KR102158803B1 - Organic light emitting device and manufacturing method thereof - Google Patents

Abstract

The organic light-emitting display device according to an exemplary embodiment of the present invention includes an organic light-emitting display panel displaying an image, a lower protective film attached under the organic light-emitting display panel, and the lower protective film includes the organic light-emitting display panel and It may include a support film in contact, and a stress control layer formed under the support film.

Description

An organic light-emitting display device and its manufacturing method TECHNICAL FIELD [ORGANIC LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF}

The present invention relates to an organic light emitting display device and a method of manufacturing the same.

The organic light emitting diode display includes organic light emitting devices including a hole injection electrode, an organic emission layer, and an electron injection electrode. Each organic light-emitting device emits light by energy generated when excitons generated by the combination of electrons and holes in the organic light-emitting layer fall from an excited state to a ground state.

Since organic light-emitting devices can be deteriorated by external factors such as external moisture, oxygen, or ultraviolet rays, a packaging technology that seals the organic light-emitting device is important.In order to apply to various applications, the organic light-emitting display device is manufactured thinly. Or be manufactured to be easily bent. A thin film encapsulation (TFE) technology has been developed to form and bend the organic light-emitting display device while sealing the organic light-emitting device. The thin film encapsulation technology is a technology in which an inorganic layer and an organic layer are alternately stacked on organic light emitting devices formed in a display area of a display substrate to cover the display area with a thin film encapsulation layer. When the display substrate of the organic light emitting display device having such a thin film encapsulation layer is formed of a flexible film such as polyimide (PI), it can be bent easily and is advantageous for slimming.

When the flexible OLED display is bent, stress is generated. Specifically, tensile stress is generated in the convex outer side, compressive stress is generated in the concave inner side, and the intermediate region between the outer and inner sides There is a neutral plane (Netural Plane, NP) in which no force is generated. When the organic light-emitting device is positioned on the neutral surface, a screen abnormality of the organic light-emitting display device does not occur.

However, when the thickness of the organic light-emitting display device increases due to inner and outer films such as polarizing film and protective film attached to the organic light-emitting display device, tensile stress and compressive stress increase, and the neutral plane becomes narrower, resulting in organic light on the neutral plane. It becomes difficult to locate the light emitting element. In addition, since the organic light emitting display device has a layered structure made of a composite material, an asymmetry of the strain occurs due to the difference between the tensile stress and the compressive stress between the outside and the inside of the bent part. It is difficult to locate, and this causes screen abnormalities.

An object of the present invention is to provide an organic light-emitting display device capable of reducing a stress of a bending portion by selectively controlling a strain of a bending portion and a method of manufacturing the same.

The organic light-emitting display device according to an exemplary embodiment of the present invention includes an organic light-emitting display panel displaying an image, a lower protective film attached under the organic light-emitting display panel, and the lower protective film includes the organic light-emitting display panel and It may include a support film in contact, and a stress control layer formed under the support film.

The stress control layer may include a plurality of stress control patterns disposed adjacent to each other.

The stress control pattern may be any one selected from a triangular shape, a trapezoidal shape, or a semicircular shape.

The lower ends of the stress control patterns adjacent to each other may be directly connected or separated from each other and connected.

The organic light emitting display panel may include a flat flat portion, and bent portions positioned at both ends of the flat portion and bent.

The stress control pattern includes a planar stress control pattern formed at a position corresponding to the flat part, and a bending stress control pattern formed at a position corresponding to the bending part, and the bending interval between the bending stress control patterns is the It may be smaller than the plane spacing between plane stress control patterns.

The bending gap or plane gap may be a gap between the central axes of the upper end of the stress control pattern.

The lower protective film may further include a planar protective layer formed under the support film and adjacent to the stress control layer.

The planar protective layer may be formed at a position corresponding to the planar part.

The organic light-emitting display panel may include a flexible substrate attached to the lower protective film, an organic light emitting device formed on the flexible substrate, and a thin film encapsulation layer covering the organic light emitting device.

In addition, a method of manufacturing an organic light emitting diode display according to an exemplary embodiment of the present invention includes manufacturing a lower protective film including a support film, a stress control layer formed under the support film, and a release film covering the stress control layer. , Attaching the lower protective film under the flexible substrate, completing the organic light emitting display panel by sequentially forming an organic light emitting element and a thin film encapsulation layer on the flexible substrate, and separating the release film from the lower protective film Exposing the stress control layer may include forming a bent part by bending a part of the organic light emitting display panel.

