KR100192728B1 - Radio Frequency Tag Manufacturing Method - Google Patents

Abstract

A radio frequency tag and its antenna structure are fabricated using wire bonding. The semiconductor chip is positioned and attached on an organic film substrate. Antennas consisting of one or more thin wires are created on a substrate and connected to contacts on a chip using a wirebonding machine. Another embodiment is also disclosed that uses a plurality of semiconductors on a strip of substrate. The chip may be protected with an encapsulant, and the chip and antenna coupling may be sealed between layers of organic film.

Description

Radio Frequency Tag Manufacturing Method

1 is a flow diagram illustrating the steps of the present invention.

2A-2K illustrate radio frequency tags at each stage of the method illustrated in FIG.

3a to 3e detail the various steps of the method according to the invention.

4a and 4b illustrate an RF tag fabricated to have a metal pad termination at an antenna wire end.

5a to 5b show pieces of a continuous RF tag being cut to manufacture individual tags by two preferred embodiments of the process according to the invention.

6 is a side view of a tag string being cut into individual segments by an array of knife blades.

7 illustrates the fabrication of a loop antenna for guiding the placement of antenna wires using a temporary post.

FIG. 8 illustrates the structure of a loop antenna for guiding the placement of antenna wires using embossed studs. FIG.

9 illustrates the structure of a loop antenna for guiding the placement of antenna wires using raised flaps.

FIG. 10 shows a thin sheet of tag with two loop antennas between organic covers. FIG.

* Explanation of symbols for main parts of the drawings

205 semiconductor chip 206 laser

207,208: contact 210: substrate

700,800,900: Antenna 720: Temporary Post

820: embossed stud 920: raised flap

FIELD OF THE INVENTION The present invention relates to the field of radio frequency tagging and, more particularly, to a method for manufacturing a low cost, improved small RF tag that transmits multiple bits of information.

In general, circuits are fabricated on hard printed circuit boards or flexible substrates. Printed circuit boards include materials such as epoxy-resin or epoxy-glass boards. One general class in which these circuits are manufactured is FR4. Flow substrates, also referred to as flexes, include copper structures on polyamides. These circuits are commonly used in automobiles, consumer electronics, and general interconnection. Known techniques for attaching contacts on semiconductor circuits or for placing chips located on circuit boards or flex structures are referred to as wirebonding. Wire bonds are made of very short length small wires (approximately 25 microns in diameter). The wires connected by common wire bonds are about 1 millimeter long. These wire lengths are usually kept short for some reason,

1. Small diameter wire is very weak.

2. Typically, many bonds are formed in a circuit, so longer wire lengths make it easier to cause electrical shorting at the connection.

3. Increasing the length of the wire increases self and mutual inductance, which degrades the electrical performance of the circuit.

Radio Frequency Identification (RF ID) is one of many identification techniques for identifying objects. At the heart of the RF ID system is information with tags. The tag functions in response to a Coded RF signal received from a base station. The tag reflects an incident RF carrier back to the base station. The information is transmitted by the tag as a reflected signal modulated according to the tag's programmed information protocol.

A tag consists of a semiconductor chip with RF circuits, logic, and memory. The tag may be an antenna, often a battery in the case of active tag, a substrate for mounting the components, and interconnections between components, for example. And a collection of discrete components such as means of physical enclosure, capacitors and diodes. One form of tag, passive tags, does not include a battery. They derive their energy from the RF signal used to query the tag. RF ID tags are typically manufactured by mounting individual elements on a circuit card. This is a board and circuit elements. That's a chip. This is done by using short wire bond connections or soldered connections between the capacitor, diode, and antenna. The circuit card may be made of epoxy-fiberglass or ceramic. The antenna is typically a few loops of wire soldered to the circuit, or consists of a metal etched or plated on the circuit card. The entire assembly may be enclosed in a plastic box or molded into a three-dimensional plastic package.

