KR101176819B1 - Ambient light and proximity sensor package and method for manufacturing thereof - Google Patents

Abstract

The present invention relates to a sensor capable of sensing illuminance and proximity, and more particularly, to an illuminance-proximity sensor package comprising a light emitting part and a light receiving part, and a method of manufacturing the same.
The illuminance-proximity sensor package of the present invention is configured such that the influence of crosstalk by disturbance light and reflector is shielded, the light-transmissive substrate including a light emitting portion region, a light receiving portion region and a protruding wall therebetween, and a pattern printed thereon; A light-emitting element and a light-receiving element mounted on the light-emitting portion and the light-receiving portion, respectively, of the substrate, a light-transmissive coating covering the light-emitting element and the light-receiving element, and an opaque covering to a portion except for the active region of the light-emitting portion and the light-receiving portion. And a housing.
The conventional illuminance and proximity sensor package can block the influence of crosstalk caused by disturbance light and reflector due to the exposure of the internal gate generated during the manufacturing of the double mold, and can simplify the operation than the double mold type manufacturing process. Can be.

Description

Ambient light and proximity sensor package and manufacturing method {AMBIENT LIGHT AND PROXIMITY SENSOR PACKAGE AND METHOD FOR MANUFACTURING THEREOF}

The present invention relates to a sensor capable of sensing illuminance and proximity, and more particularly, to an illuminance-proximity sensor package comprising a light emitting part and a light receiving part, and a method of manufacturing the same.

Recently, the use of a light sensor and a proximity sensor in a portable device is increasing. For example, in a mobile phone, the ambient light sensor detects the brightness of the surrounding environment and adjusts the brightness of the display, while the proximity sensor detects that the face is approaching during a call, thereby reducing the consumption of the battery or in particular the touch display. In this case, the display can be turned off automatically so as to prevent a malfunction caused by contact with the face.

In order to reduce the size of the device, the light sensor and the proximity sensor are being configured in one package. The illuminance sensor may be implemented by a semiconductor light receiving device such as a photodiode, and the proximity sensor may be implemented by a combination of a light emitting device such as a light emitting diode and a light receiving device. Therefore, by arranging the light emitting element and the light receiving element on one substrate, it is possible to construct an illuminance and proximity sensor package that can function as both an illuminance sensor and a proximity sensor while miniaturizing the device.

In an illuminance and proximity sensor package in which a light emitting element and a light receiving element are arranged side by side on one substrate, light from the light emitting element is incident on the light receiving element and blocks external light interference to affect the output of the light receiving element. It is important to configure it so that it is not given. To this end, the light-emitting device and the light-receiving device are first molded with a transparent encapsulation material to form an inner mold surrounding them, and again the black bag while optically blocking the light-emitting device and the light-receiving device so that light from the light-emitting device does not enter the light-receiving device. A double mold method is used in which the secondary mold is formed by zero secondary molding. An example of such a double mold method is described in Patent Application No. 2010-0095914 filed by Optoelectronics Co., Ltd. under the name "Method of manufacturing a sensor module having a light emitting portion and a light receiving portion", which is incorporated herein by reference.

However, when constructing the illuminance-proximity sensor into one package, the gate of the inner mold is formed when the light molding device and the light receiving device are subjected to a prior art double molding process using an epoxy mold compound. It is recognized as a problem that it is exposed without being shielded by the outer mold and is vulnerable to crosstalk by disturbance light and reflectors.

In order to solve this problem, Patent Application No. 2010-0095914 describes the removal of the gate of the inner mold and the formation of the outer mold. However, additional processing steps using laser or half dicing are required to remove the gate of the inner mold, which is considered disadvantageous in terms of time and cost.

An object of the present invention is to provide an illuminance-proximity sensor package capable of blocking crosstalk by disturbance light and a reflector and a method of manufacturing the same.

