KR100936903B1 - Inspection device and inspection method - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for inspecting foreign material defects, pattern defects, and the like on a printed circuit board. According to the present invention, the printed circuit board is moved from the loading unit to the inspection unit, and then the top surface photographing, inverting, and bottom surface photographing are sequentially performed and moved to the unloading unit. The movement of the printed circuit board between the loading unit, the inspection unit and the unloading unit is carried out using two arms arranged at right angles, the movement of the printed circuit board from the loading unit to the inspection unit and the movement of the printed circuit board from the inspection unit to the unloading unit. The movement takes place at the same time. Also, in the inspection unit, a groove in which the fingers provided for inversion of the printed circuit board are inserted is formed in the stage where the printed circuit board is placed, so that the fingers move through the groove to lift the printed circuit board from the stage or place it on the stage. Can be.

Printed circuit board, reversed, inspection

Description

Inspection device and inspection method {INSPECTING APPARATUS AND INSPECTING METHOD}

The present invention relates to an inspection apparatus and an inspection method, and more particularly, to an apparatus and method for optically inspecting whether an object such as a printed circuit board is defective.

The printed circuit board on which the pattern or the like is formed on the upper surface has a foreign substance adhered to the surface, whether there is a defect in the pattern, or if burrs remain on the cut surface when an opening is formed in the printed circuit board. Checks are made. The above-described inspection is mainly performed by the image processor detecting the brightness, etc. of each region of the image, obtained by photographing the substrate with a camera. In general, the inspection apparatus continuously inspects a large number of printed circuit boards. Therefore, it is important to quickly transfer the printed circuit board between units in the apparatus in order to shorten the time required for inspection.

In addition, when inspecting the upper and lower surfaces of the printed circuit board, a unit for inverting the printed circuit board is required. However, the general apparatus is very complicated in structure and takes a long time to invert.

The present invention provides an inspection apparatus and method that can efficiently inspect an inspection object such as a printed circuit board.

The present invention also provides an inspection apparatus and method that can reduce the time required for inspection of an inspection object such as a printed circuit board.

The present invention also provides an inspection apparatus and method that can quickly perform reversal of an inspection object such as a printed circuit board and have a simple device structure.

The problem to be solved by the present invention is not limited thereto, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

The present invention provides an apparatus for inspecting an inspection object. In example embodiments, the test object may be a printed circuit board. The inspection apparatus may include an inspection unit for inspecting an inspection object; An import unit in which an inspection object to be carried into the inspection unit is placed; A carrying out unit on which an inspected object taken out from the inspecting unit is placed; And a transfer unit for transferring an inspection object between the carrying unit and the inspection unit, and between the carrying unit and the inspection unit. The transfer unit is configured to simultaneously perform a process of transferring the inspection object placed on the carrying unit to the inspection unit and a process of transferring the inspection object placed on the inspection unit to the carrying unit.

According to an example, the inspection unit may be moved between an initial position for exchanging an inspection object with the carrying unit and the carrying unit, an inspection position at which an image is taken with respect to the inspection object, and an inversion position for reversing the inspection object. A plurality of stages to be placed; A photographing member for photographing a test object moved to the test position; An image processor which receives the photographed image from the photographing member and reads whether the inspection object is defective from the image; And an inversion member for inverting the inspection object moved to the inversion position.

According to one example, the transfer unit is disposed between the carrying unit, the carrying unit and the stage moved to the initial position, the rotatable body; A first arm extending from the rotating body and capable of holding an inspection object; And a second arm extending perpendicular to the first arm from the rotating body and capable of holding the inspection object.

According to one example, the reversing member includes a finger for holding the inspection object; A rotary driver for rotating the finger so that the inspection object is inverted; A vertical driver for moving the finger in a vertical direction; And a horizontal driver for moving the finger in the front-rear direction. Grooves into which the finger can be inserted may be formed on an upper surface of each stage.

According to one example, the carrying unit includes a carriage in which the inspection object is linearly moved, and a foreign matter removal member installed on the carriage to remove foreign matter attached to the inspection object. The pallet may be provided with a conveyor belt spaced apart from each other by a certain distance and supporting both edges of the inspection object. The foreign material removing member is disposed to contact the upper surface of the inspection object placed on the conveyor belt, the first roller provided with an adhesive on the outer surface; A second roller disposed to be in contact with the lower surface of the inspection object placed on the conveyor belt and provided with an adhesive on an outer surface thereof; An upper roller disposed to be in contact with the first roller and provided with an adhesive on an outer surface thereof to remove foreign substances attached to the first roller; And a lower roller disposed to be in contact with the second roller and provided with an adhesive on an outer surface thereof to remove foreign substances attached to the second roller.

In addition, the inspection apparatus of the present invention includes an inspection unit for inspecting the inspection object; An import unit in which an inspection object to be inspected in the inspection unit is placed; A carrying-out unit on which the inspected object subjected to the inspection in the inspecting unit is placed; And a transfer unit for transferring an inspection object between the carrying unit and the inspection unit, and between the carrying unit and the inspection unit. The inspection unit includes a first photographing member and a second photographing member for photographing an inspection object; An inverting member for inverting the inspection object; An image processor configured to receive images captured by the first photographing member and the second photographing member, and to read whether the inspection object is defective from the image; An initial position for exchanging an inspection object with the carrying unit and the carrying unit by rotation, a first inspection position provided with the first imaging member, an inverted position provided with the inversion member, and a second inspection position provided with the second imaging member It is movable in the liver and includes a plurality of stages on which the test object is placed.

According to one example, the inspection unit further comprises a base to be rotated, each side of the base is provided so that the stage is rotated with the base, the first photographing member, the inverting member, and the second The photographing member is arranged such that each of the stages can be reached sequentially when rotating.

