adjust the secondary pressure to be higher than the primary pressure in the air supply pipe (149). The electropneumatic regulator (157) adjusts the secondary pressure to be lower than the primary pressure of the air supply pipe (149). The electric regulator (157) can adjust the secondary pressure within a range below a predetermined value when the primary pressure exceeds a predetermined value. In other words, when the primary pressure is below a predetermined value, the electric regulator (157) may not be able to accurately adjust the secondary pressure to a predetermined value or higher.

The control unit (161) comprehensively controls each of the above-described units. Specifically, the control unit (161) controls the return operation in the input unit (9) and the output unit (11), the return operation of the indexer robot (IR), the reversal operation of the first reversal unit (23) and the second reversal unit (29), the return operation of the center robot (CR), etc. The control unit (161) operates by controlling the rotation control of the electric motor (49) in the back cleaning unit (SSR) (processing unit (31)), the raising/lowering operation of the guard (39), the opening/closing operation of the support pin (55) in the spin chuck (53), the swinging operation of the electric motor (42, 44), the opening/closing operation of the flow control valve (129, 135, 141, 147), the swinging and rising/falling operation of the rotary lifting mechanism (71), the rotation operation of the electric motor (119), the opening/closing operation of the opening/closing valve (153), and the opening/closing operation of the pneumatic regulator (157).

The control unit (161) has a CPU and memory that are not shown. The control unit (161) is connected to a command unit (163). The command unit (163) is operated by an operator of the substrate processing device (1). The command unit (163) is used by the operator to command a recipe that stipulates the content of processing of the substrate (W), or the start or stop of processing, etc. The control unit (161) is connected to a notification unit (165). The notification unit (165) generates an alarm when a problem occurs in the substrate processing device (1) and notifies the operator of the occurrence of the problem. The notification unit (165) is, for example, a display device, a lamp, a buzzer, a speaker, or the like. It is preferable that the notification unit (165) be capable of confirming the type of problem that has occurred. The control unit (161) is equipped with an input port (IP). Data of various electronic devices is input into the input port (IP). Data input from the input port (IP) is processed or stored in the control unit (161).

The control unit (161) receives the measurement values of the primary side pressure gauge (155) and the secondary side pressure gauge (159). The control unit (161) provides an input signal for the opening operation of the valve of the electric regulator (157). The pressure applied to the substrate (W) by the brush (99) is determined according to this input signal.

In addition, the above-described back cleaning unit (SSR) (processing unit (31)) corresponds to the “substrate processing device” in the present invention.

＜5. Preprocessing in the processing unit＞

Referring to FIGS. 7 and 8, the preprocessing in the above-described back-side cleaning unit (SSR) will be described. FIG. 7 is a flowchart showing the preprocessing performed in advance. FIG. 8 (a) shows the relationship between the opening of the electro-pneumatic regulator and the load of the electronic balance, FIG. 8 (b) shows the relationship between the secondary side pressure of the electro-pneumatic regulator and the opening, and FIG. 8 (c) is a graph showing the relationship between the load of the pressure actuator and the secondary side pressure of the electro-pneumatic regulator.

An operator of a substrate processing device (1) operates a command unit (163) to command preprocessing for one backside cleaning unit (SSR).

Step S1

An electronic balance is placed. Specifically, an electronic balance, which is not shown, is placed on a rotating support member (37). The electronic balance is a device for measuring a load. It is preferable that the electronic balance has a data output terminal. The electronic balance has a data output terminal connected to an input port (IP). The electronic balance outputs a measured value from the data output terminal. The measured value is, for example, a load (g).

Step S2

Measure the load. Specifically, for example, the control unit (161) varies the input signal to the electropneumatic regulator (157) while the on-off valve (153) is open, and measures the load X(g) of the electronic balance for each input signal at that time. In addition, the operator may instruct the instruction unit (163) for several loads (target loads X(g)) that he/she actually wants to give to the brush (99) in processing, and vary the input signal to the electropneumatic regulator (157) so that the measured value of the electronic balance becomes each target load X(g), thereby obtaining an input signal corresponding to each target load X(g) at that time. At this time, the control unit (161) receives the secondary pressure, which is the measured value of the secondary pressure gauge (159) for each load.