The present invention also provides an illuminance-proximity sensor package and a method of manufacturing the same which can exhibit stable characteristics by preventing the gate exposure of the inner mold, which is a problem in the dual mold-type illuminance-proximity sensor package.

Still another object of the present invention is to provide a method for reducing the manufacturing process step of the roughness-proximity sensor package by removing the mold process during package manufacture.

The present invention provides an illuminance-proximity sensor package shielded from the influence of disturbance light and crosstalk. The package includes an opaque substrate having a light emitting area and a light receiving area, a light emitting device and a light receiving device mounted on the light emitting area and a light receiving area of the substrate, a light-transmitting coating covering the light emitting device and the light receiving device, And an opaque housing covering the portion except the active region of the light receiving portion.

In the present invention, the substrate is divided into two regions: a light emitting portion region and a light receiving portion region for mounting the light emitting element and the light receiving element, respectively. Preferably, the substrate is a plastic injection molded product having a pattern applicable to surface mount technology (SMT).

In order to shield or at least minimize the incidence of light from the light emitting element directly onto the light receiving element, the substrate preferably has an elongated wall protruding from the substrate to block two regions between the light emitting portion and the light receiving portion. Alternatively or alternatively, it is more preferred that the light emitting area and / or the light receiving area is provided at its central portion substantially recessed deeper than the periphery, for example a dish or cup shaped depression. In this case, the light emitting element and / or the light receiving element is mounted in the depression. Therefore, the light from the light emitting element can be blocked by the side wall of the recess and / or the protruding wall of the substrate.

When the recess is provided in the light emitting region of the substrate, it is preferable to provide a reflector on the sidewall of the recess. The reflector is formed by plating a reflective metal such as gold (Au), for example. The reflector is used to collect the light exiting the side from the light emitting device to the upper side and at the same time to adjust the direction of the light when the light emitting device is a side light emitting diode. This can effectively increase the power of the light emitting portion.

The light emitting element and the light receiving element mounted on the light emitting portion region and the light receiving portion region of the substrate, respectively, are coated with a translucent resin to protect them and the wires. The coating is preferably carried out by a potting process, which is particularly advantageous when the light emitting element and the light receiving element are mounted on a substrate on which a recess is formed. According to the present invention does not require the formation of the inner mold of the prior art.

The substrate on which the light emitting element and the light receiving element are mounted and coated with the translucent resin is covered with a housing formed of an opaque material, rather than an external mold, unlike the prior art. The housing should cover the substrate to substantially completely shield outflow and inflow of light in areas other than the active areas of the light emitting device and the light receiving device. Therefore, the housing minimizes or eliminates the change in electrical characteristics of the light receiving device due to disturbance light and crosstalk.

The term “active area” is used here to refer to an area for emitting light from a light emitting device to the outside of a package for measuring illuminance and proximity, and for external light (for measuring illuminance) or for measuring proximity. It is intended to represent an area for introducing reflected light into the light receiving element. The active region is provided so as to correspond to the positions of the light emitting element and the light receiving element, but the sizes do not need to be the same. In general, the active area for the light emitting device is preferably larger than the area of the light emitting device and the active area by the light receiving device is designed to be smaller than the area of the light receiving device.

The housing is a separate component pre-fabricated. The housing may be a plastic injection molding or a shield case. Thus, the housing must be provided in a form that can be attached to the substrate. For example, the housing is formed with an opening or a groove at a position corresponding to the protruding wall of the substrate so that the protruding wall is inserted into the opening or the groove. Preferably, the width and length of the opening or groove are formed so as to correspond to the outer surface of the protruding wall so that the protruding wall can fit into the opening or groove. It is further noted that there may be various ways to attach the housing to the substrate. For example, it may be fixed to the substrate by using an adhesive or by forming a holder in the housing.

