KR102744706B1 - RF device of metal material with bidirectional non-contact type payment function - Google Patents
RF device of metal material with bidirectional non-contact type payment function Download PDFInfo
- Publication number
- KR102744706B1 KR102744706B1 KR1020230013662A KR20230013662A KR102744706B1 KR 102744706 B1 KR102744706 B1 KR 102744706B1 KR 1020230013662 A KR1020230013662 A KR 1020230013662A KR 20230013662 A KR20230013662 A KR 20230013662A KR 102744706 B1 KR102744706 B1 KR 102744706B1
- Authority
- KR
- South Korea
- Prior art keywords
- antenna
- metal
- hole
- metal sheet
- communication device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07345—Means for preventing undesired reading or writing from or onto record carriers by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches
- G06K19/07354—Means for preventing undesired reading or writing from or onto record carriers by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches by biometrically sensitive means, e.g. fingerprint sensitive
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q20/00—Payment architectures, schemes or protocols
- G06Q20/30—Payment architectures, schemes or protocols characterised by the use of specific devices or networks
- G06Q20/32—Payment architectures, schemes or protocols characterised by the use of specific devices or networks using wireless devices
- G06Q20/327—Short range or proximity payments by means of M-devices
- G06Q20/3278—RFID or NFC payments by means of M-devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Business, Economics & Management (AREA)
- Accounting & Taxation (AREA)
- General Business, Economics & Management (AREA)
- Computer Security & Cryptography (AREA)
- General Engineering & Computer Science (AREA)
- Strategic Management (AREA)
- Electromagnetism (AREA)
- Details Of Aerials (AREA)
Abstract
본 발명의 양방향 비접촉식 결제 기능을 가지는 메탈소재의 RF 통신 디바이스는, RF 통신칩이 연결된 안테나가 메탈 재질의 평판으로 구성된 제1 메탈 시트와 제2 메탈 시트 사이에 배치되어 적층이 되는 구조이며, 제1 메탈 시트와 제2 메탈 시트에는 안테나의 주변으로 홀이 형성되어 있는 것을 특징으로 한다. The RF communication device made of a metal material having a two-way contactless payment function of the present invention is characterized in that an antenna connected to an RF communication chip is laminated and placed between a first metal sheet and a second metal sheet made of a flat metal material, and a hole is formed around the antenna in the first metal sheet and the second metal sheet.
Description
본 발명은 양방향 비접촉식 결제 기능을 가지는 메탈 소재의 RF 디바이스에 관한 것이다.The present invention relates to a metal RF device having a two-way contactless payment function.
신용카드는 이를 단말기의 슬롯에 삽입해서 태그를 판독해야 하는 접촉식이 주를 이루며, 과거에는 교통카드의 마그넷 부분을 단말기에 접촉해서 결제를 하였다. 그러나, 현재는 RF통신 기술의 발달로, 메탈 소재의 RF디바이스가 상점 등 상업시설에서 또는 교통카드나 신용카드로 널리 활용되고 있다. 가장 널리 쓰이는 비접촉식 교통카드의 경우, 단말기 가까이에 카드를 가져다 대면 단말기의 코일에 의해 발생된 자기장에 의해 카드 내부의 안테나에 전류가 유도되어, 이 전력을 이용해 중앙 처리 장치에서 연산이 이루어진 후 자동으로 통신과 결제가 이루어지는 방식을 취하고 있다.Credit cards are mainly contact-type, which requires inserting the card into a slot in the terminal to read the tag. In the past, payments were made by touching the magnetic part of the transportation card to the terminal. However, with the development of RF communication technology, metal RF devices are widely used in commercial facilities such as stores or as transportation cards or credit cards. In the case of the most widely used contactless transportation card, when the card is held near the terminal, a current is induced in the antenna inside the card by the magnetic field generated by the coil of the terminal, and this power is used to perform calculations in the central processing unit, after which communication and payments are automatically made.
한편, 일반적으로 접촉식 결제(IC), 비접촉식 결제 기능을 가지는 스마트 카드의 시장에서는 다양한 소재를 사용한 특수 카드들의 개발이 진행되고 있다. 특히 메탈카드는 VIP 고객들을 상대로 차별화 서비스 제공 목적으로 시장이 활성화되어 있으며, 메탈 소재의 특성상 비접촉식 통신의 어려움으로 접촉식 결제(IC)의 기능만 가지는 상품으로 출시가 되고 있었으나, 최근 코로나19로 인한 비접촉식 간편 결제 수단의 니즈와 VISA, Mastercard에서 비접촉식 결제 기능 탑재의 의무화 도입으로 메탈카드에도 비접촉식 결제 기능이 의무화가 되었다.Meanwhile, in the market for smart cards with general contact payment (IC) and contactless payment functions, development of special cards using various materials is underway. In particular, the metal card market is active for the purpose of providing differentiated services to VIP customers, and due to the difficulty of contactless communication due to the nature of the metal material, it was released as a product with only the contact payment (IC) function. However, due to the recent need for a contactless easy payment method caused by COVID-19 and the introduction of mandatory contactless payment functions by VISA and Mastercard, contactless payment functions have become mandatory for metal cards as well.