Step S3

Memorize the corresponding relationship of the actual load. The control unit (161) obtains, by the measurement of step S2, the relationship between the opening (input signal) of the electropneumatic regulator (157) as in Fig. 8 (a) and the load of the electronic balance (target load X(g)), and the relationship between the secondary pressure and the opening of the electropneumatic regulator (157) as in Fig. 8 (b). The control unit (161) memorizes, in memory, the relationship between the load of the pressure actuator (89) as in Fig. 8 (c) and the secondary pressure of the electropneumatic regulator (157), along with the above relationship.

Step S4

The operator of the substrate processing device (1) operates the instruction unit (163) to instruct the end of the preprocessing for one back-side cleaning unit (SSR). The operator of the substrate processing device (1) removes the electronic balance from the rotation holding unit (37). If necessary, the same preprocessing is performed for other back-side cleaning units (SSR).

＜6. Cleaning treatment in the processing unit＞

Next, the cleaning process will be described with reference to Fig. 9. Fig. 9 is a flow chart showing the cleaning process.

Step S11

The operator instructs the start of processing. Specifically, he also instructs a recipe including a target load X(g). Then, the substrate (W) is returned from the indexer block (5) to the water supply unit (15), and the posture is changed so that the back side faces upward in the first inversion unit (23).

Step S12

The substrate (W) with its back side facing upward is returned to a back-side cleaning unit (SSR) by the center robot (CR). The back-side cleaning unit (SSR) starts the cleaning process. Specifically, the control unit (161) refers to the relationship ((c) of FIG. 8) acquired in advance and adjusts the input signal to the electropneumatic regulator (157) so that the secondary pressure of the secondary-side pressure gauge (159) becomes the secondary pressure Z (Pa) corresponding to the target load X (g). As a result, air is supplied from the electropneumatic regulator (157) to the pressure actuator (89), and cleaning is performed in a state where a load is applied to the substrate (W) from the brush (99) at the target load X (g). At this time, the first treatment liquid arm (41) swings, and pure water is supplied to the entire surface of the substrate (W) at a position where it does not interfere with the cleaning arm (45). At this time, the brush (99) acts on the back surface of the substrate (W) to perform a cleaning process. The control unit (161) operates the rotary lifting mechanism (71) to swing the cleaning arm (45) within the diameter of the substrate (W) so that the brush (99) passes the rotation center (P1) and is reversed on both end surfaces of the substrate (W).

In the above example, the input signal to the electric regulator (157) is adjusted according to the deviation of the secondary pressure so that the secondary pressure Z (Pa) corresponds to the target load X (g). That is, since feedback is performed, the stability and responsiveness of the pressure control of the brush (99) can be improved.

In addition, the above step S12 corresponds to the “process of applying pressure to the brush” in the present invention.

Step S13

It is determined whether the primary side pressure is below a predetermined value. The control unit (161) always monitors the measurement value of the primary side pressure gauge (155). The control unit (161) monitors the primary side pressure of the air supply pipe (149). If the primary side pressure exceeds the predetermined value, the control unit (161) moves the processing to step S14. In addition, step S13 is performed even during the processing of the next step S14. That is, the processing of step S13 is performed while the cleaning process by the brush (99) is being performed. Step S13 is performed at predetermined intervals during the cleaning process by interrupt processing.

In addition, the above step S13 corresponds to the “process of detecting primary side pressure” in the present invention.

Here, it is first explained assuming that the primary side pressure exceeds a specified value.

Step S14

The processing continues. After the supply of pure water for a predetermined time, the second processing liquid arm (43) is swung in place of the first processing liquid arm (41). As a result, the chemical liquid is supplied to the entire surface of the substrate (W) at a position where it does not interfere with the cleaning arm (45). At this time, the brush (99) is applied to the back surface of the substrate (W). After the supply of the chemical liquid for a predetermined time, the first processing liquid arm (41) is swung again in place of the second processing liquid arm (43), and the chemical liquid is replaced with pure water. At this time, the brush (99) is applied to the back surface of the substrate (W). Thereafter, the first processing liquid arm (41), the second processing liquid arm (43), and the cleaning arm (45) are moved to the standby position. Then, the control unit (161) dries the substrate (W). Specifically, the control unit (161) rotates the electric motor (49) at high speed to shake off the pure water attached to the substrate (W) and dry it.

Step S15

The processing is completed and the substrate (W) is removed. The control unit (161) lowers the guard (39) to the standby position. The center robot (CR) removes the substrate (W) that has completed the drying process from the back cleaning unit (SSR). The removed substrate (W) is inverted in the second inversion unit (29) to a posture in which the surface faces upward. The substrate (W) with the surface facing upward is removed to the removal unit (11) by the indexer robot (IR).