According to the present invention, there is provided a method of manufacturing an illuminance-proximity sensor package, the method comprising: providing an opaque substrate on which a pattern is printed, comprising a light emitting region, a light receiving region, and a protruding wall therebetween; And mounting the light emitting element and the light receiving element in the light receiving area, respectively, covering the light emitting element and the light receiving element with a light-transmitting material, and covering a portion excluding the active region of the light emitting part and the light receiving unit with an opaque housing. Steps.

When a recess is formed in the light emitting region and / or the light receiving region, the mounting step is performed to mount the light emitting element and / or the light receiving element in the recess. The mounting of the light emitting device and / or the light receiving device is preferably performed by die bonding, which is well known in the art.

When openings or grooves are formed in the housing as described above, the protruding wall of the substrate is fitted into the openings or grooves when the housing is covered. An adhesive may be provided between the protruding wall and the opening or groove to secure the housing to the substrate to increase the bond between the substrate and the housing. Alternatively, where the protruding wall of the substrate is formed to be exposed out of the opening of the housing, the exposed portion of the protruding wall may be melted and pressed to the housing.

According to an aspect of the present invention, an illuminance-proximity sensor package includes a substrate having recesses respectively formed in a light emitting portion and a light receiving portion, a light emitting element and a light receiving element mounted in each of the recesses, and the light emitting element and the light receiving portion in the recess. An inner protective layer covering the device and an outer shielding layer covering the protective layer and exposing only active regions of the light emitting device and the light receiving device.

It is preferable that protrusions are provided between the light emitting portion and the light receiving portion of the substrate to separate them from each other, and the shielding layer is provided with a groove or an incision having a complementary shape at a position corresponding to the protrusion. Alternatively, an indentation may be formed between the light emitting portion and the light receiving portion of the substrate, and the shielding layer may be configured such that a protrusion having a shape complementary to the position corresponding to the indentation exists.

According to the present invention, since the molding process is not used, it is possible to block the influence of the crosstalk caused by the disturbance light and the reflector due to the exposure of the internal gate generated when manufacturing the conventional illuminance-proximity sensor package using the double mold. In addition, the man-hour can be made simpler than the manufacturing process of the double mold system, and it is advantageous also in cost.

1 is a plan view and a front sectional view briefly illustrating a state in which a light emitting chip and a light receiving chip are mounted on a substrate according to an embodiment of the present invention.
2 is a plan view briefly illustrating a state in which a light emitting chip and a light receiving chip are mounted on a substrate according to an embodiment of the present invention.
3 is a plan view, a front view and a side view schematically showing a state in which the housing is covered in the state of FIG. 2 according to an embodiment of the present invention.

Additional aspects, features, and advantages of the invention include the following description of representative embodiments, which description should be understood in conjunction with the accompanying drawings. In order to facilitate a clear understanding of the present invention, some elements in each drawing may be exaggerated, omitted, or schematically illustrated. In addition, the size of each component does not entirely reflect the actual size. The following examples are intended to illustrate preferred embodiments of the present invention in order to enable those skilled in the art to understand and to facilitate the present invention, and should not be construed as limiting the present invention. Those skilled in the art will recognize that various changes and modifications can be made within the spirit and scope of the invention.

1 is a view schematically illustrating a state in which a light receiving chip and a light emitting chip are mounted on a predetermined substrate according to an embodiment of the present invention. The substrate 100 is a plastic injection molding pattern printed to enable the SMT process.

As shown in the plan view A shown in the upper portion of FIG. 1, the substrate 100 is divided into the light receiving unit 110 and the light emitting unit 120, and there is a wall 130 that divides them vertically therebetween. For example, the light receiving chip 210, which is a photodiode, is positioned at the center of the light receiving unit 110, and, for example, the light emitting chip 220, which is a light emitting diode, is located at the center of the light emitting unit 120.

As clearly shown in the cross-sectional view B at the bottom of FIG. 1, the wall 130 is formed to protrude above the upper plane of the substrate. Recesses 110a and 120a are formed in the light receiving unit 110 and the light emitting unit 120 of the substrate, respectively, and the light receiving chip 210 and the light emitting chip 220 are mounted on the bottom thereof. The light receiving chip and the light emitting chip are mounted on a substrate and then coated or covered with Si resin 300, for example, by a potting process. Although not shown, if the electrodes of the chips are connected by a wire, the wire will also have to be covered with a resin.