메탈 소재의 RF디바이스와 관련하여, 한국 특허 제10-2039900호는 도 6에 도시한 것과 같이, 메탈층(110'), 플라스틱의 가공층(120'), 절연층(150'), 접착층(140', 160'), 인레이층(170') 및 인쇄층(180')을 포함하는 메탈카드(100')를 개시하고 있다. 상기 메탈카드(100')는 RF 통신칩이 구성된 방향에만 메탈층(110')이 위치하고, 반대 방향에는 일반카드에서 사용되는 PVC 재질의 시트가 위치한다. 안테나 코일은 인레이층(170')에 형성되는데, 메탈층(110')이 위치한 방향으로는 안테나의 방사 경로가 차단되어 비접촉식 결제가 되지 않고, PVC 재질의 시트가 구성되어 있는 반대 방향으로만 비접촉식 통신이 가능하다는 문제가 있다. 교통 카드의 경우 카드의 정해진 한 면을 단말기의 수신 영역에, 되도록 정면 대향 시켜 접근시켜야 하며, 반대면을 접근시키거나, 접근 방향이 어긋나면 결제가 이루어지지 않는 불편이 있는 것이다.With respect to an RF device made of metal, Korean Patent No. 10-2039900 discloses a metal card (100') including a metal layer (110'), a plastic processing layer (120'), an insulating layer (150'), adhesive layers (140', 160'), an inlay layer (170'), and a printing layer (180'), as illustrated in FIG. 6. In the metal card (100'), the metal layer (110') is positioned only in the direction in which the RF communication chip is formed, and a PVC material sheet used in a general card is positioned in the opposite direction. The antenna coil is formed in the inlay layer (170'), but there is a problem in that the radiation path of the antenna is blocked in the direction in which the metal layer (110') is positioned, so that contactless payment is not possible, and contactless communication is possible only in the opposite direction in which the PVC material sheet is formed. In the case of transportation cards, one side of the card must be placed directly opposite the terminal's receiving area, if possible. If the opposite side is placed or the direction of approach is incorrect, there is the inconvenience of payment not being made.
본 발명은 메탈카드의 단방향만 결제되는 문제점을 해결하기 위하여 발명한 것으로 금속층에 홀을 형성하여 안테나의 방사 경로를 홀을 통하여 양방향으로 방사가 가능하도록 한, 양방향 비접촉식 결제가 가능한 메탈 소재의 RF 디바이스를 제공하는 것을 목적으로 한다.The present invention was invented to solve the problem of a metal card that only allows one-way payment, and the purpose of the present invention is to provide a metal RF device capable of two-way contactless payment by forming a hole in a metal layer so that the radiation path of the antenna can be radiated in both directions through the hole.
상술한 목적을 달성하기 위하여 본 발명은 NFC, RFID, IR 통신, 블루투스, BLE, 지그비, WIFI, LTE, LoRA 중의 적어도 어느 하나의 통신을 통해, 제1금속시트에 장착되는 RF통신칩과 연결된 안테나에 의하여 양방향 비접촉식 결제 기능이 가능한, RF 통신 디바이스를 제공한다.In order to achieve the above-described purpose, the present invention provides an RF communication device capable of a bidirectional contactless payment function by an antenna connected to an RF communication chip mounted on a first metal sheet through at least one of NFC, RFID, IR communication, Bluetooth, BLE, Zigbee, WIFI, LTE, and LoRA.
상기 제1금속시트에는 안테나의 RF 신호가 방사되기 위한 제1홀이 형성될 수 있다.A first hole may be formed in the first metal sheet to radiate an RF signal of the antenna.
상기 안테나에는 도전성의 안테나패턴이 안테나의 가장자리를 따라 형성되며, 안테나패턴은 평면상에서 보아 제1홀의 안쪽에 배치되어 안테나 방사가 제1금속스트에 차단 또는 반사되지 않도록 할 수 있다.In the above antenna, a conductive antenna pattern is formed along the edge of the antenna, and the antenna pattern is arranged inside the first hole when viewed in a plan view so that antenna radiation is not blocked or reflected by the first metal strip.
상기 안테나와 제1홀을 에워싸도록 제1절연층이 적층될 수 있다.A first insulating layer may be laminated to surround the above antenna and the first hole.
제1금속시트와 대향하여 접착층으로 접합되는 제2금속시트를 더 포함하고, 상기 제2금속시트에는 안테나의 RF 신호가 방사되기 위한 제2홀이 형성되며, 안테나패턴은 평면상에서 보아 제2홀의 안쪽에 배치되어 안테나 방사가 제2금속시트에 차단 또는 반사되지 않도록 할 수 있다.The device further includes a second metal sheet that is bonded to the first metal sheet using an adhesive layer, wherein a second hole is formed in the second metal sheet for radiating an RF signal of the antenna, and the antenna pattern is arranged inside the second hole when viewed from a plane so that the antenna radiation is not blocked or reflected by the second metal sheet.