Step S16

The process moves to the processing of the next substrate (W). The control unit (161) performs a cleaning process on the next substrate (W) brought in by the center robot (CR). That is, the process returns to step S12.

In the step S13 described here, a description will be given of a case where the primary side pressure is below a predetermined value. That is, a description will be given of a processing example where the primary side pressure becomes below a predetermined value during processing of a substrate (W) by a brush (99).

Step S17

An alarm is generated. The control unit (161) operates the notification unit (165) to generate an alarm when the primary pressure is below a predetermined value. As a result, the operator of the substrate processing device (1) can know that processing is performed in a state where the load of the brush (99) in the back cleaning unit (SSR) is different from the target load.

If the primary pressure is below a predetermined value, there are cases where the secondary pressure cannot be adjusted to the secondary pressure Z (Pa) corresponding to the target load X (g) even if the input signal of the electric regulator (157) is manipulated. In other words, if the primary pressure is insufficient, the secondary pressure cannot be increased to the secondary pressure corresponding to the target load. Therefore, an alarm is issued.

In addition, the above step S17 corresponds to the “process of generating an alarm” in the present invention.

Step S18

The processing continues. The control unit (161) continues the processing without stopping it after generating an alarm. That is, as in the step S14 described above, the brush chemical cleaning by the brush (99) is performed while supplying the chemical solution, the brush pure water cleaning by the brush (99) is performed while supplying the pure water, and the shaking-off drying process is performed.

Step S19

As in step S15 described above, the processing is terminated and the substrate (W) is taken out.

Step S20

Processing is stopped. The control unit (161) stops the processing after the rough cleaning process for the substrate (W) is completed. In other words, the processing is not stopped during the cleaning process, but is stopped at the point when the processing for the substrate (W) is completed. This method of stopping is also called a cycle stop.

In step S13, if the primary side pressure is judged to be below the predetermined value, there is a high possibility that the cleaning process is being performed under a condition where the pressure does not reach the target load. However, instead of stopping immediately, the same process is performed on another substrate (W) processed with the pressure of the target load, and then the processing is stopped. As a result, the processing history with the other substrate (W) can be matched. In addition, since the process is stopped after going through a rinsing process or a drying process, the damage to the substrate (W) can be reduced compared to an immediate stop without going through these.

According to the present embodiment, the control unit (161) adjusts the pressure by manipulating the input signal to the pressure actuator (89), and acts on the upper surface of the substrate (W) by the pressure mechanism (81) to cause the brush (99) to act. Since the control unit (161) monitors the primary pressure gauge (155) and the secondary pressure gauge (159), it can determine that there is an abnormality in the primary pressure. Accordingly, the control unit (161) can determine that a situation has arisen in which the pressure of the brush (99) cannot be adjusted to a desired value. As a result, it is possible to prevent in advance the inappropriate cleaning treatment for a new substrate (W) from being continuously performed.

In this embodiment, in step S17, the control unit (161) issues an alarm if the primary side pressure is below a predetermined value. Accordingly, the operator of the substrate processing device (1) can take measures such as stopping the processing in step S17. As a result, it is possible to prevent in advance an inappropriate cleaning process for the substrate (W).

In this embodiment, the control unit (161) adjusts the load of the brush (99) by the relationship ((a) to (c) of FIG. 8) acquired in advance. In this way, based on the correspondence relationship of the actual load acquired in advance and the correspondence relationship between the opening degree of the electropneumatic regulator and the secondary pressure, the opening degree of the electropneumatic regulator (157) is obtained from the correspondence relationship between the target load and the actual load. The control unit (161) provides an input signal so that the secondary pressure gauge (159) becomes the secondary pressure corresponding to the opening degree, and adjusts the pressure of the brush (99) to the target load. In a state where the primary pressure is not lower than a predetermined value, the relationship between the opening degree of the electropneumatic regulator (157) and the secondary pressure is maintained. Therefore, when the input signal is adjusted so that the secondary pressure gauge (159) becomes the secondary pressure corresponding to the opening degree, the pressure becomes the target load. Therefore, cleaning treatment can be performed accurately with the pressure of the target load.

＜Variations＞

Referring to Fig. 10, a description will be given of a modified example of the present embodiment. Fig. 10 is a cross-sectional view of a cleaning arm according to a modified example. In addition, the same reference numerals are used for the same configuration as the cleaning arm (45) in the above-described embodiment, and a detailed description thereof is omitted.

