KR102000006B1 - 열경화성 수지 조성물 - Google Patents

열경화성 수지 조성물 Download PDF

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Publication number: KR102000006B1
Authority: KR; South Korea
Prior art keywords: resin composition; thermosetting resin; solder; less; viscosity
Prior art date: 2012-02-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

KR1020130010150A

Other languages

English (en)

Korean (ko)

Other versions

KR20130097099A (ko

Inventor

타카시 나카바야시

토시히코 카키타

준 아오키

코이치 이시가키

요시노부 스기사와

Original Assignee

가부시키가이샤 다무라 세이사쿠쇼

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-02-23

Filing date

2013-01-30

Publication date

2019-07-15

2013-01-30 Application filed by 가부시키가이샤 다무라 세이사쿠쇼 filed Critical 가부시키가이샤 다무라 세이사쿠쇼

2013-09-02 Publication of KR20130097099A publication Critical patent/KR20130097099A/ko

2019-07-15 Application granted granted Critical

2019-07-15 Publication of KR102000006B1 publication Critical patent/KR102000006B1/ko

Status Expired - Fee Related legal-status Critical Current

2033-01-30 Anticipated expiration legal-status Critical

Images

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- H10W72/20—

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Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Compositions Of Macromolecular Compounds (AREA)
Adhesives Or Adhesive Processes (AREA)
Non-Metallic Protective Coatings For Printed Circuits (AREA)

KR1020130010150A 2012-02-23 2013-01-30 열경화성 수지 조성물 Expired - Fee Related KR102000006B1 (ko)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JPJP-P-2012-037815		2012-02-23
JP2012037815A JP5869911B2 (ja)	2012-02-23	2012-02-23	熱硬化性樹脂組成物

Publications (2)

Publication Number	Publication Date
KR20130097099A KR20130097099A (ko)	2013-09-02
KR102000006B1 true KR102000006B1 (ko)	2019-07-15

Family

ID=49091171

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020130010150A Expired - Fee Related KR102000006B1 (ko)	2012-02-23	2013-01-30	열경화성 수지 조성물

Country Status (3)

Country	Link
JP (1)	JP5869911B2 (ja)
KR (1)	KR102000006B1 (ja)
CN (1)	CN103289621A (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5692314B2 (ja) *	2013-09-03	2015-04-01	千住金属工業株式会社	バンプ電極、バンプ電極基板及びその製造方法
JP6407684B2 (ja) *	2014-11-28	2018-10-17	日東電工株式会社	シート状樹脂組成物、積層シート及び半導体装置の製造方法
WO2016104276A1 (ja) *	2014-12-26	2016-06-30	積水化学工業株式会社	導電ペースト、接続構造体及び接続構造体の製造方法
JP6770509B2 (ja) *	2015-03-31	2020-10-14	ナミックス株式会社	樹脂組成物、導電性樹脂組成物、接着剤、導電性接着剤、電極形成用ペースト、半導体装置
CN107636772A (zh) *	2015-08-24	2018-01-26	积水化学工业株式会社	导电材料以及连接结构体
JP6444953B2 (ja) *	2015-09-30	2018-12-26	株式会社タムラ製作所	フラックス組成物およびソルダペースト
CN105633047B (zh) *	2016-03-10	2018-07-06	三星半导体(中国)研究开发有限公司	半导体封装件及其制造方法
KR101692668B1 (ko) *	2016-03-10	2017-01-04	(주)호전에이블	칙소성이 우수한 에폭시 플럭스 페이스트 조성물
JP6452659B2 (ja) *	2016-09-28	2019-01-16	株式会社タムラ製作所	熱硬化性フラックス組成物および電子基板の製造方法
JP6502910B2 (ja) *	2016-10-28	2019-04-17	株式会社タムラ製作所	リフロー装置
JP6557694B2 (ja) *	2017-03-16	2019-08-07	株式会社タムラ製作所	熱硬化性フラックス組成物および電子基板の製造方法
KR101965620B1 (ko) *	2017-11-07	2019-04-03	(주)호전에이블	방열성 에폭시 플럭스 필름 및 이를 이용한 솔더링 방법
CN111356715B (zh) *	2017-11-14	2023-05-23	株式会社弘辉	补强用树脂组合物及电子零件装置
KR102101345B1 (ko) *	2018-06-27	2020-04-16	(주)호전에이블	접착성능이 우수한 솔더 페이스트 조성물
CN113454140B (zh) *	2019-02-26	2023-12-08	富士胶片株式会社	内窥镜用粘接剂及其固化物、以及内窥镜及其制造方法
CN112735956A (zh) *	2019-10-14	2021-04-30	昇贸科技股份有限公司	一种封装组件焊接于电路基板的方法及热固性树脂组合物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2003059970A (ja)	2001-08-08	2003-02-28	Matsushita Electric Ind Co Ltd	電子部品実装構造および電子部品実装方法
JP2003100810A (ja) *	2001-09-27	2003-04-04	Toshiba Corp	半導体装置とその製造方法
JP2011129694A (ja) *	2009-12-17	2011-06-30	Tamura Seisakusho Co Ltd	はんだ接合補強剤組成物、及びこれを用いた実装基板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3644340B2 (ja) *	1999-02-18	2005-04-27	株式会社スリーボンド	エポキシ樹脂組成物
EP1852452A1 (en) *	2005-02-23	2007-11-07	Asahi Kasei Chemicals Corporation	Latent hardener for epoxy resin and epoxy resin composition
WO2010050185A1 (ja) *	2008-10-27	2010-05-06	パナソニック株式会社	半導体の実装構造体およびその製造方法
JP5463328B2 (ja) *	2010-09-16	2014-04-09	株式会社タムラ製作所	パッケージ部品の接合方法およびその方法に用いる熱硬化性樹脂組成物

2012
- 2012-02-23 JP JP2012037815A patent/JP5869911B2/ja not_active Expired - Fee Related
2013
- 2013-01-30 KR KR1020130010150A patent/KR102000006B1/ko not_active Expired - Fee Related
- 2013-01-31 CN CN2013100383678A patent/CN103289621A/zh active Pending

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2003059970A (ja)	2001-08-08	2003-02-28	Matsushita Electric Ind Co Ltd	電子部品実装構造および電子部品実装方法
JP2003100810A (ja) *	2001-09-27	2003-04-04	Toshiba Corp	半導体装置とその製造方法
JP2011129694A (ja) *	2009-12-17	2011-06-30	Tamura Seisakusho Co Ltd	はんだ接合補強剤組成物、及びこれを用いた実装基板の製造方法

Also Published As

Publication number	Publication date
CN103289621A (zh)	2013-09-11
JP5869911B2 (ja)	2016-02-24
KR20130097099A (ko)	2013-09-02
JP2013173819A (ja)	2013-09-05

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2013-01-30	PA0109	Patent application	St.27 status event code: A-0-1-A10-A12-nap-PA0109
2013-09-02	PG1501	Laying open of application	St.27 status event code: A-1-1-Q10-Q12-nap-PG1501
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2018-12-07	D14-X000	Search report completed	St.27 status event code: A-1-2-D10-D14-srh-X000
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2019-04-10	P13-X000	Application amended	St.27 status event code: A-2-2-P10-P13-nap-X000
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