KR102738205B1 - Circuit testing device - Google Patents

Abstract

A circuit test device is provided. The circuit test device includes a test board including a first region in which a portion of a printed circuit board (PCB) to which a DUT (Device Under Test) is electrically connected is arranged, and a second region in which another portion of the PCB is arranged, a socket electrically connecting the test board and the DUT on the first region, and a fixing frame horizontally fixing the socket to the test board and covering and shielding at least a portion of the second region, wherein the fixing frame includes a conductive material.

Description

CIRCUIT TESTING DEVICE

The present invention relates to a circuit testing device.

Depending on the type of integrated circuit (IC), if the wiring length with other peripheral circuits becomes long, the reliability of the integrated circuit signal tends to decrease. Therefore, it is necessary to test the DUT (Device Under Test) by attaching the test board and socket. However, when attaching the test board and socket, there are cases where the contact is not properly made due to the inclination between the test board and the socket.

If the socket is not completely level with the test board and does not make normal contact, it may cause input/output loss compared to normal materials, and in some cases, it may not even work. In addition, if other peripheral circuits are not shielded due to the attachment of the test board and the socket, noise from other peripheral circuits may affect the integrated circuit mounted on the socket.

The technical problem to be solved by the present invention is to provide a circuit test device that outputs a signal with high power efficiency during testing.

The technical problem to be solved by the present invention is to provide a circuit test device with high signal reliability while reducing the load of repetitive test work by fixing between a socket and a test board.

The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

According to some embodiments of the present invention for achieving the above technical problem, a circuit test device includes a test board including a first region in which a part of a printed circuit board (PCB) to which a DUT (Device Under Test) is electrically connected is arranged, and a second region in which another part of the PCB is arranged, a socket electrically connecting the test board and the DUT on the first region, and a fixing frame horizontally fixing the socket to the test board and covering and shielding at least a part of the second region, wherein the fixing frame includes a conductive material.

FIG. 1 is a block diagram illustrating a test system according to some embodiments of the present invention.
FIG. 2 is a plan view illustrating a test board according to some embodiments of the present invention.
FIG. 3 is a plan view illustrating a circuit test device according to some embodiments of the present invention.
Figure 4 is a cross-sectional view taken along line A-A' of Figure 3.
Figure 5 is a cross-sectional view taken along line B-B' of Figure 3.
FIG. 6 is a plan view illustrating a circuit test device according to some further embodiments of the present invention.
Figure 7 is a cross-sectional view taken along line A-A' of Figure 6.
FIG. 8 is a cross-sectional view taken along line A-A' of FIG. 3 according to some further embodiments of the present invention.
FIG. 9 is a cross-sectional view taken along line B-B' of FIG. 3 according to some further embodiments of the present invention.
FIG. 10 is a plan view illustrating a circuit test device according to some further embodiments of the present invention.
Figure 11 is a cross-sectional view taken along line C-C' of Figure 10.
FIG. 12 is a drawing for explaining the operation of a circuit test device according to some embodiments of the present invention.
FIG. 13 is a graph illustrating the effectiveness of a circuit test device according to some embodiments of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. The same reference numerals are used for the same components in the drawings, and redundant descriptions thereof are omitted.

Hereinafter, embodiments according to the technical idea of the present invention will be described with reference to the attached drawings.

FIG. 1 is a block diagram illustrating a test system according to some embodiments of the present invention. A test system (1) according to some embodiments may include a host (10), a power supply (20), a test meter (30), a circuit test device (40), and a test jig (50).

The host (10) includes an electronic device, and may include, but is not limited to, a desktop PC, a smart phone, a tablet PC, a personal digital assistant (PDA), a laptop personal computer, etc.

The host (10) can control external electronic devices by transmitting driving signals to them through wired/wireless communication. For example, if the circuit test device (40) uses a dedicated interface, the host (10) can include a dedicated GPIB (General Purpose Interface Bus) board and can be connected to a power supply (20) and a test measuring device (30) through GPIB.

The host (10) can transmit control commands to the circuit test device (40) through the GPIB port and load a test execution program stored in the memory installed in the circuit test device (40) to conduct a test.