Applications of RF ID technology have not been as widely spread as other ID technologies, such as barcodes, but are developing into compelling technologies, particularly in some areas such as vehicle identification.

The growth of RF IDs is due to the absence of additional facilities to manufacture tags, the high cost of tags, the bulkiness of most of the tags, the problems of tag sensitivity and range, and the multiple numbers of tags. The need for reading has been hampered. Typical tags cost from $ 5 to $ 10. The company has focused on niche applications. Some prior art discloses RF tags used to identify railway boxcars. RF tags are currently used in the automatic toll industry, for example on thruway and bridge tolls. RF tags are being tested for use as contactless fare cards for buses. Employer identification badges and security badges have already been produced. Animal identification tags are also commercially available as RF ID systems are used to track components in the manufacturing process.

One limitation of the manufacture of RF tags made of PC boards or flex is that the flex or board must be manufactured first. To meet the demand for very high tag quantities (more than 1 million tags), new plants must be built to produce more boards or flexes. In addition, RF tags manufactured from these technologies are too expensive to avoid in many applications. For example, bar code is a technique used for identification at much lower cost than existing RF tagging techniques.

It is an object of the present invention to provide an improved method of manufacturing a radio frequency identification tag.

It is an object of the present invention to provide an improved method for producing a low cost radio frequency identification tag made of currently available materials.

It is another object of the present invention to provide an improved method of manufacturing a radio frequency identification tag that can be manufactured in large quantities.

According to the present invention, there is provided a novel method of manufacturing a radio frequency (RF) tag comprising a semiconductor circuit having logic, memory and radio frequency circuitry. The semiconductor is mounted on a substrate and can receive an RF signal through an antenna electrically connected to the semiconductor via a contact on the semiconductor.

The antenna is new, has a new structure, and is constructed by new use of wire bonding technology. The antenna is one or more wires, each connected to a semiconductor connection by one or two wire couplings. (In one preferred embodiment, the antenna is made of one or multiple pairs of wires.

One preferred differential coupling method spools out a length of wire required by the antenna design and removes the wire without any electrical connection at the second cut end. Cut two ends. In another preferred embodiment, the second cut end of the wire is held in place by adhering the cut end to the substrate with adhesives or by locally heating the substrate. In this way, the wire bonding method is used to substantially create the components of the RF tag circuit (antenna) rather than connecting the two components. The resulting novel antenna structure is a long wire connected to the circuit by wire bonding. Another preferred embodiment is a method of fabricating multiple structures from a plurality of semiconductors on a strip of substrate with a wire bonding tool and folded dipoles with a wire bonding tool. It includes a method of manufacturing. The components of the novel RF tag are then covered with an organic cover with new usage in this type of device.

1 is a flowchart illustrating the steps for chip attachment, wire bonding, and package sealing in a preferred embodiment.

In step 110, the semiconductor chip is positioned and attached on the organic substrate. (See FIG. 2) In a preferred embodiment chip 205 is a radiofrequency semiconductor chip. Such a structure is U.S. Patent application number 08 / 303,976 to Brady et al. entitied Radio Frequency Identification Tag filed on September 9, 1994 and incorporated herein by reference in its entirety.

The chip 205 is placed on the substrate 210 by a components pick and place machine 202 known in the semiconductor industry (FIG. 2A). It may be attached to the substrate 210 by the preferred method (step 110). First, the chip may be attached with an adhesive (step 110). Preferred adhesives include pressure sensitive adhesives such as acrylics, silicone ones, urethanes and the like. The adhesive is placed on the substrate by an adhesive dispensing machine (step 110). In addition, a drop of epoxy may be introduced between the chip 205 and the substrate 210. Another preferred method of attaching the chip 205 is to heat the substrate using a heating tool, such as a heat stage 21. The heat stage 212 may be positioned in direct contact with the bottom of the substrate 210 on the opposite side where the chip is located. In this way, the substrate can be heated such that the substrate partially reflows and becomes adhesive so that the chip can be attached to the ripple-no area. In a preferred embodiment, the chip itself is heated. This can be done by first placing the chip on the substrate and then locally heating the chip attached to the chip by causing the substrate to reflow or melt. Chip heating may be performed by a laser 206 or other known method. An adhesive that attaches the chip may also be provided as a charge 211 on the substrate. Other attachment means known in the prior art are contemplated.