According to one example, the transfer unit is disposed between the carrying unit, the carrying unit and the stage moved to the initial position, the rotatable body; A first arm extending from the rotating body and capable of holding an inspection object; And a second arm extending perpendicular to the first arm from the rotating body and capable of holding the inspection object.

In one embodiment, the reversing member includes a finger for holding the inspection object by a vacuum; And a driver for rotating the finger and linearly moving it in the vertical direction and the front and rear direction, and a groove provided on the upper surface of the stage provided as a movement path of the finger when the finger moves in the front, rear, and vertical directions.

The present invention also provides a method for inspecting a test object. According to the method of the present invention, the inspection object is moved from the import unit to the inspection unit, and the inspection unit inspects whether the inspection object is defective, and the inspection-completed substrate is moved to the export unit, but one driver The two arms rotatable by and provided at right angles to each other simultaneously perform the movement of the inspection object from the loading unit to the inspection unit and the movement of the inspection object from the inspection unit to the loading unit.

According to one example, the inspection unit is provided with a plurality of stages on which the test object can be placed, the stages are sequentially movable to the initial position, the first inspection position, the inverted position, and the second inspection position by rotation; The initial position is a position at which the loading unit, the carrying unit and the inspection unit exchange inspection objects, and the first inspection position and the second inspection position are positions at which the photographing of the inspection object is performed by a photographing member. The inversion position is a position at which the inspection object is inverted.

According to an example, four stages are provided, and the initial position, the first inspection position, the inverted position, and the second inspection position are positions at which the stages are rotated by 90 degrees each.

The reversal of the inspection object is carried out by vacuum suction of the inspection object placed on the stage with a finger from the top to lift the inspection object from the stage, and rotate the finger 180 degrees to reverse the inspection object, and the finger of the stage It can be done by placing the inspection object on the stage by moving downwardly into the groove provided on the upper surface.

In addition, the reversal of the inspection object may include inserting a finger into a groove provided in the upper surface of the stage and lifting the finger to lift the inspection object from the stage, vacuum suction the inspection object, and rotate the finger 180 degrees. It may be achieved by inverting the inspection object, removing the vacuum after placing the inspection object on the upper surface of the stage.

In addition, one of the two arms provided at right angles vacuum-adsorbs the inspection object positioned in the loading unit, and the other vacuum-adsorbs the inspection object placed on the stage moved to the initial position, and connected with the two arms. As the rotating body is rotated 90 degrees in the direction toward the carry-out unit, the inspection object placed on the stage moved to the initial position is moved to the carry-out unit, and at the same time, the inspection object located at the carry-in unit moves to the initial position. Can be moved onto the stage.

In addition, the inspection object has a thin plate shape having an upper surface and a lower surface, and performs the inspection process differently according to the number of inspection surfaces of the inspection object, each of the case where the inspection surface includes both the upper and lower surfaces The inspection object is sequentially moved to the initial position, the first inspection position, the inverted position, the second inspection position, and the initial position, and at the first inspection position, any one of an upper surface and a lower surface of the inspection object. Inspection is performed, and at the second inspection position, inspection of the other of the upper and lower surfaces of the inspection object is performed;

When the inspection surface is an upper surface, each inspection object is sequentially moved to the initial position, any one of the first inspection position and the second inspection position, and the initial position, and the first inspection position and In the second inspection position, the inspection may be performed on different inspection objects.

In addition, the foreign matter attached to the inspection object may be removed from the carrying unit before the inspection object is moved to the inspection unit.

According to the present invention, inspection can be efficiently performed for a large number of inspection objects.

According to the present invention, since the loading of the inspection object into the inspection unit and the unloading of the inspection object from the inspection unit are simultaneously performed, the time required for the inspection process can be reduced.

According to the present invention, the inspection object can be easily reversed, and the structure of the unit for reversing is simple.

According to the present invention, since the foreign matter attached to the inspection object is first removed before the photographing is performed by the photographing member, it is possible to reduce the fact that the inspection object is determined to be defective due to the foreign matter.

Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to FIGS. 1 to 10. Embodiments of the invention may be modified in various forms, the scope of the invention should not be construed as limited to the following examples. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings are exaggerated to emphasize a more clear description.

In this embodiment, the case where the inspection object is a printed circuit board B which is generally provided as a thin plate will be described as an example. However, the technical idea of the present invention may be applied to an inspection article other than the printed circuit board B.

1 is a plan view schematically showing an embodiment of the inspection device 1 of the present invention. Referring to FIG. 1, the inspection apparatus 1 has a carrying in unit 10, a carrying out unit 20, an inspecting unit 30, and a conveying unit 40. In the loading unit 10, a printed circuit board B to be inspected is placed, and in the carrying out unit 20, a printed circuit board B is completed. The inspection unit 30 inspects the printed circuit board B for defects. The transfer unit 40 moves the printed circuit board B from the loading unit 10 to the inspection unit 30, and moves the printed circuit board B from the inspection unit 30 to the carrying out unit 20. The import unit 10 and the export unit 20 are spaced apart from each other by a predetermined distance and disposed to face each other. The inspection unit 30 is disposed adjacent to one end of the carrying in unit 10 and the carrying out unit 20. The transfer unit 40 is disposed in the space provided by the loading unit 10, the inspection unit 30, and the loading unit 20.

The loading unit 10 has a mounting table 120, a carriage 140, a horizontal mover 160, and a foreign matter removing member 180. On the mounting table 120, printed circuit boards B to be inspected are placed. The horizontal mover 160 moves the printed circuit board B from the mounting table 120 to the carriage 140, and the printed circuit board B is moved by the transfer unit 40 described above in the carriage 140. It is carried to the holdable position. The foreign material removing member 180 removes a part of the foreign matter attached to the printed circuit board B before the printed circuit board B is moved to the inspection unit 30.

