KR102814018B1 - 조성물 - Google Patents
조성물 Download PDFInfo
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- KR102814018B1 KR102814018B1 KR1020217022856A KR20217022856A KR102814018B1 KR 102814018 B1 KR102814018 B1 KR 102814018B1 KR 1020217022856 A KR1020217022856 A KR 1020217022856A KR 20217022856 A KR20217022856 A KR 20217022856A KR 102814018 B1 KR102814018 B1 KR 102814018B1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Confectionery (AREA)
Abstract
Description
Claims (17)
- (A) 양이온 중합성 화합물과, (B) 광양이온 중합 개시제와, (C1) 인산 에스테르를 함유하고,
(A) 양이온 중합성 화합물이 (A-1) 에폭시기를 갖는 지환식 화합물 및 (A-2) 에폭시기를 갖는 방향족 화합물을 함유하며,
(A-2) 에폭시기를 갖는 방향족 화합물이 (A-2-1) 비스페놀 A형 에폭시 수지 및 (A-2-2) 비스페놀 F형 에폭시 수지를 함유하고,
(A-2-1) 비스페놀 A형 에폭시 수지의 함유량(A1)과 (A-2-2) 비스페놀 F형 에폭시 수지의 함유량(A2)의 비(A1/A2(질량비))가 0.2~5인 조성물. - 청구항 1에 있어서,
(C1) 인산 에스테르가 식(C1-1)으로 나타나는 화합물, 식(C1-2)으로 나타나는 화합물 및 식(C1-3)으로 나타나는 화합물로 이루어지는 군에서 선택되는 적어도 1종을 함유하는 조성물.
[화학식 1]
[화학식 2]
[화학식 3]
[식 중, R1, R2, R3, R4, R5 및 R6은 각각 독립적으로 치환기를 가지고 있어도 되는 탄화수소기를 나타낸다.] - 청구항 1 또는 청구항 2에 있어서,
(C1) 인산 에스테르의 사용량이 (A) 양이온 중합성 화합물 100질량부에 대해 0.1~5질량부인 조성물. - 청구항 1 또는 청구항 2에 있어서,
(B) 광양이온 중합 개시제가 오늄염인 조성물. - 청구항 1 또는 청구항 2에 있어서,
(B) 광양이온 중합 개시제의 함유량이 (A) 양이온 중합성 화합물 100질량부에 대해 0.05~5.0질량부인 조성물. - 청구항 1 또는 청구항 2에 있어서,
광 증감제를 더 함유하는 조성물. - 청구항 1 또는 청구항 2에 있어서,
실란 커플링제를 더 함유하는 조성물. - 청구항 1 또는 청구항 2에 기재된 조성물을 포함하는 유기 일렉트로 루미네센스 소자용 봉지제.
- 청구항 1 또는 청구항 2에 기재된 조성물의 경화체.
- 청구항 9에 기재된 경화체를 포함하는 유기 일렉트로 루미네센스 소자용 봉지재.
- 유기 일렉트로 루미네센스 소자와,
청구항 10에 기재된 유기 일렉트로 루미네센스 소자용 봉지재를 포함하는 유기 일렉트로 루미네센스 표시 장치. - 제1 부재에 청구항 1 또는 청구항 2에 기재된 조성물을 부착시키는 부착 공정과,
부착시킨 상기 조성물에 광을 조사하는 조사 공정과,
광 조사된 상기 조성물을 통해 상기 제1 부재와 제2 부재를 맞추어붙이는 첩합 공정을 갖는 유기 일렉트로 루미네센스 표시 장치의 제조 방법. - 청구항 12에 있어서,
상기 제1 부재가 기판이며,
상기 제2 부재가 유기 일렉트로 루미네센스 소자인 유기 일렉트로 루미네센스 표시 장치의 제조 방법. - (A) 양이온 중합성 화합물과, (B) 광양이온 중합 개시제와, (C1) 인산 에스테르를 함유하고,
(A) 양이온 중합성 화합물이 (A-1) 에폭시기를 갖는 지환식 화합물 및 (A-2) 에폭시기를 갖는 방향족 화합물을 함유하며,
(A-2) 에폭시기를 갖는 방향족 화합물이 비스페놀 구조를 갖는 방향족 에폭시 화합물을 함유하고,
광 조사 전의 점도를 V0, 파장 365nm, 100mW/㎠의 자외선을 30초간 조사한 후의 점도를 Vν로 하였을 때 식: Vν/V0에 따라 구한 광 조사 후의 점도 변화율이 10 이하이며,
온도 85℃, 상대 습도 85질량%의 조건하에서 1000시간 폭로한 후 6V의 전압을 10초간 인가한 후에서의 고온 고습도 조건하의 다크 스폿의 직경이 150μm 이하인 조성물.