제2홀의 면적은 제1홀 및 안테나의 면적보다 큰 비대칭 구조일 수 있다.The area of the second hole may be an asymmetrical structure larger than the area of the first hole and the antenna.
상기 제1금속시트는 접착층을 통하여 반대 방향에서 평면형의 얇은 두께를 가지는 절연층과 접합될 수 있다.The above first metal sheet can be bonded to an insulating layer having a thin thickness in a planar shape in the opposite direction through an adhesive layer.
안테나패턴이 형성되는 플레이트의 재질은 PCB(Printed Circuit Board), FPCB(Flexible Printed Circuit Board), PC, PI, PET, HDPE, PVC, LDPE 및 PP중의 적어도 어느 하나로 이루어질 수 있다.The material of the plate on which the antenna pattern is formed can be made of at least one of PCB (Printed Circuit Board), FPCB (Flexible Printed Circuit Board), PC, PI, PET, HDPE, PVC, LDPE, and PP.
안테나패턴은 높은 도전성을 가지는 구리, 알루미늄, 금, 은 중의 적어도 어느 하나의 재질로 이루어질 수 있다.The antenna pattern can be made of at least one material having high conductivity, such as copper, aluminum, gold, or silver.
지문 정보, 홍채 정보, 얼굴 정보, 목소리 정보, 정맥 정보 중의 어느 하나의 생체 정보를 인식할 수 있는 생체인식센서를 내장할 수 있다.It may be equipped with a biometric sensor capable of recognizing any one of the following biometric information: fingerprint information, iris information, facial information, voice information, or vein information.
RF통신 디바이스는 스마트카드, ID카드, 자동차 키, 직불 카드, 전자여권, Access Control 디바이스중의 어느 하나일 수 있다.The RF communication device can be any one of a smart card, an ID card, a car key, a debit card, an electronic passport, or an access control device.
도 1은 본 발명의 RF 통신 디바이스 중 주요 구성을 포함한 전체 구조를 보인 사시도;
도 2는 도 1은 본 발명의 RF 통신 디바이스의 도시하지 않은 구성을 포함한 전체 단면도;
도 3은 본 발명의 제2실시예에 따른 RF 통신 디바이스의 단면도;
도 4는 본 발명의 제3실시예에 따른 RF 통신 디바이스의 단면도;
도 5는 본 발명의 제4실시예에 따른 RF 통신 디바이스의 단면도; 그리고
도 6은 선행기술의 메탈 시트의 구성도이다.FIG. 1 is a perspective view showing the entire structure including the main components of the RF communication device of the present invention;
FIG. 2 is a full cross-sectional view including a configuration not shown in FIG. 1 of the RF communication device of the present invention;
FIG. 3 is a cross-sectional view of an RF communication device according to a second embodiment of the present invention;
FIG. 4 is a cross-sectional view of an RF communication device according to a third embodiment of the present invention;
FIG. 5 is a cross-sectional view of an RF communication device according to a fourth embodiment of the present invention; and
Figure 6 is a configuration diagram of a metal sheet of the prior art.
본 발명에 따른 양방향 비접촉식 결제 기능을 가지는 메탈소재의 RF 통신 디바이스는, RF 통신칩이 연결된 안테나가 메탈 재질의 평판으로 구성된 제1 메탈 시트와 제2 메탈 시트 사이에 배치되어 적층이 되는 구조이며, 제1 메탈 시트와 제2 메탈 시트에는 안테나의 주변으로 홀이 형성되어 있는 것을 특징으로 한다. A metal RF communication device having a two-way contactless payment function according to the present invention is characterized in that an antenna connected to an RF communication chip is laminated and placed between a first metal sheet and a second metal sheet made of a flat metal material, and a hole is formed around the antenna in the first metal sheet and the second metal sheet.
본 발명에 따른 메탈소재의 RF 통신 디바이스는 메탈 시트에 홀(Hole)을 구비하여 안테나의 방사 경로를 확보하고, 그 결과 안테나를 위/아래로 적층하고 있는 제1, 제2 메탈 시트로 인해 안테나의 방사 경로를 막거나 반사하는 것을 방지하여, 양방향 비접촉식 결제가 가능 하도록 한다.The RF communication device made of a metal material according to the present invention has a hole in a metal sheet to secure a radiation path of an antenna, and as a result, prevents the radiation path of the antenna from being blocked or reflected by the first and second metal sheets stacked above and below the antenna, thereby enabling two-way contactless payment.
먼저 본 발명의 양방향 비접촉식 결제 기능을 가지는 RF 통신 디바이스(D)의 구조에 대하여 설명한다.First, the structure of an RF communication device (D) having a two-way contactless payment function of the present invention will be described.
도 1은 본 발명의 RF 통신 디바이스(D)중 주요 구성을 포함한 전체 구조를 보인 사시도이다. Figure 1 is a perspective view showing the entire structure including the main components of the RF communication device (D) of the present invention.