FIG. 2 is a cross-sectional view taken along the line I-I of FIG. 1 and schematically shows a configuration of the mounting table 120. Referring to FIG. 2, the mounting table 120 has a frame 121, a lifting plate 122, a vertical driver 123, and a sensor 124. The frame 121 has a space in which the upper portion is opened, and generally has a rectangular parallelepiped shape. The shape of the frame 121 may vary depending on the shape of the inspection object. In the frame 121, a lifting plate 122 having a rectangular plate shape is provided. The printed circuit boards B are laid on the lifting plate 122 in a stack. The vertical driver 123 drives the lifting plate 122 in the vertical direction. Each time the printed circuit board B is moved from the frame 121 to the carriage 140, the lifting plate 122 is lifted by a predetermined height. The sensor 124 detects whether the printed circuit board B remains on the elevating plate 122. When no printed circuit board B remains on the elevating plate 122, the elevating plate 122 is lowered and a new printed circuit board B is placed into the frame 121 by an operator or an automatic transport device.

Various methods of detecting whether the printed circuit board B is placed on the elevating plate 122 may be provided. According to one example, the surface of the lifting plate 122 is provided with a material that reflects light, and the light emitting sensor and the light receiving sensor are disposed side by side on the upper surface or the top of the lifting plate 122. When the lifting plate 122 is elevated to the set position, the light irradiated from the light emitting sensor is reflected from the lifting plate 122, and the reflected light may be received by the light receiving sensor. According to another example, the size of the elevating plate 122 so that the printed circuit board B can protrude in the lateral direction of the elevating plate 122, the light emitting sensor and the light receiving sensor are mutually outside the elevating plate 122 It is arranged to face. When the printed circuit board B is placed at the set position, the printed circuit board B blocks the light emitted from the light emitting sensor, and when the lift plate 122 is placed at the set position, the light receiving sensor receives the light. Can be.

The carriage 140 has a generally rectangular shape when viewed from the top. The upper surface of the carriage 140 and the upper surface of the mounting table 120 are disposed at substantially similar heights. The carriage 140 extends in the direction toward the mobile unit starting from the position opposite to the loading table 120. The carriage 140 has conveyor belts 142 installed to face each other at regular intervals. Each conveyor belt 142 is supported by the edge of the printed circuit board (B). The printed circuit board B moved from the mounting table 120 to the one end region of the carriage 140 is linearly moved to the other end region of the carriage 140 by the conveyor belt 142. The conveyor belt 142 is continuously rotated such that its upper surface faces from one end of the carriage 140 to the other end. The conveyance of the printed circuit board B in the carriage 140 may be a conveyance structure other than the conveyor belt 142.

The horizontal mover 160 has a support shaft 161, a guide rail 162, a support rod 164, a hand 166, and drivers 167, 168. The longitudinal direction of the support shaft 161 is disposed to be perpendicular to the longitudinal direction of the pallet 140. One end of the support shaft 161 extends at or longer than the mounting table 120, and the other end of the support shaft 161 extends at or longer than the mounting table 140. The support shaft 161 is located on top of the mounting table 120 and the carriage 140. One end of the support shaft 161 is disposed to be spaced apart from the mounting table 120, and the other end of the supporting shaft 161 is arranged to cross the mounting table 120. The upper surface of the support shaft 161 is provided with a guide rail 162 in a straight line along the longitudinal direction of the support shaft 161, the bracket 163 is coupled to the guide rail 162. One end of the support rod 164 is fixedly coupled to the bracket 163, and the hand 166 is fixedly coupled to the other end of the support rod 164. The lower surface of the hand 166 is provided with a vacuum hole 166 to vacuum-adsorb the printed circuit board (B). The driver has a horizontal driver 168 for linearly moving the bracket 163 along the guide rail 162 and a vertical driver 167 for moving the hand 166 in the vertical direction.

The foreign material removing member 180 removes some foreign materials from the surface of the printed circuit board B that is transported along the conveyor belt 142 in the carriage 140. 3 is a cross-sectional view taken along the line II-II of FIG. 1 and shows an example of the foreign material removing member 180. Referring to FIG. 3, the foreign material removing member 180 has a first roller 182, a second roller 184, an upper roller 186, and a lower roller 188. The first roller 182 and the second roller 184 are disposed to face each other up and down with the conveyor belt 142 interposed therebetween. The second roller 184 is located between the conveyor belts 142. The first roller 182 and the second roller 184 are disposed to be in contact with the upper and lower surfaces of the printed circuit board B that is conveyed along the conveyor belt 142. Each of the first roller 182 and the second roller 184 may be rotated by a frictional force with the printed circuit board (B). Optionally, a driver (not shown) may be provided to rotate the first roller 182 and the second roller 184.

Adhesive layers 182a and 184a are provided on the outer circumferential surfaces of each of the first roller 182 and the second roller 184. The adhesive layers 182a and 184a may be used to remove foreign substances attached to the printed circuit board B from the printed circuit board B when the first roller 182 and the second roller 184 are in contact with the printed circuit board B. Remove The adhesive force of the adhesive layer of the first roller 182 and the second roller 184 is provided to the extent that the foreign material on the printed circuit board (B) can be removed without adhesion to the printed circuit board (B).

The upper roller 186 removes the foreign matter attached to the first roller 182, and the lower roller 188 removes the foreign matter attached to the second roller 184. The upper roller 186 is disposed to be in contact with the first roller 182 on top of the first roller 182, and the lower roller 188 is in contact with the second roller 184 at the bottom of the second roller 184. It is arranged to be. The outer peripheral surfaces of the upper roller 186 and the lower roller 188 are provided with adhesive layers 186a and 188a. The adhesive force of the adhesive layer of the upper roller 186 and the lower roller 188 can remove the foreign matter on the first roller 182 or the second roller 184 without bonding the first roller 182 or the lower roller 188. It is provided enough to be. The adhesion of the adhesive layers 186a and 188a of the upper roller 186 and the lower roller 188 is provided to be greater than the adhesion of the adhesive layers 182a and 184a of the first roller 182 and the second roller 184.