Chip 205 has at least two electrical contacts used for attachment of a radio frequency antenna. The antenna is attached to the contacts 207 and 208 and formed in a novel way using wire coupling (FIG. 2b). In one preferred antenna structure, a first antenna connection is wire coupled to a first contact using a wire coupling tool (step 120). These tools are ultrasonic wedge bonding, ball bonding, laser bonding, laser sonic bonding, thermocompression, soldering, or these Certain combinations of secrets are also possible.

In step 130, the wire is unspooled after the first connection is made. At this stage, the unspooled wire is substantially used to create the antenna component, so more wire is unspooled than the prior art methods. The length of the wire is determined by the resonant antenna frequency.

In this step 130, the wire must be unspooled at a controlled speed relative to the running speed of the head of the wire bonding tool such that the unspooled wire is not in tension. This is a common operation in the wire bonding industry for short lengths of spooled wire, ie 1 mm to 3 mm. However, the present invention requires that such control be made beyond the length of wire spooling. Also, in some cases, the head may be controlled to progress slowly with respect to the wire feed as a curve or loop may occur during the formation of the antenna component. This spooling creates an antenna between 10 mm and 1000 mm long.

In step 140, the second end of the first wire is cut and the cut end of the wire is left unconnected. This cutting is in any known method, including knife blade 213 (swedge, guillotine), automatic chopper, automatic pincers, laser, and the like. Can be performed by

The cut ends of the wires can be properly attached in several ways (steps 130 and 140). The cut end of the wire may be properly held on the substrate by a small amount of drop of adhesive 169 positioned below the wire end. (See Figures 2d and 2g). The adhesive 169 is introduced by a nozzle 168. The half end can also be held in place by locally heating the substrate at the point where the cut end rests so that the substrate becomes adhesive and adheres to the cut end. Methods for heating localized substrates are known and include a spot application of heat focused with a tool or laser 236 at the heating point. Adhesives are also known. They include epoxy, silicone and phenolic-butyral. Note that the wire may be attached before or after cutting (step 140, 170) (step 130, 160). If the wire is bonded after cutting, the cutting wire end may be properly held by pressure temporarily before attaching to the substrate.

Another method of attaching the cut end to the substrate includes heating the wires 131, 132 (FIG. 2E) such that the cut end heats the substrate at the point of contact and causes the cut end to adhere to the substrate. The wire may be heated by inductive heating 237, resistive heating 235, laser heating 236, or any other method used for this purpose. In addition, a portion of the substrate under the wire may be heated (235-237) so that some or all of the wire is embedded in the substrate. This effect can also be achieved by heating the wires 235-237 so that the segments (or all) of the wires 131, 132 are inserted into the substrate and applying pressure 246 to a portion (or all) of the wires. This can also be accomplished by heating the substrate with the heat stage 212 (FIG. 2) such that the wire adheres to a softened part of the substrate. In addition, pressure means 246 may be heated to, for example, resistance resistor 235 such that pressure and heat are simultaneously applied to wire 131.

Using the steps described above, more than one wire 131 or 132 may be attached to individual contacts 208 or 207, spooled out, attached to a substrate and then cut. These wires can be positioned at different angles with respect to each other.

In step 180 of FIG. 1, the chip is covered with a protective encapsulant layer shown in FIG. 2H. Input nozzle 281 locates a drop of encapsulant 282 on the surface of chip 235 to form a protective coating 283. In a preferred embodiment, the capsule material is not clear in protecting light-sensitive circuits on the chip.