In forming the bending part, the bending interval between the bending stress control patterns of the stress control layer attached to the position corresponding to the bending part is of the stress control layer attached to the position corresponding to the flat part of the organic light emitting display panel. It may be smaller than the plane spacing between plane stress control patterns.

The stress control pattern may be any one selected from a triangular shape, a trapezoidal shape, or a semicircular shape.

The bending gap or plane gap may be a gap between the central axes of the upper end of the stress control pattern.

The organic light emitting display device according to the exemplary embodiment of the present invention selectively minimizes the stress of the bending portion of the organic light emitting display panel by reducing the bending interval between the bending stress control patterns attached to a position corresponding to the bending portion of the organic light emitting display panel. can do. Accordingly, a screen abnormality can be eliminated by preventing an asymmetry of the strain rate of the bending portion of the organic light emitting display panel.

In addition, without first exposing the stress control layer of the lower protective film, by covering the stress control layer with a release film to flatten the lower protective film to complete the organic light emitting display panel, the stress control pattern of the lower protective film during the manufacturing process It is possible to prevent a decrease in the recognition rate of an alignment mark due to optical scattering.

In addition, when the chip-on film (COF) is pressed onto the organic light emitting display panel while the stress control layer of the lower protective film is exposed, the compression force may decrease and the frequency of occurrence of defective bonding may increase. By compressing the chip-on film (COF) on the organic light emitting display panel while covering the stress control layer with a film and flattening the lower protective film, it is possible to prevent a decrease in compression force and reduce the frequency of occurrence of defective bonding. .

1 is a side view of an organic light emitting display device according to a first exemplary embodiment of the present invention.
2 is an equivalent circuit diagram of one pixel of the organic light emitting diode display according to the first exemplary embodiment of the present invention.
3 is a graph of defect incidence rates according to the bending speed of the organic light emitting display device according to the first embodiment of the present invention and the conventional organic light emitting display device.
4 to 6 are diagrams sequentially illustrating a method of manufacturing an organic light emitting diode display according to the first exemplary embodiment of the present invention.
7 is a side view of an organic light emitting diode display according to a second exemplary embodiment of the present invention.
8 is a side view of an organic light emitting diode display according to a third exemplary embodiment of the present invention.
9 is a side view of an organic light emitting diode display according to a fourth exemplary embodiment of the present invention.
10 is a comparison graph of stress of the organic light emitting diode display according to the first to fourth exemplary embodiments.
11 is a side view of an organic light emitting diode display according to a fifth exemplary embodiment of the present invention.
12 is a side view of an organic light emitting diode display according to a sixth exemplary embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art may easily implement the present invention. The present invention may be implemented in various different forms, and is not limited to the embodiments described herein.

In order to clearly describe the present invention, parts irrelevant to the description are omitted, and the same reference numerals are attached to the same or similar components throughout the specification.

In addition, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, so the present invention is not necessarily limited to the illustrated bar.

In the drawings, the thicknesses are enlarged to clearly express various layers and regions. And in the drawings, for convenience of description, the thickness of some layers and regions is exaggerated. When a part of a layer, film, region, plate, etc. is said to be "on" or "on" another part, this includes not only the case where the other part is "directly above" but also the case where there is another part in the middle.

In addition, throughout the specification, when a certain part "includes" a certain component, it means that other components may be further included rather than excluding other components unless otherwise stated. In addition, throughout the specification, the term "on" means that it is positioned above or below the target portion, and does not necessarily mean that it is positioned above the direction of gravity.

In addition, in the accompanying drawings, an active matrix (AM) type organic light emitting display device having two thin film transistors (TFTs) and one capacitor is shown in one pixel. The invention is not limited thereto. Accordingly, the organic light emitting diode display may include a plurality of thin film transistors and one or more capacitors in one pixel, and may be formed to have various structures by further forming separate wirings or omitting existing wirings. Here, a pixel refers to a minimum unit for displaying an image, and the organic light emitting display device displays an image through a plurality of pixels.

Then, the organic light emitting display device according to the first exemplary embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2.

1 is a side view of an organic light emitting diode display according to a first exemplary embodiment of the present invention, and FIG. 2 is an equivalent circuit diagram of one pixel of an organic light emitting diode of an organic light emitting display according to the first exemplary embodiment of the present invention.