The cleaning arm (45A) has a different configuration of the pressure mechanism (81A). Specifically, the pressure mechanism (81A) has a different configuration in that it is provided with a support member (171), a lower support roller (173), an upper support roller (175), a brush moving member (177), a rod (179), and an elevating member (181).

The support member (171) has a lower support roller (173) and an upper support roller (175). The support member (171) has the lower support roller (173) and the upper support roller (175) mounted on the side. The lower support roller (173) and the upper support roller (175) are mounted so as to be rotatable around the width direction (Y). The lower support roller (173) and the upper support roller (175) pinch the upper and lower surfaces of the brush moving member (177). The brush moving member (177) is elastically pressed by pressure at one end side and indirectly moves the brush (99) at the other end side. The brush moving member (177) has the lower support roller (173) and the upper support roller (175) in contact at its upper and lower surfaces. The brush moving member (177) is regulated in the vertical direction (Z) by the lower support roller (173) and the upper support roller (175). The brush moving member (177) is supported so as to be movable in the forward-backward direction (X) by the lower support roller (173) and the upper support roller (175).

The brush moving member (177) has a first inclined surface (177a) that is inclined at one end with respect to the longitudinal axis in the forward-backward direction (X). The brush moving member (177) has a second inclined surface (177b) that is inclined at the other end with respect to the longitudinal axis in the forward-backward direction (X). The first inclined surface (177a) and the second inclined surface (177b) have an inclination of about 45° with respect to the vertical direction (Z). The first inclined surface (177a) and the second inclined surface (177b) have inclined surfaces in opposite directions to each other. The first inclined surface (177a) is a downward inclined surface, and its surface descends from the front (X) toward the rear (X). The second inclined surface (177b) is a downward inclined surface, and its surface descends from the rear (X) toward the front (X).

The rod (179) is mounted on the operating shaft (89a) of the pressure actuator (89). The rod (179) is installed standing up on the upper portion of the operating shaft (89a). The rod (179) has a rod inclined surface (179a) at the upper end. The rod inclined surface (179a) has a tip end inclined with respect to the longitudinal axis of the rod (179). The rod inclined surface (179a) is parallel to the first inclined surface (177a). The rod inclined surface (179a) is formed at the same angle as the first inclined surface (177a).

The elevating member (181) is mounted on the carriage (113b) of the linear guide (113). The elevating member (181) is installed so as to stand on the upper part of the carriage (113b). The elevating member (181) extends in the vertical direction (Z). The elevating member (181) is connected to the carriage (113b), the shaft holding member (115), the rotation shaft (103), and the brush (99) via the brush holder (101). In other words, the elevating member (181) has the brush (99) mounted on the lower part. The elevating member (181) is arranged on the other end of the brush moving member (177). The elevating member (181) has an inclined surface (181a) formed on the upper part. The inclined surface (181a) faces forward (X). The inclined surface (181a) is parallel to the second inclined surface (177b). The inclined surface (181a) is formed at the same angle as the second inclined surface. The inclined surface (181a) is an upward inclined surface, and the surface goes down from the rear (X) to the front (X).

In addition, the above-described lifting member (181) corresponds to the “bracket” in the present invention. The above-described inclined surface (181a) corresponds to the “bracket inclined surface” in the present invention.

The cleaning arm (45A) of this configuration operates as follows. Refer to Fig. 11 here. Fig. 11 is a diagram explaining the operation of the cleaning arm according to a modified example.

The cleaning arm (45A) operates the pressure actuator (89) according to the pressure. For example, the load (179) rises by the rise of the operating shaft (89a). At this time, the load inclined surface (179a) rises and translates. Accordingly, the first inclined surface (177a) and the second inclined surface (177b) of the brush moving member (177) translate backward (X). That is, the first inclined surface (177a) and the second inclined surface (177b) move backward (X). In addition, the inclined surface (181) of the lifting member (181) translates in the vertical direction (Z) and descends. Therefore, the brush (99) descends according to the rise of the load (179). In addition, when the operating shaft (89a) is lowered, the load (179) is lowered, and the load slope (179a) is lowered and translated. Accordingly, the lifting member (181) is raised by the elastic pressure of the coil spring (111), and the slope (181a) is raised and translated. In addition, the first slope (177a) and the second slope (177b) of the brush moving member (177) are translated forward (X). Even with this configuration, the pressure of the brush (99) can be adjusted, similarly to the above-described embodiment.