As shown in FIG. 3, the lower roller 188 and the upper roller 186 are disposed in a straight line in the up and down direction, and the second roller 184 and the first roller 182 are disposed in a straight line in the up and down direction. The roller 186 and the first roller 182 may be inclined at a vertical line. Optionally, as shown in FIG. 4, the lower roller 188, the second roller 184, the first roller 182, and the upper roller 186 may be disposed to be straight in the vertical direction.

The carrying out unit 20 has a loading stand 220, a carriage 240, and a horizontal mover 260. The carriage 240 of the carrying unit 20 and the carriage 140 of the carrying unit 10 are arranged to face each other side by side. Components corresponding to each other of the carrying out unit 20 and the carrying out unit 10 are arranged to be line-symmetric with respect to each other with respect to the center line between the carrying out unit 10 and the carrying out unit 20. The loading table 220, the carriage 240, and the horizontal mover 260 of the carrying out unit 20 may include the loading stand 120, the carriage 140, and the horizontal mover 160 of the loading unit 10. Generally have a similar structure. However, the sensor (not shown) in the loading table 220 of the carrying out unit 20 detects whether the lifting plate has lowered to the set height, and when the lifting plate lowers to the set height, the worker or the automatic transport device is placed on the lifting plate. The printed printed circuit boards B are removed from the mounting table 220. In addition, the direction of rotation of the conveyor belt 242 in the carrying out unit 20 and the direction of rotation of the conveyor belt 142 in the loading unit 10 are provided in reverse.

The inspection unit 30 photographs the printed circuit board B with a camera, and detects whether the printed circuit board B is defective from the photographed image. The defect inspection may be a pattern inspection that inspects whether a pattern formed on the printed circuit board B has a disconnection, a short circuit, a recess, a short circuit, or the like. Optionally, the defect inspection may be a foreign material inspection that inspects whether foreign matter remains on the upper or lower surface of the printed circuit board B. FIG. The foreign material may be a foreign material attached on the pattern, a burr remaining on the cut surface of the opening formed in the printed circuit board B, a particle attached to the surface of the printed circuit board B, and the like.

The inspection unit 30 includes a stage unit 300, photographing members 420 and 440, an inversion member 500, and an image processor 600. 5 is a perspective view of the stage unit 300 of FIG. 1. Referring to FIG. 5, the stage unit 300 has a base 320 and a plurality of stages 340. The stage unit 300 is rotated about its central axis. The base 320 has a generally square plate shape when viewed from the top. The drive shaft 324 rotated by the above-described motor 326 is fixed to the center of the lower surface of the base 320. Stages 340 are installed at each side of the base 320. The stage 340 extends outward from the base 320 from each side of the base 320 to rotate with the base 320. Each stage 340 has a rectangular plate shape, and the length of the long side of the stage 340 is provided to be substantially similar to the length of one side of the base 320.

Slit-formed long grooves 342 are formed on the upper surface of each stage 340. Each groove 342 extends a predetermined length inward from the outer side of the stage 340. Each groove 342 is formed parallel to the short side of the stage 340. The grooves 342 are formed parallel to each other. The grooves 342 function as a movement path of the finger 510 when the finger 510 of the inverting member 500 described later puts the printed circuit board B on the stage 340 or lifts it from the stage 340. .

The base 320 is rotated at a set angle or an angle thereof. For example, the set angle may be an angle obtained by dividing 360 degrees by the number of stages 340. When four stages 340 are provided as in the present embodiment, the base 320 may be rotated at 90 degrees or multiples thereof.

Each stage 340 is moved between the initial position P1, the inspection positions P2 and P4, and the inverted position P3 by rotation. The initial position P1 is a position where the carrying-in unit 10, the carrying-out unit 20, and the inspection unit 30 exchange the printed circuit board B. FIG. The inspection positions P2 and P4 are positions at which imaging of the printed circuit board B is performed by the imaging members 420 and 440. The inversion position P3 is a position where the upper surface and the lower surface of the printed circuit board B are inverted. Plural inspection positions P2 and P4 may be provided, and in this embodiment, two inspection positions P2 and P4 are provided. The first inspection position is referred to as the first inspection position P2, and the second inspection position is referred to as the second inspection position P4.

In the present embodiment, the first inspection position P2 is the first side region of the base 320 and the second inspection position P4 is the second side region of the base 320. The first side and the second side are areas facing each other. The inversion position P3 is the third side region of the base 320, and the third side is the region perpendicular to the first side and the second side. The initial position P1 is the fourth side region of the base 320, and the fourth side is the region facing the third side. The fourth side is an area adjacent to the import unit 10 and the export unit 20. When the base 320 is rotated in one direction, each stage 340 passes through the initial position P1, the first inspection position P2, the inverted position P3, and the third inspection position P2, P4. After that, it returns to the initial position P1 again.

The first imaging unit 420 is installed in the first side region of the base 320, and the second imaging unit 440 is installed in the second side region of the base 320. The camera is used as the first photographing unit 420 and the second photographing unit 440. The first photographing unit 420 and the second photographing unit 440 may be provided to photograph the printed circuit board B at the same resolution. Optionally, the first imaging unit 420 and the second imaging unit 440 may be provided to photograph the printed circuit board B at different resolutions. The first photographing unit 420 and the second photographing unit 440 may photograph upper surfaces of the printed circuit board B that are different from each other. Optionally, the first photographing unit 420 and the second photographing unit 440 photograph the same printed circuit board B, but the first photographing unit 420 photographs the top surface of the printed circuit board B. The 2 imaging unit 440 can photograph the lower surface of the printed circuit board B. FIG.

The image photographed by the photographing unit is transmitted to the image processor 600. The image processor 600 reads from the photographed image whether the printed circuit board B has a bad pattern or whether foreign matter is attached to the pattern or the surface of the printed circuit board B. FIG.