As shown in FIG. 1, the organic light emitting display device according to the first exemplary embodiment of the present invention includes an organic light emitting display panel 100 displaying an image, and a lower protective film attached under the organic light emitting display panel 100 ( 200).

The organic light emitting display panel 100 includes a flexible substrate 110, an organic light emitting device 120 formed on the flexible substrate 110, and a thin film encapsulation layer 130 covering the organic light emitting device 120 . The organic light emitting display panel 100 may be divided into a flat flat portion A and a bent portion B positioned at both ends of the flat portion A and bent.

The flexible substrate 110 may be formed of a flexible film such as polyimide.

As shown in FIG. 2, the organic light-emitting device 120 includes a plurality of signal lines 121, 171, and 172 and a plurality of pixels PX connected thereto and arranged in a substantially matrix form. .

The signal line includes a plurality of scan lines 121 for transmitting scan signals (or gate signals), a plurality of data lines 171 for transmitting data signals, and a plurality of driving voltage lines 172 for transmitting a driving voltage ELVDD do. The scan lines 121 extend substantially in a row direction and are substantially parallel to each other, and the data line 171 and the driving voltage line 172 extend substantially in a column direction and are substantially parallel to each other. Each pixel (PX) is a switching thin film transistor (T1), a driving thin film transistor (T2), a storage capacitor (Cst), and an organic light emitting diode. , OLED).

The switching thin film transistor T1 has a control terminal, an input terminal, and an output terminal, the control terminal is connected to the scan line 121, the input terminal is connected to the data line 171, and the output terminal is a driving thin film. It is connected to the transistor T2. The switching thin film transistor T1 transfers the data signal applied to the data line 171 to the driving thin film transistor T2 in response to the scan signal applied to the scan line 121.

The driving thin film transistor T2 also has a control terminal, an input terminal, and an output terminal. The control terminal is connected to the switching thin film transistor T1, the input terminal is connected to the driving voltage line 172, and the output terminal is organic. It is connected to a light emitting diode (OLED). The driving thin film transistor T2 flows an output current Id whose size varies depending on the voltage applied between the control terminal and the output terminal.

The storage capacitor CST is connected between the control terminal and the input terminal of the driving thin film transistor T2. The storage capacitor CST charges the data signal applied to the control terminal of the driving thin film transistor T2 and maintains it even after the switching thin film transistor T1 is turned off.

The organic light emitting diode (OLED) is an anode connected to the output terminal of the driving thin film transistor T2, a cathode connected to a common voltage (ELVSS), and an organic light emitting member formed between the anode and the cathode. Have. The organic light emitting diode OLED displays an image by emitting light by varying the intensity according to the output current Id of the driving thin film transistor T2.

The switching thin film transistor T1 and the driving thin film transistor T2 may be an n-channel field effect transistor (FET) or a p-channel field effect transistor. In addition, the connection relationship between the thin film transistors T1 and T2, the capacitor Cst, and the organic light emitting diode OLED may be changed.

Meanwhile, the thin film encapsulation layer 130 covering the organic light-emitting device 120 may protect the organic light-emitting device 120 by preventing oxygen and moisture from entering the organic light-emitting device 120 from outside.

The lower protective film 200 includes a support film 210 in contact with the flexible substrate 110 of the organic light emitting display panel 100, and a stress control layer 220 formed under the support film 210. .

The stress control layer 220 includes a plurality of stress control patterns 20 disposed adjacent to each other. The stress control pattern 20 includes a planar stress control pattern 21 formed at a position corresponding to the flat portion A, and a bending stress control pattern 22 formed at a position corresponding to the bending portion B. do.

By adjusting the spacing between the stress control patterns 20, the strain rate of the organic light emitting display panel 100 may be controlled, thereby reducing the stress of the bent portion B. That is, the bending interval P2 between the bending stress adjustment patterns 22 is formed smaller than the planar interval P1 between the planar stress adjustment patterns 21.

Specifically, the plane gap P1 or the bending gap P2 is a gap between the central axis 220a of the upper end of the stress control pattern 20, and the stress control pattern of the organic light emitting diode display according to the first embodiment is shown in FIG. 1. As shown, since it has a prism shape, its cross-section may have a triangular shape, and the lower ends 220b of the adjacent triangular-shaped stress control patterns 20 are directly connected to each other. The spacing of the triangular stress control pattern 20 is the spacing between the triangular vertices 220a.