RF 통신 디바이스(D)는 상부의 제1금속시트(10)를 포함한다. 제1금속시트(10)는 카드에 맞도록 평판 장방형의 시트이며, 일측에는 소정 크기의 제1홀(12)이 형성된다. 제1금속시트(10)와 대향하는 하부에는 제2금속시트(20)가 제공되며, 제1홀(12)과 동일한 위치에 동일한 크기의 제2홀(22)이 형성된다.The RF communication device (D) includes a first metal sheet (10) on the upper side. The first metal sheet (10) is a flat rectangular sheet to fit a card, and a first hole (12) of a predetermined size is formed on one side. A second metal sheet (20) is provided on the lower side opposite to the first metal sheet (10), and a second hole (22) of the same size is formed at the same location as the first hole (12).
제1홀(12)에는 RF통신칩(30)이 장착된다. 제1홀(12)은 RF통신칩(30)을 충분히 수용하도록 그 면적은 RF통신칩(30)의 면적보다 크다. 제1홀(12)과 제2홀(22) 사이에는 안테나(1)가 장착된다. An RF communication chip (30) is mounted in the first hole (12). The area of the first hole (12) is larger than that of the RF communication chip (30) so that it can sufficiently accommodate the RF communication chip (30). An antenna (1) is mounted between the first hole (12) and the second hole (22).
안테나(1)의 층은 PCB(Printed Circuit Board), FPCB(Flexible Printed Circuit Board), PC, PI, PET, HDPE, PVC, LDPE 및 PP중의 적어도 어느 하나로 이루어질 수 있다.The layer of the antenna (1) can be made of at least one of a PCB (Printed Circuit Board), FPCB (Flexible Printed Circuit Board), PC, PI, PET, HDPE, PVC, LDPE, and PP.
안테나(1)는 제1홀(12)과 제2홀(22)과 근사한 크기 또는 이 보다 큰 크기의 예를 들어 사각형의 패드 또는 시트로 제작되는 것이 바람직하다. 안테나(1)에는 내부의 테두리 주변을 따라 도전성의 안테나 패턴(100)이 형성된다. 안테나 패턴(100)의 가장자리를 따른 배치는 안테나(1)의 자기장이 제1홀(12) 및 제2홀(22)의 내부를 관통하여 외부로 방출되는데 적합한 구성이다(도 2 참조). The antenna (1) is preferably manufactured as a pad or sheet, for example, in a square shape, having a size similar to or larger than the first hole (12) and the second hole (22). A conductive antenna pattern (100) is formed along the inner periphery of the antenna (1). The arrangement of the antenna pattern (100) along the edge is a configuration suitable for allowing the magnetic field of the antenna (1) to penetrate the inside of the first hole (12) and the second hole (22) and be emitted to the outside (see FIG. 2).
안테나 패턴(100)은 높은 도전성을 가지는 구리, 알루미늄, 금, 은 중의 적어도 어느 하나의 재질로 이루어질 수 있다. 안테나(1) 상면의 양측에는 RF통신칩(30)과의 연결을 위한 연결 단자(102)가 형성되어 있다.The antenna pattern (100) may be made of at least one material among copper, aluminum, gold, and silver having high conductivity. Connection terminals (102) for connection with an RF communication chip (30) are formed on both sides of the upper surface of the antenna (1).
안테나(1)에서 방출되는 자기장이 금속 시트와 겹치게 되면 와전류(Eddy Current)를 형성하여 안테나(1)의 인덕턴스를 낮추게 되고 이로 인해 안테나(1)의 공진주파수 (Resonance Frequency)의 변화를 주어 비접촉식 통신 장애를 발생하게 된다. 이를 해결하고자 본 발명은 제1, 제2 금속시트(10, 20)에 관통되는 홀을 구성하고 홀이 구비된 부분으로 안테나 방사가 가능하도록 홀 주변으로 안테나 패턴을 배치하므로, 안테나 방사를 통해 양방향으로 비접촉식 결제가 가능하다. When a magnetic field emitted from an antenna (1) overlaps with a metal sheet, an eddy current is formed, which lowers the inductance of the antenna (1), thereby changing the resonance frequency of the antenna (1), causing a contactless communication failure. In order to solve this problem, the present invention forms a hole penetrating the first and second metal sheets (10, 20), and arranges an antenna pattern around the hole so that antenna radiation is possible through the portion provided with the hole, thereby enabling contactless payment in both directions through antenna radiation.
본 발명에서의 비접촉 통신은 NFC(Near Field Communication), RFID(Radio-Frequency Identification), IR(Infrared Rays)통신, 블루투스, BLE(Bluetooth Low Energy), 지그비, WIFI, LTE, LoRA(Long Range Radio) 중의 적어도 어느 하나의 통신방식에 의해 지원되지만, 장래 기술의 발전에 따라 이에 한정되는 것은 아니다.In the present invention, non-contact communication is supported by at least one of NFC (Near Field Communication), RFID (Radio-Frequency Identification), IR (Infrared Rays) communication, Bluetooth, BLE (Bluetooth Low Energy), Zigbee, WIFI, LTE, and LoRA (Long Range Radio), but is not limited thereto depending on future technological developments.