An inversion member 500 is installed in the third side region of the base 320. 6 is a perspective view of the inversion member 500 of FIG. 1. The reversal member 500 has a finger 510, a connecting rod 520, a rotation axis 530, a support block 540, a vertical support 550, and a driver 560. Finger 510 holds printed circuit board (B). Finger 510 has pins 512 having vacuum holes 512a formed at one end thereof. The pins 512 may be provided in plural in a row. A plurality of fingers 510 may be provided, and four fingers 510 are provided in this embodiment. The fingers 510 are disposed parallel to each other and provided to correspond to the grooves 342 formed in the stage 340. The finger 510 is provided to rotate, linearly move in the front-rear direction, and linearly move up and down. The driver includes a rotary driver 562 for rotating the finger 510, a horizontal driver 564 for linearly moving the finger 510 in the front-rear direction, and a vertical driver 566 for linearly moving the finger 510 in the vertical direction. Have

One end of the fingers 510 is fixed to the connection rod 520. The connecting rod 520 is fixedly installed on the rotation shaft 530, and the rotation shaft 530 is supported by the support block 540. The support block 540 has a generally cuboidal shape. A portion of the rotation shaft 530 is inserted into the support block 540, and a portion protrudes from the support block 540. The rotation shaft 530 is rotatable about the support block 540 and is coupled to the support block 540 to be movable in the front-rear direction. One end of the rotation shaft 530 is provided with a motor that is a rotation driver 530. The horizontal driver 564 moves the rotation shaft 530 in the front-rear direction, and a hydraulic cylinder may be used as the horizontal driver 564. The vertical support 550 is provided with a guide rail 552 provided to be in a straight line in the vertical direction. The bracket 560 is coupled to the guide rail 552 to be movable up and down with respect to the vertical support 550, and the support block 540 is fixedly coupled to the bracket 560. The bracket 560 is moved up and down by the vertical driver 566.

7A to 7E are diagrams sequentially illustrating a process of inverting the printed circuit board B on which the inversion member 500 is placed on the stage 340. Initially, the fingers 510 vacuum suck the printed circuit board B while the pins 512 protrude downward. Fingers 510 move in a direction above a certain height to lift printed circuit board B from stage 340 (FIG. 7A). The fingers 510 then move backwards so that the printed circuit board B escapes to the side of the stage 340 (FIG. 7B). The fingers 510 are rotated 180 degrees by the rotation axis 530 to invert the printed circuit board B (FIG. 7C). The printed circuit board B rests on the fingers 510. Fingers 510 move forward, so printed circuit board B is positioned above stage 340 (FIG. 7D). The fingers are then moved downward to place the printed circuit board B on the stage 340, and the fingers 510 are inserted into the grooves 342 formed in the stage 340 (FIG. 7E). The vacuum is cut off at the fingers 510 and the fingers 510 are moved backwards.

Unlike the above, the fingers 510 can lift the printed circuit board B high enough from the stage 340 and rotate the printed circuit board B directly on top of the stage 340.

In addition, unlike the above, the fingers 510 are initially inserted into the grooves 342 provided in the stage 340, and then moved upward to lift the printed circuit board B from the stage 340. . Thereafter, the fingers 510 are rotated 180 degrees to invert the printed circuit board B, and the fingers are in a state where the printed circuit board B is vacuum-adsorbed to the fingers 510 under the fingers 510. 510 may place the printed circuit board B on the stage 340.

8 is a perspective view of the transfer unit 40 of FIG. 1. The transfer unit 40 moves the printed circuit board B on the stage 340 moved to the initial position P1 to the carrying out unit 20, and at the same time the printed circuit board B placed on the loading unit 10. Has a structure for moving onto the stage 340 moved to the initial position (P1).

Referring to FIG. 8, the transfer unit 40 has a rotating body 710, a first arm 720, a second arm 740, a support plate 770, and a driver 780. Each of the first arm 720 and the second arm 740 has a rod shape, and holds the printed circuit board B. FIG. A vacuum hole 722 is formed at the end of the lower surface of the first arm 720 and the second arm 740 to suck the printed circuit board B in a vacuum. The first arm 720 extends in the lateral direction from the rotor 710. The second arm 740 is disposed on the same plane as the first arm 720 and extends in a lateral direction from the rotating body 710 perpendicular to the first arm 720. The first arm 720, the second arm 740, and the rotating body 710 have a 'b' shape when viewed from the top. The first arm 720 and the second arm 740 are coupled to the rotating body 710 to be rotated and driven together with the rotating body 710. The first arm 720, the second arm 740, and the rotating body 710 may be integrally manufactured.

The rotating body 710 is installed in the space defined by the carrying-in unit 10, the carrying out unit 20, and the stage 340 put in the initial position P1. The rotating shaft 760 is fixedly coupled to the rotating body 710, and a support plate 770 is positioned below the rotating shaft 760. The rotating shaft 760 is rotatable with respect to the support plate 770 and is coupled to the support plate 770 so as to be moved up and down with the support plate 770. The driver 780 has a rotation driver 782 for rotating the rotor 710 and a vertical driver 784 for linearly moving the rotation shaft 710 in the vertical direction. The rotation driver 782 is coupled to the rotation shaft 760 and installed on the support plate 770. As the rotary driver 782, a motor or a rotary cylinder may be used. As the vertical driver 784, a pneumatic cylinder for linear movement may be used.

