KR101072028B1 - Light emitting diode lamp - Google Patents

Abstract

The present invention discloses a light emitting diode lamp that can be firmly mounted while securing a mounting space by forming electrode terminals on upper and lower sides of a lamp package in which a light emitting diode is mounted. The present invention disclosed is a lamp package; A metal lead formed in an opening region of the lamp package; A plurality of electrode pads formed between the metal leads; A plurality of light emitting diodes mounted on the metal leads and electrically connected to the electrode pads and the metal leads; And at least one electrode terminal formed on an upper surface or a side surface of the package to be electrically connected to the metal lead or the electrode pad.

Therefore, when the LED package is mounted on the printed circuit board, the present invention can freely select a mounting space and firmly fix the mounting space on the printed circuit board.

LEDs, lamps, packages, wires, electrode terminals

Description

Light Emitting Diode Lamps {LIGHT EMITTING DIODE LAMP}

1 is a view showing a light emitting diode lamp structure according to the prior art.

FIG. 2 is a cross-sectional view of the II ′ region of FIG. 1. FIG.

3 is a view showing the light emitting diode lamp circuit of FIG.

4 is a view showing a light emitting diode lamp structure according to the present invention.

5 is a view showing the lower side of the LED lamp according to the present invention.

Figure 6a is a perspective view of a light emitting diode lamp package according to the present invention.

Figure 6b is one side cross-sectional view of Figure 6a.

* Description of the symbols for the main parts of the drawings *

100: light emitting diode lamp 102: lamp package

101a, 101b: red LED 102a, 102b: green LED

103: blue LED 138, 139: upper electrode terminal

The present invention relates to a light emitting diode (Light Emitting Diode) lamp, more specifically, by forming electrode terminals on the upper and lower sides of the lamp package in which the light emitting diode is mounted, a light emitting diode lamp that can be securely mounted while ensuring a mounting space It is about.

In general, an LED is also called a light emitting diode, which is a device used to transmit and receive an electric signal by converting an electric signal into an infrared, visible or light form using the characteristics of a compound semiconductor.

Usually, the use range of LED is used in home appliances, remote controllers, electronic signs, indicators, and various automation devices, and the types are largely divided into Infrared Emitting Diode (IRD) and Visible Light Emitting Diode (VLED).

In particular, LEDs are becoming smaller and smaller, such as resistors, capacitors, and noise filters, due to the trend toward miniaturization and slimming of information and communication devices, and directly mounting them on a PCB (Printed Circuit Board) board. In order to make the surface mount device (Surface Mount Device) type.

Such LEDs are used in home appliances, electronic displays, and the like, depending on the intensity of light output.

Accordingly, LED lamps, which are used as display elements, are also being developed in SMD type. Such SMD can replace the existing simple lighting lamp, which is used for lighting indicators of various colors, character display and image display.

1 is a view showing a light emitting diode lamp structure according to the prior art, Figure 2 is a cross-sectional view of the region II 'of FIG.

1 and 2, in the SMD type lamp 1, the metal lead 3 is inserted from the left end to the right end of the opening 2a of the synthetic resin or the liquid crystal polymer package 2, have.

Two red LEDs (R1, R2), two blue LEDs (B1, B2) and one green LED (G), i.e. a total of five light emitting LEDs, are the highest red LEDs in narrow intervals in a single horizontal row. (R1, R2) are arranged on the metal lead 3 so that the green LED 6 having the lowest height is arranged at both ends at the center.

On the other hand, a protrusion of the metal lead 3 is disposed at the center of the lower surface of the opening 2a, and the five terminals 4a, 4b, 4c 4d, and 4e are spaced apart from the metal lead 3 by a predetermined distance. And inserted into the liquid crystal polymer package 2.

The metal lead 3 and the terminals 4a, 4b, 4c 4d and 4e are integrally formed by insert molding the package 2 in a state of being set in the injection molding mold of the package 2. do.

As shown in FIG. 2, the opening 2a of the package 2 is filled with a transparent epoxy resin 6 and sealed.

Since the transparent epoxy resin 6 shrinks when cured, as shown in FIG. 2, the surface of the transparent epoxy resin 6 has a higher outer periphery than the central portion and the central portion is dented.

Since the LEDs are arranged in high order from both ends to the center, the distance between the light emitting surface of the LED element and the surface of the transparent epoxy resin 6 is substantially uniform.                         

Although not shown, 5, which is not described, represents a wire.

3 is a view illustrating the light emitting diode lamp circuit of FIG. 1, in which two red LEDs R1 and R2 and two blue LEDs B1 and B2 and one green LED G are connected to the metal lead 3. Consisting of parallel form.

Although shown in the figure, 3a, which is not described, represents a terminal for applying a common voltage to the metal lead.

However, the LED lamp having the structure as described above has limitations in structural miniaturization and thinning because LEDs are mounted on metal leads formed in the opening of the package and bonded to the terminals formed in the package opening. .

