KR102745939B1 - Cantilever-type probe pin having a multi-layered structure, method for manufacturing the same - Google Patents

Abstract

A cantilever type probe pin having a multilayer structure, comprising: a tip portion that contacts a subject to be inspected; a body portion that extends from the tip portion; a beam portion that extends from the body portion and is formed to be elastically deformable; and a lower portion that extends from the beam portion and is connected to the probe card, wherein the body portion, the beam portion, and the lower portion are formed of at least two or more different metal layers, and the tip portion includes a probe tip that directly contacts the subject to be inspected; and a first metal layer and a second metal layer that are formed to contact a portion of the probe tip, wherein the first metal layer and the second metal layer are characterized in that they are made of different metals.

Description

{CANTILEVER-TYPE PROBE PIN HAVING A MULTI-LAYERED STRUCTURE, METHOD FOR MANUFACTURING THE SAME}

The present invention relates to a cantilever type probe pin having a multilayer structure mounted on a probe card and a method for manufacturing the same.

A probe card is a device that connects a semiconductor chip (subject under test) to a test device in order to test the operation of the semiconductor. The probe pins mounted on the probe card send electricity when they come into contact with the wafer, and defective semiconductor chips are selected based on the signal that comes back.

As the size of semiconductor devices has recently become smaller, the size of semiconductor chip pads and the spacing between pads (pitch) have also become smaller, and the size of probe pins formed on probe cards has also decreased. For example, to secure space between probe pins, the thickness of the probe pins can be made thinner or the length of the probe pins can be reduced.

However, if the thickness or length of the probe pin is reduced, the rigidity and electrical properties of the probe pin are weakened. To compensate for this, materials with high electrical conductivity (e.g., silver and copper) can be applied, but there is a problem that the properties of materials with high electrical conductivity do not match the properties required for the probe pin, such as high yield strength.

Korean Registration No. 10-2098654 (registered on April 2, 2020) Korean Registration No. 10-2086390 (Registered on March 3, 2020)

The present invention is intended to solve the problems of the above-mentioned prior art, and to provide a multilayered cantilever type probe pin capable of implementing the minimum pitch required for the probe pin while simultaneously supplementing rigidity and electrical characteristics, and a method for manufacturing the same.

However, the technical tasks that this embodiment seeks to accomplish are not limited to the technical tasks described above, and other technical tasks may exist.

As a means for achieving the above-described technical problem, one embodiment of the present invention can provide a probe pin of a cantilever type having a multilayer structure, comprising: a tip portion that contacts a subject to be inspected; a body portion that extends from the tip portion; a beam portion that extends from the body portion and is formed to be elastically deformable; and a lower portion that extends from the beam portion and is connected to the probe card, wherein the body portion, the beam portion, and the lower portion are formed of at least two or more different metal layers, and the tip portion includes a probe tip that directly contacts the subject to be inspected; and a first metal layer and a second metal layer that are formed to contact a portion of the probe tip, wherein the first metal layer and the second metal layer are characterized in that they are made of different metals.

Another embodiment of the present invention provides a method for manufacturing a cantilever type probe pin having a multilayer structure, the method comprising: forming a seed layer on a substrate having an inclined surface; depositing a metal layer on an area including the inclined surface on the seed layer to form a probe tip; forming a first metal layer on the seed layer, the first metal layer contacting at least a portion of both side surfaces of the probe tip; and forming a second metal layer on a portion of the probe tip and the first metal layer, wherein the first metal layer and the second metal layer are made of different metals.

The above-described problem solving means are merely exemplary and should not be construed as limiting the present invention. In addition to the above-described exemplary embodiments, there may be additional embodiments described in the drawings and detailed description of the invention.

According to any one of the problem solving means of the present invention described above, a cantilever type probe pin having a multilayer structure formed by laminating a metal layer of a material capable of complementing the electrical characteristics of a probe pin implementing a minimum pitch and a metal layer of a material capable of implementing a yield strength required for the probe pin, and a method for manufacturing the same can be provided.

Accordingly, it is possible to provide a multilayer structured cantilever type probe pin and a method for manufacturing the same that can satisfy rigidity and electrical characteristics while implementing the minimum pitch required for recent probe pins.