In this embodiment, the light receiving chip 210 and the light emitting chip 220 are substantially all surrounded by the substrate except for the upper surface thereof. Since the substrate 100 is opaque and is mounted on the recessed portion 120a of the substrate of the light emitting chip 220, the light emitted from the light emitting chip is prevented from being integrated into the light receiving chip 210. Furthermore, since the protruding wall 130 is blocked between the light emitting chip and the light receiving chip, and the light receiving chip is also located in the recess 110a, it is structural that the light of the light emitting chip passes over the side of the light receiving chip and directly affects the light receiving chip. Is blocked. Crosstalk between the light emitting chip and the light receiving chip is more completely blocked by the housing described below, which covers them.

FIG. 2 is substantially the same as FIG. 1A but shows the pattern of the substrate together. A portion shown in blue in FIG. 2 represents a plastic injection substrate 100, and a portion shown in yellow exemplarily shows a pattern 140 printed on the substrate 100 for mounting by the SMT process of chips. Preferably, the recess 120a of the cup-shaped light emitting part 120 may be provided with a reflector 120b on its wall surface. The reflector 120b may be formed by, for example, plating gold (Au) on the wall surface of the recess 120a. As will be appreciated by those skilled in the art, such a reflector can increase the efficiency of the light emitting part by converging the light lost to the side toward the top when mounting the side light emitting diode to the recess 120a. have.

3 is a substrate 100 in a state in which the light receiving chip 210 and the light emitting chip 220 is mounted on the substrate 100 and coated with the Si resin 300 as shown in FIG. 2 according to an embodiment of the present invention. It shows a state covered with a housing 400 which is a shield case in which a shielding layer is applied to a plastic injection molding or an outer surface thereof.

First, as shown in the top plan view A of FIG. 3, the housing 400 represented in green has an active region 150 of a light receiving portion shown in a rectangle and an active region 160 of a light emitting portion shown in a circle. It substantially covers all areas of the substrate except for. However, as shown, the opening having a size corresponding to the protruding wall 130 of the substrate of the housing 400 and the wall of the substrate 130 may be exposed to the outside of the housing through the opening of the housing 400. . Although the opening is present in the housing, the skilled person will understand that light cannot flow in and out through the opening of the housing and that light can only flow in and out through the active regions 150 and 160. The opening of the housing may be formed to be wider than the wall thickness of the substrate, preferably on both sides of the protrusion, such that there is an adhesive 170 to increase the adhesion between the housing and the substrate. Therefore, the adhesion part 170 exposes the surface of the substrate, not the wall of the substrate. By simply dropping the liquid adhesive through the adhesive part 170, very easy adhesion between the housing and the substrate is possible and a wide adhesive surface can be secured, thereby increasing the adhesive strength.

As shown in the front view B in the middle of FIG. 3, only the pattern 140 formed to extend along the side of the substrate from the top surface of the substrate is exposed. Although crosstalk is blocked between the light receiving portion and the light emitting portion due to the wall of the substrate and the depression, the housing 400 and the substrate 100 may be hermetically bonded so that there is no gap therebetween. The bottom side view C of FIG. 3 shows an example in which the housing 400 covers a portion of the side surface as well as the top surface of the substrate 100. In this case, the possibility that the disturbance light or the light of the light emitting part is reflected by the peripheral element and enters the light receiving chip through the side of the substrate is completely excluded.

The package described above can be made compact and thin film. Therefore, the space required for mounting the package on the printed circuit board can be minimized and cost reduction can be achieved.

Although the invention has been described with reference to specific exemplary embodiments, the invention is not limited by the embodiments, but only by the claims. Those skilled in the art should recognize that the embodiments can be changed or modified without departing from the scope and spirit of the present invention.