That is, the miniaturization of the package using the LED is used in cell phones, laptops, PDAs, etc., the width of the LED lamp used for this should be narrow, there is a limit in forming a narrow width in the prior art as described above.

In particular, in the prior art, there is a limit in making the upper and lower widths (vertical widths) of the openings narrow and thinning.

And since the electrode pattern is uniformly located in the LED lamp package, when mounting on the PCB, there is a limit of the mounting area, there is a problem that can be easily separated from the PCB when mounting.

The present invention can freely select a mounting space when mounting an LED package on a printed circuit board by forming electrode terminals not only on the bottom surface of the package in which the LEDs are mounted, but also on the top surface where the LEDs are mounted. It can be firmly fixed on the printed circuit board when mounted.

In addition, it is an object of the present invention to provide a light emitting diode lamp that can reduce the size of the package and can be made thin.

In order to achieve the above object, a light emitting diode lamp according to the present invention,

Lamp package;

A metal lead formed in an opening region of the lamp package;

A plurality of electrode pads formed between the metal leads;

A plurality of light emitting diodes mounted on the metal leads and electrically connected to the electrode pads and the metal leads; And

And at least one electrode terminal formed on an upper surface or a side surface of the package to be electrically connected to the metal lead or the electrode pad.

Here, the light emitting diode is disposed along a center line of the opening area of the lamp package, and the electrode pad formed in the opening area of the lamp package is electrically connected to an electrode terminal formed on the bottom, top, or side of the lamp package through a via hole. Is connected, the lamp package is characterized in that formed by stacking a plurality of ceramic substrates.

The structure of the lamp package may be any one of a straight line, a triangle, a quadrangle, and a pentagon, and reflectors are provided on side and / or bottom surfaces of the opening area of the package, and the plurality of light emitting diodes may include at least one red light. And green and blue light emitting diodes.

According to the present invention, the electrode terminal is formed not only on the lower side of the package on which the LEDs are mounted, but also on the upper side on which the LEDs are mounted, whereby the mounting space can be freely selected when mounting the LED package on the printed circuit board. It can be firmly fixed on the printed circuit board when mounted.

In addition, the package can be miniaturized and can be made thin.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4 is a view showing a light emitting diode lamp structure according to the present invention.

As shown in FIG. 4, the LED lamp 100 includes red, green, and blue LEDs 101a, 101b, 102a in the opening area of the lamp package 102. 102b and 103 are mounted. The LEDs 101a, 101b, 102a, 102b, and 103 have two red LEDs (R1, R2), two green LEDs (G1, G2) and one blue LED (B) mounted on a metal lead 123a. In some cases, LEDs can be added in various ways.

In addition, upper electrode terminals 138 and 139 are formed on the upper part of the lamp package 102, that is, at both edge regions of the light emitting surface. The upper electrode terminals 138 and 139 are formed under the lamp package 102 of FIG. 5, that is, a plurality of electrode terminals 140a, 140b, 141a, 141b, 141c, 142a, and 142b formed on the back surface of the light emitting surface. ) Is electrically connected.                     

Details thereof will be described with reference to FIGS. 5, 6A, and 6B.

Electrode pads 121a, 121b, 121c, and 121d are disposed between the metal leads 122a, 122b, and 123a on which the LEDs 101a, 101b, 102a, 102b, and 103 are mounted. 101a, 101b, 102a, 102b, and 103 are bonded to the metal leads 122a, 122b, and 123a and the electrode pads 121a, 121b, 121c, and 121d in a horizontal direction.

 That is, in the LED lamp 100 of the present invention, the metal leads 122a, 122b, and 123a are formed in the center area of the lamp package 102, and the LEDs 101a are formed on the metal leads 122a, 122b and 123a. , 101b, 102a, 102b, and 103 are mounted, and a wire 112 is bonded in a horizontal direction along the center of the lamp package 102.

Therefore, the width of the lamp package 102 can be reduced as much as possible to achieve light weight and small size.

In addition, when the LED lamp 100 is mounted on a printed circuit board (PCB) by the upper electrode terminals 138 and 139 formed on the lamp package 102, various mounting positions may be designed. Can be.

That is, since the upper electrode terminals 138 and 139 are electrically connected to terminals selected from among electrode terminals formed under the lamp package 102, the electrode terminals formed under the lamp package 102 or Any one of the upper electrode terminals 138 and 139 formed on the upper portion may be selected to make electrical connection with other elements, thereby increasing design freedom.                     

In addition, even when the operation test in the state in which the LED lamp 100 is mounted on the printed circuit board, the electrode terminals are formed on the upper and lower portions of the lamp package 102, so it is easy to inspect.

Although not shown, 105 is a lower region of the opening of the lamp package 102, and 120 represents a via hole.

5 is a view showing a lower surface of the LED lamp according to the present invention.