The power supply (20) supplies driving power to the test jig (50), and for example, the power supply (20) can supply power by applying direct current/power to the test jig (50). Accordingly, the power supply (20) and the test jig (50) can be connected via a direct current cable, but are not limited thereto.

The test meter (30) measures a status signal including a transmission signal transmitted from a circuit test device (40) and a reception signal received by the circuit test device (40), and displays the status signal as a waveform so that a user can observe it. Accordingly, the test meter (30) may be connected to the circuit test device (40) through a test jig (50), but may be directly connected to the circuit test device (40) according to an embodiment.

The circuit test device (40) may include an electronic device on which a DUT (Device Under Test) is mounted. The electronic device may be a device of various forms. For example, the electronic device may include a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device, but the technical idea of the present invention is not limited to the above examples.

The DUT mounted on the circuit test device (40) according to some embodiments may include integrated circuits such as, for example, an RFIC (Radio Frequency Integrated Circuit), a Connectivity module (a short-range communication module such as Bluetooth, WiFi direct, or IrDA (infrared data association)), a CP (Communication Processor), etc. However, the technical idea of the present invention is not limited to the above examples.

In some embodiments, the circuit test device (40) may be directly connected to the host (10), the power supply (20), and the test meter (30) if it does not use a dedicated interface.

The circuit test device (40) can be connected to a test jig (50) through a radio frequency connector to block the output signal from being transmitted to the outside during a test operation.

A test jig (50) according to some embodiments can transmit a driving signal input from a host (10) to a circuit test device (40) and receive a status signal corresponding thereto from the circuit test device (40).

The operation of a test system having such a configuration can be described in detail as follows. When a circuit test device (40) as a measurement target is connected to a test jig (50) and loaded, and a power switch is turned on, voltage can be applied to the test jig (120) from the power supply (20). At this time, when a driving signal is input through the host (10), the test jig (120) can perform initialization of the test measuring device (30).

The transmission function can be tested by placing the test meter (30) in transmission mode, setting it to, for example, the AF (audio frequency) level, and then connecting the test cable to the RF connector of the circuit test device (40) to transmit a driving signal to the circuit test device (40).

In addition, the test meter (30) is placed in the receiving mode, set to the RF (radio frequency) frequency, and a test cable is connected to the RF connector of the circuit test device (40) to transmit a driving signal to the circuit test device (40), thereby checking the RSSI (received signal strength indicator) and testing the receiving function.

By repeating these operations, the transmission frequency, transmission output, reception sensitivity, transmission voice distortion, ST (signaling tone), SAT (supervisory audio tone), DTMF (dual tone multi frequency), etc. can be adjusted and confirmed. When adjustments and confirmations for all test items are performed through these operations, the test is terminated and unloaded.

FIG. 2 is a plan view illustrating a test board according to some embodiments of the present invention. FIG. 3 is a plan view illustrating a circuit test device according to some embodiments of the present invention.

Referring to FIGS. 2 and 3, the circuit test device (40) may include a test board (410), a printed circuit board (PCB) 420, a stiffener 431, and a socket (432). The test board (410) may include a substrate of an electronic device described above in the description of FIG. 1 included in the circuit test device (40).

A test board (410) according to some embodiments may include an area where a target area (421) of a PCB (420) on which a DUT (440 of FIG. 7) is mounted is placed and an area where another PCB (420) other than the target area (421) is placed.

A PCB (420) according to some embodiments may include a target region (421), a first peripheral region (422), a second peripheral region (423), and first to fourth PCB fastening portions (424 to 427).

In the target area (421), the PCB (420) and the DUT (440 in FIG. 7) can be electrically connected, in the first peripheral area (422), the first peripheral integrated circuit (450) and the PCB (420) can be electrically connected, and in the second peripheral area (423), the second peripheral integrated circuit (460) and the PCB (420) can be electrically connected.

However, the arrangement of the DUT (440 of FIG. 7) and the first and second integrated circuits (450, 460) on the test board as shown in FIGS. 2 and 3 is exemplary and is not limited to the technical idea of the present invention.

