KR102445303B1 - 열 경화성 접착제 조성물과, 접착층을 포함한 구조체 및 이의 제조 방법 - Google Patents
열 경화성 접착제 조성물과, 접착층을 포함한 구조체 및 이의 제조 방법 Download PDFInfo
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- C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
- C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
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- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
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- C08L21/02—Latex
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
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Abstract
Description
| 함량 (중량%) | 실시예 1 | 실시예 2 | 비교예 1 | 비교예 2 | 비교예 3 | |||
| 비스페놀 A 에폭시 수지1 | - | 10 | -21 | 21 | - | |||
| 실란 변성 에폭시 수지2 | 31 | 20 | 31 | - | 32 | |||
| 액상 러버3 | 31 | 30 | - | 41 | 30 | |||
| 폴리우레탄 | 수지 A4 | 10 | 12 | - | 10 | - | ||
| 수지 B5 | - | - | 20 | - | 10 | |||
| 코어-쉘 고무 공중합체6 | 10 | 10 | 10 | 10 | 10 | |||
| 착색제7 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | |||
| 열 경화제8 | 5.95 | 5.95 | 5.95 | 5.95 | 5.95 | |||
| 경화 촉매9 | 1 | 1 | 1 | 1 | 1 | |||
| 무기 충진제 | CaCO3 | 3 | 3 | 3 | 3 | 3 | ||
| CaO10 | 5 | 5 | 5 | 5 | 5 | |||
| Fumed 실리카11 | 3 | 3 | 3 | 3 | 3 | |||
| 충격 강도(-40 ℃; 단위: N/mm) | 전단 강도(23 ℃; 단위: MPa) | |
| 실시예 1 | 26 | 27 |
| 실시예 2 | 33 | 28 |
| 비교예 1 | 강도가 매우 낮아 측정 불가 | 20 |
| 비교예 2 | 강도가 매우 낮아 측정 불가 | 8 |
| 비교예 3 | 강도가 매우 낮아 측정 불가 | 15 |
Claims (18)
- 실란 변성 에폭시 수지 15 내지 60 중량%;
액상 러버 5 내지 40 중량%;
폴리알킬렌 글리콜에서 유래한 고분자 블록을 포함한 폴리우레탄 수지 2 내지 35 중량%; 및
80 ℃ 이상의 온도에서 경화 가능한 열 경화제 1.5 내지 10 중량%
를 포함하는, 열 경화성 접착제 조성물.
- 제 1 항에 있어서,
에폭시 수지를 더 포함하는, 열 경화성 접착제 조성물.
- 제 1 항 또는 제 2 항에 있어서,
상기 실란 변성 에폭시 수지 및 에폭시 수지는 비스페놀계 에폭시 수지, 노볼락계 에폭시 수지, 및 옥사졸리돈계 에폭시 수지로 이루어진 군에서 선택되는 1종 이상을 포함하는, 열 경화성 접착제 조성물.
- 제 2 항에 있어서,
상기 에폭시 수지는 170 내지 600의 에폭시 당량을 갖는 열 경화성 접착제 조성물.
- 제 1 항에 있어서,
상기 실란 변성 에폭시 수지는 에폭시 수지에 하기 화학식 1로 표시되는 알콕시 실란기가 결합되어 있는 열 경화성 접착제 조성물:
[화학식 1]
-R2-Si(R1)3
상기 화학식 1에서,
R1은 각각 독립적으로 탄소수 1 내지 6의 알킬기 또는 탄소수 1 내지 6의 알콕시기이되, 적어도 하나 이상은 탄소수 1 내지 6의 알콕시기이고,
R2는 단일 결합 또는 탄소수 1 내지 10의 알킬렌기이다.
- 제 5 항에 있어서,
상기 화학식 1에서, R1은 각각 독립적으로 메틸기, 에틸기, 프로필기, 메톡시기, 에톡시기 또는 프로폭시기이되, 적어도 하나 이상은 메톡시기, 에톡시기 또는 프로폭시기이고,
R2는 프로필렌기, 부틸렌기, 2,2-다이메틸프로필렌기, 2,2-다이메틸부틸렌기 또는 3,3-다이메틸부틸렌기인, 열 경화성 접착제 조성물.
- 제 1 항에 있어서,
상기 액상 러버는 부티디엔 또는 부타디엔-아크로니트릴 공중합체와 에폭시 수지와의 반응물인, 열 경화성 접착제 조성물.
- 제 1 항에 있어서,
상기 폴리우레탄 수지는 분지형의 폴리프로필렌글리콜에서 유래한 고분자 블록과, 다가 지방족 이소시아네이트에서 유래한 잔기와, 이들을 연결하는 우레탄 연결기를 포함한 반복 단위를 갖는 열 경화성 접착제 조성물.
