KR100702952B1 - Tape feeder and electronic component mounting device having same - Google Patents

Abstract

According to the present invention, a tape feeder and an electronic component mounting apparatus having the same are disclosed. The tape feeder is a tape feeder which transfers the tape containing the electronic component and sequentially picks up the electronic component by the mounting head. The tape feeder positions the sprocket for transferring the tape to a predetermined pitch and the position of the electronic component transferred to the pickup position. Detecting means for detecting information. According to the disclosed tape feeder and the electronic component mounting apparatus having the same, the adsorption error of the electronic component is prevented while the mounting space and installation / operation cost are minimized.

Description

Tape feeder and mounting apparatus for electrical parts having the same

1A and 1B are views illustrating a structure in which an electronic component housed in a tape is transferred to a mounting head;

2 is a schematic perspective view of an electronic component mounting apparatus according to an embodiment of the present invention;

3 is a plan view of a tape feeder according to an embodiment of the present invention,

4 is a perspective view showing a part roll on which the tape of FIG. 3 is wound;

5 is a plan view showing the structure of the tape conveyed to the pick-up position,

6 is a cross-sectional view showing a structure in which position information of an electronic component is detected;

7 is a view schematically showing position information of an electronic component obtained from the detecting means of FIG. 6;

8 is a cross-sectional view showing another structure in which position information of an electronic component is detected;

9 is a view schematically showing position information of an electronic component obtained from the detecting means of FIG. 8; FIG.

<Description of Symbols for Major Parts of Drawings>

110: guide frame 111: first Y-axis guide

112: 2nd Y-axis guide 115: X-axis guide

120: mounting head 121: head drive unit

122: adsorption nozzle 140: PCB transfer means

142: circuit board 150: host computer

200: tape feeder 210: feeder frame

220: part reel 221: tape

222: top cover 223: storage tape

224: feed hole 225: alignment mark

230: Sprocket 235: Tape Guide

240: upper cover recovery means 251,351: detection means

252,352 Detection mirror 353 Detection light source

The present invention relates to a tape feeder and an electronic component mounting apparatus having the same, and more particularly, to a tape feeder which minimizes manufacturing / operation cost of the mounting space and equipment required while eliminating or reducing the adsorption error of the electronic component. An electronic component mounting apparatus having the same.

An electronic component mounting apparatus is a device for mounting an electronic component on a circuit board. Recently, not only individual electronic components, but also circuit boards have become more dense and highly functional, and the number of electronic components mounted on circuit boards has increased significantly. Accordingly, the necessity for the electronic component mounting apparatus to operate accurately at a high speed is increased.

BACKGROUND ART In general, an electronic component mounting apparatus includes a stage capable of two-dimensional movement and a mounting head provided on the stage, wherein the mounting head is provided with a plurality of suction nozzles. The suction nozzle absorbs the electronic components supplied by the tape feeder, and then moves to the circuit board to mount the electronic components. The suction nozzle changes the pressure of the nozzle so that the electronic components supplied by the tape feeder are sucked or mounted on a circuit board.

The tape feeder supplies the electronic components sequentially by transferring the tape containing the electronic components to a constant pitch. By the way, tape feeders generally cannot transfer electronic components to the correct pickup position due to processing limitations or mechanical wear. Thus, there is a certain positional deviation between the exact position previously input to the system and the actual position conveyed by the tape feeder. In this case, there arises a problem that the adsorption rate of the electronic component due to the adsorption nozzle is lowered, and the adsorption itself becomes impossible when a slight positional deviation occurs. In particular, recently, as the electronic components are miniaturized, adsorption defects due to positional deviations increase.

1A and 1B show a structure in which an electronic component housed in a tape is picked up by a mounting head. Referring to the drawings, the electronic component 50 accommodated in the tape 23 is transferred to the pick-up position, the mounting head 22 is lowered to suck the electronic component 50. Here, as shown in FIG. 1A, when the electronic component 50 is transferred to the correct pickup position, the position S of the suction nozzle 22 and the position S` of the electronic component 50 coincide with each other. 1B, a predetermined deviation e exists between the position S of the suction nozzle 22 and the position S` of the electronic component 50, as shown in FIG. 1B. The problem of adsorption failure mentioned above arises.

In order to solve the problem of the adsorption failure, the conventional mounting apparatus is provided with a camera operated by a separate drive source, to obtain the position information from the parts image captured by the camera to move the suction nozzle to the correct position. According to this prior art, since a separate drive equipment is required for position measurement, a problem arises in that the installation space and installation / operation cost of the equipment are wasted.

