KR101311582B1 - Organic Electroluminescent Device and method for fabricating thereof - Google Patents

Abstract

The present invention discloses an organic light emitting display device.

The disclosed organic light emitting display device has an effect of blocking external moisture penetration and gas inflow by bonding the upper and lower substrates of the organic light emitting display device to a seal line and covering the entire bonded upper and lower substrates with a capsule film.

OLED display device, seal line, capsule film, bonding

Description

Organic electroluminescent display and manufacturing method thereof

The present invention relates to an organic light emitting display.

Recently, studies are being actively conducted to increase the display quality of a flat panel display device and attempt to make a large screen. Among these, the electroluminescent display device is a self-luminous element that emits light by itself. The electroluminescent display displays a video image by exciting a fluorescent material using carriers such as electrons and holes. The electroluminescent display is largely divided into an inorganic electroluminescent display and an organic electroluminescent display according to the material used. The organic electroluminescent display is driven at a lower voltage of about 5 to 20 volts than the inorganic electroluminescent display requiring a high voltage of 100 to 200 volts, thereby allowing direct current low voltage driving.

In addition, the organic electroluminescent display has excellent features such as wide viewing angle, high speed response, high contrast ratio, and the like, such as pixels of graphic displays, television image displays or surface light sources. It is suitable for next generation flat panel display because it is thin, light and good color.

On the other hand, a passive matrix type (Passive matrix type) that does not have a separate thin film transistor is mainly used as a driving method of such an organic light emitting display device. Since the passive matrix method has many limitations such as resolution, power consumption, and lifespan, an active matrix type electroluminescent display device for manufacturing next-generation displays requiring high resolution and a large screen has recently been researched and developed.

However, the active matrix type electroluminescent display device penetrates external moisture or gas because a single seal line is formed on a substrate formed with a thin film transistor (TFT) and an organic light emitting layer using an ultraviolet sealant, and then the two substrates are bonded together. There is an easy disadvantage.

In addition, an additional material such as a moisture absorbent may be formed inside the substrate to prevent external moisture or gas penetration, but this has the disadvantage of thickening the device. In addition, the use of such a moisture absorbent is limited to the fundamental moisture permeation prevention.

The present invention provides an organic light emitting display device which blocks external moisture penetration and inflow of gas by bonding upper and lower substrates of an organic light emitting display device to a seal line and covering the entire bonded upper and lower substrates with a capsule film. The purpose is to provide a method.

In order to achieve the above object, an organic light emitting display device according to an embodiment of the present invention, the first substrate; A second substrate; An organic light emitting layer formed on the first substrate; A thin film transistor formed on the second substrate; A seal line formed to bond the first substrate and the second substrate; And a capsule film formed to surround the front, rear, and side surfaces of the bonded first and second substrates.

Further, a method of manufacturing an organic light emitting display device according to an embodiment of the present invention includes the steps of providing a first substrate; Providing a second substrate; Forming a seal line on either the first substrate or the second substrate, and then bonding the two substrates together; And forming a capsule film on front, rear, and side regions of the substrate bonded by the seal line.

As described in detail above, the present invention prevents external moisture penetration and gas inflow by bonding the upper and lower substrates of the organic light emitting display device with a seal line and covering the entire bonded upper and lower substrates with a capsule film. It works.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

In the present invention, the upper and lower substrates of the organic light emitting display device are bonded to each other with a seal line, and the entire bonded upper and lower substrates are enclosed in a capsule film to block external moisture ingress and gas inflow.

In addition, in the description of the embodiment, each layer (film), region, pattern or structures may be on or below the "on / above / over / upper" of the substrate, each layer (film), region, pad or pattern. down / below / under / lower) ", the meaning is that each layer (film), region, pad, pattern or structure is a direct substrate, each layer (film), region, pad or pattern It may be interpreted as being formed in contact with the other, and may be interpreted as another layer (film), another region, another pad, another pattern, or another structure additionally formed therebetween. Therefore, the meaning should be judged by the technical idea of the invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A to 1E are cross-sectional views illustrating a manufacturing process of an organic light emitting display device according to a first embodiment of the present invention.

As shown in FIG. 1A, a metal film is formed on the first insulating substrate 100, and then a gate electrode 201, a power wiring 411, and a first dummy pattern 413a are formed. In this case, the metal film may be AlNd or a double metal film of AlNd and Mo.