9A and 9B are views illustrating a process of transferring the printed circuit board B by the transfer unit 40. On the carriage 140 of the carrying-in unit 10, the printed circuit board B1 on which the inspection conveyed from the mounting table 120 is to be performed is placed, and the stage moved to the initial position P1 of the inspection unit 30 ( The printed circuit board B2 on which the imaging is completed is placed on the 340. The first arm 720 of the transfer unit 40 is positioned above the carriage 140 of the loading unit 10, and the second arm 740 is moved to the initial position P1 of the inspection unit 30. It is located above the stage 340. The rotating body 710 moves down, the first arm 720 vacuum-adsorbs the printed circuit board B1 placed on the carriage 140 of the loading unit 10, and the second arm 740 is initially The printed circuit board B2 placed on the stage 340 moved to the position P1 is vacuum-adsorbed (FIG. 9A). The rotating body 710 moves upwards, and the second arm 740 is rotated 90 degrees in the direction toward the carrying out unit 20. The second arm 740 is moved above the carriage 140 of the carrying out unit 20, and the first arm 720 is moved above the stage 340 positioned at the initial position P1. The first arm 720 and the second arm 740 are moved downwards. The printed circuit board B1 adsorbed on the first arm 720 is placed on the stage 340 at the initial position P1, and the printed circuit board B2 at the second arm 740 is the carrying unit ( 20) on the carriage 140 (FIG. 9B). The stage 340 is rotated, and the rotor 710 is rotated 90 degrees in the direction in which the first arm 720 faces the loading unit 10. The first arm 720 is again positioned above the carriage 140 of the loading unit 10, and the second arm 740 is moved onto the stage 340 moved to the initial position P1. The above process is repeated continuously.

Next, an example of a method of inspecting whether the printed circuit board B is defective will be described with reference to FIG. 10. The printed circuit boards B are the first substrate, the second substrate, the third substrate,... In the order in which the inspection is performed. It is called. The stages 340 are referred to as the first stage, the second stage, the third stage, and the fourth stage in the order in which they are placed in the clockwise direction.

First, the surface on which each of the printed circuit boards B is to be inspected is determined (step S10). The inspection surface may be both sides of the printed circuit board B, or one surface of the printed circuit board B. FIG. One surface may be an upper surface of the printed circuit board B on which the pattern is formed.

When the inspection surface is double-sided, each printed circuit board B passes through the initial position P1, the first inspection position P2, the inversion position P3, and the second inspection position P4, and then again the initial position ( Moved to P1, and photographs the top surface of the printed circuit board B at the first inspection position P2, inverts the printed circuit board B at the inverted position P3, and the printed circuit at the second inspection position P4. Imaging of the lower surface of the substrate B is performed. An example of a specific inspection method is as follows.

First substrate, second substrate, third substrate,... Is placed in the mounting table 120 from top to bottom. The horizontal mover 160 moves the first substrate from the mounting table 120 to the carriage 140 of the loading unit 10. Rotation of the conveyor belt 142 moves the first substrate in the carriage 140 toward the inspection unit 30. Part of the foreign matter adhered on the first substrate is removed by the foreign matter removing member 180 during the movement. Second substrate, third substrate,... Is continuously moved from the mounting table 120 to the loading unit 10 at the same time interval as the first substrate. The first stage is placed at the initial position P1. The transfer unit 40 transfers the first substrate to the first stage (step S110).

The stage unit 300 is rotated 90 degrees clockwise. The first stage is moved to the first inspection position P2, and the second stage is moved to the initial position P1 (step S120).

The upper surface of the first substrate is photographed, and the second substrate is moved from the carrying in unit 10 to the second stage (step S130).

The stage unit 300 is rotated 90 degrees clockwise. The first stage is moved to the inverted position P3, the second stage 340 is moved to the first inspection position P2, and the third stage is moved to the initial position P1 (step S140).

The first substrate is inverted, the upper surface of the second substrate is photographed, and the third substrate is moved to the third stage (step S150).

The stage unit 300 is rotated 90 degrees clockwise. The first stage is moved to the second inspection position P4, the second stage is moved to the inverted position P3, the third stage is moved to the first inspection position P2, and the fourth stage is the initial position ( It moves to P1) (step S160).

The rear surface of the first substrate is photographed, the second substrate is inverted, the upper surface of the third substrate is photographed, and the fourth substrate is moved to the fourth stage (step S170).

The stage unit 300 is rotated 90 degrees clockwise. The first stage is moved to the initial position P1, the second stage is moved to the second inspection position P4, the third stage is moved to the inverted position P3, and the fourth stage is moved to the first inspection position ( It moves to P2) (step S180).

At the initial position P1, the first substrate is moved to the carriage 240 of the carrying out unit 20, and at the same time the fifth substrate is moved to the first stage. The rear surface of the second substrate is photographed, the third substrate is inverted, and the upper surface of the fourth substrate is photographed (step S190).

The first substrate is moved from the carriage 140 of the carrying out unit 20 to the mounting table 120.

The above-described process is continuously repeated, and the initial position P1 of the printed circuit board B to be inspected and the movement of the printed circuit board B whose inspection is completed from the stage 340 placed at the initial position P1 is performed. Movement to the stage 340 placed at the same time takes place at the same time.

When the inspection surface has one upper surface, each printed circuit board B passes through any one of the initial position P1, the first inspection position P2, and the second inspection position P4, and then returns to the initial position P1. Is moved. The imaging of the upper surface of the printed circuit board B different from each other at the first inspection position P2 and the second inspection position P4 is performed. In this case, the inversion of the printed circuit board B is not performed. An example of a specific inspection method is as follows.

The process of transferring the printed circuit boards B in the loading unit 10 is the same as the case where the above-described inspection surface is double sided.

The first substrate is moved to the first stage placed at the initial position P1 in the loading unit 10 (step S210).

The stage unit 300 is rotated 180 degrees clockwise. The first stage is moved to the inverted position P3, the second stage is moved to the first inspection position P2, and the third stage is moved to the initial position P1 (step S220).

The second substrate is moved to the third stage (step S230).