Figure 1 is a perspective view of a cantilever type probe pin having a multilayer structure.
Figure 2 is an exploded view that enlarges the portion circled in Figure 1.
Figure 3 is a flow chart of a method for manufacturing a cantilever type probe pin having a multilayer structure.
Figure 4 is an exemplary drawing for sequentially explaining each step according to the manufacturing method of Figure 3.
Figure 5 is a plan view from above of the tip including the probe tip according to the order of Figure 4.

Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily practice the present invention. However, the present invention may be implemented in various different forms and is not limited to the embodiments described herein. In addition, in order to clearly describe the present invention in the drawings, parts that are not related to the description are omitted, and similar parts are assigned similar drawing reference numerals throughout the specification.

Throughout the specification, when a part is said to "include" a component, this does not mean excluding other components, but rather including other components, unless otherwise specifically stated. In addition, throughout the specification, when a part is said to be "connected" to another part, this includes not only cases where they are directly connected, but also cases where they are connected through other components in between, and cases where other elements are electrically connected in between. Furthermore, throughout the specification, when a part is said to be "on" another part, this includes not only cases where a part is in contact with another part, but also cases where another part exists between the two parts. In addition, expressions such as "first," "second," etc. used herein can modify various components, regardless of order and/or importance, and are only used to distinguish one component from another component, and do not limit the components, and do not necessarily mean other components. For example, "first direction" and "second direction" may mean the same direction or different directions.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the attached drawings.

Fig. 1 is a perspective view of a cantilever type probe pin having a multilayer structure, and Fig. 2 is an exploded view showing an enlarged portion of a portion indicated by a circle in Fig. 1. Referring to Fig. 1, the probe pin (100) may be composed of a tip portion (110), a body portion (120), a beam portion (130), and a lower portion (140). In addition, the probe pin (100) may further include a grip portion (150). However, the above components (110 to 150) are only illustrative.

The probe pin (100) may be a cantilever type probe pin. Here, a cantilever is a probe in which one end is fixed and the other end is not fixed and can move. In other words, the cantilever type probe pin means a probe pin to which a force is applied in a direction perpendicular to the length direction of both ends. The cantilever type probe pin (100) is a type that contacts a pad of a test object to apply pressure and has elasticity that can be restored to its original state when removed from the contact state, and has the advantage of relatively low manufacturing cost compared to a vertical or MEMS type probe pin.

The tip (110) may include a probe tip (111) that directly contacts the test subject. The probe tip (111) is a connection portion between the chip circuit that penetrates the pad of the test subject and the probe card, and may directly contact the pad of the test subject. The probe tip (111) may receive an electric signal from the test subject and transmit it to the probe card. For example, the probe tip (111) may be formed to protrude from the end of the tip (110) and contact the test subject. The probe tip (111) may mean a metal layer made of a platinum group metal at the tip (110). As an example, the probe tip (111) may be provided in a shape including a first surface (111a), a second surface (111b), and a third surface (111c), as illustrated in FIG. 2. The body portion (120) may be formed to extend from the tip portion (110), and the beam portion (130) may be formed to extend from the body portion (120). For example, the beam portion (130) may be formed to extend in a direction intersecting one direction, and have both ends connected to the body portion (120) and the lower portion (140), respectively. The beam portion (130) may be formed to be elastically deformable.

The lower portion (140) may be formed to extend from the beam portion (130). The lower portion (140) may be formed to extend in one direction and may be connected to a probe card.

Meanwhile, the probe pin (100) may further include a grip portion (150). The grip portion (150) is a region corresponding to a gripper, and the gripper is configured to support the grip portion (150) during the process of assembling the probe pin (100). For example, when assembling a probe card such as forming an array with a plurality of probe pins (100), the probe pin (100) can be handled using the gripper.

The body portion (120), beam portion (130), and lower portion (140) may be formed of at least two different metal layers. The grip portion (150) may also be formed of different metal layers.

The probe pin (100) according to the present invention can be formed by laminating a plurality of metal layers of different materials. Through this, the reduction in rigidity of the probe pin implementing the minimum pitch can be minimized, and the electrical characteristics can be formed to be strong.