- 삭제
- 삭제
- 삭제
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019028989 | 2019-02-21 | ||
| JPJP-P-2019-028989 | 2019-02-21 | ||
| PCT/JP2020/006922 WO2020171186A1 (ja) | 2019-02-21 | 2020-02-20 | 組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210132001A KR20210132001A (ko) | 2021-11-03 |
| KR102814018B1 true KR102814018B1 (ko) | 2025-05-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217022856A Active KR102814018B1 (ko) | 2019-02-21 | 2020-02-20 | 조성물 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7220277B2 (ko) |
| KR (1) | KR102814018B1 (ko) |
| CN (1) | CN113272383B (ko) |
| TW (1) | TWI822961B (ko) |
| WO (1) | WO2020171186A1 (ko) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7270635B2 (ja) * | 2018-09-26 | 2023-05-10 | デンカ株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤 |
| WO2020171186A1 (ja) * | 2019-02-21 | 2020-08-27 | デンカ株式会社 | 組成物 |
| JP7755938B2 (ja) * | 2021-03-31 | 2025-10-17 | 株式会社Adeka | 重合性組成物 |
| KR20230048965A (ko) | 2021-10-05 | 2023-04-12 | 주식회사 엘지에너지솔루션 | 이차전지 트레이 |
| DE102022102650A1 (de) | 2022-02-04 | 2023-08-10 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Kationisch polymerisierbare flammgeschützte Massen |
| WO2024095948A1 (ja) * | 2022-11-04 | 2024-05-10 | デンカ株式会社 | 封止剤、硬化体、表示装置、表示装置の製造方法、太陽電池および組成物 |
| WO2024172143A1 (ja) | 2023-02-15 | 2024-08-22 | 味の素株式会社 | 改質された蛋白質含有食品の製造方法 |
| WO2024195590A1 (ja) | 2023-03-17 | 2024-09-26 | デンカ株式会社 | 組成物、硬化体、表示装置及び表示装置の製造方法 |
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2020
- 2020-02-20 WO PCT/JP2020/006922 patent/WO2020171186A1/ja not_active Ceased
- 2020-02-20 KR KR1020217022856A patent/KR102814018B1/ko active Active
- 2020-02-20 JP JP2021502156A patent/JP7220277B2/ja active Active
- 2020-02-20 CN CN202080007212.6A patent/CN113272383B/zh active Active
- 2020-02-21 TW TW109105654A patent/TWI822961B/zh active
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- 2022-11-04 JP JP2022177100A patent/JP7397151B2/ja active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2012116935A (ja) * | 2010-11-30 | 2012-06-21 | Daicel Corp | 硬化性エポキシ樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2020171186A1 (ja) | 2021-12-23 |
| KR20210132001A (ko) | 2021-11-03 |
| JP2023022040A (ja) | 2023-02-14 |
| WO2020171186A1 (ja) | 2020-08-27 |
| TW202045613A (zh) | 2020-12-16 |
| JP7397151B2 (ja) | 2023-12-12 |
| CN113272383A (zh) | 2021-08-17 |
| TWI822961B (zh) | 2023-11-21 |
| JP7220277B2 (ja) | 2023-02-09 |
| CN113272383B (zh) | 2023-11-17 |
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