In addition, the first peripheral integrated circuit (450) and the second peripheral integrated circuit (460) may include a central processing unit (CPU), a micro controller unit (MCU), a micro processing unit (MPU), a controller, an application processor (AP), a power management module (PMIC, Power Management IC), etc., and these may be implemented in the form of a system on chip (SoC), so that the number of integrated circuits surrounding the DUT (440 in FIG. 7) does not limit the technical idea of the present invention.

The first to fourth PCB fastening portions (424 to 427) according to some embodiments may be positioned within the PCB (420) and, although not shown in the drawing, may be electrically connected to the DUT (440 of FIG. 7), the first peripheral integrated circuit (450), or the second peripheral integrated circuit (460).

According to an embodiment, a data transmission signal and a voice transmission signal can be transmitted, and a basic data reception signal, a voice reception signal, and a diversity data reception signal can be received through each of the first to fourth PCB fastening portions (424, 425, 426, 427).

For example, the circuit test device (40) can receive a basic data reception signal (PRx) through the first to third PCB fastening portions (424 to 426), and the fourth PCB fastening portion (427) can receive a diversity data reception signal (DRx).

The first to fourth PCB fastening portions (424, 425, 426, 427) can perform the function of the RF connector described in Fig. 1. Likewise, the number and arrangement of the PCB fastening portions are exemplary and do not limit the technical idea of the present invention.

In addition, the first to fourth PCB fastening parts (424 to 427) can be connected to the first to fourth fastening parts (433 to 436) connected to the fixing frame (431). Each of the first to fourth fastening parts (433 to 436) can input/output external input/output signals to the first to fourth PCB fastening parts (424 to 427), transmit a drive signal of a host (10 in FIG. 1), and transmit a status signal of a circuit test device (40) to the outside.

A description of each of the fixed frame (431) and the socket (432) according to some embodiments is described below with reference to FIGS. 4 to 5 and FIGS. 6 to 7, respectively.

Fig. 4 is a cross-sectional view taken along line A-A' of Fig. 3. Fig. 5 is a cross-sectional view taken along line B-B' of Fig. 3.

Referring to FIGS. 3 to 5, a fixed frame (431) according to some embodiments may include an upper region (431a), a fixed frame first side wall (431b), a fixed frame second side wall (431c), and a fixed frame third side wall (431d).

According to some embodiments, the fixed frame (431) can horizontally fix the socket (432) to the test board (410) through a connection relationship with the upper region (431a), the fixed frame first side wall (431b), the fixed frame second side wall (431c), the fixed frame third side wall (431d) and the socket (432).

The above connection relationship is specifically as follows. The lower surface of the upper region (431a) of the fixed frame (431) may be in contact with a part of the upper surface of the socket (432), and according to an embodiment, the upper region (431a) and the socket (432) may be fastened to each other through a screw. However, the fastening method is not limited thereto, and may include bonding using an adhesive material or through heat treatment, and the socket (432) and the upper region (431a) may be fastened to each other through the fastening.

The lower surface of the upper region (431a) of the fixed frame (431) may be in contact with the upper surface of the fixed frame first side wall (431b). Depending on the embodiment, the height between the test board (410) and the upper surface of the fixed frame first side wall (431b) may be the same as the height between the test board (410) and the uppermost surface of the socket (432).

The lower surface of the upper region (431a) of the fixed frame (431) can be in contact with the upper surface of the first side wall (431b) of the fixed frame. The upper region (431a) and the first side wall (431b) of the fixed frame can be fastened to each other through a screw. However, the fastening method is not limited thereto, and may include bonding using an adhesive material or through heat treatment, and the first side wall (431b) of the fixed frame and the upper region (431a) can be fastened to each other through the fastening.

One side of the fixed frame first side wall (431b) can be in contact with the side wall of the test board (410). The fixed frame first side wall (431b) and the test board (410) can be fastened to each other through a screw. However, the fastening method is not limited thereto, and may include bonding using an adhesive material or through heat treatment, and the fixed frame first side wall (431b) and the test board (410) can be fastened to each other through the fastening.