Referring to FIG. 2, the probe tip (111) may be composed of a first surface (111a), a second surface (111b), and a third surface (111c). Specifically, the first surface (111a) may be in direct contact with a test object, and the second surface (111b) formed to extend from an end of the first surface (111a) may form a predetermined angle with the first surface (111a). In addition, the third surface (111c) formed to extend from an end of the second surface (111b) may form a predetermined angle with the second surface (111b). Here, the predetermined angle may be 90° or more and 180° or less.

In addition, the probe tip (111) may further include an opening (111d) formed penetrating the central region of the probe tip (111). For example, a rectangular opening (111d) may be formed in the central region of the probe tip (111). The shape of the opening (111d) is not limited to the present embodiment.

The opening (111d) can be filled with a second metal layer (113) having high electrical conductivity. Through this, the contact area between the probe tip (111) and the second metal layer (113) can be increased, thereby improving the electrical properties of the probe pin (100). In addition, the consumption of expensive platinum group metal used to manufacture the probe tip (111) can be saved.

These probe tips (111) are parts that come into direct contact with the subject of examination, and the spacing between adjacent probe tips (111) can be arranged to correspond to the pitch of the subject of examination. For example, a plurality of probe tips (111) can be arranged in parallel to correspond to the pitch of the subject of examination.

The spacing between probe tips (111) is required to be finely arranged due to miniaturization of semiconductor devices. However, if the thickness of the probe pins (100) is made thin to implement the minimum pitch between the probe pins (100), there is a problem that the electrical characteristics and rigidity required for the probe pins (100) are also weakened.

Accordingly, the probe pin (100) according to the present invention can complement the electrical characteristics and rigidity required for the probe pin (100) by laminating multiple metal layers of materials having different characteristics.

The tip (110) may include a first metal layer (112) and a second metal layer (113) formed to be in contact with at least a portion of the probe tip (111). Here, the first metal layer (112) and the second metal layer (113) may be made of different metals. The first metal layer (112) may include Ni, NiCo, or NiB, and the second metal layer (113) may include Ag or Cu.

As illustrated in FIG. 2, the first metal layer (112) may be formed to contact some areas of both side surfaces of the probe tip (111). Accordingly, some areas of the probe tip (111) in the probe pin (110) according to one embodiment of the present invention may be provided with a single metal layer. For example, the first metal layer (112) of a hard material may be formed to surround both side surfaces of the probe tip (111), thereby improving the rigidity of the probe tip (111).

The second metal layer (113) may be formed to contact at least a portion of the upper surface of the probe tip (111) and may include a region formed to fill the internal space of the opening (111d). For example, the second metal layer (113) of a material having high electrical conductivity may be formed to be directly connected to the upper surface of the probe tip (111) to minimize resistance between metals. In addition, the second metal layer (113) may fill the internal space of the opening (111d) formed in the central region of the probe tip (111) to improve the electrical characteristics of the probe pin (110).

Additionally, the tip portion (110) may further include a third metal layer (114) on at least a portion of the second metal layer (113). Here, the second metal layer (113) and the third metal layer (114) may also be made of different metals. The second metal layer (113) may include Ag or Cu, and the third metal layer (112) may include Ni, NiCo, or NiB.

By arranging a second metal layer (113) having high electrical conductivity between a first metal layer (112) and a third metal layer (114) having relatively high rigidity, the probe pin (100) can minimize deformation due to differences in properties (e.g., thermal expansion coefficient and yield strength) of different metals, and prevent breakage.

FIG. 3 is a flow chart of a method for manufacturing a cantilever type probe pin having a multilayer structure, FIG. 4 is an exemplary drawing for sequentially explaining each step according to the manufacturing method of FIG. 3, and FIG. 5 is a plan view of a tip end including a probe tip according to the sequence of FIG. 4 as viewed from above.

The method for manufacturing a cantilever type probe pin having a multilayer structure illustrated in FIG. 3 includes steps that are processed in time series according to the embodiments illustrated in FIGS. 1 and 2. Therefore, even if the content is omitted below, it is also applied to the method for manufacturing a probe pin having a multilayer structure according to the embodiments illustrated in FIGS. 1 and 2.

Referring to (a) of FIG. 3 and FIG. 4, in step S310, a method for manufacturing a probe pin can form a seed layer (10) on a substrate (S) having an inclined surface. For example, the substrate (S) is a silicon wafer, and wet etching using an anisotropic etching solution (e.g., KOH) can be performed to provide a form including an inclined surface.