Next, a gate insulating layer 102 is formed on the entire surface of the first insulating substrate 100, and an amorphous silicon film, a doped amorphous silicon film, and a metal film are subsequently formed on the entire surface of the first insulating substrate 100. Next, the source / drain electrodes 203a and 203b, the ohmic contact layer and the channel layer, and the active layer 202 and the data line (not shown) are simultaneously formed by etching according to a diffraction mask or a halftone mask process. The metal film may use Mo or its alloy, Cu or its alloy.

In this case, second and third dummy patterns 413b and 413c formed of an active layer and a source / drain metal layer are formed on the first dummy pattern 413a. In addition, a mask process for forming the active layer 202 and a mask process for forming the source / drain electrodes 203a and 203b may be performed without using a diffraction mask or a halftone mask, respectively.

As described above, when the thin film transistor Tr including the gate electrode 201, the active layer 202, and the source / drain electrodes 203a and 203b is formed, as illustrated in FIG. 1B, the first insulating substrate 100 is formed. A protective film 109 is formed on the entire surface, and then a contact hole process is performed by a photolithography method including a mask to expose a part of the drain electrode 203b and a part of the power supply wiring 411. . Although not shown in the drawing, the gate pad region and the data pad region are also etched to expose a portion of the gate pad and the data pad.

When the contact hole process is completed on the passivation layer 109 as described above, as shown in FIG. 1C, a metal layer is formed on the first insulating substrate 100 and then patterned to electrically connect with the drain electrode 203b. A contact portion 204 to be contacted is formed, and a power electrode 412 electrically contacting the power wiring 411 is formed.

When the lower substrate 110 of the organic light emitting display device is completed by the above process, as shown in FIG. 1D, the upper substrate 130 including the organic light emitting layer is bonded while corresponding to the lower substrate 110. Proceed with the process.

The upper substrate 130 has a bus line (auxiliary electrode) 305 formed on the second insulating substrate 101 having a conductive metal pattern, and is formed on the second insulating substrate 101 on which the bus line 305 is formed. The first electrode 310 is formed.

The sub pixel area is partitioned by the first buffer layer 215 and the partition wall 225 formed on the first buffer layer 215 on the second insulating substrate 101 on which the first electrode 310 is formed. In addition, the second buffer layer 306 and the first and second column spacers on the second buffer layer 306 to electrically contact the electrode of the upper substrate 130 and the thin film transistor Tr of the lower substrate 110. 335a and 335b are formed.

In addition, the organic light emitting layer 320 and the second electrode 330 are formed on the first electrode 310 in the sub pixel region. Therefore, the first electrode 310, the organic light emitting layer 320, and the second electrode 330 in the sub pixel region form the organic light emitting diode E.

The organic light emitting layer 320 may be formed of red (R), green (G), and blue (B) color organic light emitting layers in each subpixel unit, and the organic light emitting layer formed in each subpixel unit may be R. , G, B organic electroluminescent layer may be stacked to form an organic electroluminescent layer capable of generating white light. In this case, when the R, G, and B organic light emitting layers are stacked to generate white light, R, G, and B color filters may be further formed on the lower substrate or the upper substrate in units of subpixels. In addition, the organic electroluminescent layer may be formed as a single layer of a white organic electroluminescent layer, and in this case, R, G, and B color filters may be formed on the lower substrate 110 or the upper substrate 130 in units of subpixels. It can form more. According to the color filter formed in the lower substrate 110 or the upper substrate 130, the organic light emitting display device is driven by the lower light emitting method or the upper light emitting method.

The contact electrode 340 formed on the second column spacer 335b, the first electrode 310 may include a power wiring 411 and a power electrode 412 of the lower substrate 110 receiving the power voltage. It is electrically contacted. Therefore, a power supply voltage can be supplied from the lower substrate 110 to the upper substrate 130. In this case, the contact electrode 340 is simultaneously patterned when the second electrode 330 is formed.

When the upper substrate 130 and the lower substrate 110 is completed as described above, after applying the sealant on any one of the upper substrate 130 or the lower substrate 110, and then the upper substrate 130 and the lower substrate The 110 is bonded together and irradiated with ultraviolet (UV) light (sealant curing step) to form the seal line 600. The seal line 600 may use a thermosetting material such as a frit sealant.

 When the lower substrate 110 and the upper substrate 130 are bonded by the seal line 600 as described above, as shown in FIG. 1E, the capsule layer 650 is formed on the entire bonded substrate using a transparent sealant solution. Form. Accordingly, the entirety of the outer front, rear, and side regions of the bonded substrate is coated with the capsule film 650. The front surface of the bonded substrate is the outer surface of the upper substrate 130, the rear surface is the outer surface of the lower substrate 110, the side is in the state in which the two substrates are bonded to the side around the corner. This applies as is in the following description. The method of forming the capsule layer 650 may be formed by applying the forming method of FIGS. 3 to 5.

