KR100855174B1 - 기판 돔을 포함하는 진공 장치, 그 조립 및 분해 방법, 및 기판 돔을 포함하는 진공장치에서의 성막 방법 - Google Patents
기판 돔을 포함하는 진공 장치, 그 조립 및 분해 방법, 및 기판 돔을 포함하는 진공장치에서의 성막 방법 Download PDFInfo
- Publication number
- KR100855174B1 KR100855174B1 KR1020067022026A KR20067022026A KR100855174B1 KR 100855174 B1 KR100855174 B1 KR 100855174B1 KR 1020067022026 A KR1020067022026 A KR 1020067022026A KR 20067022026 A KR20067022026 A KR 20067022026A KR 100855174 B1 KR100855174 B1 KR 100855174B1
- Authority
- KR
- South Korea
- Prior art keywords
- dome
- substrate
- base
- rotating mechanism
- side gear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/548—Controlling the composition
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004187285A JP4002959B2 (ja) | 2004-06-25 | 2004-06-25 | 基板ドーム回転機構 |
| JPJP-P-2004-00187285 | 2004-06-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20070024518A KR20070024518A (ko) | 2007-03-02 |
| KR100855174B1 true KR100855174B1 (ko) | 2008-08-29 |
Family
ID=35776645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020067022026A Expired - Fee Related KR100855174B1 (ko) | 2004-06-25 | 2005-01-24 | 기판 돔을 포함하는 진공 장치, 그 조립 및 분해 방법, 및 기판 돔을 포함하는 진공장치에서의 성막 방법 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4002959B2 (ja) |
| KR (1) | KR100855174B1 (ja) |
| CN (1) | CN1946873B (ja) |
| WO (1) | WO2006001095A1 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008138276A (ja) * | 2006-12-05 | 2008-06-19 | Tsukishima Kikai Co Ltd | 真空成膜装置 |
| CN104651795B (zh) * | 2015-03-10 | 2017-01-11 | 丹阳市鼎新机械设备有限公司 | 一种镜片真空镀膜机用旋转台 |
| JP6019310B1 (ja) * | 2015-04-16 | 2016-11-02 | ナルックス株式会社 | 蒸着装置及び蒸着装置による成膜工程を含む製造方法 |
| EP3840012A1 (en) * | 2019-12-20 | 2021-06-23 | Essilor International | Optimized crucible assembly and method for physical vapor deposition |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0429654A (ja) * | 1990-05-25 | 1992-01-31 | Honda Motor Co Ltd | 3組の遊星歯車列を用いた一体遊星歯車変速機 |
| JPH0835065A (ja) * | 1994-07-22 | 1996-02-06 | Murata Mfg Co Ltd | 真空成膜装置 |
| KR960013625B1 (ko) * | 1992-12-22 | 1996-10-10 | 재단법인 한국전자통신연구소 | 진공 열증착장치 |
| JP2001073136A (ja) * | 1999-09-08 | 2001-03-21 | Showa Shinku:Kk | 光学薄膜製造装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0754286Y2 (ja) * | 1990-06-27 | 1995-12-18 | 関西日本電気株式会社 | 蒸着用プラネタ |
| DE19680845C1 (de) * | 1996-11-01 | 2002-06-06 | Theva Duennschichttechnik Gmbh | Vorrichtung zur Herstellung oxidischer Dünnschichten |
-
2004
- 2004-06-25 JP JP2004187285A patent/JP4002959B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-24 CN CN2005800131933A patent/CN1946873B/zh not_active Expired - Fee Related
- 2005-01-24 WO PCT/JP2005/000851 patent/WO2006001095A1/ja not_active Ceased
- 2005-01-24 KR KR1020067022026A patent/KR100855174B1/ko not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0429654A (ja) * | 1990-05-25 | 1992-01-31 | Honda Motor Co Ltd | 3組の遊星歯車列を用いた一体遊星歯車変速機 |
| KR960013625B1 (ko) * | 1992-12-22 | 1996-10-10 | 재단법인 한국전자통신연구소 | 진공 열증착장치 |
| JPH0835065A (ja) * | 1994-07-22 | 1996-02-06 | Murata Mfg Co Ltd | 真空成膜装置 |
| JP2001073136A (ja) * | 1999-09-08 | 2001-03-21 | Showa Shinku:Kk | 光学薄膜製造装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006001095A1 (ja) | 2006-01-05 |
| KR20070024518A (ko) | 2007-03-02 |
| JP2006009082A (ja) | 2006-01-12 |
| JP4002959B2 (ja) | 2007-11-07 |
| CN1946873B (zh) | 2010-09-29 |
| CN1946873A (zh) | 2007-04-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH06224139A (ja) | 全ウエハデポジション用装置 | |
| KR100855174B1 (ko) | 기판 돔을 포함하는 진공 장치, 그 조립 및 분해 방법, 및 기판 돔을 포함하는 진공장치에서의 성막 방법 | |
| JP6000485B1 (ja) | シール面加工機及び方法 | |
| JPH09117708A (ja) | 基板の回転処理装置 | |
| US20090295054A1 (en) | Support device for sputtering machine | |
| US9765427B2 (en) | Vapor phase growth apparatus | |
| JP2024508410A (ja) | ギアボックス中の歯の動力損失を低減するシステム | |
| JP4701486B2 (ja) | 電子ビーム蒸着用電子銃、蒸着材料保持装置、及び蒸着装置 | |
| TWI586906B (zh) | Movable type rotating device and film forming device | |
| JP2006128561A (ja) | 基板回転機構およびそれを備えた成膜装置 | |
| JPH02311239A (ja) | 切削装置の切屑回収構造 | |
| JPH0369639B2 (ja) | ||
| JP5613083B2 (ja) | サセプタカバー、該サセプタカバーを備えた気相成長装置 | |
| JP4989406B2 (ja) | パーティクル付着防止カバー、このパーティクル付着防止カバーを設けた蒸着装置及び蒸着方法 | |
| CN112282776A (zh) | 一种可更换盾构机激光扫描仪装置 | |
| CN220977127U (zh) | 一种阴极靶结构及镀膜设备 | |
| JP2006009082A5 (ja) | ||
| JP4207126B2 (ja) | ウェーハ面取り装置 | |
| CN215409984U (zh) | 一种承托机构 | |
| JP3824856B2 (ja) | 真空蒸着装置 | |
| KR20170021327A (ko) | 회전기구 및 이 회전기구를 구비한 막두께 모니터 | |
| JP4219295B2 (ja) | イオン注入装置 | |
| KR20200106654A (ko) | 승강하는 바닥 밀폐부에 다수의 이동 도가니를 갖는 다중 진공증착 장치 | |
| JP3811003B2 (ja) | 真空蒸着装置 | |
| JP4130557B2 (ja) | 水中回転機械における軸受潤滑グリスの掻揚装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20120810 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20130809 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20140818 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20150817 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20160812 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20170823 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20170823 |