The stage unit 300 is rotated 90 degrees clockwise. The first stage is moved to the second inspection position P4, the second stage is moved to the inverted position P3, the third stage is moved to the first inspection position P2, and the fourth stage is the initial position ( It moves to P1) (step S240).

Image capturing of the first substrate and the second substrate is performed (step S250).

The stage unit 300 is rotated 90 degrees clockwise. The first stage is moved to the initial position P1, the second stage is moved to the second inspection position P4, the third stage is moved to the inverted position P3, and the fourth stage is moved to the first inspection position ( It moves to P2) (step S260).

The first substrate is moved to the carrying out unit 20, and at the same time, the third substrate is moved to the first stage (step S270).

The stage unit 300 is rotated 180 degrees clockwise. The first stage is moved to the inverted position P3, the second stage is moved to the first inspection position P2, the third stage is moved to the initial position P1, and the fourth stage is moved to the second inspection position ( It moves to P4) (step S280)

The second substrate is moved to the unloading unit 20, and at the same time, the third substrate is moved to the first stage (step S290).

The above-described process is continuously repeated, and the stage 340 placed at the initial position P1 is moved from the stage 340 to the initial position P1 of the printed circuit board B on which the inspection and the inspection are to be performed. Movement to the placed stage 340 takes place simultaneously.

In the above-mentioned example, it was demonstrated that the test surface of the printed circuit board B is selected first, and then the test is performed. In this case, the first photographing member 420 and the second photographing member 440 are provided to photograph the printed circuit board B with the same resolution. Optionally, the inspection surface of the printed circuit board B may be made only on both sides. In this case, the first photographing member photographing the surface on which the pattern is formed may be provided to photograph the printed circuit board B at a higher resolution than the second photographing member photographing the opposite surface.

In the above-described example, the stage unit 300 has been described as having four stages 340. However, stage unit 300 may have a greater number of stages 340. For example, six stages 340 are provided, and each stage 340 passes through an initial position, a first inspection position, a second inspection position, an inversion position, a third inspection position, and a fourth inspection position, and then is initialized again. Can be moved to a location. In this case, the stage unit 300 may be rotated by 60 degrees at a time.

1 is a plan view of an inspection apparatus according to a preferred embodiment of the present invention.

2 is a cross-sectional view showing an example of the mounting table of FIG.

3 is a cross-sectional view illustrating an example of the foreign material removing member of FIG. 1.

4 is a cross-sectional view illustrating another example of the foreign material removing member of FIG. 1.

5 is a perspective view of the stage unit of FIG. 1.

6 is a perspective view of the inversion unit of FIG. 1.

7A through 7B are diagrams sequentially illustrating a process of inverting a printed circuit board.

8 is a perspective view of the transfer unit of FIG. 1.

9A and 9B are views illustrating a process of transferring printed circuit boards by a transfer unit.

10 is a flowchart sequentially showing a test method according to an exemplary embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10: carrying unit 20: carrying unit

30: inspection unit 40: transfer unit

120: loading table 140: carrier

180: foreign material removing member 320: base

340: Stage 420: First shooting member

440: second shooting member 510: finger

710: rotating body 720: first arm

740: the second arm

Claims (31)