Thereafter, the probe pin manufacturing method can form a first photoresist layer (R1) patterned to correspond to the shape of the probe tip (111) on the substrate (S).

Referring to FIG. 3 and FIG. 4 (a), in step S320, the probe pin manufacturing method can form a probe tip (111) by depositing a metal layer on an area including an inclined surface on the seed layer (11). For example, the probe pin manufacturing method can form a probe tip (111) by a patterned first photoresist layer (R1).

The step of forming a probe tip (S320) may further include a step of forming an opening (111d) in the central area of the probe tip (111).

Referring to (a) of Fig. 5, for example, a method for manufacturing a probe pin can form a rectangular opening (111d) in the center area of a probe tip (111). The shape of the opening (111d) can be designed in various shapes.

The opening (111d) can be filled with a second metal layer (113) having high electrical conductivity, thereby improving the electrical characteristics of the probe pin (100).

Referring to FIGS. 3 and 4 (b), in step S330, the probe pin manufacturing method can form a first metal layer (112) that contacts at least a portion of both side surfaces of the probe tip (111) on the seed layer (10). As an example, the first metal layer (112) can be formed to contact both side surfaces of the second side (111b) and the third side (111c) excluding the first side (111a) illustrated in FIG. 2.

Step S330 of forming the first metal layer (112) can form a second photoresist layer (R2) patterned to correspond to the shape of the first metal layer (112) again. The probe pin manufacturing method can form the first metal layer (112) by the patterned second photoresist layer (R2).

Here, the thickness (B) of the first metal layer (112) can be designed to be thicker than the thickness (A) of the probe tip (111). That is, the first metal layer (112) is formed to have a thickness greater than that of the probe tip (111) that directly contacts the test object, thereby supplementing the rigidity of the probe pin (100).

Referring to (b) of FIG. 5, the first metal layer (112) may be formed on some areas of both side surfaces of the probe tip (111). The first metal layer (112) having a strong rigidity may be designed to surround both side surfaces of the probe tip (111) to supplement the yield strength of the probe tip (111). For example, the first metal layer (112) may include Ni, NiCo, or NiB, which are strong and have a strong rigidity.

Referring to FIGS. 3 and 4 (c), in step S340, the probe pin manufacturing method can form a second metal layer (113) on a portion of the probe tip (111) and the first metal layer (112).

For example, in the probe pin manufacturing method, when the first metal layer (112) is formed, a third photoresist layer (R3) patterned to correspond to the shape of the second metal layer (113) can be formed again. The probe pin manufacturing method can form a second metal layer (113) with high electrical conductivity by the patterned third photoresist layer (R3).

Referring to (c) of Fig. 5, a second metal layer (113) having high electrical conductivity can be formed to be directly connected to the upper surface of the probe tip (111) to complement the electrical characteristics of the probe pin (100). For example, the second metal layer (113) can include Ag or Cu having excellent electrical conductivity.

In this way, the first metal layer (112) and the second metal layer (113) may be metals of materials having different characteristics. The first metal layer (112) having high rigidity as a characteristic can supplement the rigidity and yield strength of the probe pin (100), and the second metal layer (113) having high electrical conductivity can supplement the electrical characteristics of the probe pin (100).

Referring to (d) of FIG. 3 and FIG. 4, in step S350, the probe pin manufacturing method can form a third metal layer (114) on at least a portion of the second metal layer (113).

For example, the probe pin manufacturing method can form a fourth photoresist layer (R4) patterned to correspond to the shape of the third metal layer (114) when the second metal layer (113) is formed. The probe pin manufacturing method can form the third metal layer (114) by the patterned fourth photoresist layer (R4).

Referring to (d) of Fig. 5, the third metal layer (114) is directly connected to the tip portion (110) and the second metal layer (113) having high electrical conductivity, so that the high yield strength required for the probe pin (100) can be implemented. For example, the third metal layer (114) may include Ni, NiCo, or NiB, which are hard and have rigidity.

Here, the third metal layer (114) may be made of a different metal from the second metal layer (113). The third metal layer (114) is a metal layer having a strong rigidity like the first metal layer (112) and may supplement the rigidity of the probe pin (100).