도 2는 도 1은 본 발명의 RF 통신 디바이스(D)의 도시하지 않은 구성을 포함한 전체 단면도이다.FIG. 2 is a full cross-sectional view including a configuration not shown in FIG. 1 of the RF communication device (D) of the present invention.
제1금속시트(10)와 제2금속시트(20)는 접착층(40)에 의하여 접합된다. 제1홀(12)에 RF통신칩(30)이 장착되며, 이를 제외한 제1홀(22)의 개구는 제1절연층(50)이 봉지하듯이 에워싸고 있다. 제2홀(22)의 개구 전체는 제2절연층(60)이 에워싸고 있다. 제1및 제2절연층(50, 60)은, 제1및 제2홀(12, 22)에서, 안테나(1) 및 RF통신칩(30) 영역 주변으로 채워지며, 안테나(1)와 RF 통신칩(30)을 보호하는 목적으로 비금속 소재를 활용한다. 안테나(1)는 전술한 것과 같이 제1및 제2홀(12, 22)의 면적을 덮는 크기로 메탈 시트 사이에 개재되며, 이 부분을 제외한 제1금속시트(10)의 하면과 제2금속시트(20)의 상면이 접착층(40)에 의하여 접합되어 RF 통신 디바이스(D)가 일체로 제작된다. 연결와이어(104)가 RF통신칩(30)과 연결 단자(102) 사이를 연결하고 있다.The first metal sheet (10) and the second metal sheet (20) are joined by an adhesive layer (40). An RF communication chip (30) is mounted in the first hole (12), and the opening of the first hole (22) except for this is surrounded as if sealed by a first insulating layer (50). The entire opening of the second hole (22) is surrounded by a second insulating layer (60). The first and second insulating layers (50, 60) are filled around the areas of the antenna (1) and the RF communication chip (30) in the first and second holes (12, 22), and utilize a non-metallic material for the purpose of protecting the antenna (1) and the RF communication chip (30). As described above, the antenna (1) is interposed between the metal sheets in a size that covers the area of the first and second holes (12, 22), and the lower surface of the first metal sheet (10) and the upper surface of the second metal sheet (20), excluding this portion, are joined by an adhesive layer (40) to produce an RF communication device (D) as a single unit. A connecting wire (104) connects the RF communication chip (30) and the connecting terminal (102).
안테나(1)의 가장자리에 형성된 안테나패턴(100)은 제1홀(12) 및 제2홀(22)을 평면에서 보았을 때 안쪽에 위치하도록 배치된다. 그러면 안테나 방사 경로가 제1금속시트(10) 또는 제2금속시트(20)에 차단되거나 반사되지 않고, 안테나(1) RF신호는, 도시한 것과 같이 제1절연층(50)의 양측면을 통과하여 외부로 방사되는 제1경로(P1)와, 제2절연층(60)의 내부를 통과하여 외부로 방사되는 제2경로(P2), 즉 양방향으로 외부 방사된다. 따라서, RF 통신 디바이스(D)의 전면을 단말기에 근접시키거나 또는 후면을 단말기에 근접시켜 간편하고 오류 없이 결재를 수행할 수 있다. The antenna pattern (100) formed on the edge of the antenna (1) is positioned so as to be located on the inside of the first hole (12) and the second hole (22) when viewed from the plane. Then, the antenna radiation path is not blocked or reflected by the first metal sheet (10) or the second metal sheet (20), and the antenna (1) RF signal is radiated externally in both directions, i.e., through the first path (P1) that passes through both sides of the first insulating layer (50) and radiates externally through the second path (P2) that passes through the inside of the second insulating layer (60). Therefore, payment can be performed simply and without error by bringing the front side of the RF communication device (D) close to the terminal or the rear side close to the terminal.
이와 같이 본 발명에서는 제1, 제2금속시트(10, 20) 사이에 안테나(1)가 적층 되어 있으며 안테나(1)와 RF통신칩(30)이 연결되어 안테나 방사를 통해 양방향 비접촉 통신이 가능하다. 안테나 패턴(100)이 관통된 홀에 대면하고, 제1 및 제2금속시트(10, 20)와 겹치는 면이 없도록 안쪽에 배치되므로 안테나 방사가 잘 이루어진다.In this way, in the present invention, an antenna (1) is laminated between the first and second metal sheets (10, 20), and the antenna (1) and the RF communication chip (30) are connected to enable two-way non-contact communication through antenna radiation. Since the antenna pattern (100) faces the through hole and is positioned inside so as not to overlap with the first and second metal sheets (10, 20), antenna radiation is performed well.
이하, 본 발명의 다른 실시예에 대하여 도 3 내지 도 6을 참조로 앞서의 실시예와 다른 점을 위주로 설명한다.Hereinafter, other embodiments of the present invention will be described with reference to FIGS. 3 to 6, focusing on differences from the previous embodiments.
