JPS6383655A - Semiconductor dew sensor - Google Patents

Abstract

PURPOSE:To prevent the peeling of an electrode part, etc., from generating, and malfunction from occurring, by disusing a gold wire, and covering a part other than a dewed film part, with resin, etc. CONSTITUTION:At least two lead wires 21 almost in parallel pierce the side wall plane of a cup-shaped resin case 22, and are arranged protrusively so as to be positioned along the bottom plane side 25. Also, an electrode 28 is evaporated on a silicon substrate 27 forming a semiconductor 26, and electrode terminals 29 are formed on both sides of the electrode 28 on almost the same line. And a dewed film 30 superior in hygroscopicity is coated on the electrode 28, and the film 30 is extended to the bottom plane side 25 so as to be arranged between wires 21, and also, the element 26 is bonded on the case 22 so that the terminals 29 is dewed at both sides of the film 30, and the wires 21 are connected electrically with each other. Also, a through hole 31 is formed at the bottom plane 25 of the case 22, and when the element 26 is loaded on the case 22, for example, the thermosetting resin, etc., is filled, thereby, the element 26, the wire 21, etc., are fixed and enhanced. When moisture invades, the film 30 absorbs the moisture, and the resistance value of the film 30 is increased according to the moisture rise, the change of the resistance value is transmitted to an operation circuit part.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a semiconductor dew condensation sensor.0 Prior Art In recent years, dew condensation on automobile window glasses, building materials, VTRs, and other precision equipment has become a problem. ing.

For example, for home VTRs, "Sensor Device Handbook" edited by Sensor Technology Editorial Department, published by Information Research Group, No.
It is described in "Applications" on page 6.

A conventional semiconductor sensor will be explained below.

FIG. 4 shows a cutaway side view of a main part of a conventional semiconductor dew condensation sensor. In the figure, a metal film 2 is coated on a glass substrate 1, and a plurality of windows 3 are provided in this metal film. A lead wire 4 is provided that penetrates the glass substrate 1 and projects approximately at the center of the window 3 of the metal film 2 without contacting the metal film 2. The metal film 2 has a predetermined distance from the lead wire 4.
A semiconductor element 6 is placed thereon.

As shown in FIG. 5, the semiconductor element 5 includes a silicon substrate T on which electrodes 6 are deposited, and a dew condensation film 8 formed of a resistive film made of a dispersion of resin and carbon powder with excellent hygroscopic properties is applied. It is configured. The terminal 9 of the electrode 6 and the lead wire 4 are, for example, a thin gold wire 1 with a wire diameter of several tens of microns ≠ Φ ≠
It is electrically connected by 0. The above-mentioned semiconductor element 5, gold wire 10. The IJ-domain wire 4 and the metal film 2 are each covered and protected by a metal cap 11 in the shape of a pot.

There is a through hole 1 in the vicinity of the semiconductor element 5 on the upper surface of this cap.
2 is bored, and a mesh 13 having, for example, a net shape and excellent air permeability is attached to this through hole.

The operation of the semiconductor dew condensation sensor described above will be described below.

For example, if the semiconductor dew condensation sensor is placed in a high humidity area of a device such as a home VTR where dew condensation is likely to occur, moisture will enter the metal cap 11 through the mesh 13 which has excellent ventilation. Then, the dew condensation film 8 made of a resistive film with excellent hygroscopicity absorbs humidity, and as the humidity increases, the resistance value of the dew condensation film 8 increases. (not shown) to activate means for drying the high humidity area.

Problems to be Solved by the Invention However, according to the above-mentioned conventional configuration, the electrode part or the gold wire of the semiconductor element inside the metal cap is constantly exposed to a high humidity region, so that deterioration of the electrode part may occur. Accidents such as peeling of the gold wire often occur, leading to malfunctions. An object of the present invention is to provide a semiconductor dew condensation sensor that solves the above conventional problems.

Means for Solving the Problems In order to achieve this object, the semiconductor dew condensation sensor of the present invention has a structure in which the gold wire is eliminated and the parts other than the dew condensation film are covered with resin or the like.