The upper surface of the fixed frame second side wall (431c) can be in contact with the lower surface of the upper region (431a) of the fixed frame (431), and one side wall of the fixed frame second side wall (431c) can be in contact with the side wall of the test board (410). Also, although not shown, another side wall of the fixed frame second side wall (431c) and one side of the fixed frame first side wall (431b) can be in contact. Due to the contact relationship of the fixed frame second side wall (431c), the fixed frame second side wall (431c) can be fixed to the other region of the fixed frame (431) and the test board (410). It can be fastened with the contacted component, and the fastening method can include fastening a portion in contact with another component through a screw, using an adhesive material, or bonding through heat treatment, but the technical idea of the present invention is not limited thereto.

The upper surface of the fixed frame third side wall (431d) can be in contact with the lower surface of the upper region (431a) of the fixed frame (431), and the lower surface of the fixed frame third side wall (431d) can be in contact with the PCB (420), and according to an embodiment, can be in contact with the test board (410) instead of the PCB (420). Therefore, the height of the fixed frame third side wall (431d) can be lower than the height of the fixed frame second side wall (431c). Also, although not shown, another side wall of the fixed frame third side wall (431d) can be in contact with one side of the fixed frame first side wall (431b). Due to the contact relationship of the fixed frame third side wall (431d), the fixed frame third side wall (431d) can be fixed to the other region of the fixed frame (431) and the test board (410). It can be fastened with a contacted component, and the fastening method may include fastening a part in contact with another component through a screw, using an adhesive material, or joining through heat treatment, but the technical idea of the present invention is not limited thereto.

According to some embodiments, the fixed frame (431) may cover the first peripheral integrated circuit (450) and not cover the second peripheral integrated circuit (460). That is, it may shield only the first peripheral integrated circuit (450).

The fixed frame (431) includes a conductive material, and the conductive material may include Ag, Cu, Au, Al, W, Zn, Sn, Pb, etc., and the present invention is not limited to the above examples.

Fig. 6 is a plan view showing a circuit test device according to some other embodiments of the present invention. Fig. 7 is a cross-sectional view taken along line A-A' of Fig. 6. The same reference numerals are used for the same components in the preceding Figs. 3 to 5, and redundant descriptions thereof are omitted.

Referring to FIGS. 6 and 7, it can be confirmed that the second peripheral area is shielded by a shield can (423s). The shield can (423s) according to some embodiments includes a conductive material, and the conductive material may include Ag, Cu, Au, Al, W, Zn, Sn, Pb, etc., and the present invention is not limited to the above examples.

A socket (432) according to some embodiments may include a contact (432a), a socket body (432b), a flexible silicone layer (432c), and a test blade (432d). A DUT (440) may be mounted within the socket (432).

The contactor (432a) according to some embodiments may include a pogo pin or conductive rubber, and the contactor (432a) may be placed between the PCB (420) and the DUT (440) during a test operation.

A connection terminal (441) may be arranged on the lower surface of the DUT (440), and the connection terminal may mean a pin or a pad. However, when the DUT (440) is implemented as a BGA (ball grid array) type, the connection terminal (441) may be implemented as a solder ball as shown in the drawing.

The PCB (420) and the DUT (440) can be electrically connected by bringing the contactor (432a) and the connection terminal (441) of the DUT (440) into contact with each other.

The socket body (432b) according to some embodiments may support the contactor (432a). In addition, the socket body (432b) may have a shape corresponding to the outer shape of the test blade (432d). That is, when the test blade (432d) descends and presses the DUT (440), the test blade (432d) may be formed to surround the inner surface of the socket body (432b). Accordingly, the socket body (432b) may include a concave groove. The concave groove may facilitate the operation of the test blade (432d).

In addition, the socket (432) can contact the lower surface of the upper region (431a) of the fixing frame (431) through the upper surface of the socket body (432b), and can contact and be fixed to the PCB (420) or the test board (410) through the bottom surface of the socket body (432b). Through the above contact relationship, the bottom surfaces of the socket (432) and the socket body (432b) can be fixed horizontally to the test board (410).