DESCRIPTION OF SYMBOLS 100 Substrate 110 Light-receiving part 120 Light-emitting part 110a, 120a Depression part 120b Reflector 130 Wall 140 Pattern 150, 160 Active area 170 Adhesive part 210 Light receiving chip 220 Light emitting chip 300 Resin 400 Housing

Claims (16)

Ambient light and proximity sensor package shielded from disturbance light and crosstalk
An opaque substrate on which a pattern is printed, including a light emitting area, a light receiving area, and a protruding wall therebetween;
A light emitting device and a light receiving device mounted on the light emitting area and the light receiving area of the substrate, respectively;
A translucent coating covering the light emitting element and the light receiving element; And
An opaque housing covering a portion except for the active region of the light emitting portion and the light receiving portion;
Including illumination? Proximity sensor package. The illuminance-proximity sensor package according to claim 1, wherein the light emitting part region of the substrate comprises a recessed part, and the light emitting element is mounted in a recessed part of the light emitting part area. The illuminance-proximity sensor package according to claim 2, wherein the light receiving unit region includes a recess, and the light receiving element is mounted in a recess of the light receiving unit region. The illuminance-proximity sensor package according to any one of claims 1 to 3, wherein the substrate is a plastic injection molding and the housing is a plastic injection molding or a shield case. The illuminance-proximity sensor package according to any one of claims 1 to 3, wherein the housing has an opening formed at a position corresponding to the protruding wall of the substrate, and the protruding wall is fitted into the opening. . The illuminance-proximity sensor package according to claim 2 or 3, wherein the recessed portion of the light emitting portion region has a reflector formed on a sidewall thereof. As a method of manufacturing an illuminance and proximity sensor package to shield the influence of disturbance light and crosstalk,
Providing a light-transmissive substrate comprising a light emitting area, a light receiving area, and a protruding wall therebetween, the pattern being printed thereon;
Mounting light emitting devices and light receiving devices on the light emitting area and the light receiving area of the substrate, respectively;
Coating the light emitting device and the light receiving device with a light transmitting material; And
Covering a portion of the light-emitting portion and the light-receiving portion except the active region with an opaque housing;
Illuminance comprising a proximity sensor package manufacturing method. The method of claim 7, wherein the light emitting part region of the substrate comprises a recessed part, and in the mounting step, the light emitting device is mounted to the recessed part of the light emitting part area. The method of claim 8, wherein the light receiving unit region of the substrate includes a recess, and the mounting step includes mounting the light receiving element in a recess of the light receiving unit region. The method of claim 7, wherein the mounting comprises die-bonding the light emitting element and the light receiving element. 10. The method of claim 7, wherein the covering step comprises potting Si resin. The housing of claim 7, wherein the housing has an opening or a groove formed at a position corresponding to the protruding wall of the substrate so that the protruding wall fits into the opening or the groove when the housing is covered. Method of manufacturing a roughness? 13. The method of claim 12, further comprising melting the protruding wall or providing an adhesive between the protruding wall and the opening or groove to secure the housing. A substrate having recesses formed in the light emitting portion and the light receiving portion, respectively;
A light emitting element and a light receiving element respectively mounted on the concave portion;
An inner protective layer covering the light emitting element and the light receiving element in the recess; And
An outer shielding layer covering the protective layer and exposing only active regions of the light emitting device and the light receiving device;
Ambient light, including proximity sensor package. 15. The illuminance-proximity sensor package of claim 14, wherein a protrusion exists between the light emitting portion and the light receiving portion of the substrate, and the shielding layer has a groove or an incision formed in a shape complementary to a position corresponding to the protrusion. . 15. The illuminance-proximity sensor package of claim 14, wherein an indentation is formed between the light emitting portion and the light receiving portion of the substrate, and the shielding layer has a protrusion having a shape complementary to a position corresponding to the indentation portion.

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