Referring to (e) of FIG. 4, thereafter, the method for manufacturing a probe pin can complete the manufacturing of a tip portion (110) by polishing the first metal layer (112), the second metal layer (113), and the third metal layer (114) based on the upper surface of the probe tip (111).

The shape of the tip (110) after manufacturing is completed is as shown in (e) of Fig. 5. Referring to (e) of Fig. 5, the tip (110) may have a first metal layer (112) formed to surround both sides of one surface of the probe tip (111) that comes into contact with the test object, a second metal layer (113) may be laminated on the center and opening (111d) of the probe tip (111), and a third metal layer (114) may be laminated on the other surface of the probe tip (111).

Specifically, the first metal layer (112) and the third metal layer (114) having high rigidity are formed to surround both sides of the probe tip (111) or are formed to be directly connected to the second metal layer (113), thereby compensating for the decrease in rigidity of the probe pin (100) implementing the minimum pitch while implementing high yield strength. In addition, the second metal layer (113) is formed to be connected to the upper surface of the probe tip (111) and fill the opening (111d), thereby further improving the electrical characteristics of the probe pin (100).

In the above description, steps S310 to S350 may be further divided into additional steps or combined into fewer steps, depending on the implementation example of the present invention. In addition, some steps may be omitted as needed, and the order between the steps may be switched.

The above description of the present invention is for illustrative purposes, and those skilled in the art will understand that the present invention can be easily modified into other specific forms without changing the technical idea or essential characteristics of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single component may be implemented in a distributed manner, and likewise, components described as distributed may be implemented in a combined form.

The scope of the present invention is indicated by the claims described below rather than the detailed description above, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention.

100: Probe pin
110: Fleet
111: Probe tip
120: Body
130: Beam section
140: Bottom
150: Grip

Claims (10)

In a cantilever type probe pin having a multilayer structure,
The tip that comes into contact with the test substance;
A body portion formed by extending from the above tip portion;
A beam portion extending from the above body portion and formed to be elastically deformable; and
including a lower portion extending from the above beam portion and connected to a probe card;
The above body part, the beam part and the lower part,
It is formed by at least two different metal layers,
The above tip,
A probe tip that comes into direct contact with the test subject;
A first metal layer formed to contact at least a portion of an area on both sides of the probe tip;
A second metal layer formed to contact at least a portion of the upper surface of the probe tip; and
A third metal layer is spaced apart from the first metal layer and comprises at least a portion of the second metal side,
A probe pin, characterized in that the first metal layer and the second metal layer are made of different metals.
delete In paragraph 1,
The above probe tip is,
A probe pin further comprising an opening formed through a central area of the probe tip.
In the third paragraph,
The second metal layer is,
A probe pin comprising a region formed to fill the interior space of the opening.
In paragraph 1,
A probe pin wherein the second metal layer and the third metal layer are made of different metals.
In paragraph 5,
The above probe tip comprises a platinum group metal,
The first metal layer and the third metal layer include Ni, NiCo or NiB,
The second metal layer is a probe pin containing Ag or Cu.
In paragraph 4,
The above probe tip is,
Page 1; and
A second surface extending from an end of the first surface and forming a predetermined angle with the first surface; and
A probe pin including a third surface extending from an end of the second surface and forming a predetermined angle with the second surface.
In a method for manufacturing a cantilever type probe pin having a multilayer structure,
A step of forming a seed layer on a substrate having an inclined surface;
A step of forming a probe tip by depositing a metal layer in an area including the inclined surface on the seed layer;
A step of forming a first metal layer on the seed layer, the first metal layer contacting at least a portion of both side surfaces of the probe tip;
A step of forming a second metal layer on the first metal layer so as to contact at least a portion of the upper surface of the probe tip; and
A step of forming a third metal layer spaced apart from the first metal layer and on at least a portion of the second metal layer,
A method for manufacturing a probe pin, wherein the first metal layer and the second metal layer are made of different metals.
In Article 8,
A method for manufacturing a probe pin, wherein the second metal layer and the third metal layer are made of different metals.
In Article 8,
The step of forming the above probe tip is:
A method for manufacturing a probe pin further comprising the step of forming an opening in a central area of the probe tip.