According to an embodiment, the socket body (432b) includes a conductive material, and the conductive material may include Ag, Cu, Au, Al, W, Zn, Sn, Pb, etc., and the present invention is not limited to the above examples.

A flexible silicone layer (432c) may be formed at the bottom of the test blade (432d). The flexible silicone layer (432c) may have a concentric circle shape or a hexahedral shape having the same center as the test blade (432d). However, the shape of the flexible silicone layer (432c) is not limited to a circle or a hexahedron, and may have various shapes including polygonal columns.

The above soft silicone layer (432c) may be made of a soft material. For example, the soft silicone layer (432c) may be made of any one of soft materials including soft silicone, soft silicone rubber, polyurethane, polymer, and synthetic resin. In one embodiment of the present invention, the soft silicone layer (432c) may be made of soft silicone having a hardness of 1 to 10.

If foreign matter is introduced between the DUT (440) and the test blade (432d), the DUT (440) can be prevented from being damaged by the foreign matter through the flexible silicone layer (432c).

A test blade (432d) according to some embodiments may include a pusher block and a handler, and may be operated by applying force to the pusher block through manipulation of the handler.

A test blade (432d) to which force is applied to the pusher block can apply pressure to the DUT (440) through the flexible silicone layer (432c) to electrically connect the DUT (440) and the PCB (420), and furthermore, the test blade (432d) can secure the DUT (440) horizontally to the test board (410) when electrically connecting the contactor (432a) and the connection terminal (441) by bringing the DUT (440) into close contact with the contactor (432a).

That is, when the DUT (440) is electrically connected to the PCB (420), the DUT (440) can be fixed horizontally to the test board (410).

Referring to Fig. 7, the test blade (432d) can be formed to fill and surround a concave groove inside the socket body (432b). Through the above shape, the efficiency of force transmission to the pusher block can be increased.

According to an embodiment, the test blade (432d) includes a conductive material, and the conductive material may include Ag, Cu, Au, Al, W, Zn, Sn, Pb, etc., and the present invention is not limited to the above examples.

Hereinafter, a circuit test device according to some other embodiments of the present invention will be described with reference to FIGS. 8 to 9. The description will focus on differences from the circuit test devices illustrated in FIGS. 3 to 5. Similarly, the same reference numerals will be used for the same components in FIGS. 3 to 5, and redundant descriptions thereof will be omitted.

FIG. 8 is a cross-sectional view taken along line A-A' of FIG. 3 according to some further embodiments of the present invention. FIG. 9 is a cross-sectional view taken along line B-B' of FIG. 3 according to some further embodiments of the present invention.

The fixed frame (531) may include an upper region (531a), a fixed frame first side wall (531b), a fixed frame second side wall (531c), and a fixed frame third side wall (531d).

The upper region (531a) of the fixed frame (531) may be in contact with a portion of the uppermost surface of the socket (432) and a portion of the side wall of the socket body (532b), and according to an embodiment, the upper region (531a) and the socket (432) may be joined by fastening the contacted portions through a screw, using an adhesive material, or through heat treatment. However, the technical idea of the present invention is not limited thereto.

The lower surface of the upper region (531a) of the fixed frame (531) may be in contact with the upper surface of the first side wall (431b) of the fixed frame. However, since there is a height difference in the lower surface of the upper region (531a) of the fixed frame (531), the height between the test board (410) and the upper surface of the first side wall (531b) of the fixed frame may be smaller than the height between the test board (410) and the uppermost surface of the socket (432).

The lower surface of the upper region (531a) of the fixed frame (531) can be in contact with the upper surface of the first side wall (531b) of the fixed frame. The upper region (531a) and the first side wall (531b) of the fixed frame can be fastened to each other through a screw. However, the fastening method is not limited thereto, and may include bonding using an adhesive material or through heat treatment, and the first side wall (531b) of the fixed frame and the upper region (531a) can be fastened to each other through the fastening.

One side of the fixed frame first side wall (531b) can be in contact with the side wall of the test board (410). The fixed frame first side wall (531b) and the test board (410) can be fastened to each other through a screw. However, the fastening method is not limited thereto, and may include bonding using an adhesive material or through heat treatment, and the fixed frame first side wall (531b) and the test board (410) can be fastened to each other through the fastening.