In this way, the bending interval P2 between the bending stress control patterns 22 attached at a position corresponding to the bending portion B of the organic light emitting display panel 100 is reduced to minimize the stress of the bending portion of the organic light emitting display panel. can do. Accordingly, a screen abnormality can be eliminated by preventing an asymmetry of the strain rate of the bending portion of the organic light emitting display panel.

The lower protective film 200 may include any one material selected from UV epoxy-based, urethane acrylate-based, and acrylate-based.

In this way, by attaching the lower protective film 200 having the stress control layer 220 under the organic light emitting display panel 100, physical damage to the flexible substrate 110 of the organic light emitting display panel 100 is prevented. At the same time, by minimizing the stress of the bending portion B of the organic light emitting display panel 100, an asymmetry of the strain rate of the bending portion B is prevented, thereby removing a screen abnormality.

Meanwhile, a shape change prevention layer 300 for preventing a shape change of the stress control layer 220 may be attached under the lower protective film 200.

3 is a graph of a defect incidence rate according to a bending speed of the organic light emitting display device according to the first embodiment of the present invention and the conventional organic light emitting display device.

The defect incidence rate in FIG. 3 refers to the rate at which a problem occurs in image quality when 10 organic light emitting displays are bent with a radius of curvature of 3 mm, and a value of 10% if an abnormality occurs in one of the 10 organic light emitting displays when bent. Have. The speed of FIG. 3 indicates how fast the OLED display is bent, and the faster the OLED display is bent, the greater force is transmitted and the OLED display is damaged.

As shown in FIG. 3, in the conventional organic light-emitting display device X1, as the bending speed increases, the defect occurrence rate rapidly increases, so that 100% defects occur at a speed of 150 mm/s or more. However, it can be seen that the organic light emitting display device X2 according to the first embodiment of the present invention maintains a defect incidence rate of 40% or less even when the bending speed is 150 mm/s or more. As described above, the organic light emitting display device X2 according to the first exemplary embodiment of the present invention can be seen that the defect occurrence rate is reduced even when the organic light emitting display device X2 is bent at a higher speed than that of the conventional organic light emitting display device X1.

The method of manufacturing the organic light emitting display device according to the first exemplary embodiment of the present invention will be described in detail with reference to FIGS. 4 to 6.

4 to 6 are views sequentially illustrating a method of manufacturing an organic light emitting diode display according to the first exemplary embodiment of the present invention.

First, as shown in FIG. 4, a lower protective film 200 is manufactured. The lower protective film 200 includes a support film 210, a stress control layer 220 formed under the support film 210, and a release film 230 covering the stress control layer 220. The stress control layer 220 includes a plurality of stress control patterns 20 disposed adjacent to each other.

Then, a lower protective film 200 is attached under the flexible substrate 110. In addition, the organic light-emitting device 120 and the thin film encapsulation layer 130 are sequentially formed on the flexible substrate 110 to complete the organic light-emitting display panel 100.

In this way, without first exposing the stress control layer 220 of the lower protective film 200, the stress control layer 220 is covered with the release film 230 to flatten the lower protective film 200 to form an organic light-emitting display panel. By completing (100), it is possible to prevent a decrease in the recognition rate of the alignment mark due to optical scattering by the stress control pattern 20 of the lower protective film 200 during the manufacturing process.

In addition, when the chip-on film (COF) is pressed onto the organic light emitting display panel 100 while the stress control layer 220 of the lower protective film 200 is exposed, the bonding force is lowered, resulting in poor bonding. Although the frequency of occurrence may increase, according to the manufacturing method of the organic light emitting display device according to the first embodiment of the present invention, the stress control layer 220 is covered with a release film 230 to make the lower protective film 200 flat. By compressing a chip-on film (COF) on the organic light-emitting display panel 100 in one state, it is possible to prevent a decrease in compression force and reduce the frequency of occurrence of defective bonding.

Next, as shown in FIG. 5, the release film 230 is separated from the lower protective film 200 to expose the stress control layer 220. In this case, an empty space is generated between the stress control patterns 20 adjacent to the stress control layer 220.