delete In the device for inspecting the inspection object, An inspection unit in which the inspection object is inspected; An import unit in which an inspection object to be carried into the inspection unit is placed; A carrying out unit on which an inspected object taken out from the inspecting unit is placed; And And a transfer unit for transferring an inspection object between the carry-in unit and the inspection unit, and the carry-out unit and the inspection unit, The transfer unit is configured to simultaneously perform a process of transferring the inspection object placed on the carrying unit to the inspection unit and a process of transferring the inspection object placed on the inspection unit to the carrying unit, The inspection unit, A plurality of stages which are movable between an initial position for exchanging an inspection object with the loading unit and the carrying unit, an inspection position at which an image is taken with respect to the inspection object, and an inversion position for reversing the inspection object, and on which an inspection object is placed; A photographing member for photographing a test object moved to the test position; An image processor which receives a photographed image from the photographing member and reads whether a test object is defective from the image; And And an inversion member for inverting the inspection object moved to the inversion position. The method of claim 2, The transfer unit, A rotatable body disposed between the carrying unit, said carrying unit, and said stage moved to said initial position; A first arm extending from the rotating body and capable of holding an inspection object; And And a second arm extending perpendicularly from the rotatable body to the first arm and capable of holding an inspection object. The method according to claim 2 or 3, The test position comprises a first test position and a second test position, The initial position, the first inspection position, the inverted position, and the second inspection position are the initial position, the first inspection position, the inversion position, and the second inspection position sequentially as each stage is rotated. And an inspection device arranged to move to the initial position. The method according to claim 2 or 3, The inspection unit further includes a rotatable base having a square shape when viewed from the top, The stage is provided on each side of the base to be rotated with the base, The photographing member is disposed on the first side and the second side of the base, respectively, The inversion member is disposed on the third side of the base perpendicular to the first side and the second side, And the transfer unit is disposed on the fourth side of the base facing the third side and adjacent to the carrying unit and the carrying unit. The method of claim 3, wherein The lower surface of the first arm and the second arm is provided with a vacuum hole for holding the inspection object in a vacuum. The method according to claim 2 or 3, The inversion member, A finger holding the inspection object; A rotary driver for rotating the finger so that the inspection object is inverted; A vertical driver for moving the finger in a vertical direction; And A horizontal driver for moving the finger in the front and rear direction, An inspection apparatus, characterized in that grooves through which the finger can be inserted are formed on an upper surface of each stage. The method of claim 7, wherein The plurality of fingers are provided in parallel with each other, the fingers are coupled to the connecting member, the rotary driver includes a rotation axis fixed to the connecting member, And the grooves are formed to correspond to each of the fingers. The method of claim 2 or 3, The import unit, A carrier on which the inspection object is linearly moved; And a foreign material removing member installed on the carriage to remove foreign matter attached to the inspection object. The method of claim 9, The pallet has a conveyor belt spaced a certain distance and supporting both edges of the inspection object, The foreign material removing member, A first roller disposed to contact the upper surface of the inspection object placed on the conveyor belt and provided with an adhesive on an outer surface thereof; And a second roller disposed to be in contact with the lower surface of the inspection object placed on the conveyor belt and provided with an adhesive on an outer surface thereof. The method of claim 10, The foreign material removing member, An upper roller disposed to be in contact with the first roller and provided with an adhesive on an outer surface thereof to remove foreign substances attached to the first roller; And a lower roller disposed to be in contact with the second roller and provided with an adhesive on an outer surface thereof to remove foreign substances attached to the second roller. The method of claim 2 or 3, The import unit, A loading table on which the test objects are placed; Further comprising a horizontal driver for moving the inspection object placed on the loading table to the carrier, The loading table is, A frame providing a space in which the inspection objects are placed; A lifting plate disposed in the frame and supporting the inspection objects; A vertical driver for moving the lifting plate up and down; And And a sensor for detecting whether an inspection object is placed on the elevating plate. In the device for inspecting the inspection object, An inspection unit in which the inspection object is inspected; An import unit in which an inspection object to be inspected in the inspection unit is placed; A carrying-out unit, on which an inspection object subjected to inspection in the inspection unit is placed; And And a transfer unit for transferring an inspection object between the carry-in unit and the inspection unit, and the carry-out unit and the inspection unit, The inspection unit, A first photographing member and a second photographing member for photographing the inspection object; An inverting member for inverting the inspection object; An image processor configured to receive an image captured by the first photographing member and the second photographing member, and to read whether an inspection object is defective from the image; An initial position for exchanging an inspection object with the carrying unit and the carrying unit by rotation, a first inspection position provided with the first imaging member, an inverted position provided with the inversion member, a second inspection provided with the second imaging member And a plurality of stages movable between the positions and on which the inspection object is placed. The method of claim 13, The inspection unit further comprises a base rotated, The base is provided such that the stage is rotated with the base, And the first photographing member, the inverting member, and the second photographing member are arranged so that each of the stages can be sequentially reached upon rotation. The method according to claim 13 or 14, The transfer unit, A rotatable body disposed between the carrying unit, said carrying unit, and said stage moved to said initial position; A first arm extending from the rotating body and capable of holding an inspection object; And And a second arm extending perpendicularly from the rotatable body to the first arm and capable of holding an inspection object. The method according to claim 13 or 14, The inversion member, A finger for holding the inspection object by vacuum; A driver for rotating the finger and linearly moving in the vertical direction and the longitudinal direction, And a groove provided on the upper surface of the stage as a movement path of the finger when the finger moves in the front-back direction and the vertical direction. delete In the method of inspecting a test object, The inspection object is moved from the loading unit to the inspection unit, and the inspection unit inspects whether the inspection object is defective, and the inspection-completed substrate is moved to the export unit, Using two arms rotatable by one driver and provided at right angles to each other, the movement of the inspection object from the loading unit to the inspection unit and the movement of the inspection object from the inspection unit to the loading unit simultaneously Do it, The inspection unit is provided with a plurality of stages on which the test object can be placed, and the stages are sequentially movable to the initial position, the first inspection position, the inverted position, and the second inspection position by rotation. The carry-in unit and the carry-out unit and the inspection unit are positions for exchanging inspection objects, and the first inspection position and the second inspection position are positions at which photographing of the inspection object is performed by a photographing member, and the reversal position is inspection An inspection method, characterized in that the position of the inversion of the object. The method of claim 18, The stage is provided with four, wherein the initial position, the first inspection position, the inverted position, the second inspection position is a position where the stages are each moved by 90 degrees rotation. The method of claim 18, The reversal of the inspection object is carried out by vacuum suction of the inspection object placed on the stage with a finger from the top to lift the inspection object from the stage, and rotate the finger 180 degrees to reverse the inspection object, and the finger of the stage And dropping the inspection object on the stage by moving downwardly into the groove provided on the upper surface. The method of claim 18, The reversal of the test object is to lift the test object from the stage and vacuum-suck the test object from the stage by inserting a finger into a groove provided in the upper surface of the stage and lifting the finger, and rotating the finger 180 degrees to perform the test. Inverting the object, placing the test object on the upper surface of the stage, and removing the vacuum. The method of claim 18, One of the two arms provided at right angles vacuum-absorbs the inspection object positioned in the loading unit, and the other vacuum-adsorbs the inspection object placed on the stage moved to the initial position, and a rotating body connected to the two arms. Is rotated 90 degrees in the direction toward the carry-out unit, whereby the inspection object placed on the stage moved to the initial position is moved to the take-out unit and at the same time the inspection object placed on the carry-in unit is moved to the initial position. Inspection method characterized in that it is moved on the stage. The method of claim 18, The inspection object has a thin plate shape having an upper surface and a lower surface, Depending on the number of inspection surfaces of the inspection object to perform a different inspection process, When the inspection surface includes both the upper and lower surfaces, each of the inspection objects is sequentially moved to the initial position, the first inspection position, the inverted position, the second inspection position, and the initial position, In the first inspection position, an inspection is performed on any one of an upper surface and a lower surface of the inspection object, and an inspection of the other of the upper and lower surfaces of the inspection object is performed at the second inspection position. When the inspection surface is an upper surface, each inspection object is sequentially moved to the initial position, any one of the first inspection position and the second inspection position, and the initial position, and the first inspection position and The inspection method, characterized in that the inspection is performed on the inspection object different from each other at the second inspection position. delete The method according to any one of claims 18 to 23, And the inspection object is a printed circuit board. The method of claim 25, The inspection item of the inspection object is an inspection method, characterized in that the foreign matter inspection attached to the surface of the inspection object. delete delete delete delete delete

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