The upper surface of the fixed frame second side wall (531c) can be in contact with the lower surface of the upper region (531a) of the fixed frame (531), and one side wall of the fixed frame second side wall (531c) can be in contact with the side wall of the test board (410). Also, although not shown, another side wall of the fixed frame second side wall (531c) and one side of the fixed frame first side wall (531b) can be in contact. Due to the contact relationship of the fixed frame second side wall (531c), the fixed frame second side wall (531c) can be fixed to the other region of the fixed frame (531) and the test board (410). Therefore, the height of the fixed frame second side wall (531c) can be lower than the fixed frame second side wall (431c) of FIG. 5.

The upper surface of the fixed frame third side wall (531d) can be in contact with the lower surface of the upper region (531a) of the fixed frame (531), and the lower surface of the fixed frame third side wall (531d) can be in contact with the PCB (420), and according to an embodiment, can be in contact with the test board (410) instead of the PCB (420). Therefore, the height of the fixed frame third side wall (531d) can be lower than the height of the fixed frame second side wall (531c). Also, although not shown, another side wall of the fixed frame third side wall (531d) can be in contact with one side of the fixed frame first side wall (531b). Due to the contact relationship of the fixed frame third side wall (531d), the fixed frame third side wall (531d) can be fixed to the other region of the fixed frame (531) and the test board (410). It can be fastened with a contacted component, and the fastening method may include fastening a part in contact with another component through a screw, using an adhesive material, or joining through heat treatment, but the technical idea of the present invention is not limited thereto.

Hereinafter, a circuit test device according to another embodiment of the present invention will be described with reference to FIGS. 10 to 11. The description will focus on differences from the circuit test devices illustrated in FIGS. 3 to 5. Similarly, the same reference numerals will be used for the same components in FIGS. 3 to 5, and redundant descriptions thereof will be omitted.

Fig. 10 is a plan view showing a circuit test device according to some other embodiments of the present invention. Fig. 11 is a cross-sectional view taken along line C-C' of Fig. 10.

The fixing frame (431) according to some embodiments may cover all the PCBs within the circuit test device (40) and may cover the first peripheral integrated circuit (450) and the second peripheral integrated circuit (460). That is, the first and second peripheral integrated circuits (450) may be shielded. Accordingly, the second peripheral integrated circuit (460) may not be shielded by the shield can, unlike in FIG. 6.

In addition, one side of the fixed frame third side wall (631d) may be in contact with the side wall of the test board (410), and thus the bottom surface of the fixed frame third side wall (631d) may not be in contact with the test board (410). Accordingly, the height of the fixed frame third side wall (631d) may be the same as the height of the fixed frame second side wall (631c).

FIG. 12 is a drawing for explaining the operation of a circuit test device according to some embodiments of the present invention.

Referring to FIGS. 1 and 12, when a test system (1) according to some embodiments is in operation, a socket (432) can be fixed by a fixing frame (431) and horizontally fixed to a test board (410), and a DUT (440) can also be horizontally fixed to the test board (410) by the pressure of a test blade (432d) within the socket (432) and can be electrically connected to a target area (421) on the same surface as the test board (410).

In addition, when the test system (1) operates, first and second radio waves (E1, E2) may be generated around the first peripheral integrated circuit (450). Since the first and second radio waves (E1, E2) have a straight line, the second radio wave (E2) that travels straight toward the tester board (410) is blocked from traveling straight by the ground (ground terminal, not shown) arranged within the tester board (410), but in the case of the first radio wave (E1), the straight line may be blocked by the fixed frame (431) surrounding the first peripheral integrated circuit (450). Since the fixed frame (431) includes a conductive material, the radio wave cannot pass through the conductive material due to the nature of the radio wave.

Therefore, the first wave (E1) cannot be transmitted to the host (10), the power supply (20), the test meter (30), and the test jig (50).

FIG. 13 is a graph illustrating the effectiveness of a circuit test device according to some embodiments of the present invention.