In this modified example, since the brush moving member (177) is supported by the upper support roller (175) and the lower support roller (173), the dead weight of the brush moving member (177) is canceled when viewed from the pressure actuator (89). Accordingly, even when the rod (179) of the pressure actuator (89) moves slightly forward and backward, the brush moving member (177) can be moved according to the slight forward and backward movement. As a result, even when a slight pressure is applied, the pressure can be applied accurately.

The present invention is not limited to the above-mentioned embodiments, and can be implemented with modifications as follows.

(1) In the above-described embodiment, the backside cleaning unit (SSR) was used as an example as a substrate processing device. However, the present invention is not limited to the backside cleaning unit (SSR). For example, it can also be applied to a surface cleaning unit that cleans the surface of a substrate with a brush (99).

(2) In the above-described embodiment, the backside cleaning unit (SSR) (processing unit (31)) as a substrate processing device is described as an example of a configuration provided in a substrate processing device (1) equipped with a load/unload block (3) or an indexer block (5). However, the present invention is not limited to this configuration. For example, it may be configured with only the backside cleaning unit (SSR) (processing unit (31)).

(3) In the above-described embodiment, the cleaning arm (45) is not provided with a mechanism for detecting the load applied to the brush (99). However, the present invention is not limited to this configuration. For example, it may be configured to detect the force applied to the carriage (113b) by a load cell and detect the degree of agreement with the target load.

(4) In the above-described embodiment, when the primary pressure is below a predetermined value, an alarm is generated and a cycle is stopped. However, the present invention is not limited to this configuration. For example, a configuration may be adopted in which an alarm is generated and processing for the substrate (W) currently being processed is immediately stopped.

(5) In the above-described embodiment, based on the correspondence relationship of the measured load acquired in advance and the correspondence relationship between the opening degree of the electric regulator (157) and the secondary pressure, the input signal is applied to adjust the pressure of the brush (99) to the target load, the secondary pressure gauge (159) provides feedback so that the secondary pressure corresponds to the opening degree, and the input signal is adjusted to make the pressure the target load. However, the present invention does not require such feedback.

(6) In the above-described embodiment, the back cleaning unit (SSR) is provided with a first treatment liquid arm (41) or a second treatment liquid arm (43) in addition to the cleaning arm (45). However, the present invention does not require these. For example, the first treatment liquid arm (41) or the second treatment liquid arm (43) may be omitted, and a configuration may be provided in which a treatment liquid supply system is provided to the cleaning arm (45).

(7) In the above-described embodiment and modified examples, the cleaning arm (45) is provided with a seesaw member (87) or a brush moving member (177), and a configuration is adopted in which the power point and the action point are spaced apart in the forward-backward direction (X). However, the present invention is not limited to this configuration. That is, a configuration in which the power point and the action point are provided at almost the same position in the forward-backward direction (X) may be adopted.

1: Substrate processing device 3: Loading/unloading block
5: Indexer block 7: Processing block
W: substrate C: carrier
IR: Indexer Robot 15: Capital
23: 1st inversion unit 25, 27: Pass section
29: Second Inversion Unit 31: Processing Unit
SSR: Back Cleaning Unit CR: Center Robot
37: Rotation retainer 39: Guard
41: First treatment liquid arm 42: Electric motor
43: Second treatment arm 45: Washing arm
47: Standby port 53: Spin chuck
71: Rotating lifting mechanism 75: Housing
77: Washing machine 81: Pressure mechanism
83: Rotating mechanism 85: Branch absence
87: Absence of seesaw 87c: Central part
87l: one side 87r: the other side
89: Actuator for pressure 91: Support mechanism
93: Absence of maintenance 95: Elastic pressurized part
97: Guide section 99: Brush
101: Brush holder 103: Rotating shaft
111: Coil spring 113: Linear guide
149: Air supply pipe 151: Air supply source
155: Primary pressure gauge 157: Electric regulator
159: Secondary side pressure gauge 161: Control unit
163: Instructions 165: Notifications

Claims (8)