Next, as illustrated in FIG. 6, a part of the organic light emitting display panel 100 is bent to form a bent portion B. In this case, an empty space between the bending stress control patterns 22 of the stress control layer 220 attached to a position corresponding to the bending portion B is reduced.

Therefore, the bending gap P2 between the bending stress control patterns 22 of the stress control layer 220 attached at a position corresponding to the bending part B corresponds to the flat part A of the organic light emitting display panel 100 It becomes smaller than the planar spacing P1 between the planar stress control patterns 21 of the stress control layer 220 attached to the location. In this case, the plane gap P1 or the bending gap P2 may be a gap between the central axes 220a of the upper end of the stress control pattern 20.

Meanwhile, in the first embodiment, the lower ends of the adjacent triangular-shaped stress control patterns are directly connected to each other, but a second embodiment in which the lower ends of the adjacent triangular-shaped stress control patterns are spaced apart and connected by a predetermined interval is also possible.

Hereinafter, an organic light emitting display device according to a second exemplary embodiment of the present invention will be described in detail with reference to FIG. 7.

7 is a side view of an organic light emitting diode display according to a second exemplary embodiment of the present invention.

The second embodiment is substantially the same as compared to the first embodiment shown in FIGS. 1 and 2 except for the spacing of the lower end of the stress control pattern of the lower protective film, so a repeated description will be omitted.

7, the stress control pattern 20 of the organic light emitting diode display according to the second embodiment of the present invention has a triangular shape, and the lower end 220b of the adjacent triangular stress control pattern 20 is They are separated by a predetermined distance (d) and connected. The stress control pattern 20 having this shape may further minimize the stress generated in the bending portion B.

Meanwhile, in the first embodiment, the triangular stress control pattern is formed, but the third and fourth embodiments in which the trapezoidal stress control pattern is formed are also possible.

Hereinafter, the organic light emitting display device according to the third and fourth embodiments of the present invention will be described in detail with reference to FIGS. 8 and 9.

8 is a side view of an organic light emitting diode display according to a third exemplary embodiment of the present invention, and FIG. 9 is a side view of an organic light emitting display according to the fourth exemplary embodiment of the present invention.

The third and fourth embodiments are substantially the same as compared to the first and second embodiments shown in FIGS. 1 and 7 except for the shape of the stress control pattern of the lower protective film. Omit it.

First, as shown in FIG. 8, the stress control pattern 20 of the organic light emitting diode display according to the third embodiment of the present invention has a trapezoidal shape, and the lower end 220b of the adjacent trapezoidal stress control pattern 20 ) Are directly connected to each other. The gaps P1 and P2 of the trapezoidal stress control pattern 20 are the gaps between the central axes 220a of the upper end of the trapezoidal shape.

In addition, as shown in FIG. 9, the stress control pattern 20 of the organic light emitting diode display according to the fourth embodiment of the present invention has a trapezoidal shape, and the lower end 220b of the adjacent trapezoidal stress control pattern 20 ) Are connected by being spaced apart by a predetermined distance (d). The gaps P1 and P2 of the trapezoidal stress control pattern 20 are the gaps between the central axes 220a of the upper end of the trapezoidal shape.

The trapezoidal stress control pattern 20 shown in FIGS. 8 and 9 can further minimize the stress generated in the bending portion B compared to the triangular stress control pattern 20 shown in FIGS. 1 and 7. I can.

10 is a comparative graph of stress of the organic light emitting diode display according to the first to fourth embodiments of the present invention.

As shown in Fig. 10, the tensile stress and compression of the third and fourth embodiments including a trapezoidal stress control pattern compared to the first and second embodiments including a triangular stress control pattern It can be seen that the stress is reduced.

In addition, the tensile stress and compressive stress of the second embodiment, in which the lower ends between the stress control patterns are connected by a predetermined distance, are reduced compared to the first embodiment in which the lower ends between the stress control patterns are directly connected, and the lower ends between the stress control patterns are directly connected. It can be seen that the tensile stress and compressive stress of the fourth exemplary embodiment connected by being spaced apart from each other by a predetermined distance between the stress control patterns are reduced.

Meanwhile, in the first embodiment, a triangular stress control pattern is formed, but a fifth embodiment in which a semicircular stress control pattern is formed is also possible.

Hereinafter, an organic light emitting diode display according to a fifth exemplary embodiment of the present invention will be described in detail with reference to FIG. 11.

11 is a side view of an organic light emitting diode display according to a fifth exemplary embodiment of the present invention.