도 3은 본 발명의 제2실시예에 따른 RF 통신 디바이스(D)의 단면도이다. 도 3에서는 제2금속시트(20)에 형성된 제2홀(22)이 제1홀(12) 및 안테나(1)보다 큰 비대칭형 구조이다. 안테나의 RF신호는 제2홀(22)의 확대된 부분을 통과하여 그 만큼 더 하부의 외부로 방사된다. Fig. 3 is a cross-sectional view of an RF communication device (D) according to a second embodiment of the present invention. In Fig. 3, the second hole (22) formed in the second metal sheet (20) has an asymmetrical structure that is larger than the first hole (12) and the antenna (1). The RF signal of the antenna passes through the enlarged portion of the second hole (22) and is radiated to the outside further downward.
도 4는 본 발명의 제3실시예에 따른 RF 통신 디바이스(D)의 단면도이다. 도 4는 편면 메탈 구조로, 제2금속시트(20)를 없애고, RF통신칩(30)이 부착되는 제1금속시트(10)를 남기고 그 높이를 상대적으로 증가시키는 한편, 접착층(40)을 통하여 제1금속시트(10)와 절연층(70)을 접합하였다. 절연층(70)은 평판형의 시트 형상으로 안테나의 방사를 위하여 되도록 얇은 두께를 가지도록 제작된다. 안테나의 원활한 방사를 위하여 제1홀(12)과 안테나(1)의 길이를 도 2의 양면형 메탈 구조에 비하여 더 크게 형성하였다. 이와 같이 구성하면, 도 4에 도시한 것과 같이 안테나 방사 경로가 형성되어 양방향 비접촉식 통신이 가능하다.FIG. 4 is a cross-sectional view of an RF communication device (D) according to a third embodiment of the present invention. FIG. 4 is a single-sided metal structure in which a second metal sheet (20) is eliminated, a first metal sheet (10) to which an RF communication chip (30) is attached is left, and its height is relatively increased, while the first metal sheet (10) and an insulating layer (70) are bonded through an adhesive layer (40). The insulating layer (70) is manufactured in a flat sheet shape to have as thin a thickness as possible for antenna radiation. In order for the antenna to smoothly radiation, the length of the first hole (12) and the antenna (1) are formed to be larger than in the double-sided metal structure of FIG. 2. With this configuration, an antenna radiation path is formed as shown in FIG. 4, enabling two-way non-contact communication.
도 5는 본 발명의 제4실시예에 따른 RF 통신 디바이스(D)의 단면도이다. 도 5에서는 제 1및 제2금속시트(10, 20)에 형성된 제1 및 제2홀(12, 22)이 도 2와 비교하여 모두 크다. 그리고, 도 3과 동일하게, 제2금속시트(20)에 형성된 제2홀(22)이 제1홀(12) 및 안테나(1)보다 큰 비대칭형 구조이다. 이와 같이 구성하면, 안테나의 RF신호는 제1홀(12)의 상대적으로 넓게 이격된 양 측면을 통과하여 외부로 방사되고, 제2홀(22)의 확대된 부분을 통과하여 그 만큼 더 하부의 외부로 방사된다.FIG. 5 is a cross-sectional view of an RF communication device (D) according to a fourth embodiment of the present invention. In FIG. 5, the first and second holes (12, 22) formed in the first and second metal sheets (10, 20) are both larger than in FIG. 2. In addition, similarly to FIG. 3, the second hole (22) formed in the second metal sheet (20) has an asymmetrical structure larger than the first hole (12) and the antenna (1). With this configuration, the RF signal of the antenna passes through the relatively widely spaced side surfaces of the first hole (12) and is radiated to the outside, and passes through the enlarged portion of the second hole (22) and is radiated to the outside further down.
이와 같이 안테나 방사 경로를 확보하기 위한 홀의 형태는 제1, 제2 금속시트(10, 20)의 일대일 구조, 제1, 제2금속시트(10, 20)의 비대칭 홀 구조, 제1 금속시트(10) 단독 홀 구조로 제작이 가능하다.In this way, the shape of the hole for securing the antenna radiation path can be manufactured as a one-to-one structure of the first and second metal sheets (10, 20), an asymmetrical hole structure of the first and second metal sheets (10, 20), and a single hole structure of the first metal sheet (10).
도 3 및 도 5의 비대칭 구조의 경우 안테나 패턴(100)은 작은 크기의 홀, 즉 제1홀(12)의 안쪽으로 배치되어 양방향으로 안테나 방사 경로가 형성 되는 것이 중요하다. 그렇지 않으면 안테나 방사가 제1금속시트(10)와 간섭되어 효율이 나빠지기 때문이다. In the case of the asymmetrical structure of FIGS. 3 and 5, it is important that the antenna pattern (100) is placed inside a small hole, i.e., the first hole (12), so that an antenna radiation path is formed in both directions. Otherwise, the antenna radiation interferes with the first metal sheet (10), resulting in poor efficiency.