FIG. 5 shows the metal leads 122a, 122b, 123a and electrode pads 121a, 121b, 121c, 121d on which the LEDs 101a, 101b, 102a, 102b, 103 are mounted in FIG. 4. It corresponds to the electrode terminals 140a, 140b, 141a, 141b, 141c, 142a, and 142b formed on the lower surface.

That is, when the lamp package 102 is stacked using ceramic substrate materials, the electrode terminals 140a, 140b, 141a, 141b, 141c, 142a, and 142b may have via holes formed on the stacked ceramic substrates. The metal leads 122a, 122b, 123a, the electrode pads 121a, 121b, 121c, 124, and the upper electrode terminals 138, 139 are electrically connected to each other by the conductive metal filled in the via hole.

In the case of the ceramic substrate, since the etching operation may be performed to form various and required via holes, it is easy to electrically connect the ceramic substrates to be stacked.

Therefore, the upper electrode terminals 138 and 139 formed on the lamp package 102 or the electrode terminals 140a, 140b, 141a, 141b, 141c, 142a, and 142b formed on the lower portion of the lamp package 102 and the circuit terminals on the PCB are electrically connected to each other. It can be mounted to be contacted.

6A is a perspective view illustrating a light emitting diode lamp package according to the present invention, and FIG. 6B is a side cross-sectional view of FIG. 6A.

6A and 6B, the lamp package 102 has a structure in which a plurality of ceramic substrates 150a, 150b, 150c, and 150d made of a ceramic material are stacked.

An opening 160 is formed in a central region of the lamp package 102, and the LEDs 101a, 101b, 102a, 102b, and 103 described in FIG. 4 are mounted at predetermined intervals in the opening 160. .

The lamp package 102 may be manufactured and used in various forms according to areas used such as straight, triangular, square, and pentagonal.

Although not clearly illustrated in the drawings, the mounted LEDs 101a, 101b, 102a, 102b, and 103 may reflect light from the metal lead formed inside the opening 160 and the reflective film formed on the sidewall, thereby improving light efficiency.

In the present invention, the upper electrode terminals 138 and 139 are formed on the lamp package 102 to increase the degree of freedom for mounting the LED lamp on the PCB.

As such, the method of forming the upper electrode terminals 138 and 139 on the upper surface of the lamp package 102 is as follows.

Since the lamp package 102 is formed by stacking a plurality of ceramic substrates 150a, 150b, 150c, and 150d, a via hole is formed on each of the ceramic substrates 150a, 150b, 150c, and 150d, and the upper and lower sides thereof are formed. The upper electrode terminals 138 and 139 may be formed by forming signal patterns for electrical connection with via holes formed on the stacked ceramic substrates 150a, 150b, 150c, and 150d.

In particular, since the LED lamp is mounted with a plurality of LEDs to generate higher light output, it will be very useful to form electrode terminals on the side, bottom and top surfaces of the lamp package 102 as described above.

In addition, as the size of the light emitting diode lamp has been reduced, the application range requiring the RGB tricolor color has been widened. However, in the case of the light emitting diode lamp showing the wire bonding structure, there is a limit to the size reduction.

Thus, by varying the position of the electrode terminal as described above, there is an advantage that the width of the electrode terminal of the lower surface of the lamp package and the efficient arrangement of the electrode pattern.

In addition, by forming the upper electrode terminal on the lamp package, it can be mounted firmly on the PCB, the operation of the LED lamp in the mounted state can be inspected.

As described in detail above, when the LED package is mounted on a printed circuit board by forming electrode terminals not only on the bottom surface of the package on which the LEDs are mounted, but also on the top surface on which the LEDs are mounted, The mounting space can be freely selected, and the mounting space can be firmly fixed on the printed circuit board.                     

In addition, the package can be miniaturized, and there is an advantage that it can be made thin.

The present invention is not limited to the above-described embodiments, and various changes can be made by those skilled in the art without departing from the gist of the present invention as claimed in the following claims.

Claims (7)

Lamp package; A metal lead formed in an opening region of the lamp package; A plurality of electrode pads formed between the metal leads; A plurality of light emitting diodes mounted on the metal leads and electrically connected to the electrode pads and the metal leads; And At least one electrode terminal formed on an upper surface or a side surface of the package to be electrically connected to the metal lead or the electrode pad,  And an electrode pad formed in an opening area of the lamp package is electrically connected to an electrode terminal formed on a bottom, top, or side of the lamp package through a via hole. The method of claim 1, The light emitting diode lamp is disposed along the center line of the opening region of the lamp package. delete The method of claim 1, The lamp package is a light emitting diode lamp formed by stacking a plurality of ceramic substrates. The method of claim 1, The lamp package has a structure of any one of a straight, triangular, rectangular, pentagonal shape. The method of claim 1, The light emitting diode lamp is provided with a reflecting plate on the side and / or bottom of the opening area of the package. The method of claim 1, The plurality of light emitting diodes include at least one red, green, blue light emitting diode lamp.

Images