- 제 8 항에 있어서,
상기 폴리우레탄 수지는 말단 이소시아네이트기가 아민 화합물, 알코올 화합물, 페놀 화합물, 옥심 화합물, 또는 비스페놀 화합물로 말단 캡핑된, 열 경화성 접착제 조성물.
- 제 8 항에 있어서,
상기 다가 지방족 이소시아네이트는 헥사메틸렌 디이소시아네이트, 이소포론 디이소시아네이트, 및 메틸렌디사이클로헥실 디이소시아네이트로 이루어진 군에서 선택된 1종 이상을 포함하는, 열 경화성 접착제 조성물.
- 제 8 항에 있어서,
상기 폴리알킬렌 글리콜은 400 내지 2000의 OH 당량을 가지며,
상기 폴리우레탄 수지는 5000 내지 500000 g/mol의 중량 평균 분자량을 갖는,
열 경화성 접착제 조성물.
- 제 1 항에 있어서,
상기 열 경화제는 다이시안다이아미드계 경화제, 멜라민계 경화제, 다이알릴멜라민계 경화제, 구안아민계 경화제, 아미노트라이아졸계 경화제, 하이드라지드계 경화제, 시아노아세트아미드계 경화제, 및 방향족 폴리아민계 경화제로 이루어진 군에서 선택된 1종 이상을 포함하는, 열 경화성 접착제 조성물.
- 삭제
- 제 1 항에 있어서,
경화 촉매, 1차 입자 형태의 일반 무기 충진제, 모노 에폭시기를 갖는 반응성 희석제, 가소제, 비반응성 희석제, 커플링제, 유동성 조절제, 및 요변 조절제로 이루어진 군에서 선택된 1종 이상의 첨가제를 더 포함하는, 열 경화성 접착제 조성물.
- 제 1 항의 열 경화성 접착제 조성물을 기재 상에 도포하는 단계; 및
80 ℃ 이상의 온도에서, 상기 도포된 조성물을 열 경화하여 접착층을 형성하는 단계
를 포함하는, 구조체의 제조 방법.
- 기재와, 제 1 항의 열 경화성 접착제 조성물의 경화물을 포함한 접착층을 포함하는 구조체.
- 제 16 항에 있어서,
상기 기재는 목재, 금속 또는 플라스틱으로 이루어진, 구조체.
- 제 16 항에 있어서,
상기 접착층은 실란 변성 에폭시 수지가 열 경화제를 매개로 가교된 바인더층과,
상기 바인더층 내에 분산된 액상 러버, 및 폴리우레탄 수지를 포함하는 구조체.
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| KR102637874B1 (ko) * | 2023-10-19 | 2024-02-19 | 주식회사 이에스씨솔루션 | 교통 안전시설 부착용 이액형 접착제 조성물 |
| CN118308011B (zh) * | 2024-05-14 | 2026-01-20 | 络合高新材料(上海)股份有限公司 | 一种高延伸率石油管道修补涂料环氧树脂组合物 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100827535B1 (ko) * | 2006-12-11 | 2008-05-06 | 제일모직주식회사 | 실란 변성 에폭시 수지를 사용하는 이방 도전성 접착제조성물 및 이를 이용한 접착필름 |
| JP2008106087A (ja) | 2006-10-23 | 2008-05-08 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
| JP2018090651A (ja) * | 2015-03-31 | 2018-06-14 | 株式会社カネカ | 貯蔵安定性に優れる硬化性エポキシ樹脂組成物 |
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| ES2276182T5 (es) * | 2004-03-12 | 2015-04-10 | Dow Global Technologies Llc | Composición adhesiva epoxídica |
| EP2401339A1 (en) * | 2009-02-26 | 2012-01-04 | Dow Global Technologies LLC | One-part structural epoxy resin adhesives containing dimerized fatty acid/epoxy resin adduct and a polyol |
| US20120211161A1 (en) * | 2009-11-05 | 2012-08-23 | Andreas Lutz | Structural epoxy resin adhesives containing elastomeric tougheners capped with ketoximes |
| JP6035247B2 (ja) * | 2010-12-26 | 2016-11-30 | ダウ グローバル テクノロジーズ エルエルシー | フェノール、ポリフェノールまたはアミノフェノール化合物でキャップした鎖延長化エラストマー型強化剤を含有する構造用エポキシ樹脂接着剤 |
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| JP2008106087A (ja) | 2006-10-23 | 2008-05-08 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
| KR100827535B1 (ko) * | 2006-12-11 | 2008-05-06 | 제일모직주식회사 | 실란 변성 에폭시 수지를 사용하는 이방 도전성 접착제조성물 및 이를 이용한 접착필름 |
| JP2018090651A (ja) * | 2015-03-31 | 2018-06-14 | 株式会社カネカ | 貯蔵安定性に優れる硬化性エポキシ樹脂組成物 |
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