나아가 앞서의 실시예의 경우, 제1홀(12) 또는 제2홀(22)의 면적이 늘어남에 따라 안테나 방사 경로가 늘어나므로 양방향 통신 인식 거리 증대의 이점을 가질 수 있다.Furthermore, in the case of the above embodiment, as the area of the first hole (12) or the second hole (22) increases, the antenna radiation path increases, so that the advantage of increasing the two-way communication recognition distance can be achieved.
이상 본 발명의 바람직한 실시예를 설명하였으나, 본 발명에 대해서는 다양한 변경과 수정이 가능하다. Although the preferred embodiments of the present invention have been described above, various changes and modifications are possible to the present invention.
예를 들어, RF통신 디바이스에 지문 정보, 홍채 정보, 얼굴 정보, 목소리 정보, 정맥 정보 중의 어느 하나의 생체 정보를 인식할 수 있는 생체인식센서를 내장할 수 있다. For example, a biometric sensor capable of recognizing any one of fingerprint information, iris information, face information, voice information, and vein information may be embedded in an RF communication device.
이러한 RF통신 디바이스는 각종 카드, 예를 들어 스마트카드, ID카드, 자동차 키, 직불 카드, 전자여권, Access Control 디바이스를 포함할 수 있다.These RF communication devices may include various cards, such as smart cards, ID cards, car keys, debit cards, electronic passports, and access control devices.
본 발명의 권리범위는 이하 기술하는 청구범위와 동일 또는 균등한 영역에까지 미침은 자명하다.It is obvious that the scope of the present invention extends to an area identical or equivalent to the claims described below.
Claims (11)
상기 제1금속시트에는 안테나의 RF 신호가 방사되기 위한 제1홀이 형성되고
상기 안테나에는 도전성의 안테나패턴이 안테나의 가장자리를 따라 형성되며, 안테나패턴은 평면상에서 보아 제1홀의 안쪽에 배치되어 안테나 방사가 제1금속시트에 차단 또는 반사되지 않으며,
상기 안테나와 제1홀을 에워싸도록 제1절연층이 적층되고,
제1금속시트와 대향하여 접착층으로 접합되는 제2금속시트를 더 포함하고, 상기 제2금속시트에는 안테나의 자기장이 방사되기 위한 제2홀이 형성되며, 안테나패턴은 평면상에서 보아 제2홀의 안쪽에 배치되어 안테나 방사가 제2금속시트에 차단 또는 반사되지 않도록 한, 양방향 비접촉식 결제 기능이 가능한, 메탈 소재의 RF 통신 디바이스.A two-way contactless payment function is possible through an antenna connected to an RF communication chip mounted on the first metal sheet through at least one RF communication among NFC, RFID, IR communication, Bluetooth, BLE, Zigbee, WIFI, LTE, and LoRA.
A first hole is formed in the first metal sheet above to radiate the RF signal of the antenna.
The above antenna has a conductive antenna pattern formed along the edge of the antenna, and the antenna pattern is arranged inside the first hole when viewed from a plane so that the antenna radiation is not blocked or reflected by the first metal sheet.
A first insulating layer is laminated to surround the above antenna and the first hole,
A metal RF communication device capable of a bidirectional contactless payment function, further comprising a second metal sheet bonded with an adhesive layer facing the first metal sheet, wherein a second hole is formed in the second metal sheet through which a magnetic field of an antenna is radiated, and an antenna pattern is arranged inside the second hole when viewed from a plane so that antenna radiation is not blocked or reflected by the second metal sheet.
제2홀의 면적은 제1홀 및 안테나의 면적보다 큰 비대칭 구조인, 양방향 비접촉식 결제 기능이 가능한, 메탈 소재의 RF 통신 디바이스.In paragraph 1,
A metal RF communication device capable of two-way contactless payment, with an asymmetrical structure in which the area of the second hole is larger than that of the first hole and the antenna.
상기 제1금속시트는 접착층을 통하여 반대 방향에서 평면형의 얇은 두께를 가지는 절연층과 접합된, 양방향 비접촉식 결제 기능이 가능한, 메탈 소재의 RF 통신 디바이스.In paragraph 1,
A metal RF communication device capable of a bidirectional contactless payment function, wherein the first metal sheet is bonded to an insulating layer having a thin, flat thickness in the opposite direction through an adhesive layer.
안테나 패턴이 형성되는 플레이트의 재질은 PCB(Printed Circuit Board), FPCB(Flexible Printed Circuit Board), PC, PI, PET, HDPE, PVC, LDPE 및 PP중의 적어도 어느 하나로 이루어진, 양방향 비접촉식 결제 기능이 가능한, 메탈 소재의 RF 통신 디바이스.In paragraph 1,
A metal RF communication device capable of a two-way contactless payment function, wherein the material of the plate on which the antenna pattern is formed is made of at least one of PCB (Printed Circuit Board), FPCB (Flexible Printed Circuit Board), PC, PI, PET, HDPE, PVC, LDPE, and PP.