In step 190, the completed chip and antenna structure is covered with an organic cover 293 (bottom) and 294 (top) by using a roll laminator to compress the sandwich between the heated rollers 295 and 296. It is sealed between (FIG. 2i). The organic cover consists of a simgle layer of polyester, polyethylene or other organic film that can be softened by heating. In a preferred embodiment the membrane consists of two layers: an inner layer 297 of copolymer EVA (ethyl vinyl acetate) and an outer layer 298 of polyester. In another preferred embodiment, only one layer, for example top layer 294, needs to be applied.

3 shows in detail the placement of the wire 331 (FIG. 3A), the bonding of the wires (FIG. 3B and FIG. 3C), the unspooling of the wire (FIG. 3D), and the cutting of the wire (FIG. 3E). do. In FIG. 3A the wire 331 is located on a contact pad 307 on the semiconductor chip 305 that was attached to the substrate 310. In FIG. 3B the wire 331 is coupled to a pad 307 using ultrasonic energy 334. In FIG. 3C the wedge bond 333 is complete and the bond head 332 is removed from the substrate as the wire is spooled out as shown in FIG. 3D. In FIG. 3E the wire is terminated to a specified length and cut by knife edge 340.

4 illustrates an embodiment 400 of how wires 431 and 432 terminate at metal pad termination sites 445 and 446. Top view 4a shows a semiconductor chip 405 on an organic substrate 410 connected to wires 431 and 432 to contacts 445 and 446 on the chip. 4b is a side view.

Contacts 445 and 446 are provided to hold the cut ends of the antenna wires 432 and 431 in place. Contacts 445 and 446 may be composed of gold, silver, aluminum, copper nickel or alloys thereof. They may be deposited as a thin layer on a substrate that is attached to the surface of the substrate or on another material (such as silicon or other metal). In a preferred embodiment, the antenna wire ends do not make any connections to contacts 445 and 446.

5A shows a continuous piece 500 of semiconductor chips 505, 515, 525 on an organic substrate 502 that includes wires coupled to first and second contacts 507 and 508 on the semiconductor chip. Wires 531 and 532 are each one-half wavelength long. After combining and scaling operations as shown in FIGS. 2 and 3 above, the piece of tag 501 is segmented at the location shown by the lines 551 and 552 dotted by the knife blade 561. (541, 542, 543, etc.). In a preferred embodiment, knife blade cutting is made midway between the chips to make the remaining wire segments 533, 534, 535, 536, etc., each quarter wavelength long.

5b shows the first and second contacts 551 and 553, 561 and 563, 571 and 557, 574 and 557, 577 and 578 as well as the third and fourth contacts 552 and 554, 562 and 564, 594 and 595, 581 and 583, 591 and 593, respectively, on the semiconductor chip. A continuous strip array 501 of semiconductor chips 550, 560, 570, 580, 590 on an organic substrate 502 including wires coupled to the substrate is shown. In a preferred embodiment, the wires 511, 512, 513 and 514 are each one-half wavelength long. After joining and scaling, as shown in FIGS. 2 and 3 above, the piece array of tags 501 is segment 517 at the location shown by lines 522, 523 and 524 dotted by knife blades 561. 518, 519, 520, 521, etc.). In a preferred embodiment, knife blade cutting is made midway between the chips to make the remaining wire segments (556.565, 566, 576.567, 568, etc.) each one-quarter wavelength long. In another preferred embodiment, the cuts (522. 523, 524, etc.) can be made simultaneously by a gang of knife blades 561. Note that the semiconductor chip (typically 590) has one wire (typically 593a) that is not connected to a contact on another semiconductor chip. In these cases, the end of wire 593a will be terminated in any of the ways described above. In one preferred embodiment, wire 593a will terminate with a contact (typically 593b) located on a substrate as shown in FIG. Note also that Figure 5b shows three rows of semiconductor chips forming an array on a substrate. (One row is shown in FIG. 5A.) However, the number of rows can vary from two to as many matching on the substrate.