On the other hand, the above-described prior art is roughly classified into two types according to the driving method, that is, when the mounting head and the camera are driven by the same axis, and when both are driven by different axes. In the case of electrons driven by the same axis, it is troublesome to separately drive a camera in order to capture a part image, and a problem occurs that a work time is delayed. Even in the latter case, the mounting head and the camera driven by the different axes require a separate avoidance movement in order to avoid interference, which leads to the inconvenience of driving and the delay of the working time.

An object of the present invention is to provide a tape feeder of an improved structure in which the adsorption error of the electronic component is eliminated or reduced in order to solve the above problems and other problems, and an electronic component mounting apparatus having the same.

Another object of the present invention is to provide a tape feeder and an electronic component mounting apparatus having the same, in which the additional components are minimized while achieving the above-described object, thereby reducing installation space and manufacturing / operation cost.

Still another object of the present invention is to provide a tape feeder and an electronic component mounting apparatus having the same, which support the productivity of the mounting work.

In order to achieve the above object, the tape feeder according to an aspect of the present invention,

A tape feeder which transfers a tape in which electronic parts are stored so that electronic parts are sequentially picked up by a mounting head.

A sprocket for transferring the tape to a predetermined pitch; And

And detecting means for detecting positional information of the electronic component transferred to the pick-up position.

It is preferable that an alignment mark recognized by the detecting means is formed on the tape to indicate the position of the electronic component housed therein. Here, the alignment mark may be a through hole drilled in a row on the tape.

 In a preferred embodiment of the present invention, a detection means and a detection mirror are disposed above and below the tape to correspond to each other, and the detection means includes a laser generator for irradiating laser light and a laser beam reflected from the detection mirror. A laser light quantity measuring device is provided. Here, the laser generator irradiates laser light to the alignment mark formed on the tape, and the detection mirror reflects the laser light incident through the alignment mark back to the laser light quantity meter.

 In another embodiment of the present invention, a detection light source and a detection means are disposed above and below the tape to correspond to each other, the detection light source emits irradiation light to the alignment mark formed on the tape, and the detection means The light passing through the alignment mark is captured and captured.

 On the other hand, the electronic component mounting apparatus according to another aspect of the present invention,

 A tape feeder which transfers the tape containing the electronic parts to a predetermined pitch and sequentially supplies the electronic parts, and detects the positional information of the transferred electronic parts and outputs them to a host computer;

A host computer which processes the positional information of the electronic component and outputs it as a control signal to a mounting head; And

And a mounting head configured to receive a control signal from the host computer and pick up an electronic component supplied by the tape feeder.

Preferably in the present invention, the tape feeder,

A sprocket for transferring the tape to a predetermined pitch; And

And detecting means for detecting positional information of the electronic component transferred to the pick-up position.

In the present invention, preferably, in the host computer, a position deviation is calculated from preset pickup positions of the electronic components and detected position information.

In the present invention, preferably, the mounting head includes a head driving unit and at least one suction nozzle supported by the head driving unit and moving up and down.

Meanwhile, the electronic component mounting apparatus may further include a PCB transfer means for transferring a circuit board, wherein the mounting head mounts the picked up electronic component on the circuit board.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. 2 is a schematic perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. Referring to the drawings, the electronic component mounting apparatus includes a guide frame 110 and a mounting head 120 mounted on the guide frame, a PCB transfer means 140, and a tape feeder 200.

The guide frame 110 extends in the Y-axis direction and is mounted on the first Y-axis guide 111 and the second Y-axis guide 112 and the Y-axis guides 111 and 112 spaced apart from each other at predetermined intervals. An X-axis guide 115 is provided. The mounting head 120 installed on the X-axis guide 115 includes a head driving unit 121 and suction nozzles 122 installed on the head driving unit 121, and the suction nozzle 122 includes a head driving unit 121. Multiple can be installed in parallel. The mounting head 120 is moved along the X-axis guide 115 in the X-axis direction and the X-axis position is set, and both ends thereof are mounted on the first Y-axis guide 111 and the second Y-axis guide 112. The Y-axis position is set by moving the obtained X-axis guide 115 in the Y-axis direction. The two-dimensional movement of the mounting head 120 is made by the head driving unit 121 drives the guide frame 110.