Since the upper substrate 130 and the lower substrate 110 are manufactured in different sizes, the thickness of the capsule layer 650 is formed in the edge side region of the bonded substrate to further improve the sealing characteristics. have.

The capsule layer 650 is a fluorine resin-based sealant, and may be made of a material that is capable of low temperature curing and has excellent adhesion to glass. The fluororesin-based material uses an amorphous fluoropolymer or fluorothermoplastics in solution. The materials have a transmittance of 95% or more, and the curing process may be performed at a temperature of about 100 ° C., thereby forming the capsule membrane 650 in a low temperature state. Thus, it does not affect the elements inside the bonded substrate.

Since the capsule layer 650 has a hydrophobic characteristic, it can effectively block moisture or oxygen infiltration, thereby improving hermetic sealing of the organic light emitting display device.

In addition, since the capsule film 650 is applied to the entire area of the bonded substrate, microcavity characteristics and low reflection characteristics can be realized, and image quality can be improved. In addition, since the entire structure of the bonded substrate is wrapped, it is possible to prevent damage to the device due to vibration or external impact.

2 is a cross-sectional view illustrating a structure of an organic light emitting display device according to a second embodiment of the present invention. The substrates shown in FIG. 2 have the same structure as the upper and lower substrates shown in FIG. 1E. Therefore, the same reference numerals designate the same components, and thus detailed description thereof will be omitted.

The widths of the second insulating substrate 101 of the upper substrate 130 and the first insulating substrate 100 of the lower substrate 110 of FIG. 2 are formed to have the same width, and the bonded upper substrate 130 The capsule layer 680 is formed on the entire area of the lower substrate 110. As described above, the present invention can be applied to the case where the panel size of the organic light emitting display device or the width of the upper substrate 130 and the lower substrate 110 are different.

1E and 2, the organic light emitting layer 320 is formed on the upper substrate 130, and the TFT is formed on the lower substrate 110, but the TFT and the organic light emitting layer are formed on the lower substrate 110. The same applies to the top emission type or the bottom emission type organic light emitting display device, both of which are formed.

That is, the sealing line may be formed by first forming a seal line for bonding the substrate and forming a capsule film to surround the entire bonded substrate.

3 to 5 are views for explaining a method of forming a capsule film of the organic light emitting display device of the present invention.

3 to 5 illustrate a process of forming a capsule film formed on an entire substrate bonded in an organic light emitting display device, and FIG. 3 illustrates a method of forming a capsule film by dipping an organic field panel in a sealant in a solution form. 4 is a process of forming a capsule film by coating the entire surface of a sealant with a dispenser or printing, etc., and FIG. 5 is a process of forming a capsule film by spin coating the organic field panel.

FIG. 3 illustrates dipping an organic field panel bonded by a seal line into a container containing a sealant in a solution state to form a capsule film in an entire region of the organic field panel. Then, a low temperature heat treatment process (curing: about 100 ℃) is carried out to cure the capsule film.

FIG. 4 forms a seal line on the substrate, bonds it, and then mounts the organic field panel on the base B. Then, the sealant is dispensed to the entire area of the organic field panel using a mechanism such as a dispenser. The capsule film is on the front and back and side surfaces of the organic field panel. Then, a low temperature heat treatment process is performed to cure the capsule film. However, a capsule film may be formed by applying an inkjet method or a printing method.

FIG. 5 illustrates a nozzle capable of injecting a sealant on the bonded organic field panel, and rotating the organic field panel while spraying a sealant in a solution state from the nozzle to coat the capsule layer on the front surface. Then, the organic field panel is placed on the back side, and the same process is repeated to form a capsule film on the entire organic field panel. Thereafter, a low temperature heat treatment process is performed to cure the capsule film.

6 is a cross-sectional view illustrating a structure of an organic light emitting display device according to a third embodiment of the present invention.

6, the upper substrate 701 may be the same as the components formed on the upper substrate 130 of FIG. 1, and the lower substrate 700 may be the same as the components formed on the lower substrate 110 of FIG. 1. . In addition, the TFT may be a substrate on which the TFT and the organic light emitting layer are formed. In addition, the bonded upper substrate 701 and the lower substrate 700 may be substantially the same as the structures of the top emission type or the bottom emission type organic light emitting display device.