6 shows a piece 610 of RF tag 650 being cut 650 into individual segments 611, 612, 613 by an array of knife blades 641 and 642.

7 illustrates fabrication of a loop antenna 700 by the use of a temporary post wire guide 720. Post 720 is lowered to substrate 710 (750). Wire 730 is first coupled to the contact pad of FIG. 2, and the wire is unspooled by coupling head 740 (step 130). Wire 730 is guided by a coupling head that surrounds temporary post 720. This process is reflected at the other end of the substrate, and the wire is coupled to the contact pad 208 of FIG. 2 forming the loop antenna. Temporary post 720 is then raised 751 to complete this process. The wire is attached to the substrate using the method described above.

8 illustrates the fabrication of a loop antenna 800 by use of an embossed stud 820 wire guide. Stud 820 is permanently embossed on substrate 810. After the wire 830 is first bonded to the contact pad 207 of FIG. 2, the wire is unspooled by the coupling head 840. This process is reflected at the other end of the substrate and the wire is coupled to the contact pad 208 of FIG. 2 forming the loop antenna. Stud 820 resides in place on the substrate.

9 illustrates the fabrication of a loop antenna 900 by raised flap wire guide 900. The flap is pre-punched to the substrate 910 by a punching tool. Flap 920 is raised from the substrate by a mechanical method such as an air jet 925 or pin 926. After the wire 920 is first bonded to the contact pad 207 of FIG. 2, the wire is unspooled by the coupling head 940. This is guided by a coupling head that surrounds the raised flap 920. This process is reflected at the other end of the organ and the wire is coupled to the contact pad 208 of FIG. 2 forming a loop antenna. Mechanical lifting means 925 is removed. After the flap 920 is relaxed, the flap 920 holds the wire 930 in place on the substrate.

In some preferred embodiments of the method illustrated in FIGS. 7-9, the wire may be attached to the substrate by any of the methods described above, ie, heat and / or pressure.

10 illustrates completion of tag 1000 by application of heat 1064 and pressure 1065. Multiple antennas 1020 (and 1030) have been created on the semiconductor chip 1010 by the combination of wires 1025 (and 1035) and contact pads 1006 and 1008 (1007 and 1009). The capsule material 1030 was introduced to cover the chip 1005 and the contact pads 1006-1009. Substrate 1040 is positioned under organic cover 1045. In a preferred embodiment, the organic cover consists of an outer layer 1060 of PET and an inner layer 1050 of EVA. Heat 1064 and pressure 1065 are applied to seal the package. In another embodiment, the bottom cover 1046 is positioned under the tag and a film is formed simultaneously with the top cover 1045. PET is also known as polyester.

According to the disclosure of the present invention, one of ordinary skill in the art can develop equivalent embodiments within the scope of the present invention. For example, the method shown in FIGS. 2, 3, and 5 may be used to generate each radio frequency tag with multiple antennas present at different angles (eg, non-orthogonal) from each other. Can be.

Claims (36)