Referring to FIG. 13, the graph of FIG. 13 is a graph showing the gain of signal output according to frequency, and can be obtained based on the status signal received from the test measuring device (30) of FIG. 1.

A higher gain means less power loss during testing, higher power-efficient signal output, and higher reliability of test operation.

LTE B5 refers to the 800–900 MHz frequency band, LTE B25 refers to the 1.85–2.0 GHz frequency band, LTE B7 refers to the 2.5–2.7 GHz frequency band, and Sub-6 N78 refers to the 3.3–3.8 GHz frequency band.

SMD board reference (ref) means that soldering or heat treatment is performed between the PCB and the integrated circuit, and the PCB and the integrated circuit are mounted without a socket (432). The SMD board reference (ref) can obtain a gain of -34dB in LTE B5, -35dB in LTE B25, -36dB in LTE B7, and -37dB in Sub-6 N78.

By fixing the socket (432) through the fixing frame (431, Stiffener), a gain of -35 dB in LTE B5, -34.5 dB in LTE B25, -36.5 dB in LTE B7, and -38.5 dB in Sub-6 N78 can be obtained during the test.

When performing tests without a stiffener (431), gains of -38dB at LTE B5, -39dB at LTE B25, -42dB at LTE B7, and -42.5dB at Sub-6 N78 were achieved.

When performing a test by fixing the socket (432) through a fixing frame (431, Stiffener), an output gain of 3 dB in LTE B5, 4.5 dB in LTE B25, 5.5 dB in LTE B7, and 4 dB in Sub-6 N78 can be secured compared to performing a test without the fixing frame (431, Stiffener).

Therefore, when conducting a test using the circuit test device (40) of this invention, higher reliability can be shown than when conducting a test without a fixing frame (431, Stiffener).

In addition, by fixing the socket (432) to the test board (410), it is possible to perform repeated tests with high reliability and low cost and time when performing test operations on multiple DUTs.

Although the embodiments of the present invention have been described with reference to the attached drawings, the present invention is not limited to the embodiments described above, but can be manufactured in various different forms, and a person having ordinary skill in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing the technical idea or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

1: Test System 10: Host
20: Power Supply 30: Test Meter
40: Circuit test device 50: Test jig
410: Test Board 420: PCB
421: Target area 422: 1st peripheral area
431: Fixed Frame 432: Socket
440: DUT 450: 1st peripheral integrated circuit

Claims (10)

A test board including a first area in which a portion of a PCB (Printed Circuit Board) to which a DUT (Device Under Test) is electrically connected is arranged, and a second area in which another portion of the PCB is arranged;
On the first region, a socket electrically connecting between the PCB and the DUT; and
A fixing frame is included to fix the socket horizontally to the test board and cover and shield at least a portion of the second area,
The above-mentioned fixture is a circuit test device including a conductive material. In the first paragraph,
A circuit test device in which the above fixing frame contacts at least a portion of the upper surface of the socket and is connected to the test board to fix the socket. In the second paragraph,
The above-mentioned fixture is a circuit test device connected to the side wall of the above-mentioned test board through screws. In the first paragraph,
The above fixture is a circuit test device that does not contact the side wall of the socket. In the first paragraph,
The above fixture is a circuit test device in contact with at least a portion of the side wall of the socket. In the first paragraph,
The above fixed frame is a circuit test device that overlaps the entire second region in a plane. In the first paragraph,
The above socket contains a test blade,
A circuit test device in which the DUT is fixed horizontally to the test board by applying pressure by the test blade. In Article 7,
The above socket includes a contactor,
The above DUT includes a ball-shaped connection terminal,
A circuit test device in which pressure is applied by the test blade to electrically connect the contactor and the connection terminal. In the first paragraph,
The above-mentioned fixture is a circuit test device including aluminum among the above-mentioned conductive materials. In Article 9,
A first peripheral integrated circuit and a second peripheral integrated circuit are arranged on the second region,
The above first peripheral integrated circuit overlaps the above fixed frame in a planar manner,
A circuit test device in which the second peripheral integrated circuit is planarly non-overlapping with the fixed frame and covered by a shield can.

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