The adsorption nozzles 122 installed on the mounting head 120 adsorb the electronic components supplied from the tape feeder 200 to mount the components on the circuit board 142 transferred by the PCB transfer means 140. That is, the adsorption nozzles 122 installed on the mounting head 120 descend to adsorb the electronic components of the tape feeder 200 and rise together with the components, and the X-axis guide 115 and the first Y-axis guide 111 ) And the mounting head 120 moves to the circuit board 142 fixed to the predetermined position by the PCB transfer means 140 by the movement of the second Y-axis guide 112, and the suction nozzles 122 descend. The components are mounted at predetermined positions on the circuit board 142. After the component mounting operation is completed, the mounting head 120 is again moved onto the tape feeder 200 and picks up the electronic components using the suction nozzle 122. The movement of the mounting head 120 is controlled by the host computer 150, that is, the host computer 150 outputs a predetermined control signal to the head driver 121, so that the suction nozzle 122 is a tape feeder. To be accurately moved to the pickup position of 200;

Generally, a plurality of tape feeders are installed in parallel, and FIG. 3 illustrates the tape feeder in more detail. The tape feeder includes a feeder frame 210 and various components supported directly or indirectly on the frame 210. The frame 210 has a part reel 220, a sprocket 230 for transferring the tape 221 wound on the part reel 220 at a constant pitch, and an upper cover 222 separated from the tape 221. The top cover collecting means 240 for collecting, the detecting means 251 for detecting the positional deviation of the tape, and the like are supported.

As shown in FIG. 4, the tape reel 221 in which the electronic component 250 is accommodated is wound in a roll shape in the component reel 220. Such a tape 221 may accommodate the electronic component 250 in a longitudinal direction. A storage tape 223 having spaces formed thereon, and a top cover 222 attached to an upper surface of the storage tape 223 to seal the storage spaces. Alignment marks 225 in a row are formed along one side of the storage tape 223, for example, adjacent to the storage space. These will be described later. One side of the receiving tape 223 is formed with a plurality of transfer holes 224 at regular intervals for the transfer of the tape 221 together with these alignment marks 225.

Referring to FIG. 3 again, the tape 221 wound on the component reel 220 is transferred to the pickup position by the suction head 122 by the sprocket 230 mounted at the front, more specifically, the transfer guide. Guided by the 261, and is transported to the lower side of the tape guide 235 coupled to the upper side of the frame 210. The sprocket 230 is coupled to the feed hole 224 formed in the tape 221, the teeth formed on the outer peripheral surface, to convey the tape 221 at a predetermined pitch. Before the tape 221 reaches the pick-up position by the suction nozzle 122, the top cover 222 attached to the top surface of the tape 221 is separated and the storage tape 223 is exposed. The upper cover 222 separated from the tape 221 passes through the direction changing slit 235 ′ formed in the tape guide 235, and the conveying direction is changed to be transferred to the upper cover recovering means 240 on the other side. . As shown in the figure, the upper cover recovery means 240 may be composed of a pair of recovery gears 241 and 242 engaged with each other. The separated top cover 222 is discharged to the outside while passing between a pair of recovery gears (141, 142) that are reversely rotated.

On the other hand, when the storage tape 223 from which the top cover 222 is separated reaches the pickup position by the suction nozzle 122, the exposed electronic components are sequentially picked up and moved to another position. At this time, the position measurement of the electronic component by the detection means 251 is performed at the pick-up position. This will be described in detail below.

In FIG. 5, the storage tape 223 is transported at a constant pitch P. When the storage tape 223 is transported to the pickup position N, the detection means 251 mounted at the lower side thereof is the pickup position N. FIG. Measure the positional deviation of the electronic parts transferred to). Here, the position deviation refers to the position deviation between the exact position previously input to the system as the pick-up position and the actual position obtained through the measurement, and this position deviation is due to an error normally generated during the transfer process.