In addition, the upper substrate 701 may be a color filter substrate, and the lower substrate 700 may be an array substrate on which thin film transistorized pixel electrodes are formed, and may be a liquid crystal display device. In addition, a liquid crystal layer may be interposed between the upper substrate 701 and the lower substrate 700.

The upper substrate 701 and the lower substrate 700 are bonded by a seal line 720, and the seal line is a UV real hardening material and a thermosetting real material (V ₂ O ₅ , PbO, B ₂ O ₃ -ZnO, SiO). ₂ series materials) and metal materials can be used. Widths of the upper substrate 701 and the lower substrate 700 may have different widths or the same width, and the capsule layer 750 is formed on the front and rear surfaces and four sides of the bonded substrate to seal lines 720. ) And a capsule film 750 is formed in the region adjacent to the ().

As shown in FIG. 6, a capsule film 750 is formed on the entire surface of the substrate bonded to the seal line 720. The capsule layer 750 may use a transparent epoxy resin or a transparent silicone material.

In addition, the method of forming the capsule layer 750 may be applied to the process described with reference to FIGS. 3 to 5.

FIG. 7 is a cross-sectional view illustrating a structure of an organic light emitting display device according to a fourth exemplary embodiment of the present invention. As shown in FIG. 7, the upper substrate 801 and the lower substrate 820 are referred to as the first seal line 820. After bonding, a second seal line 821 was formed on the side of the bonded substrate, and a capsule film 823 was formed to cover the entire region of the finally bonded substrate.

The first seal line 820 may use the ultraviolet ray hardening material, the thermosetting material, or the metal material described above. In addition, the second seal line 821 may also be an ultraviolet ray hardening material, a thermosetting material or a metal material. The first seal line 820 and the second seal line 821 may use different materials. For example, when the first seal line 820 is formed of an ultraviolet ray hardening material, the second seal line 821 may be a thermosetting material or a metal material.

When the substrates are bonded by the two seal lines as described above, the capsule layer 823 is formed to cover the entire region of the bonded substrates. The process of forming the capsule film 823 is formed by applying the processes of FIGS. 3 to 5.

Therefore, in the present invention, by coating the entire area of the substrate bonded with a capsule film made of a transparent material, it is possible to protect the device against external moisture, vibration and shock.

1A to 1E are cross-sectional views illustrating a manufacturing process of an organic light emitting display device according to a first embodiment of the present invention.

2 is a cross-sectional view illustrating a structure of an organic light emitting display device according to a second embodiment of the present invention.

3 to 5 are views for explaining a method of forming a capsule film of the organic light emitting display device of the present invention.

6 is a cross-sectional view illustrating a structure of an organic light emitting display device according to a third embodiment of the present invention.

7 is a cross-sectional view illustrating a structure of an organic light emitting display device according to a fourth embodiment of the present invention.

Description of the Related Art [0002]

110: lower substrate 130: upper substrate

203a: source electrode 203b: drain electrode

204: contact portion 411: power supply wiring

600: seal line 650: capsule film

Claims (11)

A first substrate; A second substrate; An organic light emitting layer formed on the first substrate; A thin film transistor formed on the second substrate; A seal line formed to bond the first substrate and the second substrate; And It includes a capsule film formed to surround the entire front and rear and side surfaces of the bonded first and second substrates, And the capsule layer has a transmittance of 95% or more. The display device of claim 1, wherein the first substrate comprises an electrode formed to supply power to the organic light emitting layer, a column spacer for electrical contact with a thin film transistor of a second substrate, and the organic light emitting layer on a subpixel basis. The organic light emitting display device further comprises a partition wall. The organic light emitting display device of claim 1, wherein the seal line is formed of any one of an ultraviolet ray material, a thermosetting material, and a metal material. The organic light emitting display device of claim 1, wherein the capsule layer is a fluorine resin-based sealant. delete The organic light emitting display device of claim 1, wherein a width of one of the first substrate and the second substrate is relatively narrow. Providing a first substrate; Providing a second substrate; Forming a seal line on either the first substrate or the second substrate, and then bonding the two substrates together; And Forming a capsule film to surround the entire front and rear and side surfaces of the substrate bonded by the seal line, The capsule film forming process uses any one of a method of dipping the bonded substrate into a sealant in a solution state, a method of dispensing a sealant solution on the bonded substrate, a printing method, and a spin coating method. An organic light emitting display device manufacturing method characterized in that. delete delete delete The method of claim 7, wherein the capsule layer is a fluorine resin-based sealant.

Images