In a substrate treatment device that performs a cleaning process by applying a brush to the substrate,
In addition to maintaining the substrate in a horizontal position, a rotation support unit that rotates the substrate,
A brush acting on the upper surface of the substrate maintained on the above rotating support member,
A pressure mechanism that elastically presses the brush toward the substrate by supplying air,
An air supply pipe having one end connected to an air supply source and the other end connected to the pressurizing mechanism,
An electro-pneumatic regulator that adjusts the pressure of air in the air supply pipe by adjusting the opening according to the input signal,
Among the above air supply pipes, a primary side pressure gauge is placed between the air supply source and the electropneumatic regulator, and detects the pressure on the primary side of the electropneumatic regulator as the primary side pressure;
Among the above air supply pipes, a secondary pressure gauge is placed between the electric regulator and the pressurizing mechanism, and detects the pressure on the secondary side of the electric regulator as the secondary pressure;
In addition to manipulating the above input signal, a control unit that monitors the primary side pressure gauge and the secondary side pressure gauge
Equipped with,
The above control unit determines that there is an abnormality in the primary pressure by monitoring the primary pressure gauge and the secondary pressure gauge.
The above control unit generates an alarm when the primary pressure is below a predetermined value.
The above control unit stops the processing when the cleaning process for the substrate maintained in the rotating maintenance unit is completed when the primary side pressure is below a predetermined value.
A rinse solution discharge unit that discharges rinse solution onto the upper surface of the substrate maintained by the above-mentioned rotating maintenance unit,
Further provided is a rinse solution supply unit for supplying the rinse solution to the rinse solution discharge unit.
The above control unit controls the rinse solution supply unit, the pressure mechanism, and the rotation maintenance unit to perform brush cleaning processing by discharging the rinse solution onto the substrate and performing processing using the brush, and then performing a shaking-off drying process, and then stopping the processing, when the primary side pressure is below a predetermined value. A substrate processing device. In claim 1,
The above control unit, in a state where an electronic balance is placed at a position where a substrate is placed in the rotation holding unit, adjusts the input signal so that the secondary side pressure gauge becomes the secondary side pressure corresponding to the opening degree of the electropneumatic regulator, based on a correspondence between the opening degree of the electropneumatic regulator acquired in advance and the actual load of the measured value of the electronic balance, and a correspondence relationship between the opening degree of the electropneumatic regulator and the secondary side pressure, and adjusts the pressure of the brush to the target load. In claim 1 or claim 2,
The above pressure mechanism is,
A seesaw member configured to be swayable with a support member as a support member, having a pivot member on one side of the support member and an action member on the other side of the support member,
A substrate processing device characterized by having a pressure actuator that applies a driving force based on air to the above-mentioned pivot point to vibrate the seesaw member around the above-mentioned pivot point, thereby applying pressure to press the brush against the upper surface of the substrate. In a substrate treatment device that performs a cleaning process by applying a brush to the substrate,
In addition to maintaining the substrate in a horizontal position, a rotation support unit that rotates the substrate,
A brush acting on the upper surface of the substrate maintained on the above rotating support member,
A pressure mechanism that elastically presses the brush toward the substrate by supplying air,
An air supply pipe having one end connected to an air supply source and the other end connected to the pressurizing mechanism,
An electric regulator that adjusts the pressure of air in the air supply pipe by adjusting the opening according to the input signal,
Among the above air supply pipes, a primary side pressure gauge is placed between the air supply source and the electropneumatic regulator, and detects the pressure on the primary side of the electropneumatic regulator as the primary side pressure;
Among the above air supply pipes, a secondary pressure gauge is placed between the electric regulator and the pressurizing mechanism, and detects the pressure on the secondary side of the electric regulator as the secondary pressure;
In addition to manipulating the above input signal, a control unit that monitors the primary side pressure gauge and the secondary side pressure gauge
Equipped with,
The above pressure mechanism is,
A brush moving member that is elastically pressurized by pressure at one end and moves the brush at the other end,
A support member that supports the upper and lower surfaces of the above brush moving member and allows movement in the longitudinal direction,
The above brush is mounted at the bottom, and a bracket is placed at the other end of the brush moving member,
A pressure actuator having a rod that advances and retreats by supplying air according to pressure, and moving the brush moving member by bringing the tip end of the rod into contact with one end of the brush moving member
Equipped with,
The above load has a rod slope that is inclined with respect to the longitudinal axis of the tip portion,
The brush moving member has a first inclined surface inclined along the load slope at one end and inclined relative to the longitudinal axis, and a second inclined surface inclined relative to the longitudinal axis at the other end.
The above bracket has a bracket slope that is inclined along the second slope at the upper end,
A substrate processing device characterized in that the brush moving member advances and retreats in the longitudinal direction according to the advance and retreat of the load. delete delete delete delete