FIG. 6 is a diagram for explaining a detection operation when a laser inspection device is applied as an example of the detection means. Although not shown in the drawing, the detecting means 251 may include a light generator for generating a laser beam and a laser light quantity meter for outputting the light quantity of the incident laser beam as an electrical signal. The detection mirror 252 is formed above the detection means 251 to correspond to the detection means 251. As can be seen from the figure, the laser beam irradiated from the detecting means 251 is switched by the detecting mirror 252 and is incident to the detecting means 251 again, where it is acquired by the detecting means 251. By analyzing the intensity of the laser light, the positional deviation can be measured. That is, the detection means 251 irradiates the laser light vertically with respect to the storage tape 223. A part of the irradiated laser light L1 passes through the alignment mark 225 formed on the storage tape 223 to detect the mirror. Incident on 252, the rest of the laser light L2 is blocked by the receiving tape 225. The laser light reflected by the detection mirror 252 passes through the alignment mark 225 again and is incident on the detection means 251. In the detection means 251, as shown in FIG. The same detection signal can be obtained, for example, by a laser light quantity meter which generates a voltage in proportion to the light quantity of the laser light. Referring to the figure, it can be seen that a high level voltage V1 is detected in a portion corresponding to the alignment mark 225, and a low level voltage V2 is detected in other portions. Analyzing such an electrical signal, it can be seen that the measured position R of the electronic component is shifted from one position S to one side by e. Here, the information about the exact position (S) is preferably taught to the system in advance. The obtained signal is transmitted to the host computer 150 of the electronic component mounting apparatus, and the host computer 150 applies a control signal to the head driving unit 121 through a predetermined process, whereby the suction nozzle 122 Is transported to the measured position of the electronic component, and accurate pick-up operation is performed.

On the other hand, a camera may be used in addition to the laser as the detection means, for example, a known camera such as a CCD may be used. 8 is a diagram for explaining a detection operation when a camera is applied as another example of the detection means. Referring to the drawings, a detection mirror 352 having a light source 353 attached thereto and a detection means 351 disposed below the storage tape 223 are disposed therebetween. In this case, for example, a light emitting diode may be used as the light source 353. A portion L3 of the irradiation light vertically incident from the upper light source 353 passes through the alignment mark 225 formed on the storage tape 223 and is incident to the detection means 351, and the remaining irradiation light is received in the storage tape 223. Blocked by). The detection means 351 captures the image of the incident irradiated light, and acquires an image as shown in FIG. 9. That is, the incident irradiation light is clearly shown as the high luminance region I1 on the dark background I2, from which the measured position R is spaced apart from the previously taught position S by a position deviation e. It can be seen that. The acquired image is output to the host computer 150 and undergoes a predetermined image processing. The host computer 150 outputs a predetermined control signal to the head driver 121 so that the suction nozzle 122 actually measures the electronic component. To be moved to position R. The measurement data obtained from the detection means 351 is output to the host computer 150 of the electronic component mounting apparatus, and the measurement data is converted into a control signal in an electrical form while passing through the host computer 150. This control signal is transmitted to the head driving unit 121 driving the mounting head 120, thereby moving the suction nozzle 122 to the pick-up position in consideration of the positional deviation can be made to accurately absorb the components.

According to the tape feeder and the electronic component mounting apparatus having the same according to the present invention having the above structure, the following effects can be obtained.

First, according to the present invention, since the correct position of the electronic component transferred to the pick-up position is detected and the suction nozzle is driven using the position information obtained therefrom, the suction error of the electronic component can be drastically reduced.

Secondly, according to the present invention, a separate driving device is not required for the detection means for measuring the position of the part. Therefore, it is possible to save the mounting space and installation / operation costs required for the drive equipment.

Third, in the present invention, since the position information is obtained directly from the position where the electronic component is transferred, the time required for measurement can be reduced as compared with the prior art, and the overall working time of the mounting work is shortened, thereby improving the driving efficiency of the equipment. Can be.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and any person skilled in the art to which the present invention pertains may have various modifications and equivalent other embodiments. Will understand. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (9)

A tape feeder which transfers a tape in which electronic parts are stored so that electronic parts are sequentially picked up by a mounting head. A sprocket for transferring the tape to a predetermined pitch; And And a detecting means fixedly installed to detect positional information of the electronic component transferred to the pick-up position. The method of claim 1, The tape feeder, characterized in that for indicating the position of the electronic component stored in the tape, the alignment mark recognized by the detection means. The method of claim 1, And the alignment mark is a through hole drilled in a row on the tape. The method of claim 1, The detection means and the detection mirror are disposed above and below the tape so as to correspond to each other, and the detection means includes a laser generator for irradiating laser light and a laser light quantity measuring device for capturing laser light reflected from the detection mirror. Featuring a tape feeder. The method of claim 4, wherein And the laser generator irradiates laser light to the alignment mark formed on the tape, and the detection mirror reflects the laser light incident through the alignment mark back to the laser light quantity meter. The method of claim 1, A detection light source and a detection means are disposed to correspond to each other up and down of the tape, and the detection light source emits irradiation light to an alignment mark formed on the tape, and the detection means emits light passing through the alignment mark. A tape feeder characterized by capturing and imaging. delete delete delete

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