Function: This configuration eliminates peeling of the electrode portion of the semiconductor dew condensation sensor, which is always in a high humidity region, and prevents malfunctions.

EXAMPLE An example of the present invention will be described below with reference to the drawings. Fig. 1 is a cutaway perspective view of the main parts of a semiconductor dew condensation sensor according to the present invention, Fig. 2 is a perspective view of the main parts of a semiconductor element used in the present invention, and Fig. 3 is a reinforcement of this element after bonding the semiconductor element. It shows the progress of the process.

In the figure, at least two lead wires 21 arranged substantially in parallel penetrate the side wall surface 23 of the plastic case 22 and protrude along the bottom surface 26 of the internal chamber 24. . Also, the silicon substrate 2 on which the semiconductor element 26 is formed
An electrode 28 is deposited on the electrode 7, and electrode terminals 29 are formed on both sides of the electrode in substantially the same line. and,
A dew condensation film 30 with excellent hygroscopicity is applied on the electrode 28, and the dew condensation film 30 is directed toward the bottom side 26 of the case 22 so as to be disposed between the lead wires 21 arranged in parallel. The semiconductor element 26 is bonded so that the electrode terminals 29 and the lead wires 21 exposed on both sides are electrically connected to each other. On the bottom side 25 of the case 22, there is a dew condensation film part 30.
A through hole 31 is formed in a position and size corresponding to the position facing the .

When the semiconductor element 26 is bonded to the case 22, a thermosetting resin 34 or the like is filled from the opening 33 side of the case 22 through a process such as baking to fix and reinforce the semiconductor element 26, lead wires 21, etc. .

The operation of the embodiment of the present invention described above is almost the same as that of the conventional example, so a description thereof will be omitted.

Note that in the configuration of this embodiment, the shape of the lead wire 21 is not particularly explained, but the shape of the electrode terminal 2 of the semiconductor element 26 is
The part connected to 9 may have a structure that facilitates the connection, for example, as a plate-like body, and a mesh may be attached to the through hole 31 part through which moisture passes, as in the conventional example. Needless to say.

Effects of the Invention As explained above, according to the semiconductor dew condensation sensor of the present invention, it is possible to eliminate the gold wire connecting the electrode part and the lead wire part, and the electrode terminal part is directly exposed to a high humidity area. This reduces the possibility of accidents such as peeling of the gold wire. Furthermore, by eliminating expensive gold wires, the cost of parts can be drastically reduced, making it possible to provide an extremely superior semiconductor dew condensation sensor that contributes to cost reduction.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a main part of a semiconductor dew condensation sensor according to an embodiment of the present invention, FIG. 2 is a perspective view of a main part of a semiconductor device used in the present invention, and FIG. 3 is a main part of a semiconductor device of the present invention. FIG. 4 is a cutaway side view of a main part of a conventional semiconductor dew condensation sensor, and FIG. 6 is a perspective view of a main part of a semiconductor element used in a conventional example. 22...Cop-shaped resin case, 26...
Semiconductor element, 2B... electrode, 29... electrode terminal, 3o... dew condensation film. Name of agent: Patent attorney Toshio Nakao and 1 other person21
---Lead bare 22-11 stink-like odor case 26--'+den 27---electron a Mizuko 30-1 exposed trap 53□ 3'-1 through hole 33--- Open-mouthed snoring 34--Ichijubin Shichicho Futoshi (Kyu) Figure 5

Claims (1)

[Claims] A semiconductor element consisting of an electrode deposited approximately at the center of a silicon substrate, electrode terminals disposed approximately on the same line on both sides of this electrode, and a dew condensation film coated on the electrode, a cup-shaped resin case, and It consists of at least two lead wires that penetrate the side wall surface on the bottom side of the case and are arranged substantially parallel to each other along the inner bottom surface of the internal space of the case. A through hole having a similar shape to the condensation film is formed in the bottom of the case facing the dew condensation film, and heat is removed from the opening side of the case. A semiconductor dew condensation sensor characterized in that the semiconductor element is embedded by injecting a curable resin material.