The fifth embodiment is substantially the same as the first embodiment shown in FIGS. 1 and 2 except for the shape of the stress control pattern of the lower protective film, and thus a repeated description will be omitted.

11, the stress control pattern 20 of the organic light emitting diode display according to the fifth embodiment of the present invention has a semicircular shape, and the lower end 220b of the adjacent semicircular stress control pattern 20 is They are separated by a predetermined distance (d) and connected. The stress control pattern 20 having this shape may further minimize the stress generated in the bending portion B.

Meanwhile, in the first embodiment, a stress control pattern is formed on all portions of the lower protective film, but a sixth embodiment in which the stress control pattern is not formed on a part of the lower protective film is also possible.

Hereinafter, an organic light emitting display device according to a sixth exemplary embodiment of the present invention will be described in detail with reference to FIG. 12.

12 is a side view of an organic light emitting diode display according to a sixth exemplary embodiment of the present invention.

The sixth embodiment is substantially the same as that of the first embodiment shown in FIGS. 1 and 2 except for the stress control pattern of the lower protective film, so a repeated description will be omitted.

As shown in FIG. 12, the lower protective film 200 of the organic light emitting display device according to the sixth exemplary embodiment of the present invention includes a support film in contact with the flexible substrate 110 of the organic light emitting display panel 100. 210), a stress control layer 220 formed under the support film 210, and a planar protective layer 240 formed under the support film 210 and adjacent to the stress control layer 220.

The stress control layer 220 includes a plurality of stress control patterns 20 disposed adjacent to each other. The stress control pattern 20 includes a planar stress control pattern 21 formed at a position corresponding to the flat portion A, and a bending stress control pattern 22 formed at a position corresponding to the bending portion B. do. By adjusting the spacing between the stress control patterns 20, the strain rate of the organic light emitting display panel 100 may be controlled, thereby reducing the stress of the bent portion B. That is, the bending interval P2 between the bending stress adjustment patterns 22 is formed smaller than the planar interval P1 between the planar stress adjustment patterns 21.

At this time, since the planar protective layer 240 is formed in most of the positions corresponding to the flat portion A that is not bent, and the bending stress control pattern 22 is formed only at the position corresponding to the bending portion B. , The lower protective film 200 for protecting the organic light emitting display panel 100 from the outside may be faithfully performed.

In the above, preferred embodiments of the present invention have been described, but the present invention is not limited thereto, and it is possible to implement various modifications within the scope of the claims, the detailed description of the invention, and the accompanying drawings. It is natural to fall within the scope of

100: organic light emitting display panel
200: lower protective film
210: support film
220: stress control layer
240: planar protective layer

Claims (8)

An organic light emitting display panel including a flat portion and a bent portion positioned on at least one side of the flat portion and bent, and
A lower protective film attached under the organic light emitting display panel
Including,
The lower protective film includes at least a stress control layer corresponding to the bending portion and including a stress control pattern, and a planar protective layer corresponding to the flat portion and does not include a stress control pattern,
The stress control layer and the planar passivation layer are integrally formed. The method of claim 1,
The lower protective film further includes a support film in contact with the organic light-emitting display panel and positioned on the stress control layer,
The stress control layer and the planar passivation layer are adjacent to each other. The method of claim 2,
The planar passivation layer is formed on at least a part of a position corresponding to the planar part. delete An organic light emitting display panel including a flat portion and a bent portion positioned on at least one side of the flat portion and bent, and
A lower protective film attached under the organic light emitting display panel
Including,
The lower protective film is
A first portion corresponding to the flat portion and including a planar stress control pattern, and
An organic light emitting diode display device including a second portion corresponding to the bending portion and including a bending stress control pattern. The method of claim 5,
The bending stress control pattern is any one of a triangular shape, a trapezoidal shape, or a semicircular shape. The method of claim 5,
The organic light emitting diode display device of claim 1, wherein the bending interval between the bending stress adjustment patterns or the plane interval between the planar stress adjustment patterns is an interval between the bending stress adjustment pattern or a central axis of an upper end of the planar stress control pattern. The method of claim 1,
The organic light emitting display panel
A flexible substrate attached to the lower protective film,
An organic light-emitting device formed on the flexible substrate, and
An organic light emitting display device comprising a thin film encapsulation layer covering the organic light emitting device.

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