a. Attaching a semiconductor on an organic substrate, the semiconductor defining a first and second contact, a memory, and a radio frequency signal; Attaching said logic having logic to modulate at a frequency of; b. Attaching a bonded end of a first wire to the first contact using a wire bonding machine; c. Spooling the first wire to a first length with the wire coupling machine; d. Attaching the first wire to the organic substrate; e. Cutting the first wire to the first length at a first cut end; f. Attaching an end joined with a second wire to the second contact using a wire bonding machine; g. Spooling the second wire to a second length with the wire coupling machine; h. Attaching the second wire to the organic substrate; i. And cutting the second wire to the second length at a second cut end, wherein the first and second wires comprise an antenna for receiving a signal at the predetermined frequency. And the signal is modulated by the semiconductor logic, wherein the modulated signal is transmitted by the antenna. The method of claim 1, wherein the first and second lengths are one quarter length of the frequency. 4. The method of claim 1, further comprising encapsulating the semiconductor and the first and second contacts with an encapsulant. 4. The method of claim 3, wherein the capsule material is any capsule material comprising epoxy, silicone, or polymeric material. The method of claim 1, wherein the semiconductor is attached to the substrate with a chip-attaching adhesive. 6. The method of claim 5, wherein the chip-attached adhesive is a predetermined adhesive comprising acrylics, silicones and urethanes. The method of claim 1, wherein the semiconductor is attached to the substrate by heating the substrate. The method of claim 1, wherein the semiconductor is attached to the substrate by heating the semiconductor. The method of claim 1, wherein the wire is attached to the substrate by a wire-attaching adhesive. 10. The method of claim 9, wherein the wire-attach adhesive is any adhesive comprising epoxy, silicone, and phenol-butyral. The method of claim 1, wherein the wire is attached to the substrate by heating the semiconductor. The method of claim 1 wherein the wire is attached to the substrate by heating the wire. The method of claim 1, further comprising sealing the substrate, the semiconductor, and the first and second wires with a top organic cover. The method of claim 13, wherein the top organism cover is a single layer. 15. The method of claim 14, wherein the top organic cover is made of a predetermined organic film comprising polyester and po1yethylene and attached to the substrate, semiconductor and wire by heating. The radio frequency tag of claim 13, wherein the upper organic cover has an outer and inner layer, the outer layer is an organic film, and the inner layer is a cover adhesive. Manufacturing method. 17. The method of claim 16, wherein the cover adhesive is heat sensitive and the cover is attached to the substrate, semiconductor and wire by heating. 18. The method of claim 17, wherein pressure is also added to attach the cover. 18. The method of claim 17, wherein the cover adhesive is a copolymer comprising ethyl vinyl acetate (EVA). 17. The method of claim 16, wherein the cover adhesive is pressure sensitive and the cover is attached to the substrate, semiconductor, wire by pressure. 21. The method of claim 20, wherein the cover adhesive is an adhesive comprising acrylic, silicone and urethane. The method of claim 1, wherein an upper portion of the substrate is covered by an attached top cover, and a lower portion of the substrate is covered by an attached bottom cover. . a. Attaching a semiconductor on an organic substrate, the semiconductor having the first and second contacts, a memory and logic to modulate a radio frequency signal to a predetermined frequency; b. Attaching a first bonded end of a first wire to the first chip contact using a wire bonding machine; c. Spooling the first wire to a first length with the wire coupling machine; d. Attaching a first cut end of the first wire to a first termination site on the organic substrate; e. Cutting the first wire to the first length at the first cutting end; f. Attaching a second bonded end of a second wire to the second contact using a wire bond machine; g. Spooling the second wire to a second length with the wire coupling machine; h. Attaching a second cut end of the second wire to a second termination end on the organic substrate; i. Cutting the second wire to the second length at a second cut end, wherein the first and second wires form an antenna for receiving a signal at the frequency, the signal being caused by the semiconductor logic. Modulated, wherein the modulated signal is transmitted by the antenna. 