안테나패턴은 도전성을 가지는 구리, 알루미늄, 금, 은 중의 적어도 어느 하나의 재질로 이루어지는, 양방향 비접촉식 결제 기능이 가능한, 메탈 소재의 RF 통신 디바이스.In Article 8,
An RF communication device made of a metal material capable of a bidirectional contactless payment function, the antenna pattern being made of at least one material among copper, aluminum, gold, and silver having a conductive property.
지문 정보, 홍채 정보, 얼굴 정보, 목소리 정보, 정맥 정보 중의 어느 하나의 생체 정보를 인식할 수 있는 생체인식센서를 내장한, 양방향 비접촉식 결제 기능이 가능한, 메탈 소재의 RF 통신 디바이스.In paragraph 1,
A metal RF communication device with a built-in biometric sensor that can recognize any one of fingerprint information, iris information, face information, voice information, and vein information, and capable of two-way contactless payment.
RF통신 디바이스는 스마트카드, ID카드, 자동차 키, 직불 카드, 전자여권, Access Control 디바이스중의 어느 하나인, 양방향 비접촉식 결제 기능이 가능한 메탈 소재의 RF 통신 디바이스.
In paragraph 1,
RF communication device is a metal RF communication device capable of two-way contactless payment function, such as a smart card, ID card, car key, debit card, electronic passport, or access control device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020230013662A KR102744706B1 (en) | 2023-02-01 | 2023-02-01 | RF device of metal material with bidirectional non-contact type payment function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020230013662A KR102744706B1 (en) | 2023-02-01 | 2023-02-01 | RF device of metal material with bidirectional non-contact type payment function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20240120991A KR20240120991A (en) | 2024-08-08 |
| KR102744706B1 true KR102744706B1 (en) | 2024-12-19 |
Family
ID=92378163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020230013662A Active KR102744706B1 (en) | 2023-02-01 | 2023-02-01 | RF device of metal material with bidirectional non-contact type payment function |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR102744706B1 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180018551A1 (en) | 2015-02-02 | 2018-01-18 | Smart Packaging Solutions | Contactless chip card with dual antenna |
| KR102226904B1 (en) * | 2020-09-01 | 2021-03-12 | (주)바이오스마트 | Contactless-type metal card without a slit on front surface and method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102176235B1 (en) * | 2019-03-28 | 2020-11-09 | 코나엠 주식회사 | A metal card and a method for producing the metal card for bidirectional communications |
| FR3110735B1 (en) * | 2020-05-21 | 2022-04-29 | Linxens Holding | Method of electro-chemical metallization of a double-sided electric circuit for smart card and electric circuit obtained by this method. |
-
2023
- 2023-02-01 KR KR1020230013662A patent/KR102744706B1/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180018551A1 (en) | 2015-02-02 | 2018-01-18 | Smart Packaging Solutions | Contactless chip card with dual antenna |
| KR102226904B1 (en) * | 2020-09-01 | 2021-03-12 | (주)바이오스마트 | Contactless-type metal card without a slit on front surface and method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240120991A (en) | 2024-08-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10552722B2 (en) | Smartcard with coupling frame antenna | |
| US11113593B2 (en) | Contactless metal cards with fingerprint sensor and display | |
| US7306163B2 (en) | Smart card and method for its production | |
| US8286873B2 (en) | Combi card and communication system using thereof | |
| US20210081748A1 (en) | Proximity and dual interface metal cards and methods of making card bodies with two metal layers | |
| JP5913773B2 (en) | Antennas and portable electronic devices used for near field communication | |
| EP4042329B1 (en) | Smart cards having led and methods for fabrication thereof | |
| US20160180212A1 (en) | Smart metal card with radio frequency (rf) transmission capability | |
| US9633301B2 (en) | IC module, dual IC card, and method for manufacturing IC module | |
| US20160224879A1 (en) | Systems And Methods For Constructing Programmable Credential and Security Cards | |
| JP2001043340A (en) | Composite IC card | |
| JP2016178663A (en) | Wireless frequency transponder device having passive resonance circuit | |
| WO1999026195A1 (en) | Composite ic module and composite ic card | |
| KR20220064910A (en) | Card inlay for direct connection or inductive coupling technology | |
| EP4028855A2 (en) | Contactless metal cards with fingerprint sensor and display | |
| KR102199392B1 (en) | Radio frequency identification card with anti-metal effect | |
| JP5955901B2 (en) | Method, electronic device, and computer program for facilitating touch operation for wireless communication | |
| KR102744706B1 (en) | RF device of metal material with bidirectional non-contact type payment function | |
| WO2018092897A1 (en) | Electromagnetic-coupling dual ic card and ic module | |
| JPH11328341A (en) | Composite IC card | |
| KR200434239Y1 (en) | Double Sided Antenna Antenna Transportation Card | |
| KR102733313B1 (en) | RF antenna structure with bidirectional non-contact type payment function and RF device of metal material incorporating the same | |
| ES2969889T3 (en) | Smart card with docking frame antenna | |
| JP2000172814A (en) | Composite IC module and composite IC card | |
| JP2018092482A (en) | IC module, medium mounted with IC module, and method of manufacturing IC module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |