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KR100658042B1 - Resistive integrated light emitting diode - Google Patents

Resistive integrated light emitting diode Download PDF

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KR100658042B1
KR100658042B1 KR1020030078404A KR20030078404A KR100658042B1 KR 100658042 B1 KR100658042 B1 KR 100658042B1 KR 1020030078404 A KR1020030078404 A KR 1020030078404A KR 20030078404 A KR20030078404 A KR 20030078404A KR 100658042 B1 KR100658042 B1 KR 100658042B1
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light emitting
emitting diode
enclosure
semiconductor chip
resistor
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KR20050043492A (en
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김창영
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주식회사 신창전기
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Abstract

본 발명의 저항일체형 발광다이오드는 원통형의 외관을 이루는 인클로우저와, 상기 인클로우저의 상면에 연결된 반구형의 렌즈와, 상기 인클로우저 내에 설치되어 전류가 흐르면 빛을 발하는 반도체 칩과, 상기 반도체 칩의 양극과 음극사이에 연결되는 저항과, 상기 반도체 칩의 양극과 연결되어 외부로 인출되는 제1 리드선과, 상기 저항에 연결되어 외부로 인출되는 제2 리드선을 포함하여 구성되어, 발광다이오드와 저항이 일체로 됨으로써 부품수가 줄고 조립공정이 단순화되어 생산비용을 크게 절감할 수 장점을 가진 것이다.The resistive integrated light emitting diode of the present invention includes an enclosure having a cylindrical appearance, a hemispherical lens connected to an upper surface of the enclosure, a semiconductor chip installed in the enclosure and emitting light when current flows between the anode and the cathode of the semiconductor chip. And a first lead wire connected to the anode of the semiconductor chip and drawn out to the outside, and a second lead wire connected to the resistor and drawn out to the outside, wherein the light emitting diode and the resistor are integrally formed. The number is reduced and the assembly process is simplified, which greatly reduces the production cost.

발광다이오드, LED, 하이브리드, 저항Light Emitting Diodes, LEDs, Hybrids, Resistors

Description

저항일체형 발광다이오드{LED combined with resistence }Resistive integrated light emitting diodes {LED combined with resistence}

도 1은 종래기술에 따른 발광다이오드의 단면도1 is a cross-sectional view of a light emitting diode according to the prior art.

도 2는 종래기술에 따른 발광다이오드의 회로도2 is a circuit diagram of a light emitting diode according to the prior art.

도 3은 본 발명의 실시예에 따른 저항일체형 발광다이오드의 단면도3 is a cross-sectional view of a resistance integrated light emitting diode according to an embodiment of the present invention.

도 4는 본 발명의 다른 실시예에 따른 저항일체형의 하이브리드형 발광다이오드의 외관 사시도4 is an external perspective view of a hybrid integrated light emitting diode according to another embodiment of the present invention.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for main parts of the drawings>

10 : 렌즈 20 : 인클로우저10 Lens 20 Enclosure

30 : pn접합 다이오드 반도체 칩 40 : 리드선30 pn junction diode semiconductor chip 40 lead wire

31 : 저항31: resistance

50 : 베이스판 60 : 리브50: base plate 60: rib

본 발명은 발광다이오드에 관한 것으로, 더욱 상세하게는 발광다이오드와 저항이 일체로 되어 부품 수를 줄인 발광다이오드에 관한 것이다.The present invention relates to a light emitting diode, and more particularly, to a light emitting diode in which the number of components is reduced by integrating a light emitting diode and a resistor.

일반적으로 발광다이오드는 LED라고 불리는 것으로서, 전기를 통해주면 전자가 에너지 레벨이 높은 곳에서 낮은 곳으로 이동하면서 특정한 파장의 빛을 내는 화합물 반도체에 의해 만들져 디스플레이 및 광원용 장치 등에 폭넓게 쓰이는 기본 소자이다.In general, light emitting diodes are called LEDs, which are made by compound semiconductors that emit light of a specific wavelength when electrons move from a high energy level to a low energy level, and are widely used in displays and light source devices. .

이러한 발광다이오드는 반도체의 p-n 접합구조를 이용하여 주입된 불순물이 소수캐리어(전자 또는 양공)를 만들어내고, 이들의 재결합(再結合)에 의하여 발광시키는 원리를 이용한 것이다.Such a light emitting diode utilizes the principle that impurities implanted using a p-n junction structure of a semiconductor generate a small number of carriers (electrons or holes) and emit light by recombination thereof.

발광다이오드가 내는 빛의 색상은 p-n 접합 반도체에 첨가되는 불순물의 종류에 따라 적색, 녹색, 청색, 순녹색 등의 총천연색 빛을 낼 수 있다.The color of light emitted from the light emitting diodes may emit full color light such as red, green, blue, and pure green depending on the type of impurities added to the p-n junction semiconductor.

또한, 최근에는 청색 발광다이오드에 인광체(phosphor)를 첨가하여 백색광을 구현하는 기술이 개발됨으로써, 발광다이오드는 소형기기의 광원 및 전구를 대체할 차기 조명 기구로 각광을 받고 있다.In addition, recently, a technology for implementing white light by adding a phosphor to a blue light emitting diode has been developed, and thus, the light emitting diode has been spotlighted as a next lighting device to replace a light source and a light bulb of a small device.

이하, 첨부된 도 1과 도 2를 참조하여 설명하면, 종래기술에 따른 발광다이오드는, 투명 재질로 형성된 반구형의 렌즈(1)와, 상기 렌즈(1)와 연결된 원통형의 인클로우저(2)와, 상기 인클로우저(2)에 밀봉되는 p-n 접합 다이오드(3)와, 상기 p-n 접합 다이오드(3)의 양단과 연결되어 상기 인클로우저(2)의 외부로 인출된 한쌍의 리드선(4)으로 구성된다.1 and 2, a light emitting diode according to the prior art includes a hemispherical lens 1 formed of a transparent material, a cylindrical enclosure 2 connected to the lens 1, It consists of a pn junction diode (3) sealed in the enclosure (2) and a pair of lead wires (4) connected to both ends of the pn junction diode (3) and drawn out of the enclosure (2).

상기 리드선(4)의 일단은 양극에 해당하는 에노드(4a)가 되고, 타단은 음극에 해당하는 캐소드(4b)가 된다.One end of the lead wire 4 becomes the anode 4a corresponding to the positive electrode, and the other end becomes the cathode 4b corresponding to the negative electrode.

위와 같은 발광다이오드가 빛을 내기 위해서는 상기 한쌍의 리드선(4)에 일정한 전압을 가할 필요가 있다. In order to emit light as described above, it is necessary to apply a constant voltage to the pair of lead wires 4.

이때, 가해지는 전압이 부족하게 되면 발광이 되지 않고, 반대로 전압이 높으면 전류가 너무 많이 흐르게 되어 발광다이오드가 파손될 염려가 있다.In this case, when the applied voltage is insufficient, the light is not emitted. On the contrary, when the voltage is high, the current flows too much and the light emitting diode may be damaged.

따라서, 통상적으로 도 2에서와 나타난 바와 같이 발광다이오드(B)와 전원 사이에는 적당한 크기의 저항(11)이 삽입되어 적당한 밝기로 발광하게 하여 발광다이오드(B)와 전원에 무리가 가지 않도록 하고 있다.Accordingly, as shown in FIG. 2, a resistor 11 of a suitable size is inserted between the light emitting diode B and the power source to emit light at a suitable brightness so that the light emitting diode B and the power supply are not overwhelmed. .

위와 같이 전류의 흐름을 제한하는 것으로 전기회로를 순조롭게 동작하도록 하는 기능을 가지고 있는 것이 저항(11)이며 전기 회로에 꼭 필요한 부품중 하나이다.Restriction of the flow of current as described above to have a function to operate the electrical circuit smoothly is a resistor (11) is one of the essential parts of the electrical circuit.

그러나, 위와 같은 종래기술에 따른 발광다이오드는 별도로 저항을 필요로 하므로 부품수가 많아지고, 이로 인해 조립시 공수가 많이 드는 문제점이 있었다.However, the light emitting diode according to the prior art as described above requires a separate resistor, so that the number of parts increases, which causes a lot of labor during assembly.

또한, 발광다이오드와 저항을 별도로 구비하여야 되므로, 제품의 생산단가가 높아지는 문제점이 있었다. In addition, since the light emitting diode and the resistor must be provided separately, there is a problem that the production cost of the product increases.

본 발명은 상기한 종래 기술의 문제점을 해결하기 위하여 안출된 것으로서, 발광다이오드와 저항기가 일체로 된 저항일체형 발광다이오드를 소정의 장소에 간편하고 정밀하게 설치할 수 있도록 하는데 그 목적이 있다.The present invention has been made to solve the above problems of the prior art, and an object of the present invention is to enable a simple and precise installation of a resistor-integrated type light emitting diode in which a light emitting diode and a resistor are integrated in a predetermined place.

상기한 기술적 과제를 해결하기 위한 본 발명에 따른 저항일체형 발광다이오드는, 원통형의 외관을 이루는 인클로우저와, 상기 인클로우저의 상면에 연결된 반구형의 렌즈와, 상기 인클로우저 내에 설치되어 전류가 흐르면 빛을 발하는 반도체 칩과, 상기 반도체 칩의 양극과 음극에 연결된 저항과, 상기 반도체 칩의 양극과 연결되어 외부로 인출되는 제1 리드선과, 상기 반도체 칩의 음극과 연결되어 외부로 인출되는 제2 리드선을 포함하여 구성되고, 상기 인클로우저의 하측부가 끼워지는 리브가 돌출형성된 베이스판과, 상기 리브의 외측에 위치한 상기 베이스판의 부위에 형성되고 상기 제 1, 2리드선이 상기 베이스판의 외측을 향하여 휘어져 상기 제 1, 2리드선의 끝단이 삽입되는 적어도 한쌍의 관통구멍이 포함된 것을 특징으로 한다.In order to solve the above technical problem, the resistance integrated light emitting diode according to the present invention includes an enclosure forming a cylindrical appearance, a hemispherical lens connected to an upper surface of the enclosure, and a semiconductor chip installed in the enclosure to emit light when current flows. And a resistor connected to the anode and the cathode of the semiconductor chip, a first lead wire connected to the anode of the semiconductor chip and drawn out to the outside, and a second lead wire connected to the cathode of the semiconductor chip and drawn out to the outside. And a base plate having a rib protruding from the lower portion of the enclosure, and a portion of the base plate positioned outside the ribs, wherein the first and second lead wires are bent toward the outer side of the base plate. And at least one pair of through holes into which the ends of the lead wires are inserted.

이하, 본 발명의 실시 예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명에 따른 저항일체형 발광다이오드(A)의 단면도를 나타낸 것으로, 본 발명은 원통형의 외관을 이루는 인클로우저(20)와, 상기 인클로우저(20)의 상면에 연결된 반구형의 렌즈(10)와, 상기 인클로우저(20) 내에 설치되어 전류가 흐르면 빛을 발하는 양극과 음극이 구비된 반도체 칩(30)과, 상기 반도체 칩(30)의 양극과 음극에 연결되는 저항(31)과, 상기 반도체 칩(30)의 양극과 연결되어 외부로 인출되는 제1 리드선(41)과, 상기 반도체 칩(30)의 음극에 연결되어 외부로 인출되는 제2 리드선(42)으로 구성된다.3 is a cross-sectional view of a resistance integrated light emitting diode A according to the present invention. The present invention includes an enclosure 20 forming a cylindrical appearance, a hemispherical lens 10 connected to an upper surface of the enclosure 20, and A semiconductor chip 30 having an anode and a cathode installed in the enclosure 20 and emitting light when current flows; a resistor 31 connected to the anode and cathode of the semiconductor chip 30; And a first lead wire 41 connected to the anode of the semiconductor device 30 and drawn out to the outside, and a second lead wire 42 connected to the cathode of the semiconductor chip 30 and drawn out to the outside.

상기 반도체 칩(30)의 양쪽 극에는 p형 반도체가 위치하여 에노드단자를 이루는 양극단자와, n형 반도체가 위치하여 캐소드단자를 이루는 음극단자가 형성된다.On both poles of the semiconductor chip 30, a positive electrode terminal where a p-type semiconductor is positioned to form an anode terminal and a negative electrode terminal where an n-type semiconductor is positioned to form a cathode terminal are formed.

상기 양극단자와 음극단자에 연결되는 상기 저항(31)은 일정한 용량을 가지도록 규격화될 수 있다.The resistor 31 connected to the positive electrode terminal and the negative electrode terminal may be standardized to have a constant capacity.

예를 들어, 전압이 5(V)이고, 소비전류가 100(mA)인 발광다이오드를 12(V) 전원전압에 연결하고자 하면, 발광다이오드와 연결되는 저항기는 전원전압을 12(V)와 5(V)의 전압차이인 7(V)정도의 전원전압을 강하시킬 수 있도록 적어도 7(V)x0.1(A)=0.7(W)의 소비전력을 가진 70오옴(Ω)짜리 저항이 연결된다.For example, if you want to connect a light emitting diode with a voltage of 5 (V) and a current consumption of 100 (mA) to a 12 (V) power supply voltage, the resistor connected to the light emitting diodes has a power supply voltage of 12 (V) and 5 A 70 ohm resistor with at least 7 (V) x 0.1 (A) = 0.7 (W) is connected to drop the supply voltage around 7 (V), which is the voltage difference of (V). do.

여기서, 상기 저항(31)은 여유분의 소비전력을 가지도록 기본적인 소비전력치 보다 정격전력의 2배 정도에 해당하는 소비전력을 가진 저항(31)이 연결됨이 바람직하다.Here, the resistor 31 is preferably a resistor 31 having a power consumption corresponding to about twice the rated power than the basic power consumption value to have a power consumption of the margin.

도 4는 본 발명의 다른 실시예의 저항일체형의 하이브리드형 발광다이오드의 외관 사시도이다.4 is an external perspective view of a hybrid integrated light emitting diode according to another embodiment of the present invention.

상기 저항이 일체로 된 하이브리드형 발광다이오드는 상기의 저항 일체형 발광다이오드(A)와, 합성수지제의 베이스판(50)과, 상기 베이스판(50)의 중앙에 돌출 형성되어 상기 인클로우저(20)의 하측부가 삽입되는 리브(60)로 구성되고, 상기 베이스판(50)에는 상기 저항일체형 발광다이오드(A)의 리드선(41)(42)이 삽입되는 적어도 한쌍의 관통 구멍(51)(52)이 형성된다.The hybrid light emitting diode in which the resistor is integrated is formed to protrude in the center of the resistance integrated light emitting diode A, the synthetic resin base plate 50 and the base plate 50, At least one pair of through-holes 51 and 52 into which the lower part is inserted is provided with a rib 60, into which the lead wires 41 and 42 of the resistance integrated light emitting diode A are inserted. Is formed.

상기 베이스판(50)은 원형 또는 다각형의 형상으로 형성될 수 있고, 상기 리브(60)는 상기 인클로우저(20)의 하측부가 끼워지도록 상기 저항일체형의 발광다이오드(A)의 하측부와 합치되는 홈이 형성된다.The base plate 50 may be formed in a circular or polygonal shape, and the ribs 60 are grooves that coincide with the lower parts of the resistor-integrated light emitting diodes A so that the lower parts of the enclosures 20 are fitted. Is formed.

또한, 상기 베이스판(50)에 형성된 한쌍의 관통 구멍(51)(52)은 상기 발광다이오드(A)의 리드선(40)이 끼워져서 고정되도록 상기 리드선(4)의 두께와 일치되는 폭을 갖는 구멍으로 형성될 수 있다.In addition, the pair of through holes 51 and 52 formed in the base plate 50 has a width that is equal to the thickness of the lead wire 4 so that the lead wire 40 of the light emitting diode A is fitted into and fixed. It may be formed into a hole.

상기와 같이 구성된 하이브리드형 발광다이오드는 상기 관통구멍(51)(52)을 이용하여 설치 위치를 정밀하게 할 필요가 있는 곳에 사용될 수 있다.The hybrid light emitting diode configured as described above can be used where it is necessary to precisely install the position using the through holes 51 and 52.

본 발명에 따른 저항일체형 발광다이오드는, 발광다이오드와 저항이 일체로 됨으로써 부품수가 줄고 베이스판에 형성된 관통구멍에 리드선을 삽입시키고 인클로우저의 하측부를 베이스판에 형성된 리브에 삽입시키면 발광다이오드가 설치되는 것이므로 발광다이오드의 조립공정이 단순화되어 생산비용을 크게 절감할 수 있는 장점이 있다.Resistive integrated light emitting diode according to the present invention, since the number of parts is reduced by the integration of the light emitting diode and the lead is inserted into the through-hole formed in the base plate, and if the lower part of the enclosure is inserted into the rib formed on the base plate, the light emitting diode is installed Since the assembly process of the light emitting diode is simplified, there is an advantage that can greatly reduce the production cost.

Claims (2)

원통형의 외관을 이루는 인클로우저와, 상기 인클로우저의 상면에 연결된 반구형의 렌즈와, 상기 인클로우저 내에 설치되어 전류가 흐르면 빛을 발하는 양극과 음극이 구비된 반도체 칩과, 상기 반도체 칩의 양극과 음극에 연결되는 저항과, 상기 반도체 칩의 양극과 연결되어 외부로 인출되는 제1 리드선과, 상기 반도체칩의 음극과 연결되어 외부로 인출되는 제2 리드선과, 상기 인클로우저의 하측부가 끼워지는 리브가 돌출형성된 베이스판과, 상기 리브의 외측에 위치한 상기 베이스판의 부위에 형성되고, 상기 제 1, 2리드선이 상기 베이스판의 외측을 향하여 휘어져 상기 제 1, 2리드선의 끝단이 삽입되는 적어도 한쌍의 관통구멍이 포함된 것을 특징으로 하는 저항일체형 발광다이오드. A semiconductor chip including an enclosure forming a cylindrical appearance, a hemispherical lens connected to an upper surface of the enclosure, an anode and a cathode installed in the enclosure and emitting light when current flows, and connected to an anode and a cathode of the semiconductor chip. A base plate having a resistor, a first lead wire connected to the anode of the semiconductor chip and drawn out to the outside, a second lead wire connected to the cathode of the semiconductor chip and drawn out to the outside, and a base plate having a rib to which the lower portion of the enclosure is fitted; And at least one pair of through-holes formed at a portion of the base plate positioned outside the ribs, wherein the first and second lead wires are bent toward the outside of the base plate to insert the ends of the first and second lead wires. Resistive integrated light emitting diodes, characterized in that. 삭제delete
KR1020030078404A 2003-11-06 2003-11-06 Resistive integrated light emitting diode Expired - Fee Related KR100658042B1 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0292957A2 (en) * 1987-05-26 1988-11-30 Hughes Aircraft Company Temperature stabilization of laser diodes and light emitting diodes
KR920007902A (en) * 1990-10-26 1992-05-27 원본미기재 Chain links and conveyor chains having them
KR970011229U (en) * 1995-08-23 1997-03-29 Light Emitting Diodes with Integrated Protection Resistors
JPH11191634A (en) * 1997-12-25 1999-07-13 Sanken Electric Co Ltd Semiconductor light-emitting device
JP2002094121A (en) * 2000-09-19 2002-03-29 Toshiba Electronic Engineering Corp Semiconductor light emitting device
KR20020081990A (en) * 2001-04-21 2002-10-30 한국 고덴시 주식회사 Luminescent diode
US20030189211A1 (en) * 2002-04-03 2003-10-09 Mitsubishi Electric Research Laboratories, Inc. Automatic backlight for handheld devices

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0292957A2 (en) * 1987-05-26 1988-11-30 Hughes Aircraft Company Temperature stabilization of laser diodes and light emitting diodes
KR920007902A (en) * 1990-10-26 1992-05-27 원본미기재 Chain links and conveyor chains having them
KR970011229U (en) * 1995-08-23 1997-03-29 Light Emitting Diodes with Integrated Protection Resistors
JPH11191634A (en) * 1997-12-25 1999-07-13 Sanken Electric Co Ltd Semiconductor light-emitting device
JP2002094121A (en) * 2000-09-19 2002-03-29 Toshiba Electronic Engineering Corp Semiconductor light emitting device
KR20020081990A (en) * 2001-04-21 2002-10-30 한국 고덴시 주식회사 Luminescent diode
US20030189211A1 (en) * 2002-04-03 2003-10-09 Mitsubishi Electric Research Laboratories, Inc. Automatic backlight for handheld devices

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