24. The method of claim 23, wherein the first and second lengths are one quarter wave length of the frequency. a. Attaching three or more semiconductors onto a strip of organic substrate, each semiconductor comprising a first and a second contact, a memory, and a radio frequency signal at a predetermined frequency; Attaching with logic to modulate with; b. Attaching a first joining end of a wire to the first chip contact on a first chip using a wire joining machine; c. Spooling the first wire to a first length with the wire coupling machine; d. Attaching a first cut end of the first wire to a second chip contact on the second chip using a wire bonding machine; e. Cutting the first wire to the first length at the first cutting end; f. Attaching a second coupling end of the second wire to the second contact of the first chip using a wire coupling machine; g. Spooling the second wire to a second length with the wire coupling machine; h. Attaching a second cut end of the second wire to a first chip contact on a third chip using a wire bonding machine; i. Cutting the second wire to the second length at a second cut end; j. Cutting the first wire between the first and second semiconductors and cutting the second wire between the first and third semiconductors, wherein the first and second wires output a signal at the frequency. And a receiving antenna, wherein the signal is modulated by the semiconductor logic and the modulated signal is transmitted by the antenna. a. Attaching a semiconductor on an organic substrate, each semiconductor having the first and second contacts, a memory and logic to modulate a radio frequency signal to a predetermined frequency; b. Attaching a first bonding end of a wire to the first chip contact on the semiconductor using a wire bonding machine; c. Spooling the first wire around one or more wire guides with the wire coupling machine; d. Attaching the cut end of the wire to the second contact using a wire bond machine; e. Cutting the wire to a predetermined length at a cut end located at the second contact, the wire forming a folded dipole antenna to receive a signal at the frequency, the signal being Modulated by semiconductor logic, wherein the modulated signal is transmitted by the antenna. 27. The method of claim 26, wherein the semiconductor has two or more pairs of first and second contacts, wherein steps a through e are more than one folded dipole antennas. A method of manufacturing a radio frequency tag that is repeated for each pair of contacts to create a dipole antenna. 27. The method of claim 26, wherein the one or more guides are a stud embossed on a substrate. 27. The method of claim 26, wherein the one or more guides are a temporary post in temporary contact with the substrate. 30. The method of claim 29, wherein the wire is attached to the substrate by heat. 27. The method of claim 26, wherein the one or more guides are a flap punched on a substrate. 32. The method of claim 31, wherein the flap is raised by an air jet to capture wires looped to the engagement machine. 32. The method of claim 31, wherein the flap is raised by pins. a. Attaching four or more semiconductors in a predetermined array onto a piece of an organic substrate, each semiconductor having a first, second, third and fourth contact (a first, second, third and fourth chip); contact) the memory having logic to modulate the radio frequency signal to a predetermined frequency; b. Attaching a first coupling end of a first wire to the first chip contact on the first chip using a wire coupling machine; c. Spooling the first wire to a first length with the wire coupling machine; d. Attaching a first cut end of the first wire to the second chip contact on a second chip using a wire bonding machine; e. Cutting the first wire to the first length at a first cut end; f. Attaching a second coupling end of a second wire to the second contact of the first chip using a wire coupling machine; g. Spooling the second wire to a second length with the wire coupling machine; h. Attaching the second cut end of the second wire to the first chip contact on the third chip using the wire coupling machine; i. Cutting the second wire to the second length at the second cutting end; j. Attaching a third coupling end of the third wire to the third chip contact on the first chip using the wire coupling machine; k. Spooling the third wire to a third length with the wire coupling machine; l. Attaching a third cut end of the third wire to a fourth chip contact on a fourth chip by using the wire coupling machine; m. Cutting the third wire to the third length at a third cutting end; n. Attaching a fourth coupling end of a fourth wire to the fourth chip contact on the first chip using the wire coupling machine; o. Spooling the fourth wire to a fourth length with the wire coupling machine; p. Attaching a fourth cut end of the fourth wire to a connection contact on the substrate; q. Cutting the fourth wire to the fourth length at a fourth cut end; r. Cutting the first wire between the first and second semiconductors, cutting the second wire between the first and third semiconductors, and cutting the third wire between the first and fourth semiconductors. And the first, second, third and fourth wires form two antennas for receiving a signal at the frequency, the signal is modulated by the semiconductor logic, and the modulated signal is Method of manufacturing a radio frequency tag transmitted by an antenna. 35. The method of claim 34, wherein the connection contact is a contact on a fifth semiconductor and the fourth wire is cut between the first and fifth semiconductors. 35. The method of claim 34, wherein each of the